Adhesive force testing method

Abstract

The invention belongs to the technical field of electronic paper module production, and discloses an adhesive force testing method. The adhesive force testing method comprises the following steps: attaching an electronic paper diaphragm to a TFT substrate; the water-blocking film part is attached to the electronic paper diaphragm; the two opposite ends of the electronic paper diaphragm in the width direction are coated with EC glue, and the EC glue makes contact with the TFT substrate and the water blocking film; the EC glue is cured, and two glue strips are formed; fixing the TFT substrate, fixing the non-attached part of the water-blocking film on a tension meter, pulling the water-blocking film through the tension meter, and enabling the water-blocking film to be gradually separated from the adhesive tapes from the front ends of the two adhesive tapes to the rear ends of the two adhesive tapes so as to carry out an adhesive force test. The device can be used for testing the adhesive force between the EC glue and the water-blocking film, and the EC glue is only coated at the two opposite ends of the electronic paper diaphragm in the width direction, so that the stability and the accuracy of the test can be improved. In addition, the test environment is attached to the actual application environment of the EC glue and the water-blocking film, and the accuracy of the test result can be improved.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic paper module production, and particularly relates to an adhesion test method. Background Art

[0002] During the production of an electronic paper module, a thin film transistor (TFT) substrate needs to be bonded to an electronic paper film. Due to the characteristics of the electronic paper film, its ability to resist water and oxygen corrosion is poor. Therefore, a water barrier film needs to be attached above the electronic paper film, and an epoxy resin-based thermosetting adhesive (thermosetting EC adhesive) needs to be coated in the gap between the outer edge of the electronic paper film and the water barrier film to prevent water and oxygen from corroding the electronic paper film and causing display defects.

[0003] During the production process, using EC adhesives from different manufacturers or water barrier films from different manufacturers will result in differences in the ability to block water and oxygen. After analysis, the ability to block water and oxygen is mainly related to the adhesion between the EC adhesive and the water barrier film. When the adhesion between the EC adhesive and the water barrier film is large, the water blocking effect is good and can meet the requirements for product reliability. When the adhesion between the EC adhesive and the water barrier film is small, the water blocking effect is poor and cannot meet the requirements for product reliability. Currently, there is no standardized method to test the adhesion between the EC adhesive and the water barrier film. Therefore, there is an urgent need for an adhesion test method to solve the above problems. Summary of the Invention

[0004] The purpose of the present invention is to provide an adhesion test method that can be used to test the adhesion between an EC adhesive and a water barrier film, and can improve the stability and accuracy of the test.

[0005] To achieve this purpose, the present invention adopts the following technical solutions:

[0006] An adhesion test method includes:

[0007] Bond the electronic paper film to the TFT substrate;

[0008] Partially bond the water barrier film to the electronic paper film;

[0009] Apply EC adhesive to both opposite ends of the electronic paper film in the width direction, and make the EC adhesive contact the TFT substrate and the water barrier film;

[0010] Cure the EC adhesive to form two adhesive strips;

[0011] Fix the TFT substrate, fix the unbonded part of the water barrier film to a tensile meter, and pull the water barrier film through the tensile meter to gradually separate the water barrier film from the front end to the rear end of the two adhesive strips for adhesion testing.

[0012] In some possible embodiments, flow-stop grooves are processed on opposite end surfaces of the electronic paper diaphragm in the width direction, and the EC glue is applied in the flow-stop grooves.

[0013] In some possible embodiments, the electronic paper diaphragm has a rectangular structure, so that the two cured glue strips are arranged in parallel.

[0014] In some possible embodiments, before attaching the electronic paper diaphragm to the TFT substrate, it further includes: drawing the pattern of a single electronic paper diaphragm on the electronic paper diaphragm substrate, drawing the pattern of a single water-blocking film on the water-blocking film substrate, and respectively cutting the electronic paper diaphragm substrate and the water-blocking film substrate to form a single electronic paper diaphragm and a single water-blocking film.

[0015] In some possible embodiments, the patterns of multiple electronic paper diaphragms are drawn on the same electronic paper diaphragm substrate to obtain multiple electronic paper diaphragms, multiple water-blocking film substrates with different performances are selected, and the pattern of a single water-blocking film is drawn on each water-blocking film substrate to obtain multiple water-blocking films; the multiple water-blocking films are matched with the multiple electronic paper diaphragms one by one, and the same-performance EC glue is applied to all the multiple water-blocking films.

[0016] In some possible embodiments, the sizes of the multiple electronic paper diaphragms are the same, and the sizes of the multiple water-blocking films are the same.

[0017] In some possible embodiments, the tensiometer pulls the water-blocking film uniformly in the vertical direction.

[0018] In some possible embodiments, the water-blocking film has a rectangular structure. Among the opposite ends of the water-blocking film in the length direction, the end surface of one end is flush with the end surface of the electronic paper diaphragm, and the other end extends beyond the electronic paper diaphragm.

[0019] In some possible embodiments, the water-blocking film is first bent upward, and then the water-blocking film is fixed to the tensiometer.

[0020] In some possible embodiments, both ends of the TFT substrate are respectively fixed to the test base of the tensiometer through pressing plates.

[0021] Advantages of the present invention:

[0022] The adhesion test method provided by the present invention applies EC glue to both opposite ends of the electronic paper film along the width direction, and makes the EC glue contact the TFT substrate and the water barrier film. After the EC glue is cured, two glue strips are formed. The water barrier film is pulled by a tensiometer to gradually separate from the front end to the rear end of the two glue strips for adhesion testing, which can be used to test the adhesion between the EC glue and the water barrier film. In addition, applying EC glue only to the opposite ends of the electronic paper film along the width direction can avoid the situation where the water barrier film has not separated from the EC glue yet when the TFT substrate is damaged when applying EC glue to the front end of the electronic paper film, resulting in waste of test samples and labor costs. It can also avoid the situation where the value suddenly rises or becomes uncontrollable due to the change of the force application method near the end of the test when applying EC glue to the rear end of the electronic paper film, affecting the accuracy of the test data. Therefore, this adhesion test method can improve the stability and accuracy of the test. In addition, the test environment depends on the actual application environment of the EC glue and the water barrier film, which can also improve the accuracy of the test results. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] Figure 1 is a flowchart of the adhesion test method provided by the present invention;

[0024] Figure 2 is a schematic structural diagram of an electronic paper film, a TFT substrate, a water barrier film and two glue strips in the adhesion test method provided by the present invention;

[0025] Figure 3 is a schematic structural diagram of an electronic paper film and two glue strips in the adhesion test method provided by the present invention.

[0026] In the figure:

[0027] 1, TFT substrate; 2, electronic paper film; 21, flow stop groove; 3, water barrier film; 31, bending line; 4, glue strip. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0028] The present invention will be further described in detail below with reference to the drawings and embodiments. It can be understood that the specific embodiments described herein are only used to explain the present invention, rather than limiting the present invention. In addition, it should be noted that only parts related to the present invention rather than all structures are shown in the drawings for the convenience of description.

[0029] In the description of the present invention, unless otherwise clearly defined and limited, the terms "connected", "connected", and "fixed" shall be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or integrated; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the present invention can be understood according to specific circumstances.

[0030] In the present invention, unless otherwise clearly defined and limited, the first feature being "above" or "below" the second feature may include the direct contact between the first and second features, or may include the situation where the first and second features are not in direct contact but in contact through additional features therebetween. Moreover, the first feature being "above", "above", and "on" the second feature includes that the first feature is directly above and obliquely above the second feature, or merely indicates that the first feature has a higher horizontal height than the second feature. The first feature being "below", "below", and "beneath" the second feature includes that the first feature is directly below and obliquely below the second feature, or merely indicates that the first feature has a lower horizontal height than the second feature.

[0031] In the description of this embodiment, the orientation or positional relationships such as "above", "below", "right", etc. are based on the orientation or positional relationship shown in the drawings, and are only for the convenience of description and simplifying the operation, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, so it cannot be understood as a limitation to the present invention. In addition, the terms "first" and "second" are only used for distinction in description and do not have special meanings.

[0032] As Figures 1 to 3 shown, the adhesion test method provided by the present invention includes:

[0033] Step S1: Attach the electronic paper film 2 to the TFT substrate 1;

[0034] Step S2: Partially attach the water-blocking film 3 to the electronic paper film 2;

[0035] Step S3: Apply EC glue to both opposite ends of the electronic paper film 2 in the width direction, and make the EC glue contact the TFT substrate 1 and the water-blocking film 3. Herein, Figure 2 the width direction is the width direction of the electronic paper film 2, and the length direction is the length direction of the electronic paper film 2.

[0036] Step S4: Cure the EC glue to form two glue strips 4; specifically, cure the EC glue through a defoaming curing machine.

[0037] Step S5: Fix the TFT substrate 1, fix the unfitted part of the water barrier film 3 to a tensiometer, and pull the water barrier film 3 through the tensiometer so that the water barrier film 3 gradually detaches from the two adhesive strips 4 from the front end to the rear end of the adhesive strips 4 for adhesion testing. In this embodiment, the front end and the rear end of the adhesive strip 4 respectively refer to the opposite ends of the adhesive strip 4 along its own length direction. The front end is the end close to the unfitted part of the water barrier film 3, and the rear end is the end far from the unfitted part of the water barrier film 3. Optionally, the tensiometer pulls the water barrier film 3 at a uniform speed in the vertical direction, which can ensure that the measured value accurately reflects the adhesion force and avoid measurement errors caused by acceleration or deceleration.

[0038] Apply EC glue to the opposite ends of the electronic paper film 2 in the width direction, and make the EC glue contact the TFT substrate 1 and the water barrier film 3. After the EC glue cures, two adhesive strips 4 are formed. Pull the water barrier film 3 through a tensiometer so that the water barrier film 3 gradually detaches from the two adhesive strips 4 from the front end to the rear end of the adhesive strips 4 for adhesion testing. It can be used to test the adhesion between the EC glue and the water barrier film 3, and further identify the correlation between the adhesion and the water and oxygen barrier ability, which is convenient for controlling the quality of raw materials. In addition, only applying EC glue to the opposite ends of the electronic paper film 2 in the width direction can avoid the situation where the water barrier film 3 has not separated from the EC glue yet when the TFT substrate 1 is damaged when applying EC glue to the front end of the electronic paper film 2, resulting in waste of test samples and labor costs. It can also avoid the situation where the value suddenly rises or becomes uncontrollable due to the change of the force application method near the end of the test when applying EC glue to the rear end of the electronic paper film 2, affecting the accuracy of the test data. Therefore, this adhesion testing method can improve the stability and accuracy of the test. In addition, the test environment depends on the actual application environment of the EC glue and the water barrier film 3, which can also improve the accuracy of the test results. It should be noted that, as Figure 2 shown, the front end and the rear end of the electronic paper film 2 are respectively the opposite end faces of the electronic paper film 2 along the length direction. The front end is the end face of the end close to the unfitted part of the water barrier film 3, and the rear end is the end face of the end far from the unfitted part of the water barrier film 3. When applying EC glue to both the front end and the rear end of the electronic paper film 2, when pulling the water barrier film 3, the water barrier film 3 needs to first detach from the EC glue located at the front end of the electronic paper film 2, then detach from the EC glue at the opposite ends of the electronic paper film 2 in the width direction simultaneously, and finally detach from the EC glue located at the rear end of the electronic paper film 2.

[0039] Optionally, in this embodiment, stop-flow grooves 21 are processed on the opposite end faces of the electronic paper film 2 in the width direction, and the EC glue is applied into the stop-flow grooves 21. With this setting, when applying EC glue, it can be avoided that the EC glue overflows to the front end and the rear end of the electronic paper film 2, affecting the accuracy of the test results.

[0040] Optionally, the electronic paper film 2 has a rectangular structure, so that the two cured adhesive strips 4 are arranged in parallel. With such an arrangement, the stress mode of the water-blocking film 3 during the adhesion test remains unchanged, and the test stability can be improved.

[0041] Optionally, before attaching the electronic paper film 2 to the TFT substrate 1, it further includes: drawing the pattern of a single electronic paper film 2 on the electronic paper film substrate, drawing the pattern of a single water-blocking film 3 on the water-blocking film substrate, and respectively cutting the electronic paper film substrate and the water-blocking film substrate to form a single electronic paper film 2 and a single water-blocking film 3. Specifically, the electronic paper film substrate and the water-blocking film substrate are cut by a laser cutting machine tool, and the cutting accuracy and cutting quality are relatively high.

[0042] Optionally, draw the patterns of multiple electronic paper films 2 on the same electronic paper film substrate to obtain multiple electronic paper films 2, select multiple water-blocking film substrates with different performances, and draw the pattern of a single water-blocking film 3 on each water-blocking film substrate to obtain multiple water-blocking films 3; match the multiple water-blocking films 3 with the multiple electronic paper films 2 one by one, and apply EC glue with the same performance to the multiple water-blocking films 3. Since the performances of the water-blocking films 3 manufactured by different manufacturers may be different, by matching water-blocking films 3 with different performances with EC glue of the same performance for the adhesion test, the influence of water-blocking films 3 with different performances on the adhesion can be determined based on the test data, and conclusions can be drawn.

[0043] Of course, it is also possible to draw the patterns of multiple electronic paper films 2 on the same electronic paper film substrate to obtain multiple electronic paper films 2, select multiple water-blocking film substrates with the same performance, and draw the pattern of a single water-blocking film 3 on each water-blocking film substrate to obtain multiple water-blocking films 3; match the multiple water-blocking films 3 with the multiple electronic paper films 2 one by one, and select multiple EC glues with different performances and apply them to the multiple water-blocking films 3 one by one. Since the performances of the EC glues manufactured by different manufacturers may be different, by matching EC glues with different performances with water-blocking films 3 of the same performance for the adhesion test, the influence of EC glues with different performances on the adhesion can be determined based on the test data, and conclusions can be drawn.

[0044] Furthermore, the sizes of the multiple electronic paper films 2 are the same, and the sizes of the multiple water-blocking films 3 are the same. With such an arrangement, the sizes of the electronic paper films 2 and the water-blocking films 3 used in the test are unified, realizing standardized size control and ensuring the accuracy of the determination results.

[0045] Optionally, in this embodiment, the water-blocking film 3 has a rectangular structure. Among the opposite ends of the water-blocking film 3 along the length direction, one end face is flush with the end face of the electronic paper film 2, and the other end extends beyond the electronic paper film 2. With such an arrangement, materials are saved, and interference between the water-blocking film 3 and other test equipment can also be avoided, which may affect the accuracy of the test results.

[0046] Optionally, in this embodiment, first bend the water-blocking film 3 upward, and then fix the water-blocking film 3 on the tensiometer. Among them, as Figure 2 shown, the water-blocking film 3 is bent upward to form a bending line 31. With such a setting, it is convenient to fix the water-blocking film 3 on the tensiometer, saving the test time. Since the water-blocking film 3 is a flexible film, it will not affect the test results. Specifically, first bend the water-blocking film 3 upward, then clamp the clamping jaws of the tension head of the tensiometer at the central position of the water-blocking film 3. After setting the tension speed, start the tensiometer. The tension head of the tensiometer pulls the water-blocking film 3 uniformly in the vertical direction. After the test is completed, the tensiometer stops automatically, and the test data is recorded according to the numerical curve display.

[0047] Optionally, both ends of the TFT substrate 1 are fixed on the test base of the tensiometer through pressing plates respectively. With such a setting, the fixation of the TFT substrate 1 is more reliable. Optionally, in this embodiment, the opposite ends of the TFT substrate 1 along its own length direction are fixed on the test base of the tensiometer through pressing plates.

[0048] Obviously, the above embodiments of the present invention are merely examples for clearly illustrating the present invention, rather than limiting the implementation manners of the present invention. For those of ordinary skill in the art, various obvious changes, re-adjustments and substitutions can be made without departing from the protection scope of the present invention. It is not necessary and impossible to enumerate all the implementation manners here. Any modifications, equivalent substitutions and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the claims of the present invention.

Claims

1. An adhesion test method, characterized in that, Including: Bonding the electronic paper film (2) onto the TFT substrate (1); Partially bonding the water-blocking film (3) onto the electronic paper film (2); Coating EC glue on opposite ends of the electronic paper film (2) in the width direction, and making the EC glue contact the TFT substrate (1) and the water-blocking film (3); Curing the EC glue to form two glue strips (4); Fixing the TFT substrate (1), fixing the unbonded part of the water-blocking film (3) to a tensiometer, and pulling the water-blocking film (3) by the tensiometer to gradually separate the water-blocking film (3) from the front end to the rear end of the two glue strips (4) for adhesion testing.

2. The adhesion test method according to claim 1, characterized in that Processing stop-flow grooves (21) on opposite end faces of the electronic paper film (2) in the width direction, and coating the EC glue in the stop-flow grooves (21).

3. The adhesion test method according to claim 1, characterized in that, The electronic paper film (2) is of a rectangular structure so that the two cured glue strips (4) are arranged in parallel.

4. The adhesion test method according to claim 1, wherein Before bonding the electronic paper film (2) onto the TFT substrate (1), it further includes: drawing the pattern of a single electronic paper film (2) on an electronic paper film substrate, drawing the pattern of a single water-blocking film (3) on a water-blocking film substrate, and respectively cutting the electronic paper film substrate and the water-blocking film substrate to form a single electronic paper film (2) and a single water-blocking film (3).

5. The adhesion test method according to claim 4, wherein Drawing the patterns of multiple electronic paper films (2) on the same electronic paper film substrate to obtain multiple electronic paper films (2), selecting multiple water-blocking film substrates with different properties, and drawing the pattern of a single water-blocking film (3) on each water-blocking film substrate to obtain multiple water-blocking films (3); matching the multiple water-blocking films (3) with the multiple electronic paper films (2) one by one, and coating the EC glue with the same property on the multiple water-blocking films (3).

6. The adhesion test method according to claim 5, characterized in that The sizes of the multiple electronic paper films (2) are the same, and the sizes of the multiple water-blocking films (3) are the same.

7. The adhesion test method according to any one of claims 1-6, characterized in that, The tensiometer pulls the water-blocking film (3) uniformly in the vertical direction.

8. The adhesion test method according to any one of claims 1-6, characterized in that, The water-blocking film (3) is of a rectangular structure. Among opposite ends of the water-blocking film (3) in the length direction, the end face of one end is flush with the end face of the electronic paper film (2), and the other end extends beyond the electronic paper film (2).

9. The adhesion test method according to any one of claims 1-6, characterized in that, First bend the water-blocking film (3) upward, and then fix the water-blocking film (3) to the tensiometer.

10. The adhesion test method according to any one of claims 1-6, characterized in that, Fix the two ends of the TFT substrate (1) to the test base of the tensiometer through pressing plates respectively.

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