Runner plate assembly, runner plate, printing plate and processing technology

Abstract

The invention provides a runner plate assembly, a runner plate, a printing plate and a processing technology, the runner plate assembly comprises a first plate and a second plate, and the first plate and the second plate are attached to form a runner; the first plate and the second plate are fixed in a brazed mode, the runner plate assembly further comprises a welding seam, and the welding seam is arranged around the runner. According to the technical scheme, the machining cost of the runner plate assembly can be reduced, and blockage is reduced.

Description

Technical Field

[0001] The present invention relates to the technical field of plate structure welding, and particularly relates to a flow channel plate assembly, a flow channel plate, a printed circuit board, and a processing technology. Background Art

[0002] The flow channel plate assembly includes two layers of plate structures. One layer of the plate is provided with recesses. After being attached to the other layer of the plate, the recesses cooperate with the other layer of the plate to form flow channels. The two layers of plates are generally welded by brazing. The current method is to set the layer of the plate with recesses as a composite plate, that is, a brazing sheet is covered on the plate material, and then the other layer of the plate is attached to the composite plate. The brazing sheet of the composite plate contacts the other layer of the plate, and then brazing is carried out. The brazing sheet melts to fix the two layers of plates. However, this method uses more brazing material, has a higher cost, and the brazing sheet covers the recesses of the plate. After the brazing sheet at this position melts, it is easy to flow into the grooves of the recesses, causing blockage of the flow channels inside the flow channel plate assembly. Summary of the Invention

[0003] The purpose of the present application is to provide a flow channel plate assembly, a flow channel plate, a printed circuit board, and a processing technology, which can reduce blockage.

[0004] The present application provides a flow channel plate assembly, which includes a first plate and a second plate. The flow channel plate assembly includes a flow channel, and the flow channel is located between the first plate and the second plate; the first plate and the second plate are fixedly welded, and the flow channel plate assembly further includes a weld seam, and the weld seam surrounds the flow channel.

[0005] The present application further provides a flow channel plate, which includes a recess, and the recess is used to be attached to one side of another plate part to form a flow channel; the flow channel plate is provided with a groove surrounding the recess, and the groove is used to fill brazing material.

[0006] The present application further provides a processing technology for a flow channel plate assembly, which includes the following steps:

[0007] Provide a first plate, and punch the first plate to form a recess and a groove surrounding the recess;

[0008] Fill the groove with brazing material and dry it;

[0009] Provide a second plate, attach the second plate to the first plate, and carry out brazing.

[0010] The flow channel plate assembly, the flow channel plate, and the processing technology have the following technical effects:

[0011] In the solution in the background art, the brazing sheet covers the position of the recess, which will obviously cause welding blockage. However, the weld seam formed in the present application surrounds the recess, which can reduce the inflow of solder into the flow channel area, improve the internal cleanliness of the product, and avoid the welding blockage of the flow channel.

[0012] The present application also provides a printed circuit board for cooperating with a first board. The first board is provided with a recess for forming a part of the wall of a flow channel. The printed circuit board includes a first closed portion and a second closed portion. The printed circuit board has a hollowed-out area. The second closed portion corresponds to the recess of the first board. The hollowed-out area surrounds the second closed portion, and the first closed portion surrounds the hollowed-out area.

[0013] The present application also provides a processing technology for a flow channel board assembly, including the following steps:

[0014] Provide a first board, which has a recess;

[0015] Provide a printed circuit board, which includes a first closed portion and a second closed portion. The printed circuit board has a hollowed-out area. The hollowed-out area surrounds the second closed portion, and the first closed portion surrounds the hollowed-out area;

[0016] Attach the printed circuit board to the first board. The second closed portion corresponds to the recess of the first board and is used to cover the recess;

[0017] Print solder into the hollowed-out area and dry it;

[0018] Attach and solder the second board and the first board.

[0019] Spray through the cooperation of the printed circuit board and the first board. The hollowed-out area ensures that the sprayed solder surrounds the recess, thereby ensuring the welding area. In this way, a weld seam surrounding the flow channel is also formed in the flow channel board assembly, which can also reduce the solder flowing into the flow channel area, improve the internal cleanliness of the product, and avoid the solder blockage of the flow channel. Description of the Drawings

[0020] Figure 1 It is a schematic structural diagram of the flow channel board assembly in the first embodiment of the present application;

[0021] Figure 2 is Figure 1 an enlarged view of part A in

[0022] Figure 3 is Figure 1 a side view of the first board in

[0023] Figure 4 It is a schematic structural diagram of the first board of the flow channel board assembly in the first embodiment of the present application, and it is a front view of the first board;

[0024] Figure 5 is Figure 3 an enlarged view of the positions of the recess and the groove in

[0025] Figure 6 isFigure 5 Enlarged view of the middle groove part;

[0026] Figure 7 Another schematic structural view of the first plate;

[0027] Figure 8 Process flow chart for machining the runner plate assembly in the first embodiment of the present application;

[0028] Figure 9 Exploded view of the runner plate assembly in the second embodiment of the present application;

[0029] Figure 10 For Figure 9 Schematic structural view of the first plate of the runner plate assembly in the middle;

[0030] Figure 11 For Figure 10 Schematic view of another perspective of the first plate in the middle;

[0031] Figure 12 Schematic structural view of the printed circuit board in the second embodiment of the present application;

[0032] Figure 13 For Figure 12 Schematic view of another perspective of the printed circuit board in the middle;

[0033] Figure 14 For Figure 12 Schematic view of the cooperation between the printed circuit board and the first plate in the middle;

[0034] Figure 15 For Figure 14 Schematic view of the closing plate of the printed circuit board in the middle shown in black.

[0035] The descriptions of the above reference numerals are as follows:

[0036] 100 - Runner plate assembly; 100a - Runner; 100b - Weld seam;

[0037] 101 - First plate; 1011 - Straight part; 1011a - Groove; 1011a1 - Linear groove; 1011b - Edge part; 1012 - Concave part; 1012a - Straight concave part; 1012b - Arc-shaped concave part; 101A - First side; 101B - Second side; 102 - Second plate; 103 - Connecting screw;

[0038] 200 - Printed circuit board;

[0039] 201 - Closing plate; 2011 - First closing part; 2012 - Second closing part; 202 - Hollow area; 203 - Printing screen; 2031 - Connecting rib. Detailed implementation manners

[0040] To enable those skilled in the art to better understand the technical solution of this application, the following provides a further detailed description of this application in conjunction with the accompanying drawings and specific embodiments.

[0041] Please refer to Figures 1-4 , Figure 1 , which is a schematic structural diagram of the flow channel plate assembly 100 in the first embodiment of this application, showing the partial position after the first plate 101 and the second plate 102 of the flow channel plate assembly 100 are assembled; Figure 2 is Figure 1 an enlarged view of part A in Figure 3 is Figure 1 a side view of the first plate 101 in Figure 4 , which is a schematic structural diagram of the first plate 101 of the flow channel plate assembly 100 in the first embodiment of this application and is a front view of the first plate 101.

[0042] The flow channel plate assembly 100 in this embodiment includes a first plate 101 and a second plate 102. The first plate 101 and the second plate 102 are attached to form a flow channel 100a. Specifically, the first plate 101 is provided with Figure 1 the shown concave portion 1012. The second plate 102 may include a flat plate portion. The flat plate portion of the second plate 102 and the concave portion 1012 of the first plate 101 are buckled to form the flow channel 100a, that is, the wall of the concave portion 1012 and part of the wall of the second plate 102 are both the walls of the flow channel 100a. In addition, the first plate 101 and the second plate 102 in this embodiment are fixed by brazing. The flow channel plate assembly 100 further includes a weld seam 100b formed by brazing. The weld seam 100b is arranged around the flow channel 100a, that is, there are corresponding weld seams 100b on both sides in the transverse direction at any position along the flow channel 100a. In this way, it is to prevent the medium in the flow channel 100a from flowing out of the flow channel plate assembly 100 from both sides. The transverse direction of the flow channel 100a is perpendicular to the direction of the flow channel 100a.

[0043] Specifically, as Figure 3 shown, the first plate 101 includes a first side 101A and a second side 101B distributed along its thickness direction ( Figure 4Shown is the first side 101A). The first plate 101 includes a recess 1012 provided on the first side 101A. In this embodiment, the recess 1012 is formed by stamping. Therefore, if viewed from the second side 101B, the recess 1012 on the first side 101A is equivalent to a convex portion on the second side 101B. The first plate 101 can be formed by stamping a sheet material. Stamping is performed from the first side 101A towards the second side 101B to stamp out the recess 1012. The portion of the first plate 101 other than the recess 1012 is defined as a flat portion 1011. The first plate 101 includes the recess 1012 and the flat portion 1011. It can be seen that the first plate 101 is not limited to being formed by stamping. A notch can be directly cut and processed on a plate-like structure as the recess. In this case, the second side 101B of the first plate 101 can all be flat portions. However, the overall first plate 101 formed in this way will be thicker. This embodiment mainly takes the first plate 101 formed by stamping as an example for illustration. In some embodiments, the first plate 101 may not be manufactured by the stamping method, and can also be formed by processing methods such as die casting, machining, forging, etc. that can form the structural features of the first plate 101.

[0044] At this time, the recess 1012 on the first side 101A of the first plate 101 is attached to a flat plate portion on one side of the second plate 102 to form at least a part of the flow channel 100a. It can be seen that the second plate 102 can be a flat plate portion as a whole. Then, the flow channel 100a is all formed by the attachment of the recess 1012 and the plate portion of the second plate 102. The second plate 102 can also be provided with a recess like the first plate 101. The recess of the second plate 102 is attached to the flat portion 1011 of the first plate 101 to form a part of the flow channel 100a, or the recess of the second plate 102 is relatively buckled with the recess 1012 of the first plate 101 to form a part of the flow channel 100a. All are acceptable. This embodiment takes the flat second plate 102 as an example for illustration. When the second plate 102 is also provided with a recess, the same setting as that of the first plate 101 can be made.

[0045] Reference can continue to Figure 2 、 4 and be understood in combination with Figure 5 which is Figure 5 an enlarged view of the positions of the recess 1012 and the groove 1011a in Figure 3 .

[0046] The first plate 101 is provided with a groove 1011a surrounding the recess 1012. The groove 1011a is used to fill the solder. The recess direction of the groove 1011a is the same as that of the recess 1012. When the first plate 101 and the second plate 102 are attached, the solder is filled between the first plate 101 and the second plate 102. After welding, the weld seam 100b formed after the solder melts and then solidifies is located in the groove 1011a. Of course, during the solidification process of the solder, certain physical bonding will also occur at the positions where the solder contacts the wall of the groove 1011a and the second plate 102. It can be understood that the shape of the groove 1011a determines the shape of the weld seam 100b. At this time, the weld seam 100b in the embodiment is a linear weld seam. Since the groove 1011a is arranged around the flow channel 100a, the weld seam 100b is correspondingly arranged around the flow channel 100a, which can realize the relative closure of the flow channel 100a in the transverse direction and prevent the medium in the flow channel 100a from leaking from the gap between the first plate 101 and the second plate 102.

[0047] It can be seen from this that compared with the background technology, the technical solution of this embodiment has the following technical effects:

[0048] First, only the solder is arranged in the groove 1011a, and the weld seam 100b is only at the position of the groove 1011a, so that the solder in the area of the flow channel 100a can be reduced, the internal cleanliness of the product can be improved, and the blockage of the flow channel 100a by welding can be avoided. Especially when the flow channel 100a includes a narrow throttle hole, this solution can effectively reduce the blockage of the throttle hole position by welding;

[0049] Second, there is no need to form a composite material with the solder and the first plate 101, thereby reducing the cost of raw materials. In this embodiment, the material for filling the solder in the groove 1011a of the first plate 101 has a price that can be reduced by about 13% compared with the price of the composite material;

[0050] Third, since the solder is only filled at the position of the groove 1011a, the welding area is greatly reduced compared with the background technology solution. The welding area can be less than 50% of the total area of the first plate 101, so the amount of solder used is reduced, further reducing the cost.

[0051] Fourth, in the solution of the background technology, the composite plate and the flow channel plate formed by laminating the solder sheet and the plate need to be sprayed with solder before tunnel furnace brazing, and the solder flux residue in the flow channel will affect the performance of the product. In this embodiment, the liquid solder is filled in the groove 1011a of the first plate 101, and the liquid solder can be mixed with other soldering aids. In this way, when brazing with the second plate 102, the process of spraying solder can be reduced, and no solder flux residue will appear in the flow channel 100a, avoiding affecting the performance of the product.

[0052] Look at Figure 4 、 5, and in combination with Figure 6 understanding Figure 6 is Figure 5 an enlarged view of the groove 1011a in the

[0053] The first plate 101 includes an edge portion 1011b, and the edge portion 1011b is combined with Figure 4 understanding, which is the edge of the straight portion 1011. If the straight portion 1011 is Figure 4 a rectangle as shown, then the four side edges of the first plate 101 are all edge portions 1011b. If the straight portion 1011 is of other shapes, the edge portions are correspondingly of other shapes. The recess 1012 is provided on the first plate 101, then at least part of the recess 1012 and its closest edge portion 1011b are the straight portion 1011, and a groove 1011a is to be provided on this part of the straight portion 1011 to prevent the medium in the flow channel 100a from directly flowing out of the flow channel plate assembly through this part of the straight portion 1011. Figure 4 In

[0054] that is, in this embodiment, a groove 1011a is provided between the edge portion 1011b and the recess 1012. Wherein, the distance from the recess 1012 to the edge portion 1011b is defined as J, and here the distance is the vertical distance between the recess 1012 and the closest edge portion 1011b. The width of the groove 1011a is m, then it can be satisfied that: 1 / 5J ≤ m ≤ 1 / 3J. Within this range, the width of the groove 1011a will not affect the strength of the straight portion 1011, but only a relatively small notch is opened on the straight portion 1011 as the groove 1011a.

[0055] In addition, the depth of the groove 1011a is defined as n, then it can be satisfied that 0.3mm ≥ n ≥ 0.1mm. This depth can ensure that the amount of filled solder meets the quality requirements of welding, and at the same time will not affect the strength of the straight portion 1011. It can be understood that when the recess 1012 is formed by stamping, the groove 1011a can also be stamped at the same time, but the depth of the groove 1011a is lower than the depth of the recess 1012. Similarly, the groove 1011a can be formed by means other than stamping, such as cutting, etc.

[0056] Looking again Figure 5, the line perpendicular to the straight part 1011 and passing through the center of the width of the groove 1011a is the first center line X1. There is a second center line X2 in the width direction of the groove 1011a for the part of the straight part 1011 between the edge part 1011b and the concave part 1012. The second center line X2 overlaps or is parallel to the first center line X1. In this embodiment, when the second center line X2 is parallel to the first center line X1, the distance between them does not exceed 1 mm, that is, the second center line X2 and the first center line X1 coincide as much as possible. The groove 1011a is arranged in the middle part between the edge part 1011b and the concave part 1012 to balance the sealing and welding strength.

[0057] Look again Figure 4 , it can be seen from the above that the groove 1011a is arranged between the part of the concave part 1012 and the adjacent edge part 1011a. When the concave part 1012 is not straight but bent as Figure 4 shown, then a part of the groove 1011a needs to be arranged between one part and another part of the concave part 1012. Still taking Figure 4 as an example, the two straight concave parts 1012a in the middle of the concave part 1012 are adjacent to the straight concave part 1012a on the left or right. And due to the reduced spacing, the part of the groove 1011a arranged between the two adjacent straight concave parts 1012a can be a straight groove 1011a1, and this straight groove 1011a1 is used as the groove 1011a surrounding the two straight concave parts 1012a at the same time.

[0058] As Figure 6 shown, Figure 6 is another structural schematic diagram of the first plate 101.

[0059] Figure 6 In, when the spacing between two adjacent straight concave parts 1012a permits, a straight groove 1011a1 can also be set respectively as a part of the groove 1011a surrounding the concave part 1012. At this time, two straight grooves 1011a1 are arranged between two adjacent straight concave parts 1012.

[0060] Furthermore, it can be understood that the flow channel plate assembly 100 in this embodiment can also include two or more weld seams 100b surrounding the concave part 1012, that is, a multi - loop design similar to a runway. In the above - mentioned embodiment, the flow channel 100a is actually sealed by one weld seam 100b. Multiple grooves 1011a can also be set to form multiple weld seams 100b, and multiple weld seams 100b can improve the sealing performance. However, it can be known that setting too many grooves 1011a is not conducive to the strength design requirements of the straight part 1011. Therefore, if multiple weld seams 100b are set, the sum of the widths of the grooves 1011a corresponding to each weld seam 100b can be the same as Figure 6The widths of the grooves 1011a are equal, that is, a wider groove 1011a is divided into a plurality of narrow grooves arranged in parallel and at intervals.

[0061] It can be known that the groove 1011a surrounding the recess 1012 is set on the first plate 101 to store the solder for brazing, but the purpose of this embodiment is to reduce the waste of solder described in the background technology as long as the solder is set around the recess 1012 for welding. For example, the solder can be sprayed only around the recess 1012. The solder melts during brazing to form a weld 100b surrounding the recess 1012.

[0062] However, compared with directly spraying solder around the concave portion 1012 on the first plate 101, setting the groove 1011a for dispensing is conducive to confirming the area of ​​dispensing (filling solder into the groove 1011a), that is, the setting of the groove 1011a can effectively clarify the dispensing area and range, avoiding deviations during dispensing; secondly, the solder for dispensing has a certain height. If the groove 1011a is not set for dispensing, the weld 100b formed after welding may cause a larger gap between the first plate 101 and the second plate 102. If the groove 1011a is set for dispensing, the straight portion 1011 outside the groove 1011a can be better fitted with the second plate 102, thereby reducing the thickness dimension deviation of the product. In addition, the size of the groove 1011a can also assist in controlling the amount of dispensing, avoiding problems such as excessive overflow and insufficient solder joints.

[0063] This embodiment also provides a processing technology for the flow channel plate assembly 100, which is used to form the flow channel plate assembly 100 in the above embodiment. Figure 8 understand, Figure 8 This is a flowchart of the processing of the flow channel plate assembly 100 in the first embodiment of the present application. The processing includes the following steps:

[0064] Step S0, providing a first plate 101, and punching the first plate 101 to form a recess 1012 and a groove 1011a surrounding the recess 1012;

[0065] Step S1, filling the groove 1011a of the first plate 101 with solder and drying it;

[0066] Step S2: attach the second plate 102 and the first plate 101 together and perform brazing.

[0067] Among them, before step S1, raw material inspection and stamping can also be performed, that is, the sheet material of the first plate 101 is inspected. After passing the inspection, a recess 1012 can be stamped to form a part of the flow channel 100a. It can be seen that the recess 1012 is not limited to being formed by stamping. For example, it can also be formed by stretching, cutting, etc. When stamping the first plate 101, lubrication is required. Therefore, before dispensing, degreasing can also be performed, that is, the lubricating grease is removed. Then, dispensing, drying, assembling with the second plate 102, and brazing are carried out.

[0068] Please refer to Figures 9-11 , Figure 9 which is an exploded view of the flow channel plate assembly 100 in the second embodiment of the present application; Figure 10 is Figure 9 a schematic structural view of the first plate 101 of the flow channel plate assembly 100 in Figure 11 is Figure 10 a schematic view of another perspective of the first plate 101 in

[0069] The flow channel plate assembly 100 in this embodiment is basically the same as that in the first embodiment, and also includes a first plate 101 and a second plate 102. The first plate 101 and the second plate 102 are also fixedly connected by connecting screws 103, and the same connection method can also be adopted in the first embodiment. The first plate 101 is provided with a recess 1012 to fit with the second plate 102 to form a flow channel (not shown in the figure). At the same time, the weld seam (not shown in the figure) of the flow channel plate assembly 100 is also arranged around the recess 1012. The difference is that the first plate 101 in the second embodiment does not provide a groove 1011a for filling the brazing material, but through the cooperation of the printed board 200, the brazing material is arranged around the recess 1012.

[0070] Continue to refer to Figure 12 , 13 for understanding, Figure 12 which is a schematic structural view of the printed board 200 in the second embodiment of the present application; Figure 13 is Figure 12 a schematic view of another perspective of the printed board 200 in Figure 14 is Figure 12 a schematic view of the cooperation between the printed board 200 and the first plate 101 in Figure 15 is Figure 14 a schematic view of the closing plate 201 of the printed board 200 in

[0071] The printed board 200 in this embodiment is used to cooperate with the first plate 101. The printed board 200 includes a closing plate 201 and a hollow area 202. From Figure 12 , 13As can be seen from FIGS. 15, the closing plate 201 is a solid plate-like structure. The closing plate 201 includes a first closing portion 2011 and a second closing portion 2012. The second closing portion 2012 corresponds to the concave portion 1012. Figure 10 The concave portion 1012 in Figure 12 is a large reciprocally bent serpentine shape, and the second closing portion 2012 in

[0072] is also a reciprocally bent serpentine shape. When the printed circuit board 200 is attached to the first plate 101, the second closing portion 2012 can cover the concave portion 1012. In addition, the hollow area 202 surrounds the second closing portion 2012, and the first closing portion 2011 surrounds the hollow area 202.

[0073] With such a setting, when it is necessary to surround and set the solder around the concave portion 1012 of the first plate 101, the printed circuit board 200 can be covered on the first plate 101, then the concave portion 1012 is covered by the second closing portion 2012, and the peripheral part of the flat portion 1011 is covered by the first closing portion 2011. At this time, when spraying the solder on the first plate 101 again, only the part of the first plate 101 corresponding to the hollow area 202 will be sprayed with solder, and the other positions will not enter the solder due to being covered, so as to ensure that the solder in the local area is set according to the predetermined requirements. The hollow area 202 is the area that needs to be welded, and the area, position, and shape of the hollow area 202 can be set according to the requirements of the welding area. The processing efficiency of directly spraying through the printed circuit board 200 is relatively high. Figure 15 In this embodiment, the first plate 101 is sprayed with solder in the part corresponding to the hollow area 202, that is, on the flat portion 1011 outside the concave portion 1012, only the local area surrounding the concave portion 1012 is provided with solder, and the weld 100b is only arranged around the concave portion 1012 and does not occupy the entire flat portion 1011. After welding, when projecting onto the first plate 101, the projection of the weld 100b is located within the projection of the first plate 101, that is, there is a gap between the weld 100b and the edge of the first plate 101, and the projection of the concave portion 1012 is located within the outer contour of the projection of the weld 100b. Specifically, in the second embodiment, the weld 100b is a special-shaped structure after a rectangle deducts the concave portion 1012, that is, the same as the

[0074] shape of the white area shown in the printed circuit board 200 in Figure 13 、 15, since the hollow area 202 separates the first closed part 2011 and the second closed part 2012, a connecting rib 2031 can be provided to connect the second closed part 2012 and the first closed part 2011. The connecting part 2031 can be a part of the printing screen 203. For example, a local thickening setting or a non-thickening setting of the printing screen 203 can be used. The connecting rib 2031 can also be provided independently of the printing screen 203. From Figure 13 It can be seen that for the second closed part 2012 of this structural form, each arc part and both ends of the second closed part 2012 are connected to the first closed part 2011 through the connecting rib 2031.

[0075] In this embodiment, the mesh number range of the mesh cloth of the printing screen 203 can be between 90 meshes and 120 meshes. This is beneficial to ensuring the uniformity of the solder arrangement and will not affect the smooth arrival of the solder on the surface of the first plate 101. In addition, the printing of the printing screen 203 can effectively control the coating thickness of the solder, and the thickness dimension accuracy is relatively high, and the accuracy range can reach: 0.003 mm to 0.005 m.

[0076] This embodiment also provides a processing technology for the flow channel plate assembly 100, including the following steps:

[0077] Step S01: Provide the first plate 101 and stamp the first plate 101 to form a recess 1012;

[0078] Step S10: Provide the printing plate 200 described above;

[0079] Step S11: Attach the printing plate 200 to the first plate 101, and the second closed part 2012 corresponds to the recess 1012 of the first plate 101 for covering the recess 1012;

[0080] Step S12: Print solder into the hollow area 202 and dry it;

[0081] Step S13: Attach and braze the second plate 102 and the first plate 101.

[0082] Similar to the first embodiment, raw material inspection and stamping can be performed before step S11, that is, the plate material of the first plate 101 is inspected, and after passing the inspection, a recess 1012 for constituting a part of the flow channel can be stamped out, and the recess 1012 can be formed by stamping, stretching, cutting and other processes. When stamping the first plate 101, lubrication is required, so before covering the printed board 200, degreasing can be performed, that is, removing the lubricating grease, and then dispensing glue, drying, and assembling and brazing with the second plate 102. This embodiment can achieve the same technical effect as the first embodiment, but obviously, compared with the first embodiment, the brazing material in the second embodiment will occupy a certain thickness of the flow channel plate assembly 100, but the second embodiment does not need to modify the first plate 101.

[0083] Further, the main components of the solder printed on the hollow area (202) include: 15-20 parts by mass of Si, 30-40 parts by mass of KxALFy, wherein x ranges from 1 to 3, and y ranges from 4 to 6; 0.5-1.5 parts by mass of water-based adhesive; 0-0.5 parts by mass of Fe, 0-0.3 parts by mass of Mn; 0-1 parts by mass of Zn; 0-1 parts by mass of Cu; 40-50 parts by mass of solvent; the water-based adhesive is at least one of a water-soluble polyurethane resin, a polyvinyl alcohol water-based adhesive, and a silicone water-based adhesive. The solder is prepared with 0.5-1.5 parts by mass of water-based adhesive to obtain an appropriate bonding strength of the solder applied on the first plate 101, so as to control the fluidity of the solder when printing the solder. When the bonding strength of the solder on the first plate 101 is low, the solder layer is easy to fall off before soldering, and a solder with a certain bonding strength is prepared to improve the reliability of the welding process. At the same time, a water-based adhesive component is added to ensure that the brazing material has a certain bonding strength on the surface to be welded, while at the same time achieving less carbonized impurities when the welding temperature is reached, thereby reducing the impact of the adhesive impurities on the weld performance and improving the welding quality.

[0084] The mass ratio range of silicon to potassium fluoroaluminate is 1:2 to 1:1.2. Both Si and KxALFy are solid powders or granules, where the particle size of 50% of the silicon powder particles is ≤ 6 microns, and the particle size of 50% of the KxALFy powder particles is ≤ 3 microns; the solder is prepared from at least one solvent among ethylene glycol, polyethylene glycol, propanol, propylene glycol, dipropylene glycol, and glycerol. In some other embodiments, Fe, Mn, Zn, and Cu can be selected as powders or granules of various forms of compounds and / or monomeric substances. When selecting Fe, Mn, Zn, and Cu in the form of compounds, the mass ratios of Fe, Mn, Zn, and Cu in this application are the mass ratios of Fe, Mn, Zn, and Cu elements in the respective compound powders or granules. Using powders or granules within a certain range can ensure a good dispersion effect and less agglomeration, caking, etc. Limiting the mass parts of silicon and potassium fluoroaluminate to the aforementioned ratio can achieve good spreading properties during solder melting while achieving good welding strength. When the ratio of silicon to potassium fluoroaluminate is small, more potassium fluoroaluminate remains at the welding site, becoming an impurity and reducing the strength of the welding site; when the ratio of silicon to potassium fluoroaluminate is large, the spreading property of the melted solder is poor.

[0085] In the above embodiments, a recess 1012 is provided on the first plate 101, and then solder is provided on the first plate 101 around the recess 1012 so as to form a weld 100b surrounding the flow channel 100a after welding with the second plate 102. However, it can be known that when the recess 1012 is provided on the first plate 101 and the solder is provided on the second plate 102, when the first plate 101 and the second plate 102 are butt-jointed and fitted, the solder can also surround the recess 1012 or the flow channel 100a. For example, Figure 1 taking [Example], when the groove 1011a is orthogonally projected onto the second plate 102, a groove is provided at the orthographic projection position to place the solder, and the same technical effects such as reducing solder as described in the first embodiment can be achieved. For the second embodiment, the printed circuit board 200 can be attached to the second plate 102 for solder spraying. After the first plate 101 and the second plate 102 are attached and welded, the same Figure 14 technical effects can be obtained. However, it should be understood that directly providing the groove 1011a or spraying the solder on the first plate 101 provided with the recess 1012 is more conducive to grasping the dimensions, ensuring that the weld can surround the flow channel formed after fitting and maintaining a certain distance from the flow channel.

[0086] It should be noted that in the embodiments of this application, the weld 100b only surrounds the flow channel 100a. In the area where the first plate 101 and the second plate 102 are butt-jointed and fitted, only a part has the weld 100b, and the rest are directly butt-jointed. At this time, the flow channel plate assembly also has a solder area 100c (shown in Figure 2) The solder area 100c is further away from the runner 100a than the weld seam, that is, in addition to the position of the weld seam 100b, there is also an additional solder area 100c, and the solder area 100c also has solder, which can weld the first plate 101 and the second plate 102.

[0087] Specifically, in the first embodiment, when the filler metal is filled into the groove 1011a, due to the siphon effect, the areas on both sides of the groove 1011a will suck a part of the filler metal in the groove 1011a into the areas on both sides of the groove 1011a, that is, into the areas outside the groove 1011a. After welding, a solder area 100c will be formed on the side of the weld seam 100b away from the runner 100a. Of course, the solder area 100c only occupies a small area and a small height, and there is a certain distance from the edge of the runner plate assembly. The height of the solder area 100c is also smaller than the height of the weld seam 100b. In the second embodiment, similarly, the area corresponding to the hollow area 202 of the printed circuit board 200 on the first plate 101 is sprayed with filler metal, and the shape of the formed weld seam 100b is also consistent with the hollow area 202. However, during the welding process, the filler metal will also spread slightly to the side of the weld seam 100b away from the runner 100a, and at this time, a solder area will be formed on the side of the weld seam 100b away from the runner 100a.

[0088] The above embodiments only represent several implementation manners of the present invention. The description is relatively specific and detailed, but it should not be construed as a limitation on the scope of the invention patent. It should be noted that for those of ordinary skill in the art, without departing from the concept of the present invention, several deformations and controls can still be made, and these all belong to the protection scope of the present invention.

Claims

1. A runner plate assembly, characterized in that, The runner plate assembly (100) includes a first plate (101) and a second plate (102). The runner plate assembly (100) includes a runner (100a), and the runner (100a) is located between the first plate (101) and the second plate (102); the first plate (101) and the second plate (102) are fixedly welded, and the runner plate assembly (100) further includes a weld seam (100b), and the weld seam (100b) is arranged to surround the runner (100a).

2. The runner plate assembly according to claim 1, characterized in that, The first plate (101) includes a recess (1012), and the recess (1012) is in contact with one side of the second plate (102) to form at least part of the runner (100a); The first plate (101) is provided with a groove (1011a) surrounding the recess (1012), and the groove (1011a) is used for filling solder, and the weld seam (100b) is located in the groove (1011a); or, the second plate (102) is provided with a groove (1011a), and after the first plate (101) and the second plate (102) are in contact, the groove (1011a) surrounds the recess (1012), the groove (1011a) is used for filling solder, and the weld seam (100b) is located in the groove (1011a).

3. The runner plate assembly according to claim 2, wherein, The groove (1011a) is provided on the first plate (101). The first plate (101) includes an edge portion (1011b), and at least part of the groove (1011a) is provided between the recess (1012) and the edge portion (1011b). The distance from the recess (1012) to the edge portion (1011b) is J, and the width of the groove (1011a) is m, satisfying: 1 / 5J ≤ m ≤ 1 / 3J.

4. The runner plate assembly according to claim 2, wherein, The depth of the groove (1011a) is n, satisfying 0.3mm ≥ n ≥ 0.1mm.

5. The runner plate assembly according to claim 2, characterized in that, The groove (1011a) is arranged in the middle between the recess (1012) and the edge portion (1011b).

6. The runner plate assembly according to any one of claims 1-5, characterized in that, The runner plate assembly (100) includes at least two weld seams (100b) surrounding the recess (1012).

7. The runner plate assembly according to claim 1, wherein, The first plate (101) includes a recess (1012), and the recess (1012) is in contact with one side of the second plate (102) to form at least part of the runner (100a); projecting onto the first plate (101), the projection of the weld seam (100b) is located within the projection of the first plate (101), and the projection of the recess (1012) is located within the outer contour of the projection of the weld seam (100b).

8. The runner plate assembly according to any one of claims 1-5 and 7, characterized in that The runner plate assembly has a solder area (100c), the solder area (100c) is on the side of the weld seam (100b) away from the runner (100a), and the height of the solder area (100c) is less than the height of the weld seam (100b).

9. A runner plate, characterized in that, The flow channel plate includes a recess (1012), and the recess (1012) is used to fit with one side of another plate portion to form a flow channel (100a); the flow channel plate is provided with a groove (1011a) surrounding the recess (1012), and the groove (1011a) is used to fill solder.

10. A processing technology of a runner plate assembly, characterized in that, It includes the following steps: Provide a first plate (101), and the first plate (101) has a recess (1012) and a groove (1011a) surrounding the recess (1012); Fill the groove (1011a) with solder and dry it; Provide a second plate, fit the second plate (102) with the first plate (101), and perform soldering.

11. A printed circuit board, for cooperation with a first board (101), the first board (101) being provided with a recess (1012) for forming a part of the wall of a flow channel (100a), characterized in that, The printed circuit board (200) includes a first closed portion (2011) and a second closed portion (2012), the printed circuit board (200) has a hollowed-out area (202), the second closed portion corresponds to the recess (1012) of the first plate (101), the hollowed-out area (202) surrounds the second closed portion (2012), and the first closed portion (2011) surrounds the hollowed-out area (202).

12. The printed circuit board according to claim 11, wherein, A printing screen (203) is provided in the hollowed-out area (202).

13. A processing technology for a runner plate assembly, characterized in that It includes the following steps: Provide a first plate (101), and the first plate (101) has a recess (1012); Provide a printed circuit board (200), the printed circuit board (200) includes a first closed portion (2011) and a second closed portion (2012), the printed circuit board (200) has a hollowed-out area (202), the hollowed-out area (202) surrounds the second closed portion (2012), and the first closed portion (2011) surrounds the hollowed-out area (202); Fit the printed circuit board (200) to the first plate (101), and the second closed portion (2012) corresponds to the recess (1012) of the first plate (101) for covering the recess (1012); Print solder into the hollowed-out area (202) and dry it; fit the second plate (102) with the first plate (101) and perform soldering.

14. The processing technology of the runner plate assembly according to claim 13, characterized in that, The main components of the solder printed into the hollowed-out area (202) include: 15 - 20 parts by mass of Si, 30 - 40 parts by mass of KxALFy, where the value range of x is 1 - 3 and the value range of y is 4 - 6; 0.5 - 1.5 parts by mass of a water-based binder; 0 - 0.5 parts by mass of Fe, 0 - 0.3 parts by mass of Mn; 0 - 1 part by mass of Zn; 0 - 1 part by mass of Cu; 40 - 50 parts by mass of a solvent; the water-based binder is at least one of a water-soluble polyurethane resin, a polyvinyl alcohol water-based binder, and a silicone water-based binder.

15. The processing technology of the runner plate assembly according to claim 14, characterized in that, The mass ratio range of the silicon to potassium fluoroaluminate is 1:2 - 1:1.2, both Si and KxALFy are solid powders, where the particle size of 50% of the silicon powder particles ≤ 6 microns, and the particle size of 50% of the KxALFy powder particles ≤ 3 microns; the solder is prepared from at least one solvent of ethylene glycol, polyethylene glycol, propanol, propylene glycol, dipropylene glycol, and glycerol.

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