Loudspeaker module and electronic equipment

Abstract

The invention provides a loudspeaker module and electronic equipment, relates to the technical field of electronic equipment, and can reduce the noise of the loudspeaker module and improve the audio experience of the loudspeaker module. The loudspeaker module comprises a shell, an inner core, sound-absorbing particles and a separation net structure, at least one part of the inner core is arranged in the shell, and a rear cavity of the loudspeaker module is defined by the inner core and at least one part of the inner wall surface of the shell; the sound-absorbing particles are filled in the rear cavity; the separation net structure is arranged in the rear cavity and used for separating the inner core from the sound absorption particles; the separation net structure comprises a separation net and a first buffer layer, the separation net is provided with a first surface, the first surface deviates from the inner core, and the first buffer layer is arranged on the first surface. The loudspeaker module provided by the embodiment of the invention is applied to the electronic equipment.

Description

Technical Field

[0001] This application relates to the technical field of electronic devices, and particularly to a speaker module and an electronic device. Background Art

[0002] The speaker module is used to restore audio electrical signals such as music and voice into sounds and can support the function of external audio playback. Therefore, it has been more and more widely used in electronic devices such as mobile phones, tablet computers, and laptop computers.

[0003] With the development of electronic devices such as mobile phones and tablet computers, people have higher requirements for the audio experience of the speaker module. Higher low-frequency loudness will bring a better audio experience. The key factor affecting the low-frequency loudness of the speaker module is the volume of the rear cavity. The larger the volume of the rear cavity, the higher the low-frequency loudness. However, under the trend of thinning and miniaturization of electronic devices, the volume of the rear cavity is limited, which will make it difficult to improve the audio experience of the speaker module. Summary of the Invention

[0004] Embodiments of this application provide a speaker module and an electronic device, which can reduce the noise of the speaker module and improve the audio experience of the speaker module.

[0005] To achieve the above object, this application adopts the following technical solutions:

[0006] In a first aspect, some embodiments of this application provide a speaker module, including a housing, a core, sound-absorbing particles, and a partition structure. Among them, at least a part of the core is disposed in the housing, and the core and at least a part of the inner wall surface of the housing enclose the rear cavity of the speaker module; the sound-absorbing particles are filled in the rear cavity; in addition, the partition structure is disposed in the rear cavity to separate the core and the sound-absorbing particles; specifically, the partition structure may cover the part of the core located in the rear cavity or may not cover the part of the core located in the rear cavity. Furthermore, the partition structure includes a partition and a first buffer layer, and the partition includes but is not limited to a mesh and a metal mesh. The partition has a first surface facing away from the core, and the first buffer layer is disposed on the first surface. The first buffer layer covers the entire first surface or may not cover the first surface. Among them, the first surface refers to the overall surface formed by the surfaces of multiple wall plates of the partition facing away from the core.

[0007] In the embodiments of this application, a first buffer layer is disposed on the first surface of the partition. The first buffer layer can dissipate the vibration energy of the sound-absorbing particles in contact with it. Therefore, when the sound-absorbing particles in the rear cavity collide with the area of the partition provided with the first buffer layer, the generated noise will be reduced. Therefore, the overall noise caused by the collision of the sound-absorbing particles against the partition during movement can be reduced, thereby improving the sound effect of the speaker module.

[0008] In a possible implementation of the first aspect, the spacer net has mesh holes, and the vertical projection of the first buffer layer on the spacer net is offset from the mesh holes, that is, the vertical projection of the first buffer layer on the spacer net does not overlap with the mesh holes, which means the first buffer layer does not cover the mesh holes. In this way, it is beneficial to improve the transmission efficiency of sound between the inner core and the rear cavity, and improve the low-frequency effect of the speaker module.

[0009] In a possible implementation of the first aspect, the first buffer layer and the spacer net are of an integral structure, and the first buffer layer is attached to the first surface. Specifically, the first buffer layer can be formed on the spacer net by spraying or brushing. In this way, on the one hand, the processing technology of the first buffer layer can be simplified; on the other hand, the connection strength between the first buffer layer and the spacer net can be enhanced.

[0010] In a possible implementation of the first aspect, the material of the first buffer layer includes rubber and / or resin, that is, the first buffer layer can only include rubber, can only include resin, or can include both rubber and resin. In this way, the material of the first buffer layer is easy to obtain and purchase.

[0011] In a possible implementation of the first aspect, a second buffer layer is provided on at least a part of the inner wall surface of the rear cavity, that is, the second buffer layer can be provided on a part of the inner wall surface of the rear cavity, or can be provided on the entire inner wall surface of the rear cavity. In this way, the vibration energy of the sound-absorbing particles can be dissipated through the second buffer layer, and the noise generated by the collision of the sound-absorbing particles with the housing during movement can be reduced.

[0012] In a possible implementation of the first aspect, the inner core includes a diaphragm and a driving device. The inner surface of the diaphragm and the driving device enclose a vibration space. The driving device has a communication channel that communicates the vibration space and the rear cavity; specifically, the driving device includes a voice coil fixedly connected to the diaphragm, a magnetic circuit system provided on one side of the diaphragm, and a frame for mounting the diaphragm and the magnetic circuit system. The communication channel includes, but is not limited to, holes opened on the above-mentioned frame, holes opened on the magnetic circuit system, and the assembly gap between the magnetic circuit system and the frame, etc. As long as there is a communication channel on the driving device.

[0013] One end of the communication channel away from the vibration space has a first opening, and the second buffer layer includes a first part, and the first opening faces the first part. Specifically, the perpendicular orthographic projection of the first part in the plane parallel to the plane where the first opening is located overlaps with the first opening. Among them, "overlap" means "partial overlap" or "complete overlap".

[0014] In this way, the vibration energy of the sound-absorbing particles near the first opening can be dissipated through the first part, and the noise generated by the collision of the sound-absorbing particles near the first opening with the housing during movement can be reduced.

[0015] In a possible implementation of the first aspect, the housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicate with each other in a first direction; the first direction is parallel to the diaphragm.

[0016] In the vibration direction of the diaphragm, the first housing part includes a first wall plate and a second wall plate. The first wall plate has a through hole, and the inner core is integrally fixed within the first housing part, and the diaphragm seals the through hole. Specifically, the diaphragm can be arranged at the first end of the through hole close to the accommodation chamber, or at the second end of the through hole far from the accommodation chamber, or within the through hole, that is, between the first end and the second end.

[0017] The driving device is located between the diaphragm and the second wall plate. The first opening faces the second wall plate, and the first part is fixed to the second wall plate.

[0018] In this way, on the one hand, the vibration energy of the sound-absorbing particles near the first opening can be dissipated through the first part, reducing the noise generated by the collision of the sound-absorbing particles near the first opening with the housing during movement; on the other hand, since the first opening faces in a direction parallel to the vibration direction of the diaphragm, the gas flow between the vibration space and the rear cavity is maximized, which helps to reduce the air compression effect. Therefore, the speaker module can maintain a more linear response, thereby improving the accuracy and clarity of the sound.

[0019] In a possible implementation of the first aspect, the speaker module further includes an elastic adhesive part, and the elastic adhesive part includes but is not limited to gel. The elastic adhesive part is bonded between the second wall plate and the driving device; the elastic adhesive part and the first part are distributed in a direction parallel to the diaphragm, that is, the first part and the elastic adhesive part do not overlap each other.

[0020] In this way, on the one hand, the inner core can be more stably fixed within the first housing part, and on the other hand, the vibration energy generated by the inner core can be absorbed and dispersed, thereby improving the sound effect and clarity of the speaker module.

[0021] In a possible implementation of the first aspect, the mesh structure is arranged within the first housing part and surrounds the inner core; the mesh has a first mesh part laminated with the second wall plate, and the elastic adhesive part passes through the first mesh part. In this way, interference between the mesh and the elastic adhesive part can be avoided.

[0022] In a possible implementation of the first aspect, the housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicate with each other in a first direction; the first direction is parallel to the diaphragm.

[0023] The first housing part includes a first wall panel, a second wall panel, and a first side frame. The first wall panel and the second wall panel are opposite and spaced apart in the vibration direction of the diaphragm, and the first side frame is connected between the first wall panel and the second wall panel; the inner core is integrally fixed within the first housing part;

[0024] The spacer structure is disposed within the first housing part and surrounds the inner core; the second buffer layer includes a second portion that is fixed to the inner peripheral surface of the first side frame. The second portion may cover the entire inner peripheral surface of the first side frame or may be provided only on a part of the inner peripheral surface of the first side frame. In this way, the noise caused by the collision of the sound-absorbing particles against the inner wall surface of the first side frame during movement can be reduced.

[0025] In a possible implementation of the first aspect, a filling port is provided on the second housing part, and the shape of the filling port includes but is not limited to a circle, a square, a polygon, etc. The filling port communicates with the rear cavity. The sound-absorbing particles can be filled into the housing through the filling port. A sealing cover is installed on the filling port, and the sealing cover is used to block the filling port. In this way, it is convenient to fill the sound-absorbing particles.

[0026] In a possible implementation of the first aspect, the housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicate with each other in a first direction; the inner core is fixed to the first housing part;

[0027] The second housing part includes a first cavity and a second cavity. The second cavity is located at an end of the first cavity away from the first housing part. The second cavity communicates with the first housing part through the first cavity, and the area of the cross-section of the second cavity in a direction perpendicular to the first direction is larger than the area of the cross-section of the first cavity in a direction perpendicular to the first direction; the second cavity has a filling port provided on the second housing part;

[0028] The second buffer layer includes a third portion that is disposed on the inner wall surface of the first cavity. The third portion may cover the entire inner wall surface of the first cavity or may be provided only on a part of the inner wall surface of the first cavity. In this way, the noise caused by the collision of the sound-absorbing particles against the inner wall surface of the first cavity during movement can be reduced.

[0029] In a possible implementation of the first aspect, the second buffer layer is foam or silica gel. In this way, the structure of the second buffer layer is simple and convenient for production.

[0030] In a possible implementation of the first aspect, the second buffer layer includes a closed flexible bag body and a fluid medium. The material of the flexible bag body includes but is not limited to rubber, polyvinyl chloride (PVC), polyethylene (PE). The flexible bag body is fixedly connected to the inner wall surface of the rear cavity. The fluid medium is filled in the flexible bag body. The fluid medium is filled in the flexible bag body. The fluid medium includes but is not limited to water, air, oil.

[0031] In this way, when the sound-absorbing particles come into contact with the flexible bag body, the flexible bag body will deform and transmit the impact force to the internal fluid medium. Since the fluid medium has a certain viscosity and compressibility, it can effectively absorb and disperse the impact energy and play a buffering role.

[0032] In a possible implementation of the first aspect, the fluid medium is a non-Newtonian fluid. Non-Newtonian fluids include, but are not limited to, starch suspensions and inks. In this way, when an external force acts on the fluid medium, its molecular structure rearranges to form a temporary network structure, similar to an adhesive. This structure will increase the viscosity of the fluid medium, thus providing additional resistance. Therefore, it can absorb and disperse the impact energy more effectively.

[0033] In a possible implementation of the first aspect, the housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicated in a first direction; the inner core includes a diaphragm; the width of the first housing part in a second direction is greater than the width of the second housing part in the second direction to define an avoidance space; wherein, the second direction is perpendicular to the first direction, and both the first direction and the second direction are parallel to the diaphragm. When the speaker module is applied to an electronic device, this avoidance space can provide an avoidance for the speaker module.

[0034] In a possible implementation of the first aspect, the second housing part includes a first plate body and a second plate body oppositely arranged in the second direction; the first plate body includes a bent section and a flat section, the bent section and the flat section are arranged and connected in the first direction, the bent section arches towards the side where the second plate body is located, and a first cavity is formed between the bent section and the second plate body; a second cavity is formed between the flat section and the second plate body; the surface of the bent section facing away from the second plate body defines an avoidance groove. When the speaker module is applied to an electronic device, this avoidance groove can provide an avoidance for the electronic components on the circuit board.

[0035] In a possible implementation of the first aspect, the first housing part includes a first side plate and a second side plate oppositely arranged in the second direction, and the outer surface of the second side plate is flush with the outer surface of the flat section;

[0036] In the second direction, the second plate body is located between the first side plate and the second side plate; in the second direction, the avoidance space is located between the second plate body and the first side plate. In this way, without changing the width of the second housing part in the second direction, the width of the avoidance space in the second direction can be increased, so that the avoidance space can avoid a camera module with a larger width in the second direction.

[0037] In a second aspect, some embodiments of the present application provide an electronic device, including a screen, a back cover, and a speaker module as described in any of the above technical solutions; the screen is fixed to the back cover and encloses a receiving space with the back cover, and the speaker module is located in the receiving space.

[0038] Since the electronic device provided by the embodiments of the present application includes the speaker module as described in any of the above technical solutions, the two can solve the same technical problems and achieve the same technical effects.

[0039] In a possible implementation of the second aspect, the back cover includes a frame and a back plate, and the back plate is stacked with the screen; the back cover includes a frame and a back plate, and the back plate is fixed to the frame. The screen, the frame, and the back plate jointly enclose the receiving space of the electronic device. The electronic device further includes a middle plate, which is stacked between the back plate and the screen, and the frame is arranged around the edges of the back plate, the middle plate, and the screen; the speaker module is arranged between the middle plate and the back plate; the middle plate has a communication hole; the kernel includes a diaphragm, and the diaphragm seals the communication hole and encloses a front cavity of the speaker module with the communication hole.

[0040] The frame has a sound outlet hole; and / or, a part of the outer peripheral surface of the screen is spaced apart from the frame to define a sound outlet hole; that is, the sound outlet hole can be only provided on the frame, or only defined by a part of the outer peripheral surface of the screen being spaced apart from the frame, or can be composed of the sound outlet hole provided on the frame and the sound outlet hole defined by a part of the outer peripheral surface of the screen being spaced apart from the frame. The sound outlet hole communicates with the front cavity.

[0041] By providing a communication hole on the middle plate and using the diaphragm to seal the communication hole to form a front cavity, it is beneficial to achieve the compactness of the structure of the electronic device, without the need to additionally provide a front cavity in the space outside the middle plate, which is beneficial to achieving the thinness and lightness of the electronic device.

[0042] In a possible implementation of the second aspect, the housing includes a first housing part and a second housing part fixed together, and the first housing part and the second housing part are arranged side by side and communicate in a first direction; the kernel includes a diaphragm; the width of the first housing part in a second direction is greater than the width of the second housing part in the second direction to define an avoidance space; wherein, the second direction is perpendicular to the first direction, and both the first direction and the second direction are parallel to the diaphragm, and the electronic device further includes a camera module, which is located between the middle plate and the back plate and is relatively fixed to the middle plate; a part of the camera module is located in the avoidance space.

[0043] In this way, on the one hand, the compactness of the internal structure of the electronic device can be ensured; on the other hand, the problem that the thickness of the electronic device is large due to the camera module and the speaker module being stacked in the thickness direction of the electronic device can be prevented, which is beneficial to achieving the thinness and lightness of the electronic device.

[0044] Based on the above technical solutions, the electronic device further includes a circuit board, which is stacked between the speaker module and the back cover. The circuit board has an avoidance notch facing the avoidance space, and a part of the camera module is located in the avoidance notch. In this way, on the one hand, the compactness of the internal structure of the electronic device can be ensured; on the other hand, the problem that the thickness of the electronic device is large due to the stacking of the camera module and the main circuit board in the thickness direction of the electronic device can be prevented, which is beneficial to realizing the thin and light of the electronic device.

[0045] In a possible implementation manner of the second aspect, the second housing part includes a first plate body and a second plate body oppositely arranged in a second direction; the first plate body includes a bent section and a flat section, the bent section and the flat section are arranged and connected in the first direction, the bent section arches towards the side where the second plate body is located, and a first cavity is formed between the bent section and the second plate body; a second cavity is formed between the flat section and the second plate body; the surface of the bent section facing away from the second plate body defines an avoidance groove.

[0046] Electronic components are provided on the surface of the circuit board facing the speaker module, and at least a part of the electronic components is located in the avoidance groove, that is, part of the electronic components can be located in the avoidance space, or all parts of the electronic components can be located in the avoidance space. BRIEF DESCRIPTION OF THE DRAWINGS

[0047] Figure 1 is a schematic structural diagram of an electronic device provided by some embodiments of the present application;

[0048] Figure 2 is Figure 1 an exploded view of the electronic device shown;

[0049] Figure 3 is Figure 1 a schematic cross-sectional view of the electronic device shown at line A-A;

[0050] Figure 4 is Figure 1 a schematic cross-sectional view of the electronic device shown at line B-B;

[0051] Figure 5 is Figure 4 a three-dimensional structural schematic of the speaker module in the electronic device shown;

[0052] Figure 6 is Figure 3 an enlarged view of the electronic device shown at A;

[0053] Figure 7 is Figure 4 a schematic internal structure diagram of the speaker module in the electronic device shown;

[0054] Figure 8 is Figure 7 a three-dimensional structure schematic diagram of the spacer structure in the shown loudspeaker module;

[0055] Figure 9 is Figure 8 a cross-sectional structure schematic diagram of the shown spacer structure;

[0056] Figure 10 is Figure 7 a cross-sectional view of the second buffer layer in the shown loudspeaker module. Detailed implementation manners

[0057] In the embodiments of the present application, the term "exemplarily" or "for example" is used to indicate an example, illustration or explanation. Any embodiment or design solution described as "exemplarily" or "for example" in the embodiments of the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Specifically, the use of the term "exemplarily" or "for example" is intended to present relevant concepts in a specific manner.

[0058] In the description of the embodiments of the present application, the term "and / or" means and encompasses any and all possible combinations of one or more of the associated listed items. The term "and / or" is a relational term describing the relationship between associated objects, indicating that there can be three relationships. For example, A and / or B can represent: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in the present application generally represents an "or" relationship between the associated objects before and after.

[0059] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, the terms "installed", "connected" and "coupled" should be understood in a broad sense. For example, "connected" can be a detachable connection or a non-detachable connection; it can be a direct connection or an indirect connection through an intermediate medium.

[0060] In the description of the embodiments of the present application, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements not only includes those elements but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element. Without further limitation, an element defined by the statement "comprising one..." does not exclude the existence of additional identical elements in the process, method, article or device comprising the element.

[0061] As used herein, "parallel", "perpendicular", and "equal" include the stated cases as well as cases similar to the stated cases, where the range of the similar cases is within an acceptable deviation range, and the acceptable deviation range is determined by a person of ordinary skill in the art considering the measurements being discussed and the errors associated with the measurements of specific quantities (i.e., the limitations of the measurement system). For example, "parallel" includes absolute parallelism and approximate parallelism, where the acceptable deviation range for approximate parallelism can be, for example, within a deviation of ±10°; "perpendicular" includes absolute perpendicularity and approximate perpendicularity, where the acceptable deviation range for approximate perpendicularity can also be, for example, within a deviation of ±10°. "Equal" includes absolute equality and approximate equality, where the acceptable deviation range for approximate equality can be, for example, that the difference between the two equal ones is less than or equal to 5% of either one of them.

[0062] This application provides an electronic device, which is a type of electronic device with a speaker module. Specifically, the electronic device includes, but is not limited to, electronic devices such as mobile phones, tablet personal computers, laptop computers, personal digital assistants (PDAs), personal computers, notebook computers, in-vehicle devices, and wearable devices.

[0063] Please refer to Figures 1-2 , Figure 1 which is a schematic structural diagram of the electronic device 100 provided in some embodiments of this application; Figure 2 is Figure 1 an exploded view of the electronic device 100 shown. In the Figure 1 illustrated embodiment, the electronic device 100 is a mobile phone. Specifically, the electronic device 100 includes a screen 3, a back cover 1, a middle plate 2, a battery 4, a main circuit board 5, a secondary circuit board 6, a connection structure 7, a camera module 8, and a speaker module 9.

[0064] It should be noted that Figure 1 , Figure 2 and the relevant drawings below only schematically show some components included in the electronic device 100, and the actual shapes, actual sizes, actual positions, and actual structures of these components are not limited by Figure 1 , Figure 2 and the respective drawings below. In addition, when the electronic device 100 is a device in some other forms, the electronic device 100 may also not include the secondary circuit board 6, the connection structure 7, and the battery 4.

[0065] For ease of description, the width direction of the electronic device 100 is defined as the X-axis, the length direction of the electronic device 100 is defined as the Y-axis, and the thickness direction of the electronic device 100 (i.e., the stacking direction of the back shell 1 and the screen 3) is defined as the Z-axis. It can be understood that the coordinate system setting of the electronic device 100 can be flexibly set according to specific actual needs.

[0066] The screen 3 is used to display image information, video information, etc. The screen 3 includes a light-transmitting cover plate 31 and a display screen 32. The light-transmitting cover plate 31 is in a flat plate shape. Specifically, the shape of the light-transmitting cover plate 31 includes, but is not limited to, a rectangular flat plate, a square flat plate, an oblong flat plate, a circular flat plate, and an oval flat plate. The material of the light-transmitting cover plate 31 includes, but is not limited to, glass, plastic, and ceramic. The light-transmitting cover plate 31 and the display screen 32 are stacked and fixedly connected. The connection method between the light-transmitting cover plate 31 and the display screen 32 includes, but is not limited to, gluing. The light-transmitting cover plate 31 is mainly used to protect the display screen 32 and prevent dust.

[0067] The display screen 32 can be a flexible display screen or a rigid display screen. For example, the display screen 32 can be an organic light-emitting diode (OLED) display screen, an active-matrix organic light-emitting diode (AMOLED) display screen, a mini organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a micro organic light-emitting diode display screen, a quantum dot light-emitting diode (QLED) display screen, a liquid crystal display (LCD), and so on. The display surface of the display screen 32 faces the light-transmitting cover plate 31, so that information such as images and videos displayed on the display screen 32 can be observed by the user through the light-transmitting cover plate 31. Among them, the screen 3 can be a flat screen or a curved screen, which is not specifically limited here.

[0068] Please refer to Figures 2-3 , where Figure 3 is Figure 1Schematic cross-sectional view of the electronic device 100 shown at the A-A line. The screen 3 is fixed to the back shell 1 and encloses an accommodation space with the back shell 1. The connection method between the screen 3 and the back shell 1 includes but is not limited to gluing. The accommodation space of the electronic device 100 can be used to accommodate components such as the main circuit board 5, the secondary circuit board 6, the connection structure 7, the speaker module 9, the camera module 8, and the battery 4.

[0069] Please continue to refer to Figure 2 and Figure 3 , the back shell 1 includes a back cover 12 and a frame 11. The back cover 12 and the screen 3 are stacked. The frame 11 is disposed around the edges of the back cover 12 and the screen 3. In this way, the screen 3, the frame 11, and the back cover 12 together enclose the accommodation space of the electronic device 100.

[0070] The back cover 12 is fixed to the frame 11. Exemplarily, the back cover 12 can be fixedly connected to the frame 11 by adhesive. The back cover 12 and the frame 11 can also be an integrally formed structure, that is, the back cover 12 and the frame 11 are a single integral structure. Please continue to refer to Figure 2 and Figure 3 , the middle plate 2 is fixed inside the accommodation space of the electronic device 100. The middle plate 2 is in a flat plate shape, and the shape of the middle plate 2 is adapted to the shape of the light-transmitting cover plate 31. The middle plate 2 is stacked between the back cover 12 and the screen 3. Specifically, the frame 11 is disposed around the edges of the middle plate 2. Exemplarily, the middle plate 2 and the frame 11 can be an integrally formed structure. In other embodiments, the frame 11 and the middle plate 2 can also be assembled and connected, and the connection methods between them include but are not limited to gluing, snap connection, screw connection, etc.

[0071] The middle plate 2 serves as the structural "skeleton" of the electronic device 100, and components such as the main circuit board 5, the secondary circuit board 6, the speaker module 9, the camera module 8, and the battery 4 can be fixed to the middle plate 2. It can be understood that in other embodiments, the electronic device 100 may not include the middle plate 2.

[0072] The battery 4 is used to supply power to the main circuit board 5, the secondary circuit board 6, the screen 3, the camera module 8, the speaker module 9, etc. In some embodiments, a battery installation groove 21 is provided on the surface of the middle plate 2 facing the back cover 12, and the battery 4 is installed in the battery installation groove 21. In other embodiments, when the back shell 1 does not include the middle plate 2, the battery 4 can be fixed to the surface of the back cover 12 facing the display screen 32.

[0073] Please continue to refer to Figure 2 and Figure 3The main circuit board 5 can be laminated and fixed on the surface of the middle plate 2 facing the back cover 12. Specifically, the main circuit board 5 and the battery 4 are arranged along the Y-axis direction. In other embodiments, when the electronic device 100 does not include the middle plate 2, the main circuit board 5 can be fixed on the surface of the display screen 32 facing the back cover 12.

[0074] The main circuit board 5 can be a hard circuit board, a flexible circuit board, or a combination of hard and soft circuit board. The main circuit board 5 can adopt a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, and so on. Here, FR-4 is a code for a grade of flame-resistant material, and the Rogers dielectric board is a high-frequency board. The main circuit board 5 can be used for integrated chips. For example, the chip can be an application processor (AP), a double data rate synchronous dynamic random access memory (DDR), and a universal flash storage (UFS). The main circuit board 5 is electrically connected to the display screen 32, and the main circuit board 5 is used to control the display screen 32 to display images or videos.

[0075] The auxiliary circuit board 6 is located on the side of the battery 4 away from the main circuit board 5. The auxiliary circuit board 6 can be fixed to the surface of the middle plate 2 facing the back cover 12. In other embodiments, when the back shell 1 does not include the middle plate 2, the auxiliary circuit board 6 can also be fixed to the side of the display screen 32 facing the back cover 12.

[0076] The auxiliary circuit board 6 can be a hard circuit board, a flexible circuit board, or a combination of hard and soft circuit boards. The auxiliary circuit board 6 can use a FR-4 dielectric board, a Rogers dielectric board, a mixed dielectric board of FR-4 and Rogers, and so on. The auxiliary circuit board 6 can be used to integrate electronic components 51 such as antenna (such as 5G antenna), radio frequency front end, universal serial bus (USB) devices, etc.

[0077] The auxiliary circuit board 6 is electrically connected to the main circuit board 5 through the connection structure 7 to realize data and signal transmission between the auxiliary circuit board 6 and the main circuit board 5. The connection structure 7 can be a flexible circuit board. In other embodiments, the connection structure 7 can also be a wire or an enameled wire.

[0078] The camera module 8 is used to take photos / videos. The camera module 8 can be a camera module with at least one function of adjusting the amount of incident light, automatic focusing (AF), and optical image stabilization (OIS). Exemplarily, the camera module 8 can be an auto-zooming camera module. The camera module 8 can also be a type of camera module that does not have functions such as adjusting the amount of incident light, automatic focusing (AF), and optical image stabilization (OIS). Exemplarily, the camera module 8 is a fixed-focus camera module, and the fixed-focus camera module includes, but is not limited to, a wide-angle camera module and a macro camera module.

[0079] The camera module 8 can be a front camera or a rear camera. In this embodiment, the camera module 8 is taken as an example of a front camera for illustration.

[0080] Please continue to refer to Figure 2 , the camera module 8 is located between the middle plate 2 and the back cover 12 and is relatively fixed to the middle plate 2. Specifically, the camera module 8 can be fixed to the surface of the middle plate 2 facing the back cover 12. The connection manner between the camera module 8 and the middle plate 2 includes, but is not limited to, adhesive bonding, snap connection, screw connection, etc. In other embodiments, when the electronic device 100 does not include the middle plate 2, the camera module 8 can also be fixed to the surface of the display screen 32 facing the back cover 12.

[0081] Specifically, a second opening 22 is provided at a position on the middle plate 2 corresponding to the shooting area of the camera module 8, and a third opening 321 is provided at a position on the display screen 32 corresponding to the shooting area of the camera module 8. The camera module 8 can shoot various things on the side of the screen 3 away from the back cover 12 through the second opening 22 and the third opening 321.

[0082] Please continue to refer to Figure 2 , for the convenience of electrical connection between the camera module 8 and the main circuit board 5, the camera module 8 and the main circuit board 5 are located on the same side of the battery 4. In some embodiments, please continue to refer to Figure 2 , an avoidance notch K is provided on the main circuit board 5, and a part of the camera module 8 is located within the avoidance notch K. In this way, on the one hand, the compactness of the internal structure of the electronic device 100 can be ensured; on the other hand, the problem that the thickness of the electronic device 100 is large due to the stacked arrangement of the camera module 8 and the main circuit board 5 in the Z-axis direction can be prevented, which is beneficial to realizing the thinness and lightness of the electronic device 100.

[0083] In other embodiments, the avoidance notch K is not provided on the main circuit board 5, and the camera module 8 and the main circuit board 5 are stacked between the back cover 12 and the middle plate 2.

[0084] In addition, when the camera module 8 and the secondary circuit board 6 are on the same side of the battery 4, an avoidance notch K for avoiding the camera module 8 can be provided on the secondary circuit board 6. In the following description, it is assumed that the main circuit board 5 is provided with the avoidance notch K and a part of the camera module 8 is located within the avoidance notch K for illustration purposes.

[0085] The speaker module 9, also known as the "speaker", is used to convert an audio electrical signal into a sound signal. The electronic device 100 can listen to music or hands-free calls through the speaker module 9, enabling the electronic device 100 to support sound playback.

[0086] The speaker module 9 is disposed between the middle plate 2 and the back cover 12. Specifically, please continue to refer to Figure 2 and Figure 3 , where the middle plate 2, the speaker module 9, the main circuit board 5, and the back cover 12 are stacked in sequence.

[0087] To avoid the camera module 8, please continue to refer to Figure 2 , the speaker module 9 has an avoidance space M facing the avoidance notch K. A part of the camera module 8 is located within the avoidance space M.

[0088] Please refer to Figure 4 and Figure 5 , where Figure 4 is Figure 1 a schematic cross-sectional view of the electronic device 100 shown in [Figure number] at the B-B line. Figure 5 is Figure 4 a schematic three-dimensional structure view of the speaker module 9 in the electronic device 100 shown in [Figure number]. The speaker module 9 includes a housing 91.

[0089] The housing 91 is used to protect its internal structure. The material of the housing 91 includes, but is not limited to, plastic, metal, and a combination of plastic and metal.

[0090] To form the above-mentioned avoidance space M for avoiding the camera module 8. In some embodiments, the housing 91 has the avoidance space M. Specifically, the housing 91 includes a first housing part 911 and a second housing part 912 that are fixed together. The first housing part 911 and the second housing part 912 are arranged side by side and connected in the X-axis direction (i.e., the first direction).

[0091] The width of the first housing part 911 in the Y-axis direction (i.e., the second direction) is greater than the width of the second housing part 912 in the second direction to define the avoidance space M.

[0092] In this way, on the one hand, the compactness of the internal structure of the electronic device 100 can be ensured; on the other hand, the problem of the large thickness of the electronic device 100 caused by the stacked arrangement of the camera module 8 and the speaker module 9 in the Z-axis direction can be prevented, which is beneficial to realizing the thinning and lightening of the electronic device 100.

[0093] Since the main circuit board 5 and the speaker module 9 are stacked, when there are electronic components 51 on the surface of the main circuit board 5 facing the speaker module 9 (in combination Figure 2 ), in order to avoid the electronic components 51. There is an avoidance groove N on the second housing part 912. At least a part of the electronic component 51 is located in the avoidance groove N, that is, part of the electronic component 51 can be located in the avoidance groove N, or all parts of the electronic component 51 can be located in the avoidance groove N.

[0094] In this way, on the one hand, the compactness of the internal structure of the electronic device 100 can be ensured; on the other hand, the thickness of the whole formed by the main circuit board 5 and the speaker module 9 is reduced, which is beneficial to realizing the thinning and lightening of the electronic device 100.

[0095] The above-mentioned first housing part 911 can be an integral housing or can be formed by assembling multiple parts. Similarly, the second housing part 912 can be an integral housing or can be formed by assembling multiple parts.

[0096] Please refer to Figure 4 , the first housing part 911 encloses an accommodation chamber J. The first housing part 911 has a first wall plate 9111, a second wall plate 9112 and a first side frame 9113. The first wall plate 9111 and the second wall plate 9112 are arranged along the thickness direction of the speaker module 9, that is, the Z-axis direction. The first wall plate 9111 and the second wall plate 9112 are opposite and spaced apart. The first side frame 9113 is connected between the first wall plate 9111 and the second wall plate 9112. Specifically, the first side frame 9113 is arranged around the edges of the first wall plate 9111 and the second wall plate 9112 for one week.

[0097] The second housing part 912 includes a first cavity 9121 and a second cavity 9122.

[0098] The second cavity 9122 is located at one end of the first cavity 9121 away from the first housing part 911. The second cavity 9122 is communicated with the first housing part 911 through the first cavity 9121.

[0099] Specifically, the second housing part 912 has a third wall panel 9123, a fourth wall panel 9124, and a second side frame 9125. The third wall panel 9123 and the fourth wall panel 9124 are arranged along the thickness direction of the speaker module 9, i.e., the Z-axis direction. The third wall panel 9123 and the fourth wall panel 9124 are oppositely arranged. The second side frame 9125 is disposed around the edges of the third wall panel 9123 and the fourth wall, and the second side frame 9125 is connected to the first side frame 9113.

[0100] Please refer to Figure 5 , in some embodiments, the second side frame 9125 includes a first plate body 9125a and a second plate body 9125b that are oppositely arranged in the Y-axis direction, that is, the second housing part 912 includes the first plate body 9125a and the second plate body 9125b that are oppositely arranged in the Y-axis direction. The first plate body 9125a includes a bent section 9125a1 and a flat plate section 9125a2. The bent section 9125a1 and the flat plate section 9125a2 are arranged and connected in the X-axis direction. A first cavity 9121 is formed between the bent section 9125a1 and the second plate body 9125b; a second cavity 9122 is formed between the flat plate section 9125a2 and the second plate body 9125b.

[0101] The bent section 9125a1 arches toward the side where the second plate body 9125b is located. The surface of the bent section 9125a1 facing away from the second plate body 9125b defines the aforementioned avoidance groove N.

[0102] Please refer to Figure 4 and Figure 5 , in some embodiments, the outer surface of the third wall panel 9123 is coplanar with the outer surface of the first wall panel 9111. Wherein, the outer surface of the third wall panel 9123 refers to the surface of the third wall panel 9123 facing away from the first cavity 9121, and the outer surface of the first wall panel 9111 refers to the surface of the first wall panel 9111 facing away from the accommodation chamber J.

[0103] In this way, the speaker module 9 can be closely attached to the surface of the middle plate 2 facing the back cover 12 to ensure the structural compactness of the electronic device 100. It can be understood that in other embodiments, the outer surface of the third wall panel 9123 and the outer surface of the first wall panel 9111 may not be coplanar.

[0104] Please refer to Figure 4 and Figure 5 , in some embodiments, the outer surface of the second wall panel 9112 is coplanar with the outer surface of the fourth wall panel 9124. Wherein, the outer surface of the fourth wall panel 9124 refers to the surface of the fourth wall panel 9124 facing away from the first cavity 9121, and the outer surface of the second wall panel 9112 refers to the surface of the second wall panel 9112 facing away from the accommodation chamber J.

[0105] In this way, the speaker module 9 can be closely attached to the surface of the main circuit board 5 facing the middle plate 2, so as to ensure the structural compactness of the electronic device 100. It can be understood that in other embodiments, the outer surfaces of the second wall plate 9112 and the fourth wall plate 9124 may not be coplanar.

[0106] Please refer to Figure 4 and Figure 5 , in some embodiments, the first side frame 9113 includes a first side plate 9113a and a second side plate 9113b that are oppositely arranged in the Y-axis direction. That is, the first housing part 911 includes the first side plate 9113a and the second side plate 9113b that are oppositely arranged in the second direction. The outer surface of the second side plate 9113b is flush with the outer surface of the flat plate section 9125a2. In the Y-axis direction, the second plate body 9125b is located between the first side plate 9113a and the second side plate 9113b; in the Y-axis direction, the avoidance space M is located between the second plate body 9125b and the first side plate 9113a. Wherein, the outer surface of the second side plate 9113b refers to the surface of the second side plate 9113b facing away from the accommodation chamber J, and the outer surface of the flat plate section 9125a2 refers to the surface of the flat plate section 9125a2 facing away from the second cavity 9122.

[0107] In this way, when the width of the second housing part 912 in the Y-axis direction remains unchanged, the width of the avoidance space M in the second direction can be increased, so that the avoidance space M can avoid the camera module 8 with a larger width in the second direction.

[0108] Please refer to Figure 6 , Figure 6 For Figure 3 the enlarged view of the electronic device 100 shown at A. The speaker module 9 further includes a core 92. The core 92 is the core component for generating sound in the speaker module 9. At least a part of the core 92 is arranged in the housing 91, that is, a part of the core 92 can be arranged in the housing 91, or the whole of the core 92 can be arranged in the housing 91.

[0109] Please continue to refer to Figure 6 , in this embodiment, the core 92 is integrally fixed in the first housing part 911.

[0110] Specifically, the core 92 includes a diaphragm 921 and a driving device 922.

[0111] The first wall plate 9111 has a through hole 9111a, and the diaphragm 921 plugs the through hole 9111a. The diaphragm 921 can be arranged at the first end of the through hole 9111a close to the accommodation chamber J, or at the second end of the through hole 9111a far from the accommodation chamber J, or can be arranged in the through hole 9111a, that is, between the first end and the second end.

[0112] Among them, the diaphragm 921 extends in the XY direction. That is, the diaphragm 921 is parallel to the X-axis direction and the Y-axis direction. At the same time, the vibration direction of the diaphragm 921 is the same as the Z-axis direction.

[0113] Please continue to refer to Figure 6 , the middle plate 2 has a communication hole 23; the communication hole 23 is opposite to the through hole 9111a, and the diaphragm 921 seals the communication hole 23 and encloses the front cavity C1 of the speaker module 9 with the communication hole 23.

[0114] In order to reduce the distortion generated by the speaker module 9 when playing sound and improve the overall auditory experience of the speaker module 9. A part of the outer peripheral surface of the screen 3 is spaced apart from the frame 11 to define a sound outlet hole 111, and the sound outlet hole 111 communicates with the front cavity C1. In this way, the sound generated by the speaker module 9 pushing the air in the front cavity C1 to vibrate can be transmitted out through the sound outlet hole 111.

[0115] In other examples, the sound outlet hole 111 can also be opened on the frame 11, that is, the frame 11 has the sound outlet hole 111. Or, in other examples, it can be that some of the sound outlet holes provided on the frame 11 and some of the sound outlet holes defined by the part of the outer peripheral surface of the screen 3 being spaced apart from the frame 11 together form the sound outlet hole 111. As long as it is ensured that the frame 11 has the sound outlet hole 111 and / or the part of the outer peripheral surface of the screen 3 is spaced apart from the frame 11 to define the sound outlet hole 111.

[0116] Specifically, the sound outlet hole 111 communicates with the front cavity C1 through a sound outlet channel 93. Specifically, the display screen 32 is spaced apart from the middle plate 2 to form a sound outlet channel 93, and the sound outlet hole 111 communicates with the front cavity C1 through the sound outlet channel 93. See the path indicated by the arrow in Figure 3 for the air flow line in the front cavity C1. It can be understood that in other embodiments, when the position of the communication hole 23 is close to the frame 11, the sound outlet channel 93 can also be not provided, and the sound outlet hole 111 directly communicates with the front cavity C1.

[0117] Please refer to Figure 7 , Figure 7 For Figure 4 is a schematic internal structure diagram of the speaker module 9 in the electronic device 100 shown. The inner core 92 and the inner wall surface of the housing 91 enclose a rear cavity C2 of the speaker module 9. In other examples, the inner core 92 and a part of the inner wall surface of the housing 91 enclose a rear cavity C2 of the speaker module 9, and the inner core 92 and a part of the inner wall surface of the housing 91 enclose a front cavity C1 of the speaker module 9. As long as it is ensured that the inner core 92 and at least a part of the inner wall surface of the housing 91 enclose a rear cavity C2 of the speaker module 9.

[0118] The driving device 922 is used to drive the diaphragm 921 to vibrate, so as to drive the air in the front cavity C1 to vibrate to form sound waves. Among them, the driving device 922 includes but is not limited to an electrodynamic (i.e., moving coil) driving device, an electrostatic (i.e., capacitive) driving device, an electromagnetic (i.e., reed) driving device, or a piezoelectric (i.e., crystal) driving device.

[0119] The driving device 922 is stacked with the second wall plate 9112, and the driving device 922 is located between the diaphragm 921 and the second wall plate 9112. The driving device 922 and the inner surface of the diaphragm 921 enclose a vibration space 923. Among them, the inner surface of the diaphragm 921 refers to the surface of the diaphragm 921 facing away from the front cavity C1.

[0120] In some embodiments, the driving device 922 is a moving coil driving device. Specifically, please refer to Figure 7 , the driving device 922 includes a voice coil 9221 fixedly connected to the diaphragm 921, a magnetic circuit system 9222 disposed on one side of the diaphragm 921, and a frame 9223 for mounting the diaphragm 921 and the magnetic circuit system 9222. The voice coil 9221 generates an induced magnetic field after being energized, and thus is displaced under the magnetic force of the magnetic circuit system 9222 to drive the diaphragm 921 to vibrate.

[0121] Please continue to refer to Figure 7 , in order to balance the pressure difference on both sides of the diaphragm 921, reduce the non-linear movement of the diaphragm 921 caused by air pressure changes, and thus reduce the distortion generated when the speaker module 9 plays sound. In some embodiments, the driving device 922 has a communication channel 9224, and the communication channel 9224 communicates the vibration space 923 and the rear cavity C2. The communication channel 9224 includes but is not limited to holes opened on the above-mentioned frame 9223, holes opened on the magnetic circuit system 9222, and assembly gaps between the magnetic circuit system 9222 and the frame 9223, etc. As long as it is ensured that the driving device 922 has a communication channel 9224. Exemplarily, in Figure 7 the illustrated embodiment, the communication channel 9224 is a hole opened on the frame 9223. Exemplarily, the communication channel 9224 can be opened at the four top corners of the frame 9223 close to the second wall plate 9112.

[0122] In order to improve the low-frequency loudness of the speaker module 9 while not increasing the physical volume of the rear cavity C2 of the speaker module 9. Refer to Figure 7 , in some embodiments, the speaker module 9 further includes sound-absorbing particles 94, and the material of the sound-absorbing particles 94 includes but is not limited to one or more of melamine, zeolite, glass fiber, activated carbon, etc. The shape of the sound-absorbing particles 94 can be spherical, rod-shaped, sheet-shaped, cubic, irregular, etc. Among them, it should be noted that there are multiple sound-absorbing particles 94.

[0123] The sound-absorbing particles 94 are filled in the rear cavity C2. Specifically, a filling port 9126 is formed on the second housing part 912. The shape of the filling port 9126 includes but is not limited to circular, square, polygonal, etc. The filling port 9126 is communicated with the rear cavity C2. The sound-absorbing particles 94 can be filled into the housing 91 through the filling port 9126. A sealing cover (not shown in the figure) is installed on the filling port 9126, and the sealing cover is used to block the filling port 9126.

[0124] In addition, when the sealing cover does not seal the filling port 9126 and the rear cavity C2, the filling port 9126 can also be used to balance the air pressure between the rear cavity C2 and the external environment.

[0125] In this way, the sound-absorbing particles 94 can slow down the propagation speed of sound waves in the rear cavity C2 and reduce sound wave reflection, thereby increasing the equivalent volume of the rear cavity C2, and further improving the low-frequency effect of the speaker module 9.

[0126] On the basis of the above embodiments, in order to prevent the sound-absorbing particles 94 from interfering with the movement of the driving device 922 and the diaphragm 921 in the inner core 92. Please continue to refer to Figure 7 The speaker module 9 further includes a mesh structure 95. The mesh structure 95 is disposed in the rear cavity C2 for separating the inner core 92 and the sound-absorbing particles 94. Specifically, please refer to Figure 7 The mesh structure 95 is disposed in the first housing part 911 and surrounds the inner core 92.

[0127] Of course, the present application is not limited thereto. In other embodiments, the mesh structure 95 is annular, and the axial two ends of the mesh structure 95 are respectively fixedly connected to the first wall plate 9111 and the second wall plate 9112. In still other embodiments, the mesh structure 95 may not surround the inner core 92, the mesh structure 95 is in a flat plate shape, and is disposed at the communication port between the first housing part 911 and the second housing part 912.

[0128] In the speaker module 9 provided in the above embodiments, during operation, the diaphragm 921 generates vibrations, which push the surrounding air molecules to vibrate and form an air flow. Coupled with the arrangement of the communication channel 9224, there is an air flow circulation between the rear cavity C2 and the vibration space 923. These air flows exert a force on the sound-absorbing particles 94 in the rear cavity C2, causing the sound-absorbing particles 94 to vibrate and flow. The sound-absorbing particles 94 will collide with the mesh 951 and the inner wall surface of the rear cavity C2 during the vibration process, thereby generating noise.

[0129] In order to reduce the noise generated by the collision of the sound-absorbing particles 94 with the mesh 951 during movement. Please refer to Figure 8 and Figure 9 Figure 8 For Figure 7 the schematic three-dimensional structure diagram of the mesh structure 95 in the speaker module 9 shown,​Figure 9 is Figure 8 a schematic cross-sectional structure diagram of the partition net structure 95 shown. The partition net structure 95 includes a partition net 951 and a first buffer layer 952.

[0130] The partition net 951 includes, but is not limited to, a gauze net and a metal net.

[0131] The partition net 951 has a first surface 9511. The first surface 9511 faces away from the inner core 92. The first buffer layer 952 is provided on the first surface 9511. Wherein, the first surface 9511 refers to the overall surface composed of the surfaces of the plurality of wall plates of the partition net 951 that face away from the inner core 92. Exemplarily, in Figure 8 the embodiment shown, the first buffer layer 952 covers the entire first surface 9511. It can be understood that in other embodiments, the first buffer layer 952 may also cover a part of the first surface 9511.

[0132] In this way, when the sound-absorbing particles 94 in the rear cavity C2 collide with the area of the partition net 951 provided with the first buffer layer 952, part of the vibration energy of the sound-absorbing particles 94 can be dissipated through the first buffer layer 952, thereby reducing the overall noise generated by the collision of the sound-absorbing particles 94 with the partition net 951 during movement, and thus improving the sound emission effect of the speaker module 9.

[0133] Please continue to refer to Figure 8 and Figure 9 , in some embodiments, the partition net 951 has mesh holes 9512, and the vertical projection of the first buffer layer 952 on the partition net 951 is offset from the mesh holes 9512, that is, the vertical projection of the first buffer layer 952 on the partition net 951 does not overlap with the mesh holes 9512, that is, the first buffer layer 952 does not cover the mesh holes 9512. In this way, it is beneficial to improve the sound transmission efficiency between the inner core 92 and the rear cavity C2, and improve the low-frequency effect of the speaker module 9.

[0134] It can be understood that when the first buffer layer 952 covers a part of the first surface 9511, the vertical projection of the first buffer layer 952 on the partition net 951 may also not be offset from the mesh holes 9512, that is, the first buffer layer 952 covers this part of the mesh holes 9512.

[0135] In some embodiments, the first buffer layer 952 and the partition net 951 are of an integral structure, and the first buffer layer 952 is attached to the first surface 9511. Exemplarily, the first buffer layer 952 can be formed on the partition net 951 by spraying or brushing. In this way, on the one hand, the processing technology of the first buffer layer 952 can be simplified; on the other hand, the connection strength between the first buffer layer 952 and the partition net 951 can also be enhanced.

[0136] Among them, the material of the first buffer layer 952 includes rubber and / or resin, that is, the first buffer layer 952 may only include rubber, may only include resin, or may include both rubber and resin. Of course, the present application is not limited to this, and the material of the first buffer layer 952 may also be other materials such as silica gel and polyurethane.

[0137] It can be understood that in other embodiments, the first buffer layer 952 may also be an elastic solid structure such as foam or silica gel. At this time, a first through hole is formed in the first buffer layer 952 opposite to the mesh holes 9512 of the partition net 951, and the first buffer layer 952 and the partition net 951 can be fixedly connected by means of bonding, screw connection, snap connection, etc.

[0138] It can be understood that at this time, the first buffer layer 952 may be a single-layer structure or a multi-layer structure. It should be noted that the use of a multi-layer structure design for the first buffer layer 952 can more effectively disperse and absorb energy by relying on the interlayer friction, and improve the buffering performance of the first buffer layer 952.

[0139] In some embodiments, please continue to refer to Figure 7 , the speaker module 9 further includes an elastic adhesive part 96. The elastic adhesive part 96 includes but is not limited to gel. The elastic adhesive part 96 is bonded between the second wall plate 9112 and the driving device 922.

[0140] In this way, on the one hand, the kernel 92 can be more stably fixed in the first housing part 911; on the other hand, it can also absorb and disperse the vibration energy generated by the kernel 92, thereby improving the sound effect and sound clarity of the speaker module 9.

[0141] Specifically, in the embodiment shown in Figure 7 , the partition net 951 has a first net part 9513 stacked with the second wall plate 9112, and the elastic adhesive part 96 passes through the first net part 9513. In this way, interference between the partition net 951 and the elastic adhesive part 96 can be avoided.

[0142] Exemplarily, the elastic adhesive part 96 passes through the mesh holes 9512 on the first net part 9513. Of course, the present application is not limited to this. In other embodiments, a second through hole is formed in the first net part 9513, and the radius of the second through hole is greater than the radius of the mesh holes 9512, and the elastic adhesive part 96 passes through the second through hole on the first net part 9513.

[0143] To reduce the noise caused by the collision of the sound-absorbing particles 94 against the inner wall surface of the housing 91 during movement, in some embodiments, a second buffer layer 97 is provided on at least a part of the inner wall surface of the rear cavity C2, that is, the second buffer layer 97 can be provided on a part of the inner wall surface of the rear cavity C2, or the second buffer layer 97 can be provided on the entire inner wall surface of the rear cavity C2. In this way, the vibration energy of the sound-absorbing particles 94 can be dissipated through the second buffer layer 97, reducing the noise caused by the collision of the sound-absorbing particles 94 against the inner wall surface of the housing 91 during movement, thereby improving the sound generation effect of the speaker module 9.

[0144] Please refer to Figure 7 , since the second cavity 9122 has a filling port 9126 formed in the second housing portion 912. This enables the sound-absorbing particles 94 to be filled into the rear cavity C2 only in the order of the second cavity 9122, the first cavity 9121, and the accommodation chamber J. And the area of the cross-section of the second cavity 9122 in a direction perpendicular to the first direction is larger than the area of the cross-section of the first cavity 9121 in a direction perpendicular to the first direction. This makes it difficult for the sound-absorbing particles 94 to enter the first cavity 9121 from the second cavity 9122, resulting in a lower filling rate of the sound-absorbing particles 94 in the first cavity 9121, and further leading to fewer sound-absorbing particles entering the accommodation chamber J. In addition, since the core 92 occupies most of the space in the accommodation chamber J, the gap formed between the outer circumferential surface of the mesh 951 in the accommodation chamber J and the inner circumferential surface of the first side frame 9113 is very narrow, which makes it more difficult for the sound-absorbing particles 94 to enter the accommodation chamber J of the first housing portion 911, resulting in a lower filling rate and filling amount of the sound-absorbing particles 94 in the accommodation chamber J.

[0145] When the filling rate of the sound-absorbing particles 94 is low, the space between the sound-absorbing particles 94 and between the sound-absorbing particles 94 and the inner wall of the cavity will be larger. This layout will cause the sound-absorbing particles 94 to vibrate with a larger amplitude under the action of sound waves. Therefore, the collision between the sound-absorbing particles 94 and the inner wall surface of the first cavity 9121 and the inner wall surface of the first side frame 9113 is more intense, generating greater noise.

[0146] To reduce the noise caused by the collision of the sound-absorbing particles 94 against the inner wall surface of the first cavity 9121 during movement. In some embodiments, the second buffer layer 97 includes a third part 973. The third part 973 is provided on the inner wall surface of the first cavity 9121. The third part 973 can cover the entire inner wall surface of the first cavity 9121, or can be provided only on a part of the inner wall surface of the first cavity 9121.

[0147] Exemplarily, in Figure 7 the embodiment shown, the third part 973 is provided on the part of the third wall plate 9123 corresponding to the first cavity 9121 and the part of the fourth wall plate 9124 corresponding to the first cavity 9121.

[0148] In order to reduce the noise caused by the collision of the sound-absorbing particles 94 against the inner wall surface of the first side frame 9113 during movement. In some embodiments, the second buffer layer 97 includes a second part 972. The second part 972 is fixed to the inner peripheral surface of the first side frame 9113. The second part 972 may cover the entire inner peripheral surface of the first side frame 9113, or may be provided only on a part of the inner peripheral surface of the first side frame 9113. This embodiment does not make a limitation here.

[0149] When the diaphragm 921 vibrates, the gas in the vibration space 923 will flow into the rear cavity C2 through the communication channel 9224. Specifically, one end of the communication channel 9224 far from the vibration space 923 has a first opening 9224a, and the gas in the vibration space 923 flows into the rear cavity C2 from the first opening 9224a. The flowing gas generates a force on the sound-absorbing particles 94 near the first opening 9224a, increasing the moving speed of the sound-absorbing particles 94 near the first opening 9224a. This will cause the collision between the sound-absorbing particles 94 near the first opening 9224a and the area on the inner wall surface of the rear cavity C2 opposite to the communication channel 9224 to be more intense, generating greater noise.

[0150] To solve the above technical problems, please refer to Figure 7 , in some embodiments, the second buffer layer 97 includes a first part 971, and the first opening 9224a faces the first part 971. Specifically, the perpendicular orthographic projection of the first part 971 in the plane parallel to the plane where the first opening 9224a is located overlaps with the first opening 9224a. Herein, "overlap" means "partial overlap" or "complete overlap". In this way, the vibration energy of the sound-absorbing particles 94 near the first opening 9224a can be dissipated through the first part 971, reducing the noise caused by the collision of the sound-absorbing particles 94 near the first opening 9224a against the inner wall surface of the first wall plate 9111 during movement.

[0151] Please refer to Figure 7 , in some embodiments, the first opening 9224a faces the second wall plate 9112, and the first part 971 is fixed to the second wall plate 9112. In this way, on the one hand, the vibration energy of the sound-absorbing particles 94 near the first opening 9224a can be dissipated through the first part 971, reducing the noise caused by the collision of the sound-absorbing particles 94 near the first opening 9224a against the inner wall surface of the first wall plate 9111 during movement; on the other hand, since the first opening 9224a faces in a direction parallel to the vibration direction of the diaphragm 921, the gas flow between the vibration space 923 and the rear cavity C2 is maximized, which helps to reduce the air compression effect. Therefore, the speaker module 9 can maintain a more linear response, thereby improving the accuracy and clarity of the sound.

[0152] Among them, it should be noted that: The first part 971 and the elastic adhesive part 96 are distributed in a direction parallel to the diaphragm 921, that is, the first part 971 and the elastic adhesive part 96 do not overlap with each other. Of course, the present application is not limited to this. In other embodiments, the first part 971 and the elastic adhesive part 96 may overlap with each other.

[0153] In some embodiments, please refer to Figure 10 , Figure 10 is Figure 7 a cross-sectional view of the second buffer layer 97 in the speaker module 9. The second buffer layer 97 includes a closed flexible bag 974 and a fluid medium 975. The flexible bag 974 is fixedly connected to the inner wall surface of the rear cavity C2. The fixed connection method between the flexible bag 974 and the inner wall surface of the rear cavity C2 includes but is not limited to bonding. The material of the flexible bag 974 includes but is not limited to rubber, polyvinyl chloride (PVC), and polyethylene (PE).

[0154] The fluid medium 975 is filled in the flexible bag 974. At this time, the principle of the second buffer layer 97 to slow down the impact force of the sound-absorbing particles 94 is as follows: When the sound-absorbing particles 94 come into contact with the flexible bag 974, the flexible bag 974 will deform and transmit the impact force to the internal fluid medium 975. Since the fluid medium 975 has a certain viscosity and compressibility, the impact energy can be effectively absorbed and dispersed.

[0155] In some embodiments, the fluid medium 975 is a non-Newtonian fluid. Non-Newtonian fluids include but are not limited to starch suspensions and inks. In this way, when an external force acts on the fluid medium 975, its molecular structure rearranges to form a temporary network structure, similar to an adhesive. This structure will increase the viscosity of the fluid medium 975, thereby providing additional resistance. Therefore, the impact energy can be more effectively absorbed and dispersed. In other examples, the fluid medium can also be water, air, or oil.

[0156] It can be understood that the second buffer layer 97 is not limited to the above-mentioned structure form of the flexible bag and the fluid medium. In other embodiments, the second buffer layer 97 is a foam or silica gel.

[0157] In the description of this specification, specific features, structures, materials, or characteristics may be combined in a suitable manner in any one or more embodiments or examples.

[0158] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the various embodiments of the present application.

Claims

1. A speaker module, characterized in that, It includes a housing, a core, sound-absorbing particles and a mesh structure; At least a part of the core is arranged inside the housing, and the core and at least part of the inner wall surface of the housing enclose a rear cavity of the speaker module; The sound-absorbing particles are filled in the rear cavity; the mesh structure is arranged in the rear cavity to separate the core and the sound-absorbing particles; The mesh structure includes a mesh and a first buffer layer. The mesh has a first surface facing away from the core, and the first buffer layer is arranged on the first surface.

2. The speaker module according to claim 1, wherein The mesh has mesh holes, and the vertical projection of the first buffer layer on the mesh is offset from the mesh holes.

3. The loudspeaker module according to claim 1 or 2, characterized in that The first buffer layer and the mesh are of an integral structure, and the first buffer layer is attached to the first surface.

4. The loudspeaker module according to any one of claims 1-3, characterized in that, The material of the first buffer layer includes rubber and / or resin.

5. The loudspeaker module according to any one of claims 1-4, wherein A second buffer layer is provided on at least a part of the inner wall surface of the rear cavity.

6. The loudspeaker module according to claim 5, wherein The core includes a diaphragm and a driving device. The inner surface of the diaphragm and the driving device enclose a vibration space. The driving device has a communication channel that communicates the vibration space and the rear cavity; One end of the communication channel away from the vibration space has a first opening, and the second buffer layer includes a first part, and the first opening faces the first part.

7. The speaker module according to claim 6, wherein The housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicate in a first direction; the first direction is parallel to the diaphragm; In the vibration direction of the diaphragm, the first housing part includes a first wall plate and a second wall plate. The first wall plate has a through hole, and the core is integrally fixed inside the first housing part. The diaphragm seals the through hole; the driving device is located between the diaphragm and the second wall plate, the first opening faces the second wall plate, and the first part is fixed to the second wall plate.

8. The loudspeaker module according to claim 7, characterized in that, The speaker module further includes an elastic adhesive part, and the elastic adhesive part is bonded between the second wall plate and the driving device; the elastic adhesive part and the first part are distributed in a direction parallel to the diaphragm.

9. The loudspeaker module according to claim 8, wherein The mesh structure is arranged inside the first housing part and surrounds the core; The mesh has a first mesh part laminated with the second wall plate, and the elastic adhesive part passes through the first mesh part.

10. The loudspeaker module according to any one of claims 6-9, characterized in that, The housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicate in a first direction; the first direction is parallel to the diaphragm; The first housing part includes a first wall plate, a second wall plate and a first side frame. The first wall plate and the second wall plate are opposite and spaced apart in the vibration direction of the diaphragm, and the first side frame is connected between the first wall plate and the second wall plate; the core is integrally fixed inside the first housing part; The mesh structure is arranged inside the first housing part and surrounds the core; The second buffer layer includes a second part, and the second part is fixed on the inner peripheral surface of the first side frame.

11. The loudspeaker module according to any one of claims 5-10, characterized in that, The housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicate with each other in a first direction. The inner core is fixed to the first housing part. The second housing part includes a first cavity and a second cavity. The second cavity is located at an end of the first cavity away from the first housing part. The second cavity communicates with the first housing part through the first cavity. The area of the cross-section of the second cavity in a direction perpendicular to the first direction is larger than the area of the cross-section of the first cavity in a direction perpendicular to the first direction. The second cavity has a filling port formed on the second housing part. The second buffer layer includes a third part disposed on the inner wall surface of the first cavity.

12. The loudspeaker module according to any one of claims 5-11, characterized in that, The second buffer layer is made of foam or silica gel.

13. The loudspeaker module according to any one of claims 5-11, characterized in that, The second buffer layer includes a closed flexible bag body and a fluid medium filled in the flexible bag body.

14. The loudspeaker module according to claim 13, wherein The fluid medium is a non-Newtonian fluid.

15. The loudspeaker module according to any one of claims 1-14, characterized in that The housing includes a first housing part and a second housing part fixed together. The first housing part and the second housing part are arranged side by side and communicate with each other in a first direction. The inner core includes a diaphragm. The width of the first housing part in a second direction is greater than the width of the second housing part in the second direction to define an avoidance space. Wherein, the second direction is perpendicular to the first direction, and both the first direction and the second direction are parallel to the diaphragm.

16. The loudspeaker module according to claim 15, wherein The second housing part includes a first plate body and a second plate body disposed opposite to each other in the second direction. The first plate body includes a bent section and a flat section. The bent section and the flat section are arranged and connected in the first direction. The bent section arches towards the side where the second plate body is located. A first cavity is formed between the bent section and the second plate body. A second cavity is formed between the flat section and the second plate body. The surface of the bent section facing away from the second plate body defines an avoidance groove.

17. The loudspeaker module according to claim 16, wherein, The first housing part includes a first side plate and a second side plate disposed opposite to each other in the second direction. The outer surface of the second side plate is flush with the outer surface of the flat section. In the second direction, the second plate body is located between the first side plate and the second side plate. In the second direction, the avoidance space is between the second plate body and the first side plate.

18. An electronic device, characterized in that, Comprising a screen, a back shell and the speaker module according to any one of claims 1-17. The screen is fixed to the back shell and encloses a receiving space with the back shell. The speaker module is located in the receiving space.

19. The electronic device according to claim 18, wherein The back shell includes a frame and a back cover. The back cover is stacked with the screen. The electronic device further includes a middle plate stacked between the back cover and the screen. The frame is arranged around the edges of the back cover, the middle plate and the screen. The speaker module is disposed between the middle plate and the back cover. The middle plate has a communication hole. The inner core includes a diaphragm that seals the communication hole and encloses a front cavity of the speaker module with the communication hole. The frame has a sound outlet hole. And / or, a part of the outer peripheral surface of the screen is spaced apart from the frame to define a sound outlet hole; the sound outlet hole communicates with the front cavity.

20. The electronic device according to claim 19, wherein The speaker module is the speaker module according to claim 15, The electronic device further includes a camera module, the camera module is located between the middle plate and the back cover, and is relatively fixed to the middle plate; a part of the camera module is located in the avoidance space.

21. The electronic device according to claim 20, wherein The electronic device further includes a circuit board, the circuit board is stacked between the speaker module and the back cover, the circuit board has an avoidance notch facing the avoidance space, and a part of the camera module is located in the avoidance notch.

22. The electronic device according to claim 21, wherein The speaker module is the speaker module according to claim 16, Electronic components are provided on the surface of the circuit board facing the speaker module, and at least a part of the electronic components is located in the avoidance groove.

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