Storage module and server

Abstract

The invention discloses a storage module and a server, and relates to the technical field of storage modules, the storage module comprises a liquid cooling plate, a back plate, a storage unit and a connector; a first through hole is formed in the liquid cooling plate; the back plate is arranged on one side of the liquid cooling plate in the first direction; the storage unit is arranged on the other side of the liquid cooling plate along the first direction; one end of the connector is connected with the backboard, and the other end of the connector penetrates through the first through hole and is inserted into the storage unit; and the heat conduction element is arranged on the other side of the liquid cooling plate along the first direction, is in heat exchange contact with the heating surface of the storage unit and is in heat exchange contact with the liquid cooling plate. The technical problem that the heat exchange area between the hard disk of the storage module and the liquid cooling plate is limited is solved, and the technical effects of increasing the heat exchange area and improving the heat exchange effect are achieved.

Description

Technical Field

[0001] This application relates to the technical field of storage modules, and particularly to storage modules and servers. Background Art

[0002] In recent years, with the sharp increase in the computing power of servers, the heat generation of storage modules has also rapidly increased with the increase in the hard disk capacity and throughput of storage modules. Generally, traditional heat dissipation means for storage modules include air-cooled heat dissipation and liquid-cooled heat dissipation.

[0003] Air-cooled heat dissipation relies on air for convective heat dissipation. This heat dissipation method has problems such as increased power consumption and increased noise. In particular, the airflow vibration caused by the rotation of the fan will also affect the hard disk to a certain extent, which is likely to affect the performance and lifespan of the hard disk. To suppress the influence of fan vibration, it is necessary to increase the distance between the fan and the storage module, and this method is likely to cause difficulties in the design of the entire server system.

[0004] As an effective means to reduce carbon emissions, liquid-cooled heat dissipation can not only reduce the PUE value of the whole machine (an indicator for evaluating the energy efficiency of a data center), but also reduce the power consumption of the server room. Moreover, with the decrease in temperature, it can also extend the service life of the product to a certain extent and improve reliability.

[0005] In some related technologies, in the chassis of a server, a method of directly attaching the storage module to the liquid-cooled plate of the server is adopted to achieve liquid-cooled heat dissipation. However, in order to ensure the hot-swap reliability of the hard disk of the storage module and the hard disk backplane, the hard disk backplane usually needs to be arranged between the hard disk and the liquid-cooled plate. In this way, it is necessary to open a heat dissipation window on the hard disk backplane, and the heat of the hard disk is exchanged with the liquid-cooled plate at the heat dissipation window through a heat conduction element. However, due to the limitation of the heat dissipation window, the contact area between the heat conduction element and the liquid-cooled plate is greatly limited, and the heat conduction and heat exchange effects are poor. Summary of the Invention

[0006] This application provides a storage module and a server to at least solve the problem in related technologies that the heat exchange area between the hard disk of the storage module and the liquid-cooled plate is limited, resulting in poor heat conduction and heat exchange effects.

[0007] This application provides a storage module, including a liquid-cooled plate, a backplane, a storage unit, and a connector; a first through hole is provided on the liquid-cooled plate; the backplane is arranged on one side of the liquid-cooled plate along a first direction; the storage unit is arranged on the other side of the liquid-cooled plate along the first direction; one end of the connector is connected to the backplane, and the other end of the connector passes through the first through hole and is plugged into the storage unit; the heat conduction element is arranged on the other side of the liquid-cooled plate along the first direction, the heat conduction element is in heat exchange contact with the heat generating surface of the storage unit, and the heat conduction element is in heat exchange contact with the liquid-cooled plate.

[0008] The present application also provides a server, including the above-mentioned storage module.

[0009] With the present application, due to the provision of the first through holes on the liquid cooling plate and the customized extension of the connector in the first direction, the distance between the storage unit and the backplane in the first direction is increased, facilitating the placement of the liquid cooling plate between the storage unit and the backplane. The heat conducting element can directly exchange heat with the storage unit and directly exchange heat with the liquid cooling plate, and the heat exchange contact area between the heat conducting element and the liquid cooling plate is no longer affected by the position and size of the heat dissipation window. The heat exchange contact area between the heat conducting element, the liquid cooling plate, and the storage unit can be selected according to actual needs, thereby increasing the heat exchange contact area between the storage unit and the liquid cooling plate, further increasing the overall heat exchange area of the storage module, achieving better heat conduction and heat exchange effects, and enhancing the liquid cooling and heat dissipation capacity of the storage module. At the same time, through the first through holes, the connector can facilitate the connection between the storage unit and the backplane, ensuring the hot pluggability reliability between the storage unit and the backplane, and can also limit and fix the position of the storage unit, ensuring the heat exchange contact stability between the storage unit and the liquid cooling plate. BRIEF DESCRIPTION OF THE DRAWINGS

[0010] To more clearly illustrate the embodiments of the present application, the drawings required for use in the embodiments will be briefly introduced below. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0011] Figure 1 Schematic diagram of a perspective view of a storage module provided by an embodiment of the present application;

[0012] Figure 2 Schematic diagram of another perspective view of a storage module provided by an embodiment of the present application;

[0013] Figure 3 Schematic diagram of the backplane of a storage module provided by an embodiment of the present application;

[0014] Figure 4 Schematic diagram of the liquid cooling plate of a storage module provided by an embodiment of the present application;

[0015] Figure 5 Schematic diagram of a perspective view of a heat conducting element of a storage module provided by an embodiment of the present application;

[0016] Figure 6 Schematic diagram of another perspective view of a heat conducting element of a storage module provided by an embodiment of the present application;

[0017] Figure 7Schematic diagram of a connector for a storage module provided by an embodiment of the present application.

[0018] Among them, the above-mentioned drawings include the following reference numerals:

[0019] 1. Liquid cooling plate; 11. First through hole; 2. Backplane; 3. Storage unit; 4. Connector; 5. Heat conducting element; 51. Avoidance hole; 52. First heat conducting part; 53. Second heat conducting part; 6. First heat conducting gasket; 7. Second heat conducting gasket; 71. Third through hole; 8. Storage unit bracket. Detailed implementation manners

[0020] Next, the technical solutions in the embodiments of the present application will be clearly and completely described in conjunction with the drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present application.

[0021] It should be noted that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "lateral", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation to the present application. The terms "mounted", "connected", and "coupled" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be directly connected or indirectly connected through an intermediate medium, and it can be the communication inside two elements. The terms "parallel", "perpendicular", and "equal" include the described situations and situations similar to the described situations, and the range of the similar situations is within an acceptable deviation range, where the acceptable deviation range is determined by those of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallel and approximate parallel, and the acceptable deviation range of approximate parallel can be, for example, within 5° deviation; "perpendicular" includes absolute perpendicular and approximate perpendicular, and the acceptable deviation range of approximate perpendicular can also be, for example, within 5° deviation. "Equal" includes absolute equality and approximate equality, and the acceptable deviation range of approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one. For those of ordinary skill in the art, the specific meanings of the above terms in the present application can be understood according to specific situations.

[0022] In order to enable those skilled in the art of the present technology to better understand the solution of the present application, the present application will be further described in detail below with reference to the drawings and specific embodiments.

[0023] An embodiment of the present application provides a storage module, as Figures 1 to 7 shown, including a liquid cooling plate 1, a backplane 2, a storage unit 3, and a connector 4; a first through hole 11 is provided on the liquid cooling plate 1; the backplane 2 is arranged on one side of the liquid cooling plate 1 along a first direction; the storage unit 3 is arranged on the other side of the liquid cooling plate 1 along the first direction; one end of the connector 4 is connected to the backplane 2, and the other end of the connector 4 passes through the first through hole 11 and is plugged into the storage unit 3; a heat conduction element 5 is arranged on the other side of the liquid cooling plate 1 along the first direction, the heat conduction element 5 is in heat exchange contact with the heat generating surface of the storage unit 3, and the heat conduction element 5 is in heat exchange contact with the liquid cooling plate 1.

[0024] Through the provision of the first through holes 11 on the liquid cooling plate 1 and by customizing and extending the connector 4 in the first direction, the spacing between the storage unit 3 and the backplane 2 in the first direction is increased, facilitating the placement of the liquid cooling plate 1 between the storage unit 3 and the backplane 2. The heat conducting element 5 can be in direct heat exchange contact with both the storage unit 3 and the liquid cooling plate 1. Moreover, the heat exchange contact area between the heat conducting element 5 and the liquid cooling plate 1 is no longer affected by the position and size of the heat dissipation window. The heat exchange contact area between the heat conducting element 5, the liquid cooling plate 1, and the storage unit 3 can be selected according to actual needs, thereby increasing the heat exchange contact area between the storage unit 3 and the liquid cooling plate 1. Furthermore, the overall heat exchange area of the storage module is increased, resulting in better heat conduction and heat exchange effects and enhancing the liquid cooling and heat dissipation capacity of the storage module. At the same time, through the first through holes 11, the connector 4 not only facilitates the connection between the storage unit 3 and the backplane 2, ensuring the hot pluggability reliability between the storage unit 3 and the backplane 2, but also can limit and fix the position of the storage unit 3, guaranteeing the heat exchange contact stability between the storage unit 3 and the liquid cooling plate 1.

[0025] Moreover, in some related technologies, to ensure the hot pluggability reliability between the hard disk of the storage module and the hard disk backplane, the hard disk backplane usually needs to be arranged between the hard disk and the liquid cooling plate 1. In this case, heat dissipation windows need to be opened on the hard disk backplane, and the heat of the hard disk is exchanged with the liquid cooling plate 1 through the heat conducting element 5 at the heat dissipation windows. Protruding structures that can extend into the heat dissipation windows need to be provided on the heat conducting element 5 and / or the liquid cooling plate 1 to achieve the heat exchange contact between the heat conducting element 5 and the liquid cooling plate 1. Therefore, due to the constraints of the heat dissipation windows, the layout designs of the hard disk backplane, the heat conducting element 5, and the liquid cooling plate 1 interfere with and restrict each other, making it difficult to design the layout of the hard disk backplane, the heat conducting element 5, and the liquid cooling plate 1. In this embodiment, through the provision of the first through holes 11, only by customizing and extending the connector 4 can the hot pluggability between the storage unit 3 and the backplane 2 be achieved. At the same time, there is no longer a backplane 2 between the heat conducting element 5 and the liquid cooling plate 1, and they can be in direct heat exchange contact to achieve a large area of heat exchange between the heat conducting element 5 and the liquid cooling plate 1. The heat conducting element 5 can also be in heat exchange contact with the heat generating surface of the storage unit 3. Thus, a large area of heat exchange between the storage unit 3 and the liquid cooling plate 1 can be achieved, and the layout designs of the backplane 2, the heat conducting element 5, and the liquid cooling plate 1 no longer interfere with and restrict each other, solving the problem of difficult layout design of the storage unit 3, the backplane 2, the heat conducting element 5, and the liquid cooling plate 1.

[0026] In this embodiment, the storage unit 3 can be a hard disk. The storage unit 3 can be detachably and hot-pluggably connected to one end of the connector 4 facing away from the backplane 2. The first direction in this embodiment is the hot-plugging direction of the storage unit 3. The heating surface of the storage unit 3 generally refers to the surface close to the internal heat-generating electronic components of the storage unit 3. The heating surface can be a surface arranged at an angle with the liquid cooling plate 1. In a preferred embodiment, the heating surface is a surface perpendicular to the liquid cooling plate 1.

[0027] Specifically, in one embodiment, the first surface of the storage unit 3 facing the liquid cooling plate 1 can be in direct contact with the liquid cooling plate 1 for heat exchange.

[0028] Specifically, in another embodiment, a heat conducting element 5 can be arranged between the first surface of the storage unit 3 facing the liquid cooling plate 1 and the liquid cooling plate 1, and indirect contact heat exchange can be realized through the heat conducting element 5.

[0029] In a further embodiment, the connector 4 itself does not need to be improved too much. Only in the connection direction of the connector 4 with the storage unit 3 and the backplane 2, that is, in the first direction, the connector 4 can be appropriately extended. The extended distance of the connector 4 can be appropriately adjusted according to the thickness of the liquid cooling plate 1 to ensure that after the storage unit 3 is plugged into the connector 4, the storage unit 3 can be in direct contact heat exchange or indirect contact heat exchange with the liquid cooling plate 1, and the storage unit 3 can also be limited and fixed.

[0030] Specifically, in the embodiment, the extended distance of the connector 4 in the first direction is between 5 mm and 10 mm. In a preferred embodiment, the extended distance of the connector 4 in the first direction is 5 mm. In another preferred embodiment, the extended distance of the connector 4 in the first direction is 10 mm. In a preferred embodiment, the extended distance of the connector 4 in the first direction is 7.5 mm.

[0031] Specifically, in the embodiment, the surface of the liquid cooling plate 1 facing the storage unit 3 is a large liquid cooling surface. The shape of the large liquid cooling surface matches the shape of the heat conducting element 5 and / or the storage unit 3 to realize surface contact heat exchange. Among them, the large liquid cooling surface is the largest outer surface of the liquid cooling plate 1. The first through hole 11 penetrates the large liquid cooling surface and the outer surface arranged relative to the large liquid cooling surface. In a preferred embodiment, the liquid cooling plate 1 can be the system liquid cooling plate 1 of the server, which not only performs liquid cooling for the storage module, but also performs liquid cooling for other electronic components in the server. Or, in another preferred embodiment, the liquid cooling plate 1 can also be the liquid cooling plate 1 of the storage module, which only provides liquid cooling for the storage module.

[0032] In a further embodiment, the liquid cooling plate 1 includes a liquid cooling cavity, a liquid inlet, and a liquid outlet. The liquid cooling cavity is used to contain a coolant. Both the liquid inlet and the liquid outlet are in communication with the liquid cooling cavity. The coolant enters the liquid cooling cavity through the liquid inlet, exchanges heat with the storage unit 3 of the storage module in the liquid cooling cavity, and then is discharged through the liquid outlet. Here, the shape, size, and the flow path of the coolant in the liquid cooling cavity are not specifically limited, the position and number of the liquid inlets are not specifically limited, and the position and number of the liquid outlets are not specifically limited, which are determined according to the liquid cooling mechanism design inside the server. A liquid inlet quick-release connector is connected to the liquid inlet. The liquid inlet quick-release connector is convenient for quick connection and disconnection with the liquid inlet pipe and is also convenient for quick connection and disconnection with the liquid inlet on the liquid cooling plate 1. A liquid outlet quick-release connector is connected to the liquid outlet. The liquid outlet quick-release connector is convenient for quick connection and disconnection with the liquid outlet pipe and is also convenient for quick connection and disconnection with the liquid outlet on the liquid cooling plate 1.

[0033] The heat exchange contact mentioned in this embodiment includes both direct abutting contact between two structures that need to exchange heat and indirect contact between two structures that need to exchange heat through a heat conducting structure.

[0034] The heat exchange process of this embodiment includes: the heat generated by the storage unit 3 is exchanged with the heat conducting element 5 through the heating surface, and then exchanged to the liquid cooling plate 1 through the heat conducting element 5. The heat is finally carried away by the flow of the coolant in the liquid cooling plate 1, realizing liquid cooling and heat dissipation of the storage unit 3.

[0035] In one embodiment, as Figures 1 to 2 shown, at least part of the heat conducting element 5 is disposed between the liquid cooling plate 1 and the storage unit 3. This part of the heat conducting element 5 exchanges heat with the liquid cooling plate 1, and this part of the heat conducting element 5 exchanges heat with the storage unit 3. An avoidance hole 51 is provided on the heat conducting element 5. The avoidance hole 51 is correspondingly arranged with the first through hole 11. The connector 4 sequentially passes through the first through hole 11 and the avoidance hole 51 and is inserted into the storage unit 3.

[0036] At least part of the heat-conducting element 5 is arranged between the liquid-cooling plate 1 and the storage unit 3, which can not only conduct heat quickly and evenly between the liquid-cooling plate 1 and the storage unit 3, but also provide a certain degree of protection for the storage unit 3 and the liquid-cooling plate 1. Moreover, since at least part of the heat-conducting element 5 is arranged between the liquid-cooling plate 1 and the storage unit 3, the heat-exchange contact area between the storage unit 3 and the heat-conducting element 5 is increased to: the heating surface plus the surface facing the liquid-cooling plate 1, and the heat-exchange contact area between the heat-conducting element 5 and the liquid-cooling plate 1 is also increased to: the area of the surface of the storage unit 3 facing the liquid-cooling plate 1 plus the area of the surface of the heat-conducting element 5 opposite to the liquid-cooling plate 1, further increasing the heat-exchange contact area between the storage unit 3 and the liquid-cooling plate 1, thereby increasing the overall heat-exchange area, making the heat-exchange area between the storage unit 3 and the liquid-cooling plate 1 no longer restricted, with good heat conduction and heat-exchange effects, and improving the liquid-cooling heat dissipation capacity of the storage module. At the same time, the connector 4 can facilitate the connection between the storage unit 3 and the backplane 2 through the first through-hole 11 and the avoidance hole 51, ensuring the hot-swap reliability between the storage unit 3 and the backplane 2, and can also limit and fix the positions of the storage unit 3 and the heat-conducting element 5, ensuring the heat-exchange contact stability among the storage unit 3, the heat-conducting element 5 and the liquid-cooling plate 1.

[0037] Moreover, in some related technologies, in order to ensure the hot-swap reliability between the hard disk of the storage module and the hard disk backplane, the hard disk backplane usually needs to be arranged between the hard disk and the liquid-cooling plate 1. In this case, it is necessary to open a heat dissipation window on the hard disk backplane, and the heat of the hard disk is exchanged with the liquid-cooling plate 1 at the heat dissipation window through the heat-conducting element 5. Protruding structures that can extend into the heat dissipation window need to be arranged on the heat-conducting element 5 and / or the liquid-cooling plate 1 to achieve the heat-exchange contact between the heat-conducting element 5 and the liquid-cooling plate 1. Therefore, due to the restriction of the heat dissipation window, the layout designs of the hard disk backplane, the heat-conducting element 5 and the liquid-cooling plate 1 interfere with each other and restrict each other, making the layout design of the hard disk backplane, the heat-conducting element 5 and the liquid-cooling plate 1 difficult. In this embodiment, through the setting of the first through-hole 11 on the liquid-cooling plate 1 and the avoidance hole 51 on the heat-conducting element 5, only by customizing and extending the connector 4, while realizing the hot-swap between the storage unit 3 and the backplane 2, a large-area heat exchange between the storage unit 3 and the liquid-cooling plate 1 can be achieved, so that the layout designs of the backplane 2, the heat-conducting element 5 and the liquid-cooling plate 1 no longer interfere with each other, solving the problem of difficult layout design of the storage unit 3, the heat-conducting element 5, the backplane 2 and the liquid-cooling plate 1.

[0038] In some other related technologies, the liquid cooling plate 1 is arranged on the side of the storage unit 3 in the hot plugging direction, and heat exchange is performed by frictional contact between the side of the storage unit 3 and the liquid cooling plate 1 on its side. A heat conducting sheet is arranged between the storage unit 3 and the storage unit 3 on its side, and friction is generated on the heat conducting sheet on its side during the insertion of the storage unit 3. However, due to the tolerance, the heat exchange contact effect between the storage unit 3 and the liquid cooling plate 1 on its side is not easy to control, the life reliability of the heat conducting sheet is poor, the heat dissipation efficiency cannot be guaranteed, and it is difficult to use on a large scale. In this embodiment, the liquid cooling plate 1 is located between the storage unit 3 and the back plate 2 in the hot plugging direction of the storage unit 3. During the hot plugging process of the storage unit 3, there is no relative movement between the storage unit 3 and the heat conducting element 5, and the two always maintain a large heat exchange contact area. After the storage unit 3 is successfully hot plugged, the heat conducting element 5 directly contacts the liquid cooling plate 1 for heat exchange, and a large heat exchange contact area can be maintained. The life reliability of the heat conducting element 5 is high, the heat dissipation efficiency is high, and it is suitable for large-scale use.

[0039] In a specific embodiment, the heat-conducting element 5 can be a heat-conducting shell, and a heat pipe is provided on the heat-conducting shell. The heat pipe transfers heat by evaporation and condensation of liquid in a fully enclosed vacuum tube. It uses fluid principles such as capillary action to achieve a refrigeration effect similar to that of a refrigerator compressor. Heat pipes have a series of advantages such as high thermal conductivity, excellent isothermal properties, variability of heat flux density, reversibility of heat flow direction, long-distance heat transfer, constant temperature characteristics (controllable heat pipes), thermal diodes and thermal switch performance. Through the provision of the heat pipe, the heat-conducting element 5 has a good heat-conducting effect; through the provision of the heat-conducting shell, the heat pipe can also be fixed and protected. In a preferred embodiment, the heat-conducting shell can be made of a heat-conducting metal. The heat pipe can be arranged inside the heat-conducting shell, or it can be embedded in the heat-conducting shell.

[0040] In another specific embodiment, the heat conducting element 5 may also be a plate-shaped structure made of a heat conducting metal. In a specific embodiment, the heat conducting element 5 may be a plate-shaped structure made of copper, and in other embodiments, the heat conducting element 5 may also be a plate-shaped structure made of aluminum. The material of the heat conducting element 5 can be any material as long as it meets the actual requirements, and is not limited here.

[0041] In one embodiment, the surface of the storage unit 3 facing the liquid cooling plate 1 is the first surface, and the surface of the storage unit 3 connected to the first surface is the second surface; Figure 1 , Figure 2 and Figure 5As shown, the heat-conducting element 5 includes a first heat-conducting portion 52 and a second heat-conducting portion 53; the first heat-conducting portion 52 is disposed between the storage unit 3 and the liquid-cooling plate 1. An avoidance hole 51 is provided on the first heat-conducting portion 52. The first heat-conducting portion 52 is in heat-exchange contact with the storage unit 3 and the liquid-cooling plate 1; the second heat-conducting portion 53 is heat-exchange connected to the first heat-conducting portion 52, and the second heat-conducting portion 53 is in heat-exchange contact with at least one second surface of the storage unit 3, the second heat-conducting portion 53 is in heat-exchange contact with the heat-generating surface, and the second heat-conducting portion 53 is in heat-exchange contact with the liquid-cooling plate 1.

[0042] Through the arrangement of the first heat-conducting portion 52 and the second heat-conducting portion 53, heat can be quickly and evenly conducted between the liquid-cooling plate 1 and the storage unit 3, and the storage unit 3 and the liquid-cooling plate 1 can be protected to a certain extent. While ensuring the heat-exchange contact between the heat-conducting element 5 and the heat-generating surface, the stability of the heat-conducting element 5 is increased; at the same time, the first heat-conducting portion 52 and the second heat-conducting portion 53 can conduct heat out from the first surface and the second surface, greatly increasing the heat-exchange area of the storage unit 3. Moreover, both the first heat-conducting portion 52 and the second heat-conducting portion 53 can be in heat-exchange contact with the liquid-cooling plate 1, which also ensures the heat-exchange speed between the heat-conducting element 5 and the liquid-cooling plate 1, increases the heat-exchange area between the heat-conducting element 5 and the liquid-cooling plate 1, so that the heat-exchange area between the storage unit 3 and the liquid-cooling plate 1 is no longer limited, and the heat conduction and heat-exchange effects are good, improving the liquid-cooling heat dissipation capacity of the storage module; at the same time, through the first through-hole 11 and the avoidance hole 51, the connector 4 can not only facilitate the connection between the storage unit 3 and the backplane 2, ensure the hot-plug reliability between the storage unit 3 and the backplane 2, but also limit and fix the position of the storage unit 3 to ensure the stability of the heat-exchange contact between the storage unit 3 and the liquid-cooling plate 1.

[0043] As Figure 1 、 Figure 2 and 5As shown, in this embodiment, the second heat conduction part 53 is disposed on the top of the storage unit 3, that is, the second surface at the top of the storage unit 3. The second surface at the top is the heat generating surface. The second heat conduction part 53 is a plate-like structure matching the shape of the top of the storage unit 3. The projected area of the second heat conduction part 53 on the storage unit 3 is the same as the surface area of the top of the storage unit 3, or the projected area of the second heat conduction part 53 on the storage unit 3 is larger than the surface area of the top of the storage unit 3; preferably, the projected area of the second heat conduction part 53 on the storage unit 3 is the same as the surface area of the top of the storage unit 3. The first heat conduction part 52 is a plate-like structure matching the shape of the first surface of the storage unit 3. The first heat conduction part 52 and the second heat conduction part 53 are connected to form an L-shaped structure. This structure is simple and easy to form, and is also relatively easy to position and connect when disposed on the top of the storage unit 3, and is not likely to fall, move or be misaligned. As a transformable embodiment, it may also be that the heat generating surface is also the second surface disposed at the bottom of the storage unit 3. As a transformable embodiment, it may also be that the heat generating surface is also the second surface disposed on the side of the storage unit 3. In the preferred embodiment of this embodiment, the heat generating surface is the second surface disposed on the top of the storage unit 3. The storage unit 3 can support and limit the heat conduction element 5 to a certain extent through the second heat conduction part 53, further enhancing the stability of the heat conduction element 5 and reducing the difficulty of installation and disassembly of the heat conduction element 5.

[0044] In this embodiment, the second heat conduction part 53 can completely cover the second surface of the storage unit 3, or can cover a part of the second surface. When the second heat conduction part 53 covers a part of the second surface, the second heat conduction part 53 can be correspondingly disposed with the electronic components that are likely to generate heat inside the storage unit 3 to better conduct heat.

[0045] In a further embodiment, the thickness of the first heat conduction part 52 is less than the thickness of the second heat conduction part 53. The second heat conduction part 53 can conduct more heat, and a part of the heat conducted by the second heat conduction part 53 can be directly exchanged through heat exchange contact with the liquid cooling plate 1; another part of the heat conducted by the second heat conduction part 53 can be first transferred to the first heat conduction part 52 and indirectly exchanged through heat exchange contact with the liquid cooling plate 1 through the first heat conduction part 52; other parts of the heat conducted by the second heat conduction part 53 can be directly dissipated into the air inside the server chassis. And because the thickness of the first heat conduction part 52 is less than the thickness of the second heat conduction part 53, the first heat conduction part 52 can exchange heat with the liquid cooling plate 1 faster, increasing the heat exchange speed and improving the heat exchange effect.

[0046] As a transformable embodiment, it is also possible that the thickness of the first heat conducting part 52 is the same as that of the second heat conducting part 53 to obtain a more uniform heat conduction effect. A part of the heat conducted out by the second heat conducting part 53 can be directly exchanged with the liquid cooling plate 1 through heat exchange contact; another part of the heat conducted out by the second heat conducting part 53 can be first transferred to the first heat conducting part 52, and indirectly exchanged through the heat exchange contact between the first heat conducting part 52 and the liquid cooling plate 1; other parts of the heat conducted out by the second heat conducting part 53 can be directly dissipated into the air inside the server chassis.

[0047] In this embodiment, no excessive limitation is imposed on the thickness of the first heat conducting part 52, and the thickness of the first heat conducting part 52 can be reasonably set according to the thickness of the liquid cooling plate 1 and the length of the connector 4 in the first direction.

[0048] In this embodiment, no excessive limitation is imposed on the thickness of the second heat conducting part 53, and the thickness of the second heat conducting part 53 can be reasonably configured according to the height of the storage unit 3, as long as the second heat conducting part 53 has a good heat conduction effect and does not occupy too much space inside the server chassis.

[0049] In one embodiment, as Figure 1 、 Figure 2 and Figure 5 shown, the first heat conducting part 52 is in a plate-like structure, and the avoidance hole 51 is a second through hole penetrating the first heat conducting part 52.

[0050] The avoidance hole 51 is set as a second through hole penetrating the first heat conducting part 52, which can reduce the space occupied by the avoidance hole 51, increase the heat exchange contact area between the first heat conducting part 52 and the storage unit 3, and also increase the heat exchange contact area between the first heat conducting part 52 and the liquid cooling plate 1.

[0051] As a transformable embodiment, it is also possible that the first heat conducting part 52 is in a plate-like structure, and the avoidance hole 51 is an avoidance groove opened from the edge of the first heat conducting part 52 inward, and the avoidance groove penetrates the first heat conducting part 52 in the first direction. Through the avoidance groove, the positioning and fixing method between the heat conducting element 5 and the storage unit 3 can be increased, facilitating the positioning and fixing between the heat conducting element 5 and the storage unit 3.

[0052] As a transformable embodiment, it is also possible that the first heat conducting part 52 is formed by splicing at least two plate-like structures, and the avoidance hole 51 is surrounded by at least two plate-like structures.

[0053] In one embodiment, as Figure 1 shown, the storage module further includes a first heat conducting gasket 6, and the first heat conducting gasket 6 is arranged between the heat conducting element 5 and the storage unit 3. The first heat conducting gasket 6 is in contact with the heat conducting element 5 for heat exchange and in contact with the storage unit 3 for heat exchange.

[0054] The abutment of the first heat-conducting gasket 6 with the heat-conducting element 5 and the abutment of the first heat-conducting gasket 6 with the storage unit 3 can not only achieve heat transfer between the storage unit 3 and the heat-conducting element 5 through the first heat-conducting gasket 6, but also achieve buffering between the storage unit 3 and the heat-conducting element 5 through the first heat-conducting gasket 6, protecting both the storage unit 3 and the heat-conducting element 5.

[0055] In a specific embodiment, as Figure 1 shown, the first heat-conducting gasket 6 is disposed between the second heat-conducting portion 53 and the heat-generating surface of the storage unit 3. The first heat-conducting gasket 6 abuts against the storage unit 3, and the first heat-conducting gasket 6 abuts against the second heat-conducting portion 53. It can not only achieve heat transfer between the storage unit 3 and the second heat-conducting portion 53 through the first heat-conducting gasket 6, but also achieve buffering between the storage unit 3 and the second heat-conducting portion 53 through the first heat-conducting gasket 6, protecting both the storage unit 3 and the second heat-conducting portion 53.

[0056] In another specific embodiment, the first heat-conducting gasket 6 includes a first gasket portion and a second gasket portion. The first gasket portion is disposed between the heat-generating surface of the storage unit 3 and the second heat-conducting portion 53, and the first gasket portion abuts against the storage unit 3 and the second heat-conducting portion 53. It can not only achieve heat transfer between the storage unit 3 and the second heat-conducting portion 53 through the first gasket portion, but also achieve buffering between the storage unit 3 and the second heat-conducting portion 53 through the first gasket portion, protecting both the storage unit 3 and the second heat-conducting portion 53. The second gasket portion is disposed between the storage unit 3 and the first heat-conducting portion 52, and the second gasket portion abuts against the first heat-conducting portion 52 and the storage unit 3. It can not only achieve heat transfer between the storage unit 3 and the first heat-conducting portion 52 through the second gasket portion, but also achieve buffering between the storage unit 3 and the first heat-conducting portion 52 through the second gasket portion.

[0057] In still another specific embodiment, the first heat-conducting gasket 6 is disposed between the storage unit 3 and the first heat-conducting portion 52, and the first heat-conducting gasket 6 abuts against the first heat-conducting portion 52 and the storage unit 3. It can not only achieve heat transfer between the storage unit 3 and the first heat-conducting portion 52 through the first heat-conducting gasket 6, but also achieve buffering between the storage unit 3 and the first heat-conducting portion 52 through the first heat-conducting gasket 6.

[0058] In a further embodiment, the first heat-conducting gasket 6 is adhesively fixed to the heat-conducting element 5.

[0059] In another further embodiment, the first heat-conducting gasket 6 is adhesively fixed to the storage unit 3.

[0060] In still another further embodiment, the first heat-conducting gasket 6 is adhesively fixed to the heat-conducting element 5, and the first heat-conducting gasket 6 is also adhesively fixed to the storage unit 3.

[0061] In one embodiment, as Figure 1 and Figure 2 shown, the storage module further includes a second heat conductive gasket 7, and the second heat conductive gasket 7 is disposed between the heat conductive element 5 and the liquid cooling plate 1. The second heat conductive gasket 7 is in contact with the heat conductive element 5 for heat exchange, and the second heat conductive gasket 7 is in contact with the liquid cooling plate 1 for heat exchange.

[0062] The second heat conductive gasket 7 is in contact with the heat conductive element 5 for heat exchange, and the second heat conductive gasket 7 is in contact with the liquid cooling plate 1 for heat exchange. This can not only achieve heat transfer between the heat conductive element 5 and the liquid cooling plate 1 through the second heat conductive gasket 7, but also achieve buffering between the liquid cooling plate 1 and the heat conductive element 5 through the second heat conductive gasket 7, protecting both the liquid cooling plate 1 and the heat conductive element 5.

[0063] In a further embodiment, the second heat conductive gasket 7 is adhesively fixed to the heat conductive element 5.

[0064] In another further embodiment, the second heat conductive gasket 7 is adhesively fixed to the liquid cooling plate 1.

[0065] In yet another further embodiment, the second heat conductive gasket 7 is adhesively fixed to the heat conductive element 5, and the second heat conductive gasket 7 is also adhesively fixed to the liquid cooling plate 1.

[0066] Specifically, in one embodiment, as Figure 1 shown, the first heat conductive gasket 6 is disposed between the second heat conductive portion 53 and the heat generating surface of the storage unit 3. The first heat conductive gasket 6 is in contact with the storage unit 3, and the first heat conductive gasket 6 is in contact with the second heat conductive portion 53; the second heat conductive gasket 7 is disposed between the heat conductive element 5 and the liquid cooling plate 1. The second heat conductive gasket 7 is in contact with the heat conductive element 5 for heat exchange, and the second heat conductive gasket 7 is in contact with the liquid cooling plate 1 for heat exchange.

[0067] Specifically, in another embodiment, the first heat conductive gasket 6 includes a first gasket portion and a second gasket portion. The first gasket portion is disposed between the heat generating surface of the storage unit 3 and the second heat conductive portion 53, and the first gasket portion is in contact with the storage unit 3, and the first gasket portion is in contact with the second heat conductive portion 53. The second gasket portion is disposed between the storage unit 3 and the first heat conductive portion 52, and the second gasket portion is in contact with the first heat conductive portion 52, and the second gasket portion is in contact with the storage unit 3. At this time, the second heat conductive gasket 7 may or may not be provided. When the second heat conductive gasket 7 is provided, the second heat conductive gasket 7 is disposed between the heat conductive element 5 and the liquid cooling plate 1. The second heat conductive gasket 7 is in contact with the heat conductive element 5 for heat exchange, and the second heat conductive gasket 7 is in contact with the liquid cooling plate 1 for heat exchange.

[0068] Specifically, in another embodiment, the first heat-conducting gasket 6 is disposed between the storage unit 3 and the first heat-conducting part 52, and the first heat-conducting gasket 6 is in contact with the first heat-conducting part 52 and the storage unit 3. At this time, the second heat-conducting gasket 7 may or may not be provided. When the second heat-conducting gasket 7 is provided, the second heat-conducting gasket 7 is disposed between the heat-conducting element 5 and the liquid-cooling plate 1, and the second heat-conducting gasket 7 exchanges heat by contacting the heat-conducting element 5 and the liquid-cooling plate 1.

[0069] In one embodiment, as Figure 1 and Figure 2 shown, the second heat-conducting gasket 7 is provided with a third through hole 71, and the connector 4 sequentially passes through the first through hole 11, the third through hole 71 and the second through hole to be plugged into the storage unit 3.

[0070] The setting of the third through hole 71 not only facilitates the passing of the connector 4, so that the connector 4 can sequentially pass through the first through hole 11, the third through hole 71 and the second through hole to be plugged into the storage unit 3, but also can limit and fix the second heat-conducting gasket 7 through the third through hole 71.

[0071] In one embodiment, as Figure 1 and Figure 2 shown, the storage module further includes a storage unit bracket 8, and both the storage unit 3 and the heat-conducting element 5 are connected to the storage unit bracket 8.

[0072] Through the setting of the storage unit bracket 8, the storage unit 3 and the heat-conducting element 5 can be connected as a whole, which not only facilitates the fixing and limiting of the storage unit 3 and the heat-conducting element 5, but also facilitates the hot plugging and disassembly of the storage unit 3 and the heat-conducting element 5 as a whole.

[0073] In a specific embodiment, the storage unit bracket 8 includes a first frame body, a second frame body and a third frame body. The second frame body and the third frame body are respectively connected to both ends of the first frame body, and the second frame body, the first frame body and the third frame body enclose a U-shaped groove-shaped mounting frame; both the storage unit 3 and the heat-conducting element 5 are connected to the first frame body at the end facing away from the liquid-cooling plate 1, and both sides of the storage unit 3 are respectively connected to the second frame body and the third frame body; both sides of the heat-conducting element 5 are respectively connected to the second frame body and the third frame body; the storage unit 3 and the heat-conducting element 5 can slide into the inside of the storage unit bracket 8 through the notch of the storage unit bracket 8 and be connected to the first frame body, the second frame body and the third frame body. The specific connection method may be threaded connection by screws, or riveting by rivets, or snap connection by snaps.

[0074] In one embodiment, as Figure 3As shown in the figure, at least two groups of connectors 4 are connected to the backplane 2 at intervals along the second direction, and each group includes at least two connectors 4 distributed at intervals along the third direction; the liquid cooling plate 1 matches the shape of the backplane 2, and a plurality of first through holes 11 are correspondingly provided on the liquid cooling plate 1, as Figure 4 shown, each connector 4 is correspondingly connected to a storage unit 3, and each storage unit 3 corresponds to a heat conducting element 5; wherein, the first direction, the second direction and the third direction are perpendicular to each other in pairs.

[0075] One backplane 2 can connect at least two groups of storage units 3 at the same time, and one liquid cooling plate 1 can perform liquid cooling and heat dissipation on at least two groups of storage units 3 at the same time, with good integrity, less occupied space, good heat dissipation effect, and saving of components.

[0076] In a related technology, a housing liquid cooling plate 1 is additionally added to the hard disk to conduct the heat of the hard disk to the housing, and then the heat is taken away by the fluid in the flow channel of the housing liquid cooling plate 1. Each hard disk needs to have a separate housing liquid cooling plate 1 and an inlet and outlet liquid quick-release head. The liquid cooling quick-release head is large in volume and high in cost, and will occupy a large amount of space and cost of the server under a large number of hard disk configurations. In this embodiment, as Figure 4 shown, at least two groups of first through holes 11 are provided on the liquid cooling plate 1 at intervals along the second direction, and each group includes at least two first through holes 11 distributed at intervals along the third direction. One liquid cooling plate 1 can perform liquid cooling and heat dissipation on multiple storage units 3 at the same time, with good heat dissipation effect, and can save space, save liquid cooling quick-release heads, and occupy less space inside the server.

[0077] Further, in an embodiment, the number of the second heat conductive gaskets 7 can be matched with the number of the storage units 3, and each storage unit 3 is correspondingly provided with a second heat conductive gasket 7.

[0078] Further, in another embodiment, the second heat conductive gasket 7 matches the shape of the liquid cooling plate 1, and at least two groups of third through holes 71 are provided on the second heat conductive gasket 7 at intervals along the second direction, and each group includes at least two third through holes 71 distributed at intervals along the third direction.

[0079] The embodiment of the present application further provides a server, including the above-mentioned storage module, and the storage module includes a liquid cooling plate 1, a backplane 2, a storage unit 3 and a connector 4; the liquid cooling plate 1 is provided with first through holes 11; the backplane 2 is arranged on one side of the liquid cooling plate 1 along the first direction; the storage unit 3 is arranged on the other side of the liquid cooling plate 1 along the first direction; one end of the connector 4 is connected to the backplane 2, and the other end of the connector 4 passes through the first through hole 11 and is inserted into the storage unit 3; the heat conducting element 5 is arranged on the other side of the liquid cooling plate 1 along the first direction, the heat conducting element 5 is in heat exchange contact with the heat generating surface of the storage unit 3, and the heat conducting element 5 is in heat exchange contact with the liquid cooling plate 1.

[0080] Through the setting of the first through hole 11 on the liquid cooling plate 1 and the customized extension of the connector 4 in the first direction, the spacing between the storage unit 3 and the backplane 2 in the first direction is increased, which facilitates the placement of the liquid cooling plate 1 between the storage unit 3 and the backplane 2. The heat conduction element 5 can not only be in direct heat exchange contact with the storage unit 3, but also be in direct heat exchange contact with the liquid cooling plate 1. Moreover, the heat exchange contact area between the heat conduction element 5 and the liquid cooling plate 1 is no longer affected by the position and size of the heat dissipation window. The heat exchange contact area between the heat conduction element 5 and the liquid cooling plate 1 and the storage unit 3 can be selected according to actual needs, thereby increasing the heat exchange contact area between the storage unit 3 and the liquid cooling plate 1, further increasing the overall heat exchange area of the storage module, with good heat conduction and heat exchange effects, and improving the liquid cooling and heat dissipation capacity of the storage module. At the same time, the connector 4 can not only facilitate the connection between the storage unit 3 and the backplane 2 through the first through hole 11, ensuring the hot plug and unplug reliability between the storage unit 3 and the backplane 2, but also limit and fix the position of the storage unit 3, ensuring the heat exchange contact stability between the storage unit 3 and the liquid cooling plate 1.

[0081] The above has introduced in detail a storage module and a server provided by the present application. Specific examples are used in this article to elaborate on the principle and implementation manner of the present application. The description of the above embodiments is only used to help understand the method and its core idea of the present application. It should be noted that for those of ordinary skill in the art in the technical field, without departing from the principle of the present application, several improvements and modifications can still be made to the present application, and these improvements and modifications also fall within the protection scope of the claims of the present application.

Claims

1. A storage module, characterized in that, Comprising: A liquid cooling plate (1) provided with a first through hole (11); A back plate (2) arranged on one side of the liquid cooling plate (1) along a first direction; A storage unit (3) arranged on the other side of the liquid cooling plate (1) along the first direction; A connector (4) with one end connected to the back plate (2) and the other end passing through the first through hole (11) to be plugged into the storage unit (3); A heat conducting element (5) arranged on the other side of the liquid cooling plate (1) along the first direction, the heat conducting element (5) being in heat exchange contact with the heat generating surface of the storage unit (3) and in heat exchange contact with the liquid cooling plate (1).

2. The storage module according to claim 1, wherein At least part of the heat conducting element (5) is arranged between the liquid cooling plate (1) and the storage unit (3), the heat conducting element (5) being in heat exchange contact with the liquid cooling plate (1) and in heat exchange contact with the storage unit (3); a relief hole (51) is provided on the heat conducting element (5), the relief hole (51) being correspondingly arranged with the first through hole (11), and the connector (4) passes through the first through hole (11) and the relief hole (51) in sequence to be plugged into the storage unit (3).

3. The storage module according to claim 2, wherein The surface of the storage unit (3) facing the liquid cooling plate (1) is a first surface, and the surface of the storage unit (3) connected to the first surface is a second surface, and one of the second surfaces is a heat generating surface; The heat conducting element (5) comprises: A first heat conducting part (52) arranged between the storage unit (3) and the liquid cooling plate (1), the first heat conducting part (52) being provided with the relief hole (51), the first heat conducting part (52) being in heat exchange contact with the storage unit (3) and in heat exchange contact with the liquid cooling plate (1); A second heat conducting part (53) heat exchange connected to the first heat conducting part (52), the second heat conducting part (53) being in heat exchange contact with the heat generating surface and in heat exchange contact with the liquid cooling plate (1).

4. The storage module according to claim 3, wherein The relief hole (51) is a second through hole penetrating the first heat conducting part (52).

5. The storage module according to claim 3, characterized in that Further comprising a first heat conducting gasket (6), the first heat conducting gasket (6) being arranged between the heat conducting element (5) and the storage unit (3).

6. The storage module according to any one of claims 2 to 5, characterized in that Further comprising a second heat conducting gasket (7) arranged between the heat conducting element (5) and the liquid cooling plate (1).

7. The storage module according to claim 6, characterized in that, The second heat conducting gasket (7) is provided with a third through hole (71), and the connector (4) passes through the first through hole (11), the third through hole (71) and the relief hole (51) in sequence to be plugged into the storage unit (3).

8. The storage module according to any one of claims 2 to 5, characterized in that, Further comprising a storage unit bracket (8), both the storage unit (3) and the heat conducting element (5) being connected to the storage unit bracket (8).

9. The storage module according to any one of claims 1 to 5 or 7, characterized in that, At least two groups of the connectors (4) are connected to the backplane (2) at intervals along a second direction, and each group includes at least two of the connectors (4) distributed at intervals along a third direction; the liquid cooling plate (1) matches the shape of the backplane (2), and a plurality of first through holes (11) are correspondingly provided on the liquid cooling plate (1), and each of the connectors (4) is correspondingly connected to a storage unit (3); wherein, the first direction, the second direction and the third direction are perpendicular to each other in pairs.

10. A server, characterized in that, Comprising the storage module according to any one of claims 1 to 9.

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