Wafer clamping mechanism and wafer cleaning machine

Abstract

The invention relates to the technical field of wafer cleaning, in particular to a wafer clamping mechanism and a wafer cleaning machine.The wafer clamping mechanism comprises a base table, a control table is fixedly installed at the right end of the upper surface of the base table, a ventilation box is fixedly installed at the upper end of a machine cover, a ventilation mechanism is fixedly installed in the ventilation box, and a cleaning box is fixedly installed at the upper end of a boss; a spraying mechanism is arranged on the right surface of the cleaning box, a heating mechanism is arranged at the lower end of the wafer tray of the drying cylinder, three wafer limiting mechanisms arranged at equal angles are fixedly installed on the upper surface of the drying cylinder and located on the outer side of the wafer tray, and a wafer clamping mechanism is fixedly installed on the upper surface of the base and located on the outer side of the control table. Most moisture is thrown away by rotating the wafer, meanwhile, pure water and isopropanol steam are sprayed to the surface of the wafer through the nozzle, surface moisture is replaced through low surface tension and high volatility of IPA, and compared with a traditional rotary drying technology and a Margari drying technology, formation of water stains is reduced, and the cleanliness of the surface of the wafer is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of wafer cleaning, and particularly to a wafer clamping mechanism and a wafer cleaning machine. Background Art

[0002] A wafer is an ultra-pure and ultra-flat single-crystalline silicon wafer, usually in the shape of a circular thin sheet. It is made of high-purity silicon material through a series of complex processes.

[0003] Contaminants such as tiny particles, organic substances, metal ions or oxide residues on the wafer surface can cause problems such as pattern defects, ion implantation defects, insulation film breakdown defects, and transistor instability in semiconductor devices, thereby affecting the yield and reliability of the devices.

[0004] The particulate contaminants on the wafer surface may affect the accuracy of the lithography pattern, resulting in pattern defects. Cleaning can remove these particles to ensure the smooth progress of subsequent processes. The cleaned wafer reduces the defects caused by surface contamination, reduces the repeated processing time due to defect repair, and improves production efficiency.

[0005] The following deficiencies exist in the prior art:

[0006] 1. In the prior art, some use the method of spin drying, which has the advantages of simple equipment structure and low price. However, when the wafer rotates at high speed, static electricity is easily generated, which will cause dust or other particles to be adsorbed on the wafer surface, affecting subsequent processes.

[0007] 2. Using IPA drying is beneficial to ensuring the integrity of the wafer pattern. However, during the drying process, due to the uneven distribution of the wafer surface temperature and IPA vapor concentration, the drying effect is uneven. The IPA drying method requires the use of a large amount of explosive chemicals, poses a high safety risk, and requires the treatment of more organic waste gases and waste water, which has a greater impact on the environment.

[0008] 3. When using the Marangoni drying technology for drying, the water is mainly removed by the Marangoni convection generated by the surface tension gradient when the wafer is slowly pulled out of the water. This drying process is relatively slow, and when a large number of wafers need to be processed, the processing efficiency is seriously affected. Summary of the Invention

[0009] The purpose of the present invention is to solve the disadvantages in the background art and propose a wafer clamping mechanism and a wafer cleaning machine.

[0010] To achieve the above object, the technical solution adopted by the present invention is: a wafer clamping mechanism and a wafer cleaning machine, including a base. A control console is fixedly installed at the right end of the upper surface of the base. A machine cover is fixedly installed at the upper end of the base where the control console is located. A plurality of hinge seats are rotatably installed between the base and the machine cover. A protective door is rotatably installed on the relatively inner sides of every two hinge seats. A ventilation box is fixedly installed at the upper end of the machine cover. A ventilation mechanism is fixedly installed inside the ventilation box. A convex platform is fixedly installed on the left side of the upper surface of the base. A cleaning box is fixedly installed at the upper end of the convex platform. A spraying mechanism is provided on the right surface of the cleaning box. An installation plug board is fixedly installed on the right side of the upper surface of the base. Two wafer boxes are symmetrically installed at the upper end of the installation plug board. A drying cylinder is provided between the cleaning box and the wafer boxes at the upper end of the base. A wafer tray is fixedly installed on the upper surface of the drying cylinder. A heating mechanism is provided at the lower end of the wafer tray of the drying cylinder. Three wafer limiting mechanisms arranged at equal angles are fixedly installed on the upper surface of the drying cylinder outside the wafer tray. A wafer clamping mechanism is fixedly installed on the upper surface of the base outside the control console;

[0011] The wafer clamping mechanism includes a clamping base fixedly installed on the upper surface of the base. A lifting table is provided at the upper end of the clamping base. A front rotating table is fixedly installed at the front end of the lifting table.

[0012] Preferably, the spraying mechanism includes a mounting plate fixedly installed on the right side surface of the cleaning box. A spraying pipe is fixedly installed at the upper end of the outer surface of the mounting plate. A jet pipe is fixedly installed at the lower end of the spraying pipe. A limiting frame is fixedly installed at the same position outside the outer surface of the mounting plate between the spraying pipe and the jet pipe.

[0013] Preferably, the ventilation mechanism includes an impurity removal water tank fixedly installed outside the ventilation box. Filter baffle plates are fixedly installed on the front and rear outer surfaces of the ventilation box. Dust suction curtains are fixedly installed at the rear ends of the filter baffle plates inside the ventilation box. Two symmetric fans are fixedly installed at the lower end inside the ventilation box. A lower dust-proof net is fixedly installed at the lower end of the ventilation box. A hanging rack is fixedly installed at the lower end of the machine cover where the lower dust-proof net is located.

[0014] Preferably, the wafer clamping mechanism includes a rotating arm rotatably installed at the outer end of the front rotating table. A supporting arm is rotatably installed at the outer end of the rotating arm. Rotating motors penetrating through the rotating arm are fixedly installed on the upper and lower surfaces of the front rotating table. Rotating motors are fixedly installed on the upper and lower outer surfaces of the rotating arm at the connection between the rotating arm and the supporting arm.

[0015] Preferably, a clamping plate is fixedly installed at the outer end of the supporting arm. A telescopic motor is fixedly installed at the rear end of the lower surface of the clamping plate. A moving limiting plate is fixedly installed at the output end of the telescopic motor. Two symmetric front limiting plates are rotatably installed at the outer end of the lower surface of the clamping plate. Card slots are opened on the relatively inner surfaces of the front limiting plate and the moving limiting plate.

[0016] Preferably, symmetric lifting tracks are fixedly installed on the upper surface of the base at the rear side of the lifting table. A lifting motor is fixedly installed between the lifting tracks. The upper end of the lifting motor is fixedly installed with a moving table, and the moving table is fixedly installed on the rear surface of the lifting table.

[0017] Preferably, the wafer limiting mechanism includes three equally-angled arranged moving tracks fixedly installed on the upper surface of the upper plate. A driving motor is fixedly installed at the relative outer end of each moving track. A limiting baffle is slidably installed at the output end of each driving motor, and all three moving tracks penetrate through the lower end of the wafer tray.

[0018] Preferably, the heating mechanism includes a drying box fixedly installed at the central position inside the drying cylinder. A heating plate is fixedly installed at the upper end of the drying box. Heating rods are fixedly installed on the lower surface of the inner wall of the drying box below the heating plate. A plurality of equally-spaced arranged heating coils are fixedly installed on the upper surface of the heating plate.

[0019] Preferably, a lower bracket is fixedly installed inside the base at the lower surface of the drying cylinder. The lower bracket is fixedly installed on the lower surface of the drying cylinder, and a centrifugal motor is fixedly installed at the central position of the lower surface of the drying cylinder. The output end of the centrifugal motor penetrates through the inner side of the drying cylinder.

[0020] Compared with the prior art, the present invention has the following beneficial effects:

[0021] 1. The present invention adopts the technical principles of rotary drying and Marangoni drying. Most of the water is removed by rotating the wafer, and at the same time, pure water and isopropyl alcohol vapor are sprayed onto the surface of the wafer by a nozzle. The low surface tension and high volatility of IPA are used to displace the surface water, reducing the formation of water stains compared with the traditional rotary drying and Marangoni drying technologies and improving the cleanliness of the wafer surface.

[0022] 2. The present invention is provided with a drying mechanism inside the drying cylinder. The heating rods are used in cooperation with the heating coils to increase the heating area. Hot air and hot steam are blown from the bottom of the wafer upwards, directly acting on the bottom surface of the wafer, accelerating the evaporation of water, quickly removing most of the water by high-speed rotation, reducing the drying time, and the hot air penetrates into the corners of the complex graphic structure to ensure thorough drying.

[0023] 3. The present invention is provided with a ventilation mechanism for ventilation. During the wafer drying process, especially during IPA vapor drying, if the ventilation efficiency is insufficient, IPA vapor will accumulate inside. The ventilation mechanism is provided with a dust-absorbing curtain for absorbing dust, avoiding external dust from falling into the processing equipment while ensuring the ventilation state. BRIEF DESCRIPTION OF THE DRAWINGS

[0024] Figure 1 It is a schematic structural diagram of a wafer clamping mechanism and a wafer cleaning machine of the present invention;

[0025] Figure 2 This is a schematic diagram of another perspective structure of a wafer clamping mechanism and a wafer cleaning machine according to the present invention;

[0026] Figure 3 This is a schematic diagram of the internal structure of a wafer clamping mechanism and a wafer cleaning machine according to the present invention;

[0027] Figure 4 This is a Figure 3 magnified view of part A in a wafer clamping mechanism and a wafer cleaning machine according to the present invention;

[0028] Figure 5 This is a schematic diagram of the structure of the clamping mechanism of a wafer clamping mechanism and a wafer cleaning machine according to the present invention;

[0029] Figure 6 This is a Figure 5 magnified view of part B in a wafer clamping mechanism and a wafer cleaning machine according to the present invention;

[0030] Figure 7 This is a schematic diagram of the structure of the drying mechanism of a wafer clamping mechanism and a wafer cleaning machine according to the present invention;

[0031] Figure 8 This is a sectional view of the structure of the drying mechanism of a wafer clamping mechanism and a wafer cleaning machine according to the present invention;

[0032] Figure 9 This is a sectional view of the ventilation mechanism of a wafer clamping mechanism and a wafer cleaning machine according to the present invention.

[0033] 1. Base; 2. Machine cover; 3. Ventilation box; 4. Cleaning box; 5. Protection door; 6. Control console; 7. Hinge seat; 8. Boss; 9. Installation plug board; 10. Wafer cassette; 11. Installation board; 12. Limit frame; 13. Spray pipe; 14. Air injection pipe; 101. Clamping base; 102. Lifting table; 103. Lifting motor; 104. Lifting track; 105. Front turntable; 106. Rotating motor; 107. Rotating arm; 108. Support arm; 109. Clamping plate; 110. Front limit plate; 111. Telescopic motor; 112. Moving limit plate; 113. Card slot; 114. Moving table; 201. Drying cylinder; 202. Lower bracket; 203. Centrifugal motor; 204. Upper plate; 205. Heating plate; 206. Drying box; 207. Heating rod; 208. Heating coil; 209. Wafer tray; 210. Driving motor; 211. Limit baffle; 212. Moving track; 301. Filter baffle; 302. Impurity removal water tank; 303. Fan; 304. Dust suction curtain; 305. Lower dust-proof net; 306. Hanging rack. Detailed implementation manners

[0034] The following description is used to disclose the present invention so that those skilled in the art can implement the present invention. The preferred embodiments in the following description are only examples, and those skilled in the art can think of other obvious variations.

[0035] As Figures 1 - 9 shown, a wafer clamping mechanism and a wafer cleaning machine include a base 1. At the right end of the upper surface of the base 1, a control console 6 is fixedly installed. Above the control console 6 on the base 1, a machine cover 2 is fixedly installed. Between the base 1 and the machine cover 2, a plurality of hinge seats 7 are rotatably installed. Between the opposite inner sides of every two hinge seats 7, a protective door 5 is rotatably installed. At the upper end of the machine cover 2, a ventilation box 3 is fixedly installed. Inside the ventilation box 3, a ventilation mechanism is fixedly installed. On the left side of the upper surface of the base 1, a convex platform 8 is fixedly installed. At the upper end of the convex platform 8, a cleaning box 4 is fixedly installed. On the right surface of the cleaning box 4, a spraying mechanism is provided. On the right side of the upper surface of the base 1, an installation plug board 9 is fixedly installed. At the upper end of the installation plug board 9, two wafer boxes 10 are symmetrically installed. Between the cleaning box 4 and the wafer boxes 10 on the upper end of the base 1, a drying cylinder 201 is provided. On the upper surface of the drying cylinder 201, a wafer tray 209 is fixedly installed. Below the wafer tray 209 of the drying cylinder 201, a heating mechanism is provided. On the upper surface of the drying cylinder 201, outside the wafer tray 209, three wafer limiting mechanisms arranged at equal angles are fixedly installed. On the upper surface of the base 1, outside the control console 6, a wafer clamping mechanism is fixedly installed;

[0036] The wafer clamping mechanism includes a clamping base 101 fixedly installed on the upper surface of the base 1. At the upper end of the clamping base 101, a lifting platform 102 is provided. At the front end of the lifting platform 102, a front turntable 105 is fixedly installed.

[0037] As Figure 3 、 Figure 4 shown, the spraying mechanism includes a mounting plate 11 fixedly installed on the right surface of the cleaning box 4. At the upper end of the outer surface of the mounting plate 11, a spraying pipe 13 is fixedly installed. At the lower end of the spraying pipe 13, a gas spraying pipe 14 is fixedly installed. At the same position outside the spraying pipe 13 and the gas spraying pipe 14 on the outer surface of the mounting plate 11, a limiting frame 12 is fixedly installed. The spraying pipe 13 sprays pure water and hydrogen peroxide cleaning solution on the wafer surface. Then, when the drying process is carried out, the gas spraying pipe 14 sprays IPA vapor on the wafer surface to perform vapor replacement on the surface to remove moisture.

[0038] As Figure 5 、 Figure 6 shown, the wafer clamping mechanism includes a rotating arm 107 rotatably installed at the outer end of the front turntable 105. At the outer end of the rotating arm 107, a support arm 108 is rotatably installed. On the upper and lower surfaces of the front turntable 105, rotating motors 106 penetrating the rotating arm 107 are fixedly installed. At the connection between the rotating arm 107 and the support arm 108, on the upper and lower outer surfaces of the rotating arm 107, rotating motors 106 are fixedly installed. The rotating motors 106 are used to drive the rotating arm 107 and the support arm 108 to extend the clamping mechanism.

[0039] A clamping plate 109 is fixedly installed at the outer end of the support arm 108. A telescopic motor 111 is fixedly installed at the rear end of the lower surface of the clamping plate 109. A moving limit plate 112 is fixedly installed at the output end of the telescopic motor 111. Two symmetrical front limit plates 110 are rotatably installed at the outer end of the lower surface of the clamping plate 109. Card slots 113 are formed on the relative inner surfaces of the front limit plates 110 and the moving limit plate 112. The telescopic motor 111 is used to control the moving limit plate 112 to cooperate with the front limit plates 110 to clamp and transport the wafer.

[0040] As Figure 7 、 Figure 8 shown, symmetrical lifting tracks 104 are fixedly installed on the upper surface of the base 1 at the rear side of the lifting table 102. A lifting motor 103 is fixedly installed between the lifting tracks 104. The upper end of the lifting motor 103 is fixedly installed with a moving table 114, and the moving table 114 is fixedly installed on the rear surface of the lifting table 102.

[0041] The wafer limiting mechanism includes three equally-angled moving tracks 212 fixedly installed on the upper surface of the upper plate 204. A driving motor 210 is fixedly installed at the relative outer end of each moving track 212. A limiting baffle 211 is slidably installed at the output end of each driving motor 210. And the three moving tracks 212 all penetrate through the lower end of the wafer tray 209. The wafer is transported to the upper end of the wafer tray 209 through the clamping mechanism, and the three limiting baffles 211 clamp the wafer and then rotate it.

[0042] The heating mechanism includes a drying box 206 fixedly installed at the central position inside the drying cylinder 201. A heating plate 205 is fixedly installed at the upper end of the drying box 206. A heating rod 207 is fixedly installed on the lower surface of the inner wall of the drying box 206 below the heating plate 205. A plurality of equally-spaced heating coils 208 are fixedly installed on the upper surface of the heating plate 205.

[0043] A lower bracket 202 is fixedly installed inside the base 1 at the lower surface of the drying cylinder 201. The lower bracket 202 is fixedly installed on the lower surface of the drying cylinder 201. And a centrifugal motor 203 is fixedly installed at the central position of the lower surface of the drying cylinder 201. The output end of the centrifugal motor 203 penetrates through the inner side of the drying cylinder 201. When drying, the centrifugal motor 203 drives the wafer to rotate under the condition of heating the drying box 206, combining the functions of rotational water removal and drying water removal to accelerate the drying of the wafer surface.

[0044] As Figure 9As shown in the figure, the ventilation mechanism includes a dust removal water tank 302 fixedly installed on the outside of the ventilation box 3. Filter baffles 301 are fixedly installed on the front and rear outer surfaces of the ventilation box 3. Dust suction curtains 304 are fixedly installed inside the ventilation box 3 at the rear ends of the filter baffles 301. Two symmetric fans 303 are fixedly installed at the lower end inside the ventilation box 3. A lower dust-proof net 305 is fixedly installed at the lower end of the ventilation box 3. A hanging bracket 306 is fixedly installed at the lower end of the machine cover 2 where it is located below the lower dust-proof net 305. The hanging bracket 306 is fixedly installed on the lower surface of the machine cover 2 and is used to support the lower dust-proof net 305 and the upper ventilation mechanism. The dust removal water tank 302 introduces water into the dust suction curtain 304. In cooperation with the lower dust-proof net 305 and the filter baffles 301, the air inside the equipment is quickly discharged, preventing the IPA vapor from accumulating inside the equipment.

[0045] Working principle: Before the cleaning process, the staff places the wafer to be cleaned inside the wafer cassette 10 and places the wafer cassette 10 on the upper end of the mounting plug board 9 for the wafer clamping mechanism to pick up.

[0046] After placement, the operator closes the protective door 5 to prevent external dust from falling into the equipment during the cleaning process and affecting the cleaning effect. Moreover, during the wafer cleaning process, the IPA vapor drying contains a large amount of chemical substances, which poses a threat to the physical health of the operator. Before starting, the operator turns on the upper ventilation mechanism through the console 6. The dust suction curtain 304 is provided inside the ventilation mechanism. While ensuring the ventilation effect, the lower dust-proof net 305 and the filter baffles 301 cooperate to intercept internal and external impurities, preventing impurities from falling into the equipment and affecting the cleaning effect. And the dust suction curtain 304 is replenished with water by the dust removal water tank 302, which has a good absorption effect on the harmful gases and vapors generated during the IPA vapor drying process.

[0047] When starting the cleaning, the lifting table 102 located on the upper end of the clamping base 101 is controlled by the lifting motor 103 at the rear to stably move up and down along the lifting track 104, preventing the wafer from being damaged due to shaking during the movement. The rotating arm 107 is driven by the rotating motor 106 fixedly installed at the upper and lower ends of the front turntable 105 to rotate at the front end of the front turntable 105. The support arm 108 rotatably installed at the outer end of the rotating arm 107 also rotates through the rotating motor 106. They cooperate to move the clamping plate 109 into the wafer cassette 10. At this time, the telescopic motor 111 located at the rear end of the lower surface of the clamping plate 109 controls the movement of the movable limit plate 112 to expand and contract, and controls the angles of the two front limit plates 110 according to the circumference of the clamped wafer. In cooperation with the movable limit plate 112, the wafer is clamped, and slots 113 are provided on the relative inner surfaces of the movable limit plate 112 and the front limit plates 110. After clamping the wafer by expansion and contraction, it is transported to the upper end of the wafer tray 209.

[0048] There are three equally-angled arranged moving tracks 212 on the outer side of the wafer tray 209. Driving motors 210 are fixedly installed on the relative outer sides of the three moving tracks 212. A limit baffle 211 is slidably installed at the output end of each driving motor 210. After the wafer is placed on the upper end of the wafer tray 209, the three limit baffles 211 move synchronously to correct the position of the wafer. After placement, the inside of the cleaning box 4 is cleaned with hydrogen peroxide water through the spray pipe 13, and then rinsed with pure water to complete the cleaning process of the wafer surface. At this time, there are water stains and chemical residues on the wafer surface, and drying treatment is required. The air spray pipe 14 located at the lower end of the spray pipe 13 sprays IPA steam. At the same time, the heating mechanism inside the drying cylinder 201 is started. The heating rod 207 inside the drying box 206 drives the heating coil 208 to heat. The hot air and hot steam contact the bottom surface of the wafer through the upper plate 204. The centrifugal motor 203 fixedly installed at the bottom of the drying cylinder 201 starts to work, causing the drying box 206 to rotate. At the same time, the wafer tray 209 fixedly installed at the upper end and the limiting mechanism rotate synchronously. High-speed rotation quickly spins off most of the water. Bottom drying uses hot air and hot steam to blow from the bottom upwards to accelerate the evaporation of the remaining water. This drying method ensures uniform distribution of water on the wafer surface, avoids local water accumulation, and removes water physically, reducing the dependence on chemical reagents, reducing production costs and environmental impact.

[0049] After the cleaning and drying are completed, the wafer clamping mechanism clamps the wafer again and transports it into the wafer box 10 on the other side.

[0050] The above shows and describes the basic principles, main features and advantages of the present invention. Those skilled in the art should understand that the present invention is not limited by the above embodiments. What is described in the above embodiments and the specification is only the principle of the present invention. Without departing from the spirit and scope of the present invention, the present invention will have various changes and improvements, and these changes and improvements all fall within the scope of the present invention claimed. The scope of protection required by the present invention is defined by the appended claims and their equivalents.

Claims

1. A wafer clamping mechanism and a wafer cleaning machine, comprising a base (1), characterized in that: A control console (6) is fixedly installed at the right end of the upper surface of the base (1). An engine cover (2) is fixedly installed at the upper end of the base (1) where the base (1) is located. A plurality of hinge seats (7) are rotatably installed between the base (1) and the engine cover (2). A protective door (5) is rotatably installed on the inner sides opposite to each other of every two hinge seats (7). A ventilation box (3) is fixedly installed at the upper end of the engine cover (2). A ventilation mechanism is fixedly installed inside the ventilation box (3). A boss (8) is fixedly installed on the left side of the upper surface of the base (1). A cleaning box (4) is fixedly installed at the upper end of the boss (8). A spraying mechanism is provided on the right surface of the cleaning box (4). An installation insert plate (9) is fixedly installed on the right side of the upper surface of the base (1). Two wafer boxes (10) are symmetrically installed at the upper end of the installation insert plate (9). A drying cylinder (201) is provided between the cleaning box (4) and the wafer boxes (10) at the upper end of the base (1). A wafer tray (209) is fixedly installed on the upper surface of the drying cylinder (201). A heating mechanism is provided below the wafer tray (209) of the drying cylinder (201). Three wafer limiting mechanisms arranged at equal angles are fixedly installed on the outer side of the wafer tray (209) on the upper surface of the drying cylinder (201). A wafer clamping mechanism is fixedly installed on the outer side of the control console (6) on the upper surface of the base (1); The wafer clamping mechanism includes a clamping base (101) fixedly installed on the upper surface of the base (1). A lifting table (102) is provided at the upper end of the clamping base (101). A front turntable (105) is fixedly installed at the front end of the lifting table (102).

2. The wafer clamping mechanism and the wafer cleaning machine according to claim 1, characterized in that: The spraying mechanism includes a mounting plate (11) fixedly installed on the right surface of the cleaning box (4). A spray pipe (13) is fixedly installed at the upper end of the outer surface of the mounting plate (11). An air spray pipe (14) is fixedly installed at the lower end of the spray pipe (13). A limiting frame (12) is fixedly installed at the same position on the outer surface of the mounting plate (11) outside the spray pipe (13) and the air spray pipe (14).

3. A wafer clamping mechanism and a wafer cleaning machine according to claim 1, characterized in that: The ventilation mechanism includes an impurity removal water tank (302) fixedly installed outside the ventilation box (3). Filter baffles (301) are fixedly installed on the front and rear outer surfaces of the ventilation box (3). Dust suction curtains (304) are fixedly installed on the inner sides of the ventilation box (3) behind the filter baffles (301). Two symmetric fans (303) are fixedly installed at the lower end inside the ventilation box (3). A lower dust-proof net (305) is fixedly installed at the lower end of the ventilation box (3). A hanging bracket (306) is fixedly installed at the lower end of the engine cover (2) where the lower dust-proof net (305) is located.

4. A wafer clamping mechanism and a wafer cleaning machine according to claim 1, characterized in that: The wafer clamping mechanism includes a rotating arm (107) rotatably installed at the outer end of the front turntable (105). A support arm (108) is rotatably installed at the outer end of the rotating arm (107). Rotating motors (106) penetrating through the rotating arm (107) are fixedly installed on the upper and lower surfaces of the front turntable (105). Rotating motors (106) are fixedly installed on the upper and lower outer surfaces of the rotating arm (107) at the connection between the rotating arm (107) and the support arm (108).

5. A wafer clamping mechanism and a wafer cleaning machine according to claim 4, characterized in that: A clamping plate (109) is fixedly installed at the outer end of the support arm (108). A telescopic motor (111) is fixedly installed at the rear end of the lower surface of the clamping plate (109). A moving limit plate (112) is fixedly installed at the output end of the telescopic motor (111). Two symmetrical front limit plates (110) are rotatably installed at the outer end of the lower surface of the clamping plate (109). Clamping grooves (113) are formed on the opposite inner surfaces of the front limit plate (110) and the moving limit plate (112).

6. The wafer clamping mechanism and the wafer cleaning machine according to claim 4, characterized in that: Symmetrical lifting rails (104) are fixedly installed on the upper surface of the base (1) at the rear side of the lifting table (102). A lifting motor (103) is fixedly installed between the lifting rails (104). A moving table (114) is fixedly installed at the upper end of the lifting motor (103). The moving table (114) is fixedly installed on the rear surface of the lifting table (102).

7. A wafer clamping mechanism and a wafer cleaning machine according to claim 1, characterized in that: The wafer limiting mechanism includes three equally-angularly arranged moving rails (212) fixedly installed on the upper surface of the upper plate (204). A driving motor (210) is fixedly installed at the opposite outer end of each moving rail (212). A limit baffle (211) is slidably installed at the output end of each driving motor (210). And the three moving rails (212) all penetrate through the lower end of the wafer tray (209).

8. A wafer clamping mechanism and a wafer cleaning machine according to claim 1, characterized in that: The heating mechanism includes a drying box (206) fixedly installed at the central position inside the drying cylinder (201). A heating plate (205) is fixedly installed at the upper end of the drying box (206). A heating rod (207) is fixedly installed on the lower surface of the inner wall of the heating plate (205) inside the drying box (206). A plurality of equally-spaced heating coils (208) are fixedly installed on the upper surface of the heating plate (205).

9. A wafer clamping mechanism and a wafer cleaning machine according to claim 1, characterized in that: A lower bracket (202) is fixedly installed inside the base (1) at the lower surface of the drying cylinder (201). The lower bracket (202) is fixedly installed on the lower surface of the drying cylinder (201). And a centrifugal motor (203) is fixedly installed at the central position of the lower surface of the drying cylinder (201). The output end of the centrifugal motor (203) penetrates through the inside of the drying cylinder (201).

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