Laminating and grinding robot for silicon wafer
Through the combination of six-axis robots and high-efficiency vacuuming systems, the consistency and cleanliness problems in traditional silicon wafer grinding are solved, and high-precision and low-cost silicon wafer surface treatment are achieved, which improves the yield and production efficiency of semiconductor manufacturing.
Patent Information
- Application Number
- CN202510599847.4
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-05-09
- Publication Date
- 2025-07-11
- Estimated Expiration
- Not applicable · inactive patent
AI Technical Summary
The traditional silicon wafer grinding process relies on manual operation, making it difficult to ensure the consistency of the grinding depth and path, resulting in uneven local thickness on the silicon wafer surface, scratches, and it is difficult to effectively remove silicon chips and dust, which affects chip performance and production efficiency, and is seriously wasted.
The six-axis robotic linkage camera module and light source module are used for automatic positioning and real-time surface detection, combined with the servo motor-driven grinding wheel and ring-shaped toothed plate design, to achieve uniform grinding; the deionized water tank is built-in agitator rod for real-time flushing, and the vacuum cleaner mechanism captures micron-level dust through negative pressure air flow and high-precision filtration system, and silicon chips are recycled and recycled.
The surface flatness error of silicon wafers is within ±1μm, which significantly improves the yield rate of semiconductor manufacturing, reduces equipment pollution, extends maintenance cycle, reduces production costs, and reduces waste of raw materials.
Smart Images
Figure CN120287205A_ABST
Abstract
Description
Technical Field
[0001] The present invention relates to the technical field of grinding devices, and particularly to a bonding and grinding robot for silicon wafers. Background Art
[0002] As the core substrate of semiconductor integrated circuits, the surface flatness and cleanliness of silicon wafers directly affect the yield and performance of chip manufacturing, and are crucial links in the semiconductor industrial chain. The surface of silicon wafers needs to be precisely ground to meet extremely high flatness and cleanliness requirements. Traditional grinding processes mostly rely on manual operation or semi-automatic equipment to cut the surface of silicon wafers with a rotating tool, but there are significant defects in actual applications.
[0003] Manual operation is easily affected by experience, and it is difficult to ensure the consistency of grinding depth and path, resulting in uneven local thickness or scratches on the surface of silicon wafers, causing insufficient precision of silicon wafers and affecting subsequent chip manufacturing processes. The silicon chips and dust generated during the grinding process are extremely easy to adhere to the surface of the equipment and silicon wafers. The presence of silicon chips will form defects in subsequent processes and affect chip performance. Moreover, the traditional dust collection system has low efficiency and is difficult to achieve complete capture of micron-sized particles. The continuous friction between the tool and the silicon chips easily causes equipment wear, and the adhesive dust will also block the moving parts, requiring frequent shutdowns for cleaning, seriously affecting production efficiency. The silicon-containing debris is difficult to recycle due to mixed impurities, resulting in waste of raw materials and increased production costs. Therefore, we propose a bonding and grinding robot for silicon wafers. Summary of the Invention
[0004] In order to make up for the deficiencies of the prior art and solve at least one of the technical problems proposed in the background art, the present invention proposes a bonding and grinding robot for silicon wafers.
[0005] The technical solution adopted by the present invention to solve its technical problems is: a bonding and grinding robot for silicon wafers, including a base, an original machine table is installed at the upper end of the base, a silicon wafer body is arranged at the upper end of the original machine table, a robot base is fixedly connected to the upper end of the base, a heightening column is installed at the upper end of the base, a six-axis robot is installed at the upper end of the heightening column, an installation frame is fixedly connected to the output shaft wall of the six-axis robot, a camera module is installed on one side of the installation frame, a light source module is installed below the camera module on one side of the installation frame, a grinding mechanism for grinding the silicon wafer is installed at the front end of the installation frame, the grinding mechanism includes two sets of symmetric fixed brackets, and a suction mechanism for guiding the flow of silicon chips and flushing liquid is installed at the upper end of one of the two sets of fixed brackets.
[0006] Preferably, the grinding mechanism includes an installation box fixedly connected to the mounting frame. The two sides of the installation box are respectively fixedly connected to two groups of fixed brackets. A servo motor is installed inside the installation box. The output shaft of the servo motor is fixedly connected to a speed reducer. The output shaft of the servo motor penetrates through the speed reducer. The lower end of the output shaft of the servo motor is fixedly connected to a grinding wheel. A diamond coating is provided on the outer side of the grinding wheel. An electrostatic repulsion design is provided on the outer side of the grinding wheel to reduce the adhesion of silicon chips.
[0007] Preferably, a first protective cover is installed at the lower end of the speed reducer. A blocking brush is fixedly connected to the lower end of the first protective cover. The blocking brush is made of a soft material and is used to isolate the grinding area from the transmission components to prevent silicon chips from entering.
[0008] Preferably, fixed rods are fixedly connected to the inner sides of the two groups of fixed brackets. The lower ends of the two groups of fixed rods are jointly fixedly connected to an annular toothed plate. The lower end of the annular toothed plate is fixedly connected to an annular fixing plate. A first gear is meshed with the outer side of the annular toothed plate. The upper end of the first gear is rotationally connected to a mounting plate through a rotating shaft. The upper end of the mounting plate is rotationally connected to a second gear through a rotating shaft. The lower end of the second gear is fixedly connected to the first gear. Two symmetrically arranged limiting rollers are rotationally connected to the upper end of the mounting plate. The closer sides of the two limiting rollers are rotationally connected to the annular fixing plate.
[0009] Preferably, a deionized water tank is fixedly connected to the upper end of the mounting plate. A stirring rod is rotationally connected to the inside of the deionized water tank. The lower end of the stirring rod is fixedly connected to the second gear. A spray head is fixedly connected to the lower end of the deionized water tank. The outer side of the spray head penetrates through the mounting plate. An electromagnetic valve is installed inside the spray head and is used to wash the silicon chips on the surface of the silicon wafer in real time.
[0010] Preferably, a synchronous belt is rotationally connected to the outer side of the second gear. A third gear is rotationally connected to the inside of the synchronous belt. The inside of the third gear is fixedly connected to the output shaft of the servo motor. The synchronous belt adopts a pre-tensioning design.
[0011] Preferably, a limiting plate is fixedly connected to the lower end of the third gear. The lower end of the limiting plate is designed in a circumferential wave shape. A pressing plate is rotationally connected to the lower end of the limiting plate. The outer side of the pressing plate is rotationally connected to the output shaft of the servo motor through a sleeve near the middle position. Second protective covers are fixedly connected to both ends of the pressing plate. A hydrophobic layer is provided on the inner wall of the second protective covers. Two symmetrically arranged sliding grooves are opened on the outer side of the second protective covers. A rubber pressing ring is fixedly connected to the lower end of the second protective covers. Flow guiding grooves are provided on the inner walls of the second protective covers and the rubber pressing rings.
[0012] Preferably, sliding rods are fixedly connected to the sides of the two groups of fixed brackets close to each other. The sliding rods are slidably connected to the inner sides of the chutes of the second protective cover. A spring is arranged below the fixed brackets on the outer sides of the sliding rods. One end of the spring is fixedly connected to the fixed bracket, and the other end of the spring is fixedly connected to the second protective cover.
[0013] Preferably, the dust suction mechanism includes an air pump fixedly connected to a group of fixed brackets. One end of the air pump is fixedly connected to a buffer cylinder. The buffer cylinder is designed as a three-way pipe. The front and rear ends of the buffer cylinder are input ports, and the upper end of the buffer cylinder is an output port. Two symmetrically arranged suction pipes are fixedly connected to the input ports of the buffer cylinder. The other ends of the suction pipes are fixedly connected to the second protective cover. An exhaust pipe is fixedly connected to the output port of the buffer cylinder. Anti-static coatings are applied to the inner walls of the suction pipes and the buffer cylinder.
[0014] Preferably, a recovery cylinder is fixedly connected to the inside of the buffer cylinder. A blade is rotatably connected to the upper end of the recovery cylinder through a bracket. A cleaning brush is fixedly connected to the upper end of the blade. A filter screen is rotatably connected to the upper end of the cleaning brush. An exhaust cylinder is fixedly connected to the upper end of the filter screen. The upper end of the exhaust cylinder is fixedly connected to the exhaust pipe. A falling pipe is fixedly connected to the lower end of the recovery cylinder. The outer side of the falling pipe penetrates through a group of fixed brackets. A collection box is fixedly connected to the lower end of the falling pipe.
[0015] Compared with the prior art, the present invention provides a bonding and grinding robot for silicon wafers, which has the following
[0016] Beneficial effects:
[0017] 1. Through the linkage of the six-axis robot, the camera module and the light source module, the automatic positioning and real-time surface profile detection of the silicon wafer are realized, ensuring that the grinding path accurately adapts to the curved surface radian of the silicon wafer. The servo motor drives the grinding wheel and combines with the variable speed adjustment function, which can adapt to silicon wafers of different thicknesses and crystal orientations. With the circumferential motion design of the annular toothed plate and the gear set, the grinding pressure is evenly distributed, avoiding local over-grinding or under-grinding. The surface flatness error of the silicon wafer can be controlled within ±1μm, significantly improving the yield rate of semiconductor manufacturing.
[0018] 2. The deionized water tank is internally provided with a stirring rod to dynamically mix the dispersant, which is evenly sprayed through the spray head to wash the surface of the silicon wafer in real time and disperse the silicon chips to prevent their agglomeration and adsorption. The wave-shaped limiting plate of the second protective cover and the rubber pressing ring are linked in design. The spring reset generates high-frequency micro-vibrations to automatically remove the silicon chips remaining on the inner wall of the cover. The air pump and the diversion groove form a negative pressure air flow, and the micron-sized dust is introduced into the high-precision filtration system through the suction pipe. The filter screen can capture particles above 0.1μm, reducing the pollution of the silicon chips to the equipment and the environment, and extending the maintenance period by more than 50%.
[0019] 3. After the silicon chips generated by grinding are settled in the buffer cylinder and intercepted by the high-precision filter screen, they are centrally recovered into the collection box. The high-purity silicon chips can be recycled through chemical treatment, reducing waste of raw materials. The pressurized exhaust pipe uses the purified air flow to blow back and purge the camera module and the light source module, synchronously removing water stains and residual dust, and reducing the consumption of cleaning agents. Through the three measures of debris flushing, dust classification and recovery, and air flow circulation, the overall system meets the ultra-clean requirements of semiconductor manufacturing and significantly reduces production costs. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] Figure 1 is a schematic diagram of the overall structure of the present invention;
[0021] Figure 2 is a schematic cross-sectional view of the overall structure of the present invention;
[0022] Figure 3 is a schematic cross-sectional view of the overall structure of the grinding mechanism of the present invention;
[0023] Figure 4 is a schematic cross-sectional view of a partial structure of the grinding mechanism of the present invention Figure 1 ;
[0024] Figure 5 is a schematic cross-sectional view of a partial structure of the grinding mechanism of the present invention Figure 2 ;
[0025] Figure 6 is a schematic cross-sectional view of a partial structure of the grinding mechanism of the present invention Figure 3 ;
[0026] Figure 7 is of the present invention Figure 6 is an enlarged schematic view of the structure of part A;
[0027] Figure 8 is of the present invention Figure 6 is an enlarged schematic view of the structure of part B;
[0028] Figure 9 is of the present invention Figure 6 is an enlarged schematic view of the structure of part C;
[0029] Figure 10 is a schematic diagram of the overall structure of the dust suction mechanism of the present invention;
[0030] Figure 11 is a schematic cross-sectional view of the overall structure of the dust suction mechanism of the present invention.
[0031] In the figure: 1, base; 2, original machine table; 3, silicon wafer body; 4, six-axis robot; 5, mounting bracket; 6, camera module; 7, light source module; 8, grinding mechanism; 81, mounting box; 82, servo motor; 83, reducer; 84, grinding wheel; 85, first protective cover; 86, blocking brush; 87, rubber pressing ring; 88, fixing bracket; 89, fixing rod; 810, annular toothed plate; 811, annular fixing plate; 812, first gear; 813, mounting plate; 814, limiting roller; 815, second gear; 816, stirring rod; 817, spray head; 818, synchronous belt; 819, third gear; 820, deionized water tank; 821, limiting plate; 822, pressing plate; 823, second protective cover; 824, sliding rod; 825, spring; 9, dust suction mechanism; 91, air pump; 92, buffer cylinder; 93, recovery cylinder; 94, suction pipe; 95, blade; 96, exhaust cylinder; 97, exhaust pipe; 98, down pipe; 99, collection box; 910, filter screen; 911, cleaning brush; 10, robot base; 11, heightening column. Specific implementation mode
[0032] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention.
[0033] Please refer to Figures 1-11 , a bonding and grinding robot for silicon wafers, including a base 1, an original machine table 2 is installed at the upper end of the base 1, a silicon wafer body 3 is arranged at the upper end of the original machine table 2, a robot base 10 is fixedly connected to the upper end of the base 1, a heightening column 11 is installed at the upper end of the base 1, a six-axis robot 4 is installed at the upper end of the heightening column 11, a mounting bracket 5 is fixedly connected to the output shaft wall of the six-axis robot 4, a camera module 6 is installed on one side of the mounting bracket 5, a light source module 7 is installed below the camera module 6 on one side of the mounting bracket 5, and a grinding mechanism 8 for grinding silicon wafers is installed at the front end of the mounting bracket 8. The grinding mechanism 8 includes two groups of symmetric fixing brackets 88. One of the two groups of fixing brackets 88 is installed at the upper end for guiding the flow of silicon chips and flushing liquid to the dust suction mechanism 9.
[0034] In this embodiment, the grinding mechanism 8 includes a mounting box 81 fixedly connected to the mounting bracket 5. The two sides of the mounting box 81 are respectively fixedly connected to the two groups of fixing brackets 88. A servo motor 82 is installed inside the mounting box 81. The output shaft of the servo motor 82 is fixedly connected to a reducer 83. The output shaft of the servo motor 82 passes through the reducer 83. The lower end of the output shaft of the servo motor 82 is fixedly connected to a grinding wheel 84. The outer side of the grinding wheel 84 is provided with a diamond coating, and the outer side of the grinding wheel 84 is provided with an electrostatic repulsion design.
[0035] Specifically, the installation box 81 serves as the core load-bearing structure, integrating the servo motor 82 and the reduction gear 83. The output shaft of the servo motor 82 adjusts the rotational speed through the reduction gear 83, and then drives the grinding wheel 84 to grind the silicon wafer body 3. The dust suction mechanism 9 and the protective cover assembly are connected by the fixing bracket 88 to form a rigid support frame, and the electrostatic repulsion design is used to reduce the adhesion of silicon chips.
[0036] In this embodiment, a first protective cover 85 is installed at the lower end of the reduction gear 83, and a blocking brush 86 is fixedly connected to the lower end of the first protective cover 85. The blocking brush 86 is made of a soft material.
[0037] Specifically, the first protective cover 85 is used to isolate the reduction gear 83 from the external environment. The blocking brush 86 made of a soft material seals the gap between the first protective cover 85 and the second protective cover 823, preventing silicon chips from entering the synchronous belt 818 area and cleaning the residues on the surface of the synchronous belt 818.
[0038] In this embodiment, fixing rods 89 are fixedly connected to the inner sides of the two groups of fixing brackets 88. The lower ends of the two groups of fixing rods 89 are jointly fixedly connected to an annular toothed plate 810. The lower end of the annular toothed plate 810 is fixedly connected to an annular fixing plate 811. The outer side of the annular toothed plate 810 is meshed with a first gear 812. The upper end of the first gear 812 is rotationally connected to a mounting plate 813 through a rotating shaft. The upper end of the mounting plate 813 is rotationally connected to a second gear 815 through a rotating shaft. The lower end of the second gear 815 is fixedly connected to the first gear 812. Two symmetrically arranged limiting rollers 814 are rotationally connected to the upper end of the mounting plate 813. The closer sides of the two groups of limiting rollers 814 are rotationally connected to the annular fixing plate 811.
[0039] Specifically, the fixing rod 89 is connected to the fixing bracket 88 to keep the annular toothed plate 810 stable. The annular toothed plate 810 and the first gear 812 are in meshing transmission, driving the mounting plate 813 to move along the circumference of the annular fixing plate 811. The limiting rollers 814 reduce friction through rolling contact, ensuring the stable movement track of the mounting plate 813.
[0040] In this embodiment, a deionized water tank 820 is fixedly connected to the upper end of the mounting plate 813. A stirring rod 816 is rotationally connected to the inside of the deionized water tank 820. The lower end of the stirring rod 816 is fixedly connected to the second gear 815. A spray head 817 is fixedly connected to the lower end of the deionized water tank 820. The outside of the spray head 817 penetrates through the mounting plate 813, and an electromagnetic valve is installed inside the spray head 817.
[0041] Specifically, the deionized water tank 820 contains deionized water and a non-ionic surfactant with a volume ratio of 0.1%. The stirring rod 816 rotates with the second gear 815, preventing the surfactant from stratifying and ensuring that the flushing liquid sprayed by the spray head 817 evenly disperses the silicon chips and reduces the surface tension.
[0042] In this embodiment, a synchronous belt 818 is rotatably connected to the outside of the second gear 815. A third gear 819 is rotatably connected to the inside of the synchronous belt 818. The inside of the third gear 819 is fixedly connected to the output shaft of the servo motor 82. The synchronous belt 818 adopts a pre-tensioned design.
[0043] Specifically, the synchronous belt 818 connects the second gear 815 and the third gear 819, transmits the power of the servo motor 82 to the third gear 819, and the tightening design ensures the transmission stability and avoids slipping.
[0044] In this embodiment, a limiting plate 821 is fixedly connected to the lower end of the third gear 819. The lower end of the limiting plate 821 is designed with a circumferential wave shape. A pressing plate 822 is rotatably connected to the lower end of the limiting plate 821. The outside of the pressing plate 822 is rotatably connected to the output shaft of the servo motor 82 through a sleeve near the middle position. Both ends of the pressing plate 822 are fixedly connected with a second protective cover 823. A hydrophobic layer is provided on the inner wall of the second protective cover 823. Two groups of symmetrical chutes are provided on the outside of the second protective cover 823. A rubber pressing ring 87 is fixedly connected to the lower end of the second protective cover 823. Flow guide grooves are provided on the inner walls of the second protective cover 823 and the rubber pressing ring 87.
[0045] Specifically, the wave-shaped limiting plate 821 periodically presses down the pressing plate 822 through rotation to drive the second protective cover 823 to vibrate; the flow guide grooves guide the airflow and debris to the suction pipe 94, and the hydrophobic layer prevents water mist from adhering to the inner wall.
[0046] In this embodiment, slide rods 824 are fixedly connected to the sides of the two fixing brackets 88 close to each other. The slide rods 824 are slidably connected to the inside of the chutes of the second protective cover 823. Springs 825 are provided below the fixing brackets 88 on the outside of the slide rods 824. One end of the spring 825 is fixedly connected to the fixing bracket 88, and the other end of the spring 825 is fixedly connected to the second protective cover 823.
[0047] Specifically, the slide rods 824 and the springs 825 form an elastic guide to limit the vertical vibration amplitude of the second protective cover 823. The elastic force of the springs 825 provides a reset function and enhances the vibration dust cleaning effect.
[0048] In this embodiment, the dust collection mechanism 9 includes an air pump 91 fixedly connected to one of the fixing brackets 88. One end of the air pump 91 is fixedly connected to a buffer cylinder 92. The buffer cylinder 92 is designed as a three-way pipe. The front and rear ends of the buffer cylinder 92 are input ports, and the upper end of the buffer cylinder 92 is an output port. Two groups of symmetrical suction pipes 94 are fixedly connected to the input ports of the buffer cylinder 92. The other ends of the suction pipes 94 are fixedly connected to the second protective cover 823. An exhaust pipe 97 is fixedly connected to the output port of the buffer cylinder 92. Anti-static coatings are applied to the inner walls of the suction pipes 94 and the buffer cylinder 92.
[0049] Specifically, the air pump 91 extracts the dust-containing air flow in the second protective cover 823 through the suction pipe 94. The three-way buffer cylinder 92 balances the flow rate of the double suction pipes 94. The anti-static coating reduces the adhesion of sticky dust. The exhaust pipe 97 pressurizes the air flow for cleaning the camera module 6.
[0050] In this embodiment, a recovery cylinder 93 is fixedly connected to the inner side of the buffer cylinder 92. The upper end of the recovery cylinder 93 is rotatably connected to a blade 95 through a bracket. The upper end of the blade 95 is fixedly connected to a cleaning brush 911. The upper end of the cleaning brush 911 is rotatably connected to a filter screen 910. The upper end of the filter screen 910 is fixedly connected to an exhaust cylinder 96. The upper end of the exhaust cylinder 96 is fixedly connected to the exhaust pipe 97. The lower end of the recovery cylinder 93 is fixedly connected to a downcomer 98. The outer side of the downcomer 98 penetrates through a set of fixed brackets 88. The lower end of the downcomer 98 is fixedly connected to a collection box 99.
[0051] Specifically, the blade 95 is driven by the air flow to drive the cleaning brush 911 to rotate, continuously cleaning the surface of the filter screen 910. The inclined design of the downcomer 98 guides the dust to the collection box 99, realizing solid-gas separation and waste recycling.
[0052] Working principle: When in use, place the silicon wafer body 3 on the upper end of the original machine table 2 for installation. Start the heightening column 11 installed on the upper end of the robot base 10, and adjust the six-axis robot 4 to the working position. The six-axis robot 4 drives the mounting frame 5 to adjust the orientations of the camera module 6 and the light source module 7, performing visual inspection and positioning on the silicon wafer body 3. Start the original machine table 2 to drive the silicon wafer body 3 to rotate. At the same time, activate the servo motor 82 in the installation box 81. The output shaft of the servo motor 82 is speed-regulated by the reducer 83 and then drives the grinding wheel 84 to grind the silicon wafer body 3. The output shaft of the servo motor 82 drives the third gear 819 to rotate, drives the second gear 815 through the synchronous belt 818. The second gear 815 drives the first gear 812 through the rotating shaft. The first gear 812 meshes with the annular toothed plate 810, pushing the mounting plate 813 to move in a circular motion along the annular fixing plate 811. The fixing rod 89 keeps the annular toothed plate 810 stable through the fixed bracket 88. The limiting roller 814 reduces the movement resistance of the mounting plate 813. The second gear 815 drives the stirring rod 816 to stir the liquid in the deionized water tank 820, preventing the surfactant from stratifying, ensuring that the spraying liquid evenly disperses the silicon chips, and spraying through the spray head 817 to disperse the silicon chips and prevent electrostatic adsorption;
[0053] The third gear 819 drives the limit plate 821 to rotate. Its wavy design generates a periodic height difference, pressing down the pressing plate 822 to drive the second protective cover 823 and the rubber pressing ring 87 to move downward along the slide rod 824. The elastic reset effect of the spring 825 causes the second protective cover 823 to vibrate, removing debris on the inner wall. When the grinding wheel 84 rotates, a directional air flow is formed inside the second protective cover 823 and the rubber pressing ring 87. The debris lifted is guided to the suction pipe 94 through the diversion groove. The first protective cover 85 closes the gap with the second protective cover 823 through the blocking brush 86 and cleans the surface of the synchronous belt 818 to ensure unobstructed spraying around the spray head 817;
[0054] After starting the air pump 91, the suction pipe 94 sucks the dust-containing air flow in the second protective cover 823 into the buffer cylinder 92. The air flow drives the blade 95 to drive the cleaning brush 911 to clean the filter net 910. The filtered air flow enters the exhaust pipe 97 through the exhaust cylinder 96, and after being pressurized, blows and sweeps the camera module 6 and the light source module 7 to remove ashes and water stains. After the impurities intercepted by the filter net 910 are cleaned by the cleaning brush 911, they fall into the collection box 99 together with other dust through the downpipe 98 of the recovery cylinder 93. After the grinding is completed, the camera module 6 and the light source module 7 conduct quality inspection on the finished product, and after confirming that it is qualified, the material is discharged.
[0055] Although the embodiments of the present invention have been shown and described, for those of ordinary skill in the art, it can be understood that various changes, modifications, substitutions, and variations can be made to these embodiments without departing from the principle and spirit of the present invention. The scope of the present invention is defined by the appended claims and their equivalents.
Claims
1. A bonding and grinding robot for silicon wafers, comprising a base (1), characterized in that: The upper end of the base (1) is provided with the original machine table (2), the upper end of the original machine table (2) is provided with a silicon wafer body (3), the upper end of the base (1) is fixedly connected with a robot base (10), the upper end of the base (1) is provided with a heightening column (11), the upper end of the heightening column (11) is provided with a six-axis robot (4), the output shaft wall of the six-axis robot (4) is fixedly connected with a mounting bracket (5), one side of the mounting bracket (5) is provided with a camera module (6), a light source module (7) is installed below the camera module (6) on one side of the mounting bracket (5), and a grinding mechanism (8) for grinding the silicon wafer is installed at the front end of the mounting bracket (5). The grinding mechanism (8) includes two symmetrically arranged fixed brackets (88), and one of the two fixed brackets (88) is provided with a suction mechanism (9) at the upper end for guiding the silicon chips and the flushing liquid flow direction.
2. The bonding and grinding robot for silicon wafers according to claim 1, wherein: The grinding mechanism (8) includes a mounting box (81) fixedly connected with the mounting bracket (5), both sides of the mounting box (81) are fixedly connected with the two fixed brackets (88) respectively, a servo motor (82) is installed inside the mounting box (81), the output shaft of the servo motor (82) is fixedly connected with a reduction gearbox (83), the output shaft of the servo motor (82) penetrates through the reduction gearbox (83), the lower end of the output shaft of the servo motor (82) is fixedly connected with a grinding wheel (84), a diamond coating is arranged on the outer side of the grinding wheel (84), and an electrostatic repulsion design is arranged on the outer side of the grinding wheel (84).
3. The bonding and grinding robot for silicon wafers according to claim 2, wherein: A first protective cover (85) is installed at the lower end of the reduction gearbox (83), a blocking brush (86) is fixedly connected to the lower end of the first protective cover (85), and the blocking brush (86) is made of a soft material.
4. A bonding and grinding robot for silicon wafers according to claim 1, characterized in that: Fixed rods (89) are fixedly connected to the inner sides of the two fixed brackets (88), the lower ends of the two fixed rods (89) are jointly fixedly connected with an annular toothed plate (810), the lower end of the annular toothed plate (810) is fixedly connected with an annular fixing plate (811), a first gear (812) is meshed with the outer side of the annular toothed plate (810), the upper end of the first gear (812) is rotationally connected with a mounting plate (813) through a rotating shaft, the upper end of the mounting plate (813) is rotationally connected with a second gear (815) through a rotating shaft, the lower end of the second gear (815) is fixedly connected with the first gear (812), and two symmetrically arranged limiting rollers (814) are rotationally connected to the upper end of the mounting plate (813). The closer sides of the two limiting rollers (814) are rotationally connected with the annular fixing plate (811).
5. The bonding and grinding robot for silicon wafers according to claim 4, wherein: The upper end of the mounting plate (813) is fixedly connected to a deionized water tank (820). A stirring rod (816) is rotatably connected inside the deionized water tank (820). The lower end of the stirring rod (816) is fixedly connected to a second gear (815). The lower end of the deionized water tank (820) is fixedly connected to a spray head (817). The outside of the spray head (817) penetrates through the mounting plate (813). An electromagnetic valve is installed inside the spray head (817).
6. The bonding and grinding robot for silicon wafers according to claim 4, characterized in that: A synchronous belt (818) is rotatably connected to the outside of the second gear (815). A third gear (819) is rotatably connected to the inside of the synchronous belt (818). The inside of the third gear (819) is fixedly connected to the output shaft of a servo motor (82). The synchronous belt (818) adopts a pre-tensioned design.
7. The bonding and grinding robot for silicon wafers according to claim 6, wherein: A limiting plate (821) is fixedly connected to the lower end of the third gear (819). The lower end of the limiting plate (821) is designed in a circumferential wavy shape. A pressing plate (822) is rotatably connected to the lower end of the limiting plate (821). The outside of the pressing plate (822) is rotatably connected to the output shaft of the servo motor (82) through a sleeve near the middle position. Two ends of the pressing plate (822) are fixedly connected to a second protective cover (823). A hydrophobic layer is provided on the inner wall of the second protective cover (823). Two groups of symmetrical chutes are opened on the outside of the second protective cover (823). A rubber pressing ring (87) is fixedly connected to the lower end of the second protective cover (823). Flow guiding grooves are provided on the inner walls of the second protective cover (823) and the rubber pressing ring (87).
8. The bonding and grinding robot for silicon wafers according to claim 1, wherein: Sliding rods (824) are fixedly connected to the closer sides of the two fixing brackets (88). The sliding rods (824) are slidably connected to the inside of the chutes of the second protective cover (823). Springs (825) are provided below the fixing brackets (88) on the outside of the sliding rods (824). One end of each spring (825) is fixedly connected to the fixing bracket (88), and the other end of each spring (825) is fixedly connected to the second protective cover (823).
9. A bonding and grinding robot for silicon wafers according to claim 1, characterized in that: The dust suction mechanism (9) includes an air pump (91) fixedly connected to one of the fixing brackets (88). One end of the air pump (91) is fixedly connected to a buffer cylinder (92). The buffer cylinder (92) is designed as a three-way pipe. The front and rear ends of the buffer cylinder (92) are input ports, and the upper end of the buffer cylinder (92) is an output port. Two groups of symmetrical suction pipes (94) are fixedly connected to the input ports of the buffer cylinder (92). The other ends of the suction pipes (94) are fixedly connected to the second protective cover (823). An exhaust pipe (97) is fixedly connected to the output port of the buffer cylinder (92). Anti-static coatings are applied to the inner walls of the suction pipes (94) and the buffer cylinder (92).
10. A bonding and grinding robot for silicon wafers according to claim 9, characterized in that: Inside the buffer cylinder (92), a recovery cylinder (93) is fixedly connected. At the upper end of the recovery cylinder (93), a blade (95) is rotatably connected through a bracket. At the upper end of the blade (95), a cleaning brush (911) is fixedly connected. At the upper end of the cleaning brush (911), a filter screen (910) is rotatably connected. At the upper end of the filter screen (910), an exhaust cylinder (96) is fixedly connected. The upper end of the exhaust cylinder (96) is fixedly connected to an exhaust pipe (97). At the lower end of the recovery cylinder (93), a downcomer (98) is fixedly connected. The outside of the downcomer (98) penetrates through a set of fixed brackets (88). At the lower end of the downcomer (98), a collection box (99) is fixedly connected.