Improved IGBT chip with high stability and heat dissipation and manufacturing method thereof

Abstract

The application discloses an improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof, relates to the technical field of power electronics, and comprises a heat dissipation base, a limiting groove, a limiting mechanism and an adjusting mechanism, the heat dissipation base is fixedly connected with a fixing frame, the fixing frame is fixedly connected with a mounting plate, the heat dissipation base is symmetrically provided with the limiting grooves on the surface and with the mounting plate as the center, the limiting mechanisms are arranged on the two sides of the limiting grooves, the heat dissipation base is provided with an adjusting groove below the fixing frame, and the adjusting mechanism of screw thread transmission is detachably arranged in the adjusting groove; the mounting frame is driven to move through the screw thread cooperation between the threaded rod and the positioning hole by rotating the knob, the limiting pressing plate is embedded into the clamping groove, the limiting of the IGBT chip is realized, the chip is fixed by the limiting piece under the pushing of the threaded rod and with the help of the gasket, the installation stability is improved, the heat dissipation fins under the mounting plate cooperate with the heat dissipation fan and the ventilation groove, good air circulation is formed, the working temperature of the chip is effectively reduced, the stable operation of the chip is ensured, and the performance and the service life are improved.

Description

TECHNICAL FIELD

[0001] The application relates to the technical field of power electronics, and particularly relates to an improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof. BACKGROUND

[0002] An insulated gate bipolar transistor (IGBT) chip is a core component in the field of power electronics and is widely applied in many fields such as industrial control and new energy. However, the IGBT chip on the market has some problems to be solved in actual use.

[0003] In terms of stability, the mounting mode of the traditional IGBT chip cannot effectively resist the interference of external vibration and other factors, and displacement of the chip may occur in the working process, thereby affecting the electrical performance and working reliability of the chip. The fixation between the chip and the mounting plate is not firm enough, and loosening may occur during long-term use, thereby increasing the risk of equipment failure.

[0004] Heat dissipation performance is also an important factor restricting the performance of the IGBT chip. With the continuous increase of the power density of the chip, the heat generated by the chip during work is also increasing. If the heat cannot be effectively dissipated in time, the temperature of the chip will continue to rise, thereby reducing the performance of the chip and even causing damage to the chip. Therefore, the technical personnel in the field provide an improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof to solve the problems in the background. SUMMARY

[0005] The application aims to provide an improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof to solve the problems in the background.

[0006] To achieve the above-mentioned purpose, the application provides the following technical scheme.

[0007] An improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof, which comprises a heat dissipation base, a limiting groove, a limiting mechanism and an adjusting mechanism. The heat dissipation base is fixedly connected with a fixed frame in the form of a convex structure. The fixed frame is fixedly connected with a mounting plate. The heat dissipation base is symmetrically provided with a limiting groove with the mounting plate as the center. The limiting groove is provided with a limiting mechanism on both sides. An installation needle groove is formed on the upper surface of the mounting plate. An IGBT chip is detachably arranged on the installation needle groove. An adjusting groove is formed below the fixed frame of the heat dissipation base. A screw thread adjusting mechanism is detachably arranged in the adjusting groove.

[0008] As a further scheme of the present application: the limiting mechanism comprises a rotating frame, a transmission member, a limiting pressing plate, a fixed block and a clamping groove, the rotating frame is symmetrically arranged in the limiting groove on both sides, the transmission member is movably connected on the rotating frame, the transmission member is in L-shaped structure, the limiting pressing plate is arranged on the side of the fixed frame close to the rotating frame, the limiting pressing plate is arranged in an inclined manner, the fixed block is symmetrically arranged on the side of the limiting pressing plate away from the fixed frame, the fixed block is movably connected on one side of the transmission member, and the clamping groove is formed on both sides of the mounting plate close to the limiting pressing plate.

[0009] As a further scheme of the present application: the transmission member is away from the limiting block on one side and cooperates with the limiting block.

[0010] As a further scheme of the present application: the adjusting mechanism comprises a mounting frame, a knob, a threaded rod, a ventilation groove, a limiting block and a guide groove, the guide groove is symmetrically formed on both sides of the fixed frame, the mounting frame is movably connected with the fixed frame through the limiting groove, the limiting block is fixedly connected on both sides of the mounting frame, the fixed plate is fixedly connected on both sides of the mounting frame, the threaded rod is movably connected on the fixed plate, and the knob is arranged on one end of the threaded rod penetrating through the fixed plate.

[0011] As a further scheme of the present application: the fixed frame is provided with a positioning groove on both sides of the mounting plate, a positioning hole is formed in the positioning groove, the positioning hole is in a threaded structure, and the positioning hole cooperates with the threaded rod.

[0012] As a further scheme of the present application: the fixed frame is provided with a limiting member, the limiting member is in a threaded structure on both sides, the limiting member cooperates with the threaded rod, a gasket is arranged on the surface of the limiting member, and the limiting member cooperates with the surface of the IGBT chip through the gasket.

[0013] As a further scheme of the present application: the mounting plate is provided with a heat sink below, a heat dissipation fan is installed on the side of the mounting frame close to the heat sink, the heat dissipation fan cooperates with the heat sink, and the ventilation groove is formed on the side of the mounting frame away from the heat sink.

[0014] An improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof, comprising the following steps:

[0015] S1: symmetrically arranging the rotating frame in the limiting groove, connecting the transmission member, installing the limiting pressing plate, connecting the transmission member with the fixed block, completing the limiting mechanism assembly, and preliminarily assembling the adjusting mechanism by penetrating the threaded rod through the fixed plate and cooperating with the positioning hole in a threaded manner;

[0016] S2: integrating the limiting mechanism and the adjusting mechanism to the heat dissipation base, installing the limiting member on the fixed frame to cooperate with the threaded rod, and tightly installing the heat sink below the mounting plate;

[0017] S3: Turn the knob, check whether the adjustment mechanism runs smoothly, whether the mounting frame moves smoothly, and whether the limiting mechanism works normally, whether the limiting pressing plate can be accurately embedded in the clamping groove;

[0018] S4: Turn on the cooling fan power supply, check the operation and air volume, simulate the chip heating, monitor the temperature of the heat sink and the chip mounting place, and evaluate the heat dissipation performance;

[0019] S5: After debugging and passing the detection, the IGBT chip is installed on the mounting plate through the installation needle slot, the knob is turned, the limiting piece is pressed tightly to the chip through the gasket, and the manufacturing installation is completed.

[0020] Compared with the prior art, the beneficial effects of the present application are:

[0021] The threaded rod is rotated on the fixed plate by rotating the knob, and the threaded rod and the positioning hole are screwed with each other, so as to drive the mounting frame to move along the guide groove. Since the side of the transmission part away from the limiting pressing plate cooperates with the limiting block, the transmission part is pushed to rotate around the connecting point with the rotating frame. When the transmission part rotates, the end of the transmission part movably connected with the fixed block pushes the fixed block, thereby driving the limiting pressing plate to rotate around the connecting point with the fixed frame. During the rotation process, the end of the limiting pressing plate close to the mounting plate gradually approaches the clamping groove, and finally is embedded in the clamping groove. When the limiting pressing plate is embedded in the clamping groove, the limiting effect on the IGBT chip on the mounting plate is achieved, and the stability of the IGBT chip installation is ensured.

[0022] After the position adjustment of the IGBT chip is completed and the final installation position is determined, the knob is continued to be rotated. At this time, the threaded rod continues to move. Since the limiting piece on both sides is in a threaded structure and cooperates with the threaded rod, the movement of the threaded rod pushes the limiting piece to move towards the IGBT chip. The surface of the limiting piece is provided with a gasket. When the limiting piece contacts the surface of the IGBT chip, the gasket plays a role of buffering and increasing friction. As the limiting piece continues to approach the chip, the IGBT chip can be tightly fixed on the mounting plate, preventing the chip from being displaced due to vibration and the like during use, and further improving the stability of the chip installation.

[0023] The heat sink arranged below the mounting plate is used to absorb the heat generated by the IGBT chip during work. The heat dissipation fan arranged on the side of the mounting frame close to the heat sink starts to work. The air blown by the heat dissipation fan acts on the heat sink, accelerating the flow of air around the heat sink, thereby improving the heat dissipation efficiency of the heat sink. The ventilation groove is arranged on the side of the mounting frame away from the heat sink. The ventilation groove provides a channel for the flow of air, so that the hot air passing through the heat sink can be smoothly discharged, forming a good air circulation, continuously and effectively reducing the working temperature of the IGBT chip, ensuring that the chip works stably in a suitable temperature range, and improving the performance and service life of the chip. BRIEF DESCRIPTION OF DRAWINGS

[0024] Figure 1 It is a schematic diagram of the three-dimensional structure of an improved IGBT chip with high stability and heat dissipation.

[0025] Figure 2 It is an exploded view of an improved IGBT chip with high stability and heat dissipation.

[0026] Figure 3 It is a top view of the heat dissipation base in an improved IGBT chip with high stability and heat dissipation.

[0027] Figure 4 It is Figure 3 A schematic diagram of the cross-sectional structure in the direction of A-A.

[0028] Figure 5 It is a schematic diagram of the limiting mechanism in an improved IGBT chip with high stability and heat dissipation.

[0029] Figure 6 It is a schematic diagram of the adjusting mechanism in an improved IGBT chip with high stability and heat dissipation.

[0030] Figure 7 It is a schematic diagram of the cooperation of the heat dissipation fin and the heat dissipation fan in an improved IGBT chip with high stability and heat dissipation.

[0031] In the figure: 1, heat dissipation base; 2, limiting groove; 3, limiting mechanism; 301, rotating frame; 302, transmission part; 303, limiting pressing plate; 304, fixed block; 305, clamping groove; 4, limiting part; 5, mounting needle groove; 6, adjusting mechanism; 601, mounting frame; 602, knob; 603, threaded rod; 604, ventilation groove; 605, limiting block; 606, fixed plate; 7, positioning groove; 8, mounting plate; 9, positioning hole; 10, heat dissipation fan; 11, heat dissipation fin; 12, adjusting groove; 13, fixed frame. DETAILED DESCRIPTION

[0032] The technical solutions in the embodiments of the present application will be described clearly and completely below with reference to the drawings in the embodiments of the present application. Obviously, the described embodiments are only part of the embodiments of the present application, not all. Based on the embodiments in the present application, all other embodiments obtained by those skilled in the art without creative labor are within the scope of protection of the present application. EMBODIMENT

[0033] Referring to Figures 1-5The embodiment provides an improved IGBT chip with high stability and heat dissipation, which comprises a heat dissipation base 1, a limiting groove 2, a limiting mechanism 3 and an adjusting mechanism 6, the heat dissipation base 1 is fixedly connected with a fixing frame 13 in a convex structure, the fixing frame 13 is fixedly connected with a mounting plate 8, the heat dissipation base 1 is symmetrically provided with the limiting groove 2 at the center of the mounting plate 8, the limiting mechanism 3 is arranged on the two sides of the limiting groove 2, and the mounting plate 8 is provided with a mounting needle groove 5, the mounting needle groove 5 is detachably provided with an IGBT chip, the heat dissipation base 1 is provided with an adjusting groove 12 below the fixing frame 13, and the adjusting groove 12 is detachably provided with a screw transmission adjusting mechanism 6.

[0034] Specifically, the limiting mechanism 3 comprises a rotating frame 301, a transmission piece 302, a limiting pressing plate 303, a fixed block 304 and a clamping groove 305, the rotating frame 301 is symmetrically arranged in the limiting groove 2 on the two sides, the transmission piece 302 is movably connected to the rotating frame 301, the transmission piece 302 is in an L-shaped structure, the limiting pressing plate 303 is arranged on the side of the fixing frame 13 close to the rotating frame 301, the limiting pressing plate 303 is arranged in an inclined manner, the fixed block 304 is symmetrically arranged on the side, away from the fixing frame 13, of the limiting pressing plate 303, and the fixed block 304 is movably connected to one side of the transmission piece 302, and the clamping groove 305 is arranged on the two sides of the mounting plate 8 close to the limiting pressing plate 303.

[0035] The side, away from the limiting pressing plate 303, of the transmission piece 302 is matched with the limiting block 605;

[0036] Before the IGBT chip is installed, the limiting mechanism 3 is in an initial state, the transmission piece 302 is movably connected to the rotating frame 301, one end of the transmission piece 302 in the L-shaped structure is connected to the rotating frame 301, the other end is movably connected to the fixed block 304, the fixed block 304 is arranged on the side, away from the fixing frame 13, of the limiting pressing plate 303, at the moment, the limiting pressing plate 303 is arranged in an inclined manner and does not match the clamping groove 305 on the mounting plate 8, and the IGBT chip is placed on the mounting needle groove 5 of the mounting plate 8.

[0037] By rotating the knob 602 to drive the threaded rod 603 to rotate on the fixed plate 606, and the threaded rod 603 and the positioning hole 9 are threadedly matched, thereby driving the mounting frame 601 to move along the guide groove 607. Since the side of the transmission member 302 away from the limiting pressing plate 303 is matched with the limiting block 605, the transmission member 302 is pushed to rotate around the connecting point with the rotating frame 301. When the transmission member 302 rotates, the end thereof movably connected with the fixed block 304 pushes the fixed block 304, thereby driving the limiting pressing plate 303 to rotate around the connecting point thereof with the fixed frame 13. In the rotating process, the end thereof close to the mounting plate 8 gradually approaches the clamping groove 305, and finally is embedded into the clamping groove 305. When the limiting pressing plate 303 is embedded into the clamping groove 305, a limiting effect on the IGBT chip on the mounting plate 8 is achieved, and the stability of the IGBT chip installation is ensured. Embodiment

[0038] With reference to Figures 3-7 The embodiment is based on the previous embodiment, and differs from the previous embodiment in that the adjusting mechanism 6 comprises a mounting frame 601, a knob 602, a threaded rod 603, a ventilation groove 604, a limiting block 605 and a guide groove 607. The fixed frame 13 is symmetrically provided with the guide groove 607 on both sides thereof. The fixed frame 13 is movably connected with the mounting frame 601 through the limiting groove 2. The mounting frame 601 is fixedly connected with the limiting block 605 on both sides thereof. The mounting frame 601 is fixedly connected with the fixed plate 606 on both sides thereof. The fixed plate 606 is movably connected with the threaded rod 603. The threaded rod 603 is provided with the knob 602 at one end thereof and penetrates through the fixed plate 606.

[0039] The fixed frame 13 is provided with the positioning groove 7 on both sides of the mounting plate 8. The positioning groove 7 is provided with the positioning hole 9 in a threaded structure. The positioning hole 9 and the threaded rod 603 are matched with each other.

[0040] The fixed frame 13 is provided with the limiting member 4. The limiting member 4 is provided with a threaded structure on both sides thereof. The limiting member 4 and the threaded rod 603 are matched with each other. The limiting member 4 is provided with a gasket on the surface thereof. The limiting member 4 is matched with the surface of the IGBT chip through the gasket.

[0041] The mounting plate 8 is provided with the heat dissipation fin 11 below. The mounting frame 601 is provided with the heat dissipation fan 10 on the side thereof close to the heat dissipation fin 11. The heat dissipation fan 10 and the heat dissipation fin 11 are matched with each other. The mounting frame 601 is provided with the ventilation groove 604 on the side thereof away from the heat dissipation fin 11.

[0042] After the position adjustment of the IGBT chip is completed and the final installation position is determined, the knob 602 is continued to be rotated, at this time, the threaded rod 603 is continued to be moved, since the two sides of the limiting piece 4 are in threaded structure and are matched with the threaded rod 603, the movement of the threaded rod 603 pushes the limiting piece 4 to move towards the IGBT chip, the surface of the limiting piece 4 is provided with a gasket, when the limiting piece 4 contacts the surface of the IGBT chip, the gasket plays a role of buffering and increasing friction, as the limiting piece 4 continues to approach the chip, the IGBT chip can be tightly fixed on the installation plate 8, preventing the chip from being displaced due to vibration and the like in the use process, further improving the stability of the chip installation;

[0043] The fin 11 arranged below the installation plate 8 is used to absorb the heat generated by the IGBT chip during work, the heat dissipation fan 10 installed on the side of the mounting frame 601 close to the fin 11 starts to work, the air blown by the heat dissipation fan 10 acts on the fin 11, accelerating the flow of air around the fin 11, thereby improving the heat dissipation efficiency of the fin 11, the ventilation groove 604 is opened on the side of the mounting frame 601 away from the fin 11, the ventilation groove 604 provides a channel for the flow of air, so that the hot air passing through the fin 11 can be smoothly discharged, forming good air circulation, continuously and effectively reducing the working temperature of the IGBT chip, ensuring that the chip works stably in a suitable temperature range, improving the performance and service life of the chip. Embodiment

[0044] An improved IGBT chip with high stability and heat dissipation and a manufacturing method thereof, comprising the following steps:

[0045] S1: symmetrically mount the rotating frame 301 in the limiting groove 2, connect the transmission member 302, then install the limiting pressure plate 303, make the transmission member 302 connected with the fixed block 304, complete the assembly of the limiting mechanism 3, make the threaded rod 603 pass through the fixed plate 606 and be screwed with the positioning hole 9, and preliminarily mount the adjusting mechanism 6;

[0046] S2: integrate the limiting mechanism 3 and the adjusting mechanism 6 to the heat dissipation base 1, install the limiting piece 4 in cooperation with the threaded rod 603 in the fixed frame 13, and tightly mount the fin 11 below the installation plate 8;

[0047] S3: rotate the knob 602, check whether the operation of the adjusting mechanism 6 is smooth, whether the movement of the mounting frame 601 is stable, and whether the action of the limiting mechanism 3 is normal, and whether the limiting pressure plate 303 can be accurately embedded in the clamping groove 305;

[0048] S4: turn on the power supply of the heat dissipation fan 10, check the operation and air volume, simulate the heating of the chip, monitor the temperature of the fin 11 and the chip installation position, and evaluate the heat dissipation performance;

[0049] S5: After debugging detection is qualified, the IGBT chip is installed on the installation plate 8 through the installation needle slot 5, the knob 602 is rotated, the limiting piece 4 is pressed against the chip through the gasket, and manufacturing installation is completed.

[0050] It will be apparent to those skilled in the art that the application is not limited to the details of the above-exemplified embodiments and that the application can be implemented in other particular forms without departing from the spirit or essential characteristics of the application. The presently disclosed embodiments are therefore to be considered in all respects as illustrative and not restrictive, the scope of the application being indicated by the appended claims rather than by the foregoing description, and all changes which come within the meaning and range of equivalency of the claims are therefore intended to be embraced therein. No reference signs in the claims shall be construed as limiting the scope of the claims to the features

[0051] Furthermore, it should be understood that although the description is made according to the embodiments, not every embodiment contains only one independent technical solution, and the description is made in this way only for the sake of clarity, and those skilled in the art should consider the description as a whole, and the technical solutions in each embodiment can also be properly combined to form other embodiments which can be understood by those skilled in the art.

Claims

1. An improved IGBT chip with high stability and heat dissipation, characterized in that, Including heat dissipation base (1), limiting groove (2), limiting mechanism (3) and adjusting mechanism (6), the fixed frame (13) is fixedly connected in the heat dissipation base (1), the fixed frame (13) is convex structure, the fixed frame (13) is fixedly connected with mounting plate (8), the heat dissipation base (1) surface is symmetrically opened with mounting plate (8) as center with limiting groove (2), limiting groove (2) both sides are provided with limiting mechanism (3), and the mounting plate (8) upper surface is provided with mounting needle slot (5), the mounting needle slot (5) is detachably provided with IGBT chip, the heat dissipation base (1) is provided with adjusting groove (12) below the fixed frame (13), the adjusting groove (12) is detachably provided with the adjusting mechanism (6) of screw thread transmission, The limiting mechanism (3) includes rotating frame (301), transmission part (302), limiting pressing plate (303), fixed block (304) and clamping groove (305), both sides The limiting groove (2) is symmetrically provided with rotating frame (301), the transmission part (302) is movably connected on the rotating frame (301), the transmission part (302) is L-shaped structure, the fixed frame (13) is provided with limiting pressing plate (303) on one side close to the rotating frame (301), the limiting pressing plate (303) is inclinedly arranged, the fixed block (304) is symmetrically arranged on the side away from the fixed frame (13) of the limiting pressing plate (303), the fixed block (304) is movably connected on one side of the transmission part (302), The mounting plate (8) is provided with clamping groove (305) on both sides close to the limiting pressing plate (303), and the clamping groove (305) and the limiting pressing plate (303) are matched with each other. The transmission part (302) is matched with the limiting block (605) on the side away from the limiting pressing plate (303). The adjusting mechanism (6) includes mounting bracket (601), knob (602), threaded rod (603), ventilation groove (604), limiting block (605) and guide groove (607), The fixed frame (13) is symmetrically provided with guide groove (607) on both sides, the fixed frame (13) is movably connected with mounting bracket (601) through limiting groove (2), the mounting bracket (601) is fixedly connected with limiting block (605) on both sides, the mounting bracket (601) is fixedly connected with fixed plate (606) on both sides, the fixed plate (606) is movably connected with threaded rod (603), and the threaded rod (603) is provided with knob (602) at one end penetrating through fixed plate (606).

2. The improved IGBT chip with high stability and heat dissipation according to claim 1, characterized in that, The fixed frame (13) is provided with positioning groove (7) on both sides of mounting plate (8), the positioning hole (9) is arranged in the positioning groove (7), the positioning hole (9) is screw structure, and the positioning hole (9) and the threaded rod (603) are matched with each other.

3. The improved IGBT chip with high stability and heat dissipation according to claim 2, characterized in that, The fixed frame (13) is provided with limiting piece (4), the limiting piece (4) is screw structure on both sides, the limiting piece (4) and the threaded rod (603) are matched with each other, and the limiting piece (4) is provided with gasket on the surface, and the limiting piece (4) is matched with the surface of IGBT chip through the gasket.

4. The improved IGBT chip with high stability and heat dissipation according to claim 3, characterized in that, The mounting plate (8) is provided below with a heat sink (11), and the mounting rack (601) is provided on one side close to the heat sink (11) with a heat dissipation fan (10), which cooperates with the heat sink (11), and the mounting rack (601) is provided on the side away from the heat sink (11) with a ventilation groove (604).

5. A method of manufacturing an improved IGBT chip with high stability and heat dissipation, for manufacturing the improved IGBT chip with high stability and heat dissipation according to claim 4, characterized in that, The method comprises the following steps: S1: symmetrically mount the rotating frame (301) in the limiting groove (2), connect the transmission member (302), then install the limiting pressing plate (303), connect the transmission member (302) with the fixed block (304), complete the assembly of the limiting mechanism (3), pass the threaded rod (603) through the fixed plate (606) and threadedly cooperate with the positioning hole (9), and preliminarily assemble the adjusting mechanism (6); S2: integrate the limiting mechanism (3) and the adjusting mechanism (6) to the heat dissipation base (1), install the limiting member (4) in the fixed rack (13) to cooperate with the threaded rod (603), and tightly mount the heat sink (11) below the mounting plate (8); S3: rotate the knob (602), check whether the operation of the adjusting mechanism (6) is smooth, whether the movement of the mounting rack (601) is stable, whether the action of the limiting mechanism (3) is normal, and whether the limiting pressing plate (303) can be accurately embedded in the clamping groove (305); S4: connect the power supply of the heat dissipation fan (10), check the operation and air volume, simulate the chip heating, monitor the temperature of the heat sink (11) and the chip mounting position, and evaluate the heat dissipation performance; S5: after the debugging and detection are qualified, mount the IGBT chip on the mounting plate (8) through the mounting needle groove (5), rotate the knob (602), press the chip by the limiting member (4) through the gasket, and complete the manufacturing installation.

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