Sintering equipment

Abstract

The invention discloses sintering equipment, and belongs to the field of semiconductor production equipment. The sintering equipment comprises sintering equipment, a conveying device, a carrying device, an automatic film laminating and feeding device and an automatic film laminating and collecting device, a product area, a film feeding area, a film collecting area and a manual area are arranged on the periphery of the sintering equipment, the conveying device and the carrying device are arranged in the product area, and the automatic film laminating and feeding device is arranged in the film feeding area. The automatic film covering and collecting device is arranged in the film collecting area, the carrying device is used for driving the product to move between the sintering equipment and the conveying device, and the automatic film covering and feeding device and the automatic film covering and collecting device are used for driving the Teflon film to penetrate through the sintering equipment. The automatic film covering and feeding device, the automatic film covering and collecting device and the carrying devices are arranged on the three sides of the sintering equipment correspondingly, so that one side of the sintering equipment is of an open structure, and the problem that in the prior art, two carrying devices are arranged on the two sides of the sintering equipment, so that maintenance and other operation on the sintering equipment are inconvenient is solved.

Description

Technical Field

[0001] The present invention belongs to the field of semiconductor production equipment, and specifically relates to a sintering device. Background Art

[0002] The existing sintering equipment uses a technical solution of loading materials on one side and unloading materials on the other side for loading and unloading. Two handling devices need to be set on both sides of the sintering equipment. Generally, an automatic film covering and film feeding device and an automatic film covering and film receiving device also need to be set on both sides of the sintering equipment to enable the Teflon film to participate in the sintering process. When the automatic film covering and film feeding device and the automatic film covering and film receiving device are set above the two handling devices, it is inconvenient for manual maintenance and other operations of the automatic film covering and film feeding device, the automatic film covering and film receiving device, and the handling device; when the automatic film covering and film feeding device and the automatic film covering and film receiving device are not set above the two handling devices, then the automatic film covering and film feeding device, the automatic film covering and film receiving device, and the two handling devices are respectively set on the four sides of the sintering equipment, which is inconvenient for manual maintenance and adjustment of the sintering equipment, and inconvenient for manual loading and unloading of developed products and other operations. Summary of the Invention

[0003] Object of the Invention: To provide a sintering device, in which the automatic film covering and film feeding device, the automatic film covering and film receiving device, and the handling device are respectively set on three sides of the sintering device, and the handling device performs loading and unloading operations on one side of the sintering device, solving the problem that it is inconvenient to perform maintenance and other operations on the sintering device by setting two handling devices on both sides of the sintering device in the prior art.

[0004] The technical solution of the present invention is as follows: A sintering device includes: a sintering device, a transmission device, a handling device, an automatic film covering and film feeding device, and an automatic film covering and film receiving device.

[0005] Product areas, film feeding areas, film receiving areas, and manual areas are provided around the sintering device. The transmission device and the handling device are set in the product area, the automatic film covering and film feeding device is set in the film feeding area, and the automatic film covering and film receiving device is set in the film receiving area.

[0006] The handling device is used to drive the product to move between the sintering device and the transmission device.

[0007] The automatic film covering and film feeding device and the automatic film covering and film receiving device are used to drive the Teflon film to pass through the sintering device.

[0008] In a further embodiment, the sintering device further includes: a lower die sintering mold, a lower die sintering carrier, an upper die sintering mold, and an upper die sintering punch.

[0009] The lower die sintering mold and the upper die sintering mold are installed on the sintering device. The lower die sintering carrier is detachably installed on the lower die sintering mold, and the upper die sintering punch is detachably installed on the upper die sintering mold.

[0010] The lower die sintering carrier and the upper die sintering punch are soft sintering components, hard development sintering components or hard mass production sintering components. One side of the sintering equipment is an open structure without an automatic film covering and feeding device, an automatic film covering and winding device and a handling device. Combined with the detachable design of the lower die sintering mold, the lower die sintering carrier, the upper die sintering mold and the upper die sintering punch, it is convenient for the sintering equipment to replace the upper die sintering punch with a soft sintering component, a hard development sintering component or a hard mass production sintering component according to needs, and to place the lower die sintering carrier and the upper die sintering punch in the working environment formed after the lower die sintering mold and the upper die sintering mold are closed for wafer manufacturing, product development or product mass production, solving the problem that three semiconductor sintering equipment are required to work in the three steps of wafer manufacturing, product development and product mass production in the prior art.

[0011] In a further embodiment, the lower die sintering carrier is a hard development sintering component, and the upper die sintering punch is a soft sintering component. Through the cooperation of the hard development sintering component and the soft sintering component, only the lower die sintering carrier needs to be adjusted during the process, and there is no need to adjust the upper die sintering punch at the same time, simplifying the equipment adjustment process. When the lower die sintering carrier is provided with at least two different product forming areas, two products can be developed and produced simultaneously without adjusting the lower die sintering carrier.

[0012] In a further embodiment, the sintering equipment further includes: a resilient pad.

[0013] The upper die sintering punch is a soft sintering component. The resilient pad is detachably installed on the upper die sintering punch. The resilient pad is arranged between the upper die sintering punch and the lower die sintering carrier, so that the soft sintering component of the upper die sintering punch contacts the product through the resilient pad, which can greatly extend the service life of the soft sintering component. Combined with the open structure on one side of the sintering equipment without an automatic film covering and feeding device, an automatic film covering and winding device and a handling device, the resilient pad is lighter and easier to replace.

[0014] In a further embodiment, the sintering equipment further includes: a floating mechanism and a floating punch.

[0015] The floating mechanism is arranged in the lower die sintering carrier and / or the upper die sintering punch, and the floating punch is installed on the floating mechanism.

[0016] When the lower die sintering carrier and the upper die sintering punch move to a predetermined position, the floating punch applies pressure to the product, and the floating mechanism is used to adjust the pressure applied by the floating punch to the product.

[0017] In a further embodiment, the floating mechanism includes: a piston, and an inflation chamber formed in the lower die sintering carrier and / or the upper die sintering punch. The piston is disposed in the inflation chamber, and the floating punch is mounted on the piston. By adjusting the air pressure in the inflation chamber, the pressure exerted by the floating punch on the product can be adjusted. Through the cooperation of the inflation chamber and the piston, it is possible to adjust the pressure exerted by the floating punch while reducing the structural complexity of the floating mechanism.

[0018] In a further embodiment, the sintering device further includes: a thin film pressure sensor.

[0019] The thin film pressure sensor is disposed below the floating punch.

[0020] When the lower die sintering carrier and the upper die sintering punch move to a predetermined position, the thin film pressure sensor is used to detect the pressure exerted by the floating punch on the product, so that the floating mechanism adjusts the pressure exerted by the floating punch on the product according to the pressure detected by the pressure sensor. Through the thin film pressure sensor, the floating mechanism can adjust the pressure exerted by the floating punch on the product according to the pressure detected by the pressure sensor, thereby improving the accuracy of the pressure exerted by the floating punch on the product.

[0021] In a further embodiment, the upper die sintering punch is provided with a product pressurizing area, and each product pressurizing area is provided with at least two floating punches. The floating punches are matched with the number and position of the chips on the product corresponding to the product pressurizing area, so that the floating punches can accurately control the pressure exerted on each chip on the product.

[0022] In a further embodiment, the sintering device further includes: a preheating device and a cooling device.

[0023] The preheating device and the cooling device are provided with an inflation channel and an air extraction channel.

[0024] The preheating device and the cooling device include: a base, a sealing moving component and an upper cover.

[0025] The upper cover is mounted on the sealing moving component, and the sealing moving component is used to drive the upper cover to move to a position where it is hermetically fitted with the base.

[0026] The handling device is used to drive the product to move between the sintering device, the base of the preheating device, the base of the cooling device and the transmission device. Compared with directly preheating and cooling on the transmission device in the prior art, the cooperation of the base, the sealing moving component and the upper cover can form a better sealing environment, reduce product oxidation and dust interference, improve the product yield, and reduce the influence of temperature change on the transmission device.

[0027] In a further embodiment, the transmission device includes: an enclosure, a conveying mechanism, an enclosure power component and an enclosure plate.

[0028] The closing plate is installed on a closing power component. The closing shell and the closing plate cooperate to enclose the working area of the conveying mechanism with a material receiving area and a material feeding area, and a transfer area is provided between the material receiving area and the material feeding area.

[0029] The closing power component is used to drive the closing plate to cooperate with the closing shell, so that the material receiving area and the material feeding area are of a closed structure.

[0030] The conveying mechanism is used to drive the product to move between the material receiving area, the transfer area and the material feeding area. Since the material receiving area and the material feeding area are of a closed structure, the material receiving area and the material feeding area are only opened when the product receives and feeds materials through the position of the closing plate, reducing the dust pollution rate in the material receiving area and the material feeding area, enabling the product to receive and feed materials in a closed space with a low dust pollution rate, and further reducing the probability of dust in the environment interfering with the product.

[0031] The beneficial effect of the present invention is that: in this application, the automatic film laminating film feeding device, the automatic film laminating film receiving device and the handling device are respectively arranged on three sides of the sintering equipment, so that the handling device performs loading and unloading operations on one side of the sintering equipment, making one side of the sintering equipment an open artificial area, enabling the sintering equipment, the handling device, the automatic film laminating film feeding device and the automatic film laminating film receiving device to all have space for maintenance and other operations, and solving the problem in the prior art that it is inconvenient to perform maintenance and other operations on the sintering equipment when two handling devices are arranged on both sides of the sintering equipment. Description of the Drawings

[0032] Figure 1 is the overall axonometric schematic diagram of the present invention.

[0033] Figure 2 is the overall axonometric schematic diagram of the present invention from another angle.

[0034] Figure 3 is the cross-sectional schematic diagram of the cooperation of the lower die sintering mold, the lower die sintering carrier, the upper die sintering mold and the upper die sintering press head of the present invention.

[0035] Figure 4 is the schematic diagram of the lower die sintering carrier being a hard mass production sintering component of the present invention.

[0036] Figure 5 is the schematic diagram of the lower die sintering carrier being a hard development sintering component of the present invention.

[0037] Figure 6 is the schematic diagram of the upper die sintering press head being a hard development sintering component of the present invention.

[0038] Figure 7 is the schematic diagram of the upper die sintering press head being a soft sintering component of the present invention.

[0039] Figure 8 It is an exploded view of the floating mechanism and floating punch installed on the upper die sintering punch of the present invention, and the floating mechanism and floating punch installed on the lower die sintering carrier.

[0040] Figure 9 It is a cross-sectional view of the upper die sintering punch and the lower die sintering carrier installed on the floating mechanism and floating punch of the present invention.

[0041] Figure 10 It is a schematic diagram of the internal structure of the transmission device of the present invention.

[0042] The reference numerals shown in the figure are: sintering equipment 1, transmission device 2, handling device 3, automatic film laminating film feeding device 4, automatic film laminating film collecting device 5, preheating device 6, cooling device 7, base 71, sealing moving component 72, upper cover 73, lower die sintering die 8, lower die sintering carrier 9, hard quality production lower die sintering carrier 91, hard quality development lower die sintering carrier 92, upper die sintering die 10, upper die sintering punch 11, hard quality development upper die sintering punch 111, soft quality upper die sintering punch 112, elastic pad 113, positioning fixture 12, floating punch 13, piston 14, closed shell 21, conveying mechanism 22, closed power component 23, closing plate 24. Detailed implementation manners

[0043] In the following description, a large number of specific details are given to provide a more thorough understanding of the present invention. However, it is obvious to those skilled in the art that the present invention can be implemented without one or more of these details. In other examples, in order to avoid confusion with the present invention, some well-known technical features in the art are not described.

[0044] The present application discloses a sintering equipment, which is provided with control devices such as PLC, and power sources such as motors and cylinders and sensors are connected to the control devices, and each device is controlled to cooperate through the control device. The automatic film laminating film feeding device, the automatic film laminating film collecting device and the handling device are respectively arranged on three sides of the sintering equipment, and the handling device performs loading and unloading operations on one side of the sintering equipment, solving the problem that it is inconvenient to maintain the sintering equipment and other operations when two handling devices are arranged on both sides of the sintering equipment in the prior art.

[0045] As Figure 1 shown, the sintering equipment includes: sintering equipment 1, transmission device 2, handling device 3, automatic film laminating film feeding device 4 and automatic film laminating film collecting device 5.

[0046] Product areas, film feeding areas, film collecting areas and manual areas are arranged around the sintering equipment 1. The transmission device 2 and the handling device 3 are arranged in the product area, the automatic film laminating film feeding device 4 is arranged in the film feeding area, and the automatic film laminating film collecting device 5 is arranged in the film collecting area.

[0047] The handling device 3 is used to drive the product to move between the sintering device 1 and the transmission device 2. As Figure 1 and 2 shown, the handling device 3 is a manipulator. In other embodiments, the handling device 3 can be a three-axis displacement mechanism or the like.

[0048] The automatic film laminating film feeding device 4 and the automatic film laminating film collecting device 5 are used to drive the Teflon film through the sintering device 1.

[0049] As Figure 3 shown, the sintering device further includes: a lower die sintering mold 8, a lower die sintering carrier 9, an upper die sintering mold 10, and an upper die sintering punch 11.

[0050] The lower die sintering mold 8 and the upper die sintering mold 10 are installed on the sintering device 1. The lower die sintering carrier 9 is detachably installed on the lower die sintering mold 8, and the upper die sintering punch 11 is detachably installed on the upper die sintering mold 10.

[0051] The lower die sintering carrier 9 and the upper die sintering punch 11 are soft sintering components, hard development sintering components, or hard mass production sintering components.

[0052] It is possible to make the structures of the soft sintering component, the hard development sintering component, and the hard mass production sintering component cooperate with the lower die sintering mold 8 and the upper die sintering mold 10 to be the same. A positioning jig 12 is provided in the lower die sintering mold 8 and the upper die sintering mold 10. The positioning jig 12 is installed on the lower die sintering mold 8 and the upper die sintering mold 10 through positioning pins and screws. A positioning groove is provided between the positioning jig 12 and the lower die sintering mold 8 and the upper die sintering mold 10. The sides of the lower die sintering carrier 9 and the upper die sintering punch 11 are matched with the positioning groove to enable the quick positioning and installation of the lower die sintering carrier 9 and the upper die sintering punch 11. In other embodiments, the lower die sintering mold 8 and the lower die sintering carrier 9, and the upper die sintering mold 10 and the upper die sintering punch 11 can be connected by positioning pins and screws, so that the lower die sintering carrier 9 is detachably installed on the lower die sintering mold 8, and the upper die sintering punch 11 is detachably installed on the upper die sintering mold 10, and this is not limited thereto.

[0053] When the lower die sintering carrier 9 is the Figure 5 shown hard development lower die sintering carrier 92, the upper die sintering punch 11 can be the Figure 6 shown soft upper die sintering punch 112.

[0054] As Figure 7The upper die sintering punch 11 shown is the soft upper die sintering punch 112 of the soft sintering component. The sintering equipment further includes: an elastic pad 113. The upper die sintering punch 11 is a soft sintering component, and the elastic pad 113 is detachably installed on the upper die sintering punch 11. The elastic pad 113 is arranged between the upper die sintering punch 11 and the lower die sintering carrier 9. As Figure 7 shown, the four corners of the elastic pad 113 are detachably installed on the upper die sintering punch 11 through screws.

[0055] As Figure 4 shown, the lower die sintering carrier 9 is the hard lower die sintering carrier 91 of the hard mass production sintering component, which is provided with a plurality of identical floating punches 13. The corresponding hard mass production upper die sintering punch 11 is provided with corresponding floating punches 13, which are used for mass-producing a plurality of identical products.

[0056] As Figure 5 shown, the lower die sintering carrier 9 is the hard development lower die sintering carrier 92 of the hard development sintering component. As Figure 6 shown, the upper die sintering punch 11 is the hard development upper die sintering punch 111 of the hard development sintering component. The two correspond to be provided with a plurality of floating punches 13 with different shapes, and each floating punch 13 with a different shape is used for producing products of the corresponding model.

[0057] In this embodiment, the sintering equipment further includes: a mass production tooling tray matched with the hard mass production sintering component, and a development tooling tray matched with the hard development sintering component. The tooling tray is provided with a product cavity matched with the floating punch 13.

[0058] Among them, the mass production tooling tray is provided with a plurality of identical product cavities, which are used for carrying a plurality of identical products and placing them on the hard mass production sintering component.

[0059] The development tooling tray is provided with at least one product cavity. When the development tooling tray is provided with more than two product cavities, the shape of each product cavity can be different, and it is used for carrying products of the corresponding model and placing them on the hard development sintering component.

[0060] The handling device 3 and the staff place the products on the hard mass production sintering component or the hard development sintering component through the mass production tooling tray or the development tooling tray carrying the products.

[0061] When using the hard development sintering component, the staff can replace the upper die sintering punch 11 on the sintering equipment 1 with the hard development lower die sintering carrier 92 and the hard development upper die sintering punch 111, or replace it with the hard development lower die sintering carrier 92 and the soft upper die sintering punch 112 in the manual area, and then directly use the tooling tray corresponding to the hard development lower die sintering carrier 92 in the manual area for loading and unloading the developed products, which can greatly reduce the forming cycle of the developed products.

[0062] Furthermore, when using a hard development sintering component, a Teflon film can be manually placed on the tooling tray corresponding to the hard development lower die sintering carrier 92, which can greatly reduce the waste rate of the Teflon film.

[0063] Benefiting from the layout settings of the sintering device 1 with a product area, a film feeding area, a film collecting area, and a manual area around it, it can reduce the interference of the transmission device 2 and the handling device 3 when manually loading and unloading and manually operating the Teflon film.

[0064] As Figure 8 shown, the sintering device further includes: a floating mechanism and a floating punch 13.

[0065] The floating mechanism is arranged in the lower die sintering carrier 9 and / or the upper die sintering punch 11, and the floating punch 13 is installed on the floating mechanism.

[0066] When the lower die sintering carrier 9 and the upper die sintering punch 11 move to a predetermined position, the floating punch 13 applies pressure to the product, and the floating mechanism is used to adjust the pressure applied by the floating punch 13 to the product.

[0067] As Figure 9 shown, the floating mechanism includes: a piston 14, and an air inflation chamber opened in the lower die sintering carrier 9 and / or the upper die sintering punch 11. The piston 14 is arranged in the air inflation chamber, and the floating punch 13 is installed on the piston 14. The pressure applied by the floating punch 13 to the product is adjusted by adjusting the air pressure in the air inflation chamber.

[0068] As Figure 6 and 9 shown, the upper die sintering punch 11 is provided with a product pressurizing area, and each product pressurizing area is provided with at least two floating punches 13. The floating punches 13 cooperate with the number and position of the chips on the product corresponding to the product pressurizing area.

[0069] In a further embodiment, the sintering device further includes: a thin film pressure sensor.

[0070] The thin film pressure sensor is arranged below the floating punch 13.

[0071] When the lower die sintering carrier 9 and the upper die sintering punch 11 move to a predetermined position, the thin film pressure sensor is used to detect the pressure applied by the floating punch 13 to the product, so that the floating mechanism adjusts the pressure applied by the floating punch 13 to the product according to the pressure detected by the pressure sensor, wherein the thin film pressure sensor is arranged between the floating punch 13 and the Teflon film.

[0072] As Figure 1 shown, the sintering device further includes: a preheating device 6 and a cooling device 7, as Figure 1The preheating device 6 and the cooling device 7 shown are respectively arranged above the material receiving area and the material feeding area of the conveying device 2, which further facilitates manual preheating and cooling of products in the product area.

[0073] The preheating device 6 and the cooling device 7 are provided with an inflation channel and an air extraction channel.

[0074] The preheating device 6 and the cooling device 7 include: a base 71, a sealing moving component 72, and an upper cover 73.

[0075] The upper cover 73 is installed on the sealing moving component 72, and the sealing moving component 72 is used to drive the upper cover 73 to move to a position where it is hermetically fitted with the base 71.

[0076] The handling device 3 is used to drive the product to move between the sintering device 1, the base 71 of the preheating device 6, the base 71 of the cooling device 7, and the conveying device 2.

[0077] The inflation channel and the air extraction channel can be arranged on the base 71 or the upper cover 73 and communicate with the sealed cavity surrounded by the base 71 and the upper cover 73. The inflation channel is used to communicate with inflation devices such as nitrogen gas and formic acid gas filling devices, and the air extraction channel is used to communicate with a vacuum device to evacuate the inside of the preheating device 6 and the cooling device 7. So that the preheating device 6 can preheat the product after evacuation, nitrogen gas filling, and formic acid gas filling, and the cooling device 7 can cool the product after evacuation, nitrogen gas filling, and formic acid gas filling. Anti-oxidation work is carried out before and after the sintering process, which improves the yield of the product.

[0078] As Figure 1 shown, the sealing moving component 72 is an electric cylinder lifting component installed on the base 71. In other embodiments, the sealing moving component 72 can be arranged on one side of the base 71, or other moving components in other directions or a two-axis or three-axis moving mechanism can be used as the sealing moving component 72.

[0079] As Figure 1 and 10 shown, the conveying device 2 includes: an enclosed shell 21, a conveying mechanism 22, an enclosed power component 23, and an enclosed plate 24.

[0080] The enclosed plate 24 is installed on the enclosed power component 23, and the enclosed shell 21 and the enclosed plate 24 cooperate to enclose the working area of the conveying mechanism 22 with a material receiving area and a material feeding area, and there is a transfer area between the material receiving area and the material feeding area.

[0081] The enclosed power component 23 is used to drive the enclosed plate 24 to cooperate with the enclosed shell 21 so that the material receiving area and the material feeding area are in a closed structure.

[0082] The conveying mechanism 22 is used to drive the product to move between the material receiving area, the transfer area, and the material feeding area.

[0083] As shown Figure 1 The enclosed shell 21 shown includes two side plates, as well as two groups of top plates and bottom plates. At both ends of the top plates and bottom plates, there are enclosed power components 23 and enclosed plates 24. As shown Figure 10 The enclosed power component 23 shown is a cylinder, which is used to drive the enclosed plate 24 to move up and down, so that both ends of the material receiving area and the material feeding area can be opened. The conveying mechanism 22 is a conveyor belt mechanism, and the motor can be installed outside the enclosed shell 21.

[0084] Usage method: When mass-producing product processing is required, the staff installs the hard mass-production sintering components on the sintering equipment 1 in the manual area. Then, the transfer device 2 receives the tooling trays and products corresponding to the hard mass-production sintering components. Then, the handling device 3 places the tooling trays and products on the preheating device 6. The preheating device 6 conducts sealed inflation preheating. Then, the handling device 3 moves the preheated tooling trays and products to the lower die sintering carrier 9 of the sintering equipment 1. Then, the sintering equipment 1 conducts the mold closing and inflation sintering work. Then, the handling device 3 moves the processed tooling trays and products to the cooling device 7. The cooling device 7 conducts sealed inflation preheating and cooling. Then, the handling device 3 moves the cooled tooling trays and products to the transfer device 2. Finally, the transfer device 2 removes the products from the sintering equipment.

[0085] When developing product processing is required, the staff installs the hard development lower die sintering carrier 92 and the hard development upper die sintering punch 111, or the hard development lower die sintering carrier 92 and the soft upper die sintering punch 112 on the sintering equipment 1 in the manual area. Then, the staff directly uses the tooling trays corresponding to the hard development lower die sintering carrier 92 for loading and unloading products in the manual area. Then, the sintering equipment 1 conducts the mold closing and inflation sintering work. Finally, the staff removes the tooling trays and products from the sintering equipment. During this process, the staff can also preheat or cool the tooling trays and products in the product area. It is possible to process a small number of development products without passing through the transfer device 2 and the handling device 3 by using the insertion method without changing the structure and procedure of the transfer device 2 and the handling device 3, which greatly reduces the forming cycle of the development products.

[0086] As described above, although the present invention has been shown and described with reference to specific preferred embodiments, it should not be construed as a limitation of the present invention itself. Various changes can be made to it in form and detail without departing from the spirit and scope of the present invention defined by the appended claims.

Claims

1. A sintering device, characterized in that, Including: A sintering device, a transmission device, a handling device, an automatic film laminating film feeding device, and an automatic film laminating film collecting device; Product areas, film feeding areas, film collecting areas, and manual areas are provided around the sintering device. The transmission device and the handling device are arranged in the product area, the automatic film laminating film feeding device is arranged in the film feeding area, and the automatic film laminating film collecting device is arranged in the film collecting area; The handling device is used to drive the product to move between the sintering device and the transmission device; The automatic film laminating film feeding device and the automatic film laminating film collecting device are used to drive the Teflon film to pass through the sintering device.

2. The sintering device according to claim 1, wherein Also including: A lower die sintering mold, a lower die sintering carrier, an upper die sintering mold, and an upper die sintering press head; The lower die sintering mold and the upper die sintering mold are installed on the sintering device. The lower die sintering carrier is detachably installed on the lower die sintering mold, and the upper die sintering press head is detachably installed on the upper die sintering mold; The lower die sintering carrier and the upper die sintering press head are soft sintering components, hard development sintering components, or hard mass production sintering components.

3. The sintering equipment according to claim 2, wherein The lower die sintering carrier is a hard development sintering component, and the upper die sintering press head is a soft sintering component.

4. The sintering device according to claim 2, wherein Also including: A resilient pad; The upper die sintering press head is a soft sintering component. The resilient pad is detachably installed on the upper die sintering press head, and the resilient pad is arranged between the upper die sintering press head and the lower die sintering carrier.

5. The sintering device according to claim 2, wherein Also including: A floating mechanism and a floating press head; The floating mechanism is arranged in the lower die sintering carrier and / or the upper die sintering press head, and the floating press head is installed on the floating mechanism; When the lower die sintering carrier and the upper die sintering press head move to a predetermined position, the floating press head applies pressure to the product, and the floating mechanism is used to adjust the pressure applied by the floating press head to the product.

6. The sintering device according to claim 5, characterized in that, The floating mechanism includes: a piston, and an air inflation cavity opened in the lower die sintering carrier and / or the upper die sintering press head. The piston is arranged in the air inflation cavity, and the floating press head is installed on the piston. The pressure applied by the floating press head to the product is adjusted by adjusting the air pressure in the air inflation cavity.

7. The sintering device according to claim 5, characterized in that Also including: A thin film pressure sensor; The thin film pressure sensor is arranged below the floating press head; When the lower die sintering carrier and the upper die sintering press head move to a predetermined position, the thin film pressure sensor is used to detect the pressure applied by the floating press head to the product, so that the floating mechanism adjusts the pressure applied by the floating press head to the product according to the pressure detected by the pressure sensor.

8. The sintering equipment according to claim 5, wherein The upper die sintering press head is provided with a product pressure application area. Each product pressure application area is provided with at least two floating press heads, and the floating press heads are matched with the number and positions of the chips on the product corresponding to the product pressure application area.

9. The sintering device according to claim 1, wherein, Also including: A preheating device and a cooling device; The preheating device and the cooling device are provided with an air inflation channel and an air extraction channel; The preheating device and the cooling device include: a base, a sealing moving component, and an upper cover; The upper cover is installed on the sealing moving component, and the sealing moving component is used to drive the upper cover to move to a position where it is hermetically fitted with the base; The handling device is used to drive the product to move between the sintering device, the base of the preheating device, the base of the cooling device, and the transmission device.

10. The sintering device according to claim 1, characterized in that, The transmission device includes: an enclosed shell, a conveying mechanism, an enclosed power component, and an enclosed plate; The closed plate is installed on a closing power component. The closed shell and the closed plate cooperate to enclose a working area of the conveying mechanism, forming a material receiving area and a material feeding area. A transfer area is provided between the material receiving area and the material feeding area; The closing power component is used to drive the closed plate to cooperate with the closed shell, so that the material receiving area and the material feeding area are in a closed structure; The conveying mechanism is used to drive products to move between the material receiving area, the transfer area and the material feeding area.

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