Clamp tool for quantum chip processing

Abstract

The invention discloses a clamp tool for quantum chip processing, and relates to the field of clamps, the clamp tool comprises a device body, a sliding groove is formed in the top of the device body, a spring is arranged in the sliding groove, a pressure alarm is arranged at the center of the top of the device body, and the clamp tool further comprises stabilizing devices arranged on the left side and the right side of the top of the device body. The stabilizing device comprises a fixing plate, an electric telescopic rod, a concentric-square-shaped telescopic plate and a stabilizing assembly, the bottom of the fixing plate is fixedly installed on the top of the device body, and the right side of the electric telescopic rod is fixedly installed on the left side of the fixing plate and fixedly installed on the left side of the telescopic end of the electric telescopic rod. According to the chip clamping device, the telescopic ends of the concentric-square-shaped telescopic plates gradually draw close to clamp chips, the chips are prevented from falling off in the machining process, the concentric-square-shaped telescopic plates can effectively clamp the chips with different sizes by means of free telescopic changes of the telescopic ends of the concentric-square-shaped telescopic plates, and the machining preparation time is saved.

Description

Technical Field

[0001] The present invention relates to the technical field of jigs, and particularly to a jig tooling for quantum chip processing. Background Art

[0002] A quantum chip is the core component of a quantum computer. During the processing of a quantum chip, a vapor deposition process is adopted. On a substrate made of materials such as silicon wafers or sapphires, a quantum circuit and quantum devices are obtained by using a patterned mask, thereby obtaining a quantum chip with quantum information processing functions.

[0003] The patent with the patent announcement number CN218203016U discloses a jig for quantum chip processing, which is used for clamping a substrate and a mask. The jig for quantum chip processing includes a first clamping element for fixing the substrate, and a second clamping element for fixing the mask. Among them, the first clamping element is fixedly connected to the second clamping element, and the substrate and the mask are stacked. In this patent, by setting the first clamping element and the second clamping element to clamp the substrate and the mask respectively, the substrate and the mask are kept fixed respectively. Moreover, since the first clamping element is fixedly connected to the second clamping element, the substrate and the mask can be kept relatively fixed, avoiding relative displacement between the substrate and the mask during the quantum chip processing, thereby effectively ensuring the yield rate of quantum chip production.

[0004] However, this device still has deficiencies: This device can avoid relative displacement between the substrate and the mask during the quantum chip processing. However, when dealing with the processing of quantum chips with different diameters, it is difficult for this device to make timely adjustments for the same diameter, which is likely to delay the processing progress. Therefore, it is very necessary to design a jig tooling for quantum chip processing that relies on the free expansion and contraction of the telescopic end of a loop-shaped telescopic plate, so that the loop-shaped telescopic plate can effectively clamp quantum chips with different diameters. Summary of the Invention

[0005] The purpose of the present invention is to provide a jig tooling for quantum chip processing to solve the problems raised in the above background art.

[0006] To solve the above technical problems, the present invention provides the following technical solutions: A fixture tooling for quantum chip processing, including a device main body. A chute is provided at the top of the device main body, and a spring is provided inside the chute. A pressure alarm is provided at the center of the top of the device main body. It also includes a stabilizing device, a protection device, an air flow circulation device, and a cross-flow device. The stabilizing device is arranged on the left and right sides of the top of the device main body. The protection device is arranged above the stabilizing device. The air flow circulation device is arranged above the protection device. The cross-flow device is arranged on the front of the stabilizing device. The stabilizing device includes a fixed plate, an electric telescopic rod, a return-shaped telescopic plate, and a stabilizing component. The bottom of the fixed plate is fixedly installed on the top of the device main body, and the fixed plate provides good stability for the electric telescopic rod. The right side of the electric telescopic rod is fixedly installed on the left side of the fixed plate. The right side of the return-shaped telescopic plate is fixedly installed on the left side of the telescopic end of the electric telescopic rod. The telescopic end of the electric telescopic rod moves towards the center of the device main body, thereby squeezing the return-shaped telescopic plate to move synchronously. The telescopic ends of the return-shaped telescopic plate gradually approach to clamp the chip, preventing the chip from falling off during the chip processing. The stabilizing device is arranged on the left side of the inner wall of the return-shaped telescopic plate.

[0007] According to the above technical solution, a spring is provided on the outer wall of the telescopic end of the electric telescopic rod, and a chute is provided inside the inner wall of the return-shaped telescopic plate, and a torsion spring is provided inside the chute.

[0008] According to the above technical solution, the stabilizing component includes an inclined rod and an inclined plate. The right end of the inclined rod is hinged inside the chute of the return-shaped telescopic plate through a torsion spring. The back of the inclined plate is hinged to one end of the front of the inclined rod, and the bottom of the inclined plate is located above the bottom of the inner wall of the return-shaped telescopic plate. The return-shaped telescopic plate drives the inclined rod to move synchronously, and the inclined rod drives the inclined plate to move synchronously. When the inclined plate moves towards the center of the device main body and touches the surface of the chip, it will move towards both ends away from the center of the chip. At this time, the inclined plate will scrape the dirt on the surface of the chip, preventing the dirt from adhering during the chip processing and reducing the quality of the chip finished product.

[0009] According to the above technical solution, the protection device includes a transmission rod, an L-shaped telescopic plate, and a protection component. One end of the bottom of the transmission rod is hinged to the top of the outer wall of the telescopic end of the electric telescopic rod. The bottom left of the L-shaped telescopic plate is fixedly installed on the left side of the top of the device main body, and the bottom of the telescopic end of the L-shaped telescopic plate is hinged to one end of the top of the transmission rod. The telescopic end of the electric telescopic rod drives the transmission rod to move synchronously, and the transmission rod drives the telescopic end of the L-shaped telescopic plate to move towards the center of the device main body. At this time, the L-shaped telescopic plate will form a shield above the return-shaped telescopic plate, preventing debris from falling from above during the chip processing and damaging the chip. The protection component is arranged on the top right of the L-shaped telescopic plate.

[0010] According to the above technical solution, the protection component includes a U-shaped plate, a pull rod, a roller and a spring piece. The bottom of the inner wall of the U-shaped plate is slidably installed at the top of the inner wall on the right side of the L-shaped telescopic plate. The left end of the pull rod is hinged to the bottom right side of the U-shaped plate, and the right end of the pull rod is hinged to the bottom of the telescopic end of the L-shaped telescopic plate. The roller is rotatably installed inside the U-shaped plate through a cylinder, and the outer wall of the roller contacts the top surface of the L-shaped telescopic plate. When the telescopic end of the L-shaped telescopic plate drives the pull rod to move synchronously, the pull rod drives the U-shaped plate to move synchronously, and the U-shaped plate drives the roller to move synchronously. When the roller contacts the L-shaped telescopic plate, the roller starts to rotate due to the generated frictional force and rolls and adsorbs the dirt on the top of the L-shaped telescopic plate, preventing the dirt on the surface of the L-shaped telescopic plate from adhering and solidifying for a long time, and causing corrosion to the L-shaped telescopic plate. The spring piece is fixedly installed between the left side of the bottom of the U-shaped plate and the right side of the L-shaped telescopic plate. When the U-shaped plate slides, it pulls the spring piece to deform synchronously. When the transmission rod stops moving, the spring piece relies on its own elasticity to pull the U-shaped plate to move left and right during the recovery process, and the U-shaped plate drives the roller to roll back and forth along the surface of the L-shaped telescopic plate, further improving the adsorption effect on dirt.

[0011] According to the above technical solution, the air flow circulation device includes a cross bar, an H-shaped carbon plate and an air flow circulation component. The outer wall of the cross bar penetrates and is fixedly installed at the bottom of the spring piece. The inner walls on the front and back sides of the H-shaped carbon plate are fixedly installed at the left and right ends of the cross bar. When the spring piece deforms, it drives the cross bar to move up and down, and the cross bar will drive the H-shaped carbon plate to move synchronously. At this time, the H-shaped carbon plate expands the contact range with harmful gases, and further expands the purification frequency of harmful gases. The air flow circulation component is arranged above the H-shaped carbon plate.

[0012] According to the above technical solution, the air flow circulation component includes a downstream plate and an arc-shaped guide plate. The bottom of the downstream plate is fixedly installed at the top edge of the H-shaped carbon plate. When the H-shaped carbon plate moves up and down, it drives the downstream plate to move synchronously. The downstream plate relies on its smooth inner wall to prevent solid particles in harmful gases from adhering. The bottom of the arc-shaped guide plate is fixedly installed on the top of the downstream plate. When the downstream plate moves up and down, it drives the arc-shaped guide plate to move synchronously. When the arc-shaped guide plate contacts the air, the resistance causes its arc surface to bend downward and deform, thereby agitating the gas downward. Repeating this process causes the gas to circulate downward along the arc surface of the arc-shaped guide plate.

[0013] According to the above technical solution, the cross-flow device includes a pressing plate, a cooling component and a cross-flow component. The top of the pressing plate is fixedly installed at the bottom edge of the H-shaped carbon plate. The bottom of the cooling component is slidably installed on the top of the device body. The cooling component emits cold air towards the center of the device body to prevent the high temperature generated during chip processing from softening the chip body and avoid adverse phenomena such as deformation during chip processing. The cross-flow component is arranged on the back of the cooling component.

[0014] According to the above technical solution, the bottom of the pressing plate is in contact with the inclined surface at the top of the cooling component, and the bottom of the cooling component is fixedly connected to the spring in the top chute of the device body.

[0015] According to the above technical solution, the cross-flow component includes an L-shaped rod and a baffle plate. The front of the top of the L-shaped rod is fixedly installed on the back of the pressing plate. The top of the baffle plate is fixedly connected to the bottom of the L-shaped rod, and the baffle plate is located below the retractable plate. When the pressing plate moves up and down, it drives the L-shaped rod to move synchronously. The L-shaped rod drives the baffle plate to move synchronously. The baffle plate fans the cold air circulation up and down, accelerating the flow rate of the cold air circulation. Relying on the cooperation with the arc-shaped guide plate, the cold air can circulate and cool the H-shaped carbon plate, ensuring that the H-shaped carbon plate body is at a low temperature, thereby preventing the growth of bacteria caused by solid dirt adhering to the surface of the H-shaped carbon plate.

[0016] Compared with the prior art, the beneficial effects achieved by the present invention are as follows: (1) Through the setting of the stabilizing device in the present invention, with the cooperation of the fixing plate, the electric telescopic rod and the retractable plate, the fixing plate provides good stability for the electric telescopic rod. The telescopic end of the electric telescopic rod moves towards the center of the device body, thereby squeezing the retractable plate to move synchronously. The telescopic ends of the retractable plate gradually approach to clamp the chip, preventing the chip from falling off during the chip processing. At the same time, relying on the free telescopic change of the telescopic ends of the retractable plate, the retractable plate can effectively clamp chips of different sizes, saving the processing preparation time. When the inclined plate moves towards the center of the device body and contacts the surface of the chip, it will stroke towards the two ends away from the center of the chip. At this time, the inclined plate will scrape the dirt on the surface of the chip, preventing dirt from adhering during the chip processing and reducing the quality of the chip finished product. When the inclined rod is restored by the torsion spring, it drives the inclined plate to reset synchronously, thus realizing the automatic reset effect and facilitating the next processing use.

[0017] (2) Through the setting of the protection device, the electric telescopic rod, transmission rod, and L-shaped telescopic plate cooperate to make the transmission rod drive the telescopic end of the L-shaped telescopic plate to move towards the center of the device body. The L-shaped telescopic plate will block the upper part of the loop-shaped telescopic plate, preventing debris from falling from above during chip processing and damaging the chip, ensuring a safe processing environment for the chip. At the same time, the L-shaped telescopic plate also blocks the splashes generated during chip processing, preventing the splashes from flying around and polluting the processing environment, avoiding increasing the difficulty of later maintenance; through the cooperation of the U-shaped plate, pull rod, and roller, when the roller contacts the L-shaped telescopic plate, it starts to rotate due to the generated frictional force. When the roller rotates, it will roll and adsorb the dirt on the top of the L-shaped telescopic plate, preventing the dirt on the surface of the L-shaped telescopic plate from adhering and solidifying for a long time, causing corrosion to the L-shaped telescopic plate, and avoiding shortening the service life of the L-shaped telescopic plate; through the setting of the elastic piece, when the transmission rod stops moving, the elastic piece relies on its own elasticity to pull the U-shaped plate to move left and right during the recovery process. The U-shaped plate drives the roller to roll back and forth along the surface of the L-shaped telescopic plate, increasing the rolling friction frequency of the roller and further improving the adsorption effect on dirt.

[0018] (3) Through the setting of the air flow circulation device, through the setting of the H-shaped carbon plate, the harmful gas will gradually float upward and be purified by relying on the H-shaped carbon plate, avoiding being inhaled by the processing personnel and causing harm to physical health; through the cooperation of the elastic piece, cross bar, and H-shaped carbon plate, when the cross bar moves up and down, it will drive the H-shaped carbon plate to move synchronously, expanding the contact range between the H-shaped carbon plate and the harmful gas, further expanding the purification frequency of the harmful gas, thereby optimizing the purification quality of the harmful gas and preventing environmental pollution; through the setting of the downstream plate, when the H-shaped carbon plate moves up and down, it drives the downstream plate to move synchronously. The downstream plate relies on its smooth inner wall to prevent the solid particles in the harmful gas from adhering, ensuring the downstream speed of the gas while also reducing the pollution of the harmful gas to the downstream plate; through the setting of the arc-shaped guide plate, when the arc-shaped guide plate moves up and down, it will bend downward due to the resistance arc surface when contacting the air, thus agitating the gas downward. Repeating this process makes the gas circulate downward along the arc surface of the arc-shaped guide plate, increasing the purification effect while also promoting the adsorption effect of the H-shaped carbon plate on the harmful solid particles in the harmful gas, realizing the classification treatment of solid and gas.

[0019] (4) The present invention arranges a cross-flow device and a cooling component so that the cooling component emits cold air toward the center of the device body, thereby preventing the high temperature generated during chip processing from softening the chip body and avoiding undesirable phenomena such as deformation during chip processing; the pressure plate and the cooling component cooperate so that the pressure plate will contact the inclined surface of the cooling component to move the cooling component to the right, and the opposite cooling component will move to the left due to the offset distribution of the pressure plate, thereby achieving dispersed distribution of cold air. Compared with sliding in the same direction, the cold air coverage of the cooling component is further expanded, effectively avoiding excessive concentration of cold air that causes the chip to During processing, the alternating temperature of hot and cold is too large, resulting in embrittlement and cracks, which damages the chip and causes economic losses. Through the cooperation of the L-shaped rod and the baffle plate, the baffle plate moves up and down to fan the cold air circulation up and down, speeding up the circulation of the cold air, and relying on the cooperation with the arc guide plate, the cold air can circulate and cool the H-shaped carbon plate, ensuring the low temperature of the H-shaped carbon plate body, thereby preventing solid dirt adhering to the surface of the H-shaped carbon plate from causing bacterial reproduction and breeding, avoiding bacterial contamination of the H-shaped carbon plate, ensuring the overall cleanliness of the H-shaped carbon plate, thereby reducing the number of H-shaped carbon plates and reducing economic expenditure. BRIEF DESCRIPTION OF THE DRAWINGS

[0020] The accompanying drawings are used to provide a further understanding of the present invention and constitute a part of the specification. Together with the embodiments of the present invention, they are used to explain the present invention and do not constitute a limitation of the present invention. In the accompanying drawings: Figure 1 A schematic diagram of the present invention as a whole; Figure 2 It is a cross-sectional schematic diagram of the present invention as a whole; Figure 3 It is a schematic diagram of the stabilizing device of the present invention; Figure 4 It is a schematic diagram of the protective device of the present invention; Figure 5 This is a schematic diagram of the bottom perspective of the protective device of the present invention; Figure 6 It is a schematic diagram of the airflow circulation device of the present invention; Figure 7 It is a schematic diagram of the cross-flow device of the present invention.

[0021] In the figure: 1. Device main body; 2. Pressure alarm; 3. Stabilizing device; 31. Fixed plate; 32. Electric telescopic rod; 33. Return-shaped telescopic plate; 300. Stabilizing component; 301. Diagonal rod; 302. Diagonal plate; 4. Protection device; 41. Transmission rod; 42. L-shaped telescopic plate; 400. Protection component; 401. U-shaped plate; 402. Pull rod; 403. Roller; 404. Elastic sheet; 5. Airflow circulation device; 51. Cross bar; 52. H-shaped carbon plate; 500. Airflow circulation component; 501. Downstream plate; 502. Arc-shaped diversion plate; 6. Cross-flow device; 61. Pressing plate; 62. Cooling component; 600. Cross-flow component; 601. L-shaped rod; 602. Baffle plate. Detailed implementation manner

[0022] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention. Embodiment

[0023] Please refer to Figures 1-5 , this embodiment provides a technical solution: A fixture for quantum chip processing, including a device main body 1. A chute is provided at the top of the device main body 1, and a spring is provided inside the chute. A pressure alarm 2 is provided at the center of the top of the device main body 1. It also includes a stabilizing device 3 and a protection device 4. The stabilizing device 3 is provided on the left and right sides of the top of the device main body 1, and the protection device 4 is provided above the stabilizing device 3. The stabilizing device 3 includes a fixed plate 31, an electric telescopic rod 32, a return-shaped telescopic plate 33, and a stabilizing component 300. The bottom of the fixed plate 31 is fixedly installed on the top of the device main body 1. The fixed plate 31 provides good stability for the electric telescopic rod 32. The right side of the electric telescopic rod 32 is fixedly installed on the left side of the fixed plate 31. The right side of the return-shaped telescopic plate 33 is fixedly installed on the left side of the telescopic end of the electric telescopic rod 32. The telescopic end of the electric telescopic rod 32 moves towards the center of the device main body 1, thereby squeezing the return-shaped telescopic plate 33 to move synchronously. The telescopic ends of the return-shaped telescopic plate 33 gradually approach to clamp the chip, preventing the chip from falling off during the chip processing. The stabilizing device 3 is provided on the left inner wall of the return-shaped telescopic plate 33.

[0024] A spring is provided on the outer wall of the telescopic end of the electric telescopic rod 32, and a chute is opened on the inner wall of the return-shaped telescopic plate 33, and a torsion spring is provided inside the chute.

[0025] The stabilizing component 300 includes an inclined rod 301 and an inclined plate 302. The right end of the inclined rod 301 is hinged inside the chute of the loop-shaped telescopic plate 33 through a torsion spring. The back of the inclined plate 302 is hinged to one end of the front of the inclined rod 301, and the bottom of the inclined plate 302 is located above the bottom of the inner wall of the loop-shaped telescopic plate 33. The loop-shaped telescopic plate 33 drives the inclined rod 301 to move synchronously, and the inclined rod 301 drives the inclined plate 302 to move synchronously. When the inclined plate 302 moves towards the center of the device body 1 and touches the surface of the chip, it will move towards both ends away from the center of the chip. At this time, the inclined plate 302 will scrape the dirt on the surface of the chip to prevent dirt from adhering during the chip processing, thereby reducing the quality of the chip finished product.

[0026] The protection device 4 includes a transmission rod 41, an L-shaped telescopic plate 42, and a protection component 400. One end of the bottom of the transmission rod 41 is hinged to the top of the outer wall of the telescopic end of the electric telescopic rod 32. The bottom left side of the L-shaped telescopic plate 42 is fixedly installed on the top left side of the device body 1, and the bottom of the telescopic end of the L-shaped telescopic plate 42 is hinged to one end of the top of the transmission rod 41. The telescopic end of the electric telescopic rod 32 drives the transmission rod 41 to move synchronously, and the transmission rod 41 drives the telescopic end of the L-shaped telescopic plate 42 to move towards the center of the device body 1. At this time, the L-shaped telescopic plate 42 will form an occlusion above the loop-shaped telescopic plate 33 to prevent debris from falling from above during chip processing and damaging the chip. The protection component 400 is arranged on the top right side of the L-shaped telescopic plate 42.

[0027] The protection component 400 includes a U-shaped plate 401, a pull rod 402, a roller 403, and a spring piece 404. The bottom inner wall of the U-shaped plate 401 is slidably installed on the top of the right inner wall of the L-shaped telescopic plate 42. The left end of the pull rod 402 is hinged to the bottom right side of the U-shaped plate 401, and the right end of the pull rod 402 is hinged to the bottom of the telescopic end of the L-shaped telescopic plate 42. The roller 403 is rotatably installed inside the U-shaped plate 401 through a cylinder, and the outer wall of the roller 403 contacts the top surface of the L-shaped telescopic plate 42. The telescopic end of the L-shaped telescopic plate 42 drives the pull rod 402 to move synchronously, the pull rod 402 drives the U-shaped plate 401 to move synchronously, the U-shaped plate 401 drives the roller 403 to move synchronously, and the roller 403 starts to rotate due to the frictional force generated when contacting the L-shaped telescopic plate 42 to roll and adsorb the dirt on the top of the L-shaped telescopic plate 42, preventing the dirt on the surface of the L-shaped telescopic plate 42 from adhering and solidifying for a long time, causing corrosion to the L-shaped telescopic plate 42. The spring piece 404 is fixedly installed between the bottom left side of the U-shaped plate 401 and the right side of the L-shaped telescopic plate 42. When the U-shaped plate 401 slides, it pulls the spring piece 404 to deform synchronously. When the transmission rod 41 stops moving, the spring piece 404 relies on its own elasticity to pull the U-shaped plate 401 to move left and right during the recovery process, and the U-shaped plate 401 drives the roller 403 to roll reciprocally along the surface of the L-shaped telescopic plate 42, further improving the adsorption effect on dirt.

[0028] During use, place the chip at the bottom of the inner wall of the retractable clip plate 33. Start the electric telescopic rod 32. The fixed plate 31 provides good stability for the electric telescopic rod 32. At this time, the telescopic end of the electric telescopic rod 32 moves towards the center of the device body 1, thereby squeezing the retractable clip plate 33 to move synchronously. The telescopic ends of the retractable clip plate 33 gradually approach to clamp the chip, preventing the chip from falling off during the processing. At the same time, relying on the free telescopic change of the telescopic ends of the retractable clip plate 33, the retractable clip plate 33 can effectively clamp chips of different sizes, saving processing preparation time; the retractable clip plate 33 drives the inclined rod 301 to move synchronously, and the inclined rod 301 drives the inclined plate 302 to move synchronously. When the inclined plate 302 moves towards the center of the device body 1 and touches the surface of the chip, it will stroke towards both ends away from the center of the chip. At this time, the inclined plate 302 will scrape the dirt on the surface of the chip, preventing dirt from adhering during the chip processing and reducing the quality of the chip finished product; when the processing is completed, the inclined rod 301 drives the inclined plate 302 to reset synchronously when the torsion spring inside the retractable clip plate 33 is restored, thereby achieving an automatic reset effect and facilitating the next processing use.

[0029] The telescopic end of the electric telescopic rod 32 drives the transmission rod 41 to move synchronously. The transmission rod 41 drives the telescopic end of the L-shaped telescopic plate 42 to move towards the center of the device body 1. At this time, the L-shaped telescopic plate 42 will form an occlusion above the retractable clip plate 33, preventing debris from falling from above during chip processing and damaging the chip, ensuring a safe processing environment for the chip. At the same time, the L-shaped telescopic plate 42 also occludes the splashes generated during chip processing, preventing the splashes from flying around and polluting the processing environment, and avoiding increasing the difficulty of later maintenance; the telescopic end of the L-shaped telescopic plate 42 drives the pull rod 402 to move synchronously. The pull rod 402 drives the U-shaped plate 401 to move synchronously. The U-shaped plate 401 drives the roller 403 to move synchronously. The roller 403 starts to rotate due to the frictional force generated when it contacts the L-shaped telescopic plate 42. When the roller 403 rotates, it will roll and adsorb the dirt on the top of the L-shaped telescopic plate 42, preventing the dirt on the surface of the L-shaped telescopic plate 42 from adhering and solidifying for a long time, causing corrosion to the L-shaped telescopic plate 42, and avoiding shortening the service life of the L-shaped telescopic plate 42; when the U-shaped plate 401 slides, it pulls the elastic piece 404 to deform synchronously. When the transmission rod 41 stops moving, the elastic piece 404 relies on its own elasticity to pull the U-shaped plate 401 to move left and right during the restoration process. The U-shaped plate 401 drives the roller 403 to roll back and forth along the surface of the L-shaped telescopic plate 42, increasing the rolling friction frequency of the roller 403 and further improving the adsorption effect on dirt. Embodiment

[0030] Please refer to Figures 1-7 , based on Embodiment 1, this embodiment further includes an air flow circulation device 5 and a cross-flow device 6. The air flow circulation device 5 is arranged above the protection device 4, and the cross-flow device 6 is arranged on the front of the stabilizing device 3; The air flow circulation device 5 includes a cross bar 51, an H-shaped carbon plate 52, and an air flow circulation component 500. The outer wall of the cross bar 51 penetrates and is fixedly installed at the bottom of the elastic piece 404. The inner walls of the front and back sides of the H-shaped carbon plate 52 are fixedly installed at the left and right ends of the cross bar 51. When the elastic piece 404 deforms, it drives the cross bar 51 to move up and down. The cross bar 51 drives the H-shaped carbon plate 52 to move synchronously. At this time, the H-shaped carbon plate 52 expands the contact range with harmful gases, further expanding the purification frequency of harmful gases. The air flow circulation component 500 is arranged above the H-shaped carbon plate 52.

[0031] The air flow circulation component 500 includes a downstream plate 501 and an arc-shaped guide plate 502. The bottom of the downstream plate 501 is fixedly installed at the top edge of the H-shaped carbon plate 52. When the H-shaped carbon plate 52 moves up and down, it drives the downstream plate 501 to move synchronously. The downstream plate 501 relies on its smooth inner wall to prevent solid particles in harmful gases from adhering. The bottom of the arc-shaped guide plate 502 is fixedly installed on the top of the downstream plate 501. When the downstream plate 501 moves up and down, it drives the arc-shaped guide plate 502 to move synchronously. When the arc-shaped guide plate 502 contacts with air, its arc surface will bend downward due to the resistance, thus agitating the gas downward. Repeating this process, the gas is circulated and guided downward along the arc surface of the arc-shaped guide plate 502.

[0032] The cross-flow device 6 includes a pressing plate 61, a cooling component 62, and a cross-flow component 600. The top of the pressing plate 61 is fixedly installed at the bottom edge of the H-shaped carbon plate 52. The bottom of the cooling component 62 is slidably installed on the top of the device main body 1. The cooling component 62 emits cold air towards the center of the device main body 1 to prevent the high temperature generated during chip processing from softening the chip body and avoid adverse phenomena such as deformation during chip processing. The cross-flow component 600 is arranged on the back of the cooling component 62.

[0033] The bottom of the pressing plate 61 is in inclined contact with the top of the cooling component 62. The bottom of the cooling component 62 is fixedly connected to the top of the chute spring of the device main body 1.

[0034] The cross-flow component 600 includes an L-shaped rod 601 and a shielding plate 602. The front of the top of the L-shaped rod 601 is fixedly installed on the back of the pressing plate 61. The top of the shielding plate 602 is fixedly connected to the bottom of the L-shaped rod 601, and the shielding plate 602 is located below the loop-shaped telescopic plate 33. When the pressing plate 61 moves up and down, it drives the L-shaped rod 601 to move synchronously. The L-shaped rod 601 drives the shielding plate 602 to move synchronously. The shielding plate 602 fans the cold air up and down in a cycle, accelerating the circulation flow rate of the cold air. By cooperating with the arc-shaped guide plate 502, the cold air can circulate and cool the H-shaped carbon plate 52, ensuring that the body of the H-shaped carbon plate 52 is at a low temperature to prevent the solid dirt adhered to the surface of the H-shaped carbon plate 52 from causing bacteria to breed.

[0035] When in use, the harmful gas generated during chip processing will gradually float upward and rely on the H-shaped carbon plate 52 for purification, avoiding damage to the health of the processed personnel due to inhalation; when the spring piece 404 is deformed, it drives the cross bar 51 to move up and down, and when the cross bar 51 moves up and down, it drives the H-shaped carbon plate 52 to move synchronously. At this time, the H-shaped carbon plate 52 expands the contact range with the harmful gas, further expands the purification frequency of the harmful gas, thereby optimizing the purification quality of the harmful gas and preventing pollution to the environment; when the H-shaped carbon plate 52 moves up and down, it drives the downstream plate 501 to move synchronously, and the downstream plate 501 relies on the smooth inner wall to prevent solid particles in the harmful gas from being trapped in the air. The arc-shaped guide plate 502 is moved up and down to make the arc-shaped guide plate 502 bend downward and deform by the resistance when it contacts with the air, so as to push the gas downward. This reciprocating process makes the gas rely on the arc-shaped guide plate 502 to circulate and guide the gas downward. The contact time between the gas and the H-shaped carbon plate 52 increases the purification effect and promotes the adsorption effect of the H-shaped carbon plate 52 on the harmful solid particles in the harmful gas, so as to achieve solid-gas classification treatment.

[0036] Start the cooling component 62, which emits cold air toward the center of the device body 1 to prevent the high temperature generated during chip processing from softening the chip body and avoiding undesirable phenomena such as deformation during chip processing; when the H-shaped carbon plate 52 moves downward, it drives the pressing plate 61 to move synchronously, and the pressing plate 61 will resist the inclined surface of the cooling component 62 to move the cooling component 62 to the right. At this time, the opposite cooling component 62 will move to the left due to the misaligned distribution of the pressing plate 61, so as to achieve dispersed distribution of cold air. Compared with sliding in the same direction, the cold air coverage of the cooling component 62 is further expanded, and it is effectively avoided that the cold air is too concentrated, which makes the temperature change of the chip during hot and cold alternation too large, thereby causing embrittlement and cracking, causing damage to the chip and causing economic losses; at the same time, the cooling component 62 relies on the elasticity inside the slide groove When the spring is restored, the thrust is reset, and the reciprocating motion makes the cooling assembly 62 slide back and forth left and right, further promoting the uniform coverage of the cooling air of the cooling assembly 62 within the range; when the pressure plate 61 moves up and down, it drives the L-shaped rod 601 to move synchronously, and the L-shaped rod 601 drives the shielding plate 602 to move synchronously, and when the shielding plate 602 moves up and down, it fans the cold air circulation up and down, speeds up the circulation speed of the cold air, and relies on the cooperation with the arc guide plate 502 to make the cold air circulate and cool the H-shaped carbon plate 52, ensuring the low temperature of the H-shaped carbon plate 52 body, thereby preventing the solid dirt adhered to the surface of the H-shaped carbon plate 52 from causing bacteria to multiply and breed, avoiding bacteria from polluting the H-shaped carbon plate 52, ensuring the overall cleanliness of the H-shaped carbon plate 52, thereby reducing the number of times the H-shaped carbon plate 52 is less, and reducing economic expenditure.

[0037] It should be noted that in this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, so that a process, method, article or device comprising a series of elements not only includes those elements, but also includes other elements not expressly listed, or further includes elements inherent to such process, method, article or device.

[0038] Finally, it should be noted that the above are only preferred embodiments of the present invention and are not intended to limit the present invention. Although the present invention has been described in detail with reference to the foregoing embodiments, those skilled in the art can still modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements for some of the technical features. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included within the protection scope of the present invention.

Claims

1. A fixture tool for quantum chip processing, comprising a device main body (1). A chute is provided at the top of the device main body (1), and a spring is arranged inside the chute. A pressure alarm (2) is arranged at the center of the top of the device main body (1), and it is characterized in that: It also includes a stabilizing device (3), a protective device (4), an air flow circulation device (5) and a cross-flow device (6). The stabilizing device (3) is arranged on the left and right sides of the top of the device main body (1). The protective device (4) is arranged above the stabilizing device (3). The air flow circulation device (5) is arranged above the protective device (4). The cross-flow device (6) is arranged on the front of the stabilizing device (3). The stabilizing device (3) includes a fixing plate (31), an electric telescopic rod (32), a loop-shaped telescopic plate (33) and a stabilizing component (300). The bottom of the fixing plate (31) is fixedly installed on the top of the device main body (1). The right side of the electric telescopic rod (32) is fixedly installed on the left side of the fixing plate (31). The right side of the loop-shaped telescopic plate (33) is fixedly installed on the left side of the telescopic end of the electric telescopic rod (32). The stabilizing device (3) is arranged on the left inner wall of the loop-shaped telescopic plate (33).

2. The fixture tooling for quantum chip processing according to claim 1, characterized in that: A spring is arranged on the outer wall of the telescopic end of the electric telescopic rod (32). A chute is formed on the inner wall of the loop-shaped telescopic plate (33), and a torsion spring is arranged inside the chute.

3. The fixture tooling for quantum chip processing according to claim 2, characterized in that: The stabilizing component (300) includes an inclined rod (301) and an inclined plate (302). The right end of the inclined rod (301) is hinged inside the chute of the loop-shaped telescopic plate (33) through a torsion spring. The back of the inclined plate (302) is hinged to the front end of the inclined rod (301), and the bottom of the inclined plate (302) is located above the bottom of the inner wall of the loop-shaped telescopic plate (33).

4. A fixture tool for quantum chip processing according to claim 3, characterized in that: The protective device (4) includes a transmission rod (41), an L-shaped telescopic plate (42) and a protective component (400). The bottom end of the transmission rod (41) is hinged to the top of the outer wall of the telescopic end of the electric telescopic rod (32). The left bottom of the L-shaped telescopic plate (42) is fixedly installed on the left side of the top of the device main body (1), and the bottom of the telescopic end of the L-shaped telescopic plate (42) is hinged to the top end of the transmission rod (41). The protective component (400) is arranged on the top right side of the L-shaped telescopic plate (42).

5. The fixture tooling for quantum chip processing according to claim 4, wherein: The protective component (400) includes a U-shaped plate (401), a pull rod (402), a roller (403) and a spring piece (404). The bottom inner wall of the U-shaped plate (401) is slidably installed on the top right inner wall of the L-shaped telescopic plate (42). The left end of the pull rod (402) is hinged to the bottom right side of the U-shaped plate (401), and the right end of the pull rod (402) is hinged to the bottom of the telescopic end of the L-shaped telescopic plate (42). The roller (403) is rotatably installed inside the U-shaped plate (401) through a cylinder, and the outer wall of the roller (403) is in contact with the top surface of the L-shaped telescopic plate (42). The spring piece (404) is fixedly installed between the left bottom of the U-shaped plate (401) and the right side of the L-shaped telescopic plate (42).

6. The fixture tooling for quantum chip processing according to claim 5, characterized in that: The air flow circulation device (5) includes a cross bar (51), an H-shaped carbon plate (52) and an air flow circulation component (500). The outer wall of the cross bar (51) penetrates and is fixedly installed at the bottom of the spring piece (404). The inner walls of the front and back surfaces of the H-shaped carbon plate (52) are fixedly installed at the left and right ends of the cross bar (51). The air flow circulation component (500) is arranged above the H-shaped carbon plate (52).

7. A fixture tool for quantum chip processing according to claim 6, characterized in that: The air flow circulation component (500) includes a downstream plate (501) and an arc-shaped guide plate (502). The bottom of the downstream plate (501) is fixedly installed at the top edge of the H-shaped carbon plate (52), and the bottom of the arc-shaped guide plate (502) is fixedly installed at the top of the downstream plate (501).

8. A fixture tool for quantum chip processing according to claim 7, characterized in that: The cross-flow device (6) includes a pressing plate (61), a cooling component (62) and a cross-flow component (600). The top of the pressing plate (61) is fixedly installed at the bottom edge of the H-shaped carbon plate (52). The bottom of the cooling component (62) is slidably installed at the top of the device main body (1), and the cross-flow component (600) is arranged on the back of the cooling component (62).

9. A fixture tool for quantum chip processing according to claim 8, characterized in that: The bottom of the pressing plate (61) is in inclined surface contact with the top of the cooling component (62), and the bottom of the cooling component (62) is fixedly connected to the top chute spring of the device main body (1).

10. A fixture tool for quantum chip processing according to claim 9, characterized in that: The cross-flow component (600) includes an L-shaped rod (601) and a shielding plate (602). The front of the top of the L-shaped rod (601) is fixedly installed on the back of the pressing plate (61). The top of the shielding plate (602) is fixedly connected to the bottom of the L-shaped rod (601), and the shielding plate (602) is located below the loop-shaped telescopic plate (33).

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