Temperature control method based on pressure transmitter
By adding a heating mechanism on the back of the pressure transmitter circuit board and combining the intelligent adjustment of the neural network model, the problem of limited performance of the circuit board at ultra-low temperatures is solved, and the stable operation and high-efficiency energy consumption management of the pressure transmitter in extreme environments is achieved.
Patent Information
- Application Number
- CN202510408297.3
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-02
- Publication Date
- 2025-07-08
AI Technical Summary
The use temperature range limitation of existing pressure transmitters in ultra-low temperature environments leads to limited overall performance, and circuit board components may decline or fail due to low temperature performance.
By adding a heating mechanism and control system on the back of the circuit board, a closed-loop control of multi-stage temperature acquisition and intelligent adjustment is adopted, and the front and back temperature difference is dynamically analyzed by neural network model, and the PWM duty cycle is intelligently adjusted to achieve precise temperature control to prevent excessive heating and energy consumption.
It significantly improves the reliability and energy efficiency of the pressure transmitter in extreme environments, ensures that the circuit board and pressure sensors work stably at ultra-low temperatures, and avoids the overshooting problem of traditional PID algorithms.
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Figure CN120276530A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of pressure transmitters, and particularly to a temperature control method based on a pressure transmitter. Background Art
[0002] A pressure transmitter is a complex system composed of multiple modules such as a pressure sensor core, a signal processing circuit, an output circuit, a housing, connection components, and a power supply. Its core function is to convert a pressure signal into a standardized electrical signal output, providing key support for industrial automation and control systems.
[0003] Currently, some pressure sensor cores are already able to work stably within a wide temperature range of -65°C to 175°C, meeting the pressure measurement requirements in ultra-low temperature environments. Another important part of a pressure transmitter is the circuit board, which is the core part responsible for signal processing, data conversion, and output control in the pressure transmitter. However, its operating temperature range is usually narrower than that of the pressure sensor core. In ultra-low temperature environments, electronic components in the circuit board such as integrated circuits, capacitors, and resistors may experience performance degradation or even failure due to low temperature, such as signal distortion, response delay, or complete inability to work.
[0004] Therefore, although the pressure sensor core can work normally at ultra-low temperatures, the temperature limit of the circuit board still restricts the overall performance of the pressure transmitter when operating at ultra-low temperatures. Summary of the Invention
[0005] In view of the above problems, this application provides a temperature control method based on a pressure transmitter. By adding a heating mechanism and a control system to the circuit board in the pressure transmitter, intelligent temperature adjustment is realized to enable the pressure transmitter to be applicable to ultra-low temperature environments and ensure the stable operation of the circuit board and the pressure sensor at ultra-low temperatures.
[0006] To achieve the purpose of this application, the following technical solutions are provided in this application:
[0007] This application provides a temperature control method based on a pressure transmitter, and the method includes:
[0008] The first temperature is collected in real time through a temperature sensor. When the first temperature is less than the first preset temperature, the controller starts the heating mechanism to heat the circuit board;
[0009] After the first preset time, the second temperature is collected in real time through the temperature sensor. When the difference between the second temperature and the first temperature is less than or equal to the preset difference, the controller implements an intelligent power adjustment scheme;
[0010] After the second preset time, the third temperature is collected in real time by the temperature sensor. When the third temperature is not within the third temperature range, the controller controls the heating mechanism to continue adjusting the heating power. After the third preset time of adjusting the heating power, the temperature is collected again until the collected temperature is within the third temperature range;
[0011] Wherein, a pressure sensor and a circuit board connected to the pressure sensor are arranged in the cavity of the pressure transmitter. A temperature sensor and a controller are arranged on the circuit board, and the heating mechanism is attached to the back of the circuit board.
[0012] In a possible implementation manner, when the difference between the second temperature and the first temperature is less than or equal to a preset difference, the controller implements an intelligent power adjustment scheme, which further includes:
[0013] Training the neural network model with historical data, where the historical data includes pressure, temperature, heating film power, and the trend of temperature changing with time;
[0014] The controller inputs the difference into the neural network model, and the neural network model predicts the temperature change in the cavity within a future preset time, and generates an intelligent power adjustment scheme according to the temperature change;
[0015] When the difference between the second temperature and the first temperature is less than or equal to the preset difference, the controller implements the intelligent power adjustment scheme, and the intelligent power adjustment scheme includes the heating start time, heating duration, and heating power of the heating mechanism.
[0016] In a possible implementation manner, the controller controls the heating mechanism to continue adjusting the heating power, which further includes:
[0017] According to the error range between the third temperature and the third temperature range, dynamically calculate the control quantity of the controller through the neural network model, where the control quantity includes a proportional coefficient, an integral coefficient, and a differential coefficient;
[0018] The PWM signal transmitter maps the control quantity to a PWM duty cycle;
[0019] Adjust the heating power of the heating mechanism according to the PWM duty cycle.
[0020] In a possible implementation manner, the controller further includes a startup preheating controller; after the first temperature is collected in real time by the temperature sensor, the method further includes:
[0021] When the first temperature is less than the first preset temperature, the startup preheating controller controls the heating mechanism to heat;
[0022] When the operating temperature of the controller reaches the first preset temperature, the power-on preheating controller is turned off.
[0023] In a possible implementation, the method further includes:
[0024] When the third temperature is within the third temperature range, the controller turns off the heating mechanism.
[0025] A temperature control method based on a pressure transmitter provided by the present application has the following beneficial effects:
[0026] The temperature control method based on the pressure transmitter described in the embodiments of the present application significantly improves the reliability and energy efficiency performance of the pressure transmitter in extreme environments through a closed-loop control of multi-level temperature acquisition and intelligent regulation. Its core advantage lies in the adoption of a progressive temperature control strategy: when detecting an ultra-low temperature (such as the first temperature), it immediately starts a rapid heating mode to prevent cold start damage to circuit board components; through neural network dynamic analysis of the temperature difference before and after, it intelligently adjusts the PWM duty cycle to achieve precise temperature control and avoid overshoot problems of traditional PID algorithms; and the temperature review mechanism with multiple time windows can not only ensure that the temperature stably enters the safe range (such as the third temperature range), but also prevent energy consumption waste caused by overheating. Description of the Drawings
[0027] The drawings are used to provide a further understanding of the present application and constitute a part of the specification. They are used together with the embodiments of the present application to explain the present application and do not constitute a limitation to the present application;
[0028] Figure 1 Shows a schematic structural diagram of a pressure transmitter provided by an embodiment of the present application;
[0029] Figure 2 Shows a schematic structural diagram of a control device based on a pressure transmitter provided by an embodiment of the present application;
[0030] Figure 3 Shows a flowchart of a temperature control method based on a pressure transmitter provided by an embodiment of the present application;
[0031] Figure 4 Shows a flowchart of a temperature control method based on a pressure transmitter provided by another embodiment of the present application;
[0032] Reference Signs: 1, First Connector; 2, Pressure Sensor; 3, Adapter Tube; 4, Housing; 5, Circuit Board; 6, Heating Mechanism; 7, Second Connector; 8, Connector; 9, Temperature Sensor. Detailed Embodiments
[0033] To make the objectives, technical solutions, and advantages of this application clearer, the following will clearly and completely describe the technical solutions in this application with reference to the accompanying drawings in this application. Obviously, the described embodiments are part of the embodiments of this application, rather than all of them. Based on the embodiments in this application, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of this application.
[0034] The terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features; in the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more.
[0035] Pressure transmitters applied in fields such as aerospace (such as aircraft fuel systems, rocket propellant monitoring), national defense and military (such as missile guidance, deep-sea equipment), energy industry (such as LNG storage tanks, geothermal exploration), automobiles (such as hydrogen fuel vehicles, racing car engines), industrial manufacturing (such as semiconductor equipment, chemical pipelines), and polar or space exploration (such as Mars rovers, polar robots) generally need to be stable in extreme temperature environments. Nowadays, some pressure sensors used in pressure transmitters can adapt to ultra-low temperatures, but the circuit boards responsible for communicating with the pressure sensors and data processing are very difficult to work properly at ultra-low temperatures. Therefore, to solve this problem, this application provides a pressure transmitter and a temperature control method based on the pressure transmitter.
[0036] The technical solutions of this application will be described in conjunction with the following embodiments.
[0037] Figure 1 The structural schematic diagram of a pressure transmitter provided by an embodiment of this application is shown, as Figure 1 shown, an embodiment of this application provides a pressure transmitter, including: a first joint 1, a transition pipe 2, a pressure sensor 3, a housing 4, a circuit board 5, a heating mechanism 6, a second joint 7, and a connector 8.
[0038] Among them, the outer wall of the first end of the first joint 1 is sleeved with a pressure sensor 2, and the end of the first joint 1 connected to the pressure sensor 2 is inserted into the first end of the transition pipe 3. The outer wall of the second end of the transition pipe 3 is sleeved with the first end of the housing 4. A cavity is provided inside the housing 4, and a circuit board 5 is arranged inside the cavity. The second end of the transition pipe 3 is connected to the circuit board 5. Specifically, the second end surface of the transition pipe 3 is connected to the circuit board 5 through a pan head screw. The two ends of the transition pipe 3 are respectively connected to the first joint 1 and the housing 4 to form a sealed pressure conduction channel, and the pressure of the measured medium (such as pipeline fluid) is transmitted to the diaphragm of the pressure sensor 2 without loss.
[0039] The back surface of the circuit board 5 is attached to the heating mechanism 6. The second end of the housing 4 is connected to the second connector 7. A connector 8 is inserted into the second connector 7. This connector 8 serves as the electrical interface between the circuit board 5 and the external system. The circuit board 5 is respectively connected to the pressure sensor 2 and the connector 8 through electrical signal transmission lines.
[0040] To enable the circuit board 5 to be applicable to ultra-low temperature usage scenarios, the present application adds a heating mechanism 6 to the back surface of the circuit board 5. Exemplarily, a PI heating film is attached to the back surface of the circuit board 5, or a heat dissipation layer and a PI heating film are sequentially laminated on the back surface of the circuit board 5. The PI heating film serves as the active heat source, precisely generates heat by receiving the PWM signal of the controller, and converts electrical energy into stable and controllable heat energy; while the heat dissipation layer (such as a high thermal conductivity graphite sheet or a metal composite material) is arranged closely to the heating film, and utilizes its excellent planar heat conduction characteristics to quickly laterally diffuse the heat generated by the heating film, eliminate local high temperature points, and ensure uniform temperature distribution across the entire circuit board 5.
[0041] Therefore, in the embodiment of the present application, the heating mechanism 6 heats the circuit board 5, enabling the circuit board 5 to still operate stably at ultra-low temperatures, and further ensuring the stable operation of the pressure transmitter at ultra-low temperatures, which can be applied to special scenarios with extremely high requirements for temperature tolerance and reliability.
[0042] To achieve a tight connection between the first connector 1 and other parts of the pressure transmitter and to facilitate the insertion of the first connector 1 into the adapter tube 3, the first connector 1 is designed as a stepped reduced-diameter column in the embodiment of the present application. The stepped reduced-diameter column includes a first part, a second part, and a third part that are sequentially connected and have gradually decreasing radii. The first part is located outside the first end of the adapter tube 3, the outer diameter of the second part is in interference fit with the adapter tube 3, such that the second part can sleeve the first end of the adapter tube 3, and the third part is located inside the adapter tube 3 and sleeves the pressure sensor 2.
[0043] To ensure the sealed connection between the first connector 1 and the adapter tube 3, a sealing ring is provided between the outer wall of the second part and the inner wall of the first end of the adapter tube 3. And to ensure the sealed connection between the second end of the adapter tube 3 and the housing 4, a sealing ring is provided between the outer wall of the second end of the adapter tube 3 and the inner wall of the housing 4.
[0044] The inner wall of the housing 4 is lined with thermal insulation cotton, such as aerogel or ceramic fiber. The thermal insulation cotton reflects the heat generated by the heating film back to the area of the circuit board 5, reducing heat dissipation to the outside of the housing 4.
[0045] The pressure transmitter provided by the embodiments of the present application can work stably within a wide temperature range of -65°C to 175°C. Therefore, in order to simultaneously achieve heating and heat preservation at ultra-low temperatures and ensure heat dissipation at high temperatures, in one embodiment, a plurality of heat dissipation ribs are arranged on the outer wall of the housing 4 of the pressure transmitter at evenly spaced angles along the circumferential direction of the housing 4. The heat preservation layer is coaxially attached to the inner wall of the housing 4 in a cylindrical shape. A paraffin-based phase change layer and heat preservation cotton are arranged at evenly spaced angles along the circumferential direction of the heat preservation layer. The heat preservation cotton is connected to the paraffin-based phase change layer, so that the heat preservation layer arranged in the area where the inner wall of the housing 4 overlaps with the heat dissipation ribs is the paraffin-based phase change layer. The paraffin-based phase change layer can enhance heat conduction when melting at high temperatures and restore heat insulation when solidifying at low temperatures. Therefore, at low temperatures, the heat preservation layer keeps warm and reduces heat loss. At high temperatures, the paraffin-based phase change layer melts and exposes the heat dissipation ribs, and the heat dissipation ribs dissipate heat.
[0046] It should be noted that the paraffin-based phase change layer is a heat-responsive composite material, including paraffin, graphite powder, silicone rubber, etc. At high temperatures, the melted paraffin expands in volume and can push the graphite powder to concentrate towards the edge, forming a heat dissipation channel for the heat dissipation ribs; at low temperatures, the paraffin shrinks, and the elasticity of the silicone rubber pulls the graphite powder back from the edge and disperses it, and the heat dissipation channel disappears. The paraffin-based phase change layer can not only achieve low-temperature curing and high-temperature melting, but also be recycled to achieve thousands of phase changes.
[0047] The present application also provides an implementation manner, which can solve the problems of circuit short-circuit or sensor failure caused by the accumulation of condensed water in an extreme temperature difference environment with the assistance of the heating mechanism 6. When the pressure transmitter works in a low-temperature and high-humidity environment, external cold air may penetrate into the housing 4 through the joint gap and form condensed water when encountering the relatively high-temperature circuit board 5 or heating mechanism 6. Therefore, in the embodiments of the present application, a condensed water collection tank is arranged in the housing 4, and an evaporator and a liquid level sensor are installed in the condensed water collection tank. When the liquid level sensor detects that the liquid level is greater than the liquid level threshold, the evaporator and the heating mechanism 6 are started to reduce the humidity in the housing 4, so that even if the outer shell of the pressure transmitter repeatedly dew due to reasons such as day-night temperature difference, the circuit board 5 in the housing 4 can still be kept dry.
[0048] The present application provides another embodiment, which is a control device that can adjust the start time, heating duration, heating temperature, heating frequency, heating power, etc. of the heating mechanism 6 according to the temperature and / or humidity changes in the housing 4 of the pressure transmitter. Figure 2 The structural schematic diagram of the control device based on the pressure transmitter provided by the embodiments of the present application is shown, as Figure 2 shown, this control device is arranged on the circuit board 5 and includes a controller, a temperature sensor 9, a humidity sensor, a pressure signal acquisition and conditioning module, a humidity signal acquisition conditioner, and a PWM signal transmitter. The temperature sensor 9 is installed on the front side of the circuit board 5 or on the side of the heating mechanism 6 opposite to the circuit board 5.
[0049] Among them, the pressure sensor 2 is communicatively connected to the controller through a pressure signal acquisition conditioner. It should be noted that the adapter pipe 3, as the core channel for pressure conduction, has one end connected to the medium to be measured (such as pipeline gas or liquid), and the other end is connected to the pressure sensor 2 through a sealing structure, transmitting the external pressure to the pressure sensor 2 without loss. After the pressure sensor 2 converts the physical pressure conducted by the adapter pipe 3 into an original electrical signal (usually a weak analog signal in millivolts), the pressure signal acquisition conditioner immediately intervenes and converts the original signal into a standard industrial signal through processing such as high-precision amplification, temperature compensation, non-linear correction, and noise filtering, and transmits it to the controller on the circuit board 5.
[0050] The temperature sensor 9 is communicatively connected to the controller through a temperature signal acquisition conditioner. It should be noted that the temperature sensor 9 (exemplarily including PT100 or thermocouple) senses the temperature of the key parts in real time (such as inside the pressure sensor 2, the circuit board 5, or the housing 4). The weak analog signal output by it is amplified, compensated, and linearized by the temperature signal acquisition conditioner and converted into a high-precision digital signal. After receiving this signal, the controller dynamically adjusts the power of the heating mechanism 6 in combination with the preset temperature threshold and algorithms (such as neural network model and PID control).
[0051] The humidity sensor is communicatively connected to the controller through a humidity signal acquisition conditioner. It should be noted that the humidity sensor monitors the humidity change inside the housing 4 in real time (such as a sudden increase in humidity caused by the evaporation of condensed water). The original signal is amplified, linearized, and temperature-compensated by the humidity acquisition conditioner and converted into a high-precision digital signal and transmitted to the controller. The controller then dynamically adjusts the power of the heating mechanism 6 or starts and stops the evaporator according to the preset humidity threshold.
[0052] The heating mechanism 6 and the PWM signal transmitter are respectively communicatively connected to the controller. It should be noted that the controller generates a dynamic control instruction according to the real-time data fed back by the temperature sensor 9, converts the digital instruction into a high-precision pulse width modulation signal through the PWM signal transmitter, and precisely drives the power output of the heating mechanism 6 (such as a PI heating film). At the same time, the PWM transmitter will monitor the current of the heating circuit in real time and feedback the load status to the controller to form a two-way communication.
[0053] Another embodiment is provided in this application. A power-on preheating controller is also provided on the circuit board 5, and the power-on preheating controller is connected to the heating mechanism 6. It should be noted that during the cold start stage of the pressure transmitter, the power-on preheating controller controls the heating structure to preferentially heat key components such as the signal conditioning chip and the reference voltage source on the circuit board 5 progressively. Specifically, the heating power of the heating mechanism 6 is precisely controlled through the PWM signal transmitter, so that the temperature of the key components climbs slowly, avoiding low-temperature embrittlement or condensation short circuit.
[0054] The circuit board 5 further includes a power supply, which is electrically connected to the controller, the pressure signal acquisition and conditioning module, the humidity signal acquisition conditioner, the PWM signal transmitter, and the startup preheating controller respectively. It should be noted that, as an energy hub, the power supply works in coordination with each module through a hierarchical power distribution strategy: the power supply preferentially provides stable voltage for core circuits such as the controller, the signal conditioning module (pressure / humidity), and the PWM signal transmitter to ensure the real-time performance of signal acquisition and processing; while the startup preheating controller serves as a power management unit, dynamically allocating electric energy during the cold start phase, that is, pre-powering the sensors and conditioning circuits first, and only after the controller passes the self-check, driving the heating mechanism 6 to work through the modulation signal output by the PWM signal transmitter. At the same time, indirectly powering the heating mechanism 6 through the PWM transmitter can not only utilize its current isolation characteristic to eliminate interference and ensure the circuit stability, but also achieve fine control of the heating power through duty cycle adjustment.
[0055] Based on the above embodiments, in combination with Figure 2 , the controller collects the data of the digital temperature sensor 9 (such as DS18B20) through the 1-wire bus. After performing PID operation internally, it outputs an analog control signal through the PWM signal via a V / F converter (voltage-frequency conversion). At the same time, it realizes two-way communication with the host computer through the RS232 serial port - both uploading real-time temperature data and receiving parameter instructions from the monitoring software. This design combines digital precision and analog control flexibility, and is typically applied to industrial constant temperature systems, where the 1-wire saves IO resources, the V / F conversion enhances anti-interference ability, and the RS232 provides reliable long-distance communication.
[0056] Figure 3 The flowchart of a temperature control method based on a pressure transmitter provided by an embodiment of the present application is shown. Figure 4 The flowchart of another temperature control method based on a pressure transmitter provided by an embodiment of the present application is shown. As Figure 3 and Figure 4 shown, based on the pressure transmitter described in the above embodiments, the embodiment of the present application further provides a temperature control method based on a pressure transmitter, including the following steps:
[0057] It should be noted that a pressure sensor 2 and a circuit board 5 connected to the pressure sensor 2 are provided in the pressure transmitter cavity. A temperature sensor 9 and a controller are provided on the circuit board 5, and a heating mechanism 6 is attached to the back of the circuit board 5. The circuit board 5 is provided with a controller, a temperature sensor 9, a humidity sensor, a pressure signal acquisition and conditioning module, a humidity signal acquisition and conditioner, a PWM signal transmitter, and a power-on preheating controller. Among them, the pressure sensor 2 is communicatively connected to the controller through a pressure signal acquisition and conditioner; the temperature sensor 9 is communicatively connected to the controller through a temperature signal acquisition and conditioner; the humidity sensor is communicatively connected to the controller through a humidity signal acquisition and conditioner, the heating mechanism 6 and the PWM signal transmitter are respectively communicatively connected to the controller, and the power-on preheating controller is connected to the heating mechanism 6.
[0058] S100 collects the first temperature in real time through the temperature sensor 9. When the first temperature is less than the first preset temperature, the controller starts the heating mechanism 6 to heat the circuit board 5.
[0059] After collecting and verifying a large amount of data, the first preset temperature is set to -40 °C.
[0060] After the first preset time in S200, the second temperature is collected in real time through the temperature sensor 9. When the difference between the second temperature and the first temperature is less than or equal to the preset difference, the controller implements an intelligent power adjustment scheme.
[0061] After verifying a large amount of data, the absolute value of the preset difference is 2 °C. When the difference between the second temperature and the first temperature is less than or equal to the preset difference, it means that the temperature rise rate inside the housing 4 is too slow. If the heating power of the heating mechanism 6 continues to be maintained, the circuit board 5 may be damaged due to ultra-low temperature. Therefore, it is necessary to increase the heating power of the heating mechanism 6 to ensure a rapid increase in the temperature inside the housing 4. The duration of the first preset time is 10 seconds. The intelligent power adjustment scheme is generated by the controller according to the neural network model and triggered by the controller for implementation. Specifically, it includes:
[0062] The neural network model is trained with historical data, and the historical data includes pressure, temperature, heating film power, and the trends of temperature and humidity changing over time.
[0063] The controller inputs the difference into the neural network model. The controller uses the neural network model to predict the temperature change situation inside the cavity in the future preset time, and generates an intelligent power adjustment scheme according to the temperature change situation;
[0064] When the difference between the second temperature and the first temperature is less than or equal to the preset difference, the controller implements the intelligent power adjustment scheme. The intelligent power adjustment scheme includes the heating frequency, heating start time, heating duration, and heating power of the heating mechanism 6. By implementing the intelligent power adjustment scheme, the temperature inside the cavity is raised to the third temperature range.
[0065] After the second preset time in S300, the third temperature is collected in real time through the temperature sensor 9. When the third temperature is not within the third temperature range, the controller controls the heating mechanism 6 to continue to adjust the heating power, and the temperature is collected again after the third preset time for adjusting the heating power until the collected temperature is within the third temperature range.
[0066] The third temperature range is -35°C ± 2°C. When the temperature inside the housing 4 is within the third temperature range, the circuit board 5 can work properly. The duration of the second preset time is 30 seconds.
[0067] Wherein, when the third temperature is not within the third temperature range, the controller controls the heating mechanism 6 to continue to adjust the heating power, which specifically includes:
[0068] When the third temperature is lower than the minimum value of the third temperature range, the controller controls the heating mechanism 6 to increase the heating power, and the temperature is collected again after the third preset time for increasing the heating power until the collected temperature is within the third temperature range. The third preset time is 50 seconds. Wherein, when increasing the heating power, it can be increased step by step, such as increasing 5% of the original power every 5 seconds.
[0069] Or, when the third temperature is higher than the maximum value of the third temperature range, the controller controls the heating mechanism 6 to reduce the heating power, and the temperature is collected again after the third preset time for reducing the heating power until the collected temperature is within the third temperature range. Wherein, when reducing the heating power, it can be reduced step by step, such as reducing 5% of the original power every 5 seconds.
[0070] It should be noted that when the third temperature is within the third temperature range, the controller controls the heating mechanism 6 to stop heating.
[0071] In another embodiment provided by the present application, the controller in S300 controls the heating mechanism 6 to continue to adjust the heating power, which specifically includes:
[0072] According to the error between the difference value and the preset difference value, the control quantity of the controller is dynamically calculated through the neural network model. The control quantity includes a proportional coefficient, an integral coefficient, and a differential coefficient; the PWM signal transmitter maps the control quantity to the PWM duty cycle; and the heating power of the heating mechanism 6 is adjusted according to the PWM duty cycle.
[0073] Another embodiment of the present application also provides a pressure transmitter, that is, a condensate water collection tank is arranged in the cavity of the pressure transmitter, and a liquid level sensor and an evaporator are arranged in the collection tank. Therefore, the temperature control method based on the pressure transmitter in the embodiment of the present application further includes:
[0074] When the liquid level sensor detects that the liquid level is greater than the liquid level threshold, the controller starts the evaporator and the heating mechanism 6;
[0075] The controller controls the heating mechanism 6 to raise the temperature in the cavity to the fourth temperature, where the fourth temperature ≥ Tdew + △T, Tdew is the current dew point temperature, △T is the preset safety margin, and △T = 5°C;
[0076] When the humidity sensor detects that the relative humidity is lower than the humidity threshold and the liquid level sensor detects that the current liquid level is lower than the liquid level threshold, the controller turns off the evaporator and the heating mechanism 6. The liquid level threshold = 2 mm, and the humidity threshold = 20%RH.
[0077] Another temperature control method based on a pressure transmitter provided by an embodiment of the present application includes the following steps executed by a controller:
[0078] The temperature sensor 9 collects the first temperature. When the first temperature is less than the first preset temperature, the power-on preheating controller controls the heating mechanism 6 to perform preheating;
[0079] When the operating temperature of the controller reaches the first preset temperature, the power-on preheating controller is turned off, and the PWM signal transmitter is started to adjust the heating power of the heating mechanism 6. When performing power adjustment, the heating power of the fixed heating mechanism 6 can be adjusted in real time through a neural network model and a PID control algorithm, or the controller can be triggered to implement an intelligent power adjustment scheme predicted according to the neural network model.
[0080] The beneficial effects that can be achieved by the embodiment of the present application: The pressure transmitter described in the embodiment of the present application adopts a nested design of the first joint, the adapter tube and the housing, realizes the integrated integration of the pressure sensor and the circuit board, reduces external interference, and improves the overall structural stability; at the same time, the heating mechanism is directly attached to the circuit board, can respond to the needs of the low-temperature environment, and ensures the stable operation of the circuit board and the pressure sensor at ultra-low temperatures.
[0081] The temperature control method based on the pressure transmitter described in the embodiment of the present application significantly improves the reliability and energy efficiency performance of the pressure transmitter in extreme environments through a closed-loop control of multi-level temperature acquisition and intelligent adjustment. Its core advantage lies in adopting a progressive temperature control strategy: when detecting ultra-low temperature (such as the first temperature), immediately start the fast heating mode to prevent cold start damage to the circuit board components; dynamically analyze the temperature difference before and after through a neural network, and intelligently adjust the PWM duty cycle to achieve precise temperature control, avoiding the overshoot problem of the traditional PID algorithm; and the temperature review mechanism with multiple time windows (such as 10 / 30 / 50 second step detection) can not only ensure that the temperature stably enters the safe range (such as the third temperature range), but also prevent energy consumption waste caused by overheating.
[0082] The flowcharts and block diagrams in the accompanying drawings illustrate the possible architectures, functions, and operations of systems, methods, and computer program products according to various embodiments of the present invention. In this regard, each block in the flowchart or block diagram may represent a module, a segment of a program, or a part of code that contains one or more executable instructions for implementing a specified logical function. It should also be noted that in some alternative implementations, the functions marked in the blocks may occur in a different order than that marked in the accompanying drawings. For example, two consecutive blocks shown may actually be executed substantially in parallel, and they may sometimes be executed in the reverse order, depending on the functions involved. It should also be noted that each block in the block diagram or flowchart, as well as combinations of blocks in the block diagram or flowchart, can be implemented by a dedicated hardware-based system for performing the specified functions or operations, or can be implemented by a combination of dedicated hardware and computer instructions.
[0083] It should be noted that although several modules or units of devices for action execution are mentioned in the above detailed description, such a division is not mandatory. In fact, according to the embodiments of the present invention, the features and functions of the two or more modules or units described above can be embodied in one module or unit. Conversely, the features and functions of one module or unit described above can be further divided and embodied by multiple modules or units.
[0084] From the description of the above embodiments, those skilled in the art can easily understand that the example embodiments described herein can be implemented by software, or by a combination of software and necessary hardware. Therefore, the technical solutions according to the embodiments of the present invention can be embodied in the form of a software product, which can be stored in a non-volatile storage medium (such as a CD-ROM, a USB flash drive, a mobile hard disk, etc.) or on a network, including several instructions to enable a computing device (such as a personal computer, a server, a touch terminal, or a network device, etc.) to execute the methods according to the embodiments of the present invention.
[0085] In the several embodiments provided in this application, it should be understood that the disclosed systems, modules, and methods can be implemented in other ways. For example, the module embodiments described above are merely illustrative. For example, the division of units is only a logical function division, and there may be other division methods in actual implementation. For example, multiple units or components can be combined or integrated into another system, or some features can be ignored or not executed. Another point is that the couplings, direct couplings, or communication connections shown or discussed among each other can be through some interfaces, indirect couplings or communication connections of modules or units, and can be in electrical, mechanical, or other forms.
[0086] The above embodiments are only used to illustrate the technical solutions of the present application, rather than limiting it. The present application is not limited to the exact structures described above and illustrated in the drawings, and it cannot be determined that the specific implementation of the present application is only limited to these descriptions. For those of ordinary skill in the technical field to which the present application belongs, without departing from the concept of the present application, various changes and deformations made should be regarded as falling within the protection scope of the present application.
Claims
1. A temperature control method based on a pressure transmitter, characterized in that, The method includes: Collecting the first temperature in real time through a temperature sensor. When the first temperature is less than the first preset temperature, the controller starts the heating mechanism to heat the circuit board. After the first preset time, collecting the second temperature in real time through the temperature sensor. When the difference between the second temperature and the first temperature is less than or equal to the preset difference, the controller implements an intelligent power adjustment scheme. After the second preset time, collecting the third temperature in real time through the temperature sensor. When the third temperature is not within the third temperature range, the controller controls the heating mechanism to continue adjusting the heating power, and continues to collect the temperature after the third preset time of adjusting the heating power until the collected temperature is within the third temperature range. Wherein, a pressure sensor and a circuit board connected to the pressure sensor are arranged in the cavity of the pressure transmitter. A temperature sensor and a controller are arranged on the circuit board, and the heating mechanism is attached to the back of the circuit board.
2. The temperature control method based on a pressure transmitter according to claim 1, wherein When the difference between the second temperature and the first temperature is less than or equal to the preset difference, and the controller implements an intelligent power adjustment scheme, it further includes: Training a neural network model with historical data, where the historical data includes pressure, temperature, heating film power, and the trend of temperature changing with time. The controller inputs the difference into the neural network model, and the neural network model predicts the temperature change situation in the cavity within the future preset time, and generates an intelligent power adjustment scheme according to the temperature change situation. When the difference between the second temperature and the first temperature is less than or equal to the preset difference, the controller implements the intelligent power adjustment scheme, and the intelligent power adjustment scheme includes the heating start time, heating duration, and heating power of the heating mechanism.
3. The temperature control method based on a pressure transmitter according to claim 1, wherein When the controller controls the heating mechanism to continue adjusting the heating power, it further includes: According to the error range between the third temperature and the third temperature range, dynamically calculating the control quantity of the controller through the neural network model, where the control quantity includes a proportional coefficient, an integral coefficient, and a differential coefficient. The PWM signal transmitter maps the control quantity to a PWM duty cycle. Adjusting the heating power of the heating mechanism according to the PWM duty cycle.
4. The temperature control method based on a pressure transmitter according to claim 1, characterized in that The controller further includes a startup preheating controller; after collecting the first temperature in real time through the temperature sensor, the method further includes: When the first temperature is less than the first preset temperature, the startup preheating controller controls the heating mechanism to heat. When the working temperature of the controller reaches the first preset temperature, the startup preheating controller is turned off.
5. The temperature control method based on a pressure transmitter according to claim 1, characterized in that, The method further includes: when the third temperature is within the third temperature range, the controller turns off the heating mechanism.