Light emitting device and projection system

Abstract

The invention provides a light-emitting device and a projection system, and relates to the technical field of projection. The light-emitting device comprises: a housing having a sealed internal cavity; the light-transmitting piece is connected with the shell in a sealed mode, and part of the cavity wall of the inner cavity is located on the light-transmitting piece; the light-emitting part is located in the inner cavity; the conductive part penetrates through the shell, the first end of the conductive part is located on the outer side of the shell, and the second end of the conductive part is located in the inner cavity and used for being electrically connected with the light-emitting part; laser emitted by the light-emitting part is configured to be emitted to the outer side of the shell through the light-transmitting part; the conductive piece is a non-magnetic metal piece. According to the light-emitting device and the projection system, noise generated in the working process of the light-emitting device can be obviously relieved or even eliminated, and the use experience of a user is improved.

Description

Technical Field

[0001] The present application relates to the field of projection technology, and in particular, to a light-emitting device and a projection system. Background Art

[0002] Lasers can meet the high-efficiency and wide-color gamut picture quality requirements needed for laser TVs, projectors, and smart projectors. As the carrier of laser semiconductor chips, lasers are important tools for laser practical applications. A power supply can input pulsed current to the laser, so that the light-emitting element of the laser emits laser light; due to the input of pulsed current, the laser will generate noise during operation.

[0003] In the prior art, generally, noise-reducing foam is arranged around the laser, and the noise-reducing foam is used to absorb and isolate noise, thereby reducing the noise emitted by the laser.

[0004] However, the noise reduction effect of the noise reduction method in the prior art is limited, and the noise will affect the user experience. Summary of the Invention

[0005] In view of the above problems, the present application provides a light-emitting device and a projection system, which can significantly alleviate or even eliminate the noise generated during the operation of the light-emitting device, and improve the user experience.

[0006] To achieve the above object, the present application provides the following technical solutions:

[0007] The first aspect of the present application provides a light-emitting device, including:

[0008] A housing having a sealed internal cavity;

[0009] A light-transmitting member hermetically connected to the housing, with part of the cavity wall of the internal cavity located on the light-transmitting member;

[0010] A light-emitting member located in the internal cavity;

[0011] A conductive member passing through the housing, with the first end of the conductive member located outside the housing and the second end of the conductive member located in the internal cavity and used for electrically connecting to the light-emitting member; the laser light emitted by the light-emitting member is configured to be emitted to the outside of the housing through the light-transmitting member; the conductive member is a non-magnetic metal member.

[0012] The beneficial effect of the present application is that when the power supply member delivers pulsed current to the light-emitting member through the conductive member, since the conductive member is a non-magnetic metal member, thus, the pulsed current will not cause magnetostriction phenomenon in the conductive member, and no noise will be generated on the conductive member due to the magnetostriction phenomenon; thus, the light-emitting device provided by the present application can significantly alleviate or even eliminate the noise generated during the operation of the light-emitting device, and improve the user experience.

[0013] In a possible implementation, the conductive member is a non-magnetic single-metal wire. In this way, the single-metal wire is easy to obtain and can reduce the manufacturing cost of the light-emitting device.

[0014] In a possible implementation, the conductive member includes a first non-magnetic metal layer and a second non-magnetic metal layer made of different materials, and the second non-magnetic metal layer is wrapped around the outside of the first non-magnetic metal layer.

[0015] In this way, the conductive member becomes a composite material member, and the conductive member can simultaneously have the properties of two non-magnetic metal materials, thereby expanding the applicable scenarios of the conductive member.

[0016] In a possible implementation, the anti-bending strength of the first non-magnetic metal layer is greater than that of the second non-magnetic metal layer, and the conductivity of the first non-magnetic metal layer is less than that of the second non-magnetic metal layer.

[0017] In this way, through the mutual cooperation of the two non-magnetic metal materials, the conductive member can simultaneously have good anti-bending properties and conductivity.

[0018] In a possible implementation, the thermal expansion coefficient of the first non-magnetic metal layer is greater than that of the second non-magnetic metal layer.

[0019] In this way, when the conductive member expands due to heat, the first non-magnetic metal layer can squeeze the second non-magnetic metal layer, and no gap will be generated between them, ensuring the sealing of the internal cavity of the housing.

[0020] In a possible implementation, the light-emitting device further includes a sealing member; a through hole is provided on the housing, and the through hole penetrates the housing along the thickness direction of the housing and communicates with the internal cavity; the conductive member passes through the through hole, and the sealing member is filled in the gap between the conductive member and the hole wall of the through hole.

[0021] In this way, the sealing of the internal cavity is improved, and the light-emitting member can work stably in the closed cavity.

[0022] In a possible implementation, the sealing member includes an insulating layer and a buffer layer, and the insulating layer and the buffer layer are connected along the radial direction of the through hole; the absolute value of the difference between the thermal expansion coefficient of the insulating layer and the thermal expansion coefficient of the buffer layer is less than a set value.

[0023] In this way, the existence of the buffer layer can alleviate the phenomenon of insulation layer rupture caused by the inconsistent thermal expansion coefficients of the insulating layer and the conductive member or the housing, ensuring the sealing of the internal cavity.

[0024] In a possible implementation, when each of the insulating layer and the buffer layer has one layer, the buffer layer is disposed between the insulating layer and the conductive member, or the buffer layer is disposed between the insulating layer and the hole wall;

[0025] When the total number of insulating layers and buffer layers is greater than two, the insulating layers and buffer layers are alternately arranged in sequence along the radial direction of the through hole.

[0026] In this way, the alternately arranged insulating layers and buffer layers can better absorb the stress from the conductive member or the housing.

[0027] In a possible implementation, the absolute value of the difference between the coefficient of thermal expansion of the housing near the through hole and the coefficient of thermal expansion of the insulating layer is less than a set value; and / or, the absolute value of the difference between the coefficient of thermal expansion of the conductive member and the coefficient of thermal expansion of the insulating layer is less than a set value.

[0028] In this way, when the housing and the insulating layer expand thermally, the stress exerted by the housing on the insulating layer can be reduced; when the conductive member and the insulating layer expand thermally, the stress exerted by the conductive member on the insulating layer can be reduced.

[0029] In a possible implementation, the housing includes a bottom plate and a side plate connected to each other, the light-emitting component is mounted on the bottom plate, and the through hole is provided on the side plate;

[0030] The side plate is a kovar metal part, and the buffer layer is a kovar metal layer.

[0031] In this way, the coefficients of thermal expansion between the side plate and the sealant are close to each other, thereby reducing the stress exerted by the housing on the insulating layer during the thermal expansion process.

[0032] The second aspect of the present application provides a light-emitting device, including:

[0033] A housing for providing a sealed internal cavity;

[0034] A light-transmitting member for sealingly connecting with the housing so that part of the cavity wall of the internal cavity is located on the light-transmitting member;

[0035] A light-emitting component for being placed in the internal cavity;

[0036] A conductive member for passing through the housing, the first end of the conductive member is for being placed outside the housing, and the second end of the conductive member is for being placed in the internal cavity and for electrically connecting with the light-emitting component; the laser emitted by the light-emitting component is configured to be emitted to the outside of the housing through the light-transmitting member; the conductive member is a non-magnetic metal part for eliminating the noise generated when a pulsed current flows through a magnetic metal.

[0037] The third aspect of the present application provides a projection system, including a projection screen and the light-emitting device in any one of the above implementation manners, and the light-emitting device is used for projecting a projection image onto the projection screen.

[0038] The present application provides a light-emitting device and a projection system. The projection system includes a projection screen and the light-emitting device, and the light-emitting device is configured to project a projection image onto the projection screen. Among them, the light-emitting device includes: a housing having a sealed internal cavity; a light-transmitting member hermetically connected to the housing, with a part of the cavity wall of the internal cavity located on the light-transmitting member; a light-emitting member located in the internal cavity; a conductive member passing through the housing, with the first end of the conductive member located outside the housing and the second end of the conductive member located in the internal cavity and configured to be electrically connected to the light-emitting member; the laser emitted by the light-emitting member is configured to be emitted to the outside of the housing through the light-transmitting member; and the conductive member is a non-magnetic metal member.

[0039] Therefore, in the light-emitting device and the projection system provided by the present application, when the power supply member delivers a pulsed current to the light-emitting member through the conductive member, since the conductive member is a non-magnetic metal member, the pulsed current will not cause magnetostriction in the conductive member, and no noise will be generated on the conductive member due to magnetostriction. Therefore, the light-emitting device provided by the present application can significantly alleviate or even eliminate the noise generated during the operation of the light-emitting device, improving the user experience. In addition, the presence of the buffer layer can alleviate the phenomenon of insulation layer rupture caused by the inconsistent thermal expansion coefficients of the insulation layer and the conductive member or the housing, ensuring the sealing of the internal cavity in the housing.

[0040] The structure of the present application and its other inventive purposes and beneficial effects will become more clearly understandable through the description of the specific embodiments in conjunction with the accompanying drawings. BRIEF DESCRIPTION OF THE DRAWINGS

[0041] In order to more clearly illustrate the technical solutions in the embodiments of the present application or the prior art, the following will briefly introduce the drawings required for use in the description of the embodiments or the prior art. Obviously, the following drawings are some embodiments of the present application. For those of ordinary skill in the art, other drawings can be obtained based on these drawings without creative efforts.

[0042] Figure 1 A perspective view of the light-emitting device provided by the embodiment of the present application after removing the light-transmitting member;

[0043] Figure 2 A top view of the light-emitting device provided by the embodiment of the present application after removing the light-transmitting member;

[0044] Figure 3 A left view of the light-emitting device provided by the embodiment of the present application after removing the light-transmitting member;

[0045] Figure 4 For Figure 3 The view after the conductive member in is electrically connected to the power supply member;

[0046] Figure 5 ForFigure 2 Cross-sectional view at A-A in [the figure];

[0047] Figure 6 is Figure 5 The first enlarged view at B in [the figure];

[0048] Figure 7 is Figure 5 The second enlarged view at B in [the figure];

[0049] Figure 8 is Figure 5 The third enlarged view at B in [the figure];

[0050] Figure 9 is Figure 5 The fourth enlarged view at B in [the figure];

[0051] Figure 10 is Figure 5 The fifth enlarged view at B in [the figure];

[0052] Figure 11 is Figure 1 Stereogram after installing the light-transmitting member;

[0053] Figure 12 is Figure 5 Cross-sectional view after installing the light-transmitting member.

[0054] Explanation of reference numerals:

[0055] 100 - Power supply component; 200 - Light-emitting component;

[0056] 300 - Housing; 310 - Internal cavity;

[0057] 320 - Bottom plate; 330 - Side plate;

[0058] 340 - Through hole; 400 - Conductive component;

[0059] 500 - Sealing component; 510 - Insulating layer;

[0060] 520 - Buffer layer; 600 - Wire;

[0061] 700 - Light-transmitting member. Detailed implementation manners

[0062] To make the purpose, implementation manners and advantages of this application clearer, the following will clearly and completely describe the exemplary implementation manners of this application with reference to the drawings in the exemplary embodiments of this application. Obviously, the described exemplary embodiments are only a part of the embodiments of this application, rather than all of the embodiments.

[0063] It should be noted that the brief description of the terms in this application is only for the convenience of understanding the following-described embodiments, rather than intending to limit the embodiments of this application. Unless otherwise specified, these terms should be understood in their ordinary and general meanings.

[0064] In addition, the terms "comprising" and "having" and any variations thereof are intended to cover but not exclusively include. For example, a product or device comprising a series of components does not necessarily have to be limited to those components clearly listed, but may include other components not clearly listed or inherent to these products or devices.

[0065] In the description of this application, it should be understood that the orientation or positional relationship indicated by the terms "center", "upper", "lower", "front", "rear", "left", "right", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings, and is only for the convenience of describing this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus should not be construed as a limitation to this application.

[0066] The terms "first" and "second" are only used for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of this application, unless otherwise specified, the meaning of "a plurality" is two or more.

[0067] In the description of this application, it should be noted that unless otherwise clearly specified and defined, the terms "installed", "connected", and "coupled" should be understood in a broad sense. For example, it may be a fixed connection, a detachable connection, or an integral connection; it may be a mechanical connection or an electrical connection; it may be directly connected or indirectly connected through an intermediate medium, and it may be the communication inside two elements. For those of ordinary skill in the art, the specific meanings of the above terms in this application can be understood according to specific circumstances.

[0068] Next, the technical solutions in the embodiments of this application will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of this application. Obviously, the described embodiments are only a part of the embodiments of this application, rather than all the embodiments. All other embodiments obtained by those of ordinary skill in the art based on the embodiments in this application without creative efforts belong to the scope of protection of this application.

[0069] When a laser power supply inputs a pulsed current to a laser, it will cause noise generated during the operation of the laser. In the prior art, by arranging noise reduction foam around the laser and using the noise reduction foam to absorb and isolate the noise. However, the noise reduction effect of the noise reduction foam is limited, and the noise will affect the user experience. The applicant of this application found through experiments that the noise is mainly generated by the magnetic metal leads on the laser. When the laser power supply inputs a pulsed current to the laser through the magnetic metal leads, the pulsed current will flow through the magnetic metal leads, resulting in the magnetostrictive phenomenon of the magnetic metal leads. The magnetostrictive phenomenon causes the magnetic metal leads to generate noise.

[0070] Based on the above problems, this application provides a light-emitting device and a projection system. The light-emitting device includes: a housing having a sealed internal cavity; a light-transmitting member sealingly connected to the housing, with part of the cavity wall of the internal cavity located on the light-transmitting member; a light-emitting member located in the internal cavity; a conductive member passing through the housing, with the first end of the conductive member located outside the housing and the second end of the conductive member located in the internal cavity and used for electrically connecting to the light-emitting member; the laser emitted by the light-emitting member is configured to be emitted to the outside of the housing through the light-transmitting member; the conductive member is a non-magnetic metal member. Thus, when the power supply member conveys a pulsed current to the light-emitting member through the conductive member, since the conductive member is a non-magnetic metal member, the pulsed current will not cause the magnetostrictive phenomenon in the conductive member, and the conductive member will not generate noise due to the magnetostrictive phenomenon. Thus, the light-emitting device and the projection system provided by this application can significantly alleviate or even eliminate the noise generated during the operation of the light-emitting device, improving the user experience.

[0071] The following will combine Figures 1 to 12 to describe in detail the structure of the light-emitting device provided in the embodiments of this application.

[0072] As Figure 1 、 Figure 2 、 Figure 11 and Figure 12 shown, the light-emitting device provided by this application includes:

[0073] A housing 300 having a sealed internal cavity 310, and the internal cavity 310 serves to accommodate other electronic components.

[0074] A light-transmitting member 700 sealingly connected to the housing 300, with part of the cavity wall of the internal cavity 310 located on the light-transmitting member 700. The light-transmitting member 700 can play a role in blocking, ensuring the sealing of the internal cavity 310 while also playing a role in light transmission. The material of the light-transmitting member 700 can be optical glass, crystal, sapphire, etc. with high light-transmitting performance; the light-transmitting member 700 can be a plate-like component, or the light-transmitting member 700 can be a lens with a light-concentrating function.

[0075] A light-emitting component 200 is located in an internal cavity 310; the housing 300 can function to accommodate and protect the light-emitting component 200. Specifically, the light-emitting component 200 can be a light-emitting chip, and the light-emitting component 200 can emit laser light.

[0076] A conductive component 400 passes through the housing 300. The first end of the conductive component 400 is located outside the housing 300, and the second end of the conductive component 400 is located in the internal cavity 310 and is electrically connected to the light-emitting component 200; the laser light emitted by the light-emitting component 200 is configured to be emitted to the outside of the housing 300 through a light-transmitting component 700; the conductive component 400 is a non-magnetic metal component. As Figure 3 and Figure 4 shown, a power supply component 100 is located outside the housing 300. The first end of the conductive component 400 can be electrically connected to the power supply component 100, and the power supply component 100 delivers pulsed current to the light-emitting component 200 through the conductive component 400. Thus, when the power supply component 100 delivers pulsed current to the light-emitting component 200 through the conductive component 400, the light-emitting component 200 can emit laser light. It should be noted that the light-emitting device can be a laser. The housing 300, the light-emitting component 200, and the conductive component 400 are all components of the laser. The conductive component 400 is a lead on the laser. There can be multiple light-emitting components 200, and the multiple light-emitting components 200 are connected by a wire 600.

[0077] Thus, when the power supply component 100 delivers pulsed current to the light-emitting component 200 through the conductive component 400, since the conductive component 400 is a non-magnetic metal component, the pulsed current will not cause magnetostriction in the conductive component 400, and no noise will be generated on the conductive component 400 due to magnetostriction; thus, the light-emitting device provided in this application can significantly alleviate or even eliminate the noise generated during the operation of the light-emitting device, improving the user experience.

[0078] In addition, after testing, it is obtained that: after the conductive component 400 uses a non-magnetic metal material, the noise is reduced by 1.2 dB compared with before improvement, and the number and peak value of harmonics above 1 KHZ, which affect the user's subjective experience in the noise, are significantly reduced. It should be noted that when the light-emitting device is a laser, in addition to the conductive component 400 on the laser, there may be other electronic components generating noise; if these electronic components exist, then after the conductive component 400 uses a non-magnetic metal material, the laser will still generate noise, but the noise generated by the laser can be significantly alleviated; if these electronic components do not exist, the noise of the laser will be completely eliminated after the conductive component 400 uses a non-magnetic metal material.

[0079] Specifically, the conductive member 400 includes a first non-magnetic metal layer and a second non-magnetic metal layer made of different materials, and the second non-magnetic metal layer wraps around the outside of the first non-magnetic metal layer. With this arrangement, after the first non-magnetic metal layer and the second non-magnetic metal layer are connected to each other, the conductive member 400 becomes a composite material member, and the conductive member 400 can simultaneously have different properties of two non-magnetic metal materials, thereby expanding the applicable scenarios of the conductive member 400. Specifically, the conductive member 400 is a lead wire, the first non-magnetic metal layer is the inner core of the lead wire, and the second non-magnetic metal layer is arranged to wrap the inner core.

[0080] Exemplarily, the anti-bending strength of the first non-magnetic metal layer is greater than that of the second non-magnetic metal layer, and the conductivity of the first non-magnetic metal layer is less than that of the second non-magnetic metal layer; the first non-magnetic metal layer can ensure the anti-bending performance of the conductive member 400, and the second non-magnetic metal layer can ensure the conductive performance of the conductive member 400. With this arrangement, through the mutual cooperation of the two non-magnetic metal materials, the conductive member 400 can simultaneously have good anti-bending property and conductivity. Specifically, the first non-magnetic metal layer can be made of copper, and the second non-magnetic metal layer can be made of silver; or, the first non-magnetic metal layer can be made of aluminum, and the second non-magnetic metal layer can be made of copper. It should be noted that the anti-bending strength can be used to measure the stress-bearing ability and durability of material bending, and the conductivity can be used to measure the conductive performance of the material.

[0081] Exemplarily, the coefficient of thermal expansion of the first non-magnetic metal layer is greater than that of the second non-magnetic metal layer. Since one end of the conductive member 400 passes through the housing 300 and enters the internal cavity 310, when the conductive member 400 expands due to heat, the first non-magnetic metal layer can expand to a greater extent and squeeze the second non-magnetic metal layer, and there will be no gap between the first non-magnetic metal layer and the second non-magnetic metal layer, thereby ensuring the sealing performance of the internal cavity 310 of the housing 300.

[0082] In addition, the conductive member 400 can also be a non-magnetic single-metal wire; for example, single-metal wires such as copper, silver, and aluminum; the single-metal wire is easy to obtain and can reduce the manufacturing cost of the light-emitting device.

[0083] In the embodiment of the present application, as Figures 5 to 10As shown, the light-emitting device further includes a seal 500; a through-hole 340 is provided on the housing 300, and the through-hole 340 penetrates the housing 300 along the thickness direction of the housing 300 and communicates with the internal cavity 310; the conductive member 400 passes through the through-hole 340, and the seal 500 is filled in the gap between the conductive member 400 and the hole wall of the through-hole 340. The presence of the seal 500 prevents the internal cavity 310 of the housing 300 from communicating with the outside of the housing 300. With such a setting, the sealing performance of the internal cavity 310 is improved, and the light-emitting member 200 can operate stably in the closed cavity. In a specific embodiment, as Figure 6 shown, the seal 500 fills all the gaps in the through-hole 340 to ensure the reliability of the seal; or, as Figure 10 shown, the seal 500 fills part of the gaps in the through-hole 340.

[0084] Specifically, as Figures 6 to 10 shown, the seal 500 includes an insulating layer 510 and a buffer layer 520, and the insulating layer 510 and the buffer layer 520 are connected along the radial direction of the through-hole 340; the absolute value of the difference between the thermal expansion coefficient of the insulating layer 510 and the thermal expansion coefficient of the buffer layer 520 is less than a set value. The insulating layer 510 can play an insulating role to prevent electrical connection between the conductive member 400 and the housing 300. Specifically, the buffer layer 520 can be a kovar metal layer, and the insulating layer 510 can be a glass insulating layer 510 or a ceramic insulating layer 510. The insulating layer 510, the buffer layer 520, and the conductive member 400 can be connected together by sintering.

[0085] It should be noted that the thermal expansion coefficient of the insulating material in the insulating layer 510 is generally less than the thermal expansion coefficient of the non-magnetic metal in the conductive member 400. Therefore, when the conductive member 400 undergoes thermal expansion, the conductive member 400 will apply stress to the insulating layer 510 and cause the insulating layer 510 to rupture, thereby affecting the sealing performance of the internal cavity 310; in addition, due to the difference in thermal expansion coefficient between the housing 300 and the insulating layer 510, the housing 300 may also apply stress to the insulating layer 510 and cause the insulating layer 510 to rupture.

[0086] Since the thermal expansion coefficients of the insulating layer 510 and the buffer layer 520 are close to each other, their expansion degrees are the same when they undergo thermal expansion; the buffer layer 520 can absorb part of the stress applied by the conductive member 400 or the housing 300 to the insulating layer 510, avoiding the phenomenon that the stress on the insulating layer 510 is too large and causing rupture. Therefore, the presence of the buffer layer 520 can alleviate the phenomenon of insulation layer rupture caused by the inconsistent thermal expansion coefficients of the insulating layer 510 and the conductive member 400 or the housing 300, and ensure the sealing performance of the internal cavity 310.

[0087] Exemplarily, when the insulating layer 510 and the buffer layer 520 each have one layer, as Figure 6 shown, the buffer layer 520 can be disposed between the insulating layer 510 and the conductive member 400. At this time, the buffer layer 520 can better alleviate the phenomenon of insulation layer rupture caused by the inconsistent thermal expansion coefficients of the insulating layer 510 and the conductive member 400; or, as Figure 7 shown, the buffer layer 520 is disposed between the insulating layer 510 and the hole wall. At this time, the buffer layer 520 can better alleviate the phenomenon of insulation layer rupture caused by the inconsistent thermal expansion coefficients of the insulating layer 510 and the housing 300.

[0088] Exemplarily, as Figure 8 and Figure 9 shown, when the total number of layers of the insulating layer 510 and the buffer layer 520 is greater than two, the insulating layer 510 and the buffer layer 520 are alternately arranged in sequence along the radial direction of the through hole 340. With such an arrangement, the alternately arranged insulating layer 510 and buffer layer 520 can better absorb the stress from the conductive member 400 or the housing 300, and the stress is dispersed in different insulating layers 510 and buffer layers 520, further avoiding the occurrence of the insulation layer rupture phenomenon.

[0089] In a specific embodiment, the absolute value of the difference between the thermal expansion coefficient of the housing 300 near the through hole 340 and the thermal expansion coefficient of the insulating layer 510 is less than a set value; thereby, when the housing 300 and the insulating layer 510 undergo thermal expansion, since the thermal expansion coefficients of the two are close, the stress exerted by the housing 300 on the insulating layer 510 can be reduced.

[0090] In a specific embodiment, the absolute value of the difference between the thermal expansion coefficient of the conductive member 400 and the thermal expansion coefficient of the insulating layer 510 is less than a set value. When the conductive member 400 and the insulating layer 510 undergo thermal expansion, since the thermal expansion coefficients of the two are close, the stress exerted by the conductive member 400 on the insulating layer 510 can be reduced.

[0091] It should be noted that the above set value can be determined according to actual requirements. When the sealing requirement of the housing 300 is high, a smaller set value can be selected; when the sealing requirement of the housing 300 is low, a larger set value can be selected.

[0092] Specifically, as Figure 5 shown, the housing 300 includes a bottom plate 320 and a side plate 330 that are connected to each other. The light-emitting member 200 is mounted on the bottom plate 320, and the through hole 340 is provided on the side plate 330; the side plate 330 is a kovar metal part, the buffer layer 520 is a kovar metal layer, and the materials of the side plate 330 and the buffer layer 520 are the same; thereby, the thermal expansion coefficients between the side plate 330 and the seal 500 are close, thereby reducing the stress exerted by the housing 300 on the insulating layer 510 during the thermal expansion process. AsFigure 11 and Figure 12 As shown in Figure 12 , the light-transmitting member 700 is connected to one end of the side plate 330 facing away from the bottom plate 320, and the light-transmitting member 700 can block the plate edge of the side plate 330; the bottom plate 320, the side plate 330, and the light-transmitting member 700 cooperate with each other to enclose a sealed internal cavity 310; and the laser emitted by the light-emitting member 200 can pass through the light-transmitting member 700 and be emitted to the outside of the housing 300.

[0093] Based on the above embodiments, the present application further provides a projection system, including a projection screen and the light-emitting device in any one of the above implementation manners, and the light-emitting device is used to project a projection image onto the projection screen. Among them, the specific structure, working principle, and function of the light-emitting device have been described in detail in the foregoing Embodiment 1, and will not be elaborated here.

[0094] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, and not to limit them; although the present application has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some or all of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the scope of the technical solutions of the embodiments of the present application.

[0095] For the sake of explanation, the above description has been made in conjunction with specific implementation manners. However, the above exemplary discussion is not intended to be exhaustive or to limit the implementation manners to the specific forms disclosed above. According to the above teachings, various modifications and variations can be obtained. The selection and description of the above implementation manners are for better explaining the principles and actual applications, so that those skilled in the art can better use the implementation manners and various different variations of the implementation manners suitable for specific use considerations.

Claims

1. A light-emitting device, characterized in that, Comprising: A housing having a sealed internal cavity; A light transmissive member sealingly connected to the housing, with a portion of the cavity wall of the internal cavity located on the light transmissive member; A light emitting member located in the internal cavity; A conductive member passing through the housing, with a first end of the conductive member located outside the housing and a second end of the conductive member located in the internal cavity and configured to be electrically connected to the light emitting member; the laser light emitted by the light emitting member is configured to be emitted to the outside of the housing through the light transmissive member; the conductive member is a non-magnetic metal member.

2. The light-emitting device according to claim 1, wherein The conductive member is a non-magnetic single metal wire.

3. The light-emitting device according to claim 1, wherein The conductive member includes a first non-magnetic metal layer and a second non-magnetic metal layer of different materials, and the second non-magnetic metal layer is wrapped around the outside of the first non-magnetic metal layer.

4. The light-emitting device according to claim 3, wherein The anti-bending strength of the first non-magnetic metal layer is greater than that of the second non-magnetic metal layer, and the conductivity of the first non-magnetic metal layer is less than that of the second non-magnetic metal layer; And / or, the coefficient of thermal expansion of the first non-magnetic metal layer is greater than that of the second non-magnetic metal layer.

5. The light-emitting device according to any one of claims 1-4, characterized in that, Further comprising a sealing member; a through hole is provided on the housing, the through hole penetrates the housing along the thickness direction of the housing and communicates with the internal cavity; the conductive member passes through the through hole, and the sealing member fills the gap between the conductive member and the hole wall of the through hole.

6. The light-emitting device according to claim 5, characterized in that, The sealing member includes an insulating layer and a buffer layer, and the insulating layer and the buffer layer are connected along the radial direction of the through hole; the absolute value of the difference between the coefficient of thermal expansion of the insulating layer and the coefficient of thermal expansion of the buffer layer is less than a set value.

7. The light-emitting device according to claim 6, characterized in that, When there is one layer each of the insulating layer and the buffer layer, the buffer layer is provided between the insulating layer and the conductive member, or the buffer layer is provided between the insulating layer and the hole wall; When the total number of layers of the insulating layer and the buffer layer is greater than two, the insulating layer and the buffer layer are alternately arranged in sequence along the radial direction of the through hole.

8. The light-emitting device according to claim 6, characterized in that, The absolute value of the difference between the coefficient of thermal expansion of the housing near the through hole and the coefficient of thermal expansion of the insulating layer is less than a set value; and / or, the absolute value of the difference between the coefficient of thermal expansion of the conductive member and the coefficient of thermal expansion of the insulating layer is less than a set value.

9. The light-emitting device according to claim 6, wherein The housing includes a bottom plate and a side plate connected to each other, the light emitting member is mounted on the bottom plate, and the through hole is provided on the side plate; The side plate is a kovar metal member, and the buffer layer is a kovar metal layer.

10. A projection system, characterized in that, Including a projection screen and the light emitting device according to any one of claims 1-9, the light emitting device being configured to project a projection image onto the projection screen.

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