LED structure and packaging method thereof
The LED structure formed through substrate design and electroplating process solves the problems of complex and high cost of traditional bracket electroplating processes, and realizes a low-cost, high flexibility and good compatibility LED packaging method.
Patent Information
- Application Number
- CN202510437857.8
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-09
- Publication Date
- 2025-07-08
AI Technical Summary
The electroplating or sputtering process of the existing LED bracket structure is complex and has high development costs, which leads to an increase in product development costs and a lack of mature mass production processes in China.
The substrate design is adopted, including the first substrate and the second substrate. The substrate is equipped with a bowl, a pad, a solid crystal region and a conductive wire. The metal plating layer is formed using an electroplating or an electroplating process, and the overall structure is formed by a press alignment and pressing to form a thermal dissipation, combined with a thermal column to assist in heat dissipation.
It reduces production costs, improves design flexibility and compatibility, and the product design can be fine-tuned according to terminal needs, with good compatibility and excellent performance.
Smart Images
Figure CN120282604A_ABST
Abstract
Description
Technical Field
[0001] The present invention belongs to the technical field of LED optoelectronics, and particularly relates to an LED structure and a packaging method thereof. Background Art
[0002] At present, for products of size 2319 / 2219 or other sizes with gold-plated designs of bowl-cup type brackets on the market, the bracket structures of these products are all made by plastic electroplating or sputtering methods. However, the developed metal bracket structures are complex, and the manufacturing cost is relatively high. For each change in design, the bracket needs to be re-molded, and the cost of mold opening is also relatively high. As a result, the overall development cost of the product will increase, and domestic electroplating manufacturers capable of this process do not yet have a mature mass production process. Therefore, such products have not been popularized on the market. Therefore, it is urgent to design a new product structure to avoid the complex electroplating or sputtering process in plastic brackets, so as to replace the development of such products. Summary of the Invention
[0003] The purpose of the present invention is to solve the problems of difficult bracket electroplating or sputtering process and high development cost in the prior art, and provide an LED structure and a packaging method thereof with high flexibility, mature process, and low cost investment.
[0004] To achieve the above purpose, the technical solution adopted by the present invention is: an LED structure, including a first substrate and a second substrate. A bowl-cup is provided inside the first substrate. A positive electrode pad and a negative electrode pad connecting to the bottom surface of the bowl-cup are provided on the second substrate. A die bonding area is located on the positive electrode pad or the negative electrode pad and inside the bowl-cup. A chip is provided on the die bonding area, and a conductive wire for conducting the surface electrode of the chip to the positive electrode pad or the negative electrode pad is provided. The periphery of the chip and the conductive wire is wrapped with encapsulation colloid. Heat conducting columns are respectively provided inside the second substrate corresponding to the positions of the positive electrode pad, the negative electrode pad, and the die bonding area.
[0005] Preferably, metal coatings are provided on the upper surface of the first substrate, the inner wall of the bowl-cup, and the upper and lower surfaces of the second substrate. The material of the metal coating is selected from copper, nickel, silver, palladium, or gold.
[0006] Preferably, the materials of the first substrate and the second substrate are selected from BT, FR4, or CEM-3.
[0007] Preferably, the first substrate and the second substrate are connected by press alignment and pressing.
[0008] Preferably, the chip is fixed on the die bonding area through die bonding glue, and the die bonding glue is conductive glue or resin glue.
[0009] Preferably, the bowl-shaped cup is a conical bowl-shaped cup with a larger upper part and a smaller lower part. The encapsulation colloid fills the conical bowl-shaped cup and extends to cover the upper surface of the first substrate. The encapsulation colloid is silicone or epoxy resin.
[0010] Preferably, the heat-conducting column is a heat-conducting copper column or a heat-conducting resin.
[0011] An encapsulation method for the above LED structure includes the following steps:
[0012] S1. Form a plurality of conical perforations similar to the shape of a bowl-shaped cup on the first substrate through a conical drill bit, and form a metal coating on the upper surface of the first substrate and the inner wall of the bowl-shaped cup through electroplating or chemical plating process;
[0013] S2. Form a metal coating on the upper and lower surfaces of the second substrate through electroplating or chemical plating process, and the metal material of the metal coating is the same as that of the metal coating on the first substrate;
[0014] S3. Design pads and die-bonding areas on the second substrate, and set heat-conducting columns at the positions corresponding to the pads and die-bonding areas for assisting heat dissipation;
[0015] S4. Perform alignment and pressing through a board factory press equipment to form a complete overall structure of the first substrate and the second substrate;
[0016] S5. Fix the wafers on the die-bonding areas, weld the conductive wires, and fill the encapsulation colloid in sequence;
[0017] S6. Cut the whole product into single LED finished products.
[0018] Preferably, in step S3, the heat-conducting column is a heat-conducting copper column, which is arranged in the second substrate by the way of drilling and copper plugging.
[0019] After adopting the above technical solution, an LED structure and its encapsulation method provided by the present invention have the following beneficial effects:
[0020] 1) The present invention breaks through the traditional bracket using electroplating or sputtering design process. Compared with the integrated bracket mold electroplating, the production cost of its design and development is lower, and the flexibility of design and development is higher;
[0021] 2) The product designed by the present invention can be directly compatible with the products on the original market. The selection space for the length and width dimensions of the product is larger, and it can be finely adjusted and modified according to the design requirements of the product terminal, with high design flexibility;
[0022] 3) The product designed by the present invention is not affected at the customer terminal. The terminal does not need to make any design modifications and can be used compatibly, with the advantages of better product practicability, better compatibility, better effects and performance, etc. Description of the Drawings
[0023] Figure 1 This is a schematic structural diagram of an LED structure according to the present invention;
[0024] Figure 2 This is a side view of the first substrate in the present invention;
[0025] Figure 3 This is a front view of the first substrate in the present invention;
[0026] Figure 4 This is a side view of the second substrate in the present invention.
[0027] Wherein: the first substrate 1, the second substrate 2, the bowl cup 3, the positive electrode pad 4, the negative electrode pad 5, the die bonding area 6, the chip 7, the conductive wire 8, the encapsulation colloid 9, the heat conducting column 10. Specific embodiments
[0028] The present invention will be further clearly and completely described below in conjunction with the accompanying drawings and specific embodiments. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all of the embodiments. The following description of at least one exemplary embodiment is actually only illustrative and in no way limits the present invention and its application or use. Based on the embodiments in the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.
[0029] It should be noted that the terms used here are only for describing specific embodiments and are not intended to limit the exemplary embodiments according to the present application. As used herein, unless the context clearly indicates otherwise, the singular form is also intended to include the plural form. In addition, it should be understood that when the terms "comprise" and / or "include" are used in this specification, they indicate the presence of features, steps, operations, devices, components, and / or combinations thereof.
[0030] Unless otherwise specifically stated, the relative arrangements, numerical expressions, and numerical values of the components and steps set forth in these embodiments do not limit the scope of the present invention. At the same time, it should be understood that, for the sake of convenience of description, the dimensions of the various parts shown in the drawings are not drawn in actual proportional relationships. Technologies, methods, and devices known to those of ordinary skill in the relevant art may not be discussed in detail, but where appropriate, the technologies, methods, and devices should be regarded as part of the authorized specification. In all the examples shown and discussed here, any specific value should be construed as merely exemplary and not as a limitation. Therefore, other examples of the exemplary embodiments may have different values. It should be noted that: like reference numerals and letters denote like items in the following drawings, and therefore, once an item is defined in one drawing, it does not need to be further discussed in subsequent drawings.
[0031] In the description of the present invention, it should be understood that the orientation or positional relationship indicated by orientation terms such as "front, rear, upper, lower, left, right", "lateral, vertical, perpendicular, horizontal" and "top, bottom", etc. is usually based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description. Without contrary statements, these orientation terms do not indicate or imply that the device or element referred to must have a specific orientation or be constructed and operated in a specific orientation. Therefore, it should not be construed as a limitation on the protection scope of the present invention; the orientation terms "inside, outside" refer to the inside and outside relative to the contour of each component itself.
[0032] For the sake of convenience in description, spatial relative terms such as "above...", "over...", "on the upper surface of...", "upper" etc. can be used here to describe the spatial positional relationship between a device or feature shown in the drawings and other devices or features. It should be understood that the spatial relative terms are intended to cover different orientations in use or operation in addition to the orientation described in the drawings for the device. For example, if the device in the drawing is inverted, the device described as "above other devices or structures" or "over other devices or structures" will then be positioned as "below other devices or structures" or "under other devices or structures". Thus, the exemplary term "above..." can include both the orientations of "above..." and "below...". The device can also be positioned in other different ways (rotated 90 degrees or in other orientations), and corresponding explanations should be made for the spatial relative descriptions used here.
[0033] In addition, it should be noted that using words such as "first", "second", etc. to limit components is only for the convenience of differentiating the corresponding components. Without additional statements, the above words have no special meanings. Therefore, it should not be construed as a limitation on the protection scope of the present invention.
[0034] Such as Figures 1-4As shown in the figure, an LED structure provided by the present invention includes a first substrate 1 and a second substrate 2 stacked on top of each other. Specifically, the first substrate 1 and the second substrate 2 can be made of materials such as BT, FR4, CEM-3, etc. The first substrate 1 is press-fitted onto the second substrate 2 through a press for alignment to form an integral structure. An inverted conical bowl 3 with a larger upper part and a smaller lower part is provided inside the first substrate 1, and metal coatings are provided on the upper surface of the first substrate 1 and the inner wall of the bowl 3 by electroplating or chemical plating. The material of the metal coating can be metal materials such as copper, nickel, silver, palladium, gold, etc. Metal coatings are also provided on the upper and lower surfaces of the second substrate 2 by electroplating or chemical plating, and the metal materials of the metal coatings on the second substrate 2 are the same as those of the metal coatings on the first substrate 1. Further, a positive electrode pad 4 and a negative electrode pad 5 connecting to the bottom surface of the bowl 3 are provided on the second substrate 2. A die bonding area 6 is provided at a position on the positive electrode pad 4 or the negative electrode pad 5 and inside the bowl 3. A chip 7 is provided on the die bonding area 6, and a conductive wire 8 is provided for conducting between the surface electrode of the chip 7 and the positive electrode pad 4 or the negative electrode pad 5. The outer periphery of the chip 7 and the conductive wire 8 is wrapped with a packaging colloid 9. Specifically, the chip 7 is fixed on the die bonding area 6 through a die bonding adhesive, and the die bonding adhesive is a conductive adhesive or a resin adhesive. The packaging colloid 9 fills the conical bowl 3 and extends outward to cover the upper surface of the first substrate 1. The packaging colloid 9 is silica gel or epoxy resin.
[0035] Further, heat conducting columns 10 are respectively provided inside the second substrate 2 at positions corresponding to the positive electrode pad 4, the negative electrode pad 5, and the die bonding area 6. The heat conducting columns 10 are heat conducting copper columns or heat conducting resins.
[0036] The present invention also provides a packaging method for the above LED structure, including the following steps:
[0037] S1. Form a plurality of conical perforations similar to the shape of a bowl on the first substrate 1 through a conical drill bit, and form a metal coating on the upper surface of the first substrate 1 and the inner wall of the bowl 3 through electroplating or chemical plating processes;
[0038] S2. Form a metal coating on the upper and lower surfaces of the second substrate 2 through electroplating or chemical plating processes, and the metal material of the metal coating is the same as the metal material of the metal coating on the first substrate 1;
[0039] S3. Design pads and a die bonding area on the second substrate 2, and set heat conducting columns 10 at positions corresponding to the pads and the die bonding area for assisting in heat dissipation;
[0040] S4. Perform alignment and press-fitting through a press equipment of a board factory to make the first substrate 1 and the second substrate 2 form a complete integral structure;
[0041] S5. Fix the chip 7 on the die bonding area 6, weld the conductive wire 8, and fill the packaging colloid 9 in sequence;
[0042] S6. Cut the whole product into individual LED finished products.
[0043] Among them, in step S3, the heat conducting column 10 is made of a heat conducting copper column, which is arranged in the second substrate 2 by means of copper plugging in a drilled hole.
[0044] In summary, an LED structure and its packaging method provided by the present invention mainly involve the innovative design of the substrate structure to solve the problems of difficult traditional bracket electroplating or sputtering processes and high development costs. The present invention has high design flexibility and mature manufacturing processes in the industry. Therefore, the design cost will be further reduced.
[0045] The above is only a preferred specific embodiment of the present invention, but the protection scope of the present invention is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present invention, according to the technical solution and inventive concept of the present invention, makes equivalent substitutions or changes, and should be covered by the protection scope of the present invention.
Claims
1. An LED structure, characterized in that, It includes a first substrate (1) and a second substrate (2). A bowl cup (3) is provided inside the first substrate (1). A positive electrode pad (4) and a negative electrode pad (5) connecting to the bottom surface of the bowl cup (3) are provided on the second substrate (2). A die bonding area (6) is located on the positive electrode pad (4) or the negative electrode pad (5) and inside the bowl cup (3). A chip (7) is provided on the die bonding area (6), and a conductive wire (8) is used for conducting between the surface electrode of the chip (7) and the positive electrode pad (4) or the negative electrode pad (5). The outer peripheries of the chip (7) and the conductive wire (8) are wrapped with a packaging colloid (9). Heat conducting columns (10) are respectively provided inside the second substrate (2) corresponding to the positions of the positive electrode pad (4), the negative electrode pad (5), and the die bonding area (6).
2. The LED structure according to claim 1, characterized in that: Metal coatings are provided on the upper surface of the first substrate (1), the inner wall of the bowl cup (3), and the upper and lower surfaces of the second substrate (2). The material of the metal coating is selected from copper, nickel, silver, palladium, or gold.
3. An LED structure according to claim 1, characterized in that: The materials of the first substrate (1) and the second substrate (2) are selected from BT, FR4, or CEM-3.
4. An LED structure according to claim 1, characterized in that: The first substrate (1) and the second substrate (2) are connected by alignment pressing through a press.
5. The LED structure according to claim 1, characterized in that: The chip (7) is fixed on the die bonding area (6) by a die bonding adhesive, and the die bonding adhesive is a conductive adhesive or a resin adhesive.
6. An LED structure according to claim 1, characterized in that: The bowl cup (3) is a conical bowl cup with a larger upper part and a smaller lower part. The packaging colloid (9) fills the conical bowl cup and extends to cover the upper surface of the first substrate (1). The packaging colloid (9) is silicone or epoxy resin.
7. The LED structure according to claim 1, wherein: The heat conducting column (10) is a heat conducting copper column or a heat conducting resin.
8. A packaging method for the LED structure according to any one of claims 1-7, characterized in that, It includes the following steps: S1. Form a plurality of conical perforations in the shape of bowl cups on the first substrate (1) through a conical drill bit, and form a metal coating on the upper surface of the first substrate (1) and the inner wall of the bowl cup (3) through electroplating or electroless plating process. S2. Form a metal coating on the upper and lower surfaces of the second substrate (2) through electroplating or electroless plating process, and the metal material of this metal coating is the same as that of the metal coating on the first substrate (1). S3. Design pads and die bonding areas on the second substrate (2), and set heat conducting columns (10) at the positions corresponding to the pads and die bonding areas for assisting heat dissipation. S4. Perform alignment pressing through the press equipment of the board factory to make the first substrate (1) and the second substrate (2) form a complete overall structure. S5. Fix the chip (7) on the die bonding area (6) in sequence, weld the conductive wire (8), and fill the packaging colloid (9). S6. Cut the whole product into single LED finished products.
9. The encapsulation method of an LED structure according to claim 8, characterized in that: In step S3, the heat conducting column (10) is selected as a heat conducting copper column, and it is set inside the second substrate (2) by the way of drilling and copper plugging.