Analysis system based on preparation data of anti-adhesion blade coating

Abstract

The present invention discloses an analysis system based on the preparation data of anti-adhesion tool head coatings, and relates to the technical field of coating preparation data management. The analysis system based on the preparation data of anti-adhesion tool head coatings includes: a plate offset analysis module, a preparation stability analysis module, and an anti-adhesion error analysis module. The present invention performs an offset analysis on the coordinate position of the plate to be prepared by using the obtained correction parameters, and at the same time determines whether to determine the number of plates to be prepared based on the offset analysis results, and then determines whether to perform a preparation parameter optimization analysis based on the preparation stability analysis results, and finally determines whether to send a secondary tool cutting preparation instruction based on the anti-adhesion error analysis results, thereby achieving an improvement in the reliability of the analysis of the preparation status of the anti-adhesion tool head coating corresponding to the tool cutting preparation process, and solves the problem of low reliability of the analysis of the preparation status of the anti-adhesion tool head coating corresponding to the tool cutting preparation process in the prior art.

Description

Technical Field

[0001] The present invention relates to the technical field of coating preparation data management, and in particular to an analysis system based on anti-adhesion tool head coating preparation data. Background Art

[0002] As modern manufacturing continues to evolve toward high precision, high efficiency, and high reliability, cutting tools, as core components in machining, have a significant impact on machining quality and production efficiency. In high-end manufacturing fields such as aerospace, automotive, and mold processing, cutting tools are susceptible to adhesion wear during high-speed cutting, leading to shortened tool life, reduced surface quality, and even equipment downtime. To address this issue, anti-adhesion tool tip coating technology has emerged. This technology deposits a special coating on the tool surface, significantly reducing friction and material adhesion during cutting, thereby extending tool life and improving machining accuracy.

[0003] Existing technology integrates the blade coating preparation process parameters (such as power, temperature, gas flow, etc.) and the basic performance data of the coating (such as thickness, roughness, microstructure) as a starting point to build a process-material database. At the same time, an ellipsometer or white light interferometer is used to monitor the growth dynamics of the blade coating. Then, a laser confocal microscope or an atomic force microscope is used to obtain the material composition value, and the influence of surface morphology on adhesion is analyzed. Subsequently, a friction and wear testing machine is used to measure the friction coefficient and wear rate when the blade coating contacts the target tissue, and the anti-adhesion performance of the blade coating is predicted to achieve the design of a low-friction, high-thermal-conductivity blade coating.

[0004] However, in the process of implementing the technical solutions of the invention in the embodiments of the present application, the present application found that the above technology has at least the following technical problems:

[0005] In the existing technology, only limited key indicators (such as coating thickness, surface roughness, and microstructure) are relied upon, and key factors such as material composition gradient are ignored, resulting in deviations between the anti-adhesion performance evaluation and the actual working conditions. The failure mechanism of the coating under complex cutting conditions cannot be accurately predicted, making the prediction model unreliable when dealing with complex process parameters. There is also a problem of low reliability in the analysis of the preparation status of the anti-adhesion tool head coating during the tool cutting preparation process. Summary of the Invention

[0006] The embodiment of the present application solves the problem in the prior art that the reliability of the analysis of the preparation status of the anti-adhesion blade coating corresponding to the tool cutting preparation process is low by providing an analysis system based on the preparation data of the anti-adhesion blade coating, thereby improving the reliability of the analysis of the preparation status of the anti-adhesion blade coating corresponding to the tool cutting preparation process.

[0007] An embodiment of the present application provides an analysis system based on the preparation data of the anti-adhesion tool head coating, including: a plate offset analysis module, a preparation stability analysis module and an anti-adhesion error analysis module; wherein the plate offset analysis module is used to perform an offset analysis on the coordinate position of the plate to be prepared according to the acquired correction parameters to obtain an offset analysis result, the plate to be prepared is the anti-adhesion tool head coating to be prepared on the preparation platform, and the offset analysis is used to quantify the degree of matching between the actual coordinate position of the plate to be prepared and the trajectory to be prepared; the preparation stability analysis module is used to determine whether to perform a quantity determination of the plates to be prepared according to the offset analysis result, if the quantity determination of the plates to be prepared is performed, then a preparation stability analysis is performed on a laser preparation process of the plate to be prepared based on the acquired preparation data to obtain a preparation stability analysis result, otherwise a gain parameter optimization analysis is performed and then the preparation stability analysis result is determined. The preparation stability analysis is used to quantify the deviation trend of the plate to be prepared on the preparation platform under the influence of preparation data. The gain parameter optimization analysis is used to quantify the degree of recovery of the deviation of the plate to be prepared by adjusting the position loop gain and the speed loop gain. The anti-adhesion error analysis module is used to determine whether to perform preparation parameter optimization analysis based on the preparation stability analysis results. If so, the preparation parameter optimization analysis process is monitored in real time. Otherwise, the plate sample after one tool cutting preparation is completed is subjected to anti-adhesion error analysis to obtain the anti-adhesion error analysis results. At the same time, based on the anti-adhesion error analysis results, it is determined whether to send a secondary tool cutting preparation instruction. The preparation parameter optimization analysis is used to analyze the degree of recovery of the preparation stability of the plate to be prepared by adjusting the auxiliary gas pressure and the tool cutting power. The anti-adhesion error analysis is used to quantify the corresponding anti-adhesion performance of the plate sample after one tool cutting preparation is completed.

[0008] One or more technical solutions provided in the embodiments of this application have at least the following technical effects or advantages:

[0009] 1. The coordinate position of the plate to be prepared is analyzed for offset by the obtained correction parameters, and at the same time, whether to determine the number of plates to be prepared is determined based on the offset analysis results, and then whether to perform preparation parameter optimization analysis is determined based on the preparation stability analysis results. Finally, based on the anti-adhesion error analysis results, it is determined whether to send a secondary tool cutting preparation instruction, thereby achieving consistency in production efficiency and production quality of the plates to be prepared, and further achieving an improvement in the reliability of the analysis of the preparation status of the anti-adhesion tool head coating corresponding to the tool cutting preparation process, effectively solving the problem of low reliability of the analysis of the preparation status of the anti-adhesion tool head coating corresponding to the tool cutting preparation process in the prior art.

[0010] 2. By obtaining the difference between the X-direction offset and the maximum allowable X-direction offset in the database, and combining it with the introduced X-direction offset correction to perform compensation correction, the X-direction offset correlation score is obtained. At the same time, the result of geometric averaging of the obtained X-direction offset correlation score and the Y-direction offset correlation score is coupled with the rotation angle offset correlation score to obtain the coordinate offset analysis value, thereby improving the accuracy of obtaining the coordinate offset analysis value, and further achieving a more accurate analysis of the degree of matching between the actual coordinate position of the to-be-prepared plate and the to-be-prepared trajectory.

[0011] 3. By judging that the obtained safety distance is not less than the safety distance setting value in the data and the obtained overlapping area is not greater than the overlapping area setting value in the database, it is judged whether to linearly couple the obtained coordinate offset analysis value coefficient, cutting speed related score and safety distance related score to obtain the first preparation stability analysis value, and linearly couple the obtained coordinate offset analysis value coefficient, cutting speed related score and overlapping area related score to obtain the second preparation stability analysis value, thereby achieving an improvement in the accuracy of obtaining the preparation stability analysis value, and thus achieving a more accurate analysis of the offset trend of the plate to be prepared on the preparation platform under the influence of preparation data.

[0012] 4. By dynamically adjusting the auxiliary gas pressure and tool cutting power, it can effectively deal with unstable factors in the preparation process, reduce the plate offset, improve the stability of the preparation process, and ensure the consistency of the quality of the anti-adhesion blade coating preparation. At the same time, the PID control algorithm is used to accurately adjust the tool cutting power to optimize the cutting process parameters, improve cutting accuracy and efficiency, and reduce coating defects and plate scrap caused by unreasonable parameters. It can adapt to the preparation needs of plates of different materials and specifications and reduce production losses. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 A schematic diagram of the structure of an analysis system based on the preparation data of anti-adhesion tool tip coatings provided in an embodiment of the present application;

[0014] Figure 2 A specific flow chart of the preparation stability analysis module provided in the embodiment of the present application;

[0015] Figure 3 This is a specific flow chart of the anti-adhesion error analysis module provided in an embodiment of the present application. DETAILED DESCRIPTION

[0016] The embodiments of the present application solve the problem of low reliability of the preparation status analysis of the anti-adhesion tool head coating during the tool cutting preparation process in the prior art by providing an analysis system based on the preparation data of the anti-adhesion tool head coating. The plate offset analysis module performs an offset analysis on the coordinate position of the plate to be prepared based on the obtained correction parameters to obtain an offset analysis result. Then, the preparation stability analysis module determines whether to determine the number of plates to be prepared based on the offset analysis result. If the number of plates to be prepared is determined, a preparation stability analysis is performed on the single laser preparation process of the plate to be prepared based on the obtained preparation data to obtain a preparation stability analysis result. Otherwise, a gain parameter optimization analysis is performed and then a preparation stability analysis result is determined. Finally, the anti-adhesion error analysis module determines whether to perform a preparation parameter optimization analysis based on the preparation stability analysis result. If so, the preparation parameter optimization analysis process is monitored in real time. Otherwise, an anti-adhesion error analysis is performed on the plate sample after the single tool cutting preparation to obtain an anti-adhesion error analysis result. At the same time, based on the anti-adhesion error analysis result, it is determined whether to send a secondary tool cutting preparation instruction. This improves the reliability of the preparation status analysis of the anti-adhesion tool head coating during the tool cutting preparation process.

[0017] The technical solution in the embodiment of the present application is to solve the problem that the reliability of the analysis of the preparation status of the anti-adhesion blade coating corresponding to the tool cutting preparation process is not high. The overall idea is as follows:

[0018] The coordinate position of the plate to be prepared is analyzed for offset through the obtained correction parameters, and the number of plates to be prepared is determined based on the offset analysis results. Then, the preparation parameter optimization analysis is determined based on the preparation stability analysis results. Finally, the secondary tool cutting preparation instruction is determined based on the anti-adhesion error analysis results, thereby achieving the effect of improving the reliability of the analysis of the preparation status of the anti-adhesion tool head coating during the tool cutting preparation process.

[0019] In order to better understand the above technical solution, the above technical solution will be described in detail below with reference to the accompanying drawings and specific implementation methods.

[0020] like Figure 1 As shown, it is a structural schematic diagram of the analysis system based on the preparation data of the anti-adhesion tool tip coating provided in an embodiment of the present application. The analysis system based on the preparation data of the anti-adhesion tool tip coating provided in an embodiment of the present application includes: a plate offset analysis module, a preparation stability analysis module and an anti-adhesion error analysis module.

[0021] The plate offset analysis module is used to perform offset analysis on the coordinate position of the plate to be prepared based on the obtained correction parameters to obtain the offset analysis results. The plate to be prepared is the anti-adhesion tool head coating to be prepared on the preparation platform. The correction parameters include the X-direction offset, the Y-direction offset and the rotation angle offset. The offset analysis is used to quantify the degree of match between the actual coordinate position of the plate to be prepared and the trajectory to be prepared.

[0022] Among them, the coordinate position of the plate to be prepared is analyzed for offset according to the obtained correction parameters. The specific steps include: first, obtaining the difference between the X-direction offset and the maximum allowable X-direction offset in the database, and performing compensation correction based on the introduced X-direction offset correction to obtain the X-direction offset correlation score; X-direction offset correlation score The specific restriction expression is: , where Indicates the X-direction offset score of the plate to be prepared on the preparation platform during the preset analysis period. Indicates the X-direction offset correction amount, Indicates the X-direction offset of the plate to be prepared on the preparation platform during the preset analysis period. Indicates the maximum allowable X-direction offset. The units of X-direction offset and maximum allowable X-direction offset are the same, both in micrometers (μm). The maximum allowable X-direction offset is represented by the sum and average of the maximum historical X-direction offsets of the plates to be prepared on the preparation platform in the database during each historical analysis period.

[0023] Then, the difference between the Y-direction offset and the maximum allowable Y-direction offset in the database is obtained, and the Y-direction offset correction is combined with the introduced Y-direction offset correction to obtain the Y-direction offset correlation score; Y-direction offset correlation score The specific restriction expression is: , where Indicates the Y-direction offset score of the plate to be prepared on the preparation platform within the preset analysis period. Indicates the Y-direction offset correction amount, Indicates the Y-direction offset of the plate to be prepared on the preparation platform within the preset analysis period. Indicates the maximum allowable Y-direction offset. The units of the Y-direction offset and the maximum allowable Y-direction offset are the same, both are microns (μm). The maximum allowable Y-direction offset is represented by the sum and average of the maximum historical Y-direction offsets of the plates to be prepared on the preparation platform in the database during each historical analysis period.

[0024] Next, the difference between the rotation angle offset and the maximum allowable rotation angle offset in the database is obtained, and the rotation angle offset correction introduced is combined to perform compensation correction to obtain the rotation angle offset correlation score; the rotation angle offset correlation score The specific restriction expression is: , where It represents the rotation angle offset score of the plate to be prepared on the preparation platform within the preset analysis period. Indicates the rotation angle offset correction amount, Indicates the rotation angle offset of the plate to be prepared on the preparation platform during the preset analysis period. It represents the maximum allowable rotation angle offset. The units of rotation angle offset and maximum allowable rotation angle offset are the same, both are micrometers (μm). The maximum allowable rotation angle offset is represented by the sum and average of the maximum values of the historical rotation angle offsets of the plates to be prepared on the preparation platform in the database during each historical analysis period.

[0025] Finally, the obtained X-direction offset correlation score and Y-direction offset correlation score are geometrically averaged and coupled with the rotation angle offset correlation score to obtain the coordinate offset analysis value. The coordinate offset analysis value is used to quantify the degree of coordinate position offset of the correction parameter to be prepared within the preset analysis period. The specific restriction expression is: , where Indicates the coordinate offset analysis value of the plate to be prepared on the preparation platform within the preset analysis period.

[0026] In the offset analysis of this example, the X-direction offset, Y-direction offset, and rotation angle offset are obtained using binocular vision sensors combined with computer-aided geometric analysis. The X / Y offsets exhibit nonlinear correlations (for example, rotation causes the offsets to change proportionally). The geometric mean effectively captures this relationship. Compared to the arithmetic mean, the geometric mean is less sensitive to extreme values. By integrating multiple nonlinear indicators, the geometric mean process can more accurately reflect the degree of coordinate offset. This is particularly applicable to offsets with proportional relationships. Combined with dynamic gain parameter optimization, it can significantly improve the positioning accuracy of manufacturing machine tools.

[0027] The aforementioned database is a database for storing various types of setting data established before the design of the analysis system based on the anti-adhesion tool head coating preparation data. The database includes but is not limited to preset coordinate offset analysis values, preset preparation stability analysis values, preset analysis time periods, and one-time preparation time periods. The various values are directly set by technical personnel. Among them, the setting basis of the preset coordinate offset analysis value can be determined according to the actual preparation scenario of the plate to be prepared. For example, the preset coordinate offset analysis value is represented by the sum and average of the historical coordinate offset analysis values of the plate to be prepared on the preparation platform in the database within the historical analysis period. In addition, the various values in the database can be set and fine-tuned by technical personnel according to actual debugging.

[0028] In the database, a series of corrections have been pre-set for the coordinate offset analysis values. There is a clear, pre-defined association pattern between these corrections and the X-direction offset, Y-direction offset, and rotation angle offset. This association is not formed randomly and can be expressed in a one-to-one correspondence or a many-to-one mapping. For example, in actual applications, when it is necessary to evaluate the degree of match between the actual coordinate position of the sheet to be prepared and the trajectory to be prepared, the system allows the user to directly input the real-time monitored X-direction offset, Y-direction offset, and rotation angle offset into this preset association system, which can quickly and accurately parse out the corrections that match the input parameters, namely the X-direction offset correction, the Y-direction offset correction, and the rotation angle offset correction.

[0029] What is particularly critical is that in order to ensure the uniformity and comparability of the evaluation results, the value range of the three correction quantities in this system is limited to the interval of 0 to 1, and the sum of these three correction quantities is always equal to 1.

[0030] In this embodiment, the coordinate offset analysis value increases with the increase of the X-direction offset, Y-direction offset and rotation angle offset. Among them, in the three-dimensional space coordinate system, the translation offset in the X-direction and Y-direction will change the relative position between the plate and the tool, thereby affecting the geometric shape of the cutting trajectory, while the rotation angle offset will make the originally regular cutting path irregular. This combined effect of translation and rotation is not a simple linear superposition, but rather a nonlinear interactive influence.

[0031] Taking these interactions into account helps construct a more accurate coordinate offset analysis model. This model comprehensively considers the coupling between X- and Y-axis offsets and rotational angle offsets, enabling more accurate simulation and prediction of the sheet's actual position and posture during the cutting process. This model enables a more reliable assessment of the anti-adhesion coating preparation status of the sheet during the tool cutting process, thereby improving the reliability of the analysis of the anti-adhesion coating preparation status during the tool cutting process.

[0032] like Figure 2 As shown, it is a specific flow chart of the preparation stability analysis module provided in an embodiment of the present application. The preparation stability analysis module is used to determine whether to determine the number of plates to be prepared based on the offset analysis results. If the number of plates to be prepared is determined, a preparation stability analysis is performed on the laser preparation process of the plates to be prepared based on the acquired preparation data to obtain the preparation stability analysis results. Otherwise, the preparation stability analysis results are determined after the gain parameter optimization analysis. The preparation stability analysis is used to quantify the offset trend of the plates to be prepared on the preparation platform under the influence of the preparation data. The gain parameter optimization analysis is used to quantify the degree of recovery of the offset degree of the plates to be prepared by adjusting the position loop gain and the speed loop gain.

[0033] If the number of plates to be prepared is determined, it indicates that the positioning of the plates to be prepared is qualified. Otherwise, it indicates that the positioning of the plates to be prepared is unqualified. Gain parameter optimization analysis is performed. This analysis aims to quantify the extent to which the adjustment of the position loop gain and speed loop gain can restore the offset of the plates to be prepared. During the analysis, it is determined whether the speed loop response speed deviation is not greater than the database value and whether the coordinate offset analysis value deviation within the number of position loop gain reductions is not greater than 0. If the above conditions are not met, the preset personnel will be prompted to intervene. If the conditions are met, after completing the gain parameter optimization analysis, the preparation stability analysis results must still be determined until the positioning of the plates to be prepared is qualified, and then the number of plates to be prepared is determined.

[0034] In this embodiment, for plates that fail positioning, gain parameter optimization analysis can be used to adjust relevant parameters to improve positioning accuracy, ensuring the plate's accurate position during subsequent preparation. This gain parameter optimization analysis not only addresses offset issues but also comprehensively optimizes preparation parameters based on data such as the velocity loop response speed deviation and the number of position loop gain reductions, helping to improve the stability and efficiency of the entire preparation process. The process also determines the number of plates to be prepared and adopts different processing strategies based on the number of plates (single or multiple). This entire process, through a three-level architecture of "offset trend prediction - gain self-healing - closed-loop feedback," systematically addresses the response lag and parameter rigidity issues of traditional PID control under complex operating conditions.

[0035] Furthermore, the offset analysis result is used to determine whether to determine the number of plates to be prepared. The specific process is as follows: if the obtained coordinate offset analysis value is not greater than the coordinate offset analysis value preset in the database, the offset analysis result is recorded as qualified positioning of the plates to be prepared and the number of plates to be prepared is determined; if the obtained coordinate offset analysis value is greater than the coordinate offset analysis value preset in the database, the offset analysis result is recorded as unqualified positioning of the plates to be prepared and a gain parameter optimization analysis is performed. The gain parameters include position loop gain and speed loop gain, which represent the parameters of the servo motor. The position loop gain is used to control the followability of the servo motor corresponding to the plate to be prepared to the position instruction to improve the positioning accuracy and response speed; the speed loop gain is used to control the stability of the speed of the servo motor corresponding to the plate to be prepared to suppress speed fluctuations.

[0036] Specifically, the specific process of gain parameter optimization analysis is: based on the obtained coordinate offset analysis value deviation and position loop response speed deviation, the position loop gain reduction amplitude of the servo motor corresponding to the preparation machine tool is mapped in the database; the coordinate offset analysis value deviation is used to quantify the difference between the obtained coordinate offset analysis value and the preset coordinate offset analysis value, that is, the difference between the obtained coordinate offset analysis value and the preset coordinate offset analysis value; the position loop response speed deviation is used to quantify the difference between the actual position loop response speed obtained by the plate to be prepared on the preparation platform at the end of the preset analysis period and the reference position loop response speed in the database, that is, the difference between the actual position loop response speed and the reference position loop response speed; the reference position loop response speed is represented by the sum and average of the historical position loop response speeds obtained by the plate to be prepared on the preparation platform at the end of the historical analysis period in the database; if the speed obtained after a position loop gain reduction is If the speed loop response speed deviation is not greater than the speed loop response speed deviation in the database, the speed loop gain reduction amplitude of the servo motor corresponding to the preparation machine tool is obtained based on the re-acquired coordinate offset analysis value deviation and the speed loop response speed deviation. If the re-acquired coordinate offset analysis value deviation is not greater than 0 within the preset speed loop gain reduction times, the gain parameter optimization analysis completion instruction is sent and the number of plates to be prepared is determined, otherwise the preset personnel is prompted to intervene. The speed loop response speed deviation is used to quantify the degree of difference between the actual speed loop response speed obtained by the plates to be prepared on the preparation platform at the end of the preset analysis period and the reference speed loop response speed in the database, that is, the difference between the actual speed loop response speed and the reference speed loop response speed. The reference speed loop response speed is represented by the sum and average of the historical speed loop response speeds obtained by the plates to be prepared on the preparation platform at the end of the historical analysis period in the database.

[0037] In this embodiment, the plate positioning is strictly judged by the offset analysis results, and only the plates with qualified positioning are allowed to enter the quantity determination link, thereby avoiding the plate processing quality problems caused by positioning deviation from the source. At the same time, the equipment performance gain parameter optimization analysis process can accurately adjust the position loop gain and speed loop gain according to the actual coordinate offset and response speed deviation, effectively improve the control performance of the servo motor, avoid production stagnation caused by equipment problems, effectively improve the overall production efficiency, and thus realize the intelligent management of plate positioning and equipment parameter adjustment.

[0038] Furthermore, the specific process for determining the number of plates to be prepared is as follows: if the number of plates to be prepared is 1, it is determined to be a single plate to be prepared and the safety spacing of the single plate to be prepared in the corresponding placement area on the preparation platform is obtained (that is, the spacing between the edge of the single plate to be prepared and the boundary of the preparation platform), and at the same time, based on the obtained safety spacing deviation, it is determined whether to send a plate fixed position adjustment instruction, and the safety spacing deviation represents the difference between the safety spacing setting value in the database and the obtained safety spacing; if the number of plates to be prepared is not 1, it is determined to be multiple plates to be prepared and the overlapping area of the multiple plates to be prepared in the corresponding placement area on the preparation platform is obtained, and at the same time, based on the obtained overlapping area area deviation, it is determined whether to send a plate placement order adjustment instruction and obtain preparation data, and the overlapping area area deviation represents the difference between the overlapping area setting value in the database and the obtained overlapping area.

[0039] Among them, the preparation data includes a first preparation parameter and a second preparation parameter; the first preparation parameter represents the preparation data corresponding to the single plate to be prepared during a laser preparation process, specifically including the coordinate offset analysis value, cutting speed and safety distance; the second preparation parameter represents the preparation data corresponding to multiple plates to be prepared during a laser preparation process, specifically including the coordinate offset analysis value, cutting speed and overlapping area; the cutting speed is obtained by collaborative monitoring of a high-precision laser displacement sensor and a high-speed timer, the safety distance is obtained by monitoring a binocular vision sensor combined with an image processing algorithm, and the overlapping area is obtained by monitoring a binocular vision sensor combined with a computer-aided geometric analysis.

[0040] In this embodiment, whether it is a single plate to be prepared or multiple plates to be prepared, accurate acquisition of relevant parameters and deviation analysis can ensure that the laser preparation process is carried out under optimal parameter conditions. For a single plate to be prepared, a suitable safety spacing helps to ensure the flatness and accuracy of the cutting edge. For multiple plates to be prepared, a reasonable overlapping area and placement order can make the laser cutting path more optimized, and realize the automatic acquisition and analysis of parameters such as the number of plates to be prepared, safety spacing and overlapping area, thereby avoiding production interruptions and rework caused by inappropriate parameters or improper placement of plates, thereby improving production efficiency and shortening product production cycle.

[0041] Furthermore, based on the obtained preparation data, a preparation stability analysis is performed on the laser preparation process of the plate to be prepared. The specific steps include:

[0042] The obtained coordinate offset analysis value is compensated and corrected by introducing the coordinate offset analysis value correction amount to obtain the coordinate offset analysis value coefficient. The specific restriction expression is: , where It represents the coordinate offset analysis value coefficient of the plate to be prepared on the preparation platform at the end of one preparation period. Indicates the coordinate offset analysis value correction amount, Indicates the coordinate offset analysis value of the plate to be prepared on the preparation platform within the preset analysis period.

[0043] The relative difference between the actual cutting speed and the reference cutting speed in the database is compensated by introducing the cutting speed correction amount to obtain the cutting speed related score. The specific restriction expression is: , where It represents the cutting speed-related score of the plate to be prepared on the preparation platform at the end of one preparation period. Indicates the cutting speed correction amount, Indicates the actual cutting speed of the plate to be prepared on the preparation platform at the end of one preparation period. Indicates the reference cutting speed. The actual cutting speed has the same unit as the reference cutting speed, which is millimeters per second (mm / s). The reference cutting speed is represented by the sum and average of the historical cutting speeds of the plates to be prepared on the preparation platform at the end of a historical preparation period in the database.

[0044] When the obtained safety distance is not less than the safety distance setting value in the data, the obtained coordinate offset analysis value coefficient, the cutting speed related score and the safety distance related score are linearly coupled to obtain the first preparation stability analysis value. The first preparation stability analysis value is used to quantify the interference degree of the first preparation parameter on the preparation stability of the single plate to be prepared. Among them, the safety distance related score represents the result of the safety distance correction amount correcting the difference between the obtained safety distance and the safety distance setting value in the data; the safety distance related score The specific restriction expression is: , where It represents the safety distance score of the single plate to be prepared on the preparation platform at the end of a preparation period. Indicates the safety distance correction amount, Indicates the safe distance between the single sheet to be prepared on the preparation platform at the end of one preparation period. Indicates the safety distance setting value. The units of the safety distance and the safety distance setting value are the same, both are millimeters (mm). The safety distance setting value is represented by the average of the historical safety distances of the single plate to be prepared on the preparation platform in the database at the end of a historical preparation period.

[0045] When the obtained overlapping area is not greater than the overlapping area setting value in the database, the obtained coordinate offset analysis value coefficient, cutting speed related score and overlapping area related score are linearly coupled to obtain the second preparation stability analysis value, which is used to quantify the interference degree of the second preparation parameter on the preparation stability of the multi-plate material to be prepared, wherein the overlapping area related score represents the result of the overlapping area correction amount correcting the difference between the obtained overlapping area and the overlapping area setting value in the data. Overlapping area related score The specific restriction expression is: , where It represents the area fraction of the overlapping regions of multiple plates to be prepared on the preparation platform at the end of one preparation period. Indicates the overlap area correction amount, It represents the overlapping area of multiple plates to be prepared on the preparation platform at the end of one preparation period. Indicates the overlap area setting value. The units of overlap area and overlap area setting value are the same, both are square millimeters (mm²). The overlap area setting value is represented by the average of the historical overlap area of multiple plates to be prepared on the preparation platform in the database at the end of a historical preparation period.

[0046] When the number of plates to be prepared is 1, the obtained preparation stability analysis value is recorded as the first preparation stability analysis value; when the number of plates to be prepared is not 1, the obtained preparation stability analysis value is recorded as the second preparation stability analysis value.

[0047] In summary, the stability analysis value of the preparation The specific restriction expression is: , where i is the number of the type of plate to be prepared, , Indicates the single plate to be prepared, Indicates that multiple plates are to be prepared. It indicates the preparation stability analysis value of the plate to be prepared on the preparation platform at the end of one preparation period.

[0048] In the database, a series of corrections have been pre-set for the preparation stability analysis values. There is a clear, pre-defined correlation pattern between these corrections and the coordinate offset analysis values, actual cutting speed, safety spacing, and overlapping area. This correlation is not formed randomly, and its expression can be one-to-one or many-to-one mapping. For example, in actual applications, when it is necessary to evaluate the offset trend of the sheet to be prepared under the influence of preparation data, the system allows the user to input the real-time monitored coordinate offset analysis value, actual cutting speed, safety spacing, and overlapping area directly into this preset correlation system, and can quickly and accurately parse out the corrections that match the input parameters, namely the coordinate offset analysis value correction, cutting speed correction, safety spacing correction, and overlapping area correction.

[0049] It is particularly important that in order to ensure the uniformity and comparability of the evaluation results, the value ranges of the four correction quantities in this system are limited to the interval between 0 and 1. When the sum of the coordinate offset analysis value correction, cutting speed correction and safety distance correction is 1, When , the sum of the coordinate offset analysis value correction, cutting speed correction and overlap area correction is 1.

[0050] In this embodiment, when The preparation stability analysis value increases with the increase of the coordinate offset analysis value, the actual cutting speed and the safety distance. Among them, when the actual cutting speed increases, the distance moved by the tool or laser head per unit time increases. If the coordinate offset analysis value shows that there is a certain degree of offset, the faster cutting speed can "cover up" the impact of this offset to a certain extent. For example, during high-speed cutting, the tool passes through the surface of the plate quickly. Even if there is a slight coordinate offset, due to the short cutting path and extremely fast speed, the deviation of the cutting track formed on the plate is relatively unobvious, and the unevenness of the cutting edge may not be sharply deteriorated due to the offset.

[0051] when The preparation stability analysis value increases with the increase of the coordinate offset analysis value, the actual cutting speed and the overlapping area. Among them, the size of the coordinate offset analysis value is directly related to the accuracy of the overlapping area when cutting multiple plates. When the coordinate offset analysis value increases, the cutting paths of adjacent plates will deviate, and the originally expected overlapping area may deviate. For example, if there is a coordinate offset in the plate placement process, the cutting lines of adjacent plates cannot be accurately aligned during cutting, which may cause the overlapping area to increase or decrease. An increase in the overlapping area may cause material accumulation at the joints of the plates, affecting the flatness and overall strength of the joints; a decrease in the overlapping area may result in loose joints and gaps, reducing the overall performance and anti-adhesion ability of the plates.

[0052] By comprehensively considering the mutual influence relationship between the coordinate offset analysis value, the actual cutting speed and the area of the overlapping region, the influence of various factors in the tool cutting preparation process on the preparation stability can be more comprehensively reflected. Traditional analysis methods may only focus on a single factor and ignore the interaction between factors, resulting in inaccurate analysis results. Through the analysis of this mutual influence mechanism, the preparation stability analysis value can be calculated more accurately, providing a reliable basis for subsequent process adjustment and optimization, thereby achieving the improvement of the reliability of the analysis of the preparation status of the anti-adhesion tool head coating during the tool cutting preparation process.

[0053] like Figure 3 As shown, it is a specific flow chart of the anti-adhesion error analysis module provided in an embodiment of the present application. The anti-adhesion error analysis module is used to determine whether to perform preparation parameter optimization analysis based on the preparation stability analysis results. If so, the preparation parameter optimization analysis process is monitored in real time. Otherwise, the anti-adhesion error analysis is performed on the plate sample after one tool cutting preparation is completed to obtain the anti-adhesion error analysis result. At the same time, based on the anti-adhesion error analysis result, it is determined whether to send a secondary tool cutting preparation instruction. The preparation parameter optimization analysis is used to analyze the degree of recovery of the preparation stability of the plate to be prepared by adjusting the auxiliary gas pressure and the tool cutting power. The anti-adhesion error analysis is used to quantify the anti-adhesion performance corresponding to the plate sample after one tool cutting preparation is completed.

[0054] First, the preparation stability is analyzed to determine whether it meets the expected requirements. If so, the anti-adhesion error analysis is performed. If not, the preparation parameters are optimized. The first step is to adjust the auxiliary gas pressure. After the auxiliary gas pressure is adjusted, the effectiveness of the adjustment is determined based on the reduction in the plate offset. If so, the auxiliary gas pressure is adjusted again until the preparation stability meets the expected requirements. Otherwise, the second adjustment step, namely adjusting the tool cutting power, is performed. The preparation stability is determined again, and this process is repeated until the preparation stability meets the expected requirements. Finally, the anti-adhesion error is analyzed and the deviation is determined. If the deviation is not greater than 0, local repair and laser pulse duty cycle optimization are performed to determine whether a qualified plate sample has been obtained.

[0055] In this embodiment, by analyzing the preparation stability, anomalies in the preparation process can be promptly detected. When the preparation stability does not meet the requirements, the preparation parameters are optimized and the auxiliary gas pressure is adjusted to help restore the preparation stability. Secondly, through the analysis of anti-adhesion errors, the preparation accuracy can be further ensured and the errors caused by adhesion can be reduced. Throughout the entire process, the closed-loop architecture of "preparation stability drive-parameter self-optimization-anti-adhesion quantification-dynamic secondary cutting" systematically solves the uncontrollable problem of adhesion errors in high-precision machining. This dynamic adjustment mechanism makes the preparation process more flexible and adaptable, and can cope with changes in different materials and preparation conditions.

[0056] Furthermore, it is determined whether to perform preparation parameter optimization analysis based on the preparation stability analysis results. The specific process is: if the obtained preparation stability analysis value is not greater than the preparation stability analysis value preset in the database, the preparation stability analysis result is recorded as qualified preparation and a plate sample is obtained, and an anti-adhesion error analysis is performed at the same time. The preset preparation stability analysis value is represented by the sum and average of the historical preparation stability analysis values of the plates to be prepared on the preparation platform in the database at the end of a historical preparation period; if the obtained preparation stability analysis value is greater than the preparation stability analysis value preset in the database, the preparation stability analysis result is recorded as unqualified preparation and a preparation parameter optimization analysis is performed; the preparation parameters include auxiliary gas pressure and tool cutting power.

[0057] Furthermore, the specific process of the preparation parameter optimization analysis is as follows: based on the obtained preparation stability analysis value deviation and tool cutting pressure deviation, the auxiliary gas pressure reduction amplitude of the servo motor corresponding to the preparation machine tool is mapped in the database; the tool cutting pressure deviation is used to quantify the difference between the actual tool cutting pressure corresponding to the plate to be prepared at the end of a preparation period and the tool cutting pressure setting value in the database; the preparation stability analysis value deviation is used to quantify the difference between the obtained preparation stability analysis value and the preset preparation stability analysis value; if the plate offset reduction amplitude obtained after a reduction in the auxiliary gas pressure is not less than the corresponding preset reduction amplitude, the re-acquired preparation stability analysis value deviation and the plate The horizontal offset is input into the PID control algorithm of the servo motor corresponding to the preparation machine tool to output the reduction amplitude of the tool cutting power. The reduction amplitude of the tool cutting power is used to reduce the cutting power of the tool cutting head corresponding to the plate to be prepared. The plate horizontal offset is used to quantify the degree of difference between the actual horizontal offset of the plate to be prepared in the horizontal direction at the end of a preparation period and the horizontal offset set value in the database. The plate offset reduction amplitude is used to reduce the offset of the plate to be prepared in the horizontal direction on the preparation platform; if the deviation of the re-acquired preparation stability analysis value is not greater than 0 within the preset number of tool cutting power reductions, the preparation parameter optimization analysis is completed and the anti-stickiness error analysis instruction is sent, otherwise a monitoring and early warning instruction is sent.

[0058] In this embodiment, the optimization and analysis process is highly adaptable and flexible, dynamically adjusting to the preparation requirements and actual conditions of different sheet materials. Whether dealing with sheets of varying materials, thicknesses, or specifications, or facing various complex conditions during the preparation process, the process automatically adjusts preparation parameters by acquiring and analyzing deviation data in real time, ensuring the preparation process is always optimal. This adaptability and flexibility enables the preparation system to better cope with diverse production tasks.

[0059] Furthermore, based on the anti-adhesion error analysis results, it is determined whether to send a secondary tool cutting preparation instruction. The specific process is: when the obtained anti-adhesion error analysis judgment value is within the allowable range of the anti-adhesion error analysis judgment value in the database, a local repair instruction is sent and a laser pulse duty cycle optimization analysis is performed. The allowable range of the anti-adhesion error analysis judgment value represents the range corresponding to the maximum and minimum values of the historical anti-adhesion error analysis judgment value in the database, including the case where it is equal to the maximum and minimum values of the historical anti-adhesion error analysis judgment value; when the obtained anti-adhesion error analysis judgment value is less than the minimum value of the historical anti-adhesion error analysis judgment value in the database, a plate sample qualified instruction is sent; when the obtained anti-adhesion error analysis judgment value is greater than the maximum value of the historical anti-adhesion error analysis judgment value in the database, a secondary tool cutting preparation instruction is sent; the anti-adhesion error analysis judgment value represents the result of harmonized averaging of the heat-affected zone width, bottom burr length, and surface residual slag length of the corresponding plate to be prepared after the completion of one tool cutting preparation. Results; Laser pulse duty cycle optimization means adjusting the laser energy output of the corresponding tool cutting head after one tool cutting by adjusting the laser pulse duty cycle adjustment amplitude; Laser pulse duty cycle adjustment amplitude means the result of inputting the obtained anti-adhesion error analysis judgment value deviation and laser pulse frequency deviation into the tool cutting head PID control algorithm, the anti-adhesion error analysis judgment value deviation is used to quantify the degree of difference between the obtained anti-adhesion error analysis judgment value and the anti-adhesion error analysis judgment value preset in the database, the preset anti-adhesion error analysis judgment value is represented by the sum and average of the historical anti-adhesion error analysis judgment values of the corresponding to-be-prepared plate after one tool cutting is completed in the database, the laser pulse frequency deviation is used to quantify the degree of difference between the actual laser pulse frequency of the corresponding tool cutting head after one tool cutting is completed and the preset laser pulse frequency in the database, the preset laser pulse frequency is represented by the sum and average of the historical laser pulse frequencies of the corresponding tool cutting head after one tool cutting is completed in the database.

[0060] In this embodiment, the automated and intelligent judgment process can quickly and accurately make decisions based on the anti-adhesion error analysis judgment value and send corresponding instructions in a timely manner, reducing the waiting time and decision-making links in the production process. In the process of enhancing the intelligence level of the equipment, the PID (Proportional-Integral-Derivative) control algorithm is introduced to optimize the laser pulse duty cycle analysis, thereby achieving precise control of the laser energy output. The equipment can automatically adjust the cutting parameters according to the anti-adhesion error analysis judgment value deviation and laser pulse frequency deviation obtained in real time, so that the equipment has the ability of self-adaptation and self-optimization, which significantly enhances the intelligence level of the equipment and provides strong support for the development of intelligent manufacturing in enterprises.

[0061] To sum up, the embodiment of the present application performs an offset analysis on the coordinate position of the plate to be prepared through the obtained correction parameters, and at the same time determines whether to determine the number of plates to be prepared based on the offset analysis results, and then determines whether to perform preparation parameter optimization analysis based on the preparation stability analysis results, and finally determines whether to send a secondary tool cutting preparation instruction based on the anti-adhesion error analysis results, thereby achieving consistency in the production efficiency and production quality of the plate to be prepared, and then achieving an improvement in the reliability of the analysis of the preparation status of the anti-adhesion tool head coating corresponding to the tool cutting preparation process, effectively solving the problem of low reliability of the analysis of the preparation status of the anti-adhesion tool head coating corresponding to the tool cutting preparation process in the prior art.

[0062] Those skilled in the art will appreciate that embodiments of the present invention may be provided as methods, systems, or computer program products. Thus, the present invention may take the form of an entirely hardware embodiment, an entirely software embodiment, or an embodiment combining software and hardware aspects. Furthermore, the present invention may take the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to magnetic disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0063] The present invention is described with reference to flowcharts and / or block diagrams of systems, devices (systems), and computer program products according to embodiments of the present invention. It should be understood that each process and / or block in the flowcharts and / or block diagrams, as well as combinations of processes and / or blocks in the flowcharts and / or block diagrams, can be implemented by computer program instructions. These computer program instructions can be provided to a processor of a general-purpose computer, a special-purpose computer, an embedded processor, or other programmable data processing device to produce a machine, so that the instructions executed by the processor of the computer or other programmable data processing device generate instructions for implementing the processes in the flowcharts and / or block diagrams. Figure 1 a process or multiple processes and / or boxes Figure 1 A device that provides the functions specified in a block or multiple blocks.

[0064] These computer program instructions may also be stored in a computer readable memory that can direct a computer or other programmable data processing device to work in a specific manner, so that the instructions stored in the computer readable memory produce an article of manufacture comprising an instruction device, which implements the process Figure 1 a process or multiple processes and / or boxes Figure 1 The function specified in one or more boxes.

[0065] These computer program instructions can also be loaded onto a computer or other programmable data processing device so that a series of operational steps are executed on the computer or other programmable device to produce a computer-implemented process, thereby providing the instructions executed on the computer or other programmable device for implementing the process. Figure 1 a process or multiple processes and / or boxes Figure 1 A step that specifies a function in one or more boxes.

[0066] Although the preferred embodiments of the present invention have been described, those skilled in the art may make additional changes and modifications to these embodiments once they have learned the basic creative concept. Therefore, the appended claims are intended to be interpreted as including the preferred embodiments and all changes and modifications that fall within the scope of the present invention.

[0067] Obviously, those skilled in the art may make various changes and modifications to the present invention without departing from the spirit and scope of the present invention. Thus, if such changes and modifications fall within the scope of the claims and their equivalents, the present invention is intended to include such changes and modifications.

Claims

1. An analysis system based on the preparation data of anti-adhesion tool tip coatings, characterized in that: include: Plate deviation analysis module, preparation stability analysis module and anti-adhesion error analysis module; The plate offset analysis module is used to perform an offset analysis on the coordinate position of the plate to be prepared based on the obtained correction parameters to obtain an offset analysis result. The correction parameters include an X-direction offset, a Y-direction offset, and a rotation angle offset. The plate to be prepared is an anti-adhesion tool head coating to be prepared on the preparation platform. The offset analysis is used to quantify the degree of match between the actual coordinate position of the plate to be prepared and the trajectory to be prepared. The preparation stability analysis module is used to determine whether to determine the number of plates to be prepared based on the offset analysis result. If the number of plates to be prepared is determined, a preparation stability analysis is performed on the laser preparation process of the plates to be prepared based on the acquired preparation data to obtain a preparation stability analysis result. Otherwise, a gain parameter optimization analysis is performed before determining the preparation stability analysis result. The preparation stability analysis is used to quantify the offset trend of the plates to be prepared on the preparation platform under the influence of the preparation data. The gain parameter optimization analysis is used to quantify the degree of recovery of the offset degree of the plates to be prepared by adjusting the position loop gain and the speed loop gain. The preparation data includes a first preparation parameter and a second preparation parameter. The first preparation parameter represents the preparation data corresponding to the single plate to be prepared in the laser preparation process, specifically including the coordinate offset analysis value, the cutting speed and the safety spacing. The second preparation parameter represents the preparation data corresponding to multiple plates to be prepared in the laser preparation process, specifically including the coordinate offset analysis value, the cutting speed and the overlapping area. The anti-adhesion error analysis module is used to determine whether to perform preparation parameter optimization analysis based on the preparation stability analysis results. If so, the preparation parameter optimization analysis process is monitored in real time. Otherwise, anti-adhesion error analysis is performed on the plate sample after the first tool cutting preparation is completed to obtain the anti-adhesion error analysis results. At the same time, based on the anti-adhesion error analysis results, it is determined whether to send a second tool cutting preparation instruction. The preparation parameter optimization analysis includes auxiliary gas pressure optimization analysis and tool cutting power optimization analysis. The anti-adhesion error analysis is used to quantify the anti-adhesion performance corresponding to the plate sample after the first tool cutting preparation is completed.

2. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 1, characterized in that: The offset analysis of the coordinate position of the plate to be prepared is performed based on the obtained correction parameters, and the specific steps include: Obtain the difference between the X-direction offset and the maximum allowable X-direction offset in the database, and perform compensation correction based on the introduced X-direction offset correction to obtain the X-direction offset correlation score; Obtain the difference between the Y-direction offset and the maximum allowable Y-direction offset in the database, and perform compensation correction based on the introduced Y-direction offset correction to obtain the Y-direction offset correlation score; Obtain the degree of difference between the rotation angle offset and the maximum allowable rotation angle offset in the database, and perform compensation correction based on the introduced rotation angle offset correction to obtain a rotation angle offset correlation score; The obtained X-direction offset correlation score and Y-direction offset correlation score are subjected to geometric averaging and coupled with the rotation angle offset correlation score to obtain a coordinate offset analysis value, which is used to quantify the degree of coordinate position offset of the correction parameter to the plate to be prepared within a preset analysis period.

3. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 2, characterized in that: The specific process of determining whether to determine the number of plates to be prepared based on the offset analysis results is as follows: If the obtained coordinate offset analysis value is not greater than the coordinate offset analysis value preset in the database, the offset analysis result is recorded as qualified positioning of the plate to be prepared and the number of plates to be prepared is determined; If the obtained coordinate offset analysis value is greater than the coordinate offset analysis value preset in the database, the offset analysis result is recorded as unqualified positioning of the plate to be prepared and a gain parameter optimization analysis is performed; The gain parameters include position loop gain and speed loop gain; The position loop gain is used to control the followability of the servo motor corresponding to the plate to be prepared to the position command to improve the positioning accuracy and response speed; The speed loop gain is used to control the stability of the servo motor speed corresponding to the plate to be prepared to suppress speed fluctuations.

4. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 3, characterized in that: The specific process of the gain parameter optimization analysis is as follows: Based on the obtained coordinate offset analysis value deviation and position loop response speed deviation, the position loop gain reduction amplitude of the servo motor corresponding to the manufacturing machine tool is mapped in the database; If the speed loop response speed deviation obtained after the position loop gain is reduced once is not greater than the speed loop response speed deviation in the database, the speed loop gain reduction amplitude of the servo motor corresponding to the preparation machine tool is obtained based on the newly obtained coordinate offset analysis value deviation and the speed loop response speed deviation mapped in the database; If the coordinate offset analysis value deviation obtained again is not greater than 0 within the preset speed loop gain reduction times, a gain parameter optimization analysis completion instruction is sent and the number of plates to be prepared is determined. Otherwise, a preset personnel intervention is prompted. The coordinate offset analysis value deviation is used to quantify the degree of difference between the acquired coordinate offset analysis value and the preset coordinate offset analysis value; The position loop response speed deviation is used to quantify the difference between the actual position loop response speed obtained at the end of the preset analysis period of the plate to be prepared on the preparation platform and the reference position loop response speed in the database; The speed loop response speed deviation is used to quantify the degree of difference between the actual speed loop response speed obtained at the end of a preset analysis period for a plate to be prepared on the preparation platform and the reference speed loop response speed in the database.

5. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 4, characterized in that: The specific process of determining the number of plates to be prepared is as follows: If the number of plates to be prepared is 1, it is determined to be a single plate to be prepared and the safety spacing of the single plate to be prepared in the corresponding placement area on the preparation platform is obtained. At the same time, based on the obtained safety spacing deviation, it is determined whether to send a plate fixed position adjustment instruction; If the number of plates to be prepared is not 1, it is determined that there are multiple plates to be prepared and the overlapping area of the multiple plates to be prepared in the corresponding placement area on the preparation platform is obtained. At the same time, based on the obtained overlapping area deviation, it is determined whether to send a plate placement order adjustment instruction and obtain the preparation data.

6. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 5, characterized in that: The preparation stability analysis of the laser preparation process of the plate to be prepared is performed based on the obtained preparation data, and the specific steps include: The obtained coordinate offset analysis value is compensated and corrected by the introduced coordinate offset analysis value correction amount to obtain the coordinate offset analysis value coefficient; The relative difference between the actual cutting speed obtained and the reference cutting speed in the database is compensated and corrected by introducing a cutting speed correction amount to obtain a cutting speed-related score; When the obtained safety distance is not less than the safety distance setting value in the data, the obtained coordinate offset analysis value coefficient, the cutting speed related score and the safety distance related score are linearly coupled to obtain a first preparation stability analysis value. The first preparation stability analysis value is used to quantify the degree of interference of the first preparation parameter on the preparation stability of the single sheet to be prepared; The safety distance related score represents the result of the safety distance correction amount correcting the difference between the obtained safety distance and the safety distance setting value in the data; When the obtained overlapping area is not greater than the overlapping area setting value in the database, the obtained coordinate offset analysis value coefficient, the cutting speed related score, and the overlapping area related score are linearly coupled to obtain a second preparation stability analysis value, which is used to quantify the degree of interference of the second preparation parameter on the preparation stability of the multi-plate material to be prepared; The overlap area correlation score represents a result of correcting the overlap area correction amount for the degree of difference between the acquired overlap area and the overlap area set value in the data.

7. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 6, characterized in that: The specific process of determining whether to perform preparation parameter optimization analysis based on the preparation stability analysis results is as follows: If the obtained preparation stability analysis value is not greater than the preparation stability analysis value preset in the database, the preparation stability analysis result is recorded as qualified and a plate sample is obtained, and an anti-sticking error analysis is performed at the same time; If the obtained preparation stability analysis value is greater than the preparation stability analysis value preset in the database, the preparation stability analysis result is recorded as preparation failure and preparation parameter optimization analysis is performed; The preparation parameters include auxiliary gas pressure and tool cutting power.

8. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 7, characterized in that: The specific process of the preparation parameter optimization analysis is as follows: Based on the obtained preparation stability analysis value deviation and tool cutting pressure deviation, the auxiliary gas pressure reduction amplitude of the corresponding servo motor of the preparation machine tool is mapped in the database; If the plate offset reduction amplitude obtained after the auxiliary gas pressure is reduced once is not less than the corresponding preset reduction amplitude, the re-acquired preparation stability analysis value deviation and the plate horizontal offset are input into the PID control algorithm of the corresponding servo motor of the preparation machine tool to output the tool cutting power reduction amplitude; If the deviation of the re-acquired preparation stability analysis value is not greater than 0 within the preset number of times the tool cutting power is reduced, the preparation parameter optimization analysis is completed and an anti-stick error analysis instruction is sent; otherwise, a monitoring warning instruction is sent; The reduction range of the tool cutting power is used to reduce the cutting power of the tool cutting head corresponding to the plate to be prepared so as to reduce the plate offset; The preparation stability analysis value deviation is used to quantify the degree of difference between the obtained preparation stability analysis value and the preset preparation stability analysis value; The tool cutting pressure deviation is used to quantify the difference between the actual tool cutting pressure corresponding to the plate to be prepared at the end of a preparation period and the tool cutting pressure setting value in the database; The plate horizontal offset is used to quantify the difference between the actual horizontal offset of the plate to be prepared in the corresponding horizontal direction at the end of a preparation period and the horizontal offset set value in the database.

9. The analysis system based on the preparation data of the anti-adhesion blade coating according to claim 1, characterized in that: The specific process of determining whether to send a secondary tool cutting preparation instruction based on the anti-adhesion error analysis result is as follows: When the obtained anti-stick error analysis judgment value is within the allowable range of the anti-stick error analysis judgment value in the database, a local repair instruction is sent and a laser pulse duty cycle optimization analysis is performed; When the obtained anti-adhesion error analysis judgment value is less than the minimum value of the historical anti-adhesion error analysis judgment values in the database, a qualified instruction for the plate sample is sent; When the obtained anti-stick error analysis judgment value is greater than the maximum value of the historical anti-stick error analysis judgment values in the database, a secondary tool cutting preparation instruction is sent; The anti-stick error analysis judgment value represents the result of harmonic averaging the width of the heat-affected zone, the length of the bottom burr, and the length of the residual slag on the surface of the plate to be prepared after one tool cutting preparation is completed; The laser pulse duty cycle optimization means adjusting the laser energy output of the corresponding tool cutting head after one tool cutting by adjusting the amplitude of the acquired laser pulse duty cycle; The laser pulse duty cycle adjustment amplitude represents the result of inputting the obtained anti-stick error analysis determination value deviation and laser pulse frequency deviation into the tool cutting head PID control algorithm.

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