Helmet with temperature adjusting function

Abstract

The invention relates to a helmet with a temperature adjusting function, which adopts a semiconductor chilling plate to generate cold energy and utilizes a liquid working medium, a pipeline and a circulating pump to transport the cold energy into a helmet shell, and is characterized in that: 1) the semiconductor chilling plate is arranged outside the helmet shell, so that the semiconductor chilling plate is prevented from hurting the head of a wearer when the helmet is impacted; (2) a main power supply required by the semiconductor chilling plate is not mounted on the helmet, so that the refrigeration endurance time is prolonged, a large refrigerating capacity can be obtained, the weight and the size of the helmet are reduced, and the hidden danger of combustion explosion caused by the fact that the helmet is provided with a battery is eliminated; (3) the refrigerating system is detachably mounted, so that the weight of the helmet can be reduced in seasons without refrigeration, the problem of large-cooling-capacity refrigeration supply during long endurance of the refrigerating helmet is solved, the safety of the refrigerating helmet is improved, the weight of the refrigerating helmet is reduced, and the safety and comfort of a rider wearing the helmet can be improved.

Description

Technical Field

[0001] The present invention relates to a helmet with a temperature regulation function, specifically to a helmet whose internal temperature can be adjusted, and more specifically to an adjustable temperature helmet that generates cold based on the semiconductor thermoelectric effect and generates heat based on an electric heating wire or / and the semiconductor thermoelectric effect to regulate the internal temperature of the helmet. Background Art

[0002] A helmet is a device for protecting the heads of riders of sports vehicles such as electric vehicles, motorcycles, racing cars, and racing boats. However, for a long time, traditional helmets have been criticized by wearers because their temperature cannot be actively adjusted. As a result, the heat inside the helmet is difficult to dissipate in time during summer wear, and the wearer cannot obtain heat supplement from outside the human body during winter wear, leading to a very poor temperature experience when wearing the helmet. Therefore, enabling the helmet to have a temperature regulation function is one of the important functions that many riders are eager to obtain. To solve the helmet temperature regulation problem, various technical solutions have been proposed. One relatively ideal cooling method is to utilize the thermoelectric effect of semiconductors (i.e., the Peltier effect) to obtain cold to reduce the heat inside the helmet. This is because the cooling sheet based on the semiconductor thermoelectric effect has many advantages such as small volume, light weight, and no noise, which will not have too much negative impact on the comfort of wearing the helmet. Therefore, semiconductor refrigeration helmets have been favored by manufacturers in related fields, especially in the motorcycle field.

[0003] However, the existing technical solutions for cooling helmets by generating cooling capacity based on thermoelectric coolers still have deficiencies, which are specifically reflected in the following four aspects: 1) All existing thermoelectric cooling helmets place the thermoelectric cooler inside the helmet shell. This approach is bound to pose a safety hazard because the base of the thermoelectric cooler is made of ceramics. Once a riding collision occurs, the sharp edges and acute angles of these hard ceramic bases (including the sharp fragments generated after the impact) will easily penetrate the foam protective layer and harm the rider's head. Moreover, the layout of directly attaching the thermoelectric cooler to the rider's head will be even more dangerous. 2) Existing thermoelectric cooling helmets place the thermoelectric cooler inside the helmet shell and use air cooling to dissipate heat from the hot surface of the thermoelectric cooler. This approach will inevitably result in a relatively high noise inside the helmet, which has a negative impact on the rider's mental state because although the thermoelectric cooler itself does not generate noise during cooling, the cooling fan on its hot surface will generate noise. In the enclosed environment inside the helmet shell, the fan noise will undoubtedly have a significant impact on the wearer. 3) All existing thermoelectric cooling helmets directly install the power source for maintaining the operation of the thermoelectric cooler on the helmet. The disadvantages of this approach are as follows: one is that due to the limited battery capacity, the cooling endurance time is too short to meet the cooling requirements of long-distance travel for the helmet in terms of long time and large cooling capacity; the other is that due to the heavy weight of the battery, the rider is prone to fatigue and the comfort level deteriorates. At the same time, due to the large volume of the battery, the appearance design of the helmet is not good. In particular, directly installing the battery, especially a lithium battery, on the helmet also poses a safety hazard of combustion and explosion, so the safety performance is poor. 4) All existing thermoelectric cooling helmets connect the main component of their cooling capacity acquisition unit to the helmet shell in a non-detachable installation manner. As a result, it is not conducive to the user's flexible use and flexible maintenance. For example, in spring and autumn, there is no need to cool or heat the helmet, but this non-detachable installation form cannot non-destructively and temporarily detach the cooling device system from the helmet to reduce the weight of the helmet, thereby providing the comfort of wearing the helmet. In addition, the non-detachable installation form of the cooling device system is also not conducive to the user to replace, repair, and maintain it when necessary.

[0004] In summary, although the approach of using a thermoelectric cooler to generate cooling capacity to cool the inside of the helmet is feasible in principle, the existing traditional technical solutions have obvious deficiencies. And it is necessary to design and manufacture a helmet that can adjust the temperature. Therefore, developing a temperature regulation system that can not only utilize the advantages of thermoelectric cooling to achieve temperature adjustment inside the helmet but also effectively overcome the above-mentioned drawbacks of existing thermoelectric cooling helmets is undoubtedly an improvement and enhancement of the helmet's functions, and thus will surely be a meaningful task. Summary of the Invention

[0005] In view of the problems of insufficient safety, comfort, and refrigeration endurance of existing semiconductor refrigeration helmets, the present invention proposes a helmet with a temperature adjustment function. Its main objectives are as follows: While solving the problem of realizing the temperature adjustment inside the helmet based on the semiconductor thermoelectric effect, it can also maintain the original safety of the helmet and effectively prevent the semiconductor refrigeration chip substrate and its fragments from hurting the head of the helmet wearer when the helmet is impacted; in addition, it effectively solves the problems of insufficient refrigeration endurance time, insufficient refrigeration capacity, and excessive weight and volume of the helmet due to the self - contained power supply of the existing refrigeration helmet, and at the same time completely eliminates the potential safety hazard of combustion and explosion that may occur due to the self - contained battery of the helmet; further, it effectively solves the problem of excessive internal noise of the helmet caused by the configuration of a cooling fan when the existing semiconductor refrigeration chip needs to dissipate heat from its hot surface, thereby improving the comfort of wearing the helmet. Additionally, the present invention has another objective, which is to effectively solve the problem that the existing refrigeration helmet cannot be conveniently disassembled to reduce weight in seasons when temperature adjustment is not required, enabling it to be quickly removed as needed to reduce the weight of the helmet, thereby further improving the comfort of wearing the helmet.

[0006] The object of the present invention is achieved as follows: A helmet with a temperature adjustment function includes a shell and at least one semiconductor refrigeration chip. The semiconductor refrigeration chip includes a cold surface and a hot surface. It is characterized in that: The semiconductor refrigeration chip is installed on the shell of the helmet and is arranged outside the shell; the main power supply required for the operation of the semiconductor refrigeration chip is in a form that is not installed on the helmet; the helmet is provided with a pipeline, a liquid working medium, and a circulation pump; the circulation pump can drive the liquid working medium to flow and can drive the liquid working medium to flow through the cold surface of the semiconductor refrigeration chip or through a heat - conductive isolation layer attached to the cold surface of the semiconductor refrigeration chip, and can drive the liquid working medium to flow into and out of the internal space enclosed by the helmet shell via the pipeline.

[0007] Further, the helmet is provided with a cold - quantity exchange unit connected to the pipeline or / and at least a part of the pipeline is set as a cold - quantity exchange unit. The cold - quantity exchange unit is arranged in the internal space enclosed by the shell, and the liquid working medium can flow through the cold - quantity exchange unit.

[0008] Further, at least one cold - quantity exchange unit of the helmet or a part of a certain cold - quantity exchange unit is arranged on the inner wall of the shell or on the inner - lining protection layer of the shell at the positions corresponding to or adjacent to the forehead, temple, or / and cheek of the wearer.

[0009] Further, the helmet is provided with a heat dissipation unit, which can export the heat at the hot surface of the semiconductor refrigeration sheet and dissipate it into the atmosphere outside the helmet; the heat dissipation unit is at least one of the following three heat dissipation forms a), b) and c): a) Natural air cooling form, that is, a heat dissipation shell cover is provided, and the heat dissipation shell cover is provided with air guiding hole grooves, and the air guiding hole grooves can communicate the hot surface of the semiconductor refrigeration sheet or / and the heat sink attached to the hot surface with the atmosphere outside the helmet; b) Forced air cooling form, that is, a heat dissipation fan is provided, and the heat dissipation fan can drive the atmosphere outside the helmet to generate cooling air and make the cooling air blow across the hot surface of the semiconductor refrigeration sheet or / and the heat sink attached to the hot surface; c) Forced liquid cooling form, that is, a heat dissipation device is provided, and a liquid cooling working medium is used and a transport pump is used to drive the cooling working medium to flow through the heat dissipation device and through the hot surface of the semiconductor refrigeration sheet or / and the heat conduction and transmission pipe fittings attached to the hot surface.

[0010] Further, a wind speed sensor is provided on the helmet, and a wind speed threshold v o is preset, and the wind speed sensor can achieve the following regulation functions a) or / and b): a) When the wind speed sensor senses that the wind speed is less than or equal to the wind speed threshold v o, the wind speed sensor can convert the working voltage of the semiconductor refrigeration sheet and reduce it, that is, it can regulate the working voltage of the refrigeration working condition operated by the semiconductor refrigeration sheet from the original higher working voltage value to a lower working voltage value; b) When the heat dissipation form adopted by the heat dissipation unit includes the forced air cooling form, the wind speed sensor can regulate the operating condition of the heat dissipation fan configured by the heat dissipation unit, and its regulation logic is: if the wind speed sensor senses that the wind speed is greater than the wind speed threshold v o, the wind speed sensor cuts off the power supply of the heat dissipation fan, otherwise it will maintain the power supply circuit connected.

[0011] Further, the wind speed sensor is of a reed structure type, and it regulates the conduction or non-conduction of the triode by triggering the control pole of the triode, and then controls the operation of the semiconductor refrigeration sheet or / and the heat dissipation fan through the triode.

[0012] Further, a delay circuit is provided between the wind speed sensor and the triode, and the delay circuit presets a delay threshold ⊿τ. The contact of the wind speed sensor must be delayed for more than or equal to the delay threshold ⊿τ after the moment of engagement before the triode can be turned on.

[0013] The flow path layout of the liquid working medium flowing through the cold surface of the semiconductor refrigeration chip or flowing through the flow path that is attached to the cold surface of the semiconductor refrigeration chip and can conduct heat is in a zigzag and circuitous manner, that is, when the liquid working medium flows through the above-mentioned area, its flow direction has turned at least once by more than or equal to 90 degrees.

[0014] Furthermore, there are at least two semiconductor refrigeration chips, and at least two semiconductor refrigeration chips are arranged in a cold surface facing cold surface layout form. A fluid channel is formed between the two semiconductor refrigeration chips with cold surfaces facing each other, and the liquid working medium flows through this fluid channel.

[0015] A first temperature controller is provided on the helmet, and this first temperature controller can directly sense or indirectly sense the temperature of the liquid working medium at the first temperature measurement point; the first temperature measurement point is arranged at the outlet where the liquid working medium flows out of the cold surface of the semiconductor refrigeration chip or near this outlet; when the first temperature controller senses that the temperature of the liquid working medium at the first temperature measurement point is less than or equal to the first set threshold tc, then this first temperature controller can cut off the power supply of the semiconductor refrigeration chip to make it stop working.

[0016] Furthermore, the liquid working medium is water, and the value range of the first set threshold tc is between 1°C and 10°C.

[0017] A second temperature controller is provided on the helmet, and this second temperature controller can directly sense or indirectly sense the temperature of the second temperature measurement point; the second temperature measurement point is arranged at the hot surface of the semiconductor refrigeration chip or near this hot surface; when the second temperature controller senses that the temperature of the liquid working medium at the second temperature measurement point is greater than or equal to the second set threshold th, then this second temperature controller can cut off the power supply of the semiconductor refrigeration chip to make it stop working.

[0018] Furthermore, the value range of the second set threshold th is between 60°C and 80°C.

[0019] The assembly method of the semiconductor refrigeration temperature control system of the helmet and the shell adopts at least one of the following five detachable forms: a), b), c), d), e): a) A complete hole is opened on the body of the shell, and the pipeline passes through this hole to enter and exit the internal space enclosed by the shell. The cold quantity exchange unit and the pipeline can both be drawn out of the shell from this hole to the outside of the shell. The connection between the entire semiconductor refrigeration temperature control system and the shell adopts a separable connection structure form; b) A detachable covering member is provided outside the shell. After the pipeline passes through the space sandwiched between the covering member and the shell and then enters the internal space of the shell from the lower edge of the notch of the shell around the outside of the shell. The connection between the entire semiconductor refrigeration temperature control system and the shell adopts a separable connection structure form; c) A notch-shaped groove is formed at the lower edge of the notch of the housing, and the pipeline passes through the groove and winds from the outside of the housing into the internal space of the housing. The connection between the entire semiconductor refrigeration temperature control system and the housing adopts a separable mating structure form; d) A notch-shaped groove is formed at the lower edge of the notch of the housing, and a detachable insert matching the groove is provided. When the insert is mated with the housing, a hole is formed at the groove by the two of them. The pipeline passes through the hole and penetrates from the outside of the housing into the internal space of the housing. The connection between the entire semiconductor refrigeration temperature control system and the housing adopts a separable mating structure form; e) A complete hole is formed in the body of the housing, and the pipeline is assembled with the housing in a form of passing through the hole. The connection between the semiconductor refrigeration sheet, the heat sink, and the cooling fan and the housing, the pipeline, and the liquid working medium adopts a separable mating structure form.

[0020] The helmet is provided with a heating wire, and the heating wire is arranged on the inner lining protection layer and / or the cold quantity exchange unit of the helmet.

[0021] The present invention provides a helmet with a temperature control function, which uses a semiconductor refrigeration chip to generate cold energy, and uses liquid working fluid, pipelines and circulating pumps to transport the cold energy to the inside of the helmet shell to adjust the temperature of the helmet. The biggest highlights of this temperature control helmet are: 1) The temperature-regulating semiconductor refrigeration chip is set on the outside of the shell, so when the helmet is hit accidentally, the wearer's head can be protected from being hurt by the ceramic semiconductor refrigeration chip body and its fragments with the help of the shell, thereby effectively protecting the safety of the rider; 2) The power supply required for the operation of the semiconductor refrigeration chip is not installed on the helmet, which can not only greatly improve the refrigeration life of the semiconductor refrigeration chip and achieve a larger cooling capacity, but also reduce the weight and volume of the helmet, and at the same time completely eliminate the safety hazards of combustion and explosion caused by the helmet's built-in battery; 3) Furthermore, this temperature control helmet adopts special measures to target the semiconductor refrigeration chip. The heat dissipation of the hot surface of the body cooling plate, the cooling fan is arranged outside the helmet shell, or even no cooling fan is required at all and natural air cooling is adopted, which can effectively reduce the problem of excessive noise inside the helmet caused by the need for heat dissipation of the semiconductor cooling plate; 4) Further, the temperature-adjusting function helmet adopts an installation structure in which the refrigeration system and the helmet shell can be detachably assembled, so it can be conveniently selected whether to remove or continue to be installed on the helmet according to the needs, so in the season when the temperature adjustment is not required, the refrigeration system can be conveniently removed from the helmet (conversely, when the temperature adjustment is required, the refrigeration system can also be quickly reinstalled on the helmet), solving the problem of effectively reducing the total mass of the helmet when the temperature adjustment is not required, so the comfort of wearing the helmet can be improved. Obviously, the present invention not only effectively solves the problem of cold supply of the cooling helmet, but also effectively achieves the multi-goal realization of the temperature-adjusting function helmet that can be cooled for a long time, does not produce excessive weight and volume, and does not negatively affect the wearing safety, so it greatly improves the sense of safety and comfort of the rider wearing the helmet. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The above and / or additional aspects and advantages of the present invention will become apparent and easily understood from the description of the embodiments in conjunction with the following drawings, in which: Figure 1 It is an axonometric schematic diagram of an embodiment of a helmet with a temperature regulating function of the present invention, in which the heat dissipation of the hot surface of the semiconductor refrigeration plate is cooled by natural wind; Figure 2 yes Figure 1 A side orthographic view of a helmet of the illustrated embodiment; Figure 3 yes Figure 1 a top view of the illustrated embodiment; Figure 4 yes Figure 1 a rear view of the illustrated embodiment; Figure 5 yesFigure 1 Full cross-sectional view when the illustrated embodiment is cut along the symmetry plane of the helmet; Figure 6 Rear view of a helmet of an embodiment of a helmet with a temperature control function according to the present invention when the hot surface of the semiconductor refrigeration sheet is cooled by forced air; Figure 7 is Figure 6 Schematic diagram of the illustrated embodiment of the helmet when the wind speed is greater than the set threshold and the cooling fan stops operating; Figure 8 is Figure 6 Schematic diagram of the illustrated embodiment of the helmet when the wind speed is less than the set threshold and the cooling fan operates by drawing air; Figure 9 Circuit schematic diagram of a helmet with a temperature control function according to the present invention provided with a reed structure type wind speed sensor and the wind speed sensor adjusting and controlling the working state of the refrigeration system under different wind speed conditions; Figure 10 Schematic diagrams of several layout cases of the refrigeration sheet and the liquid working medium flow channel of a helmet with a temperature control function according to the present invention; Figure 11 Schematic diagram of an embodiment of a helmet with a temperature control function according to the present invention, in which the pipeline and the cold quantity exchange unit of the refrigeration system can be inserted into and withdrawn from the holes of the shell. Detailed implementation manners

[0023] The embodiments of the present invention will be described in detail below. The examples of the embodiments are shown in the drawings, in which the same or similar reference numerals denote the same or similar elements or elements having the same or similar functions throughout. The embodiments described below with reference to the drawings are exemplary and are only used to explain the present invention and should not be construed as a limitation to the present invention.

[0024] In the description of the present invention, it should be understood that the orientation descriptions, such as up, down, front, back, left, right, etc., indicate the orientation or position relationship based on the orientation or position relationship shown in the drawings. It is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to the present invention.

[0025] In the description of the present invention, the meaning of several is one or more, the meaning of multiple is two or more, greater than, less than, exceeding, etc. are understood as not including the present number, and above, below, within, etc. are understood as including the present number. If there is a description of first and second, it is only for the purpose of distinguishing technical features and should not be understood as indicating or implying relative importance or implicitly indicating the number of the indicated technical features or implicitly indicating the sequence relationship of the indicated technical features.

[0026] In the description of the present invention, unless otherwise clearly defined, terms such as "set", "installed", "connected", etc. should be understood in a broad sense, and those skilled in the art can reasonably determine the specific meanings of the above terms in the present invention in combination with the specific content of the technical solution.

[0027] Referring to Figures 1 to 11 , the present invention provides a helmet with a temperature regulation function, which includes a shell 1 and at least one thermoelectric cooler 2. The thermoelectric cooler 2 includes a cold surface 2a and a hot surface 2b (as shown in Figure 5 , Figure 7 and Figure 8 ). The technical principle of realizing the temperature regulation function of the helmet is: using the thermoelectric effect (i.e., the Peltier effect) of the thermoelectric cooler 2 to obtain cold quantity and using this cold quantity to reduce the heat inside the helmet, so as to achieve the effect of cooling the head of the helmet wearer, and finally improving the comfort of wearing the helmet in a relatively hot riding environment. The greatest feature of the present invention is reflected in the layout, control and installation of its refrigeration system: first, the thermoelectric cooler 2 is installed on the shell 1 of the helmet and is arranged outside the shell 1 (as shown in Figure 5 , Figure 7 and Figure 8 ); second, the main power supply required for the operation of the thermoelectric cooler 2 is not installed on the helmet, that is, the main power supply for generating cold quantity of the refrigeration system is an external power supply outside the helmet; third, pipelines 3, liquid refrigerant 4 and a circulation pump 5 are provided, and the circulation pump 5 is used to drive the liquid refrigerant 4 to flow and drive the liquid refrigerant 4 to flow through the cold surface 2a of the thermoelectric cooler 2 or through a heat-conducting isolation layer 6 attached to the cold surface 2a of the thermoelectric cooler 2 (see Figure 5 , Figure 7 and Figure 8),(and it) can drive the liquid working medium 4 to flow into and out of the internal space enclosed by the helmet shell 1 through the pipeline 3; Fourth, the thermoelectric cooler 2 has a layout form in which part or all of the refrigeration system it participates in forming is a detachable structure relative to the shell 1. Here: 1) Mounting the thermoelectric cooler 2 on the helmet shell 1 and arranging it outside the shell 1 means firmly mounting the thermoelectric cooler 2 in the external area of the shell 1, that is, when the rider wears the helmet, there will be the body of the shell 1 between his head and the thermoelectric cooler 2. The advantage of such a layout is that when an accidental impact occurs, it can effectively prevent the substrate and fragments of the thermoelectric cooler 2 from directly hurting the rider's head. 2) The main power supply required for the operation of the thermoelectric cooler 2 is not mounted on the helmet, which means that the power supply required for the operation of the helmet's refrigeration system to generate cold is in the form of an external power supply. For example, it can be a vehicle-mounted power supply such as a motorcycle's storage battery or / and generator, or even a portable power supply carried or backpacked by the rider. The advantages of such a layout are: on the one hand, it can solve the power supply problem of long-term and large-cooling-capacity refrigeration for temperature-adjustable helmets; on the other hand, it can greatly reduce the weight and volume of the helmet, not only improving the comfort of wearing the helmet and the flexibility of the appearance, but also effectively eliminating the safety hazard of battery explosion and combustion when the helmet is hit due to the self-contained power supply, thus improving safety and reliability; here, it should be particularly pointed out that the main power supply mentioned in the present invention means the dominant power supply or can also be called the main power source, that is, the power supply that runs continuously or frequently to maintain refrigeration output and undertakes the main or even all of the power contribution. It not only undertakes the role of the main power supply for refrigeration output, but also can undertake the power supply task for the execution of control command signals. In other words, the present invention can include or accommodate those auxiliary batteries with less power carried on the helmet (these auxiliary batteries are secondary power sources, which are light in weight and small in mass, but can undertake the power supply of control signals and can also assist or support temporary refrigeration power supply when necessary); particularly; the main power supply described in the present invention can be the only power source of the helmet, and it can obtain external power by connecting to an external power supply through a joint structure. The best structural type of the joint is a plug-in type, Figure 4 and Figure 6The circuit connector 9 shown is exactly this situation, that is, the circuit connector 9 has reserved jacks, and at this time, just insert the plug connected to the external power supply to obtain power supply. 3) By setting the pipeline 3, the liquid refrigerant 4 and the circulation pump 5, the cold generated by the semiconductor refrigeration sheet 2 can be carried and transported into the internal space enclosed by the helmet shell 1 by using the liquid refrigerant 4 and its fluidity. In this way, the refrigeration and temperature adjustment function of the helmet can be realized, and further, there is no need to set a fan inside the helmet shell 1 to specifically cool the hot surface 2b of the semiconductor refrigeration sheet 2, thereby reducing noise and improving the comfort of wearing the helmet. It should be noted that the liquid refrigerant 4 can directly obtain cold by flowing through the cold surface 2a of the semiconductor refrigeration sheet 2. In addition, it can also indirectly obtain cold by flowing through the heat-conducting spacer layer 6 attached to the cold surface 2a of the semiconductor refrigeration sheet 2. The heat-conducting spacer layer 6 can be various metal parts, including but not limited to aluminum sheets, copper sheets, stainless steel sheets, etc.; of course, the heat-conducting spacer layer 6 can also be made of or contain other non-metallic materials with good heat-conducting properties, such as plastics, nylons, etc.; even, the heat-conducting spacer layer 6 can also include various heat-conducting fillers or sealants such as silica gel, paint glue, etc. For example, a heat-conducting silica gel is coated between the metal sheet and the cold surface 2a (on the one hand, it can effectively eliminate the contact unevenness between the two and the "air" of the poor heat-conducting substance existing thereby, and on the other hand, it can conveniently separate the semiconductor refrigeration sheet 2 and the heat-conducting spacer layer 6 when necessary to realize the disassembly of the components of the refrigeration system as needed). At this time, the metal sheet and the silica gel together can jointly constitute the so-called heat-conducting spacer layer 6; in addition, the circulation pump 5 refers to various fluid pumps driven by a motor, including but not limited to peristaltic pumps, diaphragm pumps, plunger pumps, gear pumps, and rotor pumps, etc. Its function is to drive the liquid refrigerant 4 to flow into and out of the internal space enclosed by the helmet shell 1 through the pipeline 3, flow through the semiconductor refrigeration sheet 2 and the cold quantity exchange unit 7 mentioned below, thereby realizing the cold quantity and heat exchange between the helmet refrigeration system and the human head. Among various fluid pumps, peristaltic pumps and diaphragm pumps are preferred pump types because the sealing of these two pump types is relatively easy to achieve and the volume is small, and at the same time, it is easy to achieve the convenient disassembly of the components of the refrigeration system; in addition, the circulation pump 5 can be arranged outside the shell 1 (such as Figure 5 , Figure 7 and Figure 8shown) can also be arranged inside the internal space enclosed by the housing 1 (not shown in the figure); further, the pipeline 3 can be made of various existing materials and various structural forms, and its main function is to guide and regulate the flow of the liquid working medium 4. In particular, when necessary, the pipeline 3 can also act as a cold quantity exchange unit 7 for heat exchange (for example, the part of the pipeline 3 arranged inside the helmet can perform the function of cold quantity and heat exchange between the refrigeration system and the human head); in addition, in order to form a space for the liquid working medium 4 to stay at the cold surface 2a, a housing 4a can be provided; here, there are two preferred layout designs for the circulation flow scheme of the liquid working medium 4 in the refrigeration system: one design is circulation pump 5 → cold surface 2a of the semiconductor refrigeration sheet 2 or heat-conducting isolation layer 6 → pipeline 3 → cold quantity exchange unit 7 → pipeline 3 → circulation pump 5 (such as Figure 5 、 Figure 7 and Figure 8As shown, another design is that the circulating pump 5 → pipeline 3 → cooling capacity exchange unit 7 → pipeline 3 → the cold surface 2a of the semiconductor refrigeration sheet 2 or the heat-conducting spacer 6 → pipeline 3 → circulating pump 5 (not shown in the figure). It should be particularly noted that the liquid working medium 4 can be various flowing liquid working media, especially water. As mentioned above, the present invention can specifically set the cooling capacity exchange unit 7 connected to the pipeline 3, and even at least a part of the pipeline 3 itself is set as the cooling capacity exchange unit 7. The cooling capacity exchange unit 7 is arranged in the internal space enclosed by the housing 1, and the liquid working medium 4 can flow through this cooling capacity exchange unit 7; here, the "internal space enclosed by the housing 1" refers to the space wrapped by the main body of the housing 1, which corresponds to the space where the housing 1 surrounds the head when the rider wears the helmet; in addition to the housing 1 and various accessories installed on the housing 1, the helmet of the present invention particularly includes various components arranged in the internal space enclosed by the housing 1, such as the inner lining protection layer 1a and the lining cloth, etc. Among them, the inner lining protection layer 1a is made of light materials such as foam, cotton wool or other energy-absorbing materials, and its main function is to absorb the impact energy to protect the rider's head from being injured, while the function of the lining cloth includes improving the contact feeling with the human body (improving comfort), holding the accessories (fixing or hanging various accessories), increasing the impact slip rate (allowing the helmet to instantaneously generate a certain amount of slip relative to the head during impact to achieve the unloading and protection effect), etc. Particularly, when the pipeline 3 undertakes the function of the cooling capacity exchange unit 7, the pipe section that exchanges heat with the rider's head can be attached to the inner surface of the inner lining protection layer 1a. Further, at least one cooling capacity exchange unit 7 or a part of a certain cooling capacity exchange unit 7 of the helmet of the present invention is arranged at the positions corresponding to the rider's forehead, temple or / and cheek on the inner lining protection layer 1a of the housing 1 or on the inner wall of the housing 1 or in the vicinity of these positions, because these positions are sensitive areas of human temperature perception, so that the rider can quickly experience the cool feeling effect. Regarding the "layout form in which the local or even the whole of the refrigeration system formed by the semiconductor refrigeration sheet 2 is adopted as a detachable structure relative to the housing 1", its layout, function and advantages will be explained in detail in the preferred embodiments later and will not be elaborated here. Obviously, the present invention not only effectively solves the problem of cold quantity supply of the refrigerated helmet, but also effectively achieves multiple goals of the temperature-adjusting function helmet, such as long-duration refrigeration, no excessive weight and volume, and no negative impact on wearing safety, so it can greatly improve the sense of security and comfort of the rider wearing the helmet.

[0028] To solve the heat dissipation problem of the hot surface 2b of the semiconductor refrigeration chip 2, a heat dissipation unit A can be provided on the helmet. The heat dissipation unit A can export the heat at the hot surface 2b of the semiconductor refrigeration chip 2 and dissipate it into the atmosphere outside the helmet. As a preferred embodiment, the heat dissipation unit A can adopt one of the following three heat dissipation forms a), b), c) or various combinations thereof: a) Natural air cooling form, that is, a heat dissipation shell cover a1 is provided. The heat dissipation shell cover a1 is installed outside the shell 1 and is provided with a wind guiding hole groove a2 (see Figures 1 to 5 ). The wind guiding hole groove a2 can communicate the hot surface 2b of the semiconductor refrigeration chip 2 or / and the heat dissipation fin a3 attached to the hot surface 2b with the atmosphere outside the helmet. At this time, the heat dissipation unit A includes components or structures such as a heat dissipation shell cover a1, a wind guiding hole groove a2, a heat dissipation fin a3, and a heat dissipation air duct a4 (see Figure 5 and the C-C sectional view in this figure). Among them, the heat dissipation shell cover a1 or / and the heat dissipation fin a3 participate in forming the heat dissipation air duct a4. When the rider is traveling at a certain speed, the wind guiding hole groove a2 can use the relative speed to introduce the gas outside the helmet, and under the guidance of the heat dissipation shell cover a1, blow and pass over the heat dissipation fin a3 through the heat dissipation air duct a4, and finally flow out to the outside of the helmet through an appropriate air outlet a5 ( Figure 5 shows one form of the air outlet a5 arranged at the rear end of the helmet). Thus, the heat on the hot surface 2b of the semiconductor refrigeration chip 2 is dissipated into the atmosphere outside the helmet. Here: A heat-conducting silicone can be coated between the heat dissipation fin a3 and the hot surface 2b. At this time, the heat dissipation unit A will include this silicone. It should be noted that the wind guiding hole groove a2 of the present invention can either share with the traditional windshield provided on the helmet, that is, the two are integrated (not shown in the figure), or it can be set independently (as Figures 1 to 8 shown). In addition, the number of the wind guiding hole grooves a2 can be one or multiple.

[0029] b) Forced air cooling form, that is, a heat dissipation fan b1 is provided. The heat dissipation fan b1 can drive the atmosphere outside the helmet to generate cooling air and make the cooling air blow and pass over the hot surface 2b of the semiconductor refrigeration chip 2 or / and blow and pass over the heat dissipation fin a3 attached to the hot surface 2b (as mentioned above, a silicone can be coated between the heat dissipation fin a3 and the hot surface 2b). At this time, the heat dissipation unit A includes components or structures such as a heat dissipation shell cover a1, a wind guiding hole groove a2, a heat dissipation air duct a4, a heat dissipation fan b1, a heat dissipation fin a3, and silicone (see Figure 7 and Figure 8 ). When the heat dissipation fan b1 is powered on and operates (as Figure 8As shown, it will generate cooling air and blow and sweep across the heat sink a3 through the heat dissipation air duct a4, thereby achieving the purpose of dissipating heat from the hot surface 2b; it should be noted that the cooling air generated by the cooling fan b1 is preferably in the form of exhaust air (as Figure 8 shown). At this time, the flow path of the cooling air generated by it is: external atmosphere → air guide hole groove a2 (at this time, the air outlet a5 arranged at the rear tail of the helmet can also function as an air inlet in terms of function) → heat dissipation air duct a4 formed by the heat dissipation housing a1 and the heat sink a3 → cooling fan b1 → external atmosphere. The advantage of such an arrangement is that the cooling air generated by the cooling fan b1 does not conflict with the relative natural wind derived from the vehicle speed, so the two can complement each other; here, it should be noted that when the cooling fan b1 loses power and stops operating, at this time, the air outlet of the cooling fan b1 can become an air inlet (as Figure 7 shown). In this case, it will jointly form an air inlet for guiding the external air of the helmet into the heat dissipation air duct a4 with the air guide hole groove a2 (or the air outlet of the cooling fan b1 can also be configured as another air guide hole groove a2); the number of the cooling fans b1 described in the present invention can be one or more, which can be set according to specific circumstances. In the Figures 6 to 8 shown case, two cooling fans b1 are adopted.

[0030] c) Forced liquid cooling form, that is, a heat dissipation device is provided, and a liquid cooling working medium is used and a transport pump is used to drive the cooling working medium to flow through the heat dissipation device and through the hot surface 2b of the semiconductor refrigeration sheet 2 or / and the heat conduction transmission pipe fitting attached to the hot surface 2b. At this time, the heat dissipation unit A includes components or structures such as a heat dissipation device, a cooling working medium, a transport pump, and a heat conduction transmission pipe fitting (not shown in the figure); the forced liquid cooling form uses the liquid cooling working medium to dissipate the heat of the hot surface 2b to the external atmosphere, and its heat dissipation path is: hot surface 2b or heat conduction transmission pipe fitting → cooling working medium → heat dissipation device → external atmosphere; it should be noted that the best substance for the cooling working medium is water, and the best form of the transport pump is a peristaltic pump; in particular, the transport pump can be used interchangeably or commonly with the circulation pump 5, that is, the circulation pump 5 is the transport pump, and vice versa.

[0031] In order to protect the refrigeration system of the helmet of the present invention, a wind speed sensor 8 can be provided on the helmet. The fan sensor 8 can be designed as a contact switch type device. One of the simplest embodiments is to adopt a reed structure type for its contact form (see Figure 5 , Figure 7 , Figure 8 and Figure 11 ). At this time, its control logic is: the wind force generated by the wind speed v competes with the elastic force generated by the reed, and the result of their competition ultimately determines the contact engagement state and then adjusts the operating conditions of the refrigeration system accordingly;Figure 5 , Figure 7 , Figure 9 (a) and Figure 11 The situation shown is that when the wind force is dominant, it forces the reed k0 to deform sufficiently, causing the reed k0 to be separated from the first contact k1 and at the same time causing the reed k0 to be in contact with the second contact k2. Figure 9 (b) and Figure 9 (c) show that when the wind force is at a disadvantage, it cannot force the reed k0 to deform sufficiently, so the reed k0 remains in contact with the first contact k1 and separated from the second contact k2. Of course, the first contact k1 and the second contact k2 of the above reed structure can be swapped (or their functional roles can be interchanged). In other words, the wind speed sensor 8 can also be designed such that when the wind force is dominant, the reed k0 is in contact with the first contact k1 and separated from the second contact k2 at the same time, and conversely, when the wind force is at a disadvantage, the reed k0 is separated from the first contact k1 and in contact with the second contact k2 (not shown in the figure). It should be noted that the wind generated by the cooling fan b1 does not participate in the game against the elastic force generated by the reed k0. In other words, the wind force generated by the cooling fan b1 does not contribute to the deformation of the reed k0, just like Figure 8 the situation shown. In particular, considering that a large current places relatively high requirements on the contacts (such as a large over-current contact area and prevention of ablation caused by arc discharge, etc.), the contacts of the reed structure type wind speed sensor 8 can be designed to act as the base b of the trigger triode G (i.e., the control electrode of the triode G). At this time, the triode G controls the large working current, and the wind speed sensor 8 only plays the "key role" of controlling the on-off of the triode G circuit. Figure 9 (c) shows exactly this situation. The first resistor Rt1 and the second resistor Rt2 in this figure belong to the category of adjusting resistors. It should be pointed out that the triode G described in the present invention includes not only ordinary general transistors, but also thyristors and silicon-controlled rectifiers that can withstand relatively large powers, etc. Here, taking the case of including an NPN type triode G as an example, the following specifically illustrates how the wind speed sensor 8 controls the current flow in the cooling system circuit: 1) The first state is as Figure 9As shown in (c), at this time, the current flows from the positive pole of the helmet circuit connector 9 → the main circuit switch k (which is in the closed state at this time) → the reed k0 of the wind speed sensor 8 is engaged with the first contact k1 → the first resistor Rt1 → a smaller current reaches the base b (also called the control pole) of one of the triodes G → the emitter junction of this triode G is in the forward bias state → thus a larger current flows from the positive pole of the circuit connector 9 through the collector c to the emitter e of the triode G → the external resistor R1 and the internal resistance Ro of the fan (the sum of the two is equivalent to the voltage-dividing resistor Rh) → the semiconductor refrigeration sheet 2 (the internal resistance of the refrigeration sheet is Rr) → the negative pole of the circuit connector 9; 2) The second state (not shown in the figure): The current flows from the positive pole of the helmet circuit connector 9 → the main circuit switch k (which is in the closed state at this time) → the reed k0 of the wind speed sensor 8 is engaged with the second contact k2 → the second resistor Rt2 → a smaller current reaches the base b (also called the control pole) of the other triode G → the emitter junction of this triode G is in the forward bias state → thus a larger current flows from the positive pole of the circuit connector 9 through the collector c to the emitter e of the triode G → the semiconductor refrigeration sheet 2 (the internal resistance of the refrigeration sheet is Rr) → the negative pole of the circuit connector 9. It must be pointed out that the above circuit layout is only several preferred embodiments listed in the present invention. In addition, a circuit design with the above-mentioned implementation functions can also be adopted, which will not be listed one by one here. The present invention can preset a wind speed threshold v o, and based on this wind speed threshold v o, the wind speed sensor 8 can achieve the following regulation functions of a) or / and b): a) When the wind speed sensor 8 senses that the wind speed v is less than or equal to the wind speed threshold v o, then this wind speed sensor 8 can convert the working voltage of the semiconductor refrigeration sheet 2 and reduce it, that is, it can regulate the working voltage of the refrigeration working condition in which the semiconductor refrigeration sheet 2 operates and make it change from the original higher working voltage value to a lower working voltage value (see Figure 9 ); Here, when the wind speed v is less than or equal to the wind speed threshold v o, it means that the riding speed is low, in other words, the wind speed is small; As is well known, the refrigeration efficiency of the semiconductor refrigeration sheet 2 is subject to the heat dissipation efficiency of its hot surface 2b. If the heat dissipation effect of the hot surface 2b is not good, it may even cause the semiconductor refrigeration sheet 2 to burn out. Therefore, when the wind speed v is small, in order to protect the semiconductor refrigeration sheet 2 from burning out, it is necessary to reduce the refrigeration power of the semiconductor refrigeration sheet 2; A specific embodiment is: setting the wind speed threshold v o to 1.5 m / s, which is equivalent to the speed of a person walking normally (about 5 km / h). Thus, when the wind speed v is greater than 1.5 m / s, the semiconductor refrigeration sheet 2 (assuming its internal resistance of the refrigeration sheet is Rr) obtains the normal voltage V1 and takes the normal input power as P1=(V1) 2 / Rr; and when the wind speed sensor 8 senses the wind speed v is less than or equal to 1.5 m / s, the wind speed sensor 8 will connect the voltage-dividing resistor Rh in series with the semiconductor refrigeration sheet 2, so that the operating power of the semiconductor refrigeration sheet 2 will be reduced to P2=(V1) 2 Rr / (Rr + Rh); it should be noted that when the refrigeration system is provided with a cooling fan b1, the voltage-dividing resistor Rh may include the fan internal resistance Ro of the cooling fan b1. At this time, the voltage-dividing resistor Rh is equivalent to an equivalent resistance and satisfies the relationship Rh = R1 + Ro, where the external resistor R1 is connected in series with the cooling fan b1; of course, for the pure natural air-cooling form without the cooling fan b1, there is naturally no fan internal resistance Ro, and the voltage-dividing resistor Rh at this time is equal to the external resistor R1, that is, Rh = R1 (not shown in the figure); the following gives a specific example with the working voltage as the operating condition criterion to illustrate the regulation principle of the wind speed sensor 8: for the convenience of explanation, it is assumed here that the refrigeration system of this helmet can obtain the voltage V1 supplied by the external power supply from the circuit connector 9 (see Figure 4 、 Figure 6 and Figure 9 ) on the helmet is 12V, and the wind speed threshold v o is 1.5 m / s. At the same time, it is assumed that the value of the voltage-dividing resistor Rh is equal to the value of the internal resistance Rr of the refrigeration sheet. So when the semiconductor refrigeration sheet 2 is in the wind speed v greater than 1.5 m / s, the voltage V1 of its refrigeration operating condition is 12V. At this time, the reed k0 of the wind speed sensor 8 is in a engaged state with the second contact k2, refer to Figure 9 (a); and when the wind speed v is less than or equal to 1.5 m / s, the voltage V1 of its refrigeration operating condition is 6V. In other words, when the wind speed v is less than or equal to 1.5 m / s, the semiconductor refrigeration sheet 2 will operate at a low refrigeration output power. At this time, the reed k0 of the wind speed sensor 8 is in a engaged state with the first contact k1, which can be referred to Figure 9 (b) and Figure 9 (c), thus effectively avoiding the situation that the refrigeration system may be burned out due to poor heat dissipation.

[0032] b) When the heat dissipation form adopted by the heat dissipation unit A includes forced air cooling, the wind speed sensor 8 can regulate the operating condition of the cooling fan b1 configured by the heat dissipation unit A. Its regulation logic is: if the wind speed sensor 8 senses the wind speed v is greater than the wind speed threshold v o, the wind speed sensor 8 will cut off the power supply of the cooling fan b1, that is, the wind speed sensor 8 presents an open circuit state for the cooling fan b1, as Figure 7 andFigure 9 as shown in (a); otherwise, when the wind speed sensor 8 senses the wind speed v is less than or equal to the wind speed threshold v o, it will maintain the state of powering on the cooling fan b1, as Figure 8 shown in 9 (b) and 9(c); the purpose of such regulation and setting arrangement of the present invention is that when the wind speed sensor 8 senses the wind speed v is greater than the wind speed threshold v o, it is very likely that the speed of the rider driving the locomotive is relatively high. At this time, the external cooling wind can quickly pass by and blow the heat sink a3 under the guidance of the heat dissipation housing a1 and the air guide hole groove a2. Thus, the cooling wind can produce a good cooling effect on the hot surface 2b of the semiconductor refrigeration sheet 2. In other words, the operation of the semiconductor refrigeration sheet 2 is safe enough. At this time, stopping the power supply of the cooling fan b1 can obtain the positive effect of protecting the cooling fan b1; on the contrary, when the wind speed sensor 8 senses the wind speed v is less than or equal to the wind speed threshold v o, it means that the speed of the rider driving the locomotive is relatively slow. At this time, the natural wind generated by the vehicle speed alone can no longer meet the demand for dissipating the heat of the hot surface 2b of the semiconductor refrigeration sheet 2. So, the cooling fan b1 is powered on to forcibly dissipate the heat of the hot surface 2b of the semiconductor refrigeration sheet 2, Figure 8 as shown in 9 (b) and 9(c). In this case, the cooling fan b1 will play a leading cooling role.

[0033] In order to avoid the negative impact on the refrigeration system device caused by the bad electric shock caused by the frequent start and stop of the helmet refrigeration system, for example, when the wind speed sensor 8 senses the wind speed v due to extremely short-term wind speed changes, vehicle bumps or the wearer's head shaking and other reasons, it causes it to be at the wind speed threshold vFrequently start and stop the refrigeration system within a small range near o. For this purpose, a delay circuit based on timing control (not shown in the figure) can be set up. This delay circuit is arranged between the wind speed sensor 8 and the triode G and has a preset delay threshold Δτ. When the contacts (reed k0, first contact k1, second contact k2) of the wind speed sensor 8 are engaged, it must delay for more than or equal to this delay threshold Δτ before the triode G (not shown in the figure) can be turned on; a specific embodiment is to use a resistor R and a capacitor C to form a so-called delay circuit (whose time constant is equal to the product of their values). Thus, by selecting appropriate values of the resistor R and the capacitor C, a delay threshold Δτ that meets the requirements can be designed, and based on this, the triode G can be triggered for delay. For example, an example is to select the preset delay threshold Δτ to be equal to 3s according to actual needs. Under this condition, as long as the duration of each engagement between the reed k0 and the first contact k1 or the second contact k2 exceeds or is equal to 3s, the triode G can be turned on, and then the circuit where the semiconductor refrigeration sheet 2 or / and the cooling fan b1 is located can be connected, and finally they can execute the work according to the preset operation logic; it should be noted that if the duration of each engagement between the reed k0 and the first contact k1 or the second contact k2 does not reach the delay threshold Δτ, the refrigeration system will maintain the work task of the previous cycle, clear the original time accumulation, and wait for the occurrence of the next new trigger event again.

[0034] Considering the severe restrictions of the helmet on space and weight, the selected semiconductor refrigeration sheet 2 in the present invention cannot be too large in volume and area. Under this restriction, in order to enable the liquid refrigerant 4 to obtain as much heat exchange as possible from the cold surface 2a of the semiconductor refrigeration sheet 2 within a limited space and time, the layout form of the flow channel 10 through which the liquid refrigerant 4 flows through the cold surface 2a of the semiconductor refrigeration sheet 2 or through the heat-conducting spacer 6 attached to the cold surface 2a of the semiconductor refrigeration sheet 2 is adopted as a tortuous and circuitous manner, that is, when the liquid refrigerant 4 flows through the above area, its flow direction has at least turned by more than or equal to 90 degrees once. Figure 10 (a) shows an embodiment in which the liquid refrigerant 4 experiences and only experiences a 180-degree reverse turn under the constraint of the flow channel 10 when flowing through the cold surface 2a of the semiconductor refrigeration sheet 2 (wherein, the housing 4a participates in forming the flow channel 10 and thereby participates in restricting the flow direction of the liquid refrigerant 4 in the cold surface 2a area, and the flow direction is as shown by the solid arrow in the figure, the same below). Figure 10 (b) shows a layout embodiment in which the liquid refrigerant 4 experiences two 180-degree reverse turns under the constraint of the flow channel 10 when flowing through the cold surface 2a of the semiconductor refrigeration sheet 2; it should be noted that the layout of the flow channel 10 of the present invention is not limited to Figure 10The shown solution can actually include various other forms or configurations of layout solutions, such as spiral flow channels 10, multi-strand flow channels 10, etc. Among them, the number of turns and bends of the flow channel 10 can be planned and determined according to actual needs and based on the area and shape of the thermoelectric cooler 2. In Figure 10 (a), a single-piece layout form of the thermoelectric cooler 2 is adopted. When the liquid working medium 4 flows through the heat-conducting isolation layer 6 attached to the cold surface 2a of the thermoelectric cooler 2, the tortuous layout of its flow channel 10 can allow the liquid working medium 4 to have a sufficient passing time when flowing through this heat-conducting isolation layer 6, so that it can calmly obtain cold from the cold surface 2a of the thermoelectric cooler 2; while in Figure 10 (b), a two-piece thermoelectric cooler 2 is adopted and they are arranged in a layout form with cold surfaces 2a facing each other, and at the same time, the gap formed by them is configured as a tortuous fluid channel, that is, the above-mentioned flow channel 10. In this way, the liquid working medium 4 can also obtain as much cold exchange as possible from the cold surface 2a of the thermoelectric cooler 2 within a limited space and time. Obviously, Figure 10 (b) has less restriction on the planar size of the cold surface 2a. It can not only shorten the length of the thermoelectric cooler 2, but also enhance the cold exchange speed between the cold surface 2a and the liquid working medium 4 per unit time.

[0035] In order to ensure the normal operation of the refrigeration system, the present invention is provided with a first temperature controller 11 on the helmet. The first temperature controller 11 can directly or indirectly sense the temperature t of the liquid working medium 4 at the first temperature measurement point 12. See Figure 10 (b); the first temperature measurement point 12 is arranged at the outlet where the liquid working medium 4 flows out of the cold surface 2a of the thermoelectric cooler 2 or near this outlet; when the first temperature controller 11 senses that the temperature t of the liquid working medium 4 at the first temperature measurement point 12 is less than or equal to the first set threshold value tc, then the first temperature controller 11 can cut off the power supply of the thermoelectric cooler 2 to make it stop working. On the contrary, when the first temperature controller 11 senses that the temperature t of the liquid working medium 4 at the first temperature measurement point 12 is greater than the first set threshold value tc, then the first temperature controller 11 will continue to keep the circuit of the thermoelectric cooler 2 connected, as Figure 10 (b) shows. A preferred embodiment of the first temperature controller 11 is to adopt a reed switch 13, that is, to connect the reed switch 13 in series with the circuit where the thermoelectric cooler 2 is located. See Figure 10(b): When the reed switch 13 senses that the temperature t of the liquid refrigerant 4 at the first temperature measurement point 12 is less than or equal to the first set threshold tc, the contacts of the reed switch 13 separate, thus disconnecting the circuit where the semiconductor refrigeration sheet 2 is located and stopping its refrigeration operation; conversely, when the reed switch 13 senses that the temperature t of the liquid refrigerant 4 at the first temperature measurement point 12 is greater than the first set threshold tc, the contacts of the reed switch 13 close, so it keeps the circuit where it is located connected. In other words, the semiconductor refrigeration sheet 2 can be powered on. Further, the liquid refrigerant 4 described in the present invention is water, and the value range of the first set threshold tc is between 1 °C and 10 °C. The consideration for such a setting is to prevent the occurrence of ice blockage. The best case is that the value range of the first set threshold tc is between 4 °C and 7 °C. In this way, it can not only prevent the liquid refrigerant 4 from freezing and blocking the flow channel 10, but also ensure that the liquid refrigerant 4 can carry enough cold.

[0036] In order to ensure the normal operation of the refrigeration system, the present invention also provides a second temperature controller 14 on the helmet. The second temperature controller 14 can directly or indirectly sense the temperature t at the second temperature measurement point 15. See Figure 10 (a); the second temperature measurement point 15 is arranged at or near the hot surface 2b of the semiconductor refrigeration sheet 2. When the second temperature controller 14 senses that the temperature t at the second temperature measurement point 15 is greater than or equal to the second set threshold th, the second temperature controller 15 can disconnect the power supply of the semiconductor refrigeration sheet 2 and force it to stop refrigeration operation, as Figure 10 (a) shows; conversely, when the second temperature controller 14 senses that the temperature t at the second temperature measurement point 15 is less than the second set threshold th, the second temperature controller 15 keeps the circuit where the semiconductor refrigeration sheet 2 is located connected (not shown in the figure). Further, the value range of the second set threshold th is between 60 °C and 80 °C. The consideration for such a setting is to prevent the semiconductor refrigeration sheet 2 from overheating.

[0037] The present invention enables the convenient disassembly of the semiconductor refrigeration and temperature regulation system of the helmet, that is, allows users to choose whether to retain the semiconductor refrigeration and temperature regulation system of the helmet according to the needs of different scenarios. For example, in spring, autumn and winter, users can choose not to use the semiconductor refrigeration and temperature regulation system and remove it to reduce the weight of the helmet. At this time, the helmet will return to a traditional non-refrigerating helmet. Or, for the convenience of repairing, maintaining or replacing the semiconductor refrigeration and temperature regulation system, it can be temporarily disassembled. Therefore, the present invention specifically designs the semiconductor refrigeration and temperature regulation system into a detachable and separable assembly structure and layout, that is, when needed, part or even the whole of the semiconductor refrigeration and temperature regulation system can be disassembled from the shell 1 of the helmet. In other words, it can be conveniently disassembled and installed with simple tools or even bare hands. Here, the semiconductor refrigeration and temperature regulation system includes necessary components such as semiconductor refrigeration chips 2, pipelines 3, liquid refrigerant 4, circulation pumps 5, cold quantity exchange units 7, etc., and also includes optional components such as heat-conducting isolation layers 6, heat dissipation units A, etc. To achieve this purpose, the present invention can adopt at least one of the following five conveniently detachable forms a), b), c), d), e) for the assembly method of part or even the whole of the semiconductor refrigeration and temperature regulation system with the helmet shell 1: a) A complete hole 16 is provided on the body of the shell 1. The pipeline 3 passes through the hole 16 to enter and exit the internal space enclosed by the shell 1. And the cold quantity exchange unit 7 and the pipeline 3 (both can be made flexible) and the liquid refrigerant 4 encapsulated therein can be inserted into and withdrawn from the shell 1 through the hole 16. At this time, the connection between the entire semiconductor refrigeration and temperature regulation system and the shell 1 belongs to a separable connection structure form. Figure 11 This is the case shown; b) A detachable cover 17 is provided outside the shell 1. The pipeline 3 passes through the space sandwiched between the cover 17 and the shell 1 and then enters the internal space of the shell 1 from the outside of the shell 1 around the lower edge of the notch of the shell 1 (not shown in the figure). At this time, the connection between the entire semiconductor refrigeration and temperature regulation system and the shell 1 adopts a separable connection structure form. Here, the cover 17 can play a role in protecting the pipeline 3 and participates in the appearance expression of the helmet. c) A notch-shaped groove is provided at the lower edge of the notch of the shell 1. The pipeline 3 enters the internal space of the shell 1 from the outside of the shell 1 through the groove 17 (not shown in the figure). At this time, the connection between the entire semiconductor refrigeration and temperature regulation system and the shell 1 adopts a separable connection structure form. d) The described housing is provided with a notch-shaped groove at the lower edge of its notch, and a detachable insert matching the groove is provided. When the insert is mated with the housing 1, a hole 16 is formed at the groove between the two of them. The pipeline 3 penetrates from the outside of the housing 1 into the internal space of the housing 1 through the hole 16 (not shown in the figure). At this time, the connection of the entire semiconductor refrigeration and temperature control system to the housing 1 adopts a separable mating structure form; e) A complete hole 16 is provided on the body of the housing 1. The pipeline 3 is assembled with the housing 1 in a form of passing through the hole 16. The connection between the semiconductor refrigeration sheet 2, the heat sink a3, and the cooling fan b1 and the housing 1, the pipeline 3, the liquid working medium 4, and the circulation pump 5 adopts a separable mating structure form; This embodiment belongs to a semi-dismantling method, that is, some components of the semiconductor refrigeration and temperature control system such as the semiconductor refrigeration sheet 2, the heat sink a3, and the cooling fan b1 can be disassembled from the helmet, and even the circulation pump 5 can be disassembled from the helmet. In particular, for circulation pumps 5 such as peristaltic pumps and diaphragm pumps, this solution can be used for design and assembly. In this case, the components remaining on the helmet housing 1 in the refrigeration system are only the pipeline 3, the liquid working medium 4, the heat-conducting isolation layer 6, and the cold quantity exchange unit 7, etc. Therefore, the mass of the helmet can be significantly reduced. Figure 5 , Figure 7 and Figure 8 The case shown can be classified into this situation.

[0038] It should be emphasized that the above five separable forms can be combined with each other. For example, the solutions of b) and c) can be combined together, that is, the covering member 17 and the groove are adopted at the same time, and thus a detachable and separable mating solution for the semiconductor refrigeration and temperature control system and the helmet housing 1 is formed.

[0039] In order to meet the temperature adjustment needs in winter, the present invention can be provided with heating wires (not shown in the figure) in the helmet. Further, the heating wires are arranged on the inner lining protection layer 1a and / or the cold quantity exchange unit 7 of the helmet, thereby forming a heating system of the helmet. In this way, the rider can use the heating wires to keep warm in winter, thereby improving the comfort of wearing the helmet. It should be noted that the power supply of the heating wires in the present invention still adopts a form that is not installed on the helmet. In other words, the power supply for the heating operation of the heating system of this helmet is an external power supply, such as a portable charging power supply carried in a bag or on the back by the rider, or even a vehicle-mounted power supply such as a storage battery and / or a generator on a motorcycle. It should also be noted that the heating system of the present invention also includes the heat provided by the hot surface 2b of the semiconductor refrigeration sheet 2 (not shown in the figure). At this time, only the liquid working medium 4 needs to flow through the hot surface 2b of the semiconductor refrigeration sheet 2 and then be transported to the inside of the helmet shell 1, which will not be elaborated here. In addition, it is worth noting that the heating wires can be flexible, and it can also be in a separable connection structure form that can be detached from the inside of the helmet.

[0040] The outstanding advantages of a helmet with a temperature adjustment function according to the present invention compared with the prior art are as follows: adopting the layout scheme of an external semiconductor refrigeration sheet 2 effectively avoids the damage of the matrix and fragments of the semiconductor refrigeration sheet 2 to the head of the helmet wearer when the helmet is impacted; adopting an external power supply scheme that is not installed on the helmet effectively solves the problems of insufficient refrigeration endurance time, insufficient refrigeration capacity, and excessive weight and volume of the existing refrigeration helmets due to their built-in power supplies, and completely eliminates the potential safety hazards of combustion and explosion that may occur due to the built-in battery of the helmet. In addition, it effectively solves the problem of long-term heating of the helmet in winter. Further, the present invention also abandons the practice of setting a fan inside the shell 1 of the traditional refrigeration helmet, effectively solving the problem of excessive noise inside the helmet caused by the configuration of the fan for heat dissipation in the traditional semiconductor refrigeration system, thereby improving the comfort of wearing the helmet; furthermore, the present invention particularly solves the problem of excessive load of the existing refrigeration helmet due to the failure to disassemble the refrigeration system in seasons when temperature adjustment is not required, enabling it to be quickly disassembled as needed to reduce the weight of the helmet, thereby improving the comfort of wearing the helmet.

[0041] The above embodiments are only several preferred embodiments of the present invention, and do not limit the protection scope of the present invention accordingly. Therefore, all equivalent changes made according to the structure, shape, and principle of the present invention should be covered within the protection scope of the present invention.

Claims

1. A helmet with a temperature regulation function, which comprises a shell and at least one semiconductor refrigerating sheet. The semiconductor refrigerating sheet includes a cold surface and a hot surface, and is characterized in that: The described thermoelectric cooler is mounted on the shell of the helmet and is arranged outside the shell; the main power supply required for the operation of the thermoelectric cooler is in a form that is not mounted on the helmet; the helmet is provided with pipelines, a liquid working medium, and a circulation pump; the circulation pump can drive the liquid working medium to flow and can drive the liquid working medium to flow through the cold surface of the thermoelectric cooler or through a heat-conducting spacer layer attached to the cold surface of the thermoelectric cooler, and can drive the liquid working medium to flow into and out of the internal space enclosed by the helmet shell via the pipeline.

2. The temperature-adjustable helmet according to claim 1, wherein: A cold quantity exchange unit is provided and connected to the pipeline, or / and at least a part of the pipeline is configured as a cold quantity exchange unit. The cold quantity exchange unit is arranged in the internal space enclosed by the shell, and the liquid working medium can flow through the cold quantity exchange unit.

3. The temperature-adjustable helmet according to claim 2, wherein: At least one cold quantity exchange unit or a part of a certain cold quantity exchange unit of the helmet is arranged on the inner wall of the shell or on the inner lining protection layer of the shell at the positions corresponding to or adjacent to the forehead, temple, or / and cheek of the wearer.

4. The temperature-adjustable helmet according to claim 3, wherein: The helmet is provided with a heat dissipation unit, which can export the heat at the hot surface of the thermoelectric cooler and dissipate it into the atmosphere outside the helmet; the heat dissipation unit is at least one of the following three heat dissipation forms: a), b), and c): a) Natural air cooling form, that is, a heat dissipation shell cover is provided, and the heat dissipation shell cover is provided with air guiding hole grooves, and the air guiding hole grooves can communicate the hot surface of the thermoelectric cooler or / and the heat sink attached to the hot surface with the atmosphere outside the helmet. b) Forced air cooling form, that is, a heat dissipation fan is provided, and the heat dissipation fan can drive the atmosphere outside the helmet to generate cooling air and make the cooling air blow across the hot surface of the thermoelectric cooler or / and the heat sink attached to the hot surface. c) Forced liquid cooling form, that is, a heat dissipation device is provided, and a liquid cooling working medium is used, and a transport pump is used to drive the cooling working medium to flow through the heat dissipation device and through the hot surface of the thermoelectric cooler or / and the heat conduction and transmission pipe fittings attached to the hot surface.

5. The temperature-adjustable helmet according to claim 4, wherein: A wind speed sensor is provided on the helmet, and a wind speed threshold is preset. v o, the wind speed sensor can achieve the following control functions of a) or / and b): a) When the wind speed sensor senses that the wind speed is less than or equal to the wind speed threshold v o, the wind speed sensor can convert and reduce the working voltage of the semiconductor refrigeration chip, that is, it can regulate the working voltage of the refrigeration condition in which the semiconductor refrigeration chip operates, so that it is regulated from the original higher working voltage value to a lower working voltage value; b) When the heat dissipation form adopted by the heat dissipation unit includes the forced air cooling form, the wind speed sensor can regulate the operating conditions of the heat dissipation fan configured by the heat dissipation unit, and its regulation logic is: If the wind speed sensor senses that the wind speed is greater than the wind speed threshold v o, then the wind speed sensor cuts off the power supply to the cooling fan; otherwise, it maintains the power supply circuit in an on state.

6. The temperature-adjustable helmet according to claim 5, characterized in that: The wind speed sensor is of a reed structure type. It regulates the conduction or non-conduction of the triode by triggering the control electrode of the triode, and then controls the operating conditions of the thermoelectric cooler or / and the heat dissipation fan through the triode.

7. The temperature-adjustable helmet according to claim 6, wherein: A delay circuit is provided between the wind speed sensor and the triode. The delay circuit is preset with a delay threshold ⊿τ. The contact of the wind speed sensor must be delayed by more than or equal to the delay threshold ⊿τ after the moment of engagement before the triode can be turned on.

8. The temperature-adjustable helmet according to any one of claims 1 to 7, characterized in that: The flow path layout form of the liquid working medium flowing through the cold surface of the thermoelectric cooler or through the heat-conducting spacer layer attached to the cold surface of the thermoelectric cooler is in a tortuous and circuitous manner, that is, when the liquid working medium flows through the above area, its flow direction has at least turned by more than or equal to 90 degrees once.

9. The temperature-adjustable helmet according to claim 8, wherein: There are at least two semiconductor refrigeration chips, and at least two semiconductor refrigeration chips adopt a layout form with cold surfaces facing each other. A fluid channel is formed between the two semiconductor refrigeration chips with cold surfaces facing each other, and the liquid working medium flows through this fluid channel.

10. The temperature-adjustable helmet according to any one of claims 1 to 7, characterized in that: The helmet is provided with a first temperature controller which can directly or indirectly sense the temperature of the liquid working medium at the first temperature measurement point. The first temperature measurement point is arranged at the outlet where the liquid working medium flows out of the cold surface of the semiconductor refrigeration chip or near this outlet. When the first temperature controller senses that the temperature of the liquid working medium at the first temperature measurement point is less than or equal to the first set threshold value tc, the first temperature controller can cut off the power supply of the semiconductor refrigeration chip to make it stop working.

11. The helmet with a temperature adjustment function according to claim 10, characterized in that: The liquid working medium is water, and the value range of the first set threshold value tc is between 1°C and 10°C.

12. The temperature-adjustable helmet according to any one of claims 1 to 7, characterized in that: The helmet is provided with a second temperature controller which can directly or indirectly sense the temperature at the second temperature measurement point. The second temperature measurement point is arranged at the hot surface of the semiconductor refrigeration chip or near this hot surface. When the second temperature controller senses that the temperature at the second temperature measurement point is greater than or equal to the second set threshold value th, the second temperature controller can cut off the power supply of the semiconductor refrigeration chip to make it stop working.

13. The temperature-adjustable helmet according to claim 12, characterized in that: The value range of the second set threshold value th is between 60°C and 80°C.

14. The temperature-adjustable helmet according to any one of claims 1 to 7, characterized in that: The fitting method of the semiconductor refrigeration temperature control system of the helmet and the shell adopts at least one of the following five detachable forms: a), b), c), d), e): a) A complete hole is opened on the body of the shell, and the pipeline passes through this hole to enter and exit the internal space enclosed by the shell. The cold quantity exchange unit and the pipeline can both be drawn out of the shell from this hole to the outside of the shell. The connection between the entire semiconductor refrigeration temperature control system and the shell adopts a separable mating structure form. b) A detachable covering member is arranged outside the shell. After the pipeline passes through the space sandwiched by the covering member and the shell, it then enters the internal space of the shell from the outside of the shell around the lower edge of the notch of the shell. The connection between the entire semiconductor refrigeration temperature control system and the shell adopts a separable mating structure form. c) A notch-shaped groove is opened at the lower edge of the notch of the shell, and the pipeline enters the internal space of the shell from the outside of the shell through this groove. The connection between the entire semiconductor refrigeration temperature control system and the shell adopts a separable mating structure form. d) A notch-shaped groove is opened at the lower edge of the notch of the shell, and a detachable insert matching with this groove is provided. When the insert is mated with the shell, a hole is formed at the groove by the two of them. The pipeline enters the internal space of the shell from the outside of the shell through this hole. The connection between the entire semiconductor refrigeration temperature control system and the shell adopts a separable mating structure form. e) A complete hole is provided in the body of the housing, and the pipeline is assembled with the housing in a form of passing through the hole. The connection between the semiconductor refrigerating sheet, the heat sink and the cooling fan and the housing, the pipeline and the liquid working medium adopts a separable mating structure form.

15. The temperature-adjustable helmet according to any one of claims 1 to 7, characterized in that: The helmet is provided with heating wires, and the heating wires are arranged on the inner lining protection layer and / or the cold quantity exchange unit of the helmet.

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