Integrated cutting and contour grinding method for square quartz substrate

Abstract

The invention provides an integrated cutting and contour grinding method for a square quartz substrate, and belongs to the technical field of quartz substrate machining. The method comprises the steps that a square quartz substrate blank to be machined is cut through multi-wire cutting equipment, cutting parameters are monitored and adjusted in real time, and cooling liquid is evenly sprayed to a cutting area during cutting so as to prevent the square quartz substrate blank from cracking or deforming caused by thermal stress; a self-adaptive control numerical control engraving and milling machine is used for grinding the length, the width and the chamfered edge of the cut and formed square quartz substrate workpiece, the position and the size deviation of the workpiece are automatically detected, and the grinding path is dynamically adjusted to achieve micron-grade precision grinding; an environment compensation mechanism is introduced, and grinding parameters are automatically adjusted based on workshop temperature and humidity changes. High-precision integrated cutting and contour grinding of the square quartz substrate are achieved, the machining efficiency and the product quality are remarkably improved, and the consistency of the size precision and the surface quality is ensured.

Description

Technical Field

[0001] This application belongs to the technical field of quartz substrate processing, and specifically relates to an integrated cutting and contour grinding method for square quartz substrates. Background Art

[0002] In the fields of semiconductors, optics, and electronics manufacturing, square quartz substrates, as key raw materials, are widely used due to their excellent chemical stability and optical transmittance.

[0003] However, there are many deficiencies in the traditional cutting and contour grinding processes for square quartz substrates. Existing cutting methods usually adopt single mechanical cutting or laser cutting. These methods are prone to high cutting surface roughness, generating microcracks, and it is difficult to ensure dimensional accuracy. In addition, the separation of cutting and grinding processes increases the intermediate transfer link, which not only reduces production efficiency but also may introduce additional errors, affecting the quality consistency of the final product. Summary of the Invention

[0004] To solve at least one aspect of the technical problems in the background art, this application provides an integrated cutting and contour grinding method for square quartz substrates, which realizes high-precision integrated cutting and contour grinding of square quartz substrates, significantly improves processing efficiency and product quality, and ensures the consistency of dimensional accuracy and surface quality.

[0005] The technical solution adopted in this application is as follows:

[0006] An embodiment of this application provides an integrated cutting and contour grinding method for square quartz substrates, including:

[0007] Using a multi-wire cutting device to cut the square quartz substrate blank to be processed, real-time monitoring and adjusting the cutting parameters, and evenly spraying coolant on the cutting area during cutting to prevent cracks or deformation of the square quartz substrate blank caused by thermal stress;

[0008] Using an adaptive control CNC engraving machine to grind the length, width, and chamfer of the cut square quartz substrate workpiece, automatically detecting the workpiece position and dimensional deviation, and dynamically adjusting the grinding path to achieve micron-level precision grinding;

[0009] Introducing an environmental compensation mechanism to automatically adjust the grinding parameters based on the changes in workshop temperature and humidity.

[0010] According to the integrated cutting and contour grinding method for square quartz substrates provided by the embodiments of the present application, first, a multi-wire cutting device is used to cut the blank of the square quartz substrate to be processed. By real-time monitoring and adjusting the cutting parameters (such as tension, vibration, and temperature), and uniformly spraying low-temperature deionized water as a coolant during cutting, cracks or deformations caused by thermal stress are effectively prevented, ensuring the quality of the cutting surface. Then, an adaptive control CNC engraving machine is used to precisely grind the length, width, and chamfer of the cut workpiece. A laser distance sensor or an optical image measuring instrument is used to automatically detect the position and size deviation of the workpiece, and the grinding path is dynamically adjusted to achieve micron-level precision grinding, significantly improving the processing accuracy and surface finish. Finally, an environmental compensation mechanism is introduced to automatically adjust the grinding parameters (such as feed speed, coolant flow rate, and pressure) according to the changes in workshop temperature and humidity, ensuring stable processing effects in different environments. This method not only greatly improves the processing accuracy and production efficiency of square quartz substrates, but also effectively reduces the errors caused by intermediate transfer links, ensuring the consistency of product size accuracy and surface quality, and is applicable to semiconductor, optical, and electronic manufacturing fields with high-precision requirements.

[0011] According to an embodiment of the present application, when using a multi-wire cutting device to cut the blank of the square quartz substrate to be processed, real-time monitoring and adjustment of the cutting parameters, and uniformly spraying a coolant on the cutting area during cutting to prevent cracks or deformations of the square quartz substrate blank caused by thermal stress, specifically:

[0012] The multi-wire cutting device uses diamond wire as the cutting tool, and the wire running speed is controlled between 5 and 30 m / s;

[0013] Collect the tension, vibration, and temperature data during the cutting process, and dynamically adjust the cutting feed speed based on the collected data to ensure the material removal rate during the cutting process;

[0014] At the cutting station, multi-angle cooling nozzles are set, distributed around the cutting wire, and continuously spray low-temperature deionized water as the cooling medium into the cutting area, controlling the cutting interface temperature below 40°C.

[0015] According to an embodiment of the present application, the initial tension of the diamond wire is set between 5 N and 40 N. When the monitored tension fluctuation exceeds ±2 N, the tension is automatically adjusted to the set value;

[0016] The vibration frequency is between 1 kHz and 3 kHz, and the amplitude does not exceed ±0.1 mm;

[0017] The cutting interface temperature is between 20°C and 40°C.

[0018] According to an embodiment of the present application, the distance between two adjacent nozzles is 10 cm to 20 cm, and the temperature of the low-temperature deionized water is between 10°C and 15°C.

[0019] According to an embodiment of the present application, the liquid flow rate of the low-temperature deionized water is set to 8 L / min to 12 L / min;

[0020] The pressure of the low-temperature deionized water is maintained within the range of 0.3 MPa to 0.5 MPa;

[0021] If the cutting interface temperature rises by 1°C, the flow rate of the low-temperature deionized water increases by 0.8 L / min to 1.2 L / min), and the pressure is increased by 0.05 MPa.

[0022] According to an embodiment of the present application, the adaptive control numerical control precision engraving machine is used to grind the length, width and chamfer of the square quartz substrate workpiece after cutting and forming, automatically detect the position and size deviation of the workpiece, and dynamically adjust the grinding path to achieve micron-level precision grinding. Specifically:

[0023] A laser distance sensor or an optical image measuring instrument is used to monitor the position and size of the workpiece in real time to ensure that the detection accuracy reaches within ±5 μm;

[0024] The particle size range of the diamond abrasive is #2000 to #4000, and the spindle speed is 25000 r / min;

[0025] After each processing stage is completed, a comprehensive inspection is automatically performed, including dimensions, shape and surface quality.

[0026] According to an embodiment of the present application, the environmental compensation mechanism is introduced to automatically adjust the grinding parameters based on the changes in the temperature and humidity of the workshop. Specifically:

[0027] When it is detected that the workshop temperature rises, the grinding speed is automatically reduced and the single-pass grinding depth is reduced;

[0028] When it is detected that the workshop humidity increases, the flow rate and pressure of the coolant are automatically increased.

[0029] According to an embodiment of the present application, when it is detected that the workshop temperature rises, the grinding speed is automatically reduced and the single-pass grinding depth is reduced; when it is detected that the workshop humidity increases, the flow rate and pressure of the coolant are automatically increased. Specifically:

[0030] If the workshop temperature rises by 1°C, the grinding speed is automatically reduced by 5%, and at the same time the single-pass grinding depth is reduced by 0.01 mm;

[0031] If the relative humidity of the workshop increases by 5%, the coolant flow rate is automatically increased by 10%, and at the same time the coolant pressure is increased by 0.1 MPa.

[0032] According to an embodiment of the present application, introducing an environmental compensation mechanism to automatically adjust the grinding parameters based on the changes in the temperature and humidity in the workshop, further including:

[0033] If the workshop temperature exceeds 30°C or the humidity exceeds 70%, a warning signal is issued and grinding is stopped.

[0034] According to an embodiment of the present application, the method further includes:

[0035] After the grinding process is completed, a plasma cleaning technology is used to perform ultra-precision cleaning on the surface of the workpiece to remove residual particles and organic pollutants, ensuring that the surface cleanliness reaches below Class 10;

[0036] The cleaned workpiece is subjected to full-automatic optical inspection to identify surface defects, scratches and micro-cracks. BRIEF DESCRIPTION OF THE DRAWINGS

[0037] The drawings described herein are used to provide a further understanding of the present application, and constitute a part of the present application. The illustrative embodiments and descriptions thereof of the present application are used to explain the present application, and do not constitute an improper limitation to the present application. In the drawings:

[0038] Figure 1 It is a schematic flow chart of the integrated cutting and contour grinding method for a square quartz substrate provided by an embodiment of the present application. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] In order to more clearly explain the overall concept of the present application, the following will be described in detail by way of examples in conjunction with the drawings in the specification.

[0040] In the following description, many specific details are set forth in order to fully understand the present application. However, the present application can also be implemented in other ways different from those described herein. Therefore, the protection scope of the present application is not limited by the specific embodiments disclosed below. It should be noted that, without conflict, the embodiments of the present application and the features in each embodiment can be combined with each other.

[0041] In addition, in the description of the present application, it should be understood that the orientation or positional relationship indicated by the terms "top", "bottom", "inner", "outer", "axial", "radial", "circumferential", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing the present application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be construed as a limitation to the present application.

[0042] In this application, unless otherwise clearly specified or limited, terms such as "install", "connect", "link", "fix", etc. shall be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can be a mechanical connection, an electrical connection, or a communication connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0043] In this application, unless otherwise clearly specified or limited, the first feature being "on" or "under" the second feature can be that the first and second features are in direct contact, or the first and second features are indirectly in contact through an intermediate medium. In the description of this specification, the description with reference to terms such as "one embodiment", "some embodiments", "example", "specific example", or "some examples", etc. means that the specific features, structures, materials, or characteristics described in connection with the embodiment or example are included in at least one embodiment or example of this application. In this specification, the schematic expressions of the above terms do not necessarily refer to the same embodiment or example. Moreover, the specific features, structures, materials, or characteristics described can be combined in a suitable manner in any one or more embodiments or examples.

[0044] As Figure 1 shown, the embodiment of this application provides a method for integrated cutting and profile grinding of a square quartz substrate, including:

[0045] Step 100: Use a multi-wire cutting device to cut the square quartz substrate blank to be processed, monitor and adjust the cutting parameters in real time, and evenly spray a coolant on the cutting area during cutting to prevent cracks or deformation of the square quartz substrate blank caused by thermal stress.

[0046] Step 200: Use an adaptive control CNC engraving machine to grind the length, width, and chamfer of the cut square quartz substrate workpiece, automatically detect the position and size deviation of the workpiece, and dynamically adjust the grinding path to achieve micron-level precision grinding.

[0047] Step 300: Introduce an environmental compensation mechanism to automatically adjust the grinding parameters based on the changes in the temperature and humidity in the workshop.

[0048] In step 100, a multi-wire cutting device is used to perform high-precision cutting on the quartz substrate blank. The multi-wire cutting system completes batch cutting operations through the high-speed operation of diamond wires. The wire running speed is controlled between 5 and 30 m / s to ensure cutting efficiency and surface quality. At the same time, the system integrates a tension sensor, a vibration sensor, and a temperature sensor, which can collect key data during the cutting process in real time and dynamically adjust the cutting feed speed based on the feedback information, so as to maintain a stable material removal rate and avoid wire breakage or chipping problems caused by uneven tension or overheating.

[0049] In addition, during the cutting process, through multi-angle cooling nozzles arranged around the cutting station, low-temperature deionized water is continuously sprayed into the cutting area as a cooling medium, effectively reducing the cutting interface temperature to below 40°C, preventing thermal stress cracks or substrate deformation caused by local high temperature. This coolant also has good cleaning performance, which can promptly wash away the chips generated by cutting and reduce the risk of secondary scratching. Through the above measures, this step achieves efficient, stable, and high-quality output during the cutting process, laying a good foundation for subsequent precision grinding.

[0050] In step 200, a numerically controlled precision engraving machine with an adaptive control function is used to perform contour grinding on the cut square quartz substrate. This device is equipped with a laser distance sensor or an optical image measuring instrument, which can quickly obtain the actual position and size data of the workpiece before processing, and the detection accuracy can reach within ±5μm. According to the collected data, the control system can automatically identify the workpiece offset and dynamically correct the grinding path in combination with the preset process parameters to achieve high-precision size trimming and shape processing.

[0051] During the grinding process, ultra-fine diamond abrasives with a particle size range between #2000 and #4000 are used, and combined with a high-speed spindle (the rotation speed can reach 25000 r / min), which significantly improves the grinding efficiency and surface finish, making the final surface roughness Ra value reach below 0.1μm. After each processing stage is completed, the system will automatically perform a comprehensive inspection, including dimensions, shape, and surface quality, to ensure that all indicators meet the design requirements. Through the above technical means, this step not only improves the processing accuracy and consistency, but also greatly reduces manual intervention and improves the overall production automation level.

[0052] In step 300, this step solves the problem of affecting the machining accuracy due to the fluctuations of temperature and humidity in the workshop by constructing an environment perception and adaptive adjustment system. The system arranges multiple high-precision temperature and humidity sensors in the workshop to collect environmental data in real time and transmit the signals to the central control system. When the temperature is detected to rise, the system automatically reduces the grinding speed by 5% and reduces the single grinding depth by 0.01 mm; when the humidity is detected to rise, the coolant flow rate is correspondingly increased by 10% and the cooling pressure is increased by 0.1 MPa, so as to maintain the stability and consistency of the grinding process.

[0053] In addition, the system is equipped with a temperature and humidity warning threshold mechanism. When the workshop temperature exceeds 30 °C or the relative humidity exceeds 70%, the system will automatically send out a warning signal and pause the current machining process, prompting the operator to take measures such as cooling and dehumidification. This intelligent compensation mechanism based on environmental changes effectively avoids product size deviation or surface quality degradation caused by unstable external environments, ensures high-quality square quartz substrate products can be obtained under different production conditions, and enhances the robustness and applicability of the entire machining system.

[0054] According to the integrated cutting and contour grinding method of square quartz substrates provided by the embodiments of the present application, first, a multi-wire cutting device is used to cut the square quartz substrate blank to be processed. By real-time monitoring and adjusting cutting parameters (such as tension, vibration, and temperature), and evenly spraying low-temperature deionized water as a coolant during cutting, effectively preventing cracks or deformations caused by thermal stress and ensuring the cutting surface quality; then, an adaptive control CNC engraving machine is used to perform precision grinding on the length, width, and chamfer of the cut workpiece, automatically detecting the workpiece position and size deviation using a laser distance sensor or an optical image measuring instrument, and dynamically adjusting the grinding path to achieve micron-level precision grinding, significantly improving the machining accuracy and surface finish; finally, an environmental compensation mechanism is introduced to automatically adjust grinding parameters (such as feed speed, coolant flow rate, and pressure) according to the changes in workshop temperature and humidity, ensuring stable machining effects under different environments. This method not only greatly improves the machining accuracy and production efficiency of square quartz substrates, but also effectively reduces the errors brought by intermediate transfer links, ensures the consistency of product size accuracy and surface quality, and is applicable to the semiconductor, optical, and electronic manufacturing fields with high-precision requirements.

[0055] In some embodiments of the present application, a multi-wire cutting device is used to cut the square quartz substrate blank to be processed, real-time monitoring and adjusting cutting parameters, and evenly spraying a coolant on the cutting area during cutting to prevent cracks or deformations of the square quartz substrate blank caused by thermal stress. Specifically:

[0056] The multi-wire cutting device uses diamond wire as the cutting tool, and the wire running speed is controlled between 5 and 30 m / s;

[0057] Collect tension, vibration and temperature data during the cutting process, and dynamically adjust the cutting feed speed based on the collected data to ensure the material removal rate during the cutting process;

[0058] Multi-angle cooling nozzles are set at the cutting station and distributed around the cutting line. Low-temperature deionized water is continuously sprayed into the cutting area as a cooling medium to control the cutting interface temperature below 40°C.

[0059] Specifically, when cutting the square quartz substrate blank to be processed, multi-wire cutting equipment is used in conjunction with diamond wire as the cutting tool, and the wire running speed is controlled between 5 and 30 m / s to achieve efficient and low-damage batch cutting. Through the tension sensor, vibration sensor and temperature sensor integrated in the equipment, key parameter data of the cutting process are collected in real time. The system dynamically adjusts the cutting feed speed according to the collected data, thereby maintaining a stable material removal rate and avoiding defects such as wire breakage and edge collapse caused by tension fluctuations, abnormal vibrations or local overheating.

[0060] At the same time, multiple cooling nozzles with adjustable angles are set around the cutting station, distributed around the cutting line, and continuously spray low-temperature deionized water as a cooling medium into the cutting area, effectively removing the heat generated during the cutting process, controlling the cutting interface temperature below 40°C, and preventing cracks or substrate deformation caused by thermal stress. The coolant also has a good cleaning effect, which can promptly flush away the debris generated by cutting and reduce the risk of secondary scratches. The combination of the above structural design and the intelligent control mechanism significantly improves the cutting quality and process stability, providing a good foundation for subsequent precision grinding.

[0061] In some embodiments of the present application, the initial tension of the diamond wire is set between 5N and 40N, and when the tension fluctuation exceeds ±2N, the tension is automatically adjusted to the set value;

[0062] The vibration frequency is between 1kHz and 3kHz, and the amplitude does not exceed ±0.1mm;

[0063] The cutting interface temperature is between 20°C and 40°C.

[0064] Specifically, the multi-wire cutting equipment uses diamond wire as a cutting tool, and its initial tension is set between 5N and 40N to meet the cutting requirements of square quartz substrate blanks of different specifications. The system is equipped with a high-precision tension sensor. When the tension fluctuation exceeds ±2N, it automatically adjusts the tension to the preset value to ensure that the wire remains properly taut during the cutting process, avoiding wire breakage or edge collapse caused by uneven tension. This dynamic adjustment mechanism can respond to changes in the cutting process in real time, ensuring the consistency and stability of the cutting.

[0065] In addition, during the cutting process, the system also monitors the vibration frequency and amplitude, maintaining the vibration frequency between 1 kHz and 3 kHz and the amplitude not exceeding ±0.1 mm to ensure a smooth cutting process and reduce the impact of unnecessary vibrations on the cutting quality. Meanwhile, by setting up multi-angle cooling nozzles, low-temperature deionized water is continuously sprayed onto the cutting area to control the cutting interface temperature between 20°C and 40°C, effectively preventing crack or deformation problems caused by local overheating. This cooling system not only helps to stabilize the cutting temperature but also can timely remove cutting debris, further improving the quality and consistency of the cutting surface.

[0066] In some embodiments of the present application, the distance between two adjacent nozzles is 10 cm to 20 cm, and the temperature of the low-temperature deionized water is between 10°C and 15°C. The distance between two adjacent cooling nozzles is set to 10 cm to 20 cm. This layout can ensure that the low-temperature deionized water fully covers the entire cutting area, avoiding problems such as local overheating or insufficient cooling caused by uneven distribution of the coolant. By optimizing the nozzle spacing, the system can continuously provide a stable cooling medium during the cutting process, significantly reducing the cutting interface temperature and the risk of cracks or deformations caused by thermal stress.

[0067] In addition, the temperature of the low-temperature deionized water is controlled between 10°C and 15°C to ensure its good cooling performance. The lower coolant temperature helps to quickly remove the heat generated during the cutting process, further improving the cooling efficiency. This cooling system can not only maintain the cutting interface temperature within the ideal range of 20°C to 40°C but also effectively clean the cutting area, preventing debris residue and secondary scratches. By precisely controlling the coolant temperature and nozzle layout, this method significantly improves the cutting quality and process stability, ensuring high-precision machining of the square quartz substrate blank.

[0068] In some embodiments of the present application, the liquid flow rate of the low-temperature deionized water is set to 8 L / min to 12 L / min;

[0069] The pressure of the low-temperature deionized water is maintained within the range of 0.3 MPa to 0.5 MPa;

[0070] If the cutting interface temperature rises by 1°C, the liquid flow rate of the low-temperature deionized water increases by 0.8 L / min to 1.2 L / min, and the pressure is increased by 0.05 MPa.

[0071] Specifically, the liquid flow rate of the low-temperature deionized water is set to be from 8 L / min to 12 L / min to ensure that sufficient coolant flow covers the entire cutting area and effectively removes the heat generated during the cutting process. At the same time, the pressure of the low-temperature deionized water is maintained within the range of 0.3 MPa to 0.5 MPa to ensure that the coolant can be evenly sprayed onto the cutting line, avoiding problems such as poor cooling effect or local overheating caused by insufficient pressure. This precisely controlled coolant flow rate and pressure setting not only improves the cooling efficiency but also further enhances the stability and consistency of the cutting process.

[0072] To cope with the change in the temperature of the cutting interface, this method introduces an intelligent adjustment mechanism. When it is detected that the temperature of the cutting interface rises by 1 °C, the system automatically increases the flow rate of the low-temperature deionized water by 0.8 L / min to 1.2 L / min and raises the coolant pressure by 0.05 MPa. This dynamic adjustment strategy ensures that even in a high-temperature environment, the cutting interface can be maintained within the ideal temperature range (20 °C to 40 °C), effectively preventing cracks or deformations caused by thermal stress. Through this adaptive coolant adjustment mechanism, this method significantly improves the cutting quality and reduces the processing errors caused by environmental changes.

[0073] In some embodiments of the present application, an adaptive control numerically controlled precision engraving machine is used to grind the length, width, and chamfer of a square quartz substrate workpiece after cutting, automatically detect the position and size deviation of the workpiece, and dynamically adjust the grinding path to achieve micron-level precision grinding. Specifically:

[0074] A laser distance sensor or an optical image measuring instrument is used to monitor the position and size of the workpiece in real time to ensure that the detection accuracy reaches within ±5 μm;

[0075] The particle size range of the diamond abrasive is from #2000 to #4000, and the spindle speed is 25000 r / min;

[0076] After each processing stage is completed, a comprehensive inspection is automatically carried out, including dimensions, shape, and surface quality.

[0077] Specifically, an adaptive control numerically controlled precision engraving machine is used to perform high-precision contour grinding on the length, width, and chamfer of a square quartz substrate workpiece. This equipment is equipped with a laser distance sensor or an optical image measuring instrument to detect the position and size of the workpiece in real time before processing, ensuring that the detection accuracy reaches within ±5 μm. Through the collected initial position and size data of the workpiece, the system can automatically identify the offset and dynamically adjust the grinding path in combination with the preset process parameters to achieve micron-level precision contour trimming, effectively eliminating product defects caused by clamping errors or positioning deviations.

[0078] In addition, during the grinding process, ultra-fine diamond abrasives with a particle size range of #2000 to #4000 are used, and a high-speed spindle runs at a speed of 25000 r / min, significantly improving the surface finish and machining efficiency, and making the final surface roughness Ra value less than 0.1 μm. After each machining stage is completed, the system will automatically start a comprehensive inspection process to recheck the dimensions, shape, and surface quality of the workpiece to ensure that all indicators meet the design requirements. This combination of closed-loop detection and adaptive correction mechanism not only improves machining accuracy and consistency but also greatly reduces manual intervention, enhancing the overall production efficiency and intelligence level.

[0079] In some embodiments of the present application, an environmental compensation mechanism is introduced to automatically adjust the grinding parameters based on the changes in workshop temperature and humidity. Specifically:

[0080] When it is detected that the workshop temperature rises, the grinding speed is automatically reduced and the single-pass grinding depth is decreased;

[0081] When it is detected that the workshop humidity increases, the flow rate and pressure of the coolant are automatically increased.

[0082] Specifically, in the embodiments of the present application, an environmental compensation mechanism based on the changes in workshop temperature and humidity is introduced to improve the processing stability and consistency of square quartz substrates under different environmental conditions. This mechanism deploys multiple high-precision temperature and humidity sensors inside the workshop to collect environmental data in real-time and feedback the information to the central control system. When it is detected that the workshop temperature rises, the system automatically reduces the grinding speed and the single-pass grinding depth to slow down the dimensional deviation caused by material thermal expansion or equipment thermal deformation, thereby ensuring micron-level machining accuracy.

[0083] Meanwhile, when it is detected that the relative humidity in the workshop increases, the system will automatically increase the flow rate and pressure of the coolant to enhance the cooling effect and prevent water vapor condensation on the workpiece surface or a decline in the coolant performance caused by excessive humidity. Through this dynamic adjustment strategy, even in the case of large fluctuations in the external environment, the stability of the grinding process and the consistency of the surface quality can be effectively maintained. This environmental compensation mechanism not only improves the adaptability of the equipment to complex production environments but also significantly increases the product yield and machining reliability, and is particularly suitable for high-end quartz substrate manufacturing scenarios with strict precision requirements.

[0084] In some embodiments of the present application, when it is detected that the workshop temperature rises, the grinding speed is automatically reduced and the single-pass grinding depth is decreased; when it is detected that the workshop humidity increases, the flow rate and pressure of the coolant are automatically increased. Specifically:

[0085] If the workshop temperature rises by 1 °C, the grinding speed is automatically reduced by 5%, and at the same time, the single-pass grinding depth is decreased by 0.01 mm;

[0086] If the relative humidity in the workshop increases by 5%, the coolant flow rate is automatically increased by 10%, and at the same time, the coolant pressure is increased by 0.1 MPa.

[0087] Specifically, when the workshop temperature is detected to increase by 1°C, the system automatically reduces the grinding speed by 5% and at the same time reduces the single - pass grinding depth by 0.01 mm. This dynamic adjustment can effectively mitigate the material thermal expansion effect and equipment thermal deformation problems caused by temperature rise, thereby maintaining the dimensional accuracy of the workpiece. In this way, even in a high - temperature environment, the stability and consistency of the grinding process can be ensured, and machining errors caused by temperature fluctuations can be avoided.

[0088] Similarly, when the relative humidity in the workshop is detected to increase by 5%, the system automatically increases the coolant flow rate by 10% and raises the coolant pressure by 0.1 MPa. This adjustment strategy helps to enhance the cooling effect, prevent water vapor condensation caused by high humidity, ensure uniform distribution of the coolant on the workpiece surface and effectively carry away heat. In addition, increasing the coolant pressure can better clean the grinding area, reduce debris residue, and further improve the surface quality of the workpiece. Through these fine - tuning measures, the system can maintain stable processing performance under different environmental conditions and ensure high - quality production of square quartz substrates.

[0089] In some embodiments of the present application, an environmental compensation mechanism is introduced to automatically adjust the grinding parameters based on the changes in the workshop temperature and humidity, and it further includes:

[0090] If the workshop temperature exceeds 30°C or the humidity exceeds 70%, a warning signal is issued and the grinding is stopped.

[0091] Specifically, the environmental compensation mechanism not only includes the dynamic adjustment of grinding parameters based on the changes in the workshop temperature and humidity, but also further sets an environmental safety threshold judgment logic. When the system detects that the workshop temperature exceeds 30°C or the relative humidity exceeds 70%, it is determined that the current environment has exceeded the safe processing range, and the control system will immediately issue a warning signal to remind the operator to take cooling or dehumidification measures to ensure that the production environment returns to the appropriate range.

[0092] At the same time, to avoid workpiece deformation, dimensional deviation, or surface quality degradation that may occur when continuing to process in an extreme environment, the system will automatically stop the current grinding operation while issuing a warning to prevent the production of defective products. This function effectively improves the operation safety and processing reliability of the equipment in a complex environment, ensures the stability and consistency of square quartz substrates during high - precision manufacturing, and has good engineering application value.

[0093] In some embodiments of the present application, the method further includes:

[0094] After the grinding process, the surface of the workpiece is ultrasonically cleaned using plasma cleaning technology to remove residual particles and organic contaminants, ensuring that the surface cleanliness reaches below Class 10;

[0095] The cleaned workpiece is then subjected to fully automated optical inspection to identify surface defects, scratches, and microcracks.

[0096] Specifically, after the grinding process, the embodiments of the present application further include a step of ultrasonically cleaning the surface of the workpiece. This process uses plasma cleaning technology, where high-energy ions bombard the surface of the workpiece to effectively remove residual particles, metal debris, and organic contaminants, ensuring that the surface cleanliness after cleaning reaches below Class 10 (i.e., the number of particles ≥ 0.5μm in each cubic foot of air does not exceed 10). This cleaning process does not require the use of chemical reagents, avoiding the risks of secondary pollution and material corrosion, and is particularly suitable for the manufacturing scenario of square quartz substrates with extremely high cleanliness requirements.

[0097] After cleaning, the system transfers the workpiece to the fully automated optical inspection module, where a high-resolution CCD camera and a multi-angle light source system are used to comprehensively scan the surface of the workpiece. This inspection system can automatically identify and classify surface defects such as scratches, microcracks, pits, and locally rough areas, and use AI image processing algorithms to determine whether the product meets the quality standards. The inspection results are uploaded to the MES production management system in real time to achieve full-process quality traceability. This integrated cleaning and inspection process not only improves the product yield but also significantly enhances the production automation level and process control accuracy.

[0098] What is not described in this application can be implemented by adopting or referring to existing technologies.

[0099] Each embodiment in this specification is described in a progressive manner. For the same or similar parts among the embodiments, reference can be made to each other. Each embodiment focuses on the differences from other embodiments.

[0100] The above are only the embodiments of the present application and are not used to limit the present application. For those skilled in the art, various changes and modifications can be made to the present application. Any modification, equivalent replacement, improvement, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.

Claims

1. A method for integrated cutting and profile grinding of a square quartz substrate, characterized in that, Including: Using a multi-wire cutting device to cut a square quartz substrate blank to be processed, monitoring and adjusting the cutting parameters in real time, and evenly spraying a coolant on the cutting area during cutting to prevent cracks or deformation of the square quartz substrate blank caused by thermal stress; Using an adaptive control CNC precision engraving machine to grind the length, width and chamfer of the cut square quartz substrate workpiece, automatically detecting the position and size deviation of the workpiece, and dynamically adjusting the grinding path to achieve micron-level precision grinding; Introducing an environmental compensation mechanism to automatically adjust the grinding parameters based on the changes in workshop temperature and humidity.

2. The integrated cutting and contour grinding method for a square quartz substrate according to claim 1, characterized in that The using of a multi-wire cutting device to cut a square quartz substrate blank to be processed, monitoring and adjusting the cutting parameters in real time, and evenly spraying a coolant on the cutting area during cutting to prevent cracks or deformation of the square quartz substrate blank caused by thermal stress is specifically as follows: The multi-wire cutting device uses diamond wire as the cutting tool, and the wire running speed is controlled between 5 and 30 m / s; Collecting the tension, vibration and temperature data during the cutting process, and dynamically adjusting the cutting feed speed based on the collected data to ensure the material removal rate during the cutting process; Setting multi-angle cooling nozzles at the cutting station, distributed around the cutting wire, and continuously spraying low-temperature deionized water as the cooling medium to the cutting area, controlling the cutting interface temperature below 40°C.

3. The integrated cutting and contour grinding method for a square quartz substrate according to claim 2, wherein The initial tension of the diamond wire is set between 5 N and 40 N. When the monitored tension fluctuation exceeds ±2 N, the tension is automatically adjusted to the set value; The vibration frequency is between 1 kHz and 3 kHz, and the amplitude does not exceed ±0.1 mm; The cutting interface temperature is between 20°C and 40°C.

4. The integrated cutting and contour grinding method for a square quartz substrate according to claim 2, characterized in that The distance between two adjacent nozzles is 10 cm to 20 cm, and the temperature of the low-temperature deionized water is between 10°C and 15°C.

5. The integrated cutting and profile grinding method of the square quartz substrate according to claim 4, characterized in that The liquid flow rate of the low-temperature deionized water is set to 8 L / min to 12 L / min; The pressure of the low-temperature deionized water is maintained in the range of 0.3 MPa to 0.5 MPa; If the cutting interface temperature rises by 1°C, the flow rate of the low-temperature deionized water increases by 0.8 L / min to 1.2 L / min, and the pressure is increased by 0.05 MPa.

6. The integrated cutting and profile grinding method for a square quartz substrate according to claim 1, characterized in that, The using of an adaptive control CNC precision engraving machine to grind the length, width and chamfer of the cut square quartz substrate workpiece, automatically detecting the position and size deviation of the workpiece, and dynamically adjusting the grinding path to achieve micron-level precision grinding is specifically as follows: Using a laser ranging sensor or an optical image measuring instrument to monitor the position and size of the workpiece in real time, ensuring that the detection accuracy reaches within ±5 μm; The particle size range of the diamond abrasive is from #2000 to #4000, and the spindle speed is 25000 r / min; After each processing stage is completed, a comprehensive inspection is automatically carried out, including dimensions, shape and surface quality.

7. The integrated cutting and profile grinding method for a square quartz substrate according to claim 1, characterized in that, The introducing of an environmental compensation mechanism to automatically adjust the grinding parameters based on the changes in workshop temperature and humidity is specifically as follows: When it is detected that the workshop temperature rises, the grinding speed is automatically reduced and the single-grinding depth is reduced; When it is detected that the workshop humidity increases, the flow rate and pressure of the coolant are automatically increased.

8. The integrated cutting and profile grinding method for a square quartz substrate according to claim 7, characterized in that When it is detected that the temperature in the workshop rises, the grinding speed is automatically reduced and the single - pass grinding depth is decreased; when it is detected that the humidity in the workshop increases, the flow rate and pressure of the coolant are automatically increased. Specifically: If the temperature in the workshop rises by 1°C, the grinding speed is automatically reduced by 5%, and at the same time, the single - pass grinding depth is decreased by 0.01 mm; If the relative humidity in the workshop increases by 5%, the coolant flow rate is automatically increased by 10%, and at the same time, the coolant pressure is increased by 0.1 MPa.

9. The integrated cutting and profile grinding method for a square quartz substrate according to claim 7 or 8, characterized in that The introduction of an environmental compensation mechanism to automatically adjust the grinding parameters based on the changes in the temperature and humidity in the workshop further includes: If the temperature in the workshop exceeds 30°C or the humidity exceeds 70%, a warning signal is issued and the grinding is stopped.

10. The integrated cutting and contour grinding method for a square quartz substrate according to claim 1, characterized in that The method further includes: After the grinding process is completed, the surface of the workpiece is ultrasonically cleaned using plasma cleaning technology to remove residual particles and organic pollutants, ensuring that the surface cleanliness reaches below Class 10; The cleaned workpiece is subjected to full - automatic optical inspection to identify surface defects, scratches, and micro - cracks.

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