Electronic device

Abstract

The invention discloses electronic equipment, and belongs to the technical field of electronic equipment. The electronic equipment comprises a circuit board, a camera module, a conductive layer, a conductive part and a mainboard bracket, the camera module comprises a first camera module and a second camera module, and the first camera module and the second camera module are both arranged on the circuit board; the first camera module comprises a first camera and a first connector, and the first connector is electrically connected with the first camera; the second camera module comprises a second camera and a second connector, and the second connector is electrically connected with the second camera; the conductive layer is arranged on the surface of the side, away from the circuit board, of the camera module, and the conductive layer covers and is electrically connected to the first camera, the first connector and the second connector; the mainboard support covers the side, away from the circuit board, of the conductive layer, the conductive layer is electrically connected with the mainboard support through a conductive piece, and the mainboard support is grounded.

Description

Technical Field

[0001] This application belongs to the technical field of electronic devices, and particularly relates to an electronic device. Background Art

[0002] With the development of shooting technology, the number of cameras on electronic devices such as mobile phones is increasing. For example: as Figure 1 shown, the mobile phone includes a front camera 101 and two rear cameras 102. Among them, the front camera 101 is usually arranged at the top of the mobile phone, and the grounding and heat conduction of the front camera 101 are realized through the shielding cover 1031 on the main upper circuit board 103, that is, the front camera 101 is lapped to the shielding cover 1031 through the conductive cloth 104 and the heat sink. The shielding cover 1031 is located in the lower area of the main upper circuit board 103, and the shielding cover 1031 is arranged at an interval from the rear camera 102. In this way, limited by the grounding and heat conduction requirements of the front camera 101, the front camera 101 and the rear camera 102 need to be spaced apart by a certain distance, and the front camera 101 needs to be arranged on the side close to the shielding cover 1031 of the rear camera 102.

[0003] As can be seen from the above, in the related art, in order to realize the grounding and heat conduction of the front camera 101, there are various limitations on the layout of the front camera 101 and the rear camera 102, the ID shape and the appearance of the electronic device, the structure of the main upper circuit board, etc., making the layout of the internal structural components of the electronic device not flexible enough. Summary of the Invention

[0004] The purpose of the embodiments of this application is to provide an electronic device, which can solve the problem that in the related art, the grounding scheme of the camera is realized by lapping the front camera to the shielding cover through a conductive cloth, resulting in insufficient flexibility in the layout of the internal structural components of the electronic device.

[0005] The embodiments of this application provide an electronic device, which includes: a circuit board, a camera module, a conductive layer, a conductive member, and a main board bracket;

[0006] The camera module includes a first camera module and a second camera module, and both the first camera module and the second camera module are arranged on the circuit board;

[0007] The first camera module includes a first camera and a first connector, and the first connector is electrically connected to the first camera;

[0008] The second camera module includes a second camera and a second connector, and the second connector is electrically connected to the second camera;

[0009] The conductive layer is arranged on the surface of the camera module facing away from the circuit board, and the conductive layer at least covers and is electrically connected to the first camera, the first connector, and the second connector;

[0010] The main board bracket is disposed on the side of the conductive layer facing away from the circuit board, and the conductive layer is electrically connected to the main board bracket through a conductive member.

[0011] In the embodiment of the present application, the camera module is electrically connected to the main board bracket through the conductive layer and the conductive member, and the main board bracket is grounded. In this way, the camera module can be grounded through the conductive layer, the conductive member, and the main board bracket, without using the shielding cover on the circuit board to meet the grounding requirement of the camera module. Thus, the camera module does not need to be disposed in the area of the circuit board close to the shielding cover, nor does it need to reserve space for arranging the conductive cloth in the area of the circuit board between the camera module and the shielding cover, enabling the camera to be disposed in any area of the circuit board, and only needing to reuse the main board bracket near the circuit board, which can make the layout of the internal structural components of the electronic device more flexible. Description of the Drawings

[0012] Figure 1 is a schematic diagram of the grounding and heat dissipation solution of the front camera in the related art;

[0013] Figure 2 is one of the schematic diagrams of the structure of the electronic device in some embodiments of the present application;

[0014] Figure 3 is Figure 2 one of the schematic diagrams of the structure of the electronic device after removing the main board bracket in;

[0015] Figure 4 is Figure 2 one of the schematic diagrams of the structure of the electronic device after removing the main board bracket, the heat sink, the conductive layer, and the conductive member in;

[0016] Figure 5 is a cross-sectional view along the A-A direction in Figure 2 ;

[0017] Figure 6 is Figure 5 an enlarged view of the W area in;

[0018] Figure 7 is a cross-sectional view along the B-B direction in Figure 2 ;

[0019] Figure 8 is Figure 7 an enlarged view of the V area in;

[0020] Figure 9 is a schematic diagram of the structure of the main board bracket in some embodiments of the present application;

[0021] Figure 10 is one of the schematic diagrams of the electronic device after removing the main board bracket in some embodiments of the present application;

[0022] Figure 11a Schematic cross-sectional structure diagram of the assembly layer for assembling the conductive double-sided tape in some embodiments of the present application

[0023] Figure 11b Front view of the assembly layer for assembling the conductive double-sided tape in the unfolded state in some embodiments of the present application;

[0024] Figure 11c Back view of the assembly layer for assembling the conductive double-sided tape in the unfolded state in some embodiments of the present application;

[0025] Figure 12a One of the schematic diagrams of the assembly process of the electronic device in some embodiments of the present application;

[0026] Figure 12b Another schematic diagram of the assembly process of the electronic device in some embodiments of the present application;

[0027] Figure 12c Another schematic diagram of the assembly process of the electronic device in some embodiments of the present application;

[0028] Figure 12d Another schematic diagram of the assembly process of the electronic device in some embodiments of the present application;

[0029] Figure 13 Another schematic diagram of the electronic device after removing the main board bracket in some embodiments of the present application;

[0030] Figure 14 Another schematic diagram of the structure of the electronic device in some embodiments of the present application;

[0031] Figure 15 Is along Figure 14 Cross-sectional view in the C-C direction in;

[0032] Figure 16 Is Figure 15 Enlarged view of the U region in;

[0033] Figure 17 Back view of the main board bracket in some embodiments of the present application;

[0034] Figure 18 Partial schematic diagram of the electronic device in some embodiments of the present application

[0035] Explanation of reference numerals:

[0036] Circuit board 1, second through-hole 11, camera module P, first camera module 2, first camera 21, first connector 22, heat sink 3, hollowed-out portion 31, conductive layer 4, first release film 42, first side 43, conductive member 5, isolation film 51, second release film 53, motherboard bracket 6, first through-hole 61, area 62 of the motherboard bracket corresponding to the edge of the conductive layer, protruding portion 63, limiting groove 64, pre-pressed foam 65, third camera module 7, second camera 71, second connector 72, third camera module 8, third camera 81, third connector 82, speaker sealing area 9, shielding cover 10, conductive double-sided tape 201, conductive cloth 2011, first conductive adhesive 2012, second conductive adhesive 2013, screw 301, screw gasket 302, main upper 303, ground spring piece 304, conductive material layer 305, frame 306, antenna slit 3061. Detailed implementation manners

[0037] Next, the technical solutions in the embodiments of the present application will be clearly described with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are some, but not all, of the embodiments of the present application. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0038] The terms "first", "second", etc. in the description and claims of the present application are used to distinguish similar objects, rather than to describe a specific order or sequence. It should be understood that such data can be interchanged under appropriate circumstances so that the embodiments of the present application can be implemented in an order other than those illustrated or described herein, and the objects distinguished by "first", "second", etc. are usually of the same category, and the number of objects is not limited. For example, the first object can be one or multiple. In addition, "and / or" in the description and claims means at least one of the connected objects, and the character " / " generally means an "or" relationship between the associated objects before and after.

[0039] Next, the electronic device provided in the embodiments of the present application will be described in detail with reference to the accompanying drawings through specific embodiments and their application scenarios.

[0040] Refer to Figure 2 、 Figure 3 and Figure 4 The electronic device provided in the embodiments of the present application includes: a circuit board 1, a camera module P, a conductive layer 4, a conductive member 5, and a motherboard bracket 6;

[0041] The camera module P includes a first camera module 2 and a second camera module 7, and both the first camera module 2 and the second camera module 7 are provided on the circuit board 1;

[0042] The first camera module 2 includes a first camera 21 and a first connector 22, and the first camera 21 is electrically connected to the first connector 22;

[0043] The second camera module 7 includes a second camera 71 and a second connector 72, and the second camera 71 is electrically connected to the second connector 72;

[0044] The conductive layer 4 is disposed on the surface of the camera module P facing away from the circuit board 1, and the conductive layer 4 at least covers and is electrically connected to the first camera 21, the first connector 22, and the second connector 72;

[0045] The main board bracket 6 covers the side of the conductive layer 4 facing away from the circuit board 1, and the conductive layer 4 is electrically connected to the main board bracket 6 through a conductive member 5.

[0046] In some embodiments, the electronic device in the embodiments of the present application may be a terminal or other devices other than terminals. Exemplarily, the electronic device may be a mobile phone, a tablet computer, a notebook computer, a handheld computer, a vehicle-mounted electronic device, a Mobile Internet Device (MID), an augmented reality (AR) / virtual reality (VR) device, a robot, a wearable device, an ultra-mobile personal computer (UMPC), a netbook, or a personal digital assistant (PDA), etc., and may also be a server, a Network Attached Storage (NAS), a personal computer (PC), a television (TV), a teller machine, or a self-service machine, etc. The embodiments of the present application do not make specific limitations.

[0047] In some embodiments, the main board bracket 6 may be grounded through a grounding member on the circuit board 1, or grounded through other grounding structures outside the circuit board 1. Among them, the grounding member on the circuit board 1 may be any structure electrically connected to the grounding wiring in the circuit board 1, such as a grounding terminal or a grounding contact on the circuit board 1, and specific limitations are not made here. For the convenience of description, in the embodiments of the present application, it is usually exemplified that the main board bracket 6 may be grounded through the grounding member on the circuit board 1, which does not constitute a specific limitation here.

[0048] In some embodiments, the main board bracket 6 may be made of a metal structure.

[0049] In some other embodiments, the main board bracket 6 may include an insulating material and a steel sheet of the main board bracket partially embedded in the insulating material. At this time, the structure for realizing electrical connection on the main board bracket 6 is the steel sheet of the main board bracket.

[0050] In some embodiments, the camera module P in the embodiments of the present application may include at least two camera modules on an electronic device, such as Figure 4 As shown, in the embodiments of the present application, generally, the camera module P including the first camera module 2 and the second camera module 7 is taken as an example for illustration. Among them, the first camera module 2 is a front camera module, the light-gathering side of the front camera faces away from the main board bracket 6, and the second camera module 7 is a rear camera module, and the light-gathering side of the rear camera faces the main board bracket 6.

[0051] In some embodiments, the conductive layer 4 may cover the surface of the camera module P facing away from the light-gathering side, and may even extend outside the camera module P. In the embodiments of the present application, taking the conductive layer 4 shown in Figure 2 as an example, the conductive layer 4 covers and is electrically connected to the first camera 21, the first connector 22, and the second connector 72. In this way, on the one hand, the area of the conductive layer 4 can be increased, and a grounding path can be added to the first camera module 2 by using the conductive layer 4 and the second connector 72, and a grounding path can be added to the second camera module 7 by using the conductive layer 4 and the first connector 22, improving the grounding performance of the first camera module 2 and the second camera module 7.

[0052] In some other embodiments, the camera module P may further include other camera modules, such as Figure 3 the third camera module 8 shown in, and the third camera module 8 includes a third camera 81 and a third connector 82. At this time, the conductive layer 4 may further extend to the surface of the side of the third connector 82 facing away from the circuit board 1.

[0053] It should be noted that when the conductive layer 4 can further extend outside the camera module P, the area of the conductive layer 4 is greater than the sum of the areas of the first camera 21, the first connector 22, and the second connector 72, and the perimeter of the conductive layer 4 can extend beyond the edges of the first camera 21, the first connector 22, and the second connector 72. Thus, when a heat sink 3 is attached to the side of the conductive layer 4 facing away from the circuit board 1, the heat dissipation area of the camera module P can be increased, improving the heat dissipation efficiency of the camera module P.

[0054] In some embodiments, the conductive member 5 may be disposed at the edge or the middle position of the conductive layer 4. For example: as Figure 3 shown, when the conductive member 5 and the conductive layer 4 are of an integral structure, the conductive member 5 is a folded portion formed at the edge of the conductive layer 4 and facing the main board bracket 6. Or, as Figure 15As shown, the conductive member 5 is located in the area of the conductive layer 4 that is attached to the first connector 22 and faces away from the first connector 22.

[0055] In some embodiments, the area of the conductive layer 4 that is electrically connected to the conductive member 5 can be the area of the conductive layer 4 that covers the connector in the imaging module P, such as the area where the first connector 22 or the second connector 72 is located.

[0056] In other embodiments, the area of the conductive layer 4 that is electrically connected to the conductive member 5 can be the area of the conductive layer 4 that covers the camera in the imaging module P, such as the area where the first camera 21 is located.

[0057] For the sake of convenience of description, in the embodiments of the present application, usually, the area of the conductive layer 4 that is electrically connected to the conductive member 5 is taken as an example where the conductive layer 4 covers the area where the first connector 22 is located for illustration, which does not constitute a specific limitation here.

[0058] In some embodiments, the electronic device of the embodiments of the present application further includes a heat sink 3, and the heat sink 3 is stacked on the side of the conductive layer 4 facing away from the imaging module P.

[0059] At this time, the motherboard bracket 6 is located on the side of the heat sink 3 facing away from the conductive layer 4. Among them, the heat sink 3 is used to absorb the heat of the imaging module P and dissipate heat.

[0060] As Figure 3 shown, the conductive layer 4 extends from the first imaging module 2 to the second connector 72 of the nearby second imaging module 7. In this way, when the heat sink 3 is attached to the surface of the conductive layer 4 on the side facing away from the first imaging module 2, the area of the heat sink 3 can be increased, and the heat dissipation effect of the heat sink 3 on the first imaging module 2 can be improved; or, when the second imaging module 7 generates heat, the heat can be conducted to the area where the first imaging module 2 is located and dissipated over a large area.

[0061] In some embodiments, the heat sink 3 can be a heat dissipation film (Panasonic Graphite Sheet, PGS).

[0062] In some embodiments, the electrical connection between the motherboard bracket 6 and the grounding member of the circuit board 1 can be achieved by any means such as screw washers, metal shrapnel, wire connection, etc., and no specific limitation is made here.

[0063] Optionally, there can be one or more electrical connection points between the motherboard bracket 6 and the grounding member on the circuit board 1. For example: As Figure 7As shown in the figure, there can be two electrical connection points between the main board bracket 6 and the grounding component on the circuit board 1, and they are distributed on opposite sides of the first camera module 2. By increasing the number of electrical connection points between the main board bracket 6 and the grounding component on the circuit board 1, the grounding path of the first camera module 2 can be increased, the grounding performance of the first camera module 2 can be improved, and the electromagnetic interference generated by the electromagnetic radiation components near the first camera module 2 on the first camera module 2 can be reduced.

[0064] In the embodiment of the present application, taking the conductive layer 4 covering the first camera 21 of the first camera module 2, the first connector 22 of the first camera module 2, and the second connector 72 of the second camera module 7 as an example for illustration. Of course, the conductive layer 4 can also be attached to other devices except the second connector 72 of the second camera module 7. At this time, the shape and size of the conductive layer 4 can be adjusted accordingly according to actual needs.

[0065] In some embodiments, such as Figure 5 、 Figure 6 、 Figure 7 and Figure 8 As shown, a through hole is formed on the circuit board 1, and the first camera module 2 is embedded in the through hole, and the lens of the first camera module 2 faces away from the side where the conductive layer 4, the conductive component 5, and the main board bracket 6 are located. At this time, the main board bracket 6 can be parallel to the circuit board 1, and there is a certain gap between the main board bracket 6 and the first camera module 2. By attaching the conductive layer 4 to the exposed surface of the first camera module 2 and using the conductive component 5, the conductive component 5 can span the gap between the main board bracket 6 and the first camera module 2, so that the conductive component 5 is electrically connected to the main board bracket 6, thereby realizing the grounding of the first camera module 2.

[0066] As an alternative embodiment, such as Figure 3 and Figure 12b As shown, the conductive component 5 and the conductive layer 4 are connected as an integral structure, and the conductive component 5 is a folded portion formed at the edge of the conductive layer 4 facing the main board bracket 6, and the conductive component 5 is folded and electrically connected to the main board bracket 6.

[0067] For example: as Figure 3 As shown, the conductive component 5 is folded from the upper side edge of the conductive layer 4 in a direction away from the circuit board 1 to approach the main board bracket 6, so as to facilitate the electrical connection between the conductive component 5 and the main board bracket 6. Among them, the electrical connection method between the conductive component 5 and the main board bracket 6 can be direct electrical contact or coupled connection.

[0068] In this embodiment, the conductive component 5 and the conductive layer 4 can be an integral structure. For example: the conductive layer 4 and the conductive component 5 are an integral conductive double-sided adhesive 201, as Figure 11b and Figure 11cThe conductive double-sided adhesive 201 shown, wherein the area where the first release film 42 is attached is the conductive layer 4, and the area where the second release film 53 is attached is the conductive member 5. In this way, the structures of the conductive layer 4 and the conductive member 5 can be simplified. By adjusting the shape of the conductive double-sided adhesive 201, the conductive layer 4 can be folded upward from the edge of the conductive layer 4.

[0069] It should be noted that, as Figure 11a shown, the conductive double-sided adhesive 201 can be obtained by respectively coating the first conductive adhesive 2012 and the second conductive adhesive 2013 on the front and back sides of the conductive cloth 2011, so that both the front and back sides of the conductive double-sided adhesive 201 can achieve electrical connection, enabling the flexible arrangement of the conductive layer 4 and the conductive member 5 to achieve the electrical connection between the conductive layer 4 and the main board bracket 6. In addition, by using the integrated conductive double-sided adhesive 201 to form the conductive layer 4 and the conductive member 5, the conductive material is single, and there is no need to lap multiple disconnected conductive materials to form the conductive layer 4 and the conductive member 5, which can improve the conductive performance between the conductive layer 4 and the conductive member 5, and further improve the grounding performance of the camera module P.

[0070] In some embodiments, as Figure 2 shown, the conductive member 5 is folded and connected to the side of the main board bracket 6 facing away from the circuit board 1.

[0071] It should be noted that there is a gap between the conductive layer 4 and the main board bracket 6. The conductive member 5 is folded from the edge of the conductive layer 4 towards the direction where the main board bracket 6 is located to extend to the side of the main board bracket 6 facing away from the circuit board 1. At this time, a U-shaped groove is formed between the conductive member 5 and the conductive layer 4. The main board bracket 6 extends into this U-shaped groove, and the conductive member 5 is attached to the inner side wall of the U-shaped groove formed by the conductive member 5 to achieve electrical contact with the main board bracket 6.

[0072] In this embodiment, the conductive member 5 can be folded and connected to the upper surface of the main board bracket 6 facing away from the circuit board 1. At this time, as Figure 3 shown, the conductive member 5 and the conductive layer 4 form a U-shaped structure to electrically connect the conductive layer 4 and the upper surface of the main board bracket 6 by using the conductive member 5 to cross over the edge of the main board bracket 6.

[0073] In some embodiments, when the conductive member 5 is composed of a conductive double-sided adhesive and is used to be folded and electrically connected to the upper surface of the main board bracket 6 facing away from the circuit board 1, an isolation film 51, such as a polyethylene terephthalate (PET) film, can be provided on the side of the conductive member 5 facing away from the main board bracket 6.

[0074] In this way, the isolation film 51 can be used to cover the conductive adhesive layer on the side of the conductive member 5 facing away from the main board bracket 6 to prevent the side of the conductive member 5 facing away from the main board bracket 6 from adhering to or making electrical contact with other devices.

[0075] In some other embodiments, as Figure 10 shown, the conductive member 5 is folded and connected to the side of the main board bracket 6 facing the circuit board 1, and the conductive member 5 is clamped between the heat sink 3 and the main board bracket 6.

[0076] For example: in the case where the conductive layer 4 and the conductive member 5 are an integrated structure of conductive double-sided tape 201, the conductive layer 4 can be folded from the edge of the conductive member 5 to be electrically connected to the lower surface of the main board bracket 6 facing the circuit board 1.

[0077] In some embodiments, when a heat sink 3 is covered on the side of the conductive layer 4 facing away from the circuit board 1 and the heat sink 3 is made of an insulating material, the conductive member 5 can be clamped between the heat sink 3 and the main board bracket 6 to electrically connect the conductive layer 4 to the lower surface of the main board bracket 6 by means of the conductive member 5.

[0078] In some embodiments, the conductive member 5 can be directly attached to the surface of the heat sink 3. At this time, the heat sink 3 can be made of an insulating material, and the conductive layer 4 is electrically connected to the lower surface of the main board bracket 6 by using the conductive member 5 with a smaller area. In this way, the coverage of the conductive member 5 on the heat sink 3 can be reduced, so that the heat absorbed by the heat sink 3 from the camera module P can be quickly transferred to the main board bracket 6 with a larger area, improving the heat dissipation effect on the camera module P.

[0079] In some embodiments, the conductive member 5 can be lifted away from the heat sink 3 by a certain distance. In this way, the coverage of the conductive member 5 on the heat sink 3 can also be reduced, improving the heat dissipation effect of the heat sink 3.

[0080] In some embodiments, the conductive layer 4 and the conductive member 5 can be composed of at least one of any conductive materials such as conductive cloth, conductive glue, conductive foam, and conductive double-sided tape.

[0081] For example: in the case where the conductive member 5 is folded from the edge of the conductive layer 4 to be electrically connected to the upper surface of the main board bracket 6 facing away from the circuit board 1, the conductive layer 4 and the conductive member 5 can be an integrated structure of conductive double-sided tape. For example, conductive glue is coated on the opposite two surfaces of the conductive cloth so that one surface of the conductive double-sided tape can adhere to and be electrically connected to the upper surface of the camera module P, and the other surface of the conductive double-sided tape can be folded to adhere to and be electrically connected to the upper surface of the main board bracket 6 facing away from the circuit board 1.

[0082] For another example: when the conductive member 5 can be folded over to be electrically connected to the lower surface of the mainboard bracket 6 facing the circuit board 1, the conductive layer 4 and the conductive member 5 can be a conductive single-sided adhesive of an integral structure, such as coating conductive adhesive on one side of the conductive cloth, so that a partial area of ​​the surface of the conductive single-sided adhesive coated with the conductive adhesive is adhered to the upper surface of the camera module P and electrically connected, and after another part of the conductive single-sided adhesive is folded over, the surface of the side coated with the conductive adhesive is folded over to the lower surface of the mainboard bracket 6 facing away from the circuit board 1, thereby achieving adhesion and electrical connection between the conductive single-sided adhesive and the lower surface of the mainboard bracket 6 facing the circuit board 1.

[0083] Of course, in some other embodiments, the conductive layer 4 and the conductive member 5 may be non-integrated structures, or even structures made of different materials, for example: Figure 14 , Figure 15 and Figure 16 As shown, the conductive member 5 is sandwiched between the conductive layer 4 and the mainboard bracket 6 . At this time, a conductive foam can be arranged in the gap between the mainboard bracket 6 and the conductive layer 4 to form the conductive member 5 .

[0084] As an optional implementation, Figure 13 and Figure 16 As shown, the conductive member 5 and the conductive layer 4 are stacked;

[0085] The heat sink 3 is provided with a hollow portion 31 , through which the conductive layer 4 is exposed to the heat sink 3 ; the conductive member 5 is provided corresponding to the hollow portion 31 , and conducts the conductive layer 4 on opposite sides of the heat sink 3 and the mainboard bracket 6 .

[0086] It should be noted that if Figure 13 In the illustrated embodiment, the hollow portion 31 is an irregular shape for illustration. In some implementations, the hollow portion 31 may be any shape such as a circle or a rectangle. In addition, the number of the hollow portions 31 may be one or more. For ease of explanation, in the embodiment of the present application, the number of the hollow portions 31 is one for illustration, which does not constitute a specific limitation herein.

[0087] In the present embodiment, a hollow portion 31 is provided on the heat sink 3 so that a partial area of ​​the conductive layer 4 can be exposed on the heat sink 3. Thus, the exposed conductive layer 4 can be electrically connected to the mainboard bracket 6 through the conductive member 5 correspondingly arranged in the hollow portion 31. Compared with the conductive member 5 in the aforementioned embodiment, which is bent from the edge of the conductive layer 4 and extended to be electrically connected to the mainboard bracket 6, the structure of the conductive member 5 in the present embodiment is simpler and the assembly process is more concise.

[0088] In some embodiments, the conductive member 5 can be disposed in the area where the first connector 22 is located. In this way, the first connector 22 can be grounded through the conductive layer 4, the conductive member 5, and the main board bracket 6, and the ground pin in the first connector 22 and the main board bracket 6 can be at the same equipotential surface.

[0089] Optionally, the conductive member 5 can be made of conductive foam. Since the conductive member 5 is pressed between the main board bracket 6 and the conductive layer 4, in this way, the elastic property of the conductive foam can also be utilized to press the first connector 22 on the circuit board 1, thereby improving the connection reliability between the first connector 22 and the interface on the circuit board 1.

[0090] Optionally, as Figure 17 shown, a limiting groove 64 can be provided at the position of the main board bracket 6 facing the hollow portion 31, and the conductive foam constituting the conductive member 5 can be aligned with the hollow portion 31 under the limiting action of the limiting groove 64.

[0091] Optionally, pre-pressed foam can be provided around the limiting groove 64. For example: as Figure 17 shown, pre-pressed foam 65 is provided above, below, and on the right side of the limiting groove 64 respectively.

[0092] In this way, the conductive foam constituting the conductive member 5 and the pre-pressed foam 65 provided around the limiting groove 64 can be used as auxiliary materials to pre-press the first connector 22.

[0093] In this embodiment, by providing the hollow portion 31 in the area where the first connector 22 is located, while realizing the electrical connection between the conductive layer 4 and the main board bracket 6 using the conductive member 5, when the main board bracket 6 is pressed on the side of the conductive member 5 facing away from the first connector 22, the elastic conductive foam can be used to press the first connector 22 on the circuit board 1, thereby improving the connection reliability between the first connector 22 and the corresponding structure on the circuit board 1.

[0094] In some embodiments, at least one of the connectors of the camera module in the embodiments of the present application, such as the first connector 22, the second connector 72, and the third connector 82, can be a board-to-board (BTB) connector of the camera module. Of course, in addition to the BTB connector, the connectors of the camera module in the embodiments of the present application can also be any other connectors that can realize the electrical signal transmission function of the camera.

[0095] For the convenience of description in the embodiments of the present application, usually, the connector in the camera module P is taken as an example of a BTB connector for illustration. This does not constitute a specific limitation.

[0096] It is worth mentioning that in the embodiment of the present application, the camera module P can be electrically connected to the mainboard bracket 6 through the conductive layer 4 and the conductive member 5, wherein the mainboard bracket 6 is located on the side of the circuit board 1 away from the conductive layer 4, and the mainboard bracket 6 is grounded, so that the camera module P can be grounded through the mainboard bracket 6 that is separated from the circuit board 1 using the conductive layer 4 and the conductive member 5. According to the actual application, the camera module P can be set in an area on the circuit board 1 away from the shielding cover.

[0097] For example: Figure 4 As shown, taking the first camera module 2 as an example, the first camera module 2 can be a front camera module, which is arranged at the top edge of the circuit board 1, and the areas of the circuit board 1 located on the left, right and bottom of the front camera module can be used to closely deploy other devices, such as the second camera module 7, the third camera module 8 and the speaker sealing area 9, etc. In this layout scenario, there is no area around the first camera module 2 for deploying the shielding cover 10. In the embodiment of the present application, the first camera module 2 can be connected to the main board bracket 6 through the conductive layer 4 and the conductive member 5, and the main board bracket 6 is connected to the grounding member on the circuit board 1. The first camera module 2 can be grounded through the conductive layer 4, the conductive member 5, the main board bracket 6 and the grounding member on the circuit board 1, without using the shielding cover 10 on the circuit board 1 to meet the grounding requirement of the first camera module 2.

[0098] In addition, in some embodiments, the heat sink 3 is also attached to the side of the conductive layer 4 facing away from the first camera module 2, and the heat sink 3 can be used to achieve the heat dissipation function of the first camera module 2, and there is no need to use the shielding cover 10 on the circuit board 1 to meet the heat dissipation requirements of the first camera module 2. In this way, the first camera module 2 does not need to be set in the area of ​​the circuit board 1 close to the shielding cover 10, and there is no need to reserve space for arranging the heat sink and the conductive cloth in the area of ​​the circuit board 1 between the first camera module 2 and the shielding cover 10, so that the first camera module 2 can be set in any area of ​​the circuit board 1, and only the motherboard bracket 6 in the existing structure near the circuit board 1 needs to be reused for grounding, which can make the structural design of the electronic device more flexible.

[0099] It should be noted that the camera module P in the embodiment of the present application can be set at the edge of the circuit board 1, or at other areas of the circuit board 1. For the sake of convenience of explanation, the embodiment of the present application is usually illustrated by taking the example that the first camera module 2 in the camera module P is set at the edge of the circuit board 1, and the second camera module 7 is set near the first camera module 2, which does not constitute a specific limitation here.

[0100] In some embodiments, the first connector 22 is adjacent to the second connector 72 , and a length extension direction of the first connector 22 is consistent with a length extension direction of the second connector 72 .

[0101] For example: as Figure 4 shown, the first connector 22 is adjacent to the second connector 72, and the first connector 22 and the second connector 72 can be distributed along the length direction of the first connector 22, that is, arranged vertically as in Figure 4 .

[0102] Of course, in some other embodiments, the first connector 22 and the second connector 72 can also be distributed along the width direction of the first connector 22, that is, arranged horizontally and parallel to each other.

[0103] In still some other embodiments, the first connector 22 and the second connector 72 are arranged in a staggered manner, that is, the long sides of the first connector 22 and the second connector 72 are parallel, but not opposite to each other.

[0104] As an alternative embodiment, as Figure 4 shown, the long sides of the first connector 22 and the second connector 72 are on the same straight line, and the first camera 21 is arranged on the left side of the straight line, and the second camera 71 is arranged on the right side of the straight line.

[0105] In this embodiment, the first connector 22 is arranged adjacent to the second connector 72, which facilitates the conductive layer 4 to extend from the area where the first connector 22 is located to the area where the second connector 72 is located. At this time, the second connector 72 can be used to make the electrical signals on the first camera module 2 ground according to the third path Z as in Figure 5 . In addition, when the heat sink 3 also extends from the area where the first connector 22 is located to the area where the second connector 72 is located, the heat dissipation area of the first camera module 2 can be increased, thereby improving the heat dissipation efficiency of the first camera module 2, or the heat dissipation area of the second camera module 7 can be increased, thereby improving the heat dissipation efficiency of the second camera module 7.

[0106] As an alternative embodiment, as Figure 4 shown, the second connector 72 is located on the side of the first connector 22 facing the shielding cover 10 on the circuit board 1.

[0107] In this embodiment, the area between the first connector 22 and the shielding cover 10 can be used to layout the second connector 72, which can improve the compactness of the camera devices on the circuit board 1 and improve the utilization rate of the layout area of the circuit board 1.

[0108] As an alternative embodiment, as Figure 4 shown, the electronic device further includes: a third camera module 8, and the third camera module 8 is arranged on the circuit board 1;

[0109] The third camera module 8 includes a third camera 81 and a third connector 82, and the third connector 82 is electrically connected to the third camera 81;

[0110] The third camera 81 is arranged side by side with the first camera 21, and the shielding cover 10 on the first camera module 2, the second camera module 7 and the circuit board 1 is distributed along the periphery of the third camera module 8.

[0111] In this embodiment, the area between the first connector 22, the second connector 72 and the shielding cover 10 can also be used to layout the third camera module 8, so that the first connector 22, the second connector 72 and the shielding cover 10 closely surround three sides of the third camera module 8, which can further improve the utilization rate of the layout area of the circuit board 1.

[0112] In some embodiments, taking the electronic device shown as an example, the assembly process of the electronic device may include the following steps: Figure 10 shown, the assembly process of the electronic device may include the following steps:

[0113] Step 1: Obtain the assembly layer 200. As shown in Figure 11a , Figure 11b and Figure 11c shown, the assembly layer 200 includes a conductive double-sided adhesive 201, a first release film 42 and a second release film 53 attached to one surface of the conductive double-sided adhesive 201. Among them, the part of the conductive double-sided adhesive 201 covered by the first release film 42 is used as the conductive layer 4, and the part of the conductive double-sided adhesive 201 covered by the second release film 53 is used as the conductive part 5.

[0114] In some embodiments, the surface of the conductive part 5 that is not covered by the second release film 53 is covered with an isolation film 51. When the conductive part 5 is folded and adhered to the side of the main board bracket 6 facing away from the circuit board 1, the isolation film 51 covers the exposed surface of the conductive part 5, preventing the adhesive surface of the conductive part 5 from being exposed and adhered or electrically contacted with other components.

[0115] Step 2: As shown in Figure 12a shown, attach the exposed adhesive surface of the conductive layer 4 to the back surface of the camera module P, such as attaching it to the side of the first camera 21, the first connector 22 and the second connector 72 facing the main board bracket 6.

[0116] It is worth noting that by attaching the conductive layer 4 to the second connector 72, the conductive layer 4 can be grounded through the ground pin in the second connector 72, and the induced current on the second camera module 7 can also be grounded through the conductive layer 4, the conductive part 5, the main board bracket 6 and the circuit board 1.

[0117] Step 3: As shown in Figure 12b shown, remove the first release film 42 and attach the heat sink 3 to the exposed adhesive surface of the conductive layer 4.

[0118] Step 4: As shown in Figure 12c and Figure 12d , remove the second release film 53, and bend the conductive member 5 so that the adhesive surface of the exposed conductive member 5 adheres to the main board bracket 6.

[0119] In some embodiments, as shown in Figure 11b , Figure 11c and Figure 12a , the first release film 42 can extend outside the conductive layer 4, and the second release film 53 can extend outside the conductive member 5 to form a "handle". In this way, it is convenient to tear off the first release film 42 and the extended part of the second release film 53 from the adhesive surfaces of the conductive layer 4 and the conductive member 5.

[0120] As can be seen from the above, the assembly process of the electronic device in the embodiment of the present application is simple, and the release film can be used to prevent the conductive double-sided tape from adhering to other components during the assembly process, affecting subsequent assembly operations.

[0121] In some embodiments, as shown in Figure 9 , the main board bracket 6 can be grounded by screws, screw washers, metal shrapnel, etc. between the circuit board 1 and the main board bracket 6.

[0122] As an alternative embodiment, as shown in Figure 7 , the electronic device further includes: a screw 301;

[0123] A first through hole 61 is formed on the main board bracket 6, and a second through hole 11 is formed on the circuit board 1. The screw 301 passes through the first through hole 61 and the second through hole 11, and fixes the main board bracket 6 to the circuit board 1;

[0124] The main board bracket 6 is electrically connected to the circuit board 1 through the screw 301;

[0125] As shown in Figure 7 , the grounding path of the camera module P includes a first path X. The first path X sequentially passes through the conductive layer 4, the conductive member 5, the main board bracket 6, the screw 301, and the circuit board 1.

[0126] In some embodiments, a corresponding screw washer 302 can be provided for the screw 301, and the screw washer 302 is electrically connected to the circuit board 1. At this time, the main board bracket 6 can be clamped between the nut of the screw 301 and the screw washer 302, and the first path X can also pass through the screw washer 302. The screw washer 302 can be fixed on the circuit board 1 and is electrically connected to the grounding trace inside the circuit board 1. Compared with the method of directly using the screw 301 to be electrically connected to the grounding structure on the circuit board 1, using the screw washer 302 to be electrically connected to the grounding structure on the circuit board 1 can improve the grounding reliability.

[0127] It should be noted that the above motherboard bracket 6 is electrically connected to the circuit board 1 through the screw 301. It can be that the motherboard bracket 6 is electrically connected to the grounding structure on the circuit board 1, such as a grounding terminal, through the screw 301, so as to ground the motherboard bracket 6.

[0128] In some embodiments, the screw 301 can be reused as the screw for fixing the motherboard bracket 60 and the circuit board 1 to the main body 303 of the electronic device.

[0129] In this embodiment, the induced current of the camera module P can pass through, for example, Figure 7 the first path X shown and go to the ground.

[0130] As an alternative embodiment, as Figure 7 , Figure 9 and Figure 10 shown, the electronic device further includes: a grounding spring piece 304, and the grounding spring piece 304 abuts between the motherboard bracket 6 and the circuit board 1;

[0131] The region 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 is electrically coupled and conductive with the conductive layer 4, or a conductive material layer 305 is provided between the region 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 and the conductive layer 4, and the conductive layer 4 is electrically coupled and conductive with the conductive material layer 305;

[0132] As Figure 7 shown, the grounding path of the camera module P further includes a second path Y, and the second path Y sequentially passes through the conductive layer 4, the region 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4, the grounding spring piece 304 and the circuit board 1.

[0133] In some embodiments, the edge of the conductive layer 4 laid on the first camera 21 is electrically coupled and connected to the corresponding region on the motherboard bracket 6.

[0134] In other embodiments, a conductive material layer 305 is provided between the motherboard bracket 6 and the region corresponding to the edge of the conductive layer 4 laid on the first camera 21. The conductive layer 4 is electrically coupled and conductive with the conductive material layer 305, and the conductive material layer 305 is electrically coupled and connected or in contact electrical connection with the corresponding region on the motherboard bracket 6.

[0135] In some embodiments, either the first path X or the second path can be selected to ground the motherboard bracket 6.

[0136] In other embodiments, the motherboard bracket 6 can be grounded through the first path X and the second path together.

[0137] Optionally, when the motherboard bracket 6 is grounded through the first path X and the second path together, the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 is located at one side edge of the conductive layer 4, and the first through hole 61 is located on the side of the conductive layer 4 away from the area 62 corresponding to the edge of the conductive layer 4 of the motherboard bracket 6. In this way, the first camera module 2 can be grounded through two paths respectively, and the two grounding paths are located on the opposite side edges of the first camera module 2, so that the induced current on the first camera module 2 can flow to the ground through the nearest path, improving the grounding performance of the first camera module 2.

[0138] In some embodiments, as Figure 10 shown, a protrusion 63 is provided at a position of the motherboard bracket 6 close to the grounding spring piece 304. In this way, after the circuit board 1 is fixed to the motherboard bracket 60, one end of the grounding spring piece 304 is connected to the grounding terminal on the circuit board 1, and the free end of the grounding spring piece 304 abuts against the protrusion 63.

[0139] In some embodiments, the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 can directly abut against the surface of the heat sink 3, so that the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 is directly coupled to the conductive layer 4, and the current coupled from the conductive layer 4 is grounded through the grounding spring piece 304.

[0140] In other embodiments, a conductive material layer 305 can be interposed between the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 and the heat sink 3. The conductive material layer 305 can be a conductive material such as conductive foam or conductive double-sided tape. In this way, the conductive material layer 305 can be coupled to the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4, and based on the conductive property of the conductive material layer 305, the current coupled from the conductive layer 4 is transmitted to the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 and grounded through the grounding spring piece 304.

[0141] For the sake of convenience of description, as Figure 7 shown in the embodiment, the conductive material layer 305 interposed between the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 and the heat sink 3 is conductive foam, and the conductive material layer 305 is coupled to the conductive layer 4. Based on the conductive property of the conductive material layer 305, the current coupled from the conductive layer 4 is transmitted to the area 62 of the motherboard bracket 6 corresponding to the edge of the conductive layer 4 and grounded through the grounding spring piece 304 is taken as an example for illustration, which does not constitute a specific limitation here.

[0142] Among them, the method of sandwiching the conductive material layer 305 between the area 62 corresponding to the edge of the main board bracket 6 and the heat sink 3 can utilize the conductive medium of the flexible material to reduce the stress between the area 62 corresponding to the edge of the main board bracket 6 and the heat sink 3, and prevent the heat sink 3 and the camera module P below it from being damaged when the main board bracket 6 is stressed.

[0143] In this embodiment, the induced current of the camera module P can be grounded through the second path Y as shown in Figure 7 the figure.

[0144] In addition, in addition to the first path and the second path, the grounding path of the induced current of the camera module P can also include other paths. For example, the induced current of the first camera module 2 can also be grounded through the conductive layer 4 and the second connector 72 to achieve the grounding path shown as the third path Z in Figure 5 the figure. Or, for the induced current of the second camera module 7, it can also be grounded through the conductive layer 4 and the first connector 22.

[0145] As an alternative embodiment, as shown in Figure 18 the figure, the electronic device further includes: a frame 306;

[0146] The frame 306 is disposed around the circumference of the circuit board 1, and the frame 306 has an antenna slit 3061, and the antenna slit 3061 is correspondingly disposed with the first camera module 2 or the second camera module 7.

[0147] In some embodiments, at least one of the first camera module 2 and the second camera module 7 can be disposed at the edge of the circuit board 1. For example: as shown in Figure 4 the figure, the first camera module 2 is disposed at the edge of the circuit board 1.

[0148] In some embodiments, the conductive member 5 is electrically connected to the area of the conductive layer 4 close to the antenna slit 3061.

[0149] Among them, the grounding area on the conductive layer 4 includes the area connected to the conductive member 5. By electrically connecting the conductive member 5 to the area of the conductive layer 4 close to the antenna slit 3061, the grounding area on the conductive layer 4 can be made as close as possible to the antenna slit 3061. In this way, when the frame antenna works, the induced current generated on the camera module P based on the strong radiation at the antenna slit 3061 can be grounded as soon as possible through the conductive member 5.

[0150] In some embodiments, when the conductive layer 4 and the conductive member 5 are a one-piece conductive double-sided tape, the conductive member 5 is electrically connected to the area of the conductive layer 4 close to the antenna slit 3061. For example: as shown in Figure 3 the figure, the conductive member 5 is electrically connected to the side of the conductive layer 4 facing the antenna slit 3061.

[0151] In some embodiments, when the conductive member 5 includes a conductive foam, the conductive member 5 is electrically connected to the region of the conductive layer 4 close to the antenna slit 3061. For example, the distance between the conductive member 5 and the side of the conductive layer 4 facing the antenna slit 3061 is less than the distance between the conductive member 5 and the side of the conductive layer 4 facing away from the antenna slit 3061.

[0152] In this embodiment, as Figure 7 and Figure 5 shown, for the first camera module 2 close to the antenna slit 3061, at least three grounding paths including a first path X, a second path Y, and a third path Z are provided, so that the first camera module 2 has good grounding performance. In this way, even if the antenna slit 3061 of the electronic device is arranged near the first camera module 2, the electromagnetic interference resistance performance of the first camera module 2 can meet the requirements, making the layout of the antenna slit 3061 and the first camera module 2 on the electronic device more loose and flexible.

[0153] Similarly, if the second camera module 7 is arranged close to the antenna slit 3061, at least three grounding paths can also be provided, so that the second camera module 7 has good grounding performance. In this way, even if the antenna slit 3061 of the electronic device is arranged near the second camera module 7, the electromagnetic interference resistance performance of the second camera module 7 can meet the requirements, making the layout of the antenna slit 3061 and the second camera module 7 on the electronic device more loose and flexible.

[0154] For the convenience of description, in the embodiments of the present application, the case where the first camera module 2 is correspondingly arranged with the antenna slit 3061 is taken as an example for illustration, which does not constitute a specific limitation here.

[0155] In some embodiments, as Figure 18 shown, the projection area of the conductive member 5 on the first side 43 of the conductive layer 4 includes the projection area of the antenna slit 3061 on the first side 43, and the first side 43 is the side of the conductive layer 4 facing the frame 306.

[0156] In this embodiment, the region of the conductive layer 4 opposite to the antenna slit 3061 is electrically connected to the conductive member 5. In this way, when the frame antenna works, its strongest radiation point is usually located at the antenna slit 3061. By electrically connecting the region of the conductive layer 4 opposite to the antenna slit 3061 to the conductive member 5, the induced current on the camera module P can be grounded at the strongest current position, which can reduce the electromagnetic interference of the frame antenna on the camera module P.

[0157] In the electronic device provided by the embodiment of the present application, on the premise of meeting the grounding and heat dissipation design of the camera module P, the camera module P can still be closely arranged with the surrounding components, which can improve the utilization rate of the circuit board in the electronic device and make the layout of the components in the electronic device more flexible.

[0158] It should be noted that in this text, the term "including", "comprising" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device including a series of elements not only includes those elements, but also includes other elements not expressly listed, or also includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "including a..." does not exclude the existence of another identical element in the process, method, article or device including the element.

[0159] The embodiments of the present application have been described above in conjunction with the accompanying drawings. However, the present application is not limited to the above specific embodiments. The above specific embodiments are merely illustrative and not restrictive. Under the inspiration of the present application, those of ordinary skill in the art can also make many forms without departing from the purpose of the present application and the scope protected by the claims, and all of them belong to the protection scope of the present application.

Claims

1. An electronic device, characterized in that, Comprising: A circuit board, a camera module, a conductive layer, a conductive member, and a main board bracket; The camera module includes a first camera module and a second camera module, and both the first camera module and the second camera module are disposed on the circuit board; The first camera module includes a first camera and a first connector, and the first connector is electrically connected to the first camera; The second camera module includes a second camera and a second connector, and the second connector is electrically connected to the second camera; The conductive layer is disposed on a surface of the camera module facing away from the circuit board, and the conductive layer at least covers and is electrically connected to the first camera, the first connector, and the second connector; The main board bracket covers a side of the conductive layer facing away from the circuit board, and the conductive layer is electrically connected to the main board bracket through the conductive member.

2. The electronic device according to claim 1, wherein A heat sink is covered on a side of the conductive layer facing away from the camera module.

3. The electronic device according to claim 2, characterized in that, The conductive layer and the conductive member are of an integral structure, the conductive member is a folded portion formed at an edge of the conductive layer and facing the main board bracket, and the conductive member is folded and electrically connected to the main board bracket.

4. The electronic device according to claim 3, characterized in that, The conductive member is folded and connected to a side of the main board bracket facing away from the circuit board.

5. The electronic device according to claim 3, characterized in that, The conductive member is folded and connected to a side of the main board bracket facing the circuit board, and the conductive member is clamped between the heat sink and the main board bracket.

6. The electronic device according to claim 2, wherein The conductive layer and the conductive member are stacked; The heat sink is provided with a hollow portion, and the conductive layer is exposed from the heat sink through the hollow portion; the conductive member is correspondingly disposed with the hollow portion, and conducts the conductive layer and the main board bracket on opposite sides of the heat sink.

7. The electronic device according to any one of claims 1 to 6, characterized in that The first connector and the second connector are adjacent, and a length extension direction of the first connector is the same as a length extension direction of the second connector.

8. The electronic device according to any one of claims 1 to 6, characterized in that, Further comprising: A frame; The frame is disposed around a circumference of the circuit board, the frame has an antenna slit, and the antenna slit is correspondingly disposed with the first camera module or the second camera module.

9. The electronic device according to claim 1, wherein Further comprising: A screw; A first through hole is formed in the main board bracket, a second through hole is formed in the circuit board, and the screw passes through the first through hole and the second through hole to fix the main board bracket to the circuit board; The main board bracket is electrically connected to the circuit board through the screw; A grounding path of the camera module includes a first path, and the first path sequentially passes through the conductive layer, the conductive member, the main board bracket, the screw, and the circuit board.

10. The electronic device according to claim 1, characterized in that, The electronic device further includes: a grounding spring piece, and the grounding spring piece abuts between the main board bracket and the circuit board; A region of the main board bracket corresponding to an edge of the conductive layer is electrically coupled and conductive with the conductive layer, or a conductive material layer is provided between a region of the main board bracket corresponding to the edge of the conductive layer and the conductive layer, and the conductive layer is electrically coupled and conductive with the conductive material layer; The grounding path of the camera module includes a second path to ground, which sequentially passes through the conductive layer, the area of the main board bracket corresponding to the edge of the conductive layer, the grounding elastic sheet, and the circuit board.

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