Power module and data center

Abstract

The application relates to a power module and a data center, wherein the power module comprises a device layer, a transmission layer and a heat management layer, the device layer is provided with a plurality of power devices, transmission lines between the plurality of power devices are arranged in the transmission layer, the heat management layer is provided with a heat management device, the heat management device is configured to: adopt a first heat management mode to perform heat management on at least one of the plurality of power devices based on a first temperature level; adopt a second heat management mode to perform heat management on at least one of the plurality of power devices based on a second temperature level; and adopt a third heat management mode to perform heat management on at least one of the plurality of power devices based on a third temperature level; wherein a temperature value of the first temperature level is greater than a temperature value of the second temperature level, and the temperature value of the second temperature level is greater than a temperature value of the third temperature level. The application can reduce the technical problems of low energy conversion rate and structural imbalance of waste heat utilization in the prior art.

Description

Technical Field

[0001] This application relates to the field of waste heat recovery technology in data centers, and in particular to a power module and a data center. Background Technology

[0002] With the global energy crisis intensifying and environmental protection demands rising, the information technology and internet services industry, as a high-energy-consuming sector, has seen waste heat recovery technology become a crucial breakthrough for improving energy efficiency.

[0003] Existing data centers generally employ an integrated thermal management strategy, recovering waste heat through heat exchangers or the thermoelectric (TE) effect, using the waste heat for power generation or cooling. However, in practice, due to differences in various power equipment, problems such as low energy conversion efficiency and poor system adaptability exist. Another approach is to adopt a homogenized processing mode, such as using a thermoelectric generator (TEG) to directly convert all recovered heat energy into electrical energy through the Seebeck effect. However, this "one-size-fits-all" thermal management approach may result in many effective waste heats not being fully utilized. Summary of the Invention

[0004] In view of the above, it is necessary to provide a power module and data center that can reduce the technical problems of low energy conversion efficiency and structural imbalance in waste heat utilization in the existing technology.

[0005] This application first provides a power module, including a device layer, a transmission layer, and a thermal management layer. The device layer is provided with multiple power devices, and the transmission lines between the multiple power devices are located in the transmission layer. The thermal management layer is provided with a thermal management device, which is configured to: perform thermal management on at least one of the multiple power devices using a first thermal management method based on a first temperature level; perform thermal management on at least one of the multiple power devices using a second thermal management method based on a second temperature level; and perform thermal management on at least one of the multiple power devices using a third thermal management method based on a third temperature level; wherein the temperature value of the first temperature level is greater than the temperature value of the second temperature level, and the temperature value of the second temperature level is greater than the temperature value of the third temperature level.

[0006] In the power module of this application, the decoupling design between the equipment layer, transmission layer, and thermal management layer enables independent operation of heat flow control and power transmission. The thermal management layer divides the power equipment into three temperature levels: a first (e.g., high temperature), a second (e.g., medium temperature), and a third (e.g., low temperature), each matched with a corresponding thermal management method. For example, the first stable level prioritizes the extraction of high-grade heat energy through active heat recovery technology; the second temperature level employs a cascaded conversion or temporary storage mechanism to achieve slow energy release; and the third temperature level relies on a directional heat dissipation path to guide the harmless release of residual heat energy. This overcomes the environmental adaptability limitations of traditional integrated or homogenized processing modes. By reducing the loss of high-calorific-value waste heat through temperature zone threshold sorting, multiple levels of optimization are achieved. In other words, by improving the graded utilization rate of heat resources, the overall energy conversion efficiency is enhanced, thereby systematically reducing the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in existing technologies.

[0007] In some embodiments, the first thermal management method is to collect the thermal energy of at least one electrical device and use the thermal energy for power generation and / or cooling.

[0008] In some embodiments, the second thermal management method is to collect the thermal energy of at least one electrical device and use the thermal energy for cooling or heating.

[0009] In some embodiments, the third thermal management method is to collect the thermal energy of at least one electrical device and use the thermal energy for heating.

[0010] In some embodiments, the power equipment includes a medium-voltage transformer, a transformer, and an energy storage device. The operating temperature of the medium-voltage transformer, the transformer, and the energy storage device is at a first temperature level. The thermal management device is configured to collect the heat energy generated by at least one of the medium-voltage transformer, the transformer, and the energy storage device during operation and use the heat energy for power generation and / or cooling.

[0011] In some embodiments, the thermal management device includes a first heat-conducting device, a power generation device, a refrigeration device, and a control device. The first heat-conducting device is connected to the intermediate voltage transformer, the transformer, and the energy storage device to collect the heat energy generated during the operation of the intermediate voltage transformer, the transformer, and the energy storage device. The power generation device is connected to the first heat-conducting device and the control device. The refrigeration device is connected to the first heat-conducting device and the control device. The control device is used to control the power generation device to use the heat energy for power generation and / or to control the refrigeration device to use the heat energy for refrigeration.

[0012] In some embodiments, the power equipment includes a low-voltage switchgear and a reactive power compensation device. The operating temperature of the low-voltage switchgear and the reactive power compensation device is at a second temperature level. The thermal management device is configured to collect the heat energy generated by the low-voltage switchgear and the reactive power compensation device during operation and use the heat energy for cooling or heating. The thermal management device includes a second heat-conducting device, a cooling device, a heating device, and a control device. The second heat-conducting device is connected to the low-voltage switchgear and the reactive power compensation device to collect the heat energy generated by the low-voltage switchgear and the reactive power compensation device during operation. The cooling device is connected to the second heat-conducting device and the control device. The heating device is connected to the second heat-conducting device and the control device. The control device is used to control the cooling device to use the heat energy for cooling or to control the heating device to use the heat energy for heating.

[0013] In some embodiments, the electrical equipment includes a ventilation device, the ventilation device operates at a third temperature level, and the thermal management device is configured to collect the heat energy of the ventilation device and use the heat energy for heating; the thermal management device includes a heat storage device, a heating device, and a control device, the heat storage device is connected to the ventilation device to store the heat energy of the ventilation device, the heating device is connected to the heat storage device and the control device, and the control device is used to control the heating device to use the heat energy stored in the heat storage device for heating.

[0014] In some embodiments, the transmission layer is provided with a cooling device, which is connected to a refrigeration device. The cooling device is used to obtain low-temperature heat energy from the refrigeration device and use the low-temperature heat energy to cool the transmission line.

[0015] This application also provides a data center, including a data processing device, a data storage device, a network device, and a power module as described in any of the above embodiments of this application, wherein the power module is used to provide power for the operation of the data processing device, the data storage device, and the network device.

[0016] In the data center of this application, data processing equipment, data storage equipment, and network equipment can form the basic functional modules of the data center to provide data services. The power module can provide power for the operation of the data processing equipment, data storage equipment, and network equipment. Furthermore, the power module of this application can reduce the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in the prior art. Attached Figure Description

[0017] Figure 1 This is a schematic diagram of the structure of the power module and its thermal management scenario according to an embodiment of this application.

[0018] Figure 2 This is a schematic diagram of the structure of the thermal management device according to an embodiment of this application and its thermal management in a first thermal management mode.

[0019] Figure 3This is a schematic diagram of the structure of the thermal management device according to an embodiment of this application and its thermal management in a second thermal management mode.

[0020] Figure 4 This is a schematic diagram of the structure of the thermal management device according to an embodiment of this application and its thermal management in a third thermal management manner.

[0021] Figure 5 This is a schematic diagram of the structure of a power module and its thermal management scenario according to another embodiment of this application.

[0022] Figure 6 This is a structural block diagram of a data center according to an embodiment of this application.

[0023] Explanation of main component symbols

[0024] 1. Data Center; 100. Power Module; 101. Data Processing Equipment; 102. Data Storage Equipment; 103. Network Equipment; 11. Equipment Layer; 12. Transmission Layer; 13. Thermal Management Layer; 110. Transmission Line; 111. Power Equipment; 1111. Medium Voltage Transformer; 1112. Transformer; 1113. Energy Storage Device; 1114. Low Voltage Switchgear; 1115. Reactive Power Compensation Device; 1116. Ventilation Device; 121. Cooling Device; 131. Thermal Management Device; 1311. First Heat Conduction Device; 1312. Power Generation Device; 1313. Refrigeration Device; 1314. Control Device; 1315. Second Heat Conduction Device; 1316. Heating Device; 1317. Thermal Storage Device.

[0025] The following detailed description, in conjunction with the accompanying drawings, will further illustrate this application. Detailed Implementation

[0026] In the description of the embodiments in this application, the words "exemplary," "or," and "for example" are used to indicate examples, illustrations, or descriptions. Any embodiment or design scheme described as "exemplary" or "for example" in the embodiments of this application should not be construed as being more preferred or advantageous than other embodiments or design schemes. Specifically, the use of the words "exemplary," "or," and "for example" is intended to present the relevant concepts in a specific manner.

[0027] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application pertains. The terminology used in this application's specification is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. It should be understood that, unless otherwise stated, " / " in this application means "or". For example, A / B can mean A or B. "And / or" in this application is merely a description of the relationship between related objects, indicating that three relationships can exist. For example, A and / or B can represent: A alone, A and B simultaneously, and B alone. "At least one" refers to one or more. "More than one" refers to two or more. For example, at least one of a, b, or c can represent: a, b, c, a and b, a and c, b and c, and a, b, and c (seven cases).

[0028] It should also be noted that the terms "first" and "second" in the specification, claims, and drawings of this application are used to distinguish similar objects, not to describe a specific order or sequence. The methods disclosed in the embodiments of this application or the methods shown in the flowcharts include one or more steps for implementing the method. Without departing from the scope of the claims, the execution order of multiple steps can be interchanged, and some steps can also be deleted.

[0029] With the escalating global energy crisis and rising environmental demands, waste heat recovery technology has become a crucial breakthrough for improving energy efficiency in the information technology and internet services industry, which are high-energy-consuming sectors. The construction of intelligent waste heat management systems has become a core issue for the green transformation of the information technology industry. Currently, in data center thermal management technologies, while integrated strategies (i.e., recovering waste heat through heat exchangers or the thermoelectric (TE) effect and using it for power generation or cooling) can achieve multi-energy flow coordination, they struggle to address the differentiated characteristics of heterogeneous heat sources at the equipment level, resulting in low energy conversion rates and poor system adaptability. On the other hand, the homogenization treatment mode centered on TEG devices (i.e., using thermoelectric generators (TEGs) to directly convert all recovered heat energy into electricity through the Seebeck effect) simplifies the system architecture but exhibits inherent limitations in the fine-grained matching of thermal resources. Therefore, this "one-size-fits-all" thermal management approach may lead to the underutilization of much effective waste heat.

[0030] Specifically, due to differences in structural characteristics and workload, the heat dissipation temperature distribution of devices such as servers, UPS power supplies, and transformers within data centers exhibits a significant gradient characteristic. The uniform design standards (i.e., integrated or homogenized) adopted by traditional TEG modules are ill-suited to multi-level heat flux fields, such as the 0-50℃ low-temperature zone, the 50-85℃ medium-temperature zone, and the above-85℃ high-temperature zone. This leads to a decrease in the thermal energy conversion efficiency at the medium and low temperatures, and a significant amount of thermoelectric potential difference is not fully converted into effective energy. This is especially pronounced in high-density computing clusters, where the transient fluctuations and spatial heterogeneity of the chip's heat dissipation path further amplify energy loss. These mainstream solutions generally exhibit a polarization tendency: either they excessively pursue a uniform and intensive configuration of thermal equipment, leading to overload of thermoelectric conversion loads in localized high heat flux density areas; or they force the adoption of standardized cooling schemes, resulting in the active waste of recoverable heat energy in the medium and low temperature zones.

[0031] Therefore, this application provides a power module and data center that can reduce the technical problems of low energy conversion efficiency and structural imbalance in waste heat utilization in the prior art. Some embodiments will be described below with reference to the accompanying drawings. Unless otherwise specified, the following embodiments and features can be combined with each other.

[0032] Figure 1 This is a schematic diagram of the structure and thermal management scenario of the power module 100 according to an embodiment of this application.

[0033] like Figure 1 As shown, an embodiment of this application first provides a power module 100, which can be used to provide power to power-consuming generator sets or workshops such as data center 1. The power module 100 may include a device layer 11, a transmission layer 12, and a thermal management layer 13. The device layer 11 may be equipped with multiple power devices 111, and the transmission lines 110 between the multiple power devices 111 may be located in the transmission layer 12. The thermal management layer 13 may be equipped with a thermal management device 131. In this case, by dynamically dividing temperature ranges and adapting to differentiated management (e.g., high-temperature power generation and cooling, medium-temperature cooling and heating, and low-temperature storage and heating), the waste heat caused by integrated or homogenized processing is reduced, thereby forming a systematic layered thermal cycle system and improving the balance of energy conversion efficiency and waste heat utilization structure.

[0034] Figure 2 This is a schematic diagram of the structure of the thermal management device 131 according to an embodiment of this application and its thermal management in a first thermal management mode. Figure 3 This is a schematic diagram of the structure of the thermal management device 131 according to an embodiment of this application and its thermal management in a second thermal management mode. Figure 4 This is a schematic diagram of the structure of the thermal management device 131 according to an embodiment of this application and its thermal management in a third thermal management mode.

[0035] In some embodiments, such as Figures 2 to 4 As shown, the power equipment 111 may include a medium-voltage transformer 1111, a transformer 1112, an energy storage device 1113, a low-voltage switchgear 1114, a reactive power compensation device 1115, and a ventilation device 1116. The medium-voltage transformer 1111, also known as the medium-voltage transformer 1112, is used to convert power between medium-voltage power grids of different voltage levels, enabling efficient and safe long-distance power transmission and rational power distribution for data center 1. The transformer 1112 is an electrical device based on the principle of electromagnetic induction, used to achieve efficient transmission, rational distribution, and safe use of power in data center 1 by stepping up and down AC voltage, thereby reducing power transmission losses and adapting to different power demands. The energy storage device 1113 (e.g., a UPS, i.e., an uninterruptible power supply) can store electrical energy, providing emergency power when the main power supply of data center 1 is interrupted, ensuring continuous operation of equipment, and buffering voltage fluctuations to maintain power supply stability and security. The low-voltage switchgear 1114 (i.e., a low-voltage switch cabinet) is the terminal power distribution equipment of data center 1. The equipment can distribute, control, and protect low-voltage power through integrated circuit breakers and protection devices, ensuring safe and stable power supply to the equipment and supporting flexible load expansion and real-time power monitoring. The reactive power compensation device 1115 is an electrical device used to optimize the power factor of the power grid of Data Center 1. It can dynamically compensate reactive power through parallel capacitors or reactors, reduce line losses, improve power utilization efficiency, and help stabilize voltage to ensure power quality. The ventilation device 1116 (such as exhaust and air conditioning return air devices) is an important component of the environmental control system of Data Center 1. It can achieve heat dissipation and cooling, maintain constant temperature and humidity, and optimize the cold and hot aisle isolation efficiency through forced airflow circulation and precise control of airflow direction, thereby ensuring the reliable operation and efficient energy utilization of other power equipment 111 in Data Center 1.

[0036] In embodiments of this application, the thermal management device 131 may be configured to: perform thermal management on at least one of a plurality of electrical devices 111 using a first thermal management method based on a first temperature level; perform thermal management on at least one of the plurality of electrical devices 111 using a second thermal management method based on a second temperature level; and perform thermal management on at least one of the plurality of electrical devices 111 using a third thermal management method based on a third temperature level.

[0037] The temperature value of the first temperature level can be higher than that of the second temperature level, and the temperature value of the second temperature level can be higher than that of the third temperature level. For example, the first temperature level can be 85℃ to 105℃, the second temperature level can be 50℃ to 85℃, and the third temperature level can be below 50℃; or the first temperature level can be 100℃, the second temperature level can be 65℃ to 100℃, and the third temperature level can be below 65℃, or other classification relationships. It can be understood that the first, second, and third temperature levels can be dynamically classified based on the type, quantity, and operating energy consumption of the power equipment 111 in data center 1.

[0038] In some embodiments, the first thermal management method may be to collect the thermal energy of at least one electrical device 111 and use the thermal energy for power generation and / or cooling; the second thermal management method may be to collect the thermal energy of at least one electrical device 111 and use the thermal energy for cooling or heating; and the third thermal management method may be to collect the thermal energy of at least one electrical device 111 and use the thermal energy for heating. In this case, at the first temperature level, waste heat is used for both power generation and cooling, and the combined utilization rate of high-calorific-value waste heat is improved through thermoelectric synergy, thereby reducing the energy loss problem of single TEG power generation; at the second temperature level, parallel selection of cooling / heating is adopted, and the end application scenario is switched according to dynamic load demand, which can increase system flexibility compared with the traditional fixed mode and realize on-demand distribution of thermal energy; at the third temperature level, through a graded and degraded utilization strategy, waste heat that is difficult to utilize in the traditional way (such as low-temperature waste heat) is gradedly recovered through the thermal storage device 1317 (described later), thereby filling the utilization gap of traditional heat sources.

[0039] In the embodiments of this application, as described above, the power equipment 111 may include a medium-voltage transformer 1111, a transformer 1112, and an energy storage device 1113. The operating temperature of the medium-voltage transformer 1111, the transformer 1112, and the energy storage device 1113 may be at a first temperature level. At this time, the thermal management device 131 may be configured to collect the heat energy generated by at least one of the medium-voltage transformer 1111, the transformer 1112, and the energy storage device 1113 during operation, and use the heat energy for power generation and / or cooling.

[0040] In some embodiments, such as Figure 2As shown, the thermal management device 131 may include a first heat-conducting device 1311, a power generation device 1312, a cooling device 1313, and a control device 1314. The first heat-conducting device 1311 may be connected to the intermediate voltage transformer 1111, the transformer 1112, and the energy storage device 1113 to collect the heat energy generated during the operation of the intermediate voltage transformer 1111, the transformer 1112, and the energy storage device 1113. The power generation device 1312 may be connected to the first heat-conducting device 1311 and the control device 1314. The cooling device 1313 may be connected to the first heat-conducting device 1311 and the control device 1314. The control device 1314 may be used to control the power generation device 1312 to use heat energy for power generation and / or to control the cooling device 1313 to use heat energy for cooling. In this context, for devices such as medium-voltage transformers 1111, transformers 1112, and energy storage devices 1113 that can operate at relatively high temperatures (e.g., 85°C to 105°C, or above 100°C), a multi-module linkage architecture from heat conduction to power generation / cooling to control is used to form a double closed loop of energy flow and control flow, thereby improving the directional conversion efficiency and dynamic allocation flexibility of energy in the high-temperature range.

[0041] In some embodiments, the first heat-conducting device 1311 may include at least one of a heat pipe heat-conducting element, a heat collection shroud, and an ORC evaporator. The heat pipe heat-conducting element is composed of high-temperature radiant fins of Hastelloy alloy and a vacuum heat pipe, which can be directly connected (e.g., bonded) to electrical equipment 111 such as the medium-voltage transformer 1111, transformer 1112, and energy storage device 1113, and can be used to conduct heat energy generated during the operation of these electrical equipment 111. The heat collection shroud can be a fan-shaped baffle, which can adapt to irregular surfaces of the electrical equipment 111 (e.g., the oil tank of the transformer 1112) and be connected to the electrical equipment 111 such as the medium-voltage transformer 1111, transformer 1112, and energy storage device 1113, and can be used to collect heat energy generated during the operation of these electrical equipment 111. The ORC evaporator can be an embedded ORC (Organic Rankine Cycle) evaporator, which can be connected to electrical equipment 111 such as medium-pressure transformer 1111, transformer 1112 and energy storage device 1113, and can be used to transfer the heat energy generated by the electrical equipment 111 such as medium-pressure transformer 1111, transformer 1112 and energy storage device 1113 during operation to the organic working fluid and evaporate this heat energy into high-pressure steam.

[0042] In other embodiments, the heat pipe heat conductor, the heat collection shroud, and the ORC evaporator can also be interconnected. For example, the heat pipe heat conductor can be directly connected (e.g., bonded) to the power equipment 111 such as the medium-voltage transformer 1111, the transformer 1112, and the energy storage device 1113, the heat collection shroud can be connected to the heat pipe heat conductor, and the ORC evaporator can be connected to the heat collection shroud.

[0043] In some embodiments, the power generation device 1312 may include an ORC generator set, which may be connected to at least one of a heat pipe heat exchanger, a heat collector, and an ORC evaporator. The ORC generator set can generate electricity using the ORC expansion power generation principle. Additionally, the ORC generator set may be connected to power equipment 111 such as a transformer 1112 or the mains power system, thereby supplying the generated electricity to the data center 1 itself or for use by the mains power. Furthermore, the ORC generator set can be connected to the heat pipe heat exchanger, the heat collector, and the ORC evaporator via quick-release flanges, thereby reducing pipeline pressure loss and improving heat transfer efficiency.

[0044] In some embodiments, the cooling device 1313 may include a lithium bromide cooler, which may be connected to at least one of a heat pipe heat conductor or a heat collection hood, and the lithium bromide cooler may use the heat energy transferred by the heat pipe heat conductor or the heat collection hood for cooling, and the low-temperature heat energy generated by the cooling may be used to cool down the data center 1 itself.

[0045] In some embodiments, the control device 1314 may include at least one control terminal in a computer terminal or cloud. The control device 1314 may be connected to the first heat conduction device 1311, the power generation device 1312 and the cooling device 1313 to control the power generation device 1312 to use heat energy for power generation and / or control the cooling device 1313 to use heat energy for cooling based on a first thermal management method using a first temperature level.

[0046] In the embodiments of this application, as described above, the power equipment 111 may further include a low-voltage switchgear 1114 and a reactive power compensation device 1115. The operating temperature of the low-voltage switchgear 1114 and the reactive power compensation device 1115 may be at a second temperature level. The thermal management device 131 is configured to collect the heat energy generated by the low-voltage switchgear 1114 and the reactive power compensation device 1115 during operation and use the heat energy for cooling or heating.

[0047] In some embodiments, such as Figure 3As shown, the thermal management device 131 may include a second heat-conducting device 1315, a refrigeration device 1313, a heating device 1316, and a control device 1314. The second heat-conducting device 1315 may be connected to the low-voltage switchgear 1114 and the reactive power compensation device 1115 to collect the heat energy generated during the operation of the low-voltage switchgear 1114 and the reactive power compensation device 1115. The refrigeration device 1313 may be connected to the second heat-conducting device 1315 and the control device 1314. The heating device 1316 may be connected to the second heat-conducting device 1315 and the control device 1314. The control device 1314 may be used to control the refrigeration device 1313 to use heat energy for refrigeration or to control the heating device 1316 to use heat energy for heating. In this case, for equipment such as the low-voltage switchgear 1114 and the reactive power compensation device 1115, which operate at relatively moderate temperatures (e.g., 50°C to 85°C or 65°C to 100°C), a dual selection mechanism is used to deploy the refrigeration device 1313 and the heating device 1316 in parallel. Through a switchable path design (e.g., waste heat is used for heating when it is close to the low temperature range and for cooling when it is close to the high temperature range), the energy reuse requirements can be met.

[0048] In some embodiments, the second heat-conducting device 1315 may include at least one of a plate heat exchanger or a distributed waste heat boiler. The plate heat exchanger may be a titanium alloy corrugated plate, which may be connected (e.g., fitted) to the side of the electrical equipment 111, such as the low-pressure switchgear 1114 or the reactive power compensation device 1115, and may be connected to the refrigeration device 1313. The distributed waste heat boiler may be connected to the electrical equipment 111, such as the low-pressure switchgear 1114 or the reactive power compensation device 1115, and absorbs heat from the electrical equipment 111 by driving an ethylene glycol solution through its internal micro-circulation pump.

[0049] The refrigeration device 1313 can be the refrigeration device 1313 described above. Its functional principle is the same as that of the refrigeration device 1313 described above. It can be connected to a plate heat exchanger or a distributed waste heat boiler to absorb the heat from the plate heat exchanger or the distributed waste heat boiler and to cool it.

[0050] In some embodiments, the heating device 1316 may include a heat pump that may be connected to at least one of a plate heat exchanger or a distributed waste heat boiler, and may store and utilize the heat absorbed by the plate heat exchanger or the distributed waste heat boiler, while it may be connected to a city heating system to supply heat (such as heating or hot water) to the area at night.

[0051] The control device 1314 can be the control device 1314 described above, and the control device 1314 can be connected to the refrigeration device 1313 and the heating device 1316, for controlling the refrigeration device 1313 to use heat energy for refrigeration or controlling the heating device 1316 to use heat energy for heating.

[0052] In some embodiments, the control device 1314 can connect the refrigeration device 1313 and the heating device 1316 through an intelligent control valve, thereby dynamically switching the flow direction of the heat medium (i.e., cooling or heating) according to the waste heat temperature (e.g., whether it is close to the first temperature level or whether it is close to the third temperature level).

[0053] In the embodiments of this application, the power equipment 111 may further include a ventilation device 1116. The operating temperature of the ventilation device 1116 may be at the third temperature level. The thermal management device 131 may be configured to collect the heat energy of the ventilation device 1116 and use the heat energy for heating.

[0054] In some embodiments, such as Figure 4 As shown, the thermal management device 131 may include a thermal storage device 1317, a heating device 1316, and a control device 1314. The thermal storage device 1317 may be connected to the ventilation device 1116 to store the thermal energy of the ventilation device 1116. The heating device 1316 may be connected to the thermal storage device 1317 and the control device 1314. The control device 1314 may be used to control the heating device 1316 to use the thermal energy stored in the thermal storage device 1317 for heating. In this case, for equipment such as the ventilation device 1116 that can operate at relatively low temperatures (e.g., below 50°C or below 65°C), a low-temperature waste heat buffer pool is first constructed using the thermal storage device 1317. This reduces the time and space limitations of traditional waste heat recovery through an intermediate energy storage link, allowing intermittent low-grade heat energy to be utilized later, thereby improving the fault tolerance and utilization efficiency of the waste heat recovery system.

[0055] In some embodiments, the ventilation device 1116 may include at least one of an exhaust device, an air supply device, or a return air device.

[0056] In some embodiments, the thermal storage device 1317 may include a heat pump driven phase change thermal storage box, which may be connected to an exhaust device, an air supply device, or a return air device (e.g., connected to the air duct of the exhaust device, air supply device, or return air device via a heat pipe array), and uses a thermal storage ceramic ball bed (thermal storage density ≥200kJ / kg) to absorb and store the thermal energy of the exhaust device, air supply device, or return air device.

[0057] The heating device 1316 can be the heating device 1316 described above, and its functional principle is the same as that of the refrigeration device 1313 described above. It can be connected to a phase change heat storage box to absorb heat from the phase change heat storage box and heat it up to provide regional heating.

[0058] The control device 1314 can be the control device 1314 described above, and the control device 1314 can be connected to the heating device 1316 to control the heating device 1316 to use the heat energy stored in the heat storage device 1317 for heating.

[0059] Figure 5 This is a schematic diagram of the structure and thermal management scenario of a power module 100 according to another embodiment of this application.

[0060] In some embodiments, such as Figure 5 As shown, the transmission layer 12 may be equipped with a cooling device 121, which is connected to the refrigeration device 1313. The cooling device 121 is used to obtain low-temperature heat energy from the refrigeration device 1313 and use the low-temperature heat energy to cool the transmission line 110 (such as the transmission bus or copper busbar). In this case, the low-temperature waste heat resources generated by the refrigeration device 1313 are used again by the cooling device 121 to cool the transmission line 110, thereby realizing the step-by-step utilization of energy. Through the recovery of waste heat in the refrigeration process, energy can be cross-reused, improving energy utilization efficiency.

[0061] In some embodiments, the cooling device 121 may include a liquid nitrogen circulation pump and a cooling pipeline. The cooling pipeline may cover the transmission line 110 and may be filled with liquid nitrogen. The liquid nitrogen circulation pump is connected to the cooling pipeline and the refrigeration device 1313. The liquid nitrogen circulation pump can drive liquid nitrogen to circulate in the cooling pipeline to cool the transmission line 110 and can absorb low-temperature heat energy from the refrigeration device 1313.

[0062] In some embodiments, the cooling device 121 may further include an air conditioner, which can be used to provide cooling air to the transmission line 110 and various electrical devices 111 to assist in heat dissipation of the transmission line 110 and various electrical devices 111.

[0063] It should be noted that the thermal management method of the embodiments of this application may not be limited to the above-described execution method. For example, when the operating temperature of the medium-pressure transformer 1111 is at a medium (i.e., the second temperature level) or a low (i.e., the third temperature level), the second thermal management method or the third thermal management method may also be used for waste heat recovery and utilization.

[0064] In the power module 100 of this application, the decoupling design between the equipment layer 11, the transmission layer 12 and the thermal management layer 13 enables the independent operation of heat flow regulation and power transmission. The thermal management device 131 divides the power equipment 111 into a first (e.g., high temperature), a second (e.g., medium temperature), and a third (e.g., low temperature) temperature level, and matches them with corresponding thermal management methods. For example, the first stable level uses active heat recovery technology to prioritize the extraction of high-grade heat energy (i.e., high-temperature heat energy) for power generation or cooling. The second temperature level uses a cascade conversion or temporary storage mechanism to use medium-grade heat energy (i.e., medium-temperature heat energy) for cooling or heating to achieve energy slow release. The third temperature level relies on a directional heat dissipation path to guide residual low-grade heat energy (i.e., low-temperature heat energy) for heating to achieve harmless release. Therefore, it is possible to break through the environmental adaptability limitations of traditional integrated or homogenized treatment modes, reduce the loss of high-calorific-value waste heat through temperature zone threshold sorting, and achieve multi-level optimization effects. In other words, by improving the graded utilization rate of heat resources, the overall efficiency of energy conversion can be enhanced, thereby systematically reducing the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in existing technologies.

[0065] Figure 6 This is a structural block diagram of data center 1 according to an embodiment of this application.

[0066] like Figure 6 As shown, this application also provides a data center 1, which may include a data processing device 101, a data storage device 102, a network device 103, and a power module 100 as described in any of the embodiments of this application above. The power module 100 is used to provide power for the operation of the data processing device 101, the data storage device 102, and the network device 103.

[0067] In some embodiments, the data processing device 101, data storage device 102, and network device 103 of the data center 1 can also be managed for heat dissipation or waste heat recovery through the thermal management method of the power module 100 described above. For example, the heat generated by the operation of the data processing device 101, data storage device 102, and network device 103 can be transferred to the thermal storage device 1317 through water cooling pipes, and then the waste heat can be managed by the third thermal management method, thereby improving the overall heat dissipation or waste heat management efficiency of the data center 1 and improving energy utilization.

[0068] In the data center 1 of this application, the data processing device 101, the data storage device 102, and the network device 103 can form the basic functional modules of the data center 1 to provide data services. The power module 100 can provide power for the operation of the data processing device 101, the data storage device 102, and the network device 103. Furthermore, the power module 100 of this application can reduce the technical problems of low energy conversion rate and structural imbalance in waste heat utilization in the prior art.

[0069] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions can be made to the technical solutions of this application without departing from the spirit and scope of the technical solutions of this application.

Claims

1. A power module, characterized in that, The system includes a device layer, a transmission layer, and a thermal management layer. The device layer is equipped with multiple electrical devices, and transmission lines between these devices are located within the transmission layer. The thermal management layer is equipped with a thermal management device configured to: perform thermal management on at least one of the multiple electrical devices using a first thermal management method based on a first temperature level; perform thermal management on at least one of the multiple electrical devices using a second thermal management method based on a second temperature level; and perform thermal management on at least one of the multiple electrical devices using a third thermal management method based on a third temperature level; wherein the temperature value of the first temperature level is greater than the temperature value of the second temperature level, and the temperature value of the second temperature level is greater than the temperature value of the third temperature level. The first temperature level, the second temperature level, and the third temperature level are dynamically classified based on the type, quantity, and operating energy consumption of the power equipment. The power equipment includes a medium-voltage transformer, a transformer, and an energy storage device. The operating temperature of the medium-voltage transformer, the transformer, and the energy storage device is at the first temperature level. The thermal management device is configured to collect the heat energy generated by at least one of the medium-voltage transformer, the transformer, and the energy storage device during operation, and use the heat energy for power generation and / or cooling. The power equipment also includes a low-voltage switchgear and a reactive power compensation device. The operating temperature of the low-voltage switchgear and the reactive power compensation device is at the second temperature level. The thermal management device is configured to collect the heat energy generated by the low-voltage switchgear and the reactive power compensation device during operation and use the heat energy for cooling or heating. The electrical equipment also includes a ventilation device, which operates at the third temperature level. The thermal management device is configured to collect the heat energy from the ventilation device and use the heat energy for heating. The transmission layer is provided with a cooling device, which is connected to the refrigeration device in the thermal management device. The cooling device is used to obtain low-temperature heat energy from the refrigeration device and use the low-temperature heat energy to cool the transmission line.

2. The power module according to claim 1, characterized in that, The first thermal management method is to collect the thermal energy of at least one of the electrical devices and use the thermal energy for power generation and / or cooling.

3. The power module according to claim 1, characterized in that, The second thermal management method is to collect the thermal energy of at least one of the electrical devices and use the thermal energy for cooling or heating.

4. The power module according to claim 1, characterized in that, The third thermal management method involves collecting thermal energy from at least one of the electrical devices and using that thermal energy for heating.

5. The power module according to claim 1, characterized in that, The thermal management device includes a first heat-conducting device, a power generation device, a refrigeration device, and a control device. The first heat-conducting device is connected to the intermediate voltage transformer, the transformer, and the energy storage device to collect the heat energy generated during the operation of the intermediate voltage transformer, the transformer, and the energy storage device. The power generation device is connected to the first heat-conducting device and the control device. The refrigeration device is connected to the first heat-conducting device and the control device. The control device is used to control the power generation device to use the heat energy for power generation and / or to control the refrigeration device to use the heat energy for refrigeration.

6. The power module according to claim 3, characterized in that, The thermal management device includes a second heat-conducting device, a refrigeration device, a heating device, and a control device. The second heat-conducting device is connected to the low-voltage switchgear and the reactive power compensation device to collect the heat energy generated during the operation of the low-voltage switchgear and the reactive power compensation device. The refrigeration device is connected to the second heat-conducting device and the control device. The heating device is connected to the second heat-conducting device and the control device. The control device is used to control the refrigeration device to use the heat energy for refrigeration or to control the heating device to use the heat energy for heating.

7. The power module according to claim 4, characterized in that, The thermal management device includes a thermal storage device, a heating device, and a control device. The thermal storage device is connected to the ventilation device to store the thermal energy of the ventilation device. The heating device is connected to the thermal storage device and the control device. The control device is used to control the heating device to use the thermal energy stored in the thermal storage device for heating.

8. A data center, characterized in that, It includes a data processing device, a data storage device, a network device, and a power module as described in any one of claims 1 to 7, wherein the power module is used to provide power for the operation of the data processing device, the data storage device, and the network device.

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