Overmolded LED module with integrated heat sink and optics

Abstract

A method of manufacturing a light emitting diode (LED) headlight unit that includes a heat sink, an LED module, and an optical assembly that are integrally molded. The manufacturing method includes injection molding a heat sink including an LED module in a first injection molding step, and then forming an optical assembly on a top surface of the heat sink in a second injection molding step. In an alternative method of manufacturing an LED headlight unit having an integrally molded heat sink, an LED module, and an optical assembly, the optical assembly is first molded, and the heat sink is molded onto a bottom surface of the optical assembly, thereby integrating the LED module into the heat sink.

Description

[0001] Cross - Reference to Related Applications This application claims the benefit of International Patent Application No. PCT / US2022 / 051610, filed on December 2, 2022, U.S. Provisional Application No. 63 / 416254, filed on October 14, 2022, and U.S. Provisional Application No. 63 / 414815, filed on October 10, 2022, the contents of which are incorporated herein by reference. Background of the Invention

[0002] Modern motor vehicle headlight systems can include a light - emitting diode (LED) module coupled to a headlight optics. The headlight optics can direct the light generated by the LED module onto the road. The orientation of the LED module relative to the headlight optics is crucial because small deviations in alignment can result in improper illumination of the road. In addition to the LED module and the headlight optics, a headlight system is typically attached with an additional heat sink for dissipating the heat generated by the LED module.

[0003] In many modern motor vehicle headlights, the different components of the headlight system are produced separately and then finally assembled by means of gluing, screwing, etc. This results in the final production steps having a high risk of causing the product to have inadequate illumination characteristics because even small deviations play a large role. Summary of the Invention

[0004] A method of manufacturing a light - emitting diode (LED) headlight unit including an integrally molded heat sink, an LED module, and an optical component. The manufacturing method includes injection - molding a heat sink containing the LED module in a first injection - molding step and then forming the optical component on the top surface of the heat sink in a second injection - molding step. In an alternative method of manufacturing an LED headlight unit having an integrally molded heat sink, an LED module, and an optical component, the optical component is first molded and the heat sink is molded onto the bottom surface of the optical component, thereby integrating the LED module into the heat sink. Brief Description of the Drawings

[0005] A more detailed understanding can be obtained from the following description which is given by way of example in conjunction with the accompanying drawings, in which: Figure 1A and Figure 1B is a perspective view of an LED lighting system; Figure 2A and Figure 2B is a perspective view of another LED lighting system; Figure 3A and Figure 3B graphically illustrate for Figure 1A 、 Figure 1B 、 Figure 2A andFigure 2B Tolerance stack-up in the assembly of the lighting system; Figure 4 is a schematic perspective view of an exemplary LED headlamp unit that includes a molded LED module; Figure 5A is for manufacturing Figure 4 a flowchart of an exemplary method of an LED headlamp unit; Figure 5B is for manufacturing Figure 4 a flowchart of an example of an alternative method of an LED headlamp unit; Figure 6A and Figure 6B illustrate an exemplary molding apparatus that can be used to form an LED headlamp unit of a molded LED system that includes Figure 4 ; Figure 7 is a schematic diagram of an example vehicle headlamp system; and Figure 8 is a schematic diagram of another example vehicle headlamp system. DETAILED DESCRIPTION

[0006] Examples of different lighting systems and / or light-emitting diode ("LED") embodiments will be described more fully hereinafter with reference to the accompanying drawings. These examples are not mutually exclusive, and features found in one example can be combined with features found in one or more other examples to achieve additional embodiments. Thus, it will be understood that the examples shown in the accompanying drawings are provided for illustrative purposes only and are not intended to limit the present disclosure in any way. Like numbers always refer to like elements.

[0007] It will be understood that although the terms first, second, third, etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms can be used to distinguish one element from another. For example, without departing from the scope of the present invention, a first element may be referred to as a second element and a second element may be referred to as a first element, unless otherwise expressly stated. As used herein, the term "and / or" can include any and all combinations of one or more of the associated listed items.

[0008] It will be understood that when an element such as a layer, region, or substrate is referred to as being "on" or extending "onto" another element, it can be directly on or extend directly onto the other element, or intervening elements may also be present. In contrast, when an element is referred to as being "directly on" or "directly extending onto" another element, there may be no intervening element present. It will also be understood that when an element is referred to as being "connected" or "coupled" to another element, it can be directly connected or coupled to the other element and / or connected or coupled to the other element via one or more intervening elements. In contrast, when an element is referred to as being "directly connected" or "directly coupled" to another element, there is no intervening element present between the element and the other element. It will be understood that these terms are intended to cover different orientations of the element in addition to any orientation depicted in the figures.

[0009] Relative terms such as "below", "above", "upper", "lower", "horizontal", or "vertical" may be used herein to describe the relationship of one element, layer, or region to another element, layer, or region illustrated in the figures. It will be understood that these terms are intended to cover different orientations of the device in addition to the orientation depicted in the figures.

[0010] Halogen lamps have been the default light source for motor vehicle headlights for many years. However, recent advancements in LED technology and the consequent new design possibilities and energy efficiency have spurred interest in finding a legitimate alternative to halogen lamps based on LED technology. For example, LED technology for use in new designs of motor vehicle headlights requires advanced thermal management. Mounting the LEDs on a metal heat sink is a common method of cooling the LEDs. In a typical LED headlamp, the main heat transfer mechanisms can include heat conduction through the LED, solder, printed circuit board (PCB), and / or lead frame and heat sink. Using a fan, this can achieve forced convection from the heat sink surface to the air volume inside the motor vehicle headlamp. This may be different from halogen lamps, which may exhibit heat transfer via thermal radiation such that additional components (such as a heat sink) may not be required. These additional components may also require a significant amount of space in the motor vehicle headlamp, and thus, a portion of the lighting device may need to be located outside the motor vehicle headlamp (e.g., outside the reflector housing). The embodiments described herein provide a lighting device and a method for producing such a lighting device that mimics a conventional halogen lamp pendant in its form factor and has sufficient cooling.

[0011] Embodiments of a light-emitting diode (LED) headlamp unit can be used as an LED retrofit or as an independent lighting system in a vehicle designed to support LED lighting.

[0012] Figure 1A and Figure 1Bis a schematic perspective view of an LED lighting system. A similar LED lighting system is described in US10260705 titled "LED lighting module with heat sink and a method of replacing an LED module", which is incorporated herein by reference. In Figure 1A and Figure 1B In the example shown, the LED module 1 includes a heat sink 10 and an LED 14. The LED module 1 may also include a rail 46, as shown in Figure 1B When a screw is inserted into the rail and fastened to the connection feature 48 of the optical component, the rail 46 can align the LED module 1 relative to the optical component 44. Thus, in this LED system, the screw inserted into the rail 46 achieves the relative position adjustment of the LED module 1.

[0013] In Figure 1A and Figure 1B In the example LED lighting system, the LED module 1 may move relative to the optical component 44, which may result in incorrect alignment of the LED module 1 and the optical component 44. In addition, as shown in Figure 1A and Figure 1B The LED system may be formed by multiple LED modules, and each LED module needs to be correctly aligned relative to each other and the optical component. Therefore, the light generated by the LED system in Figure 1A and Figure 1B may be incorrectly projected onto the road. The misalignment of the LED module 1 and the optical component 44 may be caused by over-tightening or under-tightening the screw that holds the LED module 1 to the optical component 44. In addition, existing LED systems may require additional labor to screw the LED module 1 to the optical component 44.

[0014] Figure 2A Shows an example of the LED module 1, where the LED 14 is connected to the heat sink 10 via a screw 18. In this context, the heat sink 10 can be understood as a passive heat exchanger that transfers the generated heat to a gaseous or fluid medium such as ambient air, so that the heat can flow out of or dissipate from the lighting module. Thermally, such a heat sink can achieve the heat dissipation function of a high local flux within the light source area and / or can provide a large surface for the surrounding fluid or gaseous medium (e.g., ambient air). The heat sink 10 is typically made of a thermally conductive material (e.g., a metallic material such as aluminum, copper, and / or aluminum-based and / or copper-based alloys).

[0015] Figure 2Bis another example of the LED module 1. Similar LED modules are described in U.S. Patent Publication No. 20210385937 titled "Insert-molded electronic modules using thermally conductive polycarbonate and molded interlocking features", which is incorporated herein by reference. In Figure 2B In the example shown, the heat sink 10 is formed of a thermally conductive polycarbonate that is injection molded to interlock with the LED 14. In this LED module, an optical component 44 (not shown) can be connected to the LED module 1 via screws or other fasteners in a subsequent manufacturing step. Thus, similar to the system described with respect to Figure 1A and Figure 1B this LED module suffers from potential misalignment of the LED and the optical component, which results in the road being incorrectly illuminated.

[0016] Figure 3A and Figure 3B show the tolerance stack-up for assembling an existing LED system as described in Figure 2A and Figure 2B Tolerance stack-up is the process of adding tolerances together before manufacturing in order to understand their cumulative effect on component production. Specifically, Figure 3A shows the tolerance stack-up when a heat sink, a circuit board, and an optical device are screwed together as described in Figure 2A Similarly, Figure 3B shows the tolerance stack-up when a heat sink is molded to a circuit board as described in Figure 2B Although Figure 2B shows the tolerance stack-up of a heat sink molded to a circuit board, a similar tolerance stack-up occurs when the heat sink is glued to the circuit board.

[0017] Therefore, as shown in Figure 3A and Figure 3B the mechanical fastening of the LED module to the heat sink and the optical device requires large tolerances. However, the alignment of the LED headlight system in a vehicle requires very strict tolerances in order to correctly illuminate the road.

[0018] Figure 4 shows an example LED headlight unit 450. In the example shown in Figure 4 two overmolded LED systems 400A and 400B are integrally formed to form the LED headlight unit 450. Although Figure 4An LED headlamp unit 450 is shown having two overmolded LED systems, but in some instances, the LED headlamp unit 450 can be formed by a single overmolded LED system. In other instances, the LED headlamp unit 450 can be formed integrally by more than two overmolded LED systems.

[0019] By molding the heat sink 410, the LED module 420, and the optical component 444 into a single integral part, the overmolded LED system 450 can overcome the drawbacks of conventional LED systems. A single integral part means that the heat sink 410, the LED module 420, and the optical component 444 are joined during the molding process without the need for screws or glue. For example, molding the LED system as a single part can significantly reduce or completely eliminate any misalignment between the LED module and the optical component 444 due to the elimination of screws, fasteners, and any other reference features required by conventional systems. Additionally, by molding the LED system 400 as a single part, the production and assembly process can be improved and simplified by no longer requiring the additional step of fastening the LED module 420 to the optics 444.

[0020] The molded LED systems 400A and 400B can each include an optical component 444 molded integrally with the LED module 420 and the heat sink 410. Preferably, the optical component 444 is a lens, a reflector, a mirror, or a prism. More preferably, the optical component 444 is a reflector.

[0021] In still other instances, the LED systems 400A and 400B can share a common optical component 444. In other instances, each LED system 400A and 400B can have a separate optical component.

[0022] The selection of the thermoplastic is crucial because the material needs to be dimensionally stable and compatible with the thermoplastic of the heat sink 410. In some examples, the optical component 444 is formed of a material such as filled polycarbonate (e.g., dimensionally stable Makrolon® DS801) or unfilled polycarbonate (e.g., Makrolon® 2405) or a polycarbonate blend (e.g., having a polyester such as PBT, PET, or ABS).

[0023] If a filled thermoplastic (especially a filled polycarbonate or a polycarbonate blend) is used for the optical component (especially a reflector), then vario-thermal temperature control is used to mold the optical component. The aromatic polycarbonate can be a mixture of one or more aromatic polycarbonates.

[0024] According to the present invention, "aromatic polycarbonate" or simply "polycarbonate" is to be understood as meaning both homopolycarbonates and copolycarbonates, in particular aromatic polycarbonates. These polycarbonates can be linear or branched in a known manner. According to the present invention, mixtures of polycarbonates can also be used.

[0025] In part of the polycarbonates used according to the present invention (preferably up to 80 mol%, more preferably 20 mol% to 50 mol%), the carbonate groups may have been replaced by aromatic dicarboxylate groups. This type of polycarbonate - which incorporates in its molecular chain not only acid radicals derived from carbonic acid but also acid radicals derived from aromatic dicarboxylic acids - is called an aromatic polyester carbonate. For the purposes of the present invention, they are encompassed by the general term "thermoplastic aromatic polycarbonate".

[0026] The replacement of carbonate groups by aromatic dicarboxylate groups is carried out substantially stoichiometrically and also quantitatively, and thus the molar ratio of the reaction components is also reflected in the final polyester carbonate. The aromatic dicarboxylate groups can be incorporated randomly or in blocks.

[0027] The aromatic polycarbonate selected according to the present invention preferably has a weight-average molecular weight Mw of 15,000 to 40,000 g / mol, more preferably 16,000 to 34,000 g / mol, even more preferably 17,000 to 33,000 g / mol, and most preferably 19,000 to 32,000 g / mol. w . Here, the value of Mw w is determined by gel permeation chromatography, which is calibrated with bisphenol A polycarbonate standards using dichloromethane as the eluent; calibrated with linear polycarbonates (made from bisphenol A and phosgene) with a known molar mass distribution from PSS Polymer Standards Service GmbH, Germany; calibrated according to method 2301-0257502-09D (German version 2009) from Currenta GmbH & Co. OHG, Leverkusen. The eluent is dichloromethane. Column combination of crosslinked styrene-divinylbenzene resins. Analytical column diameter: 7.5 mm; length: 300 mm. Particle size of the column material: 3 µm to 20 µm. Solution concentration: 0.2 wt%. Flow rate: 1.0 ml / min. Solution temperature: 30 °C. Detection is carried out using a refractive index (RI) detector.

[0028] The polycarbonates are preferably produced by the interfacial method or the melt transesterification method, which have been described many times in the literature.

[0029] Regarding the interfacial method, for example, the following are referred to: H. Schnell, “Chemistry and Physics of Polycarbonates”, Polymer Reviews, Vol. 9, Interscience Publishers, New York 1964 p. 33 et seq; Polymer Reviews, Vol. 10, “Condensation Polymers by Interfacial and Solution Methods”, Paul W. Morgan, Interscience Publishers, New York 1965, Chapt. VIII, p. 325; Dres. U. Grigo, K. Kircher and P. R- Müller “Polycarbonate” in Becker / Braun, Kunststoff-Handbuch, Volume 3 / 1, Polycarbonate, Polyacetale, Polyester, Celluloseester, Carl Hanser Verlag Munich, Vienna 1992, pp. 118-145; and also EP 0517044 A1.

[0030] The melt transesterification method is described, for example, in the following: “Encyclopedia of Polymer Science”, Vol. 10 (1969), Chemistry and Physics of Polycarbonates, Polymer Reviews, H. Schnell, Vol. 9, John Wiley and Sons, Inc. (1964); and the patent specifications DE 1031512 A and US 6228973 B1.

[0031] Details relating to the production of polycarbonates have been disclosed in many patent documents spanning approximately the last 40 years. For reference here, the following may be cited: Schnell, “Chemistry and Physics of Polycarbonates”, Polymer Reviews, Volume 9, Interscience Publishers, New York, London, Sydney 1964; D. Freitag, U. Grigo, P.R. Müller, H. Nouvertné, BAYER AG, “Polycarbonates” in Encyclopedia of Polymer Science and Engineering, Volume 11, Second Edition, 1988, pages 648 - 718; and finally U. Grigo, K. Kirchner and P.R. Müller “Polycarbonate” in Becker / Braun, Kunststoff-Handbuch, Volume 3 / 1, Polycarbonate, Polyacetale, Polyester, Celluloseester, Carl Hanser Verlag Munich, Vienna 1992, pages 117 - 299.

[0032] The production of aromatic polycarbonates is effected, for example, by the reaction of dihydroxyaryl compounds with carbon halides (preferably phosgene) and / or with aromatic dicarboxylic dihalides (preferably benzene dicarboxylic dihalides); the interfacial process, which optionally uses chain terminators and optionally trifunctional or more than trifunctional branching agents. The production of polyester carbonates is effected by replacing a part of the carbonate derivatives with aromatic dicarboxylic acids or derivatives of dicarboxylic acids, specifically aromatic dicarboxylic ester structural units according to the carbonate structural units to be replaced in the aromatic polycarbonate. Production via a melt polymerization process by reaction of dihydroxyaryl compounds with, for example, diphenyl carbonate is likewise possible.

[0033] Dihydroxyaryl compounds suitable for the production of polycarbonates are, for example: hydroquinone, resorcinol, dihydroxydiphenyl, bis(hydroxyphenyl)alkanes, bis(hydroxyphenyl)cycloalkanes, bis(hydroxyphenyl)sulfides, bis(hydroxyphenyl)ethers, bis(hydroxyphenyl)ketones, bis(hydroxyphenyl)sulfones, bis(hydroxyphenyl)sulfoxides, α,α'-bis(hydroxyphenyl)diisopropylbenzene, phthalimides derived from derivatives of isatin or phenolphthalein, and their cycloalkylated, cycloarylated and cyclohalogenated compounds.

[0034] Preferred dihydroxyaryl compounds are: 4,4'-dihydroxybiphenyl, 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), 2,4-bis(4-hydroxyphenyl)-2-methylbutane, 1,1-bis(4-hydroxyphenyl)-p-diisopropylbenzene, 2,2-bis(3-methyl-4-hydroxyphenyl)propane, dimethylbisphenol A, bis(3,5-dimethyl-4-hydroxyphenyl)methane, 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, bis(3,5-dimethyl-4-hydroxyphenyl)sulfone, 2,4-bis(3,5-dimethyl-4-hydroxyphenyl)-2-methylbutane, 1,1-bis(3,5-dimethyl-4-hydroxyphenyl)-p-diisopropylbenzene, and 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, and also bisphenols (I) to (III).

[0035] wherein R' represents in each case a C1-C4 alkyl, aralkyl or aryl group, preferably a methyl or phenyl group, very particularly preferably a methyl group.

[0036] Particularly preferred dihydroxyaryl compounds are: 2,2-bis(4-hydroxyphenyl)propane (bisphenol A), 2,2-bis(3,5-dimethyl-4-hydroxyphenyl)propane, 1,1-bis(4-hydroxyphenyl)cyclohexane, 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxybiphenyl, and dimethylbisphenol A, and also the diphenols of the formulae (I), (II) and (III).

[0037] These and other suitable dihydroxyaryl compounds are described, for example, in: US3028635A, US2999825A, US3148172A, US2991273A, US3271367A, US4982014A and US2999846A; DE1570703A, DE2063050A, DE2036052A, DE2211956A and US2999846A; DE1570703A, DE2063050A, DE2036052A, DE2211956A and DE3832396A; FR1561518; the monograph “H. Schnell, Chemistry and Physics of Polycarbonates, Interscience Publishers, New York 1964”; and also JP62039 / 1986 A, JP 62040 / 1986 A and JP 105550 / 1986 A.

[0038] In the case of homopolycarbonates, only one dihydroxyaryl compound is used; in the case of copolycarbonates, two or more dihydroxyaryl compounds are used. Similar to all other chemicals and auxiliaries added to the synthesis, the dihydroxyaryl compounds used may be contaminated with pollutants from their own synthesis, handling and storage. However, it is desirable to use raw materials of the highest possible purity.

[0039] Suitable carbonic acid derivatives are, for example, phosgene and diphenyl carbonate.

[0040] Suitable chain terminators that can be used in the production of polycarbonates are monophenols. Suitable monophenols are, for example, phenol itself, alkylphenols (such as cresols, p-tert-butylphenol, cumylphenol) and mixtures thereof.

[0041] Preferred chain terminators are phenols mono-substituted or multi-substituted by straight-chain or branched C l -C 30 alkyl groups, preferably unsubstituted or substituted by tert-butyl groups. Particularly preferred chain terminators are phenol, cumylphenol and / or p-tert-butylphenol.

[0042] Based on the number of moles of diphenol used in each case, the amount of chain terminator to be used is preferably 0.1 to 5 mol%. The addition of the chain terminator can be carried out before, during or after the reaction with the carbonic acid derivative.

[0043] Suitable branching agents are trifunctional or more than trifunctional compounds common in polycarbonate chemistry, especially compounds having three or more phenolic hydroxyl groups. Suitable branching agents are, for example, 1,3,5-tris(4-hydroxyphenyl)benzene, 1,1,1-tris(4-hydroxyphenyl)ethane, tris(4-hydroxyphenyl)phenylmethane, 2,4-bis(4-hydroxyphenylisopropyl)phenol, 2,6-bis(2-hydroxy-5'-methylbenzyl)-4-methylphenol, 2-(4-hydroxyphenyl)-2-(2,4-dihydroxyphenyl)propane, tetrakis(4-hydroxyphenyl)methane, tetrakis(4-(4-hydroxyphenylisopropyl)phenoxy)methane, and 1,4-bis((4',4''-dihydroxytriphenyl)methyl)benzene and 3,3-bis(3-methyl-4-hydroxyphenyl)-2-oxo-2,3-dihydroindole. Based on the number of moles of the dihydroxyaryl compound used in each case, the amount of the branching agent that can be optionally used is preferably 0.05 mol% to 2.00 mol%. The branching agent can be initially added to the basic aqueous phase together with the dihydroxyaryl compound and the chain terminator, or dissolved in an organic solvent and added before phosgenation. In the case of the transesterification process, the branching agent is used together with the dihydroxyaryl compound.

[0044] Particularly preferred polycarbonates are homopolycarbonates based on bisphenol A, homopolycarbonates based on 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, 4,4'-dihydroxybiphenyl, and copolycarbonates based on two monomers bisphenol A and 1,1-bis(4-hydroxyphenyl)-3,3,5-trimethylcyclohexane, and also homopolycarbonates or copolycarbonates derived from diphenols of the general formulas (I), (II), and (III).

[0045] wherein R' represents in each case a C1-C4 alkyl, aralkyl or aryl group, preferably represents a methyl or phenyl group, and very particularly preferably represents a methyl group.

[0046] Also preferred are polycarbonates produced using the dihydroxyaryl compound of the following general formula (1a): (1a) wherein R 5 represents hydrogen or a C1-C4 alkyl, C1-C4 alkoxy group, preferably represents hydrogen or a methyl or methoxy group, and particularly preferably represents hydrogen, R 6 , R 7 , R 8 and R 9 independently of one another represent a C6-C 12 aryl or a C1-C4 alkyl group, preferably represents a phenyl or methyl group, and particularly represents a methyl group, Y represents a single bond, SO2-, -S-, -CO-, -O-, C1-C6 alkylene, C2-C5 alkenylene, C6-C 12 arylene (which may optionally be condensed with another aromatic ring containing a heteroatom), or represents a C5-C6 cycloalkylene residue (which may be mono- or polysubstituted by C1-C4 alkyl), preferably represents a single bond, -O-, isopropylidene or represents a C5-C6 cycloalkylene (which may be mono- or polysubstituted by C1-C4 alkyl), V represents oxygen, C2-C6 alkylene or C3-C6 alkenylene, preferably represents oxygen or C3 alkenylene, p, q and r each independently represent 0 or 1, If q = 0, then W is a single bond, if q = 1 and r = 0, then W represents -O-, C2-C6 alkylene or C3-C6 alkenylene, preferably represents -O- or C3 alkenylene, If q = 1 and r = 1, then W and V independently represent C2-C6 alkylene or C3-C6 alkenylene, preferably represents C3 alkenylene, Z represents C1-C6 alkylene, preferably represents C2 alkylene, o represents the average number of repeating units from 10 to 500, preferably from 10 to 100, and m represents the average number of repeating units from 1 to 10, preferably from 1 to 6, particularly preferably from 1.5 to 5.

[0047] It is also possible to use dihydroxyaryl compounds in which two or more siloxane blocks of the general formula (1a) are linked via terephthalic acid and / or isophthalic acid with the formation of ester groups.

[0048] Particularly preferred are the (poly)siloxanes of the general formulae (2) and (3) (3) wherein R 1 represents hydrogen, C1-C4 alkyl, preferably represents hydrogen or methyl, and particularly preferably represents hydrogen, R 2 independently represent aryl or alkyl, preferably represents methyl, X represents a single bond, -SO2-, -CO-, -O-, -S-, C1-C6 alkylene, C2-C5 alkenylene or represents C6-C 12 arylene, which may optionally be condensed with another aromatic ring containing a heteroatom, X represents a single bond, -SO2-, -CO-, -O-, -S-, C1-C6 alkylene, C2-C5 alkenylene, C5-C12 A cycloalkylene group or represents a C6-C 12 arylene group, which may optionally be condensed with a further aromatic ring containing a heteroatom, X preferably represents a single bond, an isopropylidene group, a C5-C 12 cycloalkylene group or oxygen, and particularly preferably represents an isopropylidene group, n means an average number from 10 to 400, preferably from 10 to 100, particularly preferably from 15 to 50, and m represents an average number from 1 to 10, preferably from 1 to 6, and particularly preferably from 1.5 to 5.

[0049] Also preferably, the siloxane block may be derived from one of the following structures: (IV) (V), preferably (Va) (Va), or (VI) wherein a in the molecular formulas (IV), (V) and (VI) means an average number from 10 to 400, preferably from 10 to 100, and particularly preferably from 15 to 50.

[0050] Also preferably, at least two of the same or different siloxane blocks of the general formula (IV), (V) or (VI) are linked via terephthalic acid and isophthalic acid in the formation of an ester group.

[0051] It is also preferred that if p = 0 in the molecular formula (1a), V represents a C3 alkylene group, if r = 1, Z represents a C2 alkylene group, R 8 and R 9 represent methyl, if q = 1, W represents a C3 alkylene group, if m = 1, R 5 represents hydrogen or a C1-C4 alkyl group, preferably represents hydrogen or methyl, R 6 and R 7 independently of one another represent a C1-C4 alkyl group, preferably represent methyl, and o represents 10 to 500.

[0052] The copolycarbonates having monomer units of the general formula (1a) (in particular having bisphenol A) and in particular the production of these copolycarbonates are described in WO 2015 / 052106 A2.

[0053] Depending on the required demands on the properties of the thermoplastic composition, the composition contains, in addition to the polymer, further ingredients, which polymer itself is preferably a polycarbonate or a polycarbonate blend.

[0054] Fillers can be added to achieve properties such as dimensional stability and / or thermal conductivity, while conventional additives are added to further modify the properties of the thermoplastic composition.

[0055] For at least the heat sink of the LED headlight unit, a thermally conductive thermoplastic material is used. Such materials include thermally conductive additives that can be selected according to the respective needs. Many thermally conductive fillers are commercially available, which allow for providing a composition with the required thermal conductivity.

[0056] Such thermally conductive additives can be graphene, graphite (especially expanded graphite), aluminum or other metal particles, carbon fibers or other conductors, or thermally conductive polymers. In a preferred embodiment, expanded graphite is included as a thermally conductive additive in the thermally conductive thermoplastic material. Expanded graphite and its production methods are known to those skilled in the art.

[0057] The thermoplastic composition can optionally contain one or more further commercially available polymer additives, such as flame retardants, flame retardant synergists, anti-dripping agents (e.g., compounds of fluorinated polyolefins), lubricants, flow enhancers, mold release agents, transesterification stabilizers, nucleating agents, heat stabilizers, antioxidants, UV absorbers, IR absorbers, antistatic agents, colorants, pigments, and mixtures thereof.

[0058] The material for the injection molding step is a thermoplastic material. The heat sink and the optical component can be of the same material or can be of different materials.

[0059] The thermoplastic material is based on a thermoplastic polymer, such as a polycarbonate including a copolycarbonate, a polycarbonate blend including a copolycarbonate blend, especially with PET, PBT or ABS, polyamide, polymethyl methacrylate, polystyrene, styrene acrylonitrile, cycloolefin copolymer, polyester, or mixtures of these. Preferably, the thermoplastic material is a composition based on a polycarbonate or a polycarbonate blend.

[0060] "Based on" is understood to mean that the thermoplastic composition comprises at least 50 wt%, preferably at least 60 wt%, particularly preferably at least 70 wt% of the respective polymer.

[0061] A preferred LED headlight unit according to the invention is a headlight unit comprising: A heat sink, which is formed of a first polycarbonate-based thermoplastic and integrates an LED module; and Optical component, wherein the optical component is a reflector, and the reflector is formed on the top surface of the heat sink from a second polycarbonate-based thermoplastic material. The first thermoplastic material and the second thermoplastic material can be the same polycarbonate-based material or different polycarbonate-based materials.

[0062] In the case where the optical element is a reflector, part or all of its surface is preferably metallized to achieve good reflection.

[0063] Applying a metal to a polymer can be achieved via various methods, such as, for example, by vapor deposition or sputtering. These processes are described in more detail, for example, in "Vakuumbeschichtung vol. 1 to 5", H. Frey, VDI-Verlag Düsseldorf 1995 or "Oberflächen- und Dünnschicht-Technologie" part 1, R.A. Haefer, Springer Verlag 1987.

[0064] To achieve better metal adhesion and to clean the substrate surface, the substrate is usually subjected to plasma pretreatment. In certain situations, plasma pretreatment can change the surface properties of the polymer. For example, these methods are described by Friedrich et al. in Metallized plastics 5&6: Fundamental and applied aspects and by H. Grünwald et al. in Surface and Coatings Technology 111 (1999) 287-296.

[0065] Alternatively, the reflector part can be molded into the housing or into the housing heat sink using the above-mentioned two-shot molding process, where the metallized reflector is first molded and then the housing is molded onto it. In another embodiment, the reflector part can be molded into the housing or into the housing heat sink before it is metallized. In yet another embodiment, the housing or the housing heat sink includes the reflector part, and this part is metallized after molding. Additionally, another coating can be applied to the reflector part before it is metallized.

[0066] Additional layers, such as protective cements that reduce corrosion, can be applied in a PECVD (plasma-enhanced chemical vapor deposition) or plasma polymerization process. In these, low-boiling point precursors mainly based on siloxanes are evaporated in the plasma and are thereby activated so that they can form a film. Typical substances here are hexamethyldisiloxane (HMDSO), tetramethyldisiloxane, decamethylcyclopentasiloxane, octamethylcyclotetrasiloxane, and trimethoxymethylsilane.

[0067] Possible metals are preferably Ag, Al, Ti, Cr, Cu, VA steel, Au, Pt, and particularly preferably Ag, Al, Ti or Cr. Highly particularly preferred thermoplastic compositions for optical components (preferably reflectors) and / or heat sink components are those thermoplastic compositions described in WO2022 / 112405 Al, which is hereby incorporated by reference. The compositions described in WO 2022 / 112405Al exhibit good dimensional stability and good surface properties of the molded parts, which can be seen in the example section of WO2022 / 112455 Al, which is particularly important for reflectors. Such thermoplastic compositions comprise: a) 44 to 63 wt% of an aromatic polycarbonate, b) 3 to 8 wt% of expanded graphite, c) 34 to 38 wt% of fused quartz, d) 0 to 10 wt% of one or more additives other than component b or c, wherein the total amount of expanded graphite and fused quartz is at least 40 wt%.

[0068] A particularly preferred composition for a reflector is a composition consisting of: a) 54 to 60 wt% of an aromatic polycarbonate, b) 5 to 7.5 wt% of expanded graphite, in particular expanded graphite with a D(0.5) of 700 μm to 1200 μm, which is determined by sieving analysis in accordance with DIN 51938:2015-09, c) 35 to 37.5 wt% of fused quartz, in particular fused quartz with a D(0.5) of 3 μm to 5 μm, which is determined in accordance with ISO13320:2009-10, d) 0 to 5 wt% of one or more additives other than component b or c, wherein the total amount of expanded graphite and fused quartz is at least 40 wt%, particularly preferably at least 42 wt%, and wherein particularly preferably at least one mold release agent, heat stabilizer and / or antioxidant and carbon black are included as additives.

[0069] If the heat sink and the optical element use similar materials (for example, polycarbonate-based materials in both cases), the LED headlight unit according to the present invention has the advantage that it can be easily and effectively recycled.

[0070] Alternatively, for the optical component, a composition as described in W02013079555A1 is preferably used.

[0071] A particularly preferred material disclosed in this document is a thermoplastic composition consisting of the following: A) 30.0 to 90.0 parts by weight of at least one aromatic polycarbonate, B) 0.0 to 50.0 parts by weight of a rubber-modified graft polymer and / or vinyl copolymer, C) 0.00 to 50.00 parts by weight of a polyester, D) 5.0 to 50.0 parts by weight of at least one inorganic filler having a spherical grain shape, wherein the filler is quartz, E) 0.00 to 5.00 parts by weight of additional conventional additives selected from the group consisting of flame retardants, anti-dripping agents, lubricants and mold release agents, nucleating agents, dyes, pigments, UV stabilizers, heat stabilizers, hydrolysis stabilizers and antioxidants, wherein the sum of the parts by weight of components A) to E) is 100 parts by weight in total.

[0072] For a radiator, EP2721111B1 describes an alternative material, in particular a composition comprising: 90 wt% to 30 wt% of at least one amorphous thermoplastic, wherein the amorphous thermoplastic is selected from the group consisting of polycarbonate and polymethyl methacrylate (PMMA); and 10 wt% to 70 wt% of expanded graphite, wherein at least 90% of the particles of the expanded graphite have a particle size of at least 200 microns, wherein the particle size is determined by sieve analysis.

[0073] The radiator 410 of the molded LED system 400A can be formed of a thermoplastic material having high thermal conductivity and high thermal emissivity. The selection of the thermoplastic is crucial because the material needs to be compatible with the thermoplastic of the optical component 444. Examples of such materials include Makrolon® T0629.

[0074] Additionally, if the radiator 410 and the optical component 444 use similar materials (e.g., polycarbonate-based materials in both cases), the LED headlight unit 450 has the advantage that it can be easily and effectively recycled.

[0075] In some instances, the radiator 410 can be in thermal contact with the optical component 444 such that the optical component 444 acts as an additional radiator. In some instances, the thermoplastic forming the optical component 444 can be the same as the thermoplastic forming the radiator 410. In these instances, the optical component 444 can serve both a heat dissipation function and an optical function.

[0076] The overmolded LED systems 400A and 400B can also include an LED module 420, which can contain LEDs 414. In some instances, the LED module 420 includes multiple LEDs, which may or may not have an interposer. Additionally, in some instances, the LED module 420 can include a thermally conductive diffusing element (such as made of Al or Cu), which can transfer the heat generated by each LED 414 to the heat sink 410. Further, the LED module 420 can also include a circuit board for connecting the LEDs to a suitable power source, including the required electrical components and connectors 412. In some instances, the LED module 420 includes a first reference feature 430 for aligning the LED module to the cavity of the mold of the molding device. In some instances, the reference feature 430 can be a hole, a groove, an edge, or a lug. And in some instances, the LED module 420 includes a fixing feature 435 that geometrically aligns the LED module 420 with the heat sink and supports the mechanical connection and integration of the LED module 420 to the heat sink 410. For example, in some instances, the fixing feature 435 can be two holes. In these instances, the two holes provide improved fixing and / or bonding between the LED module 420 and the heat sink 410. Examples of molding devices are shown in Figure 6A and Figure 6B and are described in more detail below.

[0077] Figure 5A FIG. is a flow chart of an example method 500 of manufacturing an LED headlamp unit 450, which may contain overmolded LED systems 400A and 400B. The LED module 420A / B can be inserted into the first cavity of the mold (510). Then the mold can be closed. In some instances, the molding tool can be integrated with corresponding reference features that match the reference features 430 of the LED systems 400A and 400B. For example, in some instances, when the reference feature 430 is a hole, a pin can be inserted into the hole in the LED module. In another instance, a defined reference edge at the LED module 420 can have a corresponding alignment edge in the tool such that the LED module 420 can be pressed against the reference before the tool is closed (e.g., by gravity).

[0078] A thermoplastic material having a high thermal conductivity and a high thermal emissivity can be injection molded onto the LED module 420 to form the heat sink 410 (520). The injection molding firmly attaches the LED module 420 into the heat sink 410 without the need for additional fasteners or glue.

[0079] In some instances, the melting temperature of the thermoplastic material having a high thermal conductivity and a high thermal emissivity is between 280 o °C - 350 oBetween C. In many cases, the mold temperature is determined based on the melting temperature of a thermoplastic material having high thermal conductivity and high thermal emissivity. For example, 280 o C - 350 o The melting temperature range of C can correspond to 80 o C - 120 o The mold temperature range of C.

[0080] In some instances, the thermoplastic material having high thermal conductivity and high thermal emissivity can be molded at a mold temperature of 90 o C and a pressure of 950 bar. However, the pressure used depends on the geometry of the heat sink 410 and the mold design. For example, 950 bar may be a good result, but it can also be 100 bar (special low - pressure molding technique) or 2000 bar (usually machine limitation). However, when overmolding the heat sink 410 onto the LED module 420, it is crucial that the pressure is low enough so as not to deform the LED module 420. Therefore, although the heat sink 410 can be molded using a pressure between 100 - 2000 bar, it is highly desirable to use a pressure below 1000 bar to ensure that the LED module 420 does not deform during injection molding.

[0081] Then, the molded LED heat sink formed in 520 can be moved to the second cavity (530), and the mold can be closed again. In some instances, a sliding table such as Figure 6A depicted in is used to perform this movement. In other instances, this movement is accomplished by a sliding table, a turntable, and / or a rotary index table.

[0082] Then, by injecting a second thermoplastic into the second cavity, the optical component 444 can be injection - molded onto the top surface of the molded heat sink (540). In some instances, the second thermoplastic can be injection - molded at a mold temperature of 165 o C, and then cooled to a mold temperature of 90 o C before the mold is opened. In some instances, the second thermoplastic can be injection - molded at 780 bar. In some instances, the molded LED module and heat sink formed in 520 can be maintained at 90 o C while the optical component is injection - molded onto the top surface.

[0083] In some instances, the injection molding of the optical component 444 is performed using a variable - temperature process. The variable - temperature process is used to improve the surface quality of the optical component. For example, in the variable - temperature process before injection, the mold is heated to approximately 140 - 170 o C. After injection, the mold is cooled to approximately 90 oC. The decision to use a variable temperature process can be made based on the second thermoplastic used or the surface quality of the desired optical component.

[0084] In other instances, the injection molding of the optical component 444 can be carried out using a constant heat process with a mold temperature between 60 o °C and 120 o °C.

[0085] However, as in the case of molding the heat sink in step 520, the molding of the optical component 444 in step 540 also depends on the properties of the second thermoplastic used. For example, in the case of a constant heat process, a second thermoplastic with a melting temperature range of 280 o °C - 350 o °C may require a mold temperature range of 60 o °C - 120 o °C. And the same material will require a mold temperature range of 120 o °C - 180 o °C when used in a variable temperature process. However, in all cases, the mold temperature must be higher than the glass transition temperature of the second thermoplastic material.

[0086] Similar to molding the heat sink in step 520, the pressure used in molding the optical component 444 in step 540 highly depends on the geometries of the optical component and the mold. For example, 780 bar may be a good result, but it could also be 100 bar again (special low-pressure molding techniques) or 2000 bar (usually machine limitations). However, when choosing the pressure, it is crucial that the pressure is low enough to avoid high warping of the optical component 444. As a result, for the molding process, the molding in step 540 can be carried out between 100 - 2000 bar. However, preferably, the pressure is below 1000 bar to ensure low warping of the optical component 444.

[0087] In some instances, the second thermoplastic can be the same material as the high thermal conductivity and high heat emissivity thermoplastic used in 520. Or a material with both sufficient heat emissivity and dimensional stability, for the heat sink and the optical device. The thermoplastic should be made based on the properties of the materials discussed above. Additionally, if the heat sink 410 and the optical component 444 use similar materials (e.g., polycarbonate-based materials are used in both cases), then the LED headlight unit 450 has the advantage that it can be easily and effectively recycled.

[0088] Then the mold can be opened and the LED headlight unit 450 can be demolded (550). In the case where the optical component 444 is a reflector, part or all of its surface may preferably be metallized to achieve good reflection after the LED headlight unit 450 is demolded.

[0089] Applying metal to a polymer can be achieved via various methods, such as for example by vapor deposition or sputtering. These processes are described in more detail in, for example, "Vakuumbeschichtung vol. 1 to 5", H. Frey, VDI-Verlag Düsseldorf 1995 or "Oberflächen- und Dünnschicht-Technologie" part 1, R.A. Haefer, Springer Verlag 1987.

[0090] To achieve better metal adhesion and to clean the substrate surface, the substrate is typically subjected to plasma pretreatment. In some cases, plasma pretreatment can change the surface properties of the polymer. For example, these methods are described by Friedrich et al. in Metallized plastics 5&6: Fundamental and applied aspects and by H. Grünwald et al. in Surface and Coatings Technology 111 (1999) 287-296.

[0091] Figure 5B is a flowchart of an example of an alternative method 505 for manufacturing an LED headlight unit 450, which can include overmolded LED systems 400A and 400B. The LED modules 420A / B can be inserted into the second cavity of the mold (515). Then the mold can be closed. In some instances, the molding tool can be integrated with corresponding reference features that match the reference features 430 of the LED systems 400A and 400B. For example, in some instances, when the reference feature 430 is a hole, pins can be inserted into the holes in the LED module. In another instance, a defined reference edge at the LED module 420 can have a corresponding alignment edge in the tool such that the LED module 420 can be pressed against the reference before the tool (e.g., by gravity) is closed.

[0092] Then the optical component can be injection molded into the first cavity (525). In some instances, as described above, the thermoplastic for the optical component can be injection molded using a variable temperature process. In other instances, as described above, injection molding can be performed using a constant heat process.

[0093] The molded optical component formed in 525 can be moved to the second cavity (535), and the mold can be closed again. In some instances, a sliding table such as that depicted in Figure 6A is used to perform this movement. In other instances, the movement is accomplished by a sliding table, a turntable, and / or a rotary index table.

[0094] A thermoplastic material having high thermal conductivity and high thermal emissivity can be injection molded onto the bottom surface of the optical component molded in step 525 to form the heat sink 510 (545). Molding the heat sink onto the optical component in step 545 also integrates the LED module 420 into the heat sink 510.

[0095] In some instances, the parameters discussed in step 520 can be used to mold the thermoplastic material having high thermal conductivity and high thermal emissivity.

[0096] The mold can then be opened, and the LED headlight unit 450 can be demolded (555). As discussed with respect to step 550, in cases where the optical component 444 is a reflector, part or all of its surface may preferably be metallized to achieve good reflection after the LED headlight unit 450 is demolded.

[0097] In some instances, 2K molding can be used to perform the injection molding described with respect to Figure 5A and Figure 5B 2K molding is beneficial because it improves precision, efficiency, and the bonding behavior between the two thermoplastics due to the fact that the two components are molded directly one after the other in a short period of time. In other instances, other plastic overmolding techniques can be used. Examples of other overmolding techniques that can be utilized include two separate injection molding steps. For example, the headlight unit can be formed in two area steps. In the first injection molding of the heat sink, and then the heat sink is placed in a second mold / machine to overmold the optics onto the heat sink.

[0098] Figure 6A and Figure 6B shows an example molding apparatus that can be used to implement process 500. Specifically, Figure 6B shows the first cavity 610 in which the heat sink is formed and the second cavity 620 for forming the optical component 444, respectively. An example of a sliding table that can be used to move components between the first cavity 610 and the second cavity 620 is shown in Figure 6A .

[0099] Figure 7 is a schematic diagram of an example vehicle headlight system 700 that can incorporate one or more of the embodiments and examples described herein.Figure 7 The exemplary vehicle headlight system 700 shown in FIG. includes a power line 702, a data bus 704, an input filter and protection module 706, a bus transceiver 708, a sensor module 710, an LED DC-to-DC (DC / DC) module 712, a logic low-dropout (LDO) module 714, a microcontroller 716, and an active headlight 718.

[0100] The power line 702 can have an input for receiving power from the vehicle, and the data bus 704 can have an input / output through which data can be exchanged between the vehicle and the vehicle headlight system 700. For example, the vehicle headlight system 700 can receive instructions from other locations in the vehicle, such as instructions to turn on turn signaling or turn on the headlights, and can send feedback to other locations in the vehicle if desired. The sensor module 710 can be communicatively coupled to the data bus 704 and can provide additional data to the vehicle headlight system 700 or other locations in the vehicle, the additional data being related to, for example, environmental conditions (e.g., time of day, rain, fog, or ambient light level), vehicle state (e.g., parked, in motion, speed of motion, or direction of motion), and the presence / location of other objects (e.g., vehicles or pedestrians). A headlight controller separate from any vehicle controller communicatively coupled to the vehicle data bus can also be included in the vehicle headlight system 700. In Figure 7 FIG., the headlight controller can be a microcontroller, such as microcontroller (μc) 716. The microcontroller 716 can be communicatively coupled to the data bus 704.

[0101] The input filter and protection module 706 can be electrically coupled to the power line 702 and can support, for example, various filters to reduce conducted emissions and provide power immunity. Additionally, the input filter and protection module 706 can provide electrostatic discharge (ESD) protection, load dump protection, alternator field decay protection, and / or reverse polarity protection.

[0102] The LED DC / DC module 712 can be coupled between the input filter and protection module 706 and the active headlight 718 to receive filtered power and provide drive current to power the LEDs in the LED array of the active headlight 718. The LED DC / DC module 712 can have an input voltage between 10 volts and 18 volts, with a nominal voltage of approximately 13.2 volts, and the output voltage can be slightly higher (e.g., 0.3 volts) than the maximum voltage of the LED array (e.g., as determined by factors or local calibration and operating condition adjustments due to load, temperature, or other factors).

[0103] The logic LDO module 714 can be coupled to the input filter and the protection module 706 to receive filtered power. The logic LDO module 714 can also be coupled to the microcontroller 716 and the active headlight 718 to supply power to the electronics (such as CMOS logic) in the microcontroller 716 and / or the active headlight 718.

[0104] The bus transceiver 708 can have, for example, a universal asynchronous receiver / transmitter (UART) or a serial peripheral interface (SPI) interface and can be coupled to the microcontroller 716. The microcontroller 716 can convert vehicle inputs based on or including data from the sensor module 710. The converted vehicle inputs can include video signals that can be transmitted to an image buffer in the active headlight 718. Additionally, the microcontroller 716 can load default image frames and test for open / short pixels during startup. In an embodiment, the SPI interface can load the image buffer in the CMOS. The image frames can be full frames, differential, or partial frames. Other features of the microcontroller 716 can include control interface monitoring of the CMOS state, including die temperature and the logic LDO output. In an embodiment, the LED DC / DC output can be dynamically controlled to minimize headroom. In addition to providing image frame data, other headlight functions can be controlled, such as complementary use in combination with side marker lights or turn signal lights, and / or activation of daytime running lights.

[0105] Figure 8 Schematic diagram of another example vehicle headlight system 800. Figure 8 The example vehicle headlight system 800 shown includes an application platform 802, two LED lighting systems 806 and 808, and secondary optics 810 and 812.

[0106] The LED lighting system 808 can emit a light beam 814 ( Figure 8 as shown between arrows 814a and 814b in Figure 8 ). The LED lighting system 806 can emit a light beam 816 ( Figure 8 as shown between arrows 816a and 816b in

[0107] When included, the secondary optical devices 810 / 812 can be or include one or more light guides. The one or more light guides can be edge-illuminated or can have internal openings that define the inner edges of the light guides. The LED lighting systems 808 and 806 can be inserted into the internal openings of the one or more light guides such that they inject light into the inner edges (internally-opened light guides) or outer edges (edge-illuminated light guides) of the one or more light guides. In an embodiment, the one or more light guides can shape the light emitted by the LED lighting systems 808 and 806 in a desired manner - such as, for example, having a gradient, chamfered distribution, narrow distribution, wide distribution, or angular distribution.

[0108] The application platform 802 can provide power and / or data to the LED lighting systems 806 and / or 808 via line 804, which can include Figure 7 one or more or a portion of the power line 702 and data bus 704. One or more sensors (which can be sensors in the vehicle headlight system 800 or other additional sensors) can be inside or outside the housing of the application platform 802. Alternatively or additionally, as Figure 7 shown in the example vehicle headlight system 700, each of the LED lighting systems 808 and 806 can include its own sensor module, connection and control module, power supply module, and / or LED array.

[0109] In an embodiment, the vehicle headlight system 800 can represent a motor vehicle with steerable beams, where the LEDs can be selectively activated to provide steerable light. For example, an array of LEDs or emitters can be used to define or project a shape or pattern, or to illuminate only a selected portion of the road. In an example embodiment, the infrared cameras or detector pixels within the LED lighting systems 806 and 808 can be sensors (e.g., similar to the Figure 7 sensors in the sensor module 710) that identify portions of the scene that require illumination (e.g., the road or a pedestrian intersection).

[0110] In some instances, the LED headlight unit 450 can be manufactured at least in part using a computer-aided design (CAD) software package. Non-limiting examples of CAD software are Solid Works, ProEngineer, AutoCAD, and CATIA. The CAD software can generate a three-dimensional model of the LED headlight unit 450. Additionally, the CAD software can generate instructions that, when executed by a computer numerical control (CNC) machine, cause the CNC machine to generate a model for a cavity required to model the LED headlight unit 450 according to the 3D model generated by the CAD software package. Examples of CNC machines that can be used to produce the LED headlight unit 450 include drill presses, lathes, milling machines, grinders, routers, and 3D printers. In some instances, the instructions, when executed by the CNC machine, cause the CNC to generate a mold that can subsequently be used to form the LED headlight unit 450. In some instances, the CAD software can also generate instructions for controlling a molding machine to form the LED headlight unit 450 using process 500. Examples of molding machines include 2K molding machines.

[0111] Having described embodiments in detail, those skilled in the art will appreciate that given this description, modifications can be made to the embodiments described herein without departing from the spirit of the disclosure. Accordingly, it is intended that the scope of the disclosure not be limited to the specific embodiments illustrated and described.

Claims

1. A method of manufacturing a light emitting diode (LED) headlamp unit, the method comprising: Inserting an LED module into a first cavity; Performing a first injection molding that injects a first thermoplastic into the first cavity to form a heat sink integrating the LED module; Moving the heat sink to a second cavity; Performing a second injection molding that injects a second thermoplastic in the second cavity to integrally form an optical component on the top surface of the heat sink integrating the LED module; And Demolding the optical component and the heat sink integrating the LED module to form the LED headlamp unit.

2. The manufacturing method according to claim 1, wherein the LED module includes a first reference feature, and The inserting aligns the LED module with the first cavity by using the reference feature.

3. The manufacturing method according to claim 1, wherein the optical component is a lens or a reflector.

4. The manufacturing method according to claim 1, wherein the LED module includes a fixing feature for aligning the LED module relative to the heat sink.

5. The manufacturing method according to claim 1, wherein the first thermoplastic is a thermally conductive polycarbonate or a polycarbonate blend.

6. The manufacturing method according to claim 1, wherein the second thermoplastic is the same material as the first thermoplastic.

7. A light emitting diode (LED) headlamp unit, comprising: A heat sink formed of a first thermoplastic and integrating an LED module; And An optical component integrally formed of a second thermoplastic on the top surface of the heat sink.

8. The LED headlamp unit according to claim 7, wherein the LED module includes a first reference feature that aligns the LED module with the first cavity forming the heat sink.

9. The LED headlamp unit according to claim 7, wherein the optical component is a lens or a reflector.

10. The LED headlamp unit according to claim 7, wherein the LED module includes a fixing feature for aligning the LED module relative to the heat sink.

11. The LED headlamp unit according to claim 7, wherein the first thermoplastic is a thermally conductive polycarbonate or a polycarbonate blend.

12. The method according to claim 1, wherein the second thermoplastic is the same material as the first thermoplastic.

13. A non-transitory computer-readable storage medium storing instructions for forming a light emitting diode (LED) headlamp unit, the instructions when executed by an injection molding machine cause the injection molding machine to perform a method comprising: Performing a first injection molding that injects a first thermoplastic into a first cavity to form a heat sink integrating an LED module device; Moving the heat sink to a second cavity; Performing a second injection molding that injects a second thermoplastic in the second cavity to form an optical component on the top surface of the heat sink integrating the LED module; and Demold an optical component and a heat sink integrated with an LED module to form an LED headlight unit.

14. The non-transitory computer-readable storage medium according to claim 13, wherein the LED module includes a reference feature that aligns the LED module with the first cavity.

15. The non-transitory computer-readable storage medium according to claim 13, wherein the optical component is a lens or a reflector.

16. The non-transitory computer-readable storage medium according to claim 13, wherein the LED module includes a fixing feature that aligns the LED module relative to the heat sink.

17. The non-transitory computer-readable storage medium according to claim 13, wherein the first thermoplastic is a thermally conductive polycarbonate or a polycarbonate blend.

18. The non-transitory computer-readable storage medium according to claim 13, wherein the second thermoplastic is the same material as the first thermoplastic.

19. A method of manufacturing a light-emitting diode (LED) headlight unit, the method comprising: Insert an LED module into a second cavity; Perform a first injection molding that injects a second thermoplastic into the second cavity to form an optical component; Move a heat sink into the second cavity; Perform a second injection molding that injects a first thermoplastic into a first cavity to form a heat sink that integrates the LED module on a bottom surface of the optical component; and Demold the optical component and the heat sink integrated with the LED module to form an LED headlight unit.

20. An LED headlight unit made by the method according to claim 19.

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