Semiconductor laser bar packaging clamp suitable for different cavity lengths and packaging method

Abstract

The invention particularly relates to a semiconductor laser bar packaging clamp suitable for different cavity lengths and a packaging method, and aims to solve the problems that an existing packaging clamp is poor in universality, cannot adapt to semiconductor laser bars with different cavity lengths, and is difficult to uniformly flatten a semiconductor laser chip so as to ensure the packaging quality. The device comprises a base, a bearing plate and a positioning assembly which are arranged on the inclined surface of the base, a positioning table arranged at the lower part of the inclined surface, a trapezoidal supporting table arranged in a guide groove of the positioning table, a trapezoidal pressure block arranged on the inclined surface of the trapezoidal supporting table and used for pressing a chip, and an adjusting assembly arranged on the positioning table and used for adjusting the position of the trapezoidal supporting table, the spring positioning device and the spring are arranged between the trapezoidal supporting table and the side wall of the guide groove; the clamp can accurately fix and align semiconductor laser bars with different lengths, ensures the position accuracy of chips in the welding process, and improves the reliability and consistency of packaging.

Description

Technical Field

[0001] The present invention relates to a welding fixture for semiconductor laser chips, and particularly to a packaging fixture and a packaging method for semiconductor laser bars with different cavity lengths. Background Art

[0002] In the manufacturing and production process of semiconductor lasers, packaging is a crucial link and the core link to ensure the performance, reliability, and service life of the chips. Currently, high-power semiconductor laser bar chips are basically packaged on microchannel heat sinks to ensure efficient heat dissipation of the chips. The bar chips and the heat sinks are packaged by reflow soldering, and the quality of reflow soldering directly determines whether the conductive and heat conduction paths of the chips are smooth. On the one hand, during reflow soldering, the solder undergoes a state change from solid to liquid and then to solid, and welding problems such as voids and solder bridging are likely to occur during this process. It is necessary to use a reflow fixture to accurately fix components such as the bar chips and the heat sinks in place to prevent deformation or displacement caused by high temperature. On the other hand, due to the small size and light weight of semiconductor laser bar chips, they are easily "lifted" under the action of the surface tension of the solder during welding, resulting in the solder shrinking towards the middle of the chip and the surrounding areas of the chip not being fully wetted. It is necessary to use a packaging fixture to apply sufficient welding pressure to the chips to break the tension effect during solder melting.

[0003] Currently, the packaging fixtures used in the industry are mainly of two types: probe type and block type. The pressure application method of the probe type packaging fixture is to directly apply pressure to the chip surface through elastic elements and probes. For example, a sintering fixture for high-power laser bar chips proposed in Chinese Patent CN105428994B applies different pressures to different parts of the chip through spring probes to balance the stress on the chip and correct bending, thereby significantly improving the beam quality of the chip. However, this method requires continuous adjustment of the pressure of each probe, making it difficult to ensure the consistency of bar sintering and is not conducive to batch production. The block type packaging fixture indirectly transmits the force to the surface of the bar chip using fastening devices such as blocks. The block is connected to components such as the chip and the heat sink through fastening bolts or other fixing devices. When the fastening bolt is tightened, the block receives a downward force, and this force is transmitted to the surface of the bar chip through the block, thereby applying pressure to the bar chip. For example, a sintering fixture and a sintering method for a high-power conduction-cooled packaged structure bar laser proposed in Chinese Patent CN111628405B use fastening bolts to fix the block, the bar chip, and the CS heat sink, and preset the torque value through a torque screwdriver to quantitatively control the pressure applied to the chip. Although the design purpose of this structure is to provide a uniform pressure distribution, this requires very high surface flatness of the chip and the heat sink, and it is very difficult to achieve a completely uniform pressure distribution in actual applications, which may lead to problems such as insufficient or excessive local pressure, thereby affecting the welding quality.

[0004] In addition, the current packaging fixtures are not universally suitable for the reflow packaging of semiconductor laser bar chips with different cavity lengths. This means that when welding bar chips with different cavity lengths, packaging fixtures with matching sizes need to be designed, which increases R&D and production costs, reduces production efficiency, and lacks flexibility in the production process. Summary of the invention

[0005] The main purpose of the present invention is to solve the problem that the existing packaging fixture has poor versatility, cannot adapt to semiconductor laser bars with different cavity lengths, and is difficult to uniformly flatten the semiconductor laser chip to ensure the packaging quality, and to provide a semiconductor laser bar packaging fixture and packaging method suitable for different cavity lengths.

[0006] The idea of ​​the present invention is: by precisely applying pressure to the center line of the chip along the length of the cavity, the gas generated during the reflow temperature increase process can be smoothly discharged from the center of the chip to both sides, thereby effectively reducing the void rate in the solder layer and improving the welding quality; in addition, by adjusting the displacement of the trapezoidal support, the position of the gravity line of the pressure block can be flexibly adjusted, so that the fixture has higher adaptability and flexibility to meet different packaging sizes and process requirements.

[0007] In order to achieve the above invention objectives and complete the above invention concepts, the present invention provides the following technical solutions:

[0008] A semiconductor laser bar packaging fixture suitable for different cavity lengths, including a base, has the following special features:

[0009] The base is processed with an inclined surface for placing the heat sink to be packaged, and a positioning boss is respectively arranged on both sides of the inclined surface, and the spacing between the two positioning bosses is adapted to the width of the heat sink to be packaged, and a pressure plate is arranged on the inclined surface between the two positioning bosses; a positioning component passing through the pressure plate is arranged at a position corresponding to the positioning hole of the heat sink to be packaged on the inclined surface of the base, and is used to position the heat sink to be packaged, the chip, the negative electrode sheet, and the insulating sheet;

[0010] A positioning platform is provided at the bottom of the inclined surface on the base, and the upper surface of the positioning platform is higher than the bottom of the inclined surface, the side surface where the positioning platform meets the inclined surface is the positioning inclined surface, and the positioning inclined surface is perpendicular to the inclined surface on the base; a vertical guide groove is provided on the positioning platform, and a trapezoidal support platform is placed in the guide groove; a spring positioning assembly is provided between the front side surface of the inner wall of the guide groove and the upper bottom surface of the trapezoidal support platform, and a spring is sleeved on the spring, one end of the spring abuts against the front side surface of the inner wall of the guide groove, and the other end abuts against the upper bottom surface of the trapezoidal support platform;

[0011] The horizontal cross-section of the trapezoidal support platform is rectangular, and the vertical cross-section parallel to the side wall is a right trapezoid. Its upper base faces the inclined plane side on the base. The side wall above the guide groove is a guide inclined plane, and the angle α between the guide inclined plane and the horizontal plane is 40° - 60°. Above the guide inclined plane, there is a trapezoidal pressure block. The horizontal cross-section of the trapezoidal pressure block is rectangular, and the vertical cross-section parallel to the side wall is a right trapezoid. Its upper base faces away from the inclined plane side on the base. The inclined plane of the trapezoidal pressure block fits with the guide inclined plane of the trapezoidal support platform, and the angle β with the horizontal plane is 90° - α. The lower corner of the trapezoidal pressure block is used to press the negative electrode sheet to be encapsulated in a line contact form, indirectly pressing the chip.

[0012] At the position on the base corresponding to the rear side face of the trapezoidal support platform, an adjusting component is provided that penetrates the side wall of the positioning platform and is used to adjust the position of the trapezoidal support platform back and forth to adjust the contact position between the trapezoidal pressure block and the chip. The heat sink and the chip are a microchannel heat sink and a semiconductor laser bar chip to be encapsulated together.

[0013] Further, a micrometer head mounting hole is provided on the side wall of the positioning platform of the base. The adjusting component is a micrometer head installed in the micrometer head mounting hole. The front end of the micrometer head is located in the micrometer head positioning groove provided on the rear side face of the trapezoidal support platform and is used to precisely adjust the position of the trapezoidal support platform.

[0014] Further, the positioning component includes a positioning stud of a bearing plate fixedly installed on the inclined plane of the base, extending perpendicular to the inclined plane and penetrating through. A nut is installed on the positioning stud to press the bearing plate.

[0015] Further, the inclined plane of the trapezoidal pressure block is composed of two mutually parallel first inclined planes and a second inclined plane. The first inclined plane fits with the guide inclined plane of the trapezoidal support platform, and there is a groove between the second inclined plane and the first inclined plane. The angle between the second inclined plane and the lower bottom surface of the trapezoidal pressure block is the lower corner of the trapezoidal pressure block.

[0016] Further, the spring positioning component includes a spring positioning post B provided on the front side face of the trapezoidal support platform and a spring positioning post A provided on the inner wall of the guide groove corresponding to the position of the spring positioning post B. The spring positioning post A is a hollow cylinder, and its inner diameter is adapted to the outer diameter of the spring positioning post B. The spring positioning post A is sleeved on the spring positioning post B, and the spring is sleeved on the outside of the spring positioning post A.

[0017] Further, the lower corner of the trapezoidal pressure block is provided with a rounded corner to avoid damaging the chip.

[0018] Further, the angle between the inclined plane of the base and the horizontal plane is 30° - 60° to ensure that under the action of gravity, the lower side face of the heat sink placed on the inclined plane of the base and the front cavity face of the chip are both in contact with the positioning inclined plane.

[0019] At the same time, the present invention also provides a semiconductor laser bar packaging method suitable for different cavity lengths, using the above-mentioned semiconductor laser bar packaging fixture suitable for different cavity lengths, which is special in that it includes the following steps:

[0020] Step 1, place the base on a horizontal plane, and put the spring on the spring positioning assembly;

[0021] Step 2, placing the trapezoidal support in the guide groove;

[0022] Step 3, install the adjustment component on the base, calculate the adjustment distance L of the trapezoidal support according to the size of the lower corner of the trapezoidal pressure block and the cavity length of the chip, and use the adjustment component to adjust the position of the trapezoidal support according to the adjustment distance L;

[0023] Step 4: Pass the heat sink and the insulating sheet through the positioning assembly in sequence, place them on the inclined surface of the base, place the chip on the upper surface of the heat sink, make the side of the chip flush with the heat sink, and the front cavity surface of the chip and the lower side of the heat sink are in contact with the positioning inclined surface; pass the negative plate and the pressure plate through the positioning assembly in sequence, press them on the insulating sheet and the chip, and press them tightly using the positioning assembly;

[0024] Step 5, placing the trapezoidal pressure block on the trapezoidal support, at which time the lower corner of the trapezoidal pressure block is just pressed on the negative plate, and the position of the lower corner is just on the middle dividing plane of the chip perpendicular to the cavity length direction, indirectly and evenly pressing the chip, so as to realize the pressing and positioning of the heat sink, chip, insulating sheet and negative plate;

[0025] Step 6, place the entire fixture into a vacuum reflow oven, perform reflow soldering on the heat sink, chip, insulating sheet, and negative plate to complete the packaging of the semiconductor laser bar chip.

[0026] Furthermore, step 3 is specifically as follows:

[0027] Step 3.1, install the screw micrometer into the micrometer mounting hole provided on the base, and position its front end in the micrometer positioning groove;

[0028] Step 3.2, calculate the adjustment distance L of the trapezoidal support according to the fillet radius of the lower corner of the trapezoidal pressure block and the cavity length of the chip. Assuming the cavity length of the chip is m, the fillet radius of the lower corner of the trapezoidal pressure block is r, then the distance from the lower corner of the trapezoidal pressure block to the front cavity surface of the chip is Adjust distance

[0029] Step 3.3, use the micrometer screw to adjust the position of the trapezoidal support according to the adjustment distance L.

[0030] Furthermore, step 1 is specifically as follows:

[0031] Place the base on a horizontal plane, slip the spring over the spring positioning post A, and engage the spring positioning post A with the spring positioning post B.

[0032] Compared with the prior art, the beneficial effects of the present invention are as follows:

[0033] 1. The semiconductor laser bar packaging fixture and packaging method applicable to different cavity lengths provided by the present invention have high adaptability and flexibility, which can meet diverse packaging requirements. By flexibly adjusting the position of the trapezoidal support platform, it is ensured that each chip can obtain an accurate pressing position and uniform pressure during the welding process, so that the fixture can be applicable to the packaging of semiconductor laser chips with different cavity lengths and sizes.

[0034] 2. The semiconductor laser bar packaging fixture and packaging method applicable to different cavity lengths provided by the present invention adopt a simplified operation process and an accurate positioning mechanism, reducing the operation difficulty and error rate. By precisely controlling the position of the trapezoidal support platform through a micrometer head, it is ensured that the trapezoidal pressure block can accurately apply pressure on the mid-plane of the chip perpendicular to the cavity length direction, realizing high-quality reflow soldering.

[0035] 3. The semiconductor laser bar packaging fixture and packaging method applicable to different cavity lengths provided by the present invention help to reduce production costs, improve the consistency of welding quality, reduce welding defects, and bring economic and technical advantages to the field of semiconductor laser bar packaging. BRIEF DESCRIPTION OF THE DRAWINGS

[0036] Figure 1 is a schematic diagram of the overall structure of an embodiment of a semiconductor laser bar packaging fixture applicable to different cavity lengths of the present invention;

[0037] Figure 2 is a schematic side view structure diagram of an embodiment of a semiconductor laser bar packaging fixture applicable to different cavity lengths of the present invention;

[0038] Figure 3 is a schematic diagram of the structural decomposition during the use of an embodiment of a semiconductor laser bar packaging fixture applicable to different cavity lengths of the present invention;

[0039] Figure 4 is a schematic diagram of the structure of the base in an embodiment of a semiconductor laser bar packaging fixture applicable to different cavity lengths of the present invention;

[0040] Figure 5 is a schematic diagram of the structure of the trapezoidal support platform in an embodiment of a semiconductor laser bar packaging fixture applicable to different cavity lengths of the present invention;

[0041] Description of the reference numerals:

[0042] 1 - Base; 101 - Positioning boss; 102 - Positioning stud; 103 - Spring positioning post A; 104 - Micrometer head mounting hole; 2 - Spring; 3 - Micrometer head; 4 - Trapezoidal support; 41 - Spring positioning post B; 42 - Micrometer head positioning groove; 5 - Trapezoidal pressure block; 6 - Bearing plate; 7 - Nut; 8 - Heat sink; 9 - Negative electrode plate; 10 - Insulating sheet; 11 - Chip. Detailed implementation manner

[0043] The present invention will be further described below in conjunction with the accompanying drawings and specific embodiments.

[0044] A semiconductor laser bar packaging fixture applicable to different cavity lengths, the specific structure of which is as Figures 1-3 shown, including a base 1. An inclined surface for placing the heat sink 8 is machined on the base 1. The included angle between the inclined surface and the horizontal plane is 45°. A bearing plate 6 is arranged thereon; at a position on the inclined surface of the base 1 corresponding to the positioning hole of the heat sink 8, a positioning stud 102 extending perpendicular to the inclined surface and passing through the bearing plate 6 is provided. A nut 7 for pressing is installed on the positioning stud 102 to position the heat sink 8; positioning bosses 101 for positioning the heat sink 8 are arranged on both sides of the inclined surface. The distance between the two positioning bosses 101 is 0.2 - 1 mm larger than the width of the heat sink 8;

[0045] A horizontal positioning platform is arranged at a position on the base 1 flush with the bottom of the inclined surface, and the upper surface of the positioning platform is higher than the bottom of the inclined surface. The side surface of the positioning platform in contact with the inclined surface is a positioning inclined surface, and the positioning inclined surface is perpendicular to the inclined surface on the base 1; a vertically oriented guiding groove is formed in the positioning platform, and a trapezoidal support 4 is placed in the guiding groove; a spring positioning post B 41 is arranged on the front side surface of the trapezoidal support 4, and its specific position is as Figure 4 shown; a spring positioning post A 103 is arranged on the inner wall of the guiding groove corresponding to the position of the spring positioning post B 41; the spring positioning post A 103 is a hollow cylinder, and its inner diameter is adapted to the outer diameter of the spring positioning post B 41; the spring positioning post A 103 is sleeved on the spring positioning post B 41, and the spring 2 is sleeved on the spring positioning post A 103, with one end abutted against the inner wall of the guiding groove and the other end abutted against the front side surface of the trapezoidal support 4;

[0046] The horizontal cross-section of the trapezoidal platform 4 is rectangular, and the vertical cross-section parallel to the side wall is a right trapezoid. Its upper base faces the inclined plane side on the base 1, and the side wall above the guiding groove is a guiding inclined plane. The angle α between the guiding inclined plane and the horizontal plane is 45°. A trapezoidal pressure block 5 is arranged thereon. The horizontal cross-section of the trapezoidal pressure block 5 is rectangular, and the vertical cross-section parallel to the side wall is a right trapezoid. Its upper base faces the side away from the inclined plane on the base 1. The inclined plane of the trapezoidal pressure block 5 is composed of two mutually parallel first inclined planes and second inclined planes. The first inclined plane is in contact with the guiding inclined plane of the trapezoidal platform 4, and there is a groove between the second inclined plane and the first inclined plane. The angles β between the first inclined plane and the second inclined plane and the horizontal plane are both 45°, and the first inclined plane is in close contact with the trapezoidal platform 4; the lower corner of the trapezoidal pressure block 5 is rounded, and the chip 11 is pressed in a line contact form to avoid damaging the chip 11;

[0047] A micrometer head mounting hole 104 is opened on the side wall of the positioning platform of the base 1, and a screw micrometer head 3 is installed therein. The front end of the screw micrometer head 3 is located in the micrometer head positioning groove 42 opened on the rear side of the trapezoidal platform 4.

[0048] This embodiment also includes a packaging method based on the above packaging fixture, including the following steps:

[0049] Step 1, place the base 1 on a horizontal plane, sleeved the spring 2 on the spring positioning post A 103, and make the spring positioning post A 103 and the spring positioning post B 41 fit together;

[0050] Step 2, place the trapezoidal platform 4 in the guiding groove;

[0051] Step 3.1, install the screw micrometer head 3 into the micrometer head mounting hole 104 provided on the base 1, and make its front end located in the micrometer head positioning groove 42;

[0052] Step 3.2, calculate the adjustment distance L of the trapezoidal platform 4 according to the radius size of the rounded corner at the lower corner of the trapezoidal pressure block 5 and the cavity length of the chip 11. Let the cavity length of the chip 11 be m, and the radius of the rounded corner at the lower corner of the trapezoidal pressure block 5 be r. Then the distance from the lower corner of the trapezoidal pressure block 5 to the front cavity surface position of the chip 11 is Adjustment distance

[0053] Step 3.3, use the screw micrometer head 3 to adjust the position of the trapezoidal platform 4 according to the adjustment distance L;

[0054] Step 4: Pass the heat sink 8 and the insulating sheet 10 through the positioning studs 102 in sequence, place them on the inclined surface of the base 1, place the chip 11 on the upper surface of the heat sink 8, make the side surface of the chip 11 flush with the heat sink 8, and make the front cavity surface of the chip 11 and the lower side surface of the heat sink 8 both contact the positioning inclined surface; pass the negative electrode plate 9 and the bearing plate 6 through the positioning studs 102 in sequence, press them on the insulating sheet 10 and the chip 11, and tighten them appropriately with the nuts 7.

[0055] Step 5: Place the trapezoidal pressure block 5 on the trapezoidal support 4. At this time, the lower corner of the trapezoidal pressure block 5 just presses on the negative electrode plate 9, and the position of the lower corner is exactly on the middle plane of the chip 11 perpendicular to the cavity length direction, indirectly and uniformly pressing the chip 11 to achieve the pressing and positioning of the heat sink 8, the chip 11, the insulating sheet 10, and the negative electrode plate 9.

[0056] Step 6: Place the entire fixture into a vacuum reflow oven to perform reflow soldering on the heat sink 8, the chip 11, the insulating sheet 10, and the negative electrode plate 9 to complete the encapsulation of the semiconductor laser bar chip.

[0057] In addition, according to the conventional dimensional parameters of the trapezoidal pressure block 5 and the chip 11 in this embodiment, the specific value of the adjustment distance L of the trapezoidal support 4 can be given for reference, where the fillet radius of the lower corner of the trapezoidal pressure block 5 is 0.2 mm:

[0058]

[0059] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them. For those of ordinary skill in the art, the specific technical solutions recorded in the foregoing embodiments can be modified, or some of the technical features can be equivalently replaced, and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions protected by the present invention.

Claims

1. A semiconductor laser bar package fixture applicable to different cavity lengths, comprising a base (1), characterized in that: On the base (1), an inclined surface for placing the heat sink (8) to be packaged is machined. On both sides of the inclined surface, a positioning boss (101) is respectively arranged. The distance between the two positioning bosses (101) is adapted to the width of the heat sink (8) to be packaged. On the inclined surface between the two positioning bosses (101), a bearing plate (6) is arranged; at the position corresponding to the positioning holes of the heat sink (8) to be packaged on the inclined surface of the base (1), a positioning component passing through the bearing plate (6) is arranged for positioning the heat sink (8), chip (11), negative electrode plate (9), and insulating sheet (10) to be packaged; At the bottom position of the inclined surface on the base (1), a positioning platform is arranged, and the upper surface of the positioning platform is higher than the bottom of the inclined surface. The side surface of the positioning platform connected to the inclined surface is a positioning inclined surface, and the positioning inclined surface is perpendicular to the inclined surface on the base (1); a vertically oriented guiding groove is opened on the positioning platform, and a trapezoidal support platform (4) is placed in the guiding groove; between the front side surface of the inner wall of the guiding groove and the upper bottom surface of the trapezoidal support platform (4), a spring positioning component is arranged, on which a spring (2) is sleeved. One end of the spring (2) abuts against the front side surface of the inner wall of the guiding groove, and the other end abuts against the upper bottom surface of the trapezoidal support platform (4); The horizontal cross-section of the trapezoidal support platform (4) is rectangular, and the vertical cross-section parallel to the side wall is a right trapezoid. Its upper bottom surface faces the inclined surface side of the base (1). The side wall above the guiding groove is a guiding inclined surface, and the angle α between the guiding inclined surface and the horizontal plane is 40° - 60°; above the guiding inclined surface, a trapezoidal pressure block (5) is arranged. The horizontal cross-section of the trapezoidal pressure block (5) is rectangular, and the vertical cross-section parallel to the side wall is a right trapezoid. The upper bottom surface faces away from the inclined surface side of the base (1). The inclined surface of the trapezoidal pressure block (5) fits with the guiding inclined surface of the trapezoidal support platform (4), and the angle β with the horizontal plane is 90° - α. The lower corner part of the trapezoidal pressure block (5) is used to press the negative electrode plate (9) to be packaged in a line contact form, indirectly pressing the chip (11); At the position on the base (1) corresponding to the rear side surface of the trapezoidal support platform (4), an adjusting component passing through the side wall of the positioning platform is arranged for adjusting the position of the trapezoidal support platform (4) back and forth to adjust the contact position between the trapezoidal pressure block (5) and the chip (11); the heat sink (8) and the chip (11) are a microchannel heat sink and a semiconductor laser bar chip to be packaged together.

2. The semiconductor laser bar package fixture applicable to different cavity lengths according to claim 1, characterized in that: A micrometer head mounting hole (104) is opened on the side wall of the positioning platform of the base (1); the adjusting component is a micrometer head (3) installed in the micrometer head mounting hole (104), and the front end of the micrometer head (3) is located in the micrometer head positioning groove (42) opened on the rear side surface of the trapezoidal support platform (4).

3. The semiconductor laser bar package fixture applicable to different cavity lengths according to claim 1, characterized in that: The positioning component includes a positioning stud (102) fixedly installed on the inclined surface of the base (1), extending in a direction perpendicular to the inclined surface and passing through the bearing plate (6). A nut (7) for pressing the bearing plate (6) is installed on the positioning stud (102).

4. The semiconductor laser bar packaging fixture applicable to different cavity lengths according to claim 1, wherein: The inclined surface of the trapezoidal pressure block (5) is composed of two mutually parallel first inclined surfaces and second inclined surfaces. The first inclined surface fits with the guiding inclined surface of the trapezoidal platform (4), there is a groove between the second inclined surface and the first inclined surface, and the angle between the second inclined surface and the bottom surface of the trapezoidal pressure block (5) is the lower corner part of the trapezoidal pressure block (5).

5. The semiconductor laser bar packaging fixture applicable to different cavity lengths according to claim 1, wherein: The spring positioning component includes a spring positioning post B (41) arranged on the front side surface of the trapezoidal platform (4) and a spring positioning post A (103) arranged on the inner wall of the guiding groove corresponding to the position of the spring positioning post B (41); the spring positioning post A (103) is a hollow cylinder, the inner diameter of which is adapted to the outer diameter of the spring positioning post B (41); the spring positioning post A (103) is movably sleeved on the spring positioning post B (41), and the spring (2) is sleeved on the outside of the spring positioning post A (103).

6. The semiconductor laser bar packaging fixture applicable to different cavity lengths according to claim 4, wherein: The lower corner part of the trapezoidal pressure block (5) is provided with a rounded corner to avoid damaging the chip (11).

7. The semiconductor laser bar packaging fixture applicable to different cavity lengths according to claim 1, wherein: The angle between the inclined surface of the base (1) and the horizontal plane is 30° - 60°, so as to ensure that under the action of gravity, the lower side surface of the heat sink (8) placed on the inclined surface of the base (1) and the front cavity surface of the chip (11) are both in contact with the positioning inclined surface.

8. A semiconductor laser bar packaging method applicable to different cavity lengths, using the semiconductor laser bar packaging fixture applicable to different cavity lengths according to any one of claims 1-7, characterized in that, It includes the following steps: Step 1: Place the base (1) on a horizontal plane, and sleeve the spring (2) on the spring positioning component; Step 2: Place the trapezoidal platform (4) in the guiding groove; Step 3: Install the adjusting component on the base (1), calculate the adjusting distance L of the trapezoidal platform (4) according to the size of the lower corner part of the trapezoidal pressure block (5) and the cavity length of the chip (11), and use the adjusting component to adjust the position of the trapezoidal platform (4) according to the adjusting distance L; Step 4: Pass the heat sink (8) and the insulating sheet (10) through the positioning component in sequence, place them on the inclined surface of the base (1), place the chip (11) on the upper surface of the heat sink (8), make the side surface of the chip (11) flush with the heat sink (8), and both the front cavity surface of the chip (11) and the lower side surface of the heat sink (8) are in contact with the positioning inclined surface; pass the negative plate (9) and the bearing plate (6) through the positioning component in sequence, press them on the insulating sheet (10) and the chip (11), and use the positioning component to press and hold them. Step 5: Place the trapezoidal pressure block (5) on the trapezoidal support (4). At this time, the lower corner of the trapezoidal pressure block (5) exactly presses on the negative electrode plate (9), and the position of the lower corner is exactly on the middle plane of the chip (11) perpendicular to the cavity length direction, indirectly and uniformly pressing the chip (11) to achieve the pressing and positioning of the heat sink (8), the chip (11), the insulating sheet (10), and the negative electrode plate (9). Step 6: Place the entire fixture into a vacuum reflow oven to perform reflow soldering on the heat sink (8), the chip (11), the insulating sheet (10), and the negative electrode plate (9), completing the encapsulation of the semiconductor laser bar chip.

9. A semiconductor laser bar packaging method applicable to different cavity lengths according to claim 8, characterized in that Step 3 specifically is as follows: Step 3.1: Install the micrometer head (3) into the micrometer head mounting hole (104) provided on the base (1), and make its front end located in the micrometer head positioning groove (42). Step 3.2: Calculate the adjustment distance L of the trapezoidal support (4) according to the fillet radius at the lower corner of the trapezoidal pressure block (5) and the cavity length of the chip (11). Let the cavity length of the chip (11) be m, and the fillet radius at the lower corner of the trapezoidal pressure block (5) be r. Then the distance from the lower corner of the trapezoidal pressure block (5) to the front cavity surface position of the chip (11) is Adjustment distance Step 3.3: Use the micrometer head (3) to adjust the position of the trapezoidal support (4) according to the adjustment distance L.

10. A semiconductor laser bar packaging method applicable to different cavity lengths according to claim 8, characterized in that, Step 1 specifically is as follows: Place the base (1) on a horizontal plane, sleeved the spring (2) on the spring positioning post A (103), and make the spring positioning post A (103) and the spring positioning post B (41) engage with each other.

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