Device for treating and recycling chemical cleaning fluid in semiconductor grinding process

Abstract

The invention relates to the technical field of semiconductors, and discloses semiconductor grinding process chemical cleaning fluid treatment and recycling equipment which comprises a treatment cylinder, a partition plate is fixedly connected to the interior of the treatment cylinder, a control processor and an air pump are fixedly installed on the upper surface of the treatment cylinder, and an air inlet pipe is fixedly connected to an air inlet of the air pump; an air outlet of the air pump is fixedly connected with an air supply pipe. The heater works, so that the temperature of nearby wastewater is increased, the volume is expanded, the density is reduced, the wastewater is lighter than cold wastewater above and moves upwards, the cold wastewater above is pushed to the left side of the treatment barrel, and the wastewater at the bottom is extruded by the wastewater on the left side to be in contact with the heater, so that circular flow of the wastewater is formed; and the added flocculating agent is driven to flow along with the fan-shaped plates and is fully mixed when passing through the fan-shaped plates, so that the problems of overlarge mixture volume and higher water content caused by non-uniform distribution of the flocculating agent added into the wastewater in the prior art are solved.

Description

Technical Field

[0001] This application relates to the field of semiconductor technology, and particularly to a chemical cleaning liquid treatment, recycling and recovery device for the semiconductor grinding process. Background Art

[0002] In recent years, the semiconductor industry has demonstrated huge market potential and development prospects. In the process of transforming semiconductor wafers into final products with various functions, according to the requirements of product specifications and dimensions, the wafers must be ground and cut. During this process, in order to ensure the cleanliness of the wafers, water is used for cleaning, resulting in a large amount of wastewater. This grinding and cutting wastewater mainly contains suspended particulate matter and cleaning agent components, and is characterized by a high concentration of suspended substances, fine particles that are difficult to precipitate, turbid water quality, and relatively complex treatment due to poor biochemical properties and usually weak alkaline characteristics.

[0003] In the current chemical cleaning liquid treatment, recycling and recovery device for the semiconductor grinding process, when adding a flocculant into the treatment cylinder, the flocculant all falls below the feeding position, resulting in too large a mixture of solid particles and the flocculant near the feeding position, and it is difficult for the liquid in the mixture to drain out. This makes the moisture content of the mixture relatively high, resulting in a reduction in the amount of recycled water. Due to the large amount of liquid, after the flocculant enters the treatment cylinder, it is difficult to quickly and evenly mix with the liquid. If a strong stirring device is set, it is easy to cause the mixture of solid particles and the flocculant to be dispersed, affecting the flocculation effect. Therefore, how to effectively solve the uniform distribution of the flocculant and improve the recycling utilization rate of the liquid is the key problem to be solved currently. Summary of the Invention

[0004] This application proposes a chemical cleaning liquid treatment, recycling and recovery device for the semiconductor grinding process, which has the advantages of uniform distribution of the flocculant and improved recycling utilization rate of the liquid, and is used to solve the problem that the flocculant all falls at the adding position, resulting in too large a mixture of solid particles and the flocculant at the nearby position.

[0005] To achieve the above object, this application adopts the following technical solution: A chemical cleaning liquid treatment, recycling and recovery device for the semiconductor grinding process, including a treatment cylinder, an internal partition of the treatment cylinder is fixedly connected, a control processor and an air pump are fixedly installed on the upper surface of the treatment cylinder, an air inlet pipe of the air pump is fixedly connected, an air supply pipe of the air pump is fixedly connected, a cylinder cover is movably installed on the top of the treatment cylinder, and a heater is arranged on the right side of the partition;

[0006] A telescopic rod, a rotating plate is rotatably installed at the telescopic end of the telescopic rod, a push rod is fixedly connected to the bottom surface of the front end of the rotating plate, and a sealing sleeve is movably installed at the bottom end of the push rod;

[0007] The material distribution mechanism, the upper surface of the material distribution mechanism is provided with a blanking pipe, and the top end of the blanking pipe is communicated with a material cylinder;

[0008] The mixing mechanism, the mixing mechanism is arranged on the left side inside the treatment cylinder, and a flow velocity monitor is arranged on the left side of the mixing mechanism. The above structure can monitor the flow velocity of the wastewater through the flow velocity monitor during operation.

[0009] Preferably, the material distribution mechanism includes a cylinder, a material distribution cavity is opened inside the cylinder, a plurality of short pipes are communicated with the bottom of the material distribution cavity, a fixing ring is fixedly connected inside the short pipe, a plurality of through holes are opened inside the fixing ring, springs are fixedly connected to the upper and lower surfaces of the fixing ring, a T-shaped rod is slidably connected to the middle of the fixing ring, and sealing rings are arranged at the top end and the bottom end of the T-shaped rod. The above structure can, during operation, after the flocculant contacts the upper surface of the T-shaped rod, push the T-shaped rod to move downward, so that the material distribution cavity is communicated with the inside of the treatment cylinder, and the flocculant is discharged into the wastewater.

[0010] Preferably, the mixing mechanism includes a shaft body, an air duct is opened in the middle of the shaft body, a plurality of sector plates are fixedly connected to the curved surface of the shaft body, a sector cavity is opened inside the sector plate, a plurality of exhaust holes are opened on the lower curved surface of the sector plate, connecting rings are fixedly connected to the edges of the two lowest sector plates, and a limiting ring is arranged below the connecting ring. The above structure can, during operation, the flocculant entering the wastewater will flow with the wastewater. When flowing through a plurality of sector plates, each sector plate will divide the wastewater and the flocculant into smaller parts and promote the contact of these wastewater and flocculant. As the wastewater and the flocculant move along the length direction of the sector plate, this process of division and recombination is continuously repeated, so as to achieve an efficient mixing effect.

[0011] Preferably, the heater is fixedly connected to the inner wall of the treatment cylinder, the telescopic rod is fixedly connected to the upper surface of the treatment cylinder, the material cylinder is fixedly connected to the upper surface of the treatment cylinder, the flow velocity monitor is fixedly connected to the inner wall of the treatment cylinder, and the blanking pipe is fixedly connected to the treatment cylinder.

[0012] Preferably, the upper spring is fixedly connected to the top end of the T-shaped rod, the lower spring is fixedly connected to the bottom end of the T-shaped rod, and the sealing ring is fixedly connected to the inner wall of the short pipe.

[0013] Preferably, the sector cavity is communicated with the air duct, and the limiting ring, the two middle sector plates are perpendicular to the upper and lower sector plates.

[0014] Preferably, the distance between the partition plate and the top and bottom of the treatment cylinder is equal, and the cylinder is fixedly connected to the air supply pipe.

[0015] Preferably, the limiting ring is fixedly connected to both the treatment cylinder and the partition plate. The fixed ring is in contact with both the treatment cylinder and the partition plate. The air duct is communicated with the air supply pipe. With the above structure, during operation, the air pump supplies air into the air supply pipe. The gas will enter the air duct, then enter the fan-shaped cavity and be discharged from the exhaust holes. The discharged gas will push the wastewater to flow downward, further promoting the flow of wastewater inside the treatment cylinder. Moreover, the bubbles discharged from the exhaust holes can help disperse the flocculant. The air pump works to supply air into the air supply pipe. The gas will enter the air duct, then enter the fan-shaped cavity and be discharged from the exhaust holes. The discharged gas will push the wastewater to flow downward, further promoting the flow of wastewater inside the treatment cylinder. Moreover, the bubbles discharged from the exhaust holes can help disperse the flocculant.

[0016] Preferably, an inner chamfer is provided on the upper part of the fixed ring. The sealing sleeve is adapted to the material cylinder. With the above structure, during operation, it can prevent sediment from falling above the fixed ring and ensure good sealing between the sealing sleeve and the material cylinder.

[0017] Preferably, the lower surface of the column body is flush with the upper surface of the partition plate. The heater is located in the middle and lower part of the partition plate. With the above structure, during operation, it can heat the cleaning liquid wastewater inside the treatment cylinder. The temperature of the wastewater near the heater will rise first, its volume will expand, its density will decrease, and it will become lighter than the cold wastewater above. So it will move upward, enabling a sufficient amount of cold water to enter the left side of the treatment cylinder.

[0018] The beneficial effects of the present invention are as follows:

[0019] 1. By the operation of the heater, the cleaning liquid wastewater inside the treatment cylinder is heated. The temperature of the wastewater near the heater will rise first, its volume will expand, its density will decrease, and it will become lighter than the cold wastewater above. So it will move upward, pushing the cold wastewater above to the left side of the treatment cylinder. The wastewater at the bottom is squeezed by the wastewater on the left side, making it contact the heater, thus forming a circulating flow of wastewater, which drives the added flocculant to flow along. When passing through multiple fan-shaped plates, it will be fully mixed. At the same time, it avoids the mixture of solid particles and flocculant from being scattered, thus solving the problem that the existing flocculant is unevenly distributed when added to the wastewater, resulting in a too large volume and high water content of the mixture.

[0020] 2. The flow velocity monitor of the present invention monitors the flow velocity of the wastewater. When the wastewater is flowing, it will transmit a signal to the control processor. At the same time, the flow velocity monitor monitors the flow velocity of the wastewater and transmits the signal to the control processor, so as to control the shortening amount of the telescopic rod per unit time according to the flow velocity of the wastewater. The shortening of the telescopic rod will drive the rotating plate, the push rod and the sealing sleeve to move downward, pushing the flocculant into the feeding pipe and the distribution chamber, and finally adding it to the wastewater, further making the mixing of the flocculant more uniform. At the same time, after the addition of the flocculant is completed, the inside of the barrel will inhale and then discharge the wastewater, so as to discharge the remaining flocculant into the wastewater.

[0021] 3. The present invention works by means of an air pump to supply air into the inside of the air supply pipe. The gas will enter the air duct, then enter the fan-shaped chamber and be discharged from the exhaust holes. The discharged gas will push the wastewater to flow downward, further promoting the flow of the wastewater inside the treatment cylinder. Moreover, the bubbles discharged from the exhaust holes can help disperse the flocculant, making it more evenly distributed in the entire wastewater, thereby promoting the effective collision and aggregation between the particles in the wastewater and forming larger and more stable flocs. BRIEF DESCRIPTION OF THE DRAWINGS

[0022] The drawings forming a part of the specification illustrate the embodiments disclosed in the present application and, together with the specification, are used to explain the principles disclosed in the present application in a clear and understandable manner.

[0023] With reference to the drawings, the present disclosure can be more clearly understood from the following detailed description, wherein:

[0024] Figure 1 is a schematic external view of the present invention;

[0025] Figure 2 is a schematic semi-sectional view of the treatment cylinder of the present invention;

[0026] Figure 3 is a schematic semi-sectional view of the barrel of the present invention;

[0027] Figure 4 is Figure 3 an enlarged schematic view of part A in

[0028] Figure 5 is a schematic semi-sectional view of the column of the present invention;

[0029] Figure 6 is Figure 5 an enlarged schematic view of part B in

[0030] Figure 7 is a schematic semi-sectional view of the shaft of the present invention.

[0031] Wherein: 1. Processing cylinder; 2. Partition board; 3. Control processor; 4. Air pump; 5. Intake pipe; 6. Supply pipe; 7. Telescopic rod; 8. Rotating plate; 9. Push rod; 10. Sealing sleeve; 11. Feeding mechanism; 111. Cylinder body; 112. Feeding cavity; 113. Short pipe; 114. Fixed ring; 115. Through hole; 116. Spring; 117. I-shaped rod; 118. Sealing ring; 12. Discharge pipe; 13. Hopper; 14. Mixing mechanism; 141. Shaft body; 142. Air passage; 143. Sector plate; 144. Sector cavity; 145. Exhaust hole; 146. Connecting ring; 147. Limiting ring; 15. Flow rate monitor; 16. Cylinder cover; 17. Heater. Detailed implementation manners

[0032] The following will clearly and completely describe the technical solutions in the embodiments of the present application with reference to the accompanying drawings in the embodiments of the present application. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present application without creative efforts shall fall within the protection scope of the present application.

[0033] Please refer to Figures 1-7 , a chemical cleaning liquid treatment and recycling device for semiconductor grinding process is disclosed, including a processing cylinder 1, a partition board 2 is fixedly connected inside the processing cylinder 1, a control processor 3 and an air pump 4 are fixedly installed on the upper surface of the processing cylinder 1, an intake pipe 5 is fixedly connected to the intake port of the air pump 4, a supply pipe 6 is fixedly connected to the outlet port of the air pump 4, a cylinder cover 16 is movably installed on the top of the processing cylinder 1, and a heater 17 is arranged on the right side of the partition board 2;

[0034] A telescopic rod 7, a rotating plate 8 is rotatably installed at the telescopic end of the telescopic rod 7, a push rod 9 is fixedly connected to the bottom surface of the front end of the rotating plate 8, and a sealing sleeve 10 is movably installed at the bottom end of the push rod 9;

[0035] A feeding mechanism 11, a discharge pipe 12 is arranged on the upper surface of the feeding mechanism 11, and the top end of the discharge pipe 12 communicates with a hopper 13;

[0036] A mixing mechanism 14, the mixing mechanism 14 is arranged on the left side inside the processing cylinder 1, and a flow rate monitor 15 is arranged on the left side of the mixing mechanism 14.

[0037] Wherein, the feeding mechanism 11 includes a cylinder body 111, a feeding cavity 112 is opened inside the cylinder body 111, a plurality of short pipes 113 communicate with the bottom of the feeding cavity 112, a fixed ring 114 is fixedly connected inside the short pipe 113, a plurality of through holes 115 are opened inside the fixed ring 114, springs 116 are fixedly connected to the upper and lower surfaces of the fixed ring 114, an I-shaped rod 117 is slidably connected to the middle of the fixed ring 114, and sealing rings 118 are arranged at the top and bottom ends of the I-shaped rod 117;

[0038] Its function is that the flow velocity monitor 15 monitors the flow velocity of the wastewater. When the wastewater is flowing, it will transmit a signal to the control processor 3. At the same time, the flow velocity monitor 15 monitors the flow velocity of the wastewater and transmits the signal to the control processor 3, so as to control the shortening amount of the telescopic rod 7 per unit time according to the flow velocity of the wastewater. The shortening of the telescopic rod 7 will drive the rotating plate 8, the push rod 9 and the sealing sleeve 10 to move downward, pushing the flocculant into the feeding pipe 12 and the material distribution cavity 112, and finally adding it to the wastewater, further making the mixing of the flocculant more uniform. At the same time, after the addition of the flocculant is completed, the inside of the material cylinder 13 will suck in the wastewater and then discharge it, so as to discharge the remaining flocculant into the wastewater.

[0039] Among them, the mixing mechanism 14 includes a shaft body 141. An air passage 142 is provided in the middle of the shaft body 141. A plurality of sector plates 143 are fixedly connected to the curved surface of the shaft body 141. A sector cavity 144 is provided inside the sector plate 143. A plurality of exhaust holes 145 are provided on the lower curved surface of the sector plate 143. Connecting rings 146 are fixedly connected to the edges of the two lowermost sector plates 143. A limiting ring 147 is provided below the connecting ring 146.

[0040] Among them, the heater 17 is fixedly connected to the inner wall of the treatment cylinder 1, the telescopic rod 7 is fixedly connected to the upper surface of the treatment cylinder 1, the material cylinder 13 is fixedly connected to the upper surface of the treatment cylinder 1, the flow velocity monitor 15 is fixedly connected to the inner wall of the treatment cylinder 1, and the feeding pipe 12 is fixedly connected to the treatment cylinder 1;

[0041] Its function is that when the heater 17 works, it heats the cleaning liquid wastewater inside the treatment cylinder 1. The temperature of the wastewater near the heater 17 will first rise, the volume expands, the density decreases, and it becomes lighter than the cold wastewater above. So it moves upward, pushing the cold wastewater above to the left side of the treatment cylinder 1, and the wastewater at the bottom is squeezed by the wastewater on the left side, so that it contacts the heater 17, thus forming a circulating flow of the wastewater, driving the added flocculant to flow along with it. When passing through a plurality of sector plates 143, it will be fully mixed. At the same time, it avoids the mixture formed by solid particles and the flocculant from being dispersed, thus solving the problem that the existing flocculant is unevenly distributed when added to the wastewater, resulting in too large a volume of the mixture and a high water content.

[0042] Among them, the upper spring 116 is fixedly connected to the top end of the I-shaped rod 117, the lower spring 116 is fixedly connected to the bottom end of the I-shaped rod 117, the sealing ring 118 is fixedly connected to the inner wall of the short pipe 113, the sector cavity 144 is communicated with the air passage 142, the limiting ring 147, the two middle sector plates 143 are perpendicular to the upper and lower sector plates 143, the partition plate 2 is at an equal interval distance from the top and bottom of the treatment cylinder 1, and the cylinder 111 is fixedly connected to the air supply pipe 6;

[0043] Its function is that when the air pump 4 works, air is supplied into the inside of the air supply pipe 6. The gas will enter the air passage 142, then enter the fan-shaped cavity 144 and be discharged from the exhaust holes 145. The discharged gas will push the wastewater to flow downward, further promoting the flow of the wastewater inside the treatment cylinder 1. Moreover, the bubbles discharged from the exhaust holes 145 can help disperse the flocculant, making it more evenly distributed throughout the wastewater, thereby promoting the effective collision and aggregation between the particles in the wastewater and forming larger and more stable flocs.

[0044] Among them, the limiting ring 147 is fixedly connected to both the treatment cylinder 1 and the partition plate 2. The fixing ring 114 is in contact with both the treatment cylinder 1 and the partition plate 2. The air passage 142 is communicated with the air supply pipe 6. The upper part of the fixing ring 114 is provided with an inner chamfer, and the sealing sleeve 10 is adapted to the material cylinder 13.

[0045] Its function is to prevent the sediment from falling above the fixing ring 114 and make the sealing between the sealing sleeve 10 and the material cylinder 13 good.

[0046] Among them, the lower surface of the column 111 is flush with the upper surface of the partition plate 2, and the heater 17 is located in the middle and lower part of the partition plate 2.

[0047] Its function is that when the heater 17 works, it heats the cleaning liquid wastewater inside the treatment cylinder 1. The temperature of the wastewater near the heater 17 will first rise, the volume expands, the density decreases, and it becomes lighter than the cold wastewater above, so it moves upward, enabling a sufficient amount of cold water to enter the left side of the treatment cylinder 1.

[0048] Working principle:

[0049] Open the cylinder cover 16, add an appropriate amount of cleaning liquid wastewater into the inside of the treatment cylinder 1, so that the liquid level of the cleaning liquid wastewater is above the upper surface of the partition plate 2, and the telescopic rod 7 is in the longest state. At this time, the sealing sleeve 10 will disengage from the material cylinder 13. Rotate the rotating plate 8 to drive the push rod 9 and the sealing sleeve 10 to one side. According to the amount of the added cleaning liquid wastewater, add the required solid flocculant or liquid flocculant into the inside of the material cylinder 13, and rotate the rotating plate 8 to make the push rod 9 and the sealing sleeve 10 located directly above the material cylinder 13.

[0050] The heater 17 operates to heat the cleaning liquid wastewater inside the treatment cylinder 1. The temperature of the wastewater near the heater 17 will first rise, causing the volume to expand, the density to decrease, and it becomes lighter than the cold wastewater above. So it moves upward, pushing the cold wastewater above to the left side of the treatment cylinder 1. And the wastewater at the bottom is squeezed by the wastewater on the left, causing it to come into contact with the heater 17, thus forming a circulating flow of wastewater. Meanwhile, the air pump 4 operates to supply air into the inside of the air supply pipe 6. The gas will enter the air duct 142, then enter the fan-shaped cavity 144 and be discharged from the exhaust hole 145. The discharged gas will push the wastewater to flow downward, further promoting the flow of the wastewater inside the treatment cylinder 1. The flow velocity monitor 15 will monitor the flow velocity of the wastewater. When the wastewater is flowing, it will transmit a signal to the control processor 3. The control processor 3 will control the telescopic rod 7 to shorten. The faster the flow velocity of the wastewater, the greater the shortening amount of the telescopic rod 7 per unit time. Conversely, the shortening amount of the telescopic rod 7 per unit time decreases;

[0051] The shortening of the telescopic rod 7 will drive the rotating plate 8, the push rod 9 and the sealing sleeve 10 to move downward. After the sealing sleeve 10 enters the inside of the material cylinder 13, it will push the flocculant into the feeding pipe 12, the distribution cavity 112, and then into the short pipe 113. When the flocculant contacts the upper surface of the I-shaped rod 117, it will push the I-shaped rod 117 to move downward, thus connecting the distribution cavity 112 with the inside of the treatment cylinder 1, and discharging the flocculant into the wastewater. The flocculant entering the wastewater will flow along with the wastewater. When flowing through multiple fan-shaped plates 143, each fan-shaped plate 143 will divide the wastewater and the flocculant into smaller parts and prompt these wastewater and flocculant to come into contact. As the wastewater and the flocculant move along the length direction of the fan-shaped plate 143, this process of division and recombination is continuously repeated, thus achieving an efficient mixing effect; During the process, the presence of bubbles can help disperse the flocculant, making it more evenly distributed throughout the wastewater, and further promoting the effective collision and aggregation between particles in the wastewater, forming larger and more stable flocs;

[0052] When all the flocculant inside the material cylinder 13 is completely discharged, the telescopic rod 7 will extend, causing the I-shaped rod 117 to move upward, connecting the wastewater with the distribution cavity 112, thus sucking the wastewater into the inside of the distribution cavity 112, the feeding pipe 12 and the material cylinder 13, discharging the residual flocculant solvent, and then discharging the wastewater in the distribution cavity 112, the feeding pipe 12 and the material cylinder 13, thus completing the precise addition of the flocculant. Subsequently, the heater 17 and the air pump 4 stop working, waiting for the particles of the wastewater to precipitate to the bottom of the treatment cylinder 1, thus completing the treatment of the wastewater.

[0053] It should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. A chemical cleaning liquid treatment, recycling and recovery device for a semiconductor grinding process, characterized in that, Including: A processing cylinder (1), inside which a partition (2) is fixedly connected. On the upper surface of the processing cylinder (1), a control processor (3) and an air pump (4) are fixedly installed. The air inlet of the air pump (4) is fixedly connected to an intake pipe (5), and the air outlet of the air pump (4) is fixedly connected to a supply pipe (6). A cylinder cover (16) is movably installed on the top of the processing cylinder (1). A heater (17) is arranged on the right side of the partition (2). A telescopic rod (7), at the telescopic end of which a rotating plate (8) is rotatably installed. At the bottom surface of the front end of the rotating plate (8), a push rod (9) is fixedly connected. At the bottom end of the push rod (9), a sealing sleeve (10) is movably installed. A material distribution mechanism (11), on the upper surface of which a feeding pipe (12) is arranged. The top end of the feeding pipe (12) is communicated with a material cylinder (13). A mixing mechanism (14), which is arranged on the left side inside the processing cylinder (1). A flow rate monitor (15) is arranged on the left side of the mixing mechanism (14).

2. The chemical cleaning liquid treatment and recycling equipment for a semiconductor grinding process according to claim 1, wherein The material distribution mechanism (11) includes a cylinder body (111), inside which a material distribution cavity (112) is formed. The bottom of the material distribution cavity (112) is communicated with a plurality of short pipes (113). Inside the short pipes (113), a fixing ring (114) is fixedly connected. Inside the fixing ring (114), a plurality of through holes (115) are formed. Springs (116) are fixedly connected to both the upper and lower surfaces of the fixing ring (114). A T-shaped rod (117) is slidably connected to the middle of the fixing ring (114). Sealing rings (118) are arranged at both the top and bottom ends of the T-shaped rod (117).

3. A chemical cleaning liquid treatment, recycling and recovery device for a semiconductor grinding process according to claim 2, characterized in that, The mixing mechanism (14) includes a shaft body (141), inside which an air passage (142) is formed. A plurality of sector plates (143) are fixedly connected to the curved surface of the shaft body (141). Inside the sector plates (143), sector cavities (144) are formed. A plurality of exhaust holes (145) are formed on the lower curved surface of the sector plates (143). Connecting rings (146) are fixedly connected to the edges of the two lowermost sector plates (143). A limiting ring (147) is arranged below the connecting rings (146).

4. A semiconductor grinding process chemical cleaning liquid treatment, recycling and recovery device according to claim 3, characterized in that, The heater (17) is fixedly connected to the inner wall of the processing cylinder (1). The telescopic rod (7) is fixedly connected to the upper surface of the processing cylinder (1). The material cylinder (13) is fixedly connected to the upper surface of the processing cylinder (1). The flow rate monitor (15) is fixedly connected to the inner wall of the processing cylinder (1). The feeding pipe (12) is fixedly connected to the processing cylinder (1).

5. The chemical cleaning liquid treatment and recycling equipment for a semiconductor grinding process according to claim 4, wherein, The upper spring (116) is fixedly connected to the top end of the T-shaped rod (117), and the lower spring (116) is fixedly connected to the bottom end of the T-shaped rod (117). The sealing ring (118) is fixedly connected to the inner wall of the short pipe (113).

6. A semiconductor grinding process chemical cleaning liquid treatment, recycling and recovery device according to claim 5, characterized in that, The sector cavity (144) is in communication with the air duct (142). For the limiting ring (147), the two sector plates (143) in the middle are perpendicular to the sector plates (143) above and below.

7. A semiconductor grinding process chemical cleaning liquid treatment, recycling and recovery device according to claim 6, characterized in that, The distance between the partition plate (2) and the top and bottom of the processing cylinder (1) is equal. The cylinder (111) is fixedly connected to the air supply pipe (6).

8. A semiconductor grinding process chemical cleaning liquid treatment, recycling and recovery device according to claim 7, characterized in that, The limiting ring (147) is fixedly connected to both the processing cylinder (1) and the partition plate (2). The fixing ring (114) is in contact with both the processing cylinder (1) and the partition plate (2). The air duct (142) is in communication with the air supply pipe (6).

9. The chemical cleaning liquid treatment recycling equipment for a semiconductor grinding process according to claim 8, characterized in that, The upper part of the fixing ring (114) is provided with an inner chamfer. The sealing sleeve (10) is adapted to the material cylinder (13).

10. A semiconductor grinding process chemical cleaning liquid treatment, recycling and recovery device according to claim 9, characterized in that, The lower surface of the cylinder (111) is flush with the upper surface of the partition plate (2). The heater (17) is located in the middle and lower part of the partition plate (2).

Images