Optical communication device and preparation method thereof

Abstract

The invention discloses an optical communication device and a preparation method thereof, and belongs to the technical field of optical communication, and the optical communication device comprises an optical fiber unit, a first installation unit, a first lens unit, a second installation unit, a second lens unit, an optical chip unit and a substrate unit. The optical fiber unit is mounted on the first mounting unit; the first lens unit is installed on the first installation unit and located on the output side of the optical fiber unit. The first mounting unit and the second mounting unit are detachably connected; the second lens unit is mounted on the optical chip unit; the optical chip unit is mounted on the substrate unit; the second mounting unit is mounted on the substrate unit; the optical chip unit, the second lens unit and the first lens unit are sequentially arranged in the height direction of the optical communication device. According to the invention, the assembly and maintenance difficulty and cost of the CPO module are reduced.

Description

Technical Field

[0001] This invention application belongs to the technical field of optical communication, and particularly relates to an optical communication device and its preparation method. Background Art

[0002] In the traditional optical module solution, the electrical signal is transmitted from the network switching chip to the switch port, and the optoelectronic conversion and transmission are realized through a pluggable optical module. Different from the traditional pluggable optical module, the Co-Packaged Optics (CPO) technology is a technology that integrates the network switching chip and the optical engine in the same package.

[0003] In the CPO technology, the network switching chip, the optical integration chip, and the optical communication passive components are highly integrated and packaged. The optoelectronic conversion and transmission are realized at the port of the core network switching chip, which can greatly shorten the physical distance between the electrical chip and the optical engine. It has the advantages of low power consumption, low latency, and high bandwidth, and can be widely used in high-bandwidth scenarios such as data centers and AI computing power. It is the core optical connection solution for the next-generation data center and high-performance computing.

[0004] However, the highly integrated packaging of the network switching chip, the optical integration chip, the electrical chip, and the optical communication passive components has extremely high costs. The requirements for the positioning accuracy of optical fiber assembly and lens assembly are extremely high, which poses great challenges to assembly, testing, and thermal management. The failure of the optical communication passive components easily leads to the scrapping of the overall CPO module. Therefore, there is an urgent need for a technology that can both achieve coupling and facilitate the maintenance of the CPO technology. Summary of the Invention

[0005] This invention application provides an optical communication device and its preparation method, aiming to partially or fully solve the technical problems in the prior art that the failure of the optical communication passive components easily leads to the scrapping of the entire CPO module, and the cost of replacing the entire CPO module is extremely high. To achieve the above object, this invention application adopts the following technical solutions:

[0006] In a first aspect, an optical communication device includes:

[0007] An optical fiber unit, a first mounting unit, a first lens unit, a second mounting unit, a second lens unit, an optical chip unit, and a substrate unit;

[0008] The optical fiber unit is mounted on the first mounting unit;

[0009] The first lens unit is mounted on the first mounting unit, and the first lens unit is located on the output side of the optical fiber unit;

[0010] The first mounting unit and the second mounting unit are detachably connected;

[0011] The second lens unit is mounted on the optical chip unit;

[0012] The optical chip unit is mounted on the substrate unit;

[0013] The second mounting unit is mounted on the substrate unit;

[0014] Along the height direction of the optical communication device, the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence.

[0015] Optionally, the optical fiber unit includes multiple optical fibers; the first mounting unit includes a first positioning portion and a protruding portion; the first positioning portion positions the end of the outermost optical fiber of the optical fiber unit; a protruding portion is formed on the side wall of the first mounting unit, and the first positioning portion is connected to the protruding portion.

[0016] Optionally, each optical fiber includes a bare fiber portion and a cladding portion, the first mounting unit is recessed to form a first side wall and a second side wall, and there are two first positioning portions and two protruding portions;

[0017] The left first positioning portion contacts the end of the bare fiber portion of the left outermost optical fiber to position the left outermost optical fiber, a left protruding portion is formed on the first side wall, and the left protruding portion is connected to the left first positioning portion;

[0018] The right first positioning portion contacts the end of the bare fiber portion of the right outermost optical fiber to position the right outermost optical fiber, a right protruding portion is formed on the second side wall, and the right protruding portion is connected to the right first positioning portion.

[0019] Optionally, the first mounting unit further includes a positioning portion, the second mounting unit includes a positioning cavity, and the positioning portion cooperates with the positioning cavity; and / or, along the height direction of the optical communication device, the first mounting unit is located above the second mounting unit.

[0020] Optionally, the first mounting unit further includes a first transmission hole; along the height direction of the optical communication device, the first transmission hole penetrates through the first mounting unit, and the first lens unit is mounted above the first transmission hole; the second mounting unit further includes a second transmission hole; along the height direction of the optical communication device, the second transmission hole penetrates through the second mounting unit, and the second lens unit is located in the second transmission hole;

[0021] Along the height direction of the optical communication device, the height of the positioning cavity is H1, the height of the second transmission hole is H2, the height of the second mounting unit is H, the height of the optical chip unit is L1, and the height of the second lens unit is L2, satisfying: L1 + L2 ≤ H1 + H2, H1 + H2 = H.

[0022] Optionally, the first mounting unit is provided with mounting posts, and the second mounting unit is provided with mounting holes, and the mounting posts are inserted into the mounting holes; and / or, the first mounting unit is provided with mounting holes, and the second mounting unit is provided with mounting posts, and the mounting posts are inserted into the mounting holes.

[0023] Optionally, each optical fiber includes a bare fiber portion and a cladding portion. The first mounting unit includes a support portion and a second positioning portion, and the second positioning portion is provided with a plurality of positioning grooves; the support portion supports the cladding portion, and the positioning grooves position the bare fiber portion; and / or, the first mounting unit is an injection molded part; and / or, the second mounting unit is an injection molded part; and / or, the first lens unit is made of an injection molded part or a glass lens; and / or, the second lens unit is made of a silicon lens or glass; and / or, the first mounting unit and the first lens unit are integrally formed parts.

[0024] In a second aspect, a method for manufacturing an optical communication device uses any one of the optical communication devices described in the first aspect above and includes:

[0025] Step S100: Mount the optical fiber unit on the first mounting unit; mount the first lens unit on the first mounting unit, and the first lens unit is located on the output side of the optical fiber unit; assemble the second mounting unit with the first mounting unit;

[0026] Step S200: Mount the optical chip unit on the substrate unit, position the second lens unit, and mount the second lens unit on the optical chip unit;

[0027] Step S300: Position the second lens unit and the first lens unit; mount the second mounting unit on the substrate unit, and along the height direction of the optical communication device, the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence;

[0028] Step S100 and Step S200 can be carried out in sequence, or in reverse sequence, or simultaneously.

[0029] Optionally,

[0030] Step S100 includes:

[0031] Step S101: Mount the optical fiber unit on the first mounting unit;

[0032] Step S102: The first lens unit is located on the output side of the optical fiber unit. Place the first lens unit on the first mounting unit, position the first lens unit, and mount the first lens unit on the first mounting unit. Positioning the first lens unit includes: image positioning the first lens unit or optical power coupling positioning the first lens unit;

[0033] Step S103: Assemble the second mounting unit with the first mounting unit;

[0034] And / or, Step S200 includes:

[0035] Step S201: Mount the optical chip unit on the substrate unit;

[0036] Step S202: Position the second lens unit. The second lens unit is mounted on the optical chip unit. Positioning the second lens unit includes: image-positioning the second lens unit or power-coupling-positioning the second lens unit.

[0037] And / or, step S300 includes:

[0038] Step S301: Position the second lens unit and the first lens unit, including: along the height direction of the optical communication device, the second mounting unit is spaced from the substrate unit, and image-position the second lens unit and the first lens unit or power-coupling-position the second lens unit and the first lens unit.

[0039] Step S302; Mount the second mounting unit on the substrate unit. Along the height direction of the optical communication device, the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence.

[0040] Optionally, the power-coupling positioning is maximum power-coupling positioning; and / or, in step S300, after the first mounting unit and the second mounting unit are connected, along the height direction of the optical communication device, the height of the second mounting unit is H, the height of the optical chip unit is L1, and the height of the second lens unit is L2, satisfying: L1 + L2 ≤ H.

[0041] (1) In this invention application, first of all, the optical communication device can adopt a modular design, and a detachable connection design is adopted between the first mounting unit and the second mounting unit. This modular structure enables the optical communication device to be maintained without disassembling the entire system. Even if an optical communication passive component fails, only the single failed component needs to be replaced or upgraded, which not only improves the practicality and service life of the optical communication device, but also reduces the complexity and cost of CPO module assembly and repair; in addition, two independent lens units (the first lens unit and the second lens unit) are adopted, providing higher flexibility for beam control, and the transmission direction and intensity of the optical signal can be adjusted according to different fiber types or optical chip requirements; furthermore, the fiber unit and the two lens units are assembled and positioned through the first mounting unit and the second mounting unit, meeting the high-precision assembly requirements, ensuring the stability and reliability of optical signal transmission, reducing the difficulty and cost of the optoelectronic co-packaging process, testing, thermal management and maintenance, and enhancing its practical value and market prospect in modern optoelectronic co-packaging technology.

[0042] (2) In the application of the present invention, the manufacturing method of the optical communication device can be divided into two independent steps (step S100 and step S200) for manufacturing and then assembling. This facilitates the subsequent assembly, maintenance, upgrade, or replacement of the optical communication device, reduces the overall assembly and maintenance difficulty and cost of the CPO module. Step S300 positions the second lens unit and the first lens unit, so that the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence along the height direction, achieving the alignment and coupling of the optical path, reducing the signal loss of optical communication, and improving the optical transmission efficiency. The modular design and flexible step sequence support parallel operation, shortening the total assembly time of the optical communication device, being suitable for large-scale production, and meeting the requirements of different application scenarios (such as data centers or AI computing power modules). BRIEF DESCRIPTION OF THE DRAWINGS

[0043] In order to more clearly illustrate the technical solutions in the embodiments of the present invention application, the following will briefly introduce the drawings required for the description of the embodiments. Obviously, the following drawings are only some embodiments of the present invention application. For those of ordinary skill in the art, without creative efforts, other drawings can also be obtained based on these drawings.

[0044] Figure 1 Structural schematic diagram of the optical communication device of the present invention application;

[0045] Figure 2 Exploded structural schematic diagram of the optical communication device of the present invention application;

[0046] Figure 3 Structural schematic of the optical fiber unit, the first mounting unit, and the first lens unit of the present invention application Figure 1 ;

[0047] Figure 4 Structural schematic diagram of the first mounting unit of the present invention application;

[0048] Figure 5 Structural schematic of the optical fiber unit, the first mounting unit, and the first lens unit of the present invention application Figure 2 ;

[0049] Figure 6 Structural schematic of the optical fiber unit, the first mounting unit, and the first lens unit of the present invention application Figure 3 ;

[0050] Figure 7 Structural schematic diagram of the second mounting unit, the optical chip unit, the second lens unit, and the substrate unit of the present invention application;

[0051] Figure 8 Structural schematic diagram of the second mounting unit of the present invention application;

[0052] Figure 9 It is a partial structural schematic diagram of another optical communication device of the present invention application;

[0053] Figure 10 It is a process schematic diagram of a method for preparing an optical communication device of the present invention application;

[0054] The accompanying drawings are used to provide a further understanding of the present invention application, and constitute a part of the specification. Together with the embodiments of the present invention application, they are used to explain the present invention application, and do not constitute a limitation to the present invention application. Specific embodiments

[0055] Next, the technical solutions in the embodiments of the present invention application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention application. Obviously, the described embodiments are only a part of the embodiments of the present invention application, rather than all the embodiments; based on the embodiments in the present invention application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention application.

[0056] In the description of the present invention application, it should be understood that the terms "upper", "lower", "front", "rear", "left", "right", "top", "bottom", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the accompanying drawings. It is only for the convenience of describing the present invention application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation to the present invention application. To make the purpose, technical solutions and advantages of the present invention application clearer, the following will further describe the embodiments of the present invention application in detail in conjunction with the accompanying drawings.

[0057] In addition, the terms "first" and "second" are only used for descriptive purposes, and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the present invention, the meaning of "a plurality" is one or two or more than two, unless otherwise specifically defined.

[0058] To make the purpose, technical solutions and advantages of the present invention application clearer, the following will clearly and completely describe the technical solutions in the embodiments of the present invention application in conjunction with the accompanying drawings in the embodiments of the present invention application. Obviously, the described embodiments are only a part of the embodiments of the present invention application, rather than all the embodiments; based on the embodiments in the present invention application, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the scope of protection of the present invention application.

[0059] Optical communication device

[0060] As Figures 1 to 9 shown, in a first aspect, an optical communication device includes:

[0061] Optical fiber unit 100, first mounting unit 200, first lens unit 300, second mounting unit 400, second lens unit 500, optical chip unit 600, substrate unit 700;

[0062] The optical fiber unit 100 is mounted on the first mounting unit 200;

[0063] The first lens unit 300 is mounted on the first mounting unit 200, and the first lens unit 200 is located on the output side of the optical fiber unit 100;

[0064] The first mounting unit 200 and the second mounting unit 400 are detachably connected;

[0065] The second lens unit 500 is mounted on the optical chip unit 600;

[0066] The optical chip unit 600 is mounted on the substrate unit 700;

[0067] The second mounting unit 400 is mounted on the substrate unit 700;

[0068] Along the height direction of the optical communication device, the optical chip unit 600, the second lens unit 500, and the first lens unit 300 are arranged in sequence.

[0069] In some embodiments, the optical fiber unit 100 serves as an input end to receive an optical signal from the outside. The first lens unit 300 is mounted on the first mounting unit 200 and is located on the output side of the optical fiber unit 100. It can collimate the optical signal emitted from the optical fiber to obtain a first adjusted optical signal to adjust the transmission direction and / or intensity of the optical signal. Then the optical signal is transmitted to the second lens unit 500. The second lens unit 500 is connected to the optical chip unit 600. The second lens unit 500 collimates or focuses the optical signal to obtain a second adjusted optical signal and guides the second adjusted optical signal to the optical chip unit 600. The optical chip unit 600 receives the optical signal adjusted by the first lens unit 100 and the second lens unit 500 and converts it into an electrical signal for processing to achieve the optical communication function.

[0070] In some embodiments, the first lens unit 300 can be an optical lens (such as a collimating lens, etc.) for collimating the divergent light beam output from the optical fiber unit 100 into a parallel light beam. The lens material can be made of optical glass or plastic to ensure high light transmittance and low dispersion, suitable for the optical communication band. An antireflection film can be provided on the surface of the first lens unit 300 to reduce the reflection loss of the optical signal and improve the optical transmission efficiency.

[0071] In some embodiments, the second lens unit 500 can also be an optical lens (such as a convex lens, a microlens, or a spherical or aspherical lens), which is used to collimate or focus the first adjusted optical signal (such as parallel light) onto the receiving area of the optical chip unit 600 to achieve optical signal transmission. Similar to the first lens unit, a high light transmittance material (such as optical glass or silicon-based material) can also be used to match the optical communication band.

[0072] In some embodiments, along the height direction of the optical communication device, the optical chip unit 600, the second lens unit 500, and the first lens unit 300 are arranged in sequence. This vertical layout ensures a direct and efficient transmission path for optical signals from the optical fiber to the optical chip, reduces the loss of optical signals during transmission, and improves the efficiency and quality of signal transmission.

[0073] In some embodiments, the detachable connection design between the first mounting unit 200 and the second mounting unit 400, such as plug-in connection, fastening connection, or locking and releasing connection, etc., provides support for the precise alignment and modular assembly of the optical-electrical co-packaging technology, thus ensuring the integrity and efficiency of optical signal transmission.

[0074] In the present invention application, first, the optical communication device can adopt a modular design, and a detachable connection design is adopted between the first mounting unit 200 and the second mounting unit 400. This modular structure enables the device to be maintained without disassembling the entire system. Even if an optical communication passive component fails, only the single failed component needs to be replaced or upgraded, which not only improves the practicability and service life of the optical communication device, but also reduces the complexity and cost of CPO module assembly and repair; additionally, two independent lens units (the first lens unit 300 and the second lens unit 500) are adopted, which provides higher flexibility for beam control and can adjust the transmission direction and intensity of optical signals according to different optical fiber types or optical chip requirements; furthermore, through the assembly and positioning of the optical fiber unit 100 and the two lens units by the first mounting unit 200 and the second mounting unit 400, the high-precision assembly requirements are met, ensuring the stability and reliability of optical signal transmission, reducing the difficulty and cost of the optical-electrical co-packaging process, testing, thermal management, and maintenance, and enhancing its practical value and market prospect in modern optical-electrical co-packaging technology.

[0075] Optionally, the optical fiber unit 100 includes multiple optical fibers. The first mounting unit 200 includes a first positioning portion 206 and a protruding portion 207. The first positioning portion 206 positions the outermost edge optical fiber end of the optical fiber unit 100; a protruding portion 207 is formed on the side wall of the first mounting unit 200, and the first positioning portion 206 is connected to the protruding portion 207.

[0076] In the present invention application, the first lens unit 300 may include a plurality of light incident areas 301. The optical fiber unit 100 includes a plurality of optical fibers. The optical fibers are aligned with the light incident areas 301. A protruding portion 207 is formed on the side wall of the first mounting unit 200. The protruding portion 207 is connected to the first positioning portion 206, which can provide the alignment function of the optical fiber unit 100, and thus can accurately position the optical fiber unit 100.

[0077] Optionally, each optical fiber includes a bare fiber portion 101 and a cladding portion 102. The first mounting unit 200 is recessed to form a first side wall 2081 and a second side wall 2082; there are two first positioning portions 206 and two protruding portions 207 respectively;

[0078] The left first positioning portion 206 contacts the end of the bare fiber portion of the leftmost edge optical fiber 101L to position the leftmost edge optical fiber 101L. A left protruding portion 207 is formed on the first side wall 2081, and the left protruding portion is connected to the left first positioning portion 206;

[0079] The right first positioning portion 206 contacts the end of the bare fiber portion of the rightmost edge optical fiber 101R to position the rightmost edge optical fiber 101R; a right protruding portion 207 is formed on the second side wall 2082, and the right protruding portion is connected to the right first positioning portion 206.

[0080] In the present invention application, the left first positioning portion 206 contacts the end of the bare fiber portion of the leftmost edge optical fiber 101L, and the right first positioning portion 206 contacts the end of the bare fiber portion of the rightmost edge optical fiber 101R, ensuring the precise alignment of the end face of the optical fiber (end) in the horizontal direction. Through the bilateral symmetric positioning design, the optical fiber end face can be aligned with the subsequent first lens unit 300, and thus the optical signal transmission can be realized.

[0081] Optionally, the first mounting unit 200 further includes a positioning portion 201, and the second mounting unit 400 includes a positioning cavity 401. The positioning portion 201 cooperates with the positioning cavity 401; and / or, along the height direction of the optical communication device, the first mounting unit 200 is located above the second mounting unit 400

[0082] In some embodiments, the positioning portion 201 on the first mounting unit 200 is a circular protrusion or a rectangular protrusion or a T-shaped protrusion, and the positioning cavity 401 of the second mounting unit 400 is a matching circular groove or a rectangular groove or a T-shaped groove. During assembly, the positioning portion 201 is inserted into the positioning cavity 401. Exemplarily, the positioning portion 201 is a T-shaped protrusion, and a first recess 202 and a second recess 203 are formed at the bottom of the first mounting unit 200. The first recess 202 and the second recess 203 are symmetrically arranged.

[0083] In the application of the present invention, the positioning portion 201 can be designed as a convex structure and inserted into the positioning cavity 401 of the second mounting unit 400. Along the height direction of the optical communication device, the first mounting unit 200 is located above the second mounting unit 400. The positioning and guiding function of the cooperation between the positioning portion 201 and the positioning cavity 401 improves the assembly efficiency of the first mounting unit 200 and the second mounting unit 400. The mechanical fitting method ensures that the first mounting unit 200 and the second mounting unit 400 are aligned as much as possible in the horizontal and vertical directions, reducing the deviation and loss of the optical signal during transmission and improving the optical signal coupling efficiency. In addition, the cooperation between the positioning portion 201 and the positioning cavity 401 combined with the detachable connection feature allows the two units to be easily separated when needed, facilitating maintenance or upgrade.

[0084] Optionally, the first mounting unit 200 further includes a first transmission hole 209; along the height direction of the optical communication device, the first transmission hole 209 penetrates the first mounting unit 200, and the first lens unit 300 is installed above the first transmission hole 209; the second mounting unit 400 further includes a second transmission hole 402; along the height direction of the optical communication device, the second transmission hole 402 penetrates the second mounting unit 400, and the second lens unit 500 is located in the second transmission hole 402.

[0085] In some embodiments, the optical signal output by the optical fiber unit 100 propagates through the first transmission hole 209. The first transmission hole 209 penetrates the first mounting unit 200 and is located on the output side of the optical fiber unit 100. The first lens unit 300 is installed above the first transmission hole 209 to collimate the optical signal. The transmission direction of the adjusted optical signal (i.e., the first adjusted optical signal) is made to transmit along the height direction of the optical communication device, and then enters the second lens unit 500 in the second transmission hole 402 of the second mounting unit 400. The second lens unit 500 collimates or focuses the adjusted optical signal and guides it to the optical chip unit 600. The optical chip unit 600 receives the second adjusted optical signal obtained through the processing of the second lens unit and converts it into an electrical signal to complete the optoelectronic conversion.

[0086] In the application of the present invention, the first transmission hole 209 and the second transmission hole 402 penetrate along the height direction. The through design of the transmission holes combined with the layout of the two lens units (the first lens unit 300 and the second lens unit 500) ensures the alignment of the optical signal from the optical fiber to the optical chip, reducing the offset of the optical path signal. The compact design of the transmission holes allows for the transmission of multiple optical signals in a limited space, meeting the requirements of high-density optical communication.

[0087] Optionally, along the height direction of the optical communication device, the height of the positioning cavity is H1, the height of the second transmission hole is H2, the height of the second mounting unit is H, the height of the optical chip unit 600 is L1, and the height of the second lens unit 500 is L2, satisfying: L1 + L2 ≤ H1 + H2, H1 + H2 = H.

[0088] In some embodiments, L1 + L2 ≤ H1 + H2. The total height (L1 + L2) of the optical chip unit 600 and the second lens unit 500 does not exceed the sum of the heights of the positioning cavity and the second transmission hole H1 + H2, that is, the height H of the second mounting unit. The optical chip unit 600 and the second lens unit 500 can be completely accommodated within the predetermined space of the second mounting unit 400 without exceeding the height limit.

[0089] In the present invention application, by restricting the height, the second mounting unit 400 can effectively protect the optical chip unit 600 and the second lens unit 500 from mechanical damage (such as damage caused by external impact or pressure) or external interference due to exceeding the space limit. The optical chip unit and the second lens unit are firmly connected within the predetermined space, avoiding the risk of optical path misalignment caused by loosening or displacement, and improving the stability and reliability of the optical communication device.

[0090] Optionally, the first mounting unit 200 is provided with mounting posts, and the second mounting unit 400 is provided with mounting holes, and the mounting posts are inserted into the mounting holes; and / or, the first mounting unit 200 is provided with mounting holes, and the second mounting unit 400 is provided with mounting posts, and the mounting posts are inserted into the mounting holes.

[0091] In some embodiments, the first mounting unit 200 is provided with a mounting post A1, and the second mounting unit 400 is provided with a mounting hole A2. The mounting post is inserted into the mounting hole to achieve a firm connection by means of plugging; or, the first mounting unit 200 is provided with a mounting hole B2, and the second mounting unit 400 is provided with a mounting post B1 (not shown). The mounting post is inserted into the mounting hole, and the connection is also achieved through mechanical plugging. The above two methods can accurately ensure the optical coupling communication between the optical fiber unit and the optical chip unit. Those skilled in the art can select a suitable configuration according to the specific application scenario.

[0092] In the present invention application, first of all, the plugging design provides a simple alignment method to ensure the accurate position of the first two mounting units 200 and the second mounting unit 400 during assembly. The plugging design provides a self-aligning function to ensure the accurate position during the assembly process, reduce the optical path offset, and improve the optical signal transmission efficiency. Through mechanical plugging, the two units can be tightly connected, enhancing the stability of the optical communication device during operation and reducing the failures caused by loosening; in addition, the plugging structure supports the easy separation of the two units, facilitating maintenance or replacement when needed, and reducing the difficulty and cost of the optical-electrical co-packaging process, testing, thermal management, and maintenance.

[0093] Optionally, the first mounting unit 200 includes a support portion 204 and a second positioning portion 205. The second positioning portion 205 is provided with a plurality of positioning grooves; the support portion 204 supports the cladding portion 102, and the positioning grooves position the bare fiber portion 101.

[0094] In the present invention application, the second positioning portion 205 is provided with a plurality of positioning grooves. Multiple optical fibers can be installed on the first mounting unit 200 through a common positioning groove (such as a common V-groove), a cover plate, and a glue connection method. Multiple optical fibers are arranged in an array. The optical fiber includes a cladding portion 102 and a bare optical fiber portion 101. Multiple cladding portions 102 are arranged in an array on the support portion 204 and are bonded to the support portion 204 by glue. Multiple bare fiber portions 101 are arranged in an array in the positioning grooves. Glue (or other adhesives) can be filled between the positioning grooves and the bare fiber portion 101, and the cover plate is pressed and matched with the positioning grooves, so that multiple optical fibers can be pressed and bonded in the first positioning portion 205, and then the optical fiber unit 100 can be installed on the first mounting unit 200.

[0095] Optionally, the first mounting unit 200 is an injection molded part; and / or, the second mounting unit 400 is an injection molded part; and / or, the first lens unit 300 is made of an injection molded lens or a glass lens; and / or, the second lens unit 500 is made of a silicon lens or glass; and / or, the first mounting unit 200 and the first lens unit 300 are integrally formed parts.

[0096] In some embodiments, the first mounting unit 200 is used to support and position the optical fiber unit 100 and the first lens unit 300, and the first mounting unit 200 can be an injection molded part. Exemplarily, the injection molded part can be formed by injecting molten plastic into a mold, and high-strength and high-temperature resistant plastic materials such as polycarbonate PC or polyimide PI can be used.

[0097] In some embodiments, the second mounting unit 400 is used to position the first mounting unit 200. The second mounting unit 400 can be an injection molded part, and the injection molding process is also applicable to its manufacturing. Exemplarily, materials such as polycarbonate PC or polyimide PI can be used, which can be consistent with the first mounting unit 200.

[0098] In some embodiments, the first lens unit 300 is located on the output side of the optical fiber unit 100 and is used to collimate or focus optical signals. An injection molded lens (plastic) or a glass lens can be selected for manufacturing. When the first lens unit 300 is an injection molded lens, plastics such as polymethyl methacrylate (PMMA) or polycarbonate (PC) can be used; when the first lens unit 300 is a glass lens, borosilicate glass or quartz glass can be used, and those skilled in the art do not make special restrictions on this.

[0099] In some embodiments, the second lens unit 500 is made of a silicon lens or glass. The second lens unit 500 is mounted on the optical chip unit 600 to input an optical signal into the optical chip. The second lens unit 500 can be a silicon lens or a glass lens, which can be applicable to different wavelength bands and usage environments. When the second lens unit 500 is a silicon lens, high-purity silicon material can be used; when the second lens unit 500 is a glass lens, borosilicate glass or fused quartz can be used, etc., and those skilled in the art do not have special restrictions on this either.

[0100] In the present invention application, the injection molding process is suitable for mass production, significantly reducing the manufacturing cost. The plastic material can reduce the weight of the optical communication device, and the electrical insulation of the plastic protects the electronic components in the device, avoiding short circuits or interference. The injection molding process can achieve complex geometric shapes, meeting the diverse structural requirements for support, positioning, and assembly.

[0101] In the present invention application, the glass lens has a high refractive index and low dispersion, providing a clearer optical effect, stable performance in high-temperature environments, high hardness, not easily scratched, and a long service life.

[0102] In the optical communication device of the present invention application, the first mounting unit 200 and the first lens unit 300 are integrally formed parts. Exemplarily, the first mounting unit 200 and the first lens unit 300 can be integrally formed by injection molding. Integral injection molding is to form the first mounting unit 200 and the first lens unit 300 simultaneously in the same injection molding process to form an integral structure, reducing the assembly process. Integral forming can eliminate the original assembly errors, ensure the alignment accuracy between the first lens unit 300 and the optical fiber unit 100, also reduce the number of components, improve the overall stability and reliability, reduce the manufacturing cost, and improve the production efficiency.

[0103] It should be noted that those skilled in the art can reasonably select or combine materials and processes (such as injection molded parts, glass lenses, silicon lenses, integral forming technology), so that the optical communication device can be optimized in terms of cost, performance, etc., and can also meet the requirements of different application scenarios.

[0104] Method for preparing an optical communication device

[0105] As Figure 10 shown, in a second aspect, a method for manufacturing an optical communication device uses any one of the optical communication devices described in the first aspect above, and includes:

[0106] It should be noted that the method for manufacturing an optical communication device of the present invention application uses any one of the optical communication devices described in the first aspect above, and correspondingly also includes: all the technical problems, technical solutions, and technical effects recorded in any one of the optical communication devices in the first aspect. The present invention application will not repeat them here.

[0107] Step S100: The optical fiber unit 100 is installed on the first installation unit 200; the first lens unit 300 is installed on the first installation unit 200, and the first lens unit 200 is located on the output side of the optical fiber unit 100; the second installation unit 400 is assembled with the first installation unit 200;

[0108] Specifically, step S100 includes:

[0109] Step S101: The optical fiber unit 100 is installed on the first installation unit 200;

[0110] In some embodiments, the optical fiber unit 100 includes multiple optical fibers, and each optical fiber includes a bare fiber portion 101 and a cladding portion 102;

[0111] In some embodiments, step S101 includes:

[0112] The multiple optical fibers can be installed on the first installation unit 200 through a positioning groove (such as a common V-shaped groove), a cover plate, and glue connection. Specifically, the multiple optical fibers are arranged in an array on top, and the multiple cladding portions 102 are arranged in an array on the support portion 204 and bonded to the support portion 204 through glue; the multiple bare fiber portions 101 are arranged in an array in the positioning cavity, glue (or other adhesives) is filled between the positioning groove and the bare fiber portion 101, and the cover plate is in press-fit with the positioning groove, so that the multiple optical fibers can be pressed and bonded in the first positioning portion 205. In this way, the optical fiber unit 100 can be installed on the first installation unit 200.

[0113] Step S102: The first lens unit 200 is located on the output side of the optical fiber unit 100. The first lens unit 200 is placed on the first installation unit 200, and the first lens unit 300 is positioned. The first lens unit 300 is installed on the first installation unit 200. Positioning the first lens unit 300 includes: image-positioning the first lens unit 300 or optical power coupling-positioning the first lens unit 300;

[0114] In some embodiments, for image-positioning the first lens unit 300, the first lens unit 300 being installed on the first installation unit 200 includes:

[0115] Step S102A1: The first lens unit 200 is located on the output side of the optical fiber unit 100. After the first lens unit 200 is placed on the first installation unit 200, an image of the first lens unit 300 on the first installation unit 200 is taken; according to the image of the first lens unit 300 on the first installation unit 200, the actual position of the first lens unit 300 on the first installation unit 200 is obtained;

[0116] Step S102A2: Adjust the first lens unit 300 according to the set position of the first lens unit 300 on the first mounting unit 200 and the actual position of the first lens unit 300 on the first mounting unit 200, so that the first lens unit 300 is located at the set position on the first mounting unit 200;

[0117] Step S102A3: The first lens unit 300 is mounted on the first mounting unit 200.

[0118] In some embodiments, by taking an image of the first lens unit 300 on the first mounting unit 200, obtaining its actual position, analyzing the position deviation using image processing technology, comparing the actual position of the first lens unit 300 with the set position, dynamically adjusting the position of the first lens unit 300 to ensure its alignment with the output side of the optical fiber unit 100, ensuring the optical path transmission direction, and after confirming that the position of the first lens unit 300 is accurate, mounting (such as glue bonding) the first lens unit 300 on the first mounting unit 200 to complete the installation of the first lens unit 300.

[0119] In the present invention application, image positioning can provide high-resolution imaging and analysis. The imaging and adjustment process can be implemented by an automated device. Image positioning provides real-time position data and supports dynamic adjustment, enabling the first lens unit 300 to be aligned with the output side of the optical fiber unit 100, ensuring that the installation position of the first lens unit 300 meets the design requirements, reducing manual operation errors, reducing optical signal coupling losses, and improving production efficiency.

[0120] In some embodiments, the first lens unit 300 is positioned by optical power coupling. The installation of the first lens unit 300 on the first mounting unit 200 includes:

[0121] Step S102B1: The first lens unit 200 is placed on the output side of the optical fiber unit 100, and the first lens unit 200 is located on the first mounting unit 200;

[0122] Step S102B2: The optical signal is transmitted to the optical fiber unit 100, and the optical fiber unit 100 outputs the optical signal to be transmitted to the first lens unit 300. Adjust the position of the first lens unit 300 relative to the first mounting unit 200 so that the optical power of the optical signal output by the first lens unit 300 reaches the maximum. At this time, obtain and maintain the position of the first lens unit 300 on the first mounting unit 200;

[0123] Step S102B3: The first lens unit 300 is mounted on the first mounting unit 200;

[0124] In some embodiments, the first lens unit 300 is located on the output side of the optical fiber unit 100 and placed on the first mounting unit 200. As the starting position for alignment, an optical signal is output through the optical fiber unit 100 and transmitted to the first lens unit 300. By adjusting the position of the first lens unit 300 relative to the first mounting unit 200 (including translation, etc.), the optical power of the output optical signal is monitored, and the position corresponding to the maximum optical power is found. After the position of maximum optical power is confirmed, the position of the first lens unit 300 is maintained to ensure the alignment of the optical path transmission. Then, the first lens unit 300 is mounted (e.g., glued) on the first mounting unit 200 to complete the installation of the first lens unit 300.

[0125] In the present invention application, optical power monitoring provides immediate feedback. Through the adjustment of maximizing the optical power, it is ensured that the first lens unit 300 is aligned with the output side of the optical fiber unit 100, minimizing optical signal loss, improving optical transmission efficiency, making full use of the optical power feedback mechanism, dynamically optimizing the position of the first lens unit, thereby achieving efficient optical signal coupling, and also appropriately reducing the dependence on complex imaging systems to adapt to changes in the characteristics of different optical fibers or lenses.

[0126] In some embodiments, the output of the first lens unit 300 can be connected to an optical power meter or other optical power detection devices to detect the optical power of the optical signal output by the first lens unit 300;

[0127] Step S103: Assemble the second mounting unit 400 and the first mounting unit 200;

[0128] In some embodiments, the second mounting unit 400 and the first mounting unit 200 can be assembled and combined through a detachable connection method (such as plugging, fastening, or locking and releasing, etc.) to ensure the physical stability and alignment of the second mounting unit 400 and the first mounting unit 200.

[0129] In the present invention application, the detachable connection allows the independent assembly and maintenance of the two units, facilitating the replacement or upgrade of individual components, reducing the overall maintenance cost. The assembly process inherits the precise positioning of the first lens unit 300 to ensure that the optical path continues to be aligned in the second mounting unit 400, reducing signal loss. The modular assembly simplifies the manufacturing process, supports pipeline production, improves production efficiency, and the assembly design supports different configurations of the second mounting unit 400 to adapt to various optical communication application scenarios.

[0130] Step S200: Mount the optical chip unit 600 on the substrate unit 700, position the second lens unit, and mount the second lens unit 500 on the optical chip unit 600;

[0131] Specifically, step S200 includes:

[0132] Step S201: The optical chip unit 600 is mounted on the substrate unit 700;

[0133] In some embodiments, step S201 includes: The optical chip unit 600 is mounted on the substrate unit 700 by adhesive bonding.

[0134] In the present invention application, adhesive bonding provides uniform adhesive force to ensure a stable connection between the optical chip unit 600 and the substrate unit 700.

[0135] Step S202: Locate the second lens unit. The second lens unit 500 is mounted on the optical chip unit 600. Locating the second lens unit 500 includes: Image-locating the second lens unit 500 or optically power-coupling-locating the second lens unit 500.

[0136] In some embodiments, for image-locating the second lens unit 500, where the second lens unit 500 is mounted on the optical chip unit 600, it includes:

[0137] Step S202A1: Place the second lens unit 500 on the optical chip unit 600 and capture an image of the second lens unit 500 on the optical chip unit 600; Based on the image of the second lens unit 500 on the optical chip unit 600, obtain the actual position of the second lens unit 500 on the optical chip unit 600;

[0138] Step S202A2: Based on the preset position of the second lens unit 500 on the optical chip unit 600 and the actual position of the second lens unit 500 on the optical chip unit 600, adjust the second lens unit 500 so that the second lens unit 500 is located at the preset position on the optical chip unit 600.

[0139] Step S202A3: Mount the second lens unit 500 on the optical chip unit 600.

[0140] In some embodiments, it is also possible to capture an image of the second lens unit 500 on the optical chip unit 600 to obtain its actual position, analyze the position deviation using image processing technology, compare the actual position of the second lens unit 600 with the preset position, dynamically adjust the position of the second lens unit 500 to ensure its alignment with the output side of the optical chip unit 600. After confirming that the position of the second lens unit 500 is accurate, fix the second lens unit 500 on the optical chip unit 600 to complete the installation of the second lens unit 500.

[0141] In some embodiments, for optically power-coupling-locating the second lens unit 500, where the second lens unit 500 is mounted on the optical chip unit 600, it includes:

[0142] Step S202B1: Place the second lens unit 500 on the optical chip unit 600;

[0143] Step S202B2: Power on the optical chip unit 600. The optical signal generated by the optical chip unit 600 is transmitted to the second lens unit 500. Adjust the position of the second lens unit 500 relative to the optical chip unit 600 so that the optical power of the optical signal output by the second lens unit 500 reaches the maximum. At this time, obtain and maintain the position of the second lens unit 500 relative to the optical chip unit 600.

[0144] Step S202B3: Mount the second lens unit 500 on the optical chip unit 600.

[0145] In the present invention application, the adjustment of maximizing the optical power ensures the best alignment between the second lens unit 500 and the optical chip unit 600, maximizes the optical signal output efficiency. The optical power monitoring provides instant feedback to support dynamic adjustment, realizes efficient optical signal coupling, adapts to changes in the output characteristics of the optical chip, reduces the dependence on the external imaging system, reduces the risk of optical path misalignment, and improves the long-term stability and performance consistency of the optical communication device.

[0146] In some embodiments, similarly, the output of the second lens unit 500 can be connected to an optical power meter or other optical power detection device to detect the optical power of the optical signal output by the second lens unit 500.

[0147] In some embodiments, the second lens unit 500 can be mounted on the optical chip unit 600 by glue bonding.

[0148] In the present invention application, step S200 provides two methods of image positioning and optical power coupling positioning. No matter which positioning method is adopted, it can align the optical paths of the second lens unit 500 and the optical chip unit 600. In practical applications, the optimal solution can be selected according to production conditions or application requirements to enhance adaptability.

[0149] Step S300: Locate the second lens unit 500 and the first lens unit 300. The second mounting unit 400 is mounted on the substrate unit 700. Along the height direction of the optical communication device, the optical chip unit 600, the second lens unit 500, and the first lens unit 300 are arranged in sequence.

[0150] Specifically, step S300 includes:

[0151] Step S301: Locating the second lens unit 500 and the first lens unit 300 includes: Along the height direction of the optical communication device, the second mounting unit 400 is spaced from the substrate unit 700, and image-locate the second lens unit 500, the first lens unit 300 or perform optical power coupling location on the second lens unit 500 and the first lens unit 300.

[0152] In some embodiments, along the height direction of the optical communication device, the second mounting unit 400 is spaced apart from the substrate unit 700. Image positioning the second lens unit 500 and the first lens unit 300 includes:

[0153] Step S301A1: Along the height direction of the optical communication device, the second mounting unit 400 is spaced apart from the substrate unit 700, and the second mounting unit 400 is located above the substrate unit 700;

[0154] Step S301A2: Take an image including the first lens unit 300 and the second lens unit 500, and obtain the actual positions of the first lens unit 300 and the second lens unit 500;

[0155] Step S301A3: According to the first preset position of the first lens unit 300, the second preset position of the second lens unit 500, the actual positions of the first lens unit 300 and the second lens unit 500, adjust the positions of the first lens unit 300 and / or the second lens unit 500 so that the first lens unit 300 and the second lens unit 500 are completely aligned along the height direction of the optical communication device, and the second mounting unit 400 is located above the substrate unit 700.

[0156] In some embodiments, a first mechanical mechanism (such as a robotic arm) can be connected to the second mounting unit, and the first mechanical mechanism can at least drive the second mounting unit to move in the X, Y, and Z directions; and / or, a second mechanical mechanism (such as a robotic arm) can be connected to the substrate unit 700, and the second mechanical mechanism can at least drive the substrate unit 700 to move in the X, Y, and Z directions.

[0157] In some embodiments, using the first mechanical mechanism and / or the second mechanism can keep the second mounting unit 400 spaced apart from the substrate unit 700 in the height direction, and the second mounting unit 400 is located above the substrate unit 700.

[0158] In some embodiments, an image including the first lens unit 300 and the second lens unit 500 can be taken, and the actual positions of the two in the X, Y, and Z directions can be analyzed; according to the deviation between the preset position and the actual position, the first lens unit 300 and / or the second lens unit 500 can be adjusted to make them completely aligned in the height direction, and then along the height direction of the optical communication device, optical signal transmission can be carried out.

[0159] In some embodiments, a high-resolution industrial camera can be used to capture images of the first lens unit 300 and the second lens unit 500. With the aid of image processing software (such as OpenCV), the actual positions of the first lens unit 300 and the second lens unit 500 are identified. The actual position of the first lens unit 300 may include: the center coordinates of the first lens unit 300 and / or the coordinates of multiple angular vertices, etc. The actual position of the second lens unit 500 may include: the center coordinates of the second lens unit and / or the coordinates of multiple angular vertices, etc. According to the first preset position of the first lens unit 300 and the second preset position of the second lens unit 500, the position of the first lens unit 300 is adjusted using the first mechanical mechanism and / or the position of the second lens unit 500 is adjusted using the second mechanical mechanism, ultimately achieving the complete alignment of the first lens unit 300 and the second lens unit 500 along the height direction of the optical communication device.

[0160] In this way, a vertical optical communication layout can be formed, ensuring a direct and efficient transmission path for optical signals from the optical fiber to the optical chip, reducing the loss of optical signals during transmission, and improving the efficiency and quality of signal transmission.

[0161] In some embodiments, along the height direction of the optical communication device, the second mounting unit 400 is spaced from the substrate unit 700. The optical power coupling and positioning of the second lens unit 500 and the first lens unit 300 include:

[0162] Step S301B1: Along the height direction of the optical communication device, the second mounting unit 400 is spaced from the substrate unit 700, and the second mounting unit 400 is located above the substrate unit 700;

[0163] Step S301B2: The optical chip unit 600 is powered on, and the optical signal generated by the optical chip unit 600 is transmitted to the second lens unit 500. The second lens unit 500 receives the optical signal and transmits it to the first lens unit 300. The first lens unit 300 receives the optical signal and transmits it to the optical fiber unit 100. The positions of the first lens unit 300 and / or the second lens unit 500 are adjusted such that the optical power of the optical signal output by the optical fiber unit 100 reaches the maximum. At this time, the positions of the second lens unit 500 and the first lens unit 300 are obtained and maintained, and the second mounting unit 400 is located above the substrate unit 700;

[0164] In some embodiments, similarly, the first mechanical mechanism and / or the second mechanism can be used to keep the second mounting unit 400 spaced from the substrate unit 700 in the height direction, and the second mounting unit 400 is located above the substrate unit 700.

[0165] In some embodiments, the optical chip unit 600 is powered on, and the optical signal is focused by the second lens unit 500 and then transmitted to the first lens unit 300, and then output to the optical fiber unit 100. The output power of the optical fiber unit 100 is monitored using an optical power meter, and the position of the first lens unit 300 is adjusted using the first mechanical mechanism and / or the position of the second lens unit 500 is adjusted using the second mechanical mechanism, until the output optical power reaches the maximum value. After the position of the maximum optical power is confirmed, at this time, the positions of the second lens unit 500 and the first lens unit 300 are recorded and maintained, and at this time, the second mounting unit 400 is located above the substrate unit 700.

[0166] In the present invention application, the adjustment of maximizing the optical power ensures the optical path alignment of the first lens unit 300 and the second lens unit 500 with the optical chip unit 600 and the optical fiber unit 100, maximizes the optical signal transmission efficiency, and the optical power feedback provides instant data to support the dynamic adjustment of the position of at least one of the two lens units, meeting the high-performance optical communication requirements and adapting to the characteristic changes of the optical chip or the optical fiber.

[0167] Step S302; the second mounting unit 400 is mounted on the substrate unit 700, and along the height direction of the optical communication device, the optical chip unit 600, the second lens unit 500, and the first lens unit 300 are arranged in sequence.

[0168] Specifically, step S302 includes: applying glue on the substrate unit 700, and along the height direction of the optical communication device, the second mounting unit 400 moves towards the substrate unit 700 or the substrate unit 700 moves towards the second mounting unit 400, and the second mounting unit 400 is mounted on the substrate unit 700 through the glue.

[0169] In the present invention application, first, the second mounting unit 400 is adhesively mounted on the substrate unit 700 through glue. The glue provides uniform adhesive force to ensure a stable connection between the two units, enhancing the overall mechanical stability of the optical communication device; in addition, after step S301 is completed, the optical chip unit 600, the second lens unit 500, and the first lens unit 300 are arranged in sequence along the height direction, forming an aligned straight optical path, reducing the scattering and loss in the optical signal transmission, ensuring efficient coupling and transmission. After applying glue on the substrate unit 700, only the second mounting unit 400 needs to move along the height direction of the optical communication device and be bonded to the substrate unit 700, without complex mechanical fasteners, simplifying the installation process, being suitable for automated production, and reducing the manufacturing complexity.

[0170] Optionally, the optical power coupling is positioned as the maximum optical power coupling; and / or, step S100 and step S200 can be carried out in sequence, or in reverse sequence, or simultaneously.

[0171] In some embodiments, the optical power coupling is positioned at the maximum optical power coupling position; step S100 and step S200 are carried out in sequence, or step S200 and step S100 are carried out in sequence, or step S100 and step S200 are carried out simultaneously.

[0172] In the present invention application, first, step S100 and step S200 can be completed separately without interference, the process division of labor and cooperation is clear, the execution order of step S100 and step S200 can be flexibly adjusted according to the production process, equipment availability or personnel arrangement, can adapt to different manufacturing environments and production requirements, allows step S100 and S200 to be executed simultaneously, shortens the total assembly time through parallel operation, improves production efficiency, is suitable for large-scale manufacturing, and the independence of step S100 and step S200 reflects the modular design of the optical communication device; in addition, the flexibility of the order of step S100 and step S200 can avoid the risk of affecting the overall progress due to the delay of a certain step. For example, if the equipment required for S100 fails temporarily, S200 can be preferentially executed to optimize resource utilization. Each step can be completed independently and quality inspected to ensure that they all meet the design requirements and quality standards before step S300, reducing subsequent rework or unqualified rate.

[0173] Optionally, in step S300, after the first installation unit and the second installation unit are connected, the positioning portion of the first installation unit cooperates with the positioning cavity of the second installation unit. Along the height direction of the optical communication device, the height of the second installation unit is H, the height of the optical chip unit is L1, and the height of the second lens unit is L2, satisfying: L1 + L2 ≤ H.

[0174] In the present invention application, the technical problems, technical solutions, and technical effects of L1 + L2 ≤ H are exactly the same as those of L1 + L2 ≤ H1 + H2, H1 + H2 = H recorded in the first aspect, and the present invention application will not elaborate on this again.

[0175] In the method for preparing an optical communication device of the present invention application, the method for preparing the optical communication device can be divided into two independent steps (step S100 and step S200) for production and then assembly, which is convenient for subsequent assembly, maintenance, upgrade or replacement of the optical communication device, reduces the overall assembly and maintenance difficulty and cost of the CPO module. Step S300 positions the second lens unit and the first lens unit, so that the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence along the height direction, realizing the alignment and coupling of the optical path, reducing the signal loss of optical communication, improving the optical transmission efficiency. The modular design and flexible step order support parallel operation, shortening the total assembly time of the optical communication device, being suitable for large-scale production, and meeting the requirements of different application scenarios (such as data centers or AI computing power modules).

[0176] The technical features of the above embodiments can be combined arbitrarily. For the sake of brevity of description, not all possible combinations of the technical features in the above embodiments are described. However, as long as there is no contradiction in the combination of these technical features, it should be considered as the scope recorded in this specification;

[0177] Those skilled in the art of the present technology can understand that the various operations, methods, steps, measures, and solutions in the processes discussed in the present invention application can be alternated, changed, combined, or deleted; further, other steps, measures, and solutions in the various operations, methods, and processes discussed in the present invention application can also be alternated, changed, rearranged, decomposed, combined, or deleted; further, those in the prior art that have steps, measures, and solutions in the various operations, methods, and processes disclosed in the present invention application can also be alternated, changed, rearranged, decomposed, combined, or deleted;

[0178] The above-described embodiments merely represent several implementation manners of the embodiments of the present disclosure. The description thereof is relatively specific and detailed, but it should not be construed as a limitation on the scope of the patents of the embodiments of the present disclosure; it should be noted that for those of ordinary skill in the art, without departing from the concept of the embodiments of the present disclosure, several deformations and improvements can still be made, and these all belong to the protection scope of the embodiments of the present disclosure; therefore, the protection scope of the embodiments of the present disclosure should be subject to the appended claims.

Claims

1. An optical communication device, characterized in that, Comprising: Optical fiber unit, first mounting unit, first lens unit, second mounting unit, second lens unit, optical chip unit, substrate unit; The optical fiber unit is mounted on the first mounting unit; The first lens unit is mounted on the first mounting unit, and the first lens unit is located on the output side of the optical fiber unit; The first mounting unit and the second mounting unit are detachably connected; The second lens unit is mounted on the optical chip unit; The optical chip unit is mounted on the substrate unit; The second mounting unit is mounted on the substrate unit; Along the height direction of the optical communication device, the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence.

2. The optical communication device according to claim 1, characterized in that, The optical fiber unit includes multiple optical fibers; the first mounting unit includes a first positioning portion and a protruding portion; the first positioning portion positions the end of the outermost optical fiber of the optical fiber unit; a protruding portion is formed on the side wall of the first mounting unit, and the first positioning portion is connected to the protruding portion.

3. The optical communication device according to claim 2, characterized in that, Each optical fiber includes a bare fiber portion and a cladding portion. The first mounting unit is recessed to form a first side wall and a second side wall. There are two first positioning portions and two protruding portions; The left first positioning portion contacts the end of the bare fiber portion of the left outermost optical fiber to position the left outermost optical fiber. A left protruding portion is formed on the first side wall, and the left protruding portion is connected to the left first positioning portion; The right first positioning portion contacts the end of the bare fiber portion of the right outermost optical fiber to position the right outermost optical fiber. A right protruding portion is formed on the second side wall, and the right protruding portion is connected to the right first positioning portion.

4. The optical communication device according to claim 2, characterized in that, The first mounting unit further includes a positioning portion, and the second mounting unit includes a positioning cavity. The positioning portion cooperates with the positioning cavity; and / or, along the height direction of the optical communication device, the first mounting unit is located above the second mounting unit.

5. An optical communication device according to claim 4, characterized in that The first mounting unit further includes a first transmission hole; along the height direction of the optical communication device, the first transmission hole penetrates through the first mounting unit, and the first lens unit is mounted above the first transmission hole; the second mounting unit further includes a second transmission hole; along the height direction of the optical communication device, the second transmission hole penetrates through the second mounting unit, and the second lens unit is located in the second transmission hole; Along the height direction of the optical communication device, the height of the positioning cavity is H1, the height of the second transmission hole is H2, the height of the second mounting unit is H, the height of the optical chip unit is L1, and the height of the second lens unit is L2, satisfying: L1 + L2 ≤ H1 + H2, H1 + H2 = H.

6. The optical communication device according to claim 2, characterized in that, The first mounting unit is provided with a mounting post, and the second mounting unit is provided with a mounting hole. The mounting post is inserted into the mounting hole; and / or, the first mounting unit is provided with a mounting hole, and the second mounting unit is provided with a mounting post. The mounting post is inserted into the mounting hole.

7. An optical communication device according to claim 2, characterized in that, Each optical fiber includes a bare fiber portion and a cladding portion. The first mounting unit includes a support portion and a second positioning portion. The second positioning portion is provided with multiple positioning grooves; the support portion supports the cladding portion, and the positioning grooves position the bare fiber portion; and / or, the first mounting unit is an injection molded part; and / or, the second mounting unit is an injection molded part; and / or, the first lens unit is made of an injection molded part or a glass lens; and / or, the second lens unit is made of a silicon lens or glass; and / or, the first mounting unit and the first lens unit are integrally formed.

8. A method for preparing an optical communication device, which uses an optical communication device according to any one of the above claims 1-7, characterized in that, Including: Step S100: The optical fiber unit is mounted on the first mounting unit; The first lens unit is mounted on the first mounting unit, and the first lens unit is located on the output side of the optical fiber unit; the second mounting unit is assembled with the first mounting unit; Step S200: The optical chip unit is mounted on the substrate unit, the second lens unit is positioned, and the second lens unit is mounted on the optical chip unit; Step S300: Position the second lens unit and the first lens unit; the second mounting unit is mounted on the substrate unit, and along the height direction of the optical communication device, the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence; Step S100 and Step S200 are carried out in sequence or in reverse sequence or simultaneously.

9. A method for manufacturing an optical communication device according to claim 8, wherein Step S100 includes: Step S101: The optical fiber unit is mounted on the first mounting unit; Step S102: The first lens unit is located on the output side of the optical fiber unit, the first lens unit is placed on the first mounting unit, the first lens unit is positioned, and the first lens unit is mounted on the first mounting unit. Positioning the first lens unit includes: image positioning the first lens unit or optical power coupling positioning the first lens unit; Step S103: The second mounting unit is assembled with the first mounting unit; And / or, Step S200 includes: Step S201: The optical chip unit is mounted on the substrate unit; Step S202: Position the second lens unit, and the second lens unit is mounted on the optical chip unit. Positioning the second lens unit includes: image positioning the second lens unit or optical power coupling positioning the second lens unit; And / or, Step S300 includes: Step S301: Positioning the second lens unit and the first lens unit includes: along the height direction of the optical communication device, the second mounting unit is spaced from the substrate unit, and the second lens unit and the first lens unit are image positioned or the second lens unit and the first lens unit are optical power coupled positioned; Step S302; The second mounting unit is mounted on the substrate unit, and along the height direction of the optical communication device, the optical chip unit, the second lens unit, and the first lens unit are arranged in sequence.

10. A method for preparing an optical communication device according to claim 9, characterized in that, The optical power coupling positioning is the maximum optical power coupling positioning; and / or, in Step S300, after the first mounting unit and the second mounting unit are connected, along the height direction of the optical communication device, the height of the second mounting unit is H, the height of the optical chip unit is L1, and the height of the second lens unit is L2, satisfying: L1 + L2 ≤ H.

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