Temperature acquisition module and battery

Abstract

According to the temperature acquisition module and the battery provided by the invention, the first temperature acquisition assembly and the second temperature acquisition assembly can be mounted in a manner of clamping the clamping part and the matching part, and glue is not needed, so that the temperature acquisition module cannot be loosened due to temperature rise of the single battery in the working process. Moreover, the first temperature acquisition assembly and the second temperature acquisition assembly are respectively in direct contact with the conductive element and the top cover of the battery monomer, so that the heat conduction path is relatively short. Therefore, the accuracy of temperature acquisition can be obviously improved. Moreover, when pseudo soldering exists between the pole and the conductive element of the battery monomer or the pole and the conductive element are broken due to impact in the use process, the heat conduction path from the interior of the battery monomer to the conductive element is blocked, so that the temperature difference between the conductive element and the top cover is increased. Therefore, according to the temperature difference acquired by the first temperature acquisition assembly and the second temperature acquisition assembly, the connection condition between the pole and the conductive element can be indicated.

Description

Technical Field

[0001] The present invention relates to the technical field of new energy, and particularly relates to a temperature acquisition module and a battery. Background Art

[0002] When battery cells are grouped, a temperature acquisition module needs to be set up for temperature acquisition to facilitate thermal management. Currently, the temperature acquisition module is usually connected to the battery cell in the following two ways. One is to bond the temperature acquisition module to the top cover through glue. Since the working of the battery cell will cause the temperature of the top cover to rise, the bonding performance of the glue will decline under the influence of high temperature, which is likely to cause the temperature acquisition module to be adhesively loosened from the top cover, resulting in inaccurate temperature signals collected by the temperature acquisition module. The other is to arrange the temperature acquisition module on a nickel sheet, and the nickel sheet is then connected to a conductive element. At this time, the heat conduction path is relatively long and will change when conducting to the temperature acquisition module, resulting in a certain deviation between the temperature collected by the temperature acquisition module and the actual temperature of the battery cell. Summary of the Invention

[0003] Based on this, it is necessary to provide a temperature acquisition module and a battery that can improve the accuracy of temperature acquisition for the above problems.

[0004] A temperature acquisition module for being installed on a conductive element, the temperature acquisition module includes a first temperature acquisition component and a second temperature acquisition component. The first temperature acquisition component and the second temperature acquisition component can be respectively arranged on opposite sides of the conductive element. One of the first temperature acquisition component and the second temperature acquisition component is provided with a clamping portion, and the other is provided with a cooperating portion. The clamping portion can pass through the conductive element to be clamped with the cooperating portion, so that at least one of the first temperature acquisition component and the second temperature acquisition component can acquire the temperature on one side of the conductive element.

[0005] In one embodiment, the first temperature acquisition component includes a first frame, a first sensor and a first circuit board. The first sensor is installed on the first frame and connected to the first circuit board. The second temperature acquisition component includes a second frame, a second sensor and a second circuit board. The second sensor is installed on the second frame and connected to the second circuit board. One of the first frame and the second frame is provided with the clamping portion, and the other is provided with the cooperating portion. The first circuit board is arranged on the side of the first frame facing the conductive element to be in thermal connection with the conductive element, and / or the second circuit board is arranged on the side of the second frame facing the conductive element to be in thermal connection with the conductive element.

[0006] In one embodiment, the clamping portion includes a buckle provided on the second frame, and the mating portion includes a slot formed on the first frame. The buckle can pass through the conductive element and be snapped into the slot, so that the first frame can be fixed to one side surface of the conductive element to collect the temperature of the conductive element.

[0007] In one embodiment, a protrusion is provided at the end of the buckle, and a groove is formed on one side of the first frame facing away from the second temperature collection component. When the buckle is snapped into the slot, the protrusion can be inserted into the groove.

[0008] In one embodiment, an elastic pad is provided on one side of the second frame facing the first temperature collection component. The elastic pad can be abutted against the conductive element, so that the second temperature collection component is fixed to one side of the conductive element and is thermally insulated from the conductive element.

[0009] In one embodiment, the elastic pad is annular. An annular groove is formed on one side of the second frame facing the first temperature collection component. The elastic pad is partially sleeved in the annular groove and partially protrudes from the annular groove.

[0010] In one embodiment, a second circuit board and a heat-conducting pad are sequentially provided on one side of the second frame facing away from the first temperature collection component, so that the heat-conducting pad is thermally connected to the second sensor.

[0011] In one embodiment, the temperature collection module further includes an output connection board, a first buffer portion, and a second buffer portion. The first buffer portion and the second buffer portion are spaced apart at one end of the output connection board and are respectively connected to the first circuit board and the second circuit board. Both the first buffer portion and the second buffer portion can undergo elastic deformation.

[0012] In one embodiment, the temperature collection module further includes an output connection board that is simultaneously connected to the first circuit board and the second circuit board. First lines and second lines respectively connected to the first circuit board and the second circuit board are spaced apart along the width direction of the output connection board; Among them, the first line includes a plurality of first positive pins, a plurality of first negative pins, a first positive line, and a first negative line. The first positive pins and the first negative pins are alternately arranged along the extending direction of the output connection board. The first positive line and the first negative line are arranged on both sides of the first positive pins and the first negative pins along the width direction of the output connection board to be respectively connected to the plurality of first positive pins and the plurality of first negative pins.

[0013] A battery includes battery cells, conductive elements, and a temperature acquisition module as described in any one of the above embodiments. The conductive elements are connected to the terminal posts of the battery cells. The first temperature acquisition component and the second temperature acquisition component are respectively disposed on opposite sides of the conductive element. The clamping portion passes through the conductive element and is clamped with the mating portion, so as to collect the temperature on one side of the conductive element through at least one of the first temperature acquisition component and the second temperature acquisition component.

[0014] In one embodiment, one of the first temperature acquisition component and the second temperature acquisition component acquires the temperature of the conductive element, and the other is in thermal conduction connection with the top cover of the battery cell to acquire the temperature of the top cover of the battery cell.

[0015] Compared with the prior art, the above temperature acquisition module and battery have at least the following advantages: 1. The first temperature acquisition component and the second temperature acquisition component can be installed by clamping the clamping portion with the mating portion without the aid of glue, so the temperature acquisition module will not become loose due to the increase in temperature during the operation of the battery cell. Moreover, the first temperature acquisition component and the second temperature acquisition component are in direct contact with the conductive element and the top cover of the battery cell respectively, and the heat conduction path is short. Therefore, the accuracy of temperature acquisition can be significantly improved.

[0016] 2. When there is a virtual soldering between the terminal post of the battery cell and the conductive element or the connection is broken due to impact during use, the path of heat conduction from the inside of the battery cell to the conductive element is blocked, resulting in an increase in the temperature difference between the conductive element and the top cover. The first temperature acquisition component and the second temperature acquisition component can respectively acquire the temperatures at two locations of the conductive element and the top cover, and comprehensively understand the temperature field distribution inside the battery. Therefore, according to the temperature difference collected by the two, the connection condition between the terminal post and the conductive element can also be indicated. BRIEF DESCRIPTION OF THE DRAWINGS

[0017] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the drawings in the following description are only some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0018] Figure 1 It is a schematic diagram of the partial structure of the battery in an embodiment of the present invention; Figure 2 It is Figure 1 a schematic diagram of the assembly relationship between the temperature acquisition module and the conductive element in the shown battery; Figure 3 It isFigure 2 Cross-sectional view taken along A-A as shown; Figure 4 Schematic structural diagram of the temperature acquisition module in an embodiment of the present invention; Figure 5 is Figure 4 Schematic structural diagram of the first temperature acquisition component in the temperature acquisition module as shown; Figure 6 is Figure 4 Schematic structural diagram of the second temperature acquisition component in the temperature acquisition module as shown; Figure 7 is Figure 4 Cross-sectional view of the output connection plate in the temperature acquisition module as shown. Detailed implementation manners

[0019] In order to make the above objects, features and advantages of the present invention more obvious and understandable, the following will describe the detailed implementation manners of the present invention in conjunction with the accompanying drawings. Many specific details are set forth in the following description in order to fully understand the present invention. However, the present invention can be implemented in many other ways different from those described herein, and those skilled in the art can make similar improvements without departing from the connotation of the present invention. Therefore, the present invention is not limited by the specific embodiments disclosed below.

[0020] In the description of the present invention, it should be understood that the terms "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", "clockwise", "counterclockwise", "axial", "radial", "circumferential", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and are only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as limiting the present invention.

[0021] In addition, the terms "first" and "second" are only used for descriptive purposes and cannot be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the present invention, "a plurality" means at least two, such as two, three, etc., unless otherwise specifically defined.

[0022] In the present invention, unless otherwise clearly defined and limited, terms such as "installed", "connected", "joined", "fixed", etc. shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral one; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the internal communication of two components or the interaction relationship between two components, unless otherwise clearly defined. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0023] In the present invention, unless otherwise clearly defined and limited, the first feature being "on" or "under" the second feature may be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. Moreover, the first feature being "above", "over" and "on top of" the second feature may mean that the first feature is directly above or obliquely above the second feature, or merely indicates that the first feature is at a higher horizontal level than the second feature. The first feature being "under", "below" and "beneath" the second feature may be that the first feature is directly below or obliquely below the second feature, or merely indicates that the first feature is at a lower horizontal level than the second feature.

[0024] It should be noted that when an element is referred to as "fixed to" or "disposed on" another element, it can be directly on the other element or there may also be an intermediate element. When an element is considered to be "connected" to another element, it can be directly connected to the other element or there may be an intermediate element at the same time. The terms "vertical", "horizontal", "up", "down", "left", "right" and similar expressions used herein are only for the purpose of illustration and do not represent the only implementation.

[0025] Please refer to Figure 1 and Figure 2 , the present invention provides a battery 10 and a temperature acquisition module 300. Among them, the battery 10 in an embodiment of the present invention includes a battery cell 100, a conductive element 200 and a temperature acquisition module 300.

[0026] The battery cell 100 can be a lithium-ion battery, a sodium-ion battery or a magnesium-ion battery, and its external contour can be a flat body, a cuboid or other shapes, but are not limited thereto. Specifically, in this embodiment, the above battery cell 100 is a lithium-ion square shell battery. The battery cell 100 includes a top cover 110, and a pole 120 is provided on the top cover 110.

[0027] The conductive element 200 is used to connect the battery cells 100, so as to achieve series connection, parallel connection or hybrid connection between the battery cells 100. Among them, the conductive element 200 is connected to the terminal post 120 of the battery cell 100, so as to realize electrical connection with the battery cell 100. Usually, the conductive element 200 is welded to the terminal post 120 of the battery cell 100. The conductive element 200 can be an aluminum busbar, and its thickness is generally between 1 mm and 2 mm.

[0028] The temperature acquisition module 300 can be installed on the conductive element 200 and is used to acquire the temperature of the corresponding battery cell 100. Specifically, at least one temperature acquisition module 300 is arranged on each battery cell 100, so that the acquisition of temperature signals can be realized for each battery cell 100.

[0029] In addition, the above-mentioned battery 10 generally further includes a flat flexible cable 400 and a connector 500, and the connector 500 is connected to the flat flexible cable 400. The temperature acquisition module 300 on each battery cell 100 can be electrically connected to the flat flexible cable 400, so as to transmit the acquired temperature signal to the flat flexible cable 400 for summarization. The connector 500 can be plugged into the battery management system (BMS), so as to send the summarized temperature signal to the battery management system, so as to realize thermal management of the battery 10.

[0030] Please refer to Figure 3 and Figure 4 In a temperature acquisition module 300 in an embodiment of the present invention, it includes a first temperature acquisition component 310 and a second temperature acquisition component 320.

[0031] Both the first temperature acquisition component 310 and the second temperature acquisition component 320 can acquire temperature signals. Among them, the first temperature acquisition component 310 and the second temperature acquisition component 320 are respectively arranged on opposite sides of the conductive element 200, and the first temperature acquisition component 310 is located on the side of the conductive element 200 facing away from the battery cell 100, and the second temperature acquisition component 320 is located on the side of the conductive element 200 facing the battery cell 100.

[0032] During assembly, the first temperature acquisition component 310 and the second temperature acquisition component 320 are first fixed to the conductive element 200, and then the conductive element 200 is welded to the terminal post 120 of the battery cell 100. Moreover, the second temperature acquisition component 320 abuts against the top cover 110 of the battery cell 100. It can be seen that the first temperature acquisition component 310 is mainly used to acquire the temperature information of the conductive element 200, while the second temperature acquisition component 320 is mainly used to acquire the temperature information of the top cover 110 of the battery cell 100. Of course, in some embodiments, the second temperature acquisition component 320 can also acquire the temperature information of the conductive element 200.

[0033] After integrating two temperature acquisition components, even if one of the acquisition components fails, the other can still continue to work, ensuring the continuity of temperature acquisition, avoiding the failure of the entire temperature monitoring system due to the failure of a single acquisition point, and thus improving the reliability and stability of temperature acquisition.

[0034] Since the first temperature acquisition component 310 and the second temperature acquisition component 320 are in direct contact with the conductive element 200 and the top cover 110 of the battery cell 100 respectively, the heat conduction path is shortened, and at the same time, multi-point temperature measurement is realized. The temperature information collected by the first temperature acquisition component 310 and the second temperature acquisition component 320 can better reflect the temperature distribution inside the battery cell 100, avoiding errors and one-sidedness caused by single-point measurement, and improving the accuracy and stability of temperature measurement.

[0035] Moreover, when there is a virtual soldering between the terminal 120 of the battery cell 100 and the conductive element 200 or the connection is broken due to impact during use, the heat conduction path from the inside of the battery cell 100 to the conductive element 200 is blocked, resulting in an increase in the temperature difference between the conductive element 200 and the top cover 110. Thus, based on the temperature difference collected by the first temperature acquisition component 310 and the second temperature acquisition component 320, the connection condition between the terminal 120 and the conductive element 200 can be indicated. Specifically, when the temperature difference is within the preset range, it indicates that the connection between the terminal 120 and the conductive element 200 is normal, while when the temperature difference exceeds the preset range, it indicates that the connection between the terminal 120 and the conductive element 200 is abnormal. In addition, when there are differences in the collected temperature data, the first temperature acquisition component 310 and the second temperature acquisition component 320 can also cross-verify the data. The accuracy of the data of the first temperature acquisition component 310 and the second temperature acquisition component 320 can be judged through a preset algorithm, or a result closer to the true value can be obtained by integrating the two data, thereby improving the accuracy of temperature measurement.

[0036] Furthermore, one of the first temperature acquisition component 310 and the second temperature acquisition component 320 is provided with a clamping portion 3211, and the other is provided with a mating portion 3111 (see Figure 5 ). Moreover, the clamping portion 3211 can pass through the conductive element 200 to engage with the mating portion 3111. Therefore, the first temperature acquisition component 310 and the second temperature acquisition component 320 can be installed under the clamping action of the clamping portion 3211 and the mating portion 3111.

[0037] Specifically, the clamping portion 3211 is provided on the second temperature acquisition component 320, and the mating portion 3111 is provided on the first temperature acquisition component 310. Of course, the clamping portion 3211 can also be provided on the first temperature acquisition component 310, and the mating portion 3111 is provided on the second temperature acquisition component 320. The conductive element 200 is provided with a through hole for the clamping portion 3211 to pass through. The shape of the through hole matches the shape of the clamping portion 3211, and the opening range thereof should be slightly larger than the outer diameter of the clamping portion 3211 to ensure that the clamping portion 3211 can pass through smoothly.

[0038] More specifically, in this embodiment, the clamping portion 3211 includes a buckle, and the mating portion 3111 includes a clamping groove. The buckle can pass through the conductive element 200 and be snapped into the clamping groove. The buckles are usually arranged in pairs and can undergo elastic deformation, and the clamping grooves are arranged in one-to-one correspondence with the buckles. During assembly, the buckles will be subjected to an inward squeezing force when passing through the conductive element 200 and inserting into the clamping groove, so that the buckles move closer to each other inwardly; after the buckles completely pass through the conductive element 200 and are inserted into the clamping groove, the squeezing force disappears, and the buckles rebound and form a firm clamping with the clamping groove, so that the first temperature acquisition component 310 and the second temperature acquisition component 320 can be jointly fixed to the conductive element 200.

[0039] The integrated temperature acquisition module 300 has a smaller volume and a more compact structure, which is convenient for installation in a limited space. Since the first temperature acquisition component 310 and the second temperature acquisition component 320 can be installed by the clamping of the clamping portion 3211 and the mating portion 3111 without the aid of glue bonding, even if the temperature of the battery cell 100 rises during operation, the temperature acquisition module 300 will not become loose. The first temperature acquisition component 310 and the second temperature acquisition component 320 can always maintain good contact with the conductive element 200 and the top cover 110 of the battery cell 100, thereby further improving the accuracy of temperature acquisition; on the other hand, it is also convenient for the maintenance of the temperature acquisition module 300, improving the overall performance and reliability of the battery 10.

[0040] Please refer to Figure 5 , in this embodiment, the first temperature acquisition component 310 includes a first frame 311, a first sensor 312 and a first circuit board 313. The first sensor 312 is installed on the first frame 311 and connected to the first circuit board 313.

[0041] The first frame 311 plays a supporting role and is generally formed of an insulating material such as polyethylene, polypropylene, etc. The first sensor 312 is used to convert the temperature signal into an electrical signal. Specifically, the first sensor 312 can adopt a thermistor, and the resistance value of the thermistor has a negative correlation with the temperature. Therefore, the temperature can be sensed and measured by measuring the change in the resistance value of the thermistor. The first circuit board 313 can be a flexible circuit board, which is generally based on polyimide (PI) and polyester (PET) films and has high reliability and flexibility. The first circuit board 313 is electrically connected to the first sensor 312 and can ultimately be electrically connected to the flat flexible cable 400, so as to output the temperature signal collected by the first sensor 312.

[0042] Please refer to Figure 6 , the structure of the second temperature acquisition component 320 is substantially the same as that of the first temperature acquisition component 310. Specifically, the second temperature acquisition component 320 includes a second frame 321, a second sensor 322, and a second circuit board 323. The second sensor 322 is installed on the second frame 321 and is connected to the second circuit board 323. The second frame 321 is also generally formed of an insulating material, the second sensor 322 can also adopt a thermistor, and the second circuit board 323 can also be a flexible circuit board. One end of the second circuit board 323 is connected to the second sensor 322, and the other end can be connected to the flat flexible cable 400, so as to output the temperature signal collected by the second sensor 322.

[0043] Specifically, the mating portion 3111 is formed on the first frame 311, and the clamping portion 3211 is provided on the second frame 321. That is, a card slot is formed on the first frame 311, and a buckle is formed on the second frame 321. More specifically, in this embodiment, the first circuit board 313 is disposed on the side of the first frame 311 facing the conductive element 200 to be thermally connected to the conductive element 200, so that the first sensor 312 on the first circuit board 313 can better detect the temperature information of the conductive element 200. The second circuit board 323 is disposed on the side of the second frame 321 facing away from the conductive element 200 to be thermally connected to the top cover 110, so that the second sensor 322 on the second circuit board 323 can better detect the temperature information of the top cover 110.

[0044] Of course, in some other embodiments, the second circuit board 323 can also be disposed on the side of the second frame 321 facing the conductive element 200 to be thermally connected to the conductive element 200. In this way, both the first sensor 312 and the second sensor 322 can better detect the temperature information of the conductive element 200. The first sensor 312 and the second sensor 322 can respectively detect the temperatures of two opposite sides of the conductive element 200, and then the temperature distribution of the conductive element 200 can be analyzed to detect the connection condition between the conductive element 200 and the battery cell.

[0045] Further, in this embodiment, a protrusion 3212 is provided at the end of the buckle. A groove 3112 is formed on the side of the first frame 311 facing away from the second temperature acquisition component 320. When the buckle is inserted into the card slot, the protrusion 3212 can be inserted into the groove 3112. The cooperation between the protrusion 3212 and the groove 3112 can improve the stability of the buckle and the card slot connection, thereby further enhancing the reliability of the installation of the first temperature acquisition component 310 and the second temperature acquisition component 320.

[0046] In this embodiment, the first frame 311 encloses a first accommodation cavity, and the first sensor 312 is received in the first accommodation cavity. That is to say, the first frame 311 is a hollow frame structure, and the first sensor 312 is located inside the first frame 311, so it can be well protected by the first frame 311.

[0047] Similarly, the second frame 321 encloses a second accommodation cavity, and the second sensor 322 is received in the second accommodation cavity. Therefore, the second sensor 322 can also be well protected by the second frame 321.

[0048] Further, in this embodiment, a first potting adhesive 314 is filled in the first accommodation cavity, and a second potting adhesive 324 is filled in the second accommodation cavity. The first potting adhesive 314 and the second potting adhesive 324 can respectively seal the first sensor 312 and the second sensor 322 in the first frame 311 and the second frame 321, thereby further protecting the first sensor 312 and the second sensor 322. Moreover, the first potting adhesive 314 and the second potting adhesive 324 can also respectively strengthen the connection between the first frame 311 and the second frame 321 and the first circuit board 313 and the second circuit board 323.

[0049] Please refer to again Figure 3 and Figure 6 , in this embodiment, an elastic pad 325 is provided on the side of the second frame 321 facing the first temperature acquisition component 310. The elastic pad 325 can abut against the conductive element 200 so that the second temperature acquisition component 320 is fixed on one side of the conductive element 200 and is thermally insulated from the conductive element 200.

[0050] The elastic pad 325 can be formed of materials such as silicone foam and rubber, so that the elastic pad 325 has a certain elasticity. On the one hand, when the clamping portion 3211 is clamped with the mating portion 3111, the elastic pad 325 is squeezed and compressed, and a reaction force is applied to the first temperature acquisition component 310 and the second temperature acquisition component 320, thereby enhancing the clamping tightness between the first temperature acquisition component 310 and the second temperature acquisition component 320. At the same time, since the first temperature acquisition component 310 is subjected to a tensile force, it is in closer contact with the conductive element 200, which helps to reduce the thermal resistance between the first temperature acquisition component 310 and the conductive element 200 and further improve the accuracy of temperature acquisition. On the other hand, the elastic pad 325 has a heat insulation effect. The elastic pad 325 can play a heat insulation role between the second temperature acquisition component 320 and the conductive element 200, so that the temperature information of the top cover 110 collected by the second temperature acquisition component 320 is less interfered by the heat conduction element 200, and the accuracy of the second temperature acquisition component 320 for collecting the temperature of the top cover 110 is improved.

[0051] Further, in this embodiment, the elastic pad 325 is annular. A circular groove (not labeled in the figure) is formed on the side of the second frame 321 facing the first temperature acquisition component 310. The elastic pad 325 is partially sleeved in the circular groove and partially protrudes from the circular groove.

[0052] The elastic pad 325 is sleeved on the second frame 321 and partially received in the circular groove, so the installation is convenient and dislocation is not likely to occur. It should be noted that the depth of the circular groove is generally less than the thickness of the elastic pad 325 to ensure that a part of the elastic pad 325 can protrude from the circular groove to achieve direct contact with the conductive element 200.

[0053] In addition, in this embodiment, a heat conduction pad 326 is provided on the side of the second frame 321 facing away from the first temperature acquisition component 310. The second circuit board 323 and the heat conduction pad 326 are stacked so that the heat conduction pad 326 is in heat conduction connection with the second sensor 322.

[0054] The heat-conducting pad 326 is in direct contact with the top cover 110 of the battery cell 100, so as to reduce the thermal resistance between the top cover 110 and the second sensor 322, making the temperature collected by the second sensor 322 closer to the actual temperature of the battery cell 100. Specifically, the heat-conducting pad 326 can be formed of materials such as heat-conducting glue. The heat-conducting pad 326 also has a certain elasticity. When the heat-conducting pad 326 contacts the top cover 110 of the battery cell 100, the heat-conducting pad 326 can undergo elastic deformation, thereby filling the gap between the second temperature acquisition component 320 and the top cover 110 of the battery cell 100, achieving good fitting between the second sensor 322 and the top cover 110 to ensure the accuracy of temperature acquisition. On the other hand, the elasticity of the heat-conducting pad 326 can play a certain buffering role, reducing the impact of mechanical stresses such as vibration or shock of the battery 10 on the second temperature acquisition component 320.

[0055] Please refer to again Figure 4 、 Figure 5 and Figure 6 In this embodiment, the temperature acquisition module 300 further includes an output connection board 330, a first buffer portion 340, and a second buffer portion 350. The first buffer portion 340 and the second buffer portion 350 are spaced apart and disposed at one end of the output connection board 330, and are respectively connected to the first circuit board 313 and the second circuit board 323. Both the first buffer portion 340 and the second buffer portion 350 can undergo elastic deformation.

[0056] Specifically, one end of the output connection board 330 is respectively connected to the first circuit board 313 and the second circuit board 323 through the first buffer portion 340 and the second buffer portion 350, and the other end is used to connect to the flat flexible cable 400, thereby realizing electrical connection between the first circuit board 313, the second circuit board 323, and the flat flexible cable 400. Through elastic deformation, the first buffer portion 340 and the second buffer portion 350 can respectively play a buffering role between the first circuit board 313, the second circuit board 323, and the output connection board 330, preventing the vibration and position change of the first temperature acquisition component 310 and the second temperature acquisition component 320 from being transmitted to the output connection board 330, thereby avoiding tearing at the connection between the output connection board 330 and the connected flat flexible cable 400.

[0057] More specifically, the first buffer portion 340 and the second buffer portion 350 can undergo elastic deformation in the extending direction, width direction, and thickness direction of the output connection board 330 to achieve the best buffering effect. Among them, the first buffer portion 340 and the second buffer portion 350 can be set in shapes such as S shape, C shape, or O shape. Moreover, there is a height difference between the first buffer portion 340 and the second buffer portion 350 in the thickness direction of the output connection board 330 to avoid mutual interference between the two.

[0058] It should be noted that the output connection board 330, the first buffer part 340, and the second buffer part 350 can be a flexible circuit board structure integrally formed with the first circuit board 313 and the second circuit board 323. In this way, the number of solder joints can be reduced and it helps to reduce the volume of the temperature acquisition module 300.

[0059] In addition, please also refer to Figure 7 , in this embodiment, the output connection board 330 is provided with a first circuit 331 and a second circuit 332 that are respectively connected to the first circuit board 313 and the second circuit board 323 at intervals along its width direction; wherein, the first circuit 331 includes a plurality of first positive pins 3311, a plurality of first negative pins 3312, a first positive circuit 3313 and a first negative circuit 3314. The first positive pins 3311 and the first negative pins 3312 are alternately arranged along the extension direction of the output connection board 330, and the first positive circuit 3313 and the first negative circuit 3314 are arranged on both sides of the first positive pins 3311 and the first negative pins 3312 along the width direction of the output connection board 330 to be respectively connected to the plurality of first positive pins 3311 and the plurality of first negative pins 3312.

[0060] Similarly, the second circuit 332 includes a plurality of second positive pins 3321, a plurality of second negative pins 3322, a second positive circuit 3323 and a second negative circuit 3324. The second positive pins 3321 and the second negative pins 3322 are alternately arranged along the extension direction of the output connection board 330, and the second positive circuit 3323 and the second negative circuit 3324 are arranged on both sides of the second positive pins 3321 and the second negative pins 3322 along the width direction of the output connection board 330 to be respectively connected to the plurality of second positive pins 3321 and the plurality of second negative pins 3322.

[0061] Both the first circuit 331 and the second circuit 332 need to be electrically connected to the flat flexible cable 400 to achieve temperature signal transmission. Specifically, a plurality of first positive pins 3311 and a plurality of first negative pins 3312 can be soldered to the pads on the flat flexible cable 400, so as to realize the electrical connection between the first positive circuit 3313 and the first negative circuit 3314 and the flat flexible cable 400. Similarly, a plurality of second positive pins 3321 and a plurality of second negative pins 3322 can also be soldered to the pads on the flat flexible cable 400, so as to realize the electrical connection between the second positive circuit 3323 and the second negative circuit 3324 and the flat flexible cable 400.

[0062] Moreover, after the output connection board 330 is welded to the flexible flat cable 400, multiple solder joints thereon can be evenly distributed along the extending direction of the output connection board 330, so that the pulling forces on the first circuit board 313 and the second circuit board 323 are relatively uniform, thereby improving the anti-pulling ability of the temperature acquisition module 300, enhancing the overall strength and preventing warping.

[0063] Furthermore, since the first positive electrode pin 3311 and the first negative electrode pin 3312 are arranged alternately along the length direction of the output connection board 330, the space in the width direction of the output connection board 330 can be shared. Similarly, the second positive electrode pin 3321 and the second negative electrode pin 3322 can also share the space in the width direction of the output connection board 330. Therefore, the size of the output connection board 330 in the width direction can be further reduced, and the space occupied on the flexible flat cable 400 can be reduced.

[0064] Generally, the first positive electrode pin 3311 and the first negative electrode pin 3312 are arranged in a row and distributed close to one side edge in the width direction of the output connection board 330. The second positive electrode pin 3321 and the second negative electrode pin 3322 are also arranged in a row and distributed close to the other side edge in the width direction of the output connection board 330, so as to avoid interference between the first circuit 331 and the second circuit 332.

[0065] Even further, in this embodiment, the surface of the output connection board 330 is coated with an insulating layer, and openings (not marked in the figure) are provided in the insulating layer corresponding to each first positive electrode pin 3311, each first negative electrode pin 3312, each second positive electrode pin 3321, and each second negative electrode pin 3322. Each first positive electrode pin 3311, each first negative electrode pin 3312, each second positive electrode pin 3321, and each second negative electrode pin 3322 are exposed from the corresponding openings, and a gap is formed between them and the inner wall of the opening.

[0066] The first positive electrode pin 3311, the first negative electrode pin 3312, the second positive electrode pin 3321, and the second negative electrode pin 3322 are exposed by means of the openings, which can prevent them from protruding from the surface of the output connection board 330 and can play a certain protective role for the first positive electrode pin 3311, the first negative electrode pin 3312, the second positive electrode pin 3321, and the second negative electrode pin 3322. Moreover, since a gap is formed between the first positive electrode pin 3311, the first negative electrode pin 3312, the second positive electrode pin 3321, and the second negative electrode pin 3322 and the inner wall of the opening, the solder can flow into this gap during welding, thus ensuring firm welding.

[0067] Specifically, the first positive electrode pin 3311, the first negative electrode pin 3312, the second positive electrode pin 3321, and the second negative electrode pin 3322 can all be set to be arc-shaped, while the opening window is set to be rectangular. Therefore, gaps can be naturally formed between the first positive electrode pin 3311, the first negative electrode pin 3312, the second positive electrode pin 3321, and the second negative electrode pin 3322 and the inner wall of the opening window, and their tensile strength can be improved.

[0068] It should be noted that in other embodiments, the required gaps can also be formed by setting the sizes of the first positive electrode pin 3311, the first negative electrode pin 3312, the second positive electrode pin 3321, and the second negative electrode pin 3322 to be slightly smaller than the size of the opening window.

[0069] For the above battery 10 and temperature acquisition module 300, the first temperature acquisition component 310 and the second temperature acquisition component 320 can be installed by the way that the clamping part 3211 is clamped with the mating part 3111, without the aid of glue. Therefore, the temperature acquisition module 300 will not become loose due to the increase in temperature during the operation of the battery cell 100. Moreover, the first temperature acquisition component 310 and the second temperature acquisition component 320 are in direct contact with the conductive element 200 and the top cover 110 of the battery cell 100 respectively, and the heat conduction path is short. Therefore, the accuracy of temperature acquisition can be significantly improved. Moreover, the first temperature acquisition component 310 and the second temperature acquisition component 320 can respectively acquire the temperatures at two places, namely the conductive element 200 and the top cover 110 of the battery cell 100, to more comprehensively understand the internal temperature field distribution of the battery 10. Therefore, according to the temperature difference collected by the two, the connection condition between the terminal 120 of the battery cell 100 and the conductive element 200 can also be indicated.

[0070] The technical features of the above-described embodiments can be combined arbitrarily. For the sake of brief description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope described in this specification.

[0071] The above-described embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and improvements can still be made, and these all belong to the protection scope of the present invention. Therefore, the protection scope of the present invention patent should be subject to the appended claims.

Claims

1. A temperature acquisition module (300) for being installed on a conductive element (200), characterized in that, The temperature acquisition module (300) includes a first temperature acquisition component (310) and a second temperature acquisition component (320). The first temperature acquisition component (310) and the second temperature acquisition component (320) can be respectively arranged on opposite sides of the conductive element (200). One of the first temperature acquisition component (310) and the second temperature acquisition component (320) is provided with a clamping portion (3211), and the other is provided with a mating portion (3111). The clamping portion (3211) can pass through the conductive element (200) and be clamped with the mating portion (3111), so that at least one of the first temperature acquisition component (310) and the second temperature acquisition component (320) can acquire the temperature on one side of the conductive element (200).

2. The temperature acquisition module (300) according to claim 1, characterized in that The first temperature acquisition component (310) includes a first frame (311), a first sensor (312) and a first circuit board (313). The first sensor (312) is installed on the first frame (311) and is connected to the first circuit board (313). The second temperature acquisition component (320) includes a second frame (321), a second sensor (322) and a second circuit board (323). The second sensor (322) is installed on the second frame (321) and is connected to the second circuit board (323). One of the first frame (311) and the second frame (321) is provided with the clamping portion (3211), and the other is provided with the mating portion (3111). The first circuit board (313) is arranged on the side of the first frame (311) facing the conductive element (200) to be in heat conduction connection with the conductive element (200), and / or the second circuit board (323) is arranged on the side of the second frame (321) facing the conductive element (200) to be in heat conduction connection with the conductive element (200).

3. The temperature acquisition module (300) according to claim 2, characterized in that, The clamping portion (3211) includes a buckle arranged on the second frame (321). The mating portion (3111) includes a card slot formed on the first frame (311). The buckle can pass through the conductive element (200) and be snapped into the card slot, so that the first frame (311) can be fixed on one side surface of the conductive element (200) to acquire the temperature of the conductive element (200).

4. The temperature acquisition module (300) according to claim 3, characterized in that, A protrusion (3212) is arranged at the end of the buckle. A groove (3112) is formed on the side of the first frame (311) facing away from the second temperature acquisition component (320). When the buckle is snapped into the card slot, the protrusion (3212) can be inserted into the groove (3112).

5. The temperature acquisition module (300) according to any one of claims 2-4, characterized in that, An elastic pad (325) is arranged on the side of the second frame (321) facing the first temperature acquisition component (310). The elastic pad (325) can be abutted against the conductive element (200), so that the second temperature acquisition component (320) is fixed on one side of the conductive element (200) and is in heat insulation connection with the conductive element (200).

6. The temperature acquisition module (300) according to claim 5, characterized in that, The elastic pad (325) is annular. On the side of the second frame (321) facing the first temperature acquisition component (310), an annular groove is formed. The elastic pad (325) is partially sleeved in the annular groove and partially protrudes from the annular groove.

7. The temperature acquisition module (300) according to any one of claims 2-4, characterized in that, On the side of the second frame (321) facing away from the first temperature acquisition component (310), a second circuit board (323) and a heat-conducting pad (326) are sequentially arranged, so that the heat-conducting pad (326) is in heat-conducting connection with the second sensor (322).

8. The temperature acquisition module (300) according to any one of claims 2-4, characterized in that, The temperature acquisition module (300) further includes an output connection board (330), a first buffer part (340) and a second buffer part (350). The first buffer part (340) and the second buffer part (350) are arranged at intervals at one end of the output connection board (330) and are respectively connected to the first circuit board (313) and the second circuit board (323). Both the first buffer part (340) and the second buffer part (350) can undergo elastic deformation.

9. The temperature acquisition module (300) according to claim 2, wherein, The temperature acquisition module (300) further includes an output connection board (330) connected to both the first circuit board (313) and the second circuit board (323). On the output connection board (330) along its width direction, a first line (331) and a second line (332) respectively connected to the first circuit board (313) and the second circuit board (323) are arranged at intervals. Among them, the first line (331) includes a plurality of first positive pins (3311), a plurality of first negative pins (3312), a first positive line (3313) and a first negative line (3314). The first positive pins (3311) and the first negative pins (3312) are alternately arranged along the extending direction of the output connection board (330). The first positive line (3313) and the first negative line (3314) are arranged on both sides of the first positive pins (3311) and the first negative pins (3312) along the width direction of the output connection board (330) to be respectively connected to the plurality of first positive pins (3311) and the plurality of first negative pins (3312).

10. A battery (10), characterized in that, It includes a battery cell (100), a conductive element (200) and the temperature acquisition module (300) according to any one of claims 1 to 9 above. The conductive element (200) is connected to the pole post of the battery cell (100). The first temperature acquisition component (310) and the second temperature acquisition component (320) are respectively arranged on opposite sides of the conductive element (200). The clamping part (3211) passes through the conductive element (200) to be clamped with the matching part (3111), so as to collect the temperature on one side of the conductive element (200) through at least one of the first temperature acquisition component (310) and the second temperature acquisition component (320).

11. The battery (10) according to claim 10, characterized in that, One of the first temperature acquisition component (310) and the second temperature acquisition component (320) acquires the temperature of the conductive element (200), and the other is thermally connected to the top cover of the battery cell (100) to acquire the temperature of the top cover of the battery cell (100).

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