Wafer bonding scheduling method, system and equipment

Abstract

The invention provides a wafer bonding scheduling method, system and equipment. The method comprises the following steps: acquiring a technological process of a current wafer; if the process of the chamber unit where the current wafer is located is completed, judging whether the number of rear chamber units of the chamber unit where the current wafer is located is zero or not according to the process flow; if the current wafer is zero, taking the current wafer and putting the current wafer into a wafer box; if not, whether the real-time state of the rear first chamber unit of the chamber unit is empty or not is judged, or whether the real-time state of the rear first chamber unit is empty or not when the manipulator completes sheet taking from the chamber unit is judged; and if the current wafer is empty, the manipulator is controlled to take the current wafer and place the current wafer in the rear first chamber unit. According to the embodiment of the invention, one-time wafer transfer of all wafers does not need to be carried out after the processing technology of each chamber unit is completed, and parallel operation between the chamber technologies and between the chamber technologies and mechanical arm wafer transfer is carried out, so that the production efficiency of the whole machine is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor process equipment, and in particular, to a wafer bonding scheduling method, system and device. Background Art

[0002] In the wafer bonding process, generally two wafers are adhered face to face, and certain pressure, temperature, voltage, etc. are applied to the two wafers, so that covalent bonds, metal bonds, molecular bonds, etc. are generated at the interface of the two wafers, and then the two wafers are combined into one body to form a bonded wafer. For example, in polymer adhesive wafer bonding, an intermediate polymer is used to form a bond between the surfaces of two wafers. When the wafer interfaces are combined, the wafer interfaces are closely contacted by applying pressure to form a bonding force to keep the two wafers together.

[0003] When the traditional semiconductor equipment scheduling system executes the above wafer bonding process, it can only perform an overall wafer transfer after all unit processes are completed, and the production efficiency of the whole machine is not high. In addition, special chamber units need to be manually set with special scheduling logics, resulting in the need to formulate specific scheduling methods for specific equipment. Summary of the Invention

[0004] To solve the above problems, the present invention provides a wafer bonding scheduling method, which includes: obtaining the process flow of the current wafer; the process flow includes each chamber unit that the wafer needs to enter in sequence; if the process of the chamber unit where the current wafer is located is completed, it is judged whether the number of subsequent chamber units of the chamber unit where it is located is zero according to the process flow; if it is zero, the manipulator is controlled to pick up the current wafer from the chamber unit where it is located and place it in a cassette; if it is not zero, it is judged whether the real-time state of the first subsequent chamber unit of the chamber unit where it is located is empty or whether the real-time state of the first subsequent chamber unit is empty when the manipulator finishes picking up the wafer from the chamber unit where it is located; if it is empty, the manipulator is controlled to pick up the current wafer and place it in the first subsequent chamber unit.

[0005] The wafer bonding scheduling method provided by the embodiment of the present invention can perform wafer transfer based on whether the first subsequent chamber unit is in an idle state. If the first subsequent chamber unit is empty, the wafer can be picked up from the current chamber unit and placed in the first subsequent chamber unit, without waiting for all the processing processes of each chamber unit to be completed before performing a one-time transfer of all wafers. The chamber processes and the manipulator wafer transfer run in parallel, thereby improving the production efficiency of the whole machine.

[0006] Optionally, there is only one said manipulator, and the method further includes: if the post-positioned first chamber unit is a pre-alignment unit, determining whether the real-time state of the post-positioned second chamber unit is empty; in the case where the real-time state of the post-positioned second chamber unit is empty, performing the step of controlling the manipulator to pick up the current wafer and place it in the post-positioned first chamber unit.

[0007] The embodiment of the present invention formulates corresponding scheduling logics for chamber units that require special scheduling due to process requirements, improving the production efficiency of the whole machine.

[0008] Optionally, there is only one said manipulator, and the method further includes: if the post-positioned first chamber unit is a hot plate, determining whether the sum of the process time and the wafer transfer time of the post-positioned second chamber unit is less than the process time of the hot plate; if it is less, performing the step of controlling the manipulator to pick up the current wafer and place it in the post-positioned first chamber unit.

[0009] The embodiment of the present invention formulates corresponding scheduling logics for chamber units that require special scheduling due to process requirements, improving the production efficiency of the whole machine.

[0010] Optionally, if it is not zero, the method further includes: if the post-positioned first chamber unit of the chamber unit where it is located is an alignment unit, determining whether the number of wafers in the alignment unit is less than two; if it is less than two, performing the step of controlling the manipulator to pick up the current wafer and place it in the post-positioned first chamber unit.

[0011] The embodiment of the present invention formulates corresponding scheduling logics for chamber units that require special scheduling due to process requirements, improving the production efficiency of the whole machine.

[0012] Optionally, there are multiple said manipulators, and the method further includes: determining whether the post-positioned m-th chamber unit meets the following time condition:

[0013] RT PM(n+m) ≤T Pick +(m - 1)TT

[0014] where RT represents the remaining process time of the chamber unit, RT PM(n+m) represents the remaining process time of the chamber unit PM n+m ; TT represents the wafer transfer time, and T Pick represents the wafer picking time when the manipulator picks up a wafer from the PM n of the chamber unit where it is located; if it is met, performing the step of controlling the manipulator to pick up the current wafer and place it in the post-positioned first chamber unit.

[0015] The embodiments of the present invention provide specific scheduling schemes for two application scenarios of a wafer bonding device with a single robot arm and multiple robot arms respectively, realizing parallel operation between chamber processes and between chamber processes and wafer transfer by the robot arm, and improving the production efficiency of the whole machine.

[0016] Optionally, the method further includes: after the process of the wafer in the first post-chamber unit is completed, controlling another robot arm to pick up the wafer in the first post-chamber unit and place it in the second post-chamber unit.

[0017] In the application scenario of the wafer bonding device with multiple robot arms in the embodiments of the present invention, the wafer transfer by multiple robot arms runs in parallel, improving the production efficiency of the whole machine.

[0018] Optionally, the method further includes: if the number of post-chamber units of the chamber unit where the wafer is located is one and the real-time state of the post-chamber unit is empty, then execute the step of controlling the robot arm to pick up the current wafer and place it in the first post-chamber unit.

[0019] In the embodiments of the present invention, when there is only one post-chamber unit and its real-time state is empty, the robot arm can be controlled to pick up the current wafer and place it in the first post-chamber unit.

[0020] Optionally, the method further includes: if there are multiple chamber units where the wafer is located that meet the pick-up operation conditions at the same time, then determine the chamber unit for priority pick-up according to the priority of the chamber unit or the priority of the wafer in the chamber unit.

[0021] In the embodiments of the present invention, when there are multiple wafers to be picked up, the control logic for determining the pick-up order by using the priority of the chamber unit or the priority of the wafer improves the production efficiency of the whole machine.

[0022] The embodiments of the present invention provide a wafer bonding scheduling system, which is used to execute the wafer bonding scheduling method described in any one of the above.

[0023] The embodiments of the present invention provide a wafer bonding scheduling device, including the above wafer bonding scheduling system.

[0024] The above wafer bonding scheduling system and wafer bonding scheduling device provided by the embodiments of the present invention can achieve the same technical effects as the wafer bonding scheduling method. Description of the Drawings

[0025] To more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the accompanying drawings required for the description of the embodiments or the prior art. Obviously, the accompanying drawings in the following description are only the embodiments of the present invention. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained according to the provided drawings.

[0026] Figure 1 It is a schematic structural diagram of a wafer bonding device;

[0027] Figure 2 It is a schematic diagram of the specific process flow of the wafer bonding device;

[0028] Figure 3 It is a schematic flow diagram of a wafer bonding scheduling method provided by an embodiment of the present invention. Detailed implementation manners

[0029] To make the above objects, features, and advantages of the present invention more obvious and understandable, the following will describe the specific embodiments of the present invention in detail with reference to the accompanying drawings. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0030] Figure 1 It shows a schematic structural diagram of a wafer bonding device, and the wafer bonding device includes a cassette 1, a cassette 2, a pre-alignment unit 3, a glue coating unit 4, a hot plate unit 5, a cold plate unit 6, an alignment unit 7, and a manipulator 8.

[0031] Figure 2 It shows a schematic diagram of the specific process flow of the wafer bonding device, specifically as follows:

[0032] The manipulator takes out the upper wafer from the cassette and places it in the pre-alignment unit for edge inspection operation, then enters the glue coating unit to form an intermediate layer by spin coating, then enters the hot plate unit for high-temperature pyrolysis, enters the cold plate unit for cooling, enters the pre-alignment unit for edge inspection, and finally enters the upper layer of the alignment unit.

[0033] The lower wafer enters the lower layer of the alignment through the same process flow as the upper wafer.

[0034] In the alignment unit, precise alignment and bonding of wafer to wafer are achieved through the SmartView method of intelligent vision. After the bonded wafers are inspected for edges through the pre-alignment unit, they are transferred to the cassette.

[0035] Traditional semiconductor equipment scheduling systems can only perform a single overall wafer transfer after all units have completed processing, or develop specific scheduling methods for a single piece of equipment. The embodiments of the present invention provide a wafer bonding scheduling method applicable to most semiconductor equipment. Compared with traditional scheduling methods, the overall production efficiency of the machine is improved. In addition, corresponding methods are also developed for chamber units that require special scheduling due to process requirements.

[0036] In this embodiment, the system can pre-acquire the process time of each chamber unit. When the process of the chamber unit starts, a timer is set for the chamber unit, and the remaining process time is obtained by subtracting the timer time from the total process time. In this embodiment, the system can also pre-acquire the time for the robot to pick up and place wafers from and into the chamber unit.

[0037] Figure 3 FIG. is a schematic flow chart of a wafer bonding scheduling method provided by an embodiment of the present invention. The method includes the following steps:

[0038] S302, obtain the process flow of the current wafer.

[0039] The process flow may include each chamber unit that the wafer needs to enter in sequence, such as the identification of each chamber unit, the order in the process, the specific process, the corresponding process duration, etc.

[0040] S304, if the process of the chamber unit where the current wafer is located is completed, determine whether the number of subsequent chamber units of the chamber unit where the current wafer is located is zero according to the process flow. If it is zero, execute S306; if it is not zero, execute S308.

[0041] After the process of the wafer in its chamber unit is completed, it is necessary to determine whether there are any subsequent chamber units that the wafer needs to enter in the process flow. If not, it means that the process flow is completed, and the robot transfers the current wafer to the cassette; if so, it is necessary to further determine whether the condition for transferring the current wafer to the subsequent chamber unit is met.

[0042] S306, control the robot to pick up the current wafer from the above-mentioned chamber unit and place it in the cassette.

[0043] S308, determine whether the real-time status of the first subsequent chamber unit of the above-mentioned chamber unit is empty or whether the real-time status of the first subsequent chamber unit is empty when the robot finishes picking up the wafer from the chamber unit where it is located.

[0044] Among them, the first subsequent chamber unit refers to the chamber unit that is after and adjacent to the chamber unit where it is located in the above-mentioned process flow.

[0045] In one case of this embodiment, if the real-time status of the rear first chamber unit is empty, the current wafer can be directly transferred to the rear first chamber unit. In another case of this embodiment, since it takes a certain amount of time for the robot to grab the current wafer, other wafers in the above-mentioned rear first chamber unit can be grabbed synchronously during the grabbing process, and the real-time status of the rear first chamber unit is guaranteed to be empty at the moment when the current wafer is grabbed, thereby meeting the demand for the current wafer transfer, and the current wafer can be subsequently transferred to the rear first chamber unit.

[0046] There may be one or more manipulators in the wafer bonding equipment. When there are multiple manipulators, the above-mentioned action of synchronously grabbing multiple wafers can be performed.

[0047] S310, if it is empty, control the robot arm to take the current wafer and place it into the above-mentioned rear first chamber unit.

[0048] If any of the above two conditions are met, the robot can be controlled to take the current wafer and place it in the above first rear chamber unit. If it is not empty, and the above two conditions are not met, the current wafer will wait in the chamber unit where it is located, and the wafer taking operation will be performed after the above conditions are met.

[0049] As a specific case, if the number of the rear chamber unit of the above chamber unit is one, and the real-time status of the rear chamber unit is empty, the step of controlling the robot to place the current wafer into the rear first chamber unit can be executed.

[0050] The wafer bonding scheduling method provided in the embodiment of the present invention can transfer wafers based on whether the rear first chamber unit is idle. If the rear first chamber unit is empty, the wafer can be taken from the current chamber unit and placed in the rear first chamber unit. There is no need to wait for the processing processes of each chamber unit to be completed before transferring all wafers at one time. The chamber processes and the chamber processes and the robot transfer can run in parallel, thereby improving the production efficiency of the whole machine.

[0051] The embodiments of the present invention provide specific scheduling solutions for two application scenarios: a wafer bonding device having a single robot and a plurality of robots, respectively, and also formulate corresponding scheduling logic for chamber units that require special scheduling due to process requirements.

[0052] The prerequisites for the scheduling scheme are as follows: the system can obtain the process time of each chamber unit in advance. At the beginning of the chamber unit process, a timer is set for the chamber unit, and the remaining process time is obtained by subtracting the timer time from the total process time. In addition, the time for the robot to take and put the wafer in the chamber unit is obtained in advance.

[0053] For the case of only one robot, the details are as follows:

[0054] 1. Number of post - units = 0

[0055] When the process of a certain unit (PM n ) is completed and the number of post - units of this unit is 0, the manipulator picks up a wafer from the unit (PM n ) and places it into the cassette.

[0056] 2. Number of post - units = 1

[0057] When the process of a certain unit (PM n ) is completed and there is no wafer in the first post - unit (PM n+1 ). At this time, pick up the wafer of the current unit (PM n ) and place it into the first post - unit (PM n+1 ).

[0058] 3. Number of post - units >= 2

[0059] 1) When the process of a certain unit (PM n ) is completed and the first post - unit (PM n+1 ) is not a special unit and has no wafer. At this time, pick up the wafer of the current unit (PM n ) and place it into the first post - unit (PM n+1 ). The chamber unit needs to meet the following conditional formula:

[0060]

[0061] Where Wafer represents the number of wafers in the chamber unit, and PM n+1 represents the (n + 1) - th chamber unit.

[0062] In this embodiment, the special units include the pre - alignment unit, the alignment unit, and the hot plate. The pre - alignment unit has a high usage frequency and a short process time, about 5S. Therefore, it is necessary to ensure that the wafer on the pre - alignment unit can be picked up immediately after the process is completed, and the pre - alignment unit cannot be occupied. For the hot plate unit, due to special process requirements, the wafer needs to be picked up immediately after the process is completed, otherwise the residence time of the wafer in the hot plate is too long, affecting the process parameters of the adhesive intermediate layer. The alignment bonding process starts only when there are wafers on both the upper and lower sides, and other units only require one wafer for the process.

[0063] 2) When the process of a certain unit (PM n ) is completed and the first post - unit (PM n+1 ) is the pre - alignment unit.

[0064] In this embodiment, if the rear first chamber unit is a pre-alignment unit, it is determined whether the real-time status of the rear second chamber unit is empty; if the real-time status of the rear second chamber unit is empty, the above-mentioned step of controlling the manipulator to place the current wafer into the rear first chamber unit is executed. If the rear first chamber unit is a pre-alignment unit, the real-time status of the rear second chamber unit needs to be empty, so as to ensure that the wafer of the pre-alignment unit can be transferred to the rear second chamber unit in time.

[0065] When the first unit (PM n+1 ), the second unit at the rear (PM n+2 ) There is no wafer. At this time, the robot grabs the wafer of the current unit and puts it into the pre-alignment unit (PM n+1 ), wait for the pre-alignment unit process to be completed, the robot grabs the wafer of the pre-alignment unit and puts it into the second unit (PM n+2 ). The chamber unit needs to meet the following conditional formula:

[0066]

[0067] 3) A unit (PM n ) process is completed, and the first unit (PM n+1 ) is a hot plate.

[0068] In this embodiment, if the rear first chamber unit is a hot plate, it is determined whether the sum of the process time and the wafer transfer time of the rear second chamber unit is less than the process time of the hot plate; if it is less, the step of controlling the robot to take the current wafer and place it in the rear first chamber unit is executed. It should be noted that when the rear second chamber unit is empty, its process time is zero.

[0069] When the rear first chamber unit is a hot plate, consider whether the sum of the process time and the wafer transfer time is less than the process time of the hot plate. If so, it can ensure that the wafer on the hot plate can be transferred to the rear second chamber unit in time.

[0070] When PM n The unit state satisfies formula (1), and the robot moves from PM n After taking the film, put it into the first unit (PM n+1 ). This condition ensures that when the hot plate (PM n+1 ) When the process is completed, PM n+2 No wafer on the hot plate (PM n+1 ) can be immediately removed and placed in the PM n+2 The chamber unit must satisfy the following conditional formula:

[0071]

[0072] Where Wafer represents the number of wafers in the unit chamber. For example, Wafer PM(n+1) represents PM n+1 the number of wafers in the unit; PT represents the process time of the unit chamber. For example, PT PM(n+1) represents the process time of the unit chamber PM n+1 ; RT represents the remaining process time of the unit chamber. For example, RT PM(n+2) represents the remaining process time of the unit chamber PM n+2 ; TT represents the wafer transfer time, and the wafer transfer time = wafer pickup time + wafer placement time.

[0073] 4) After the process of a certain unit (PM n ) is completed, the first unit behind (PM n+1 ) is the alignment unit.

[0074] If the first chamber unit behind the unit in the chamber is the alignment unit, then determine whether the number of wafers in the alignment unit is less than two; if less than two, execute the step of controlling the manipulator to pick up the current wafer and place it in the first chamber unit behind. The alignment unit can accommodate two wafers, and when the number of wafers is less than two, wafer transfer to the alignment unit is allowed.

[0075] When the process of a certain unit (PM n ) is completed, the first unit behind (PM n+1 ) is the alignment unit and the number of wafers < 2. At this time, the manipulator grabs the wafer of the current unit (PM n ) and places it in the first unit behind (PM n+1 ). The chamber unit needs to meet the following conditional formula:

[0076] Wafer PM(n+1) <2.

[0077] 5) If there are multiple chamber units where the wafer pickup operation conditions are met simultaneously, determine the chamber unit for priority wafer pickup according to the priority of the chamber units or the priority of the wafers in the chamber units.

[0078] For the case of multiple manipulators, it is as follows:

[0079] 1. The number of units behind = 0

[0080] When the process of a certain unit (PM n ) is completed and the number of units behind is 0. The manipulator picks up the wafer from the unit (PM n ) and places it in the cassette.

[0081] 2. The number of units behind >= 1

[0082] 1) When a certain unit (PM n) The process is completed, and each subsequent unit satisfies the following conditional formula until a unit without a wafer is encountered. At this time, the robot grabs the wafer of the current unit.

[0083] RT PM(n+m) ≤T Pick +(m - 1)TT

[0084] Where RT represents the remaining process time of the chamber unit, RT PM(n+m) represents the remaining process time of the chamber unit PM n+m ; TT represents the wafer transfer time, and T Pick represents the wafer pickup time when the robot picks up the wafer from the chamber unit PM n . PM n+m represents the m-th subsequent unit, and the wafer transfer time = wafer pickup time + wafer placement time. When there is no wafer or only one wafer in the alignment unit, the remaining processing time is defaulted to 0. When there is no wafer in other units, the remaining processing time is defaulted to 0.

[0085] After the process of the wafer in the first subsequent chamber unit is completed, control another robot to pick up the wafer of the first subsequent chamber unit and place it in the second subsequent chamber unit.

[0086] Exemplarily, the grasping of robot 1 and the PM n+1 process are carried out in parallel. Robot 1 grabs the wafer of the current unit (PM n ). When robot 1 finishes grasping, the PM n+1 process has been completed. Then robot 2 grabs the wafer of the subsequent unit (PM n+1 ). After robot 2 finishes grasping, robot 1 puts the grabbed wafer into the first subsequent unit (PM n+1 ). And so on, until a PM n+m+1 without a wafer is encountered. The detailed wafer pickup and placement steps are shown in Table 1.

[0087] <![CDATA[PM n > <![CDATA[PM n+1 > <![CDATA[PM n+2 > …… <![CDATA[PM n+m > <![CDATA[PM n+m+1 (Empty film)]]> <![CDATA[Take PM n wafer]]> <![CDATA[Take PM n+1 wafer]]> <![CDATA[Place PM n wafer]]> <![CDATA[Take PM n+2 wafer]]> <![CDATA[Put PM n+1 wafer]]> …… <![CDATA[Take PM n+m wafer]]> <![CDATA[Put PM n+m-1 wafer]]> <![CDATA[Put PM n+m wafer]]>

[0088] Table 1

[0089] As shown in Table 1, the unit PM n+m+1 is empty. Take out the wafer in the unit PM n+m and place it in this unit PM n+m+1 . After taking out the wafer in the unit PM n+m , put it into the wafer taken out from the unit PM n+m-1 . After taking out the wafer in the unit PM n+m-1 , put it into the wafer taken out from the unit PM n+m-2 . And so on. The above process can run in parallel.

[0090] An embodiment of the present invention implements a scheduling method applicable to most semiconductor devices through a computer program. Compared with traditional scheduling methods, the overall production efficiency of the machine is improved. In addition, corresponding methods are also formulated for chamber units that require special scheduling due to process requirements. Compared with traditional serial scheduling methods, the embodiment of the present invention realizes parallel operation between chamber processes and between chamber processes and robot wafer transfer, improving the overall production efficiency of the machine and bringing huge economic benefits to users.

[0091] An embodiment of the present invention provides a wafer bonding scheduling system, which is used to execute the above-mentioned wafer bonding scheduling method.

[0092] An embodiment of the present invention provides a wafer bonding scheduling device, including the above-mentioned wafer bonding scheduling system.

[0093] Although the present invention is disclosed as above, the present invention is not limited thereto. Any person skilled in the art can make various changes and modifications without departing from the spirit and scope of the present invention. Therefore, the protection scope of the present invention should be subject to the scope defined by the claims.

[0094] Finally, it should also be noted that in this document, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variation thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising a..." does not exclude the existence of additional identical elements in the process, method, article or device including the element.

[0095] In this specification, the various embodiments are described in a progressive manner. The key point of each embodiment is to illustrate the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other. For the wafer bonding scheduling device disclosed in the embodiment, since it corresponds to the wafer bonding scheduling method disclosed in the above embodiment, the description is relatively simple, and the relevant parts can be referred to the description of the method part.

[0096] The foregoing description of the disclosed embodiments enables those skilled in the art to implement or use the present invention. Various modifications to these embodiments will be readily apparent to those skilled in the art, and the general principles defined herein may be implemented in other embodiments without departing from the spirit or scope of the present invention. Thus, the present invention is not intended to be limited to the embodiments shown herein but is to be accorded the widest scope consistent with the principles and novel features disclosed herein.

Claims

1. A wafer bonding scheduling method, characterized in that, The method includes: Obtaining the process flow of the current wafer; the process flow includes each chamber unit that the wafer needs to enter in sequence; If the process of the chamber unit where the current wafer is located is completed, determine whether the number of subsequent chamber units of the chamber unit where the wafer is located is zero according to the process flow; If it is zero, control the manipulator to pick up the current wafer from the chamber unit and place it in the cassette; If it is not zero, determine whether the real-time state of the first subsequent chamber unit of the chamber unit where the wafer is located is empty or whether the real-time state of the first subsequent chamber unit is empty when the manipulator finishes picking up the wafer from the chamber unit where the wafer is located; If it is empty, control the manipulator to pick up the current wafer and place it in the first subsequent chamber unit.

2. The method according to claim 1, characterized in that, There is only one such manipulator, and the method further includes: If the first subsequent chamber unit is a pre-alignment unit, determine whether the real-time state of the second subsequent chamber unit is empty; In the case where the real-time state of the second subsequent chamber unit is empty, perform the step of controlling the manipulator to pick up the current wafer and place it in the first subsequent chamber unit.

3. The method according to claim 1, characterized in that, There is only one such manipulator, and the method further includes: If the first subsequent chamber unit is a hot plate, determine whether the sum of the process time and the wafer transfer time of the second subsequent chamber unit is less than the process time of the hot plate; If it is less, perform the step of controlling the manipulator to pick up the current wafer and place it in the first subsequent chamber unit.

4. The method according to claim 1, wherein If it is not zero, the method further includes: If the first subsequent chamber unit of the chamber unit where the wafer is located is an alignment unit, determine whether the number of wafers in the alignment unit is less than two; If it is less than two, perform the step of controlling the manipulator to pick up the current wafer and place it in the first subsequent chamber unit.

5. The method according to claim 1, characterized in that, There are multiple such manipulators, and the method further includes: Determine whether the m-th subsequent chamber unit satisfies the following time condition: RT PM(n+m) ≤T Pick +(m - 1)TT Among them, RT represents the remaining process time of the chamber unit, RT PM(n+m) represents the remaining process time of the chamber unit PM n+m ; TT represents the wafer transfer time, T Pick represents the wafer pick-up time of the robot from the chamber unit PM n where the wafer is picked up; If it is satisfied, perform the step of controlling the manipulator to pick up the current wafer and place it in the first subsequent chamber unit.

6. The method according to claim 5, characterized in that, The method further includes: After the process of the wafer in the first subsequent chamber unit is completed, control another manipulator to pick up the wafer in the first subsequent chamber unit and place it in the second subsequent chamber unit.

7. The method according to claim 1, wherein The method further includes: If the number of subsequent chamber units of the chamber unit where the wafer is located is one, and the real-time state of the subsequent chamber unit is empty, perform the step of controlling the manipulator to pick up the current wafer and place it in the first subsequent chamber unit.

8. The method according to claim 1, characterized in that, The method further includes: If there are multiple chamber units where the wafer is located that satisfy the wafer picking operation condition at the same time, determine the chamber unit for priority wafer picking according to the priority of the chamber unit where the wafer is located or the priority of the wafers in the chamber unit where the wafer is located.

9. A wafer bonding scheduling system, characterized in that, The system is used to execute the wafer bonding scheduling method according to any one of claims 1-8 above.

10. A wafer bonding scheduling device, characterized in that, It includes the wafer bonding scheduling system according to claim 9.

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