Power conversion devices, energy storage systems and electrical equipment

Abstract

This application relates to the field of energy storage system technology, and proposes a power conversion device, an energy storage system, and electrical equipment for use in energy storage systems. The device includes a housing, within which an output compartment and a power conversion control compartment are disposed. The output compartment has multiple output connection ports formed on the front panel of the housing. The power conversion control compartment includes a power board, multiple inductors, an AC output board, and a target printed circuit board (PCB). The target PCB is connected to the power board, the multiple inductors, and the AC output board, respectively. By using the target PCB instead of copper busbars for connection, not only is the space occupied by copper busbar connections reduced, but the stacking design in the power conversion device is also facilitated. While ensuring separation of high and low pressure compartments, the stacking design further reduces the size of the power conversion device.

Description

Technical Field

[0001] This application relates to the field of energy storage technology, and in particular to a power conversion device, an energy storage system, and an electrical appliance. Background Technology

[0002] The power conversion system (PCS) uses a DC / AC bidirectional converter to achieve bidirectional conversion between battery DC power and grid AC power, supporting grid-connected / off-grid mode switching, thereby meeting various needs such as grid frequency regulation, voltage regulation, and energy dispatch.

[0003] In related technologies, the size limitations of energy storage systems, coupled with the fact that battery cells occupy a large portion of the system's space, result in very small power conversion devices. Furthermore, the copper busbars inside the power conversion device occupy a significant amount of internal space, making the layout of other functional boards within the device extremely challenging. Summary of the Invention

[0004] Based on this, it is necessary to address the problems in the aforementioned background technology by providing a power conversion device, energy storage system, and electrical equipment that can at least use a target printed circuit board instead of copper busbars for internal component layout. This not only reduces the internal space occupied by copper busbars but also facilitates multi-layer stacking design within the power conversion device. This allows for further reduction of the size and volume of the power conversion device through multi-layer stacking design while ensuring separation of high and low pressure chambers.

[0005] To address the aforementioned technical and other issues, according to some embodiments, a first aspect of this application provides a power conversion device applied to an energy storage system. The power conversion device has an output compartment and a power conversion control compartment within its housing. The output compartment includes multiple output connection ports disposed on the front panel of the housing. The power conversion control compartment includes a target printed circuit board, and a power board, multiple inductors, and an AC output board respectively connected to the target printed circuit board.

[0006] In some embodiments, the target printed circuit board is located above a plurality of inductors and is electrically connected to the plurality of inductors; the AC output board is located above the target printed circuit board and is electrically connected to the target printed circuit board via copper pillars.

[0007] In some embodiments, the output compartment includes an upper output compartment space and a lower output compartment space. The upper output compartment space includes various high-voltage output devices, and the lower output compartment space is connected to the lower power conversion control compartment space. Multiple first ventilation holes are provided on the front panel of the enclosure at a position corresponding to the lower output compartment space. Multiple second ventilation holes are provided on the back panel of the enclosure at a position corresponding to the lower power conversion control compartment space. The multiple first ventilation holes and multiple second ventilation holes are used to dissipate heat from the lower output compartment space and the lower power conversion control compartment space. Multiple inductors are located inside the lower power conversion control compartment space.

[0008] In some embodiments, the interconnected lower space of the output compartment and the lower space of the power conversion control compartment form an external air duct, and a first cooling fan group is provided in the lower space of the output compartment.

[0009] In some embodiments, a heat sink is also provided in the lower space of the power conversion control compartment; the power board is located above the heat sink and is electrically connected to the target printed circuit board.

[0010] In some embodiments, a plurality of current sampling Hall sensors are also included, located on the AC output board, with the power board electrically connected to the plurality of current sampling Hall sensors, and the current sampling Hall sensors electrically connected to a plurality of DC output terminals of the target printed circuit board.

[0011] In some embodiments, the power conversion device further includes a control board located inside the power conversion control compartment; multiple current sampling Hall sensors are electrically connected to the control board and transmit the detected multiple current data to the control board, which is used to protect the power conversion device based on the multiple current data.

[0012] In some embodiments, the control board is used to perform the following steps: calculate the blocking power output by the power board based on the current data detected by the current sampling Hall sensor; and determine whether there is an abnormality in the insulated gate bipolar transistor group corresponding to the current sampling Hall sensor based on the blocking power output by the power board.

[0013] In some embodiments, the target printed circuit board includes a plurality of inductor connection points; each inductor connection point is electrically connected to a corresponding inductor.

[0014] In some embodiments, the target printed circuit board further includes a plurality of input connection points; the input connection points are connected to the output connection points of a corresponding power board, and the input connection points are also connected to corresponding inductor connection points through printed lines on the target printed circuit board.

[0015] In some embodiments, the target printed circuit board further includes a plurality of output connection points; the output connection points are connected to the input connection points of the corresponding AC output board, and the output connection points are also connected to the corresponding inductor connection points through printed lines on the target printed circuit board.

[0016] In some embodiments, a second cooling fan assembly is also included, which is located on the back panel at a position corresponding to the upper space of the power conversion control compartment; wherein, a plurality of third ventilation holes are provided on the front panel at a position corresponding to the upper space of the power conversion control compartment, and the plurality of third ventilation holes and the second cooling fan assembly are used to form a cooling air duct in the upper space of the power conversion control compartment.

[0017] In some embodiments, a second aspect of this application provides an energy storage system including a battery pack, a management subsystem, a thermal management system, and a power conversion device in any of the above embodiments.

[0018] In some embodiments, a third aspect of this application provides an electrical device including the power conversion device in any of the above embodiments.

[0019] In the power conversion device, energy storage system, and electrical equipment described above, the use of a target printed circuit board instead of copper busbars for internal component layout not only reduces the internal space occupied by copper busbars but also facilitates multi-layer stacking design within the power conversion device. This allows for further reduction in the size and volume of the power conversion device while ensuring separation of high and low pressure chambers through multi-layer stacking design.

[0020] Moreover, avoiding copper busbar obstruction facilitates the formation of cooling air ducts, which not only reduces the size and volume of the power conversion device but also improves its heat dissipation performance. Attached Figure Description

[0021] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the description of the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other embodiments can be obtained from these drawings without creative effort.

[0022] Figure 1 This is a schematic diagram of a power conversion device provided in one embodiment of this application;

[0023] Figure 2 This is a schematic diagram of a conventional power conversion device provided in one embodiment of this application;

[0024] Figure 3 This is a schematic diagram of a target printed circuit board provided in one embodiment of this application.

[0025] Explanation of reference numerals in the attached figures:

[0026] 101. Enclosure; 102. Power board; 103. Copper pillar; 104. AC output board; 105. Second cooling fan assembly; 106. Inductor; 107. Target printed circuit board; 108. Insulated gate bipolar transistor assembly; 109. Heat sink; 110. First cooling fan assembly; 201. Copper busbar; 301. Copper pillar connection point; 302. Connecting copper wire; 303. Inductor connection point. Detailed Implementation

[0027] To facilitate understanding of this application, a more complete description will be provided below with reference to the accompanying drawings. Preferred embodiments of this application are shown in the drawings. However, this application can be implemented in many different forms and is not limited to the embodiments described herein. Rather, these embodiments are provided to provide a thorough and complete understanding of the disclosure of this application.

[0028] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this application belongs. The terminology used herein in the specification of this application is for the purpose of describing particular embodiments only and is not intended to be limiting of the application. The term "and / or" as used herein includes any and all combinations of one or more of the associated listed items.

[0029] When using the terms “including,” “having,” and “comprising” as described herein, another component may be added unless explicitly qualifying terms such as “only,” “consisting of,” etc. are used. Unless otherwise stated, singular terms may include plural forms and should not be construed as having a quantity of one.

[0030] It should be understood that although the terms “first,” “second,” etc., may be used herein to describe various elements, these elements should not be limited by these terms. These terms are used only to distinguish one element from another. For example, without departing from the scope of this application, a first element may be referred to as a second element, and similarly, a second element may be referred to as a first element.

[0031] In this application, unless otherwise expressly specified and limited, the terms "connected" and "linked" should be interpreted broadly. For example, they can refer to a direct connection or an indirect connection through an intermediate medium, or they can refer to the internal connection of two elements or the interaction between two elements. Those skilled in the art can understand the specific meaning of the above terms in this application according to the specific circumstances.

[0032] As a key component of energy storage systems, power conversion systems (PCS) face space constraints in their design. PCS achieves energy exchange between batteries and the grid through DC / AC bidirectional converter technology, enabling seamless switching between grid and off-grid operation. Since the internal space of the energy storage system is primarily occupied by the battery cells, the installation space for the PCS is significantly compressed, resulting in a highly compact layout of its internal components. This space constraint places higher demands on heat dissipation design, ease of maintenance, and reliability. Furthermore, the arrangement of copper busbars within the PCS occupies a considerable portion of the space, making the layout of other functional boards within the PCS very challenging.

[0033] Please see Figure 2 , Figure 2 As a comparative embodiment of this application, a schematic diagram of a power conversion device is shown.

[0034] In some embodiments, such as Figure 2 As shown, the inductor 106 of the power conversion device is connected to the power board 102 and the AC output board 104 via copper busbars 201. Since the shape and connection position of the copper busbars 201 need to correspond to the output connection point of the inductor 106, the copper busbars 201 occupy a large amount of space. For example, the copper busbar 201 connecting the inverter inductor 106 and the AC output board 104 occupies most of the space above the inverter inductor 106, preventing other functional boards from being arranged in this space. They can only be stacked on top of or below the AC output board 104 or occupy the output compartment space between the AC output board 104 and the front panel (not shown in the figure). This results in the multiple functional boards of the power conversion device being too densely packed. Furthermore, due to insufficient space in the power conversion control compartment and the large number of functional boards that need to be placed there, the functional boards in the power conversion control compartment encroach on the output compartment, causing the output compartment and the power conversion control compartment to intersect. This leads to mutual interference between the high- and low-voltage devices in the output compartment and the power conversion control compartment.

[0035] Please continue reading. Figure 2 The inductor 106 is also connected to the power output board via a copper busbar 201. Since the shape and connection position of the copper busbar 201 need to correspond to the input connection point of the inductor 106, and the copper busbar 201 also requires a certain travel path and assembly redundancy, the copper busbar 201 between the inductor 106 and the power output board occupies not only height space but also some length space. This necessitates increasing the length of the power conversion device's enclosure 101 or implementing a denser component stack. A denser component stack further hinders effective heat dissipation. The added cooling fan's ventilation efficiency is significantly reduced due to the obstruction caused by the copper busbar 201.

[0036] In some embodiments, this application provides a power conversion device; please refer to... Figures 1-2 The power conversion device includes a housing 101, wherein the housing 101 contains an output compartment and a power conversion control compartment.

[0037] The output compartment has multiple output connection ports on the front panel of the enclosure 101. The power conversion control compartment includes a power board 102, multiple inductors 106, an AC output board 104, and a target printed circuit board (PCB) 107. The target printed circuit board 107 is connected to the power board 102, multiple inductors 106, and AC output board 104 respectively.

[0038] For example, the output compartment is a high-pressure compartment and the power conversion control compartment is a low-pressure compartment. In this way, after replacing the copper busbar 201 with the target printed circuit board 107, the power board 102, multiple inductors 106, AC output board 104 and target printed circuit board 107 can be stacked, avoiding the power conversion control compartment from squeezing the space of the output compartment, and forming a separate layout design for the high and low pressure compartments of the output compartment and the power conversion control compartment.

[0039] For example, the output compartment may include DC-side high-voltage components, AC-side high-voltage components, reactive power compensation boards, DC surge protection and fuse protection boards, high-voltage switch and circuit breaker assemblies, power semiconductor devices, etc. The DC-side high-voltage components include a DC bus, DC support capacitors, and DC filter inductors. The DC bus can be made of low-resistance copper or aluminum busbars, with multiple layers of insulation (such as epoxy resin coating), used to connect the battery pack and the power conversion device, capable of carrying a DC voltage of 1000V-1500V. In a three-level topology, intermediate voltage balance control needs to be achieved. The DC support capacitor can be a film capacitor (which can improve high ripple current handling capability) or an electrolytic capacitor (suitable for low-cost solutions), capable of suppressing DC-side voltage fluctuations, absorbing high-frequency harmonics, and providing transient current buffering during the switching of the Insulated-Gate Bipolar Transistor (IGBT). The DC filter inductor can be wound with an iron-silicon-aluminum magnetic core, and the inductance value of the DC filter inductor is adjusted according to power requirements. The AC-side high-voltage components include inverter power units and step-up transformers. Inverter power units can be configured with two-level, three-level, or multi-level topologies. Step-up transformers, such as power frequency transformers or high-frequency transformers, can boost the voltage of the low-voltage AC output from the power conversion device to match grid connection requirements. Power semiconductor devices can be insulated-gate bipolar transistor (IGBT) modules or MOSFET modules. IGBT modules can consist of IGBT chips, drive circuits, and heat sinks, and can employ multi-level packaging structures. Metal-oxide-semiconductor field-effect transistor (MOSFET) modules have withstand voltage ratings exceeding 1700V, support higher switching frequencies (reducing losses by 30% compared to IGBTs), and are better suited to the high-frequency trend in energy storage systems. The reactive power compensation board is used to dynamically adjust reactive power and optimize the power factor on the grid side. It is suitable for high-voltage dynamic reactive power compensation and improving power transmission efficiency. The DC lightning protection and fuse protection board is used to prevent overvoltage or short circuit from damaging the internal circuits of the high-voltage compartment. The high-voltage switch and circuit breaker assembly includes AC circuit breakers (such as U / V / W phase circuit breakers) and DC disconnect switches, etc., to realize the on-off control and fault isolation of the high-voltage circuit.

[0040] As an example, by stacking multiple insulating layers (such as epoxy resin coating), the DC voltage that can be carried can be 1000V, 1300V, 1500V, etc.

[0041] It should be noted that the power conversion device proposed in this application is applied to an energy storage system, which also includes a battery pack, a battery management system for managing the battery pack, and a fire protection system, etc.

[0042] As an example, battery packs are placed in the battery compartment of the energy storage system. The placement and number of battery packs can be set according to actual needs. Battery packs can store grid energy during off-peak hours and supply power to external electrical equipment during peak hours, thus achieving peak shaving and valley filling to meet seasonal regional power demand. Power conversion devices are placed in the equipment compartment and are electrically connected to the battery packs. These devices adjust the output voltage, frequency, number of phases, and other electrical parameters when the battery packs output power to ensure power supply to external electrical equipment. A battery management system manages the battery packs. Specifically, the battery management system may include an electrical cabinet placed in the equipment compartment and electrically connected to the battery packs to manage the charging and discharging process, such as monitoring the charging and discharging voltage. The battery management system may also include temperature sensors installed on the battery packs to monitor their temperature and ensure safe and reliable operation. A fire suppression system is used to take appropriate fire extinguishing measures when a fire is detected. It is understood that the specific location of the fire suppression system can be determined according to actual needs. To ensure the safe operation of the micro energy storage system, the fire protection system can be installed in the battery room, or both the equipment room and the battery room can be equipped with a fire protection system.

[0043] As an example, a fire protection system may include devices such as temperature sensors, smoke sensors, automatic fire extinguishers, and controllers. The controller is connected to the temperature sensor, smoke sensor, and automatic fire extinguisher respectively, enabling it to determine whether a fire has occurred based on the temperature sensed by the temperature sensor and the smoke sensed by the smoke sensor. Upon determining a fire, it controls the automatic fire extinguisher to automatically release extinguishing agent to extinguish the fire. The partition between the battery room and the equipment room can be made of fire-resistant material. In the event of a fire in the battery room or equipment room, it can effectively prevent the spread of the fire, confining it within the battery room or equipment room, thereby effectively reducing equipment damage, lowering the fire hazard level, and buying valuable time for rescue.

[0044] Optionally, the energy storage system may also include a monitoring system, which may include at least one of an audible and visual alarm, a venting indicator, a ventilation mechanism, and a pressure relief mechanism. The audible and visual alarm may be located outside the energy storage system. In the event of an emergency such as a fire within the energy storage system, the alarm will emit a warning signal in the form of sound and / or light to alert personnel to take timely action. The venting indicator may also be located outside the energy storage system. During charging and discharging, the battery pack will generate a certain amount of hydrogen gas. When the hydrogen gas concentration within the energy storage system reaches a certain level, the venting indicator will emit a warning signal, such as sound and / or light, to remind personnel to perform hydrogen venting operations on the energy storage system, thereby ensuring the safe operation of the energy storage system. The ventilation mechanism can be used to perform hydrogen venting operations on the energy storage system. The ventilation mechanism may include an exhaust fan, which can be manually or automatically activated when hydrogen venting operations are required.

[0045] For details, please refer to Figure 1 The target printed circuit board 107 is located above the multiple inductors 106 and is electrically connected to the multiple inductors 106; the AC output board 104 is located above the target printed circuit board 107 and is electrically connected to the target printed circuit board 107 through copper pillars 103.

[0046] For details, please continue reading. Figure 1 Multiple inductors 106, target printed circuit board 107 and AC output board 104 are stacked together and interconnected by copper pillars 103. Compared with the technical solution of using copper busbars 201 to connect multiple inductors 106 and AC output board 104, a lot of space is saved.

[0047] The target printed circuit board 107 includes multiple inductor connection points 303, multiple input connection points, and multiple output connection points; the positions of the multiple inductor connection points 303 correspond to the connection positions of multiple inductors 106, and each inductor connection point 303 is electrically connected to the wiring position of a corresponding inductor 106.

[0048] Each input connection point is connected to the output connection point of a corresponding power board 102 via a copper pillar 103, and each input connection point is also connected to a corresponding inductor connection point 303 via printed lines on the target printed circuit board 107.

[0049] Each output connection point is connected to a corresponding input connection point of an AC output board 104 via a copper pillar 103, and each output connection point is also connected to a corresponding inductor connection point 303 via printed lines on the target printed circuit board 107.

[0050] For example, please refer to Figure 3The target printed circuit board 107 has a plurality of inductor connection points 303 formed thereon, and each inductor connection point 303 is electrically connected to a corresponding input connection point and output connection point of inductor 106.

[0051] Please continue reading. Figure 3 The target printed circuit board 107 also includes a copper pillar connection point 301. The copper pillar connection point 301 forms an electrical connection with the inductor 106 through the circuit layout on the target printed circuit board 107, so that the target printed circuit board 107 can replace the copper busbar 201.

[0052] Please continue reading. Figure 3 Furthermore, connecting copper wires 302 are also printed on the target printed circuit board 107. Here, connecting copper wires 302 are used on the target printed circuit board 107 to connect the inductor 106 and the copper pillar 103. This not only meets the requirements of high conductivity and stability of the power conversion device, but also avoids the risk of overheating caused by using other conductive materials for electrical connection.

[0053] Please continue to refer to this. Figure 1 and Figure 3 The positions of multiple inductor connection points 303, multiple input connection points, and multiple output connection points correspond to the positions of multiple inductors 106, the output connection points of the power board 102, and the input connection points of the AC output board 104, respectively. This ensures that the connection between the stacked AC output board 104, the target printed circuit board 107, and the multiple inductors 106 is still an electrical connection formed through copper. There is no need for a complex copper busbar 201 shape; only copper pillars 103 are needed to connect the stacked AC output board 104, the target printed circuit board 107, and the multiple inductors 106. Connecting to the power board 102 via copper pillars 103 not only ensures the stability of the electrical connection but also reduces the space occupied.

[0054] Specifically, the output compartment includes the upper space and the lower space of the output compartment.

[0055] Specifically, the upper space of the output compartment contains a variety of high-voltage output devices.

[0056] It should be noted that in the relevant technology, because the copper busbar 201 occupies most of the space in the power conversion control compartment and meets the size requirements of the power conversion device, functional boards such as the power board 102 and the AC output board 104 are very likely to intrude into the value output compartment. The mixed setting of high and low pressure compartments will significantly increase the complexity of the system, causing problems such as efficiency loss, increased failure rate and safety risks, resulting in significant system hidden dangers.

[0057] In some embodiments, the output compartment includes an upper output compartment space and a lower output compartment space. The upper output compartment space includes various high-voltage output devices, and the lower output compartment space is connected to the lower power conversion control compartment space. A plurality of first ventilation holes are provided on the front panel of the enclosure at a position corresponding to the lower output compartment space. A plurality of second ventilation holes are provided on the back panel of the enclosure at a position corresponding to the lower power conversion control compartment space. The plurality of first ventilation holes and the plurality of second ventilation holes are used to dissipate heat from the lower output compartment space and the lower power conversion control compartment space.

[0058] In some embodiments, multiple inductors are located inside the lower space of the power conversion control compartment.

[0059] Please refer to Figure 1 In some embodiments, multiple inductors 106 are located in the lower space of the power conversion control compartment.

[0060] Specifically, the lower space of the output compartment and the lower space of the power conversion control compartment are interconnected to form an external air duct, and the lower space of the output compartment is equipped with a first cooling fan group 110.

[0061] In this way, replacing the copper busbar 201 with the target printed circuit board 107 avoids the copper busbar 201 blocking the cooling airflow. Placing multiple inductors 106 in the lower space of the power conversion control compartment increases the heat dissipation capacity of the multiple inductors 106.

[0062] It should be noted that inductor 106 performs current filtering and energy storage functions in the power conversion device. However, when alternating current passes through inductor 106, copper losses (conductor resistance losses) and iron losses (core eddy current losses) are generated, leading to a rise in device temperature. If inductor 106 cannot be effectively cooled, its losses will increase significantly, reducing the overall power conversion efficiency of the PCS. Therefore, this application places inductor 106 in an external air duct to ensure efficient heat dissipation of inductor 106.

[0063] For details, please continue reading. Figure 1 The lower level of the power conversion control compartment is also equipped with a radiator 109.

[0064] The power board 102 is located above the heat sink 109 and is electrically connected to the target printed circuit board 107 through the copper pillar 103.

[0065] It should be noted that the various power devices, such as insulated-gate bipolar transistors and MOSFETs, mounted on the power board 102 generate a significant amount of heat during the power conversion process. Therefore, in this embodiment, the power board 102 is mounted on a heat sink 109 to enhance heat dissipation. The heat sink 109 is also positioned in the lower airflow duct, directly contacting the external cooling air, thus ensuring its heat dissipation efficiency and further improving the heat dissipation effect on the power board 102.

[0066] The radiator 109 employs a finned structure to increase the heat dissipation area, and optimizes heat dissipation performance by adjusting parameters such as fin height, thickness, and width. The first cooling fan assembly works in conjunction with the radiator to create forced convection, achieving a uniform temperature distribution. The radiator can use thermally conductive metals such as aluminum or copper, and its finned structure expands the heat dissipation surface area.

[0067] Here, by avoiding the use of copper busbars in the power conversion device, the embodiments of this application can form a lower air duct at the location of multiple inductors and make the lower air duct directly contact the outside air. This allows the cooling air flowing into the external air duct to not pass through other components, thus ensuring not only the cooling effect of the heat sink on the multiple insulated gate bipolar transistor groups, but also the cooling effect of the heat sink on the multiple inductors.

[0068] Multiple inductors can be arranged in parallel or staggered configurations. The long axis of parallel inductors should be parallel to the direction of the forced airflow to reduce airflow resistance and increase flow velocity. This design allows the airflow to form laminar flow along the inductor surface, enhancing convective heat transfer efficiency. When using finned inductors, axial parallel arrangement can reduce wind speed loss by 15%-20%; with staggered arrangement optimization, multiple inductor arrays can be arranged in a 45°-60° staggered layout, which enhances turbulence by disrupting the airflow boundary layer, increasing the heat transfer coefficient by 8%-12%.

[0069] Optionally, a temperature detection device can be installed near the inductor, and both the temperature detection device and the fan can be connected to the control board. The control board can dynamically adjust the fan speed according to the real-time temperature of the inductor.

[0070] For details, please refer to Figure 1 The power conversion device also includes a second cooling fan assembly 105.

[0071] The second cooling fan group 105 is located on the back panel at a position corresponding to the upper space of the power conversion control compartment. Multiple third ventilation holes are formed on the front panel at a position corresponding to the upper space of the power conversion control compartment. The multiple third ventilation holes are used to form cooling air ducts in the upper space of the power conversion control compartment.

[0072] Here, since this application avoids the use of copper busbars, it will not obstruct the cooling airflow of the cooling air duct in the upper space; since there is more space for setting up functional boards, the gaps between multiple functional boards are also larger, which facilitates the flow of cooling air.

[0073] In this way, by replacing the copper busbar 201 with the target printed circuit board 107, the obstruction of cooling airflow by the copper busbar 201 is avoided. Through the stacking design and the use of copper pillars 103 to electrically connect the power board 102, AC output board 104, and target printed circuit board 107, a certain distance can be maintained between the power board 102, AC output board 104, and target printed circuit board 107 when they are stacked. Thus, a cooling air duct is formed in the upper space of the power conversion control compartment, which can effectively cool the power board 102, AC output board 104, and target printed circuit board 107.

[0074] For example, please refer to Figure 1 The power conversion device also includes a power supply board and an auxiliary power supply board. The power supply board is used to supply power to the control board, power board 102 and other functional boards. The auxiliary power supply board is used to supply power to the first cooling fan group and the second cooling fan group 105. Both the power supply board and the auxiliary power supply board are low-voltage boards and are located in the power conversion control compartment.

[0075] For details, please continue to refer to [the website / information]. Figure 1 The power conversion device also includes multiple current sampling Hall sensors (not shown in the figure).

[0076] Multiple current sampling Hall sensors (not shown in the figure) are located on the AC output board 104. The power board 102 is connected to one end of the multiple current sampling Hall sensors through multiple copper pillars 103. The Hall sensors are connected to multiple DC output terminals of the target printed circuit board 107 through the copper pillars 103.

[0077] For details, please continue to refer to [the website / information]. Figure 1 The power conversion device also includes a control board, which is located inside the power conversion control compartment.

[0078] Multiple current sampling Hall sensors are electrically connected to the control board and transmit the detected current data to the control board, which is used to protect the power conversion device based on the current data.

[0079] Here, a Hall effect sensor is used to detect the output current of the power board 102 and transmit the data to the control board in real time. When the current exceeds the threshold, the control board can immediately trigger a protection mechanism (such as cutting off the drive signal of the insulated gate bipolar transistor) to prevent overload damage to the device. The Hall effect induces current through a magnetic field, eliminating the need for direct connection to the main circuit and avoiding the additional losses and insulation risks caused by the sampling resistor.

[0080] For further information, please continue to refer to [link / reference]. Figure 1 The output signal of the current sampling Hall sensor (not shown in the figure) is directly connected to the target printed circuit via copper busbar 103, reducing noise during long-distance transmission. In related technologies, the copper busbar 201 needs to form a connection between the inductor 106, power board 102, and AC output board 104. Its shape and orientation are fixed, and it already obstructs the cooling airflow of multiple functional boards, making it difficult to install another copper busbar 201 to detect current data. In related power conversion devices, because the copper busbar 201 occupies most of the space, the control board needs to be located in the output compartment, far from the power board 102, and is not directly connected to the AC output board 104.

[0081] Specifically, the control board is used to perform the following steps: for each current sampling Hall sensor, calculate a blocking power output by the power board 102 based on the current data detected by the current sampling Hall sensor; for each current sampling Hall sensor, determine whether there is an abnormality in the insulated gate bipolar transistor group 108 corresponding to the current sampling Hall sensor based on the blocking power output by the power board 102.

[0082] For example, please continue to refer to Figure 1 When the control board determines that a certain insulated-gate bipolar transistor (IGBT) group 108 is malfunctioning, the control board can disconnect the malfunctioning IGBT group 108 from the corresponding DC and AC power supplies. Generally, one IGBT group 108 corresponds to one battery pack. After disconnecting the malfunctioning IGBT group 108 from the corresponding DC and AC power supplies, the energy storage system can still operate normally.

[0083] Optionally, the power conversion device also includes an LC filter module, which comprises multiple filter capacitors and multiple filter inductors. The filter inductors and capacitors can filter out the battery's second-harmonic current and ripple fluctuations. Furthermore, the filter inductors and capacitors are low-failure-rate, long-life components and are not prone to failure. However, the filter inductors are relatively heavy, and the installation spacing between multiple filter inductors should not be too close.

[0084] In one possible implementation, one side of the LC filter module is connected to the AC / DC power conversion module, and the other side is connected to the battery high-voltage box.

[0085] Optionally, the front panel of the enclosure may have the following components: PCS AC interface positive terminal, PCS AC interface negative terminal, low-voltage 15V test terminal, battery high-voltage box positive terminal, battery high-voltage box negative terminal, data transmission network port, secondary control cable interface, communication indicator light, bypass contactor on / off switch, fiber optic communication interface, and high-voltage test terminal, etc.

[0086] The positive and negative terminals of the PCS AC interface are internally connected to the positive and negative terminals of the bypass contactor, respectively. Externally, they are used to connect another high-voltage cascaded energy storage converter in series. The positive and negative terminals of the PCS AC interface are used to connect the individual voltages of the AC / DC power conversion modules in series, achieving medium-to-high voltage access. The low-voltage 15V test terminal is connected to the PMC board. Before the high-voltage connection is made, the board needs to be powered on by an external device to observe and read the device status on the board. Under low-voltage conditions, the PMC board is powered on to test and read the module's operating performance. The high-voltage test terminal is connected to the energy storage capacitor bank. Before powering on the device, the DC energy storage capacitor bank can be powered by an external voltage source, and the high-voltage test terminal will then be used to power the device. The AC / DC power conversion module is powered on to test its performance. The bypass contactor switch serves as the operating port for the bypass contactor, enabling the module's self-bypass function and automatically disconnecting the bypass in case of a fault. After module repair, manual reset is required. The fiber optic communication interface belongs to the PMC board; after connecting the fiber optic cable, PMC signals are uploaded to the control cabinet backend via optical signals, or backend control commands are sent to the PMC board. The energy storage batteries on the battery cluster are connected in series, ultimately connecting to the positive and negative terminals of the high-voltage box. The data transmission network port can upload data monitored by the high-voltage box to the backend control cabinet via a 485 network cable for remote equipment control. The high-voltage box monitors parameters such as voltage, current, and temperature of the energy storage system and transmits this information to the control system. Monitoring these parameters allows for timely detection of system anomalies and appropriate handling. The secondary control cable interface connects to the energy storage battery; when abnormal current or voltage conditions occur in the system, the circuit can be cut off promptly to protect the energy storage system and other electrical equipment. The communication indicator light is electrically connected to the battery high-voltage box and is used to display the equipment status information monitored by the battery high-voltage box, observing the equipment's operating status. Generally, red indicates a fault, and green indicates normal operation.

[0087] Specifically, the housing may include a structural frame, front panel, right side panel, left side panel, rear ventilation panel, and top cover. The structural frame can be welded from standard profiles and is used to support internal components and ensure the structural strength of the device. The frame is designed with lifting interfaces, which include lifting mechanisms. The frame, front panel, right side panel, left side panel, rear ventilation panel, and top cover are all made of metal and form the protective housing of the equipment.

[0088] Please refer to Figure 1In some embodiments, the control board also includes a signal transmission unit (not shown in the figure). The signal transmission unit (not shown in the figure) can be connected to the alarm device of the energy storage system via wired or wireless means. When the control board determines that a certain insulated gate bipolar transistor group 108 is abnormal, it can control the signal transmission unit to transmit an indication signal that the insulated gate bipolar transistor group 108 is abnormal to the alarm device, so that the staff can repair and replace the abnormal insulated gate bipolar transistor group 108.

[0089] In some embodiments, when a certain insulated gate bipolar transistor group 108 malfunctions, the control board can isolate the battery pack corresponding to that insulated gate bipolar transistor group 108 from the normal battery pack, and transfer the power of the malfunctioning battery pack to the normal battery pack through the control board.

[0090] The aforementioned power conversion device, by using the target printed circuit board 107 instead of the copper busbar 201 for connection, not only reduces the space occupied by the copper busbar 201 connection, but also facilitates the stacking design in the power conversion device. While ensuring the separation of high and low pressure chambers, the stacking design can further reduce the size of the power conversion device.

[0091] Without the obstruction of copper busbar 201, it is easier to form a cooling air duct, which not only reduces the size of the power conversion device, but also facilitates the heat dissipation of the power conversion device.

[0092] In one exemplary embodiment, an energy storage system is provided, including a battery pack, a management subsystem, a thermal management system, and a power conversion device as described in any of the above embodiments.

[0093] In one exemplary embodiment, an electrical device is provided, which includes the power conversion device in any of the above embodiments.

[0094] Please note that the above embodiments are for illustrative purposes only and do not imply any limitation on this application.

[0095] The various embodiments in this specification are described in a progressive manner, with each embodiment focusing on the differences from other embodiments. The same or similar parts between the various embodiments can be referred to each other.

[0096] The technical features of the above embodiments can be combined in any way. For the sake of brevity, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, they should be considered to be within the scope of this specification.

[0097] The above embodiments are merely illustrative of several implementation methods of this application, and their descriptions are quite specific and detailed. However, they should not be construed as limiting the scope of the patent application. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of this application, and these modifications and improvements all fall within the protection scope of this application.

Claims

1. A power conversion device, characterized in that, Applied to energy storage systems, the power conversion device is equipped with an output compartment and a power conversion control compartment inside its housing; The output compartment includes multiple output connection ports disposed on the front panel of the enclosure, and the power conversion control compartment includes a target printed circuit board, and a power board, multiple inductors, and an AC output board respectively connected to the target printed circuit board; The target printed circuit board is located above the plurality of inductors and is electrically connected to all of the plurality of inductors. The AC output board is located above the target printed circuit board and is electrically connected to the target printed circuit board via copper pillars. The target printed circuit board includes multiple inductor connection points, multiple input connection points, and multiple output connection points; Each inductor connection point is electrically connected to a corresponding inductor. Each input connection point is connected to the output connection point of a corresponding power board, and is connected to the corresponding inductor connection point through the printed circuit on the target printed circuit board; Each output connection point is connected to the corresponding input connection point of the AC output board, and is connected to the corresponding inductor connection point through the printed circuit on the target printed circuit board. It also includes multiple current sampling Hall sensors located on the AC output board, the power board being electrically connected to the multiple current sampling Hall sensors, and the current sampling Hall sensors being electrically connected to multiple DC output terminals of the target printed circuit board; The power conversion device further includes a control board, which is located inside the power conversion control compartment. The plurality of current sampling Hall sensors are electrically connected to the control board and transmit the detected current data to the control board. The control board is used to protect the power conversion device based on the plurality of current data. The control board is used to perform the following steps: The shielding power output by the power board is calculated based on the current data detected by the current sampling Hall sensor. Based on the shielding power output from the power board, determine whether there is an abnormality in the insulated gate bipolar transistor group corresponding to the current sampling Hall sensor.

2. The power conversion device according to claim 1, characterized in that, The output compartment includes an upper output compartment space and a lower output compartment space. The upper output compartment space contains various high-voltage output devices, and the lower output compartment space is connected to the lower power conversion control compartment space. The front panel of the enclosure has multiple first ventilation holes at positions corresponding to the lower output compartment space. The back panel of the enclosure has multiple second ventilation holes at positions corresponding to the lower power conversion control compartment space. The multiple first ventilation holes and the multiple second ventilation holes are used for heat dissipation from the lower output compartment space and the lower power conversion control compartment space. The plurality of inductors are located inside the lower space of the power conversion control compartment.

3. The power conversion device according to claim 2, characterized in that, The interconnected lower space of the output compartment and the lower space of the power conversion control compartment form an external air duct, and a first cooling fan group is installed in the lower space of the output compartment.

4. The power conversion device according to claim 2, characterized in that, A heat sink is also installed in the lower space of the power conversion control compartment; the power board is located above the heat sink and is electrically connected to the target printed circuit board.

5. The power conversion device according to claim 2, characterized in that, It also includes a second cooling fan assembly, which is located on the back panel at a position corresponding to the upper space of the power conversion control compartment. The front panel is provided with a plurality of third ventilation holes at a position corresponding to the upper space of the power conversion control cabin. The plurality of third ventilation holes and the second cooling fan group are used to form a cooling air duct in the upper space of the power conversion control cabin.

6. An energy storage system, characterized in that, include: Battery pack; Management subsystem; Thermal management system; The power conversion device as described in any one of claims 1 to 5.

7. An electrical appliance, characterized in that, Includes the power conversion device as described in any one of claims 1 to 5.

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