Circuit board with heat dissipation structure and electronic device

Abstract

The embodiment of the invention provides a circuit board with a heat dissipation structure and an electronic device, the circuit board comprises a circuit board main body, a heat dissipation device and a back plate, and heating devices are arranged on the front surface and the back surface of the circuit board main body; the radiator is in contact with at least part of heating devices arranged on the front surface of the circuit board main body and is used for radiating the heating devices; the back plate is connected with the circuit board main body, a heat dissipation piece is arranged on the back plate, the heat dissipation piece is in contact with at least part of heating devices arranged on the back surface of the circuit board main body, and the heat dissipation piece and the heat dissipation device form at least one heat dissipation link, so that the heat dissipation piece transmits heat to the heat dissipation device for heat dissipation. According to the circuit board provided by the embodiment of the invention, at least one heat dissipation link is formed between the heat dissipation piece arranged on the back plate and the heat dissipation device, and heat on the back surface of the circuit board main body can be transmitted to the heat dissipation device positioned on the front surface for heat dissipation, so that the heat dissipation quality and efficiency of a heating device arranged on the circuit board main body are effectively ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of circuit boards, and particularly to a circuit board with a heat dissipation structure and an electronic device. Background Art

[0002] A circuit board can be called a printed wiring board or a printed circuit board, and its English name can be Printed Circuit Board, thus it can be called a PCB board. It mainly consists of pads, vias, mounting holes, conductors, components, connectors, etc.

[0003] However, during the use of a circuit board, the components located on the circuit board will generate a certain amount of heat during operation. If the heat cannot be dissipated in time, it may cause damage to the electrical components, thereby affecting the normal operation of the electronic device. Summary of the Invention

[0004] Embodiments of the present invention provide a circuit board with a heat dissipation structure and an electronic device, which can stably dissipate heat from the heat-generating devices on both sides of the circuit board, ensuring the stable and reliable operation of the electrical components.

[0005] In a first aspect, embodiments of the present invention provide a circuit board with a heat dissipation function, including:

[0006] A circuit board main body, with heat-generating devices deployed on both the front and back surfaces of the circuit board main body;

[0007] A radiator, in contact with at least some of the heat-generating devices deployed on the front surface of the circuit board main body, for dissipating heat from the heat-generating devices;

[0008] A backplane, connected to the circuit board main body, with a heat dissipation member provided on the backplane. The heat dissipation member is in contact with at least some of the heat-generating devices deployed on the back surface of the circuit board main body, and the heat dissipation member and the radiator form at least one heat dissipation link so that the heat dissipation member transfers heat to the radiator.

[0009] In some instances, the heat dissipation member is embedded in the backplane, and the upper surface of the heat dissipation member is in the same plane as the upper surface of the backplane.

[0010] In some instances, the radiator is in contact with at least some of the heat-generating devices deployed on the front surface of the circuit board main body through a heat conducting member.

[0011] In some instances, at least one protruding end for connecting to the radiator is provided on the heat dissipation member, and the at least one protruding end is in contact with the radiator through a heat conducting member to form at least one heat dissipation link.

[0012] In some instances, the size of the backplane is larger than that of the circuit board body, and there is a preset gap between the protruding end and the circuit board body.

[0013] In some instances, the heat sink includes at least one protruding end for connecting with the heat dissipation component. The at least one protruding end is in contact with the heat dissipation component through a heat conducting member, and there is a preset gap between the protruding end and the circuit board body.

[0014] In some instances, at least one first protruding end is provided on the heat dissipation component. The heat sink includes at least one second protruding end for contacting the first protruding end. The first protruding end is in contact with the second protruding end through a heat conducting member to form at least one heat dissipation link.

[0015] In some instances, the backplane is an insulating board, and the circuit board body is installed and connected to the backplane through an insulating layer.

[0016] In some instances, the backplane is a non-insulating board, and the heat conduction ability of the heat dissipation component is higher than that of the backplane.

[0017] In some instances, the heat dissipation component is a pipe structure made of a heat conducting material.

[0018] In some instances, a preset liquid is filled in the pipe structure.

[0019] In some instances, the heat sink is installed at the upper front end of the circuit board body through a detachable connecting member.

[0020] In some instances, the circuit board body is fixed between the upper clamping plate and the backplane. The upper clamping plate is located between the circuit board body and the heat sink, and the circuit board body is detachably installed on the substrate through the upper clamping plate and the backplane.

[0021] In a second aspect, an embodiment of the present invention provides an electronic device, including:

[0022] A substrate;

[0023] The circuit board with heat dissipation function described in the first aspect above, the number of the circuit boards is at least one, and the circuit boards are detachably installed on the substrate.

[0024] For the circuit board and electronic device with a heat dissipation structure provided in this embodiment, when heat-generating devices are deployed on both the front and back sides of the circuit board main body, heat dissipation operations are performed on at least some of the heat-generating devices on the front side of the circuit board main body through a radiator, and heat dissipation operations are performed on at least some of the heat-generating devices deployed on the back side of the circuit board main body through the heat dissipation component provided on the back plate. Since at least one heat dissipation link can be formed between the heat dissipation component and the radiator, when the heat dissipation component performs heat dissipation operations on at least some of the heat-generating devices located on the back side of the circuit board main body, the heat can be transferred to the radiator located on the front side for heat dissipation operations. In this way, the quality and efficiency of heat dissipation for the heat-generating devices deployed on the circuit board main body are effectively guaranteed, and further the safety and reliability of the circuit board during use are ensured. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the technical solutions in the embodiments of the present invention or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the drawings in the following description are some embodiments of the present invention. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0026] Figure 1 Structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 1 ;

[0027] Figure 2 Structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 2 ;

[0028] Figure 3 Structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 3 ;

[0029] Figure 4 Structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 4 ;

[0030] Figure 5 Structural schematic diagram showing the deployment of the heat dissipation component on the back plate provided by an embodiment of the present invention;

[0031] Figure 6 Structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 5 ;

[0032] Figure 7 Structural schematic diagram of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 6 ;

[0033] Figure 8Structural schematic of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 7 ;

[0034] Figure 9 Structural schematic of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 8 ;

[0035] Figure 10 Structural schematic diagram of an electronic device provided by an embodiment of the present invention;

[0036] Figure 11 Structural schematic diagram of a circuit board with a heat dissipation function provided by an application embodiment of the present invention. Detailed implementation manners

[0037] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below with reference to the accompanying drawings in the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0038] In the description of the embodiments of the present invention, terms such as "installation", "connection", "fixation" and the like should be understood in a broad sense. For example, "connection" can be a fixed connection, a detachable connection, or an integral connection. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present invention can be understood according to specific situations.

[0039] In the description of the embodiments of the present invention, it should be understood that the orientation or positional relationship indicated by terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the embodiments of the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the embodiments of the present invention.

[0040] The terms "comprising" and "having" in the description and claims of the embodiments of the present invention and any variations thereof are intended to cover non-exclusive inclusion. For example, a process or device comprising a series of steps does not necessarily have to be limited to those steps clearly listed, but may include other steps or structures not clearly listed or inherent to such process or device.

[0041] In addition, the terms "first" and "second" are for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include at least one of such features. In the description of the embodiments of the present invention, the meaning of "a plurality" is at least two, such as two, three, etc., unless otherwise specifically defined.

[0042] In the description of this specification, the description with reference to terms such as "an embodiment", "some embodiments", "example", "specific example", or "some examples" means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of the embodiments of the present invention. In this specification, the schematic representations of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples. In addition, without contradiction, those skilled in the art can combine and combine the different embodiments or examples described in this specification and the features of different embodiments or examples.

[0043] Figure 1 Schematic structure of a circuit board with a heat dissipation structure provided for an embodiment of the present invention Figure 1 ; Refer to the attached Figure 1 As shown, this embodiment provides a circuit board with a heat dissipation structure. The circuit board can perform stable heat dissipation operations on the heat-generating components. Specifically, the circuit board may include: a circuit board main body 1, a radiator 3 located at the upper end of the circuit board main body 1, and a backplane 4 located at the lower end of the circuit board main body 1. Specifically:

[0044] Circuit board main body 1, heat-generating devices 2 are deployed on both the front and back of the circuit board main body 1;

[0045] Radiator 3, which is in contact with at least part of the heat-generating devices 2 deployed on the front of the circuit board main body 1, and is used to perform heat dissipation operations on the heat-generating devices 2;

[0046] Backplane 4, which is connected to the circuit board main body 1. A heat dissipation member 5 is provided on the backplane 4. The heat dissipation member 5 is in contact with at least part of the heat-generating devices 2 deployed on the back of the circuit board main body 1. Moreover, the heat dissipation member 5 and the radiator 3 form at least one heat dissipation link so that the heat dissipation member 5 can transfer heat to the radiator 3 for heat dissipation.

[0047] Among them, the circuit board main body 1 can be a circuit board for carrying one or more components. The carried components can include heat-generating components and non-heat-generating components. The above heat-generating components can refer to components with relatively large power and large heat generation, such as resistors, chips, triodes, etc.; non-heat-generating components can refer to components with relatively small power and small heat generation, such as capacitors, switch components, potentiometers, inductors, etc.

[0048] For the heat-generating components 2 deployed on the circuit board main body 1, they can be jointly deployed on one side of the circuit board main body 1. For example, all the heat-generating components 2 can be deployed (soldered) on the front or back of the circuit board main body 1. At this time, in order to ensure the stable and reliable operation of the heat-generating components 2, during the operation of the heat-generating components 2, a radiator 3 for realizing heat dissipation operation can be deployed on the same side of the heat-generating components 2.

[0049] When the heat-generating components 2 are deployed on both sides of the circuit board main body 1, that is, multiple heat-generating components 2 can be deployed on both the front and back of the circuit board main body 1. Among them, the front of the circuit board main body 1 can be the side with more components deployed, and the back of the circuit board main body 1 can be the side with fewer components deployed. Of course, for the front and back of the circuit board main body 1, those skilled in the art can flexibly configure according to specific application scenarios or application requirements as long as the front and back of the circuit board main body 1 can be distinguished. In addition, the number of heat-generating components 2 located on the front is the same as or different from the number of heat-generating components 2 located on the back, that is, the number of heat-generating components 2 located on the front can be greater than or less than the number of heat-generating components 2 located on the back.

[0050] In order to ensure that the heat-generating components 2 located on both sides of the circuit board main body 1 can operate stably, structures for realizing heat dissipation operation can be deployed on both sides of the circuit board main body 1. For example, as Figure 1 shown, when the number of heat-generating components 2 is 3, two heat-generating components 2 can be deployed on the front of the circuit board main body 1, and the other heat-generating component 2 can be deployed on the back of the circuit board main body 1. At this time, in order to ensure the stable operation of the heat-generating components 2 located on the front of the circuit board main body 1, a radiator 3 can be set on the upper side of the circuit board main body 1. The radiator 3 can be deployed at the upper end of the front of the circuit board main body 1. Among them, the radiator 3 can be installed at the upper end of the front of the circuit board main body 1 through a detachable connecting member. The above detachable connecting member can include at least one of the following: bolts, studs, screws, etc. This not only facilitates operations such as disassembly, replacement, and maintenance of the radiator 3 and the circuit board main body 1, but also can reduce the cost of maintaining the circuit board.

[0051] For the deployed radiator 3, the radiator 3 can be in contact with at least some of the heat-generating devices 2 deployed on the front side of the circuit board body 1. In some instances, the radiator 3 can be directly abutted against at least some of the heat-generating devices 2 deployed on the front side of the circuit board body 1, or the radiator 3 can be abutted against at least some of the heat-generating devices 2 deployed on the front side of the circuit board body 1 through a heat-conducting member, so as to be able to dissipate heat from the above-mentioned at least some of the heat-generating devices 2.

[0052] Moreover, for the radiator 3, the heat-dissipating contact surface of the radiator 3 can be a regular plane for abutting against the heat-generating device 2. At this time, for at least one heat-generating device 2 on the front side of the circuit board body 1, the upper surfaces of all the heat-generating devices 2 are in the same plane or different planes. When the upper surfaces of all the heat-generating devices 2 located on the front side of the circuit board body 1 are in the same plane, the provided radiator 3 can be abutted against all the heat-generating devices 2, and at this time, the radiator 3 can dissipate heat from all the heat-generating devices 2 located on the front side of the circuit board body 1.

[0053] Among them, the upper surfaces of all the heat-generating devices 2 located on the front side of the circuit board body 1 can not only be in the same plane, but also be in different planes. For example, Figure 2 as shown, the upper planes of all the heat-generating devices 2 located on the front side of the circuit board body 1 can respectively form two different planes, namely plane 1 and plane 2. Since the heat-dissipating contact surface of the radiator 3 is a regular plane for abutting against the heat-generating device 2, therefore, at this time, the radiator 3 can be abutted against the upper surfaces of some of the heat-generating devices 2 located on the front side of the circuit board body 1, so as to be able to dissipate heat from the above-mentioned some of the heat-generating devices 2.

[0054] In addition, for the radiator 3, the heat-dissipating contact surface of the radiator 3 can not only be a regular plane for abutting against the heat-generating device 2, but also be an irregular plane for abutting against the heat-generating device 2. For example, Figure 3 as shown, the contact surface of the radiator 3 for abutting against the heat-generating device 2 can include a heat-dissipating contact surface 1 and a heat-dissipating contact surface 2, and the heat-dissipating contact surface 1 and the heat-dissipating contact surface 2 are different planes. At this time, if the upper surfaces of all the heat-generating devices 2 located on the front side of the circuit board body 1 are in the same plane, then the radiator 3 can only be abutted against some of the heat-generating devices 2 located on the front side of the circuit board body 1, so as to be able to dissipate heat from some of the heat-generating devices 2 deployed on the front side of the circuit board body 1.

[0055] Correspondingly, referring to the appendix Figure 4As shown, when the heat dissipation contact surface of the heat sink 3 is an irregular plane for abutting against the heat generating device 2, if the upper surfaces of all the heat generating devices 2 located on the front side of the circuit board main body 1 are different planes, then the heat sink 3 can abut against all the heat generating devices 2, that is, the heat dissipation contact surface 1 can abut against the upper surface of the heat generating device 2 on the left side, and the heat dissipation contact surface 2 can abut against the upper surface of the heat generating device 2 on the right side, so as to realize the heat dissipation operation for all the heat generating devices 2 deployed on the front side of the circuit board main body 1.

[0056] It should be noted that for the heat generating devices 2 deployed on the circuit board main body 1, designers can flexibly configure or adjust the specific quantity and specific structural features of the heat generating devices 2 according to specific application requirements or scenario requirements. After the heat generating devices 2 deployed on the circuit board main body 1 are determined, in order to ensure the quality and efficiency of heat dissipation for the heat dissipation device 2, the heat dissipation contact surface of the heat sink 3 can be configured based on the specific structural features of the heat generating devices 2, so as to ensure that the heat dissipation contact surface of the heat sink 3 can contact as many heat generating devices 2 as possible, thereby realizing the heat dissipation operation for more heat generating devices 2.

[0057] In addition, for the circuit board main body 1, since heat generating devices 2 are deployed on both the front and back sides of the circuit board main body 1, the configured heat sink 3 can perform heat dissipation operations on at least some of the heat generating devices 2 deployed on the front side of the circuit board main body 1. For the heat generating devices 2 deployed on the back side of the circuit board main body 1, in order to ensure the stable and reliable operation of the heat generating devices 2 located on the back side of the circuit board main body 1, a backplane 4 can be connected to the lower end of the circuit board main body 1. Among them, different materials of the backplane 4 can be installed and connected to the circuit board main body 1 in different ways. In some instances, the backplane 4 can be an insulating board, and at this time, the circuit board main body 1 can be installed and connected to the backplane 4 through an insulating layer. Or, in some instances, the backplane 4 can be a non-insulating board. Specifically, the backplane 4 can be a metal board. At this time, in order to ensure that the heat dissipation component 5 located on the circuit board main body 1 can quickly and stably dissipate the heat generated by the heat generating devices 2, the heat conduction ability of the heat dissipation component 5 is higher than that of the backplane 4.

[0058] For the heat dissipation component 5 that can be provided on the backplane 4 for heat dissipation operations, the heat dissipation component 5 can be realized as a pipe structure composed of a heat conducting material or a solid block structure composed of a heat conducting material. The above heat conducting materials can include at least one of the following: copper, iron, aluminum, etc. Specifically, when the heat dissipation component 5 is realized as a pipe structure composed of a heat conducting material, the pipe structure heat dissipation component 5 can be embedded on the backplane 4, as Figure 5 shown. In order to improve the heat dissipation quality and effect, a preset liquid is filled in the pipe structure heat dissipation component 5, and the preset liquid can be realized as water, hot oil, silicone oil, etc.

[0059] For the heat dissipation component 5 provided on the backplane 4, the heat dissipation component 5 can be in contact with at least part of the heat generating components 2 deployed on the back of the circuit board body 1. Specifically, the heat dissipation component 5 can be in contact with at least part of the heat generating components 2 through a heat conducting component. Since the heat dissipation component 5 is provided on the backplane 4, at least one heat dissipation link can be formed between the provided heat dissipation component 5 and the radiator 3, so that the heat dissipation component 5 can transfer heat to the radiator 3 for heat dissipation operation, effectively ensuring the heat dissipation quality and effect.

[0060] On the other hand, the specific implementation manner of the heat dissipation component 5 provided on the backplane 4 in this embodiment is not limited. For example, the heat dissipation component 5 can be provided on the backplane 4 through a connecting component or an adhesive. At this time, the heat dissipation component 5 can be fixedly provided on the upper surface of the backplane 4. Further, since the backplane 4 is installed and connected to the circuit board body 1, in order to minimize the influence of the heat dissipation component 5 on the installation and connection operation between the backplane 4 and the circuit board body 1, preferably, the heat dissipation component 5 is embedded in the backplane 4, and the upper surface of the heat dissipation component 4 is the same plane as the upper surface of the backplane 4.

[0061] For the circuit board with a heat dissipation structure provided in this embodiment, when heat generating components 2 are deployed on both the front and back of the circuit board body 1, the radiator 3 dissipates heat from at least part of the heat generating components 2 on the front of the circuit board body 1, and the heat dissipation component provided on the backplane 4 dissipates heat from at least part of the heat generating components 2 deployed on the back of the circuit board body 1. Since at least one heat dissipation link can be formed between the heat dissipation component 5 and the radiator 3, when the heat dissipation component 5 dissipates heat from at least part of the heat generating components 2 located on the back of the circuit board body 1, the heat can be transferred to the radiator 3 located on the front for heat dissipation operation, effectively ensuring the quality and efficiency of dissipating heat from the heat generating components 2 deployed on the circuit board body 1, and further ensuring the stable and reliable use of the circuit board.

[0062] Figure 6 Structural schematic of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 4 ; On the basis of the above embodiment, referring to the attached Figure 6 As shown, this embodiment does not limit at least one heat dissipation link formed between the heat dissipation component 5 and the radiator 3. In some instances, the heat dissipation component 5 can be in contact with the radiator 3 through the provided protruding end 501. At this time, at least one protruding end 501 for connecting with the radiator 3 is provided on the heat dissipation component 5, and at least one protruding end 501 is in contact with the radiator 3 through a heat conducting component to form at least one heat dissipation link.

[0063] In addition, to ensure the normal operation of the circuit board, the size of the backplane 4 can be larger than that of the circuit board body 1. To stably achieve that the heat dissipation component 5 can form a heat dissipation link with the radiator 3 through at least one protruding end 501, a preset gap can exist between the protruding end 501 and the circuit board body 1. The preset gap can refer to the gap existing between the edge of the protruding end 501 and the edge of the circuit board body 1, that is, the distance between the edge of the protruding end 501 and the edge of the circuit board body 1 can be greater than 0.

[0064] For the protruding end 501 provided on the heat dissipation component 5, the number of the protruding ends 501 can be one or more, and the protruding end 501 can be integrally connected or fixedly connected to the heat dissipation component. To ensure the heat transfer effect, the protruding end 501 can be in contact with the radiator 3 through a heat conducting component, so as to form at least one heat dissipation link. Specifically, when the number of the protruding ends 501 is multiple, the multiple protruding ends 501 can be in contact with the radiator 3 through a heat conducting component, so as to form multiple heat dissipation links. Through the multiple heat dissipation links, heat dissipation operation can be performed on the heat generating device 2, thus effectively ensuring the quality and effect of heat dissipation for the heat generating device 2 on the circuit board body 1.

[0065] Figure 7 Structural schematic of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 6 ; On the basis of the above embodiment, referring to the attached Figure 7 As shown, at least one heat dissipation link formed by the heat dissipation component 5 and the radiator 3 can not only be in contact with the radiator 3 through the protruding end 501 provided in the heat dissipation component 5, but also be in contact with the heat dissipation component 5 through the protruding end 301 provided in the radiator 3 to form at least one heat dissipation link. Specifically, the radiator 3 includes at least one protruding end 301 for connecting with the heat dissipation component 5. The at least one protruding end 301 is in contact with the heat dissipation component 5 through a heat conducting component 6, and a preset gap exists between the protruding end 301 and the circuit board body 1.

[0066] Among them, to ensure the normal operation of the circuit board, the size of the backplane 4 can be larger than that of the circuit board body 1. To stably achieve that the heat dissipation component 5 can form a heat dissipation link with the radiator 3 through at least one protruding end 301, a preset gap can exist between the protruding end 301 and the circuit board body 1. The preset gap can refer to the gap existing between the edge of the protruding end 301 and the edge of the circuit board body 1, that is, the distance between the edge of the protruding end 301 and the edge of the circuit board body 1 can be greater than 0.

[0067] For the protruding end 301 provided on the radiator 3, the number of the protruding ends 301 can be one or more, and the protruding end 301 can be integrally connected or fixedly connected to the radiator 3. In order to ensure the heat transfer effect, the protruding end 301 can be in contact with the radiator 3 through the heat conducting member 6, so as to form at least one heat dissipation link. Specifically, when the number of the protruding ends 301 is multiple, the multiple protruding ends 301 can be respectively in contact with the radiator 3 through the heat conducting member 6, so as to form multiple heat dissipation links. Through the multiple heat dissipation links, heat dissipation operations can be performed on the heat generating device 2 located on the back of the circuit board body 1. This not only ensures the flexible diversity of the realization of the heat dissipation link, but also effectively ensures the quality and effect of heat dissipation of the heat generating device 2 on the circuit board body 1 based on the heat dissipation link.

[0068] Figure 8 Structural schematic of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 7 ; On the basis of the above embodiment, refer to the attached Figure 8 As shown, the heat dissipation link can be realized not only by forming at least one heat dissipation link through the protruding end provided on the heat dissipation member 5 and the radiator 3, or by forming at least one heat dissipation link through the protruding end provided on the radiator 3 and the heat dissipation member 5, but also by the protruding ends provided on the heat dissipation member 5 and the radiator 3 to realize at least one heat dissipation link. At this time, at least one first protruding end 501 is provided on the heat dissipation member 5, and the radiator 3 includes at least one second protruding end 301 for contacting the first protruding end 501. The first protruding end 501 is in contact with the second protruding end 301 through the heat conducting member 6 to form at least one heat dissipation link.

[0069] Among them, in order to ensure the flexible reliability of the heat dissipation link setting, the heat dissipation link can be realized not only by the heat dissipation member 5 contacting the protruding end provided on the radiator 3, by the radiator 3 contacting the protruding end provided on the heat dissipation member 5, but also by the second protruding end 301 provided on the radiator 3 contacting the first protruding end 501 provided on the heat dissipation member 5. And the first protruding end 501 can be integrally provided with the heat dissipation member 5 or connected through a connecting member. Similarly, the second protruding end 301 can be designed together with the radiator 3 or connected through a connecting member, as long as it can ensure that the first protruding end 501 can be stably connected to the heat dissipation member 5 and the second protruding end 301 can be stably connected to the radiator 3, which will not be elaborated here.

[0070] Specifically, for the heat sink 5 disposed on the backplane 4, the structure and quantity of the heat sink 5 can be flexibly configured according to the structural characteristics between the backplane 4 and the circuit board body 1. In particular, for the quantity of the protruding ends 501 provided on the heat sink 5, the quantity of the first protruding ends 501 provided on the heat sink 5 can be at least one. Correspondingly, in order to enable the heat sink 5 to form at least one heat dissipation link with the radiator 3, at least one second protruding end 301 for contacting the first protruding end 501 can be configured on the radiator 3, that is, the quantity of the second protruding ends 301 can be the same as the quantity of the first protruding ends 501, and the contact surfaces of the second protruding ends 301 correspond to the contact surfaces of the first protruding ends 501. This can not only ensure the stable reliability of generating at least one heat dissipation link, but also ensure the quality and effect of dissipating heat from the heat generating device 2 based on the heat dissipation link.

[0071] Figure 9 Schematic diagram of the structure of a circuit board with a heat dissipation structure provided by an embodiment of the present invention Figure 8 ; On the basis of the above embodiment, referring to the attached Figure 9 As shown, for the circuit board body 1, since the stiffness of the circuit board body 1 is relatively high, in order to avoid damage to the circuit board body 1 when installing and connecting the circuit board body 1, when configuring the installation of the circuit board, in order to ensure the safety level of the circuit board body 1, the circuit board body 1 can be fixed between the upper clamping plate 7 and the backplane 4. The upper clamping plate 7 is located between the circuit board body 1 and the radiator 3. The circuit board body 1 is detachably installed on a substrate (not shown in the figure) through the upper clamping plate 7 and the backplane 4. It should be noted that not only one circuit board body 1 can be installed on the substrate, but also multiple circuit board bodies 1 can be installed. Specifically, the quantity of the circuit board bodies 1 disposed on the substrate can be flexibly configured and adjusted according to application requirements or design requirements, so as to generate an electronic device for realizing a preset function.

[0072] Figure 10 Schematic diagram of the structure of an electronic device provided by an embodiment of the present invention; Referring to the attached Figure 10 As shown, this embodiment provides an electronic device, which may include:

[0073] A substrate 200;

[0074] The circuit board 201 with a heat dissipation function in the above embodiment, the quantity of the circuit boards 201 is at least one, and the circuit boards 201 are detachably installed on the substrate 200.

[0075] Among them, the specific shape structure, realized functions, and realized effects of the circuit board 201 in this embodiment are similar to those of the circuit board in the above embodiment. For specific details, reference can be made to the above description, and details will not be elaborated here.

[0076] In the electronic device of this embodiment, by configuring a circuit board 201 with a heat dissipation function on the substrate 200, an electronic device with preset functions can be realized. Since the circuit board 2 has a heat dissipation structure, the stable and reliable operation of the circuit board 201 is effectively ensured, the safety and reliability of the use of the electronic device are further improved, and the practicality of the electronic device is further improved.

[0077] In specific applications, refer to the appendix Figure 11 As shown, taking the heat pipe as the heat dissipation component 5 and the circuit board corresponding to the OCP acceleration unit (OCP Accelerator Module, abbreviated as OAM) corresponding to the parallel processing unit (Parallel Processing Unit, abbreviated as PPU) as the circuit board main body 1, this application embodiment provides a circuit board corresponding to the OAM module. For the provided circuit board, by embedding the heat pipe 5 in the structural backplane 4 of the OAM module, the heat of the heat-generating device 2 deployed on the back of the OAM circuit board can be transferred to the top radiator 3 through the heat pipe 5, thereby solving the problems of complex assembly and poor maintainability of the conventional backside heat dissipation solution. Specifically, the circuit board may include:

[0078] The OAM circuit board main body 1, with heat-generating devices 2 deployed on both the front and back of the OAM circuit board main body 1, and the OAM circuit board main body 1 is fixed between the upper clamping plate (not shown in the figure) and the backplane 4;

[0079] The radiator 3, located at the upper end of the front of the OAM circuit board main body 1, is in contact with the heat-generating device 2 deployed on the front of the circuit board main body 1 through a heat-conducting material, and is used for dissipating heat from the heat-generating device 2;

[0080] The backplane 4, detachably connected to the circuit board main body 1, has a heat pipe 5 embedded therein, and the upper surface of the heat pipe 5 is in the same plane as the upper surface of the backplane 4. The heat pipe 5 is in contact with at least part of the heat-generating devices 2 deployed on the back of the circuit board main body 1. Moreover, the length, shape, and path of the heat pipe 5 can be flexibly adjusted according to the specific structure and layout of the components on the OAM circuit board main body 1. The heat dissipation component 5 and the radiator 3 form at least one heat dissipation link to enable the heat dissipation component 5 to transfer heat to the radiator 3 for heat dissipation.

[0081] The substrate 8, the OAM circuit board main body 1 is installed on the substrate 8 through the backplane 4, and at least one OAM circuit board main body 1 is deployed on the substrate 8 to realize preset functions.

[0082] It should be noted that the contact position or contact surface between the heat pipe on the backplane 4 and the top radiator 3 can be flexibly set or adjusted according to the component structure space and heat dissipation requirements on the circuit board body 1. In some instances, the heat pipe can be designed at any one or more of the four ends of the circuit board body 1, and the heat pipe can be made of other materials with strong thermal conductivity, such as copper blocks, aluminum blocks, etc. The boss structure in contact with the radiator 3 by the heat pipe 5 can be the boss structure on the radiator 3 or the boss structure of the heat pipe 5 on the backplane, thus ensuring the flexible reliability of the circuit board design.

[0083] For the circuit board provided in this application embodiment, through the heat pipe 5 or other high-thermal-conductivity metal materials embedded on the backplane 4, the heat of the heat-generating devices 2 at the bottom of the circuit board body 1 can be conducted to the radiator 3 on the top surface for heat dissipation. The heat dissipation solution is not only simple and reliable, but also adopts the top heat dissipation solution with high heat dissipation quality. At the same time, the heat dissipation structure is decoupled from the substrate and its backplane. In this way, not only no slots need to be opened on the substrate, but also the maintenance is convenient. When replacing or maintaining the components, there is no need to replace the heat-conducting material, and the subsequent maintainability is good, which effectively ensures the flexible reliability of the use of this circuit board and further ensures the practicality of this circuit board.

[0084] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and are not intended to limit them; although the present invention has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements for some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present invention.

Claims

1. A circuit board with heat dissipation function, characterized in that, Comprising: A circuit board main body, on both the front and back surfaces of which heat generating devices are deployed; A heat sink, which is in contact with at least some of the heat generating devices deployed on the front surface of the circuit board main body, and is used for dissipating heat from the heat generating devices; A backplane, which is connected to the circuit board main body, and a heat dissipating member is provided on the backplane. The heat dissipating member is in contact with at least some of the heat generating devices deployed on the back surface of the circuit board main body, and at least one heat dissipation link is formed between the heat dissipating member and the heat sink, so that the heat dissipating member transfers heat to the heat sink for dissipation.

2. The circuit board according to claim 1, wherein: The heat dissipating member is embedded in the backplane, and the upper surface of the heat dissipating member is in the same plane as the upper surface of the backplane.

3. The circuit board according to claim 1, wherein, The heat sink is in contact with at least some of the heat generating devices deployed on the front surface of the circuit board main body through a heat conducting member.

4. The circuit board according to claim 1, characterized in that, At least one protruding end for connecting with the heat sink is provided on the heat dissipating member, and the at least one protruding end is in contact with the heat sink through a heat conducting member to form at least one heat dissipation link.

5. The circuit board according to claim 4, wherein The size of the backplane is larger than that of the circuit board main body, and a preset gap exists between the protruding end and the circuit board main body.

6. The circuit board according to claim 1, wherein The heat sink includes at least one protruding end for connecting with the heat dissipating member, the at least one protruding end is in contact with the heat dissipating member through a heat conducting member, and a preset gap exists between the protruding end and the circuit board main body.

7. The circuit board according to claim 1, characterized in that, At least one first protruding end is provided on the heat dissipating member, the heat sink includes at least one second protruding end for contacting with the first protruding end, and the first protruding end is in contact with the second protruding end through a heat conducting member to form at least one heat dissipation link.

8. The circuit board according to any one of claims 1-7, characterized in that, The backplane is an insulating board, and the circuit board main body is installed and connected to the backplane through an insulating layer.

9. The circuit board according to any one of claims 1-7, characterized in that, The backplane is a non-insulating board, and the heat conduction ability of the heat dissipating member is higher than that of the backplane.

10. The circuit board according to any one of claims 1-7, characterized in that, The heat dissipating member is a pipe structure made of a heat conducting material.

11. The circuit board according to claim 10, wherein, A preset liquid is filled in the pipe structure.

12. The circuit board according to any one of claims 1-7, characterized in that, The heat sink is installed at the upper end of the front surface of the circuit board main body through a detachable connecting member.

13. The circuit board according to any one of claims 1-7, wherein: The circuit board main body is fixed between an upper clamping plate and the backplane. The upper clamping plate is located between the circuit board main body and the heat sink, and the circuit board main body is detachably installed on a substrate through the upper clamping plate and the backplane.

14. An electronic device, characterized in that, Comprising: A substrate; The circuit board with a heat dissipation function according to any one of claims 1-13, the number of the circuit boards is at least one, and the circuit boards are detachably installed on the substrate.

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