Measurement method, lithographic method, article manufacturing method, and lithographic apparatus

Abstract

The invention provides a measurement method, a lithographic method, an article manufacturing method, and a lithographic apparatus, and provides a technique which facilitates the high-precision measurement of the positional offset of an original plate with respect to a stage according to the type of the original plate. A measurement method for measuring the positional displacement of an original plate with respect to a stage in a lithographic apparatus for transferring a pattern of the original plate mounted on the stage onto a substrate comprises: an acquisition step, acquiring information indicating a relative position on a design between a reference mark of the stage and an original plate mark of the original plate in a state in which the original plate is mounted on the stage; a selection step for selecting, on the basis of the information acquired in the acquisition step, one mode from among a plurality of modes for detecting the reference mark and the original mark by an observer; and a determination step in which the reference mark and the original mark are detected by the observer in accordance with the one pattern selected in the selection step, and the positional displacement is determined on the basis of the detection result.

Description

Technical Field

[0001] The present invention relates to a measuring method, a lithography method, an article manufacturing method, and a lithography apparatus. Background Art

[0002] As one of the lithography apparatuses used in the manufacturing process of semiconductor devices or flat panel displays (FPDs), etc., there is an exposure apparatus that transfers the pattern of a reticle mounted on a stage onto a substrate. In the exposure apparatus, in order to transfer the pattern of the reticle onto the substrate with high precision, the position offset of the reticle relative to the stage can be measured by detecting a fiducial mark provided on the stage and a reticle mark provided on the reticle using an observer.

[0003] Prior Art Documents

[0004] Patent Documents

[0005] Patent Document 1: Japanese Unexamined Patent Application Publication No. 2003-007609 Summary of the Invention

[0006] Problems to be Solved by the Invention

[0007] In the exposure apparatus, it is desired to mount various types of reticles on the stage. In this case, the relative positions of the fiducial mark and the reticle mark in the state where the reticle is mounted on the stage vary depending on the type of the reticle. Therefore, it is desired to measure the position offset of the reticle relative to the stage with high precision according to the type of the reticle mounted on the stage.

[0008] The following is described in Patent Document 1: A reticle having a size smaller than a specified size of a reticle that can be mounted on the stage is mounted on the stage by using a holder that holds the peripheral portion of the reticle. In Patent Document 1, the position offset of the holder relative to the stage is measured by detecting a mark provided on the holder and a fiducial mark on the stage, and the position offset of the reticle relative to the stage is obtained based on the measurement result. However, when the reticle is mounted on the stage using the holder, the relative position between the holder and the reticle sometimes shifts. Therefore, in the method described in Patent Document 1, the position offset of the reticle relative to the stage cannot be measured with sufficient high precision.

[0009] Therefore, an object of the present invention is to provide a technique that is advantageous for measuring the position offset of a reticle relative to a stage with high precision according to the type of the reticle.

[0010] Means for Solving the Problems

[0011] In order to achieve the above object, a measuring method according to an aspect of the present invention measures a positional deviation of the reticle with respect to the stage in a lithographic apparatus that transfers a pattern of the reticle mounted on the stage onto a substrate. The measuring method is characterized in that the measuring method includes: an acquisition step of acquiring information indicating a designed relative position between a fiducial mark of the stage and a reticle mark of the reticle in a state where the reticle is mounted on the stage; a selection step of selecting one mode from a plurality of modes for detecting the fiducial mark and the reticle mark by an observer based on the information acquired in the acquisition step; and a determination step of detecting the fiducial mark and the reticle mark by the observer according to the one mode selected in the selection step, and determining the positional deviation based on the detection result. The plurality of modes include: a first mode in which the fiducial mark and the reticle mark are simultaneously received in the field of view of the observer for detection; and a second mode in which the fiducial mark and the reticle mark are separately received in the field of view through relative movement between the stage and the observer for detection.

[0012] In order to achieve the above object, a lithographic apparatus according to an aspect of the present invention transfers a pattern of a reticle onto a substrate. The lithographic apparatus is characterized in that the lithographic apparatus includes: a stage that mounts the reticle; an observer that detects a fiducial mark of the stage and a reticle mark of the reticle; and a control unit that determines a positional deviation of the reticle with respect to the stage. The control unit selects one mode from a plurality of modes based on information indicating a designed relative position between the fiducial mark and the reticle mark in a state where the reticle is mounted on the stage, and determines the positional deviation based on a result of detecting the fiducial mark and the reticle by the observer according to the one mode. The plurality of modes include: a first mode in which the fiducial mark and the reticle mark are simultaneously received in the field of view of the observer for detection; and a second mode in which the fiducial mark and the reticle mark are separately received in the field of view through relative movement between the stage and the observer for detection.

[0013] Hereinafter, other objects and other aspects of the present invention will become apparent from preferred embodiments described with reference to the drawings.

[0014] Effects of the Invention

[0015] According to the present invention, for example, a technique that facilitates highly accurately measuring a positional deviation of a reticle with respect to a stage according to the type of the reticle can be provided. Description of the Drawings

[0016] Figure 1It is a schematic diagram showing a configuration example of the exposure apparatus according to the first embodiment.

[0017] Figure 2 It is a diagram showing an example in which a reticle of a specified size is mounted on a reticle stage.

[0018] Figure 3 (a) thereof is a diagram showing the layout of the first fiducial mark on the reticle stage, and (b) is a diagram showing the layout of the reticle marks on the reticle of a specified size.

[0019] Figure 4 It is a diagram showing an example in which a reticle of a specified size is mounted on a reticle stage via a support.

[0020] Figure 5 (a) thereof is a diagram showing the layout of the first fiducial mark on the reticle stage, and (b) is a diagram showing the layout of the reticle marks on the reticle of a small size.

[0021] Figure 6 It is a flowchart showing an operation example of the exposure apparatus according to the first embodiment.

[0022] Figure 7 It is a flowchart showing the measurement process in the first mode in the first embodiment.

[0023] Figure 8 It is a flowchart showing the measurement process in the second mode in the first embodiment.

[0024] Figure 9 (a) thereof is a diagram showing the layout of the first fiducial mark on the reticle stage, (b) is a diagram showing the layout of the reticle marks on the reticle of a small size, and (c) is a diagram showing the layout of the second fiducial mark on the substrate stage.

[0025] Figure 10 It is a flowchart showing the measurement process in the second mode in the second embodiment.

[0026] Figure 11 It is a schematic diagram showing a configuration example of the exposure apparatus according to the third embodiment. Detailed Description of the Invention

[0027] Hereinafter, the embodiments will be described in detail with reference to the drawings. In addition, the following embodiments do not limit the invention described in the claims. A plurality of features are described in the embodiments, but not all of these plurality of features are essential components of the invention, and the plurality of features can also be arbitrarily combined. Further, in the drawings, the same or similar components are denoted by the same reference numerals, and redundant description is omitted.

[0028] In this specification and the accompanying drawings, directions are represented by an XYZ coordinate system in which directions orthogonal to each other in a plane parallel to the holding surface of the original stage that holds the original are defined as the X direction and the Y direction. The directions parallel to the X-axis, Y-axis, and Z-axis in the XYZ coordinate system are respectively defined as the X direction, Y direction, and Z direction, and the rotations about the X-axis, Y-axis, and Z-axis are respectively defined as θX, θY, and θZ. Control and driving (movement) with respect to the X-axis, Y-axis, and Z-axis respectively refer to control or driving (movement) in the direction parallel to the X-axis, the direction parallel to the Y-axis, and the direction parallel to the Z-axis. In addition, control or driving with respect to the θX-axis, θY-axis, and θZ-axis respectively refer to control or driving of rotation about an axis parallel to the X-axis, rotation about an axis parallel to the Y-axis, and rotation about an axis parallel to the Z-axis. <First Embodiment>

[0029] A first embodiment of the present invention will be described. As one of the lithography apparatuses used in the manufacturing process of semiconductor devices, flat panel displays (FPDs), etc., an exposure apparatus is known. An exposure apparatus is a device that performs an exposure process, which transfers (forms) a pattern formed on an original onto a substrate by exposing the substrate via the original. For a method of performing an exposure process on a plurality of exposure regions on a substrate, there are a step-and-repeat method and a step-and-scan method. An exposure apparatus using the step-and-repeat method is sometimes referred to as a stepper, and for each exposure region on the substrate, an exposure process of uniformly transferring the pattern of the original onto the substrate is sequentially performed. On the other hand, an exposure apparatus using the step-and-scan method is sometimes referred to as a scanner, and for each exposure region on the substrate, an exposure process of transferring the pattern of the original onto the substrate while relatively scanning the original and the substrate is sequentially performed. In the present embodiment, an exposure apparatus using the step-and-scan method will be exemplified for description, and the relative scanning direction of the original and the substrate in the exposure apparatus is defined as the Y direction.

[0030] Figure 1 It is a schematic diagram showing a configuration example of the exposure apparatus EXP of the present embodiment. The exposure apparatus EXP may include, for example, an illumination optical system 1, a detection unit 2, an original stage 4 (stage), a projection optical system 5, a substrate stage 7, and a control unit 11.

[0031] The illumination optical system 1 illuminates the original 3 with light emitted from a light source unit (not shown) such as an ultra-high pressure mercury lamp. For example, the illumination optical system 1 includes a wavelength selection filter, a lens group, a shutter, etc., and shapes the light from the light source unit into exposure light having a wavelength and shape suitable for exposing the substrate 6 to illuminate the original 3.

[0032] The original plate 3 is mounted on the original plate stage 4. The original plate stage 4 is configured to hold the original plate 3 and be movable in the XY directions, and is driven in the XY directions by the original plate drive mechanism 12 under the control of the control unit 11. In the case of the present embodiment, the original plate stage 4 scans in the Y direction by the original plate drive mechanism 12 during the exposure process.

[0033] The position of the original plate stage 4 can always be measured (monitored) by the first measurement unit 13. The first measurement unit 13 may include, for example, a laser interferometer. In this case, the first measurement unit 13 irradiates measurement light to the mirror 13a provided on the original plate stage 4, and measures the position of the original plate stage 4 based on the measurement light reflected by the mirror 13a. Thereby, the control unit 11 can control the position of the original plate 3 mounted on the original plate stage 4 based on the position of the original plate stage 4 measured by the first measurement unit 13. In addition, the control unit 11 can control the speed of the original plate 3 mounted on the original plate stage 4 based on the time change of the position of the original plate stage 4 measured by the first measurement unit 13.

[0034] The projection optical system 5 has a plurality of optical elements formed of mirrors or lenses or the like. The projection optical system 5 reflects / refracts the exposure light passing through the original plate 3 by the plurality of optical elements, and projects the image of the pattern formed on the original plate 3 onto the substrate 6 at a predetermined magnification.

[0035] The substrate 6 is mounted on the substrate stage 7. The substrate stage 7 is configured to hold the substrate 6 and be movable in the X direction, Y direction, Z direction, and θZ direction, and is driven in each direction by the substrate drive mechanism 14 under the control of the control unit 11. In the case of the present embodiment, the substrate stage 7 scans in the Y direction by the substrate drive mechanism 14 during the exposure process.

[0036] The position of the substrate stage 7 can always be measured (monitored) by the second measurement unit 15. The second measurement unit 15 may include, for example, a laser interferometer. In this case, the second measurement unit 15 irradiates measurement light to the mirror 15a provided on the substrate stage 7, and measures the position of the substrate stage 7 based on the measurement light reflected by the mirror 15a. Thereby, the control unit 11 can control the position of the substrate 6 mounted on the substrate stage 7 based on the position of the substrate stage 7 measured by the second measurement unit 15. In addition, the control unit 11 can control the speed of the substrate 6 mounted on the substrate stage 7 based on the time change of the position of the substrate stage 7 measured by the second measurement unit 15.

[0037] The inspection unit 2 (alignment inspection unit) has an observer for inspecting (imaging) the reference mark 8 provided on the reticle stage 4 and the reticle mark 10 provided on the reticle 3. In addition, the inspection unit 2 inspects the reference mark 9 provided on the substrate stage 7 and / or the mark (not shown) provided on the substrate 6 via the reticle 3 and the projection optical system 5. The inspection unit 2 has a focus adjustment mechanism that can adjust the focus according to the position of each mark in the Z direction and inspect each mark. In addition, hereinafter, the reference mark 8 provided on the reticle stage 4 may sometimes be referred to as the "first reference mark 8", and the reference mark 9 provided on the substrate stage 7 may be referred to as the "second reference mark 9".

[0038] In addition, the inspection unit 2 is configured to be movable in the XY direction and is driven in the XY direction by the inspection drive mechanism 16 under the control of the control unit 11. For example, when the inspection unit 2 inspects the first reference mark 8 and / or the reticle mark 10, the inspection drive mechanism 16 drives (moves) the inspection unit 2 so that the mark is disposed within the field of view of the inspection unit 2 (observer). Here, the drive (movement) for disposing the mark within the field of view of the inspection unit 2 may also be performed by driving the reticle stage 4 (reticle 3) by the reticle drive mechanism 12. Alternatively, it may be performed by relatively driving the reticle stage 4 (reticle 3) and the inspection unit 2 by both the inspection drive mechanism 16 and the reticle drive mechanism 12. That is, the inspection drive mechanism 16 and the reticle drive mechanism 12 constitute a drive mechanism for relatively driving the reticle stage 4 (reticle 3) and the inspection unit 2.

[0039] The control unit 11 is constituted by, for example, a computer (information processing device) including a processor such as a CPU (Central Processing Unit) or a storage unit such as a memory, and controls the exposure process by controlling each part of the exposure apparatus EXP. For example, the control unit 11 functions as a processing unit that determines the drive amount of each drive mechanism in the exposure process based on the position information of each mark obtained from the inspection result of the inspection unit 2. In the case of the present embodiment, the control unit 11 may include a data storage unit 11a, a drive amount calculation unit 11b, and a drive instruction unit 11c. The data storage unit 11a constitutes at least a part of the storage unit of the control unit 11 and stores the position information of each mark, drive parameters such as drive offsets and sensitivities of various drive axes, and various measurement data obtained by the exposure apparatus EXP. The drive amount calculation unit 11b constitutes at least a part of the processor of the control unit 11 and determines the drive instruction amount of various drive axes such as the reticle stage 4 or the substrate stage 7 in the exposure process based on various data stored in the data storage unit 11a. The drive instruction unit 11c constitutes at least a part of the processor of the control unit 11 and outputs a drive instruction to each drive mechanism based on the drive instruction amount determined by the drive amount calculation unit 11b.

[0040] In order to transfer the pattern of the reticle 3 onto the substrate 6 with high precision in the above-described exposure apparatus EXP, it is important to drive the reticle 3 mounted on the reticle stage 4 with high precision. As described above, the driving of the reticle 3 is performed by driving the reticle stage 4 by the reticle driving mechanism 12 based on the position of the reticle stage 4 measured by the first measurement unit 13. Therefore, in order to control the position of the reticle 3 mounted on the reticle stage 4 with high precision, it is preferable to have information indicating the position shift of the reticle 3 relative to the reticle stage 4. Thus, a measurement process is performed in the exposure apparatus EXP, and this measurement process measures the position shift of the reticle 3 relative to the reticle stage 4 by detecting the first reference mark 8 of the reticle stage 4 and the reticle mark 10 of the reticle 3 by the detection unit 2.

[0041] In addition, in the exposure apparatus EXP, it is required to mount various types of reticles 3 on the reticle stage 4. For example, in the exposure apparatus EXP, generally, the specified size of the reticle 3 that can be mounted on the reticle stage 4 is determined, but sometimes a reticle 3 having a size smaller than the specified size is mounted on the reticle stage 4 by using a holder 20 that holds the peripheral portion of the reticle 3. In this case, in the exposure apparatus EXP, it is preferable to measure the position shift of the reticle 3 relative to the reticle stage 4 with high precision according to the type (e.g., size) of the reticle 3. Hereinafter, a configuration example of the reticle stage 4 in the present embodiment and the mounting of various reticles 3 on the reticle stage 4 will be described.

[0042] Figure 2 An example in which a reticle 3a of a specified size is mounted on the reticle stage 4 is shown. In addition, Figure 3 (a) shows the layout of the first reference mark 8 in the reticle stage 4, and (b) shows the layout of the reticle mark 10 in the reticle 3a of the specified size.

[0043] The reticle stage 4 may include a main body portion 4a and a chuck 4b. The main body portion 4a is a portion driven in the XY direction by the reticle driving mechanism 12, and the first reference mark 8 is provided on the main body portion 4a. The chuck 4b is a mechanism that attracts and holds the reticle 3a by vacuum attraction or electrostatic attraction, etc. In addition, in the reticle stage 4, an opening 4c is provided for allowing light from the pattern provided in the central portion of the reticle 3a to pass through.

[0044] On the reticle 3a (first reticle) of the specified size, a reticle mark 10 (first mark) is provided. The reticle mark 10 is arranged on the reticle 3a in such a manner that it enters the field of view of the detection unit 2 (observer) together with the first reference mark 8 of the reticle stage 4 in a state where the reticle 3a is mounted on the reticle stage 4. In Figure 3In the example, the original mark 10 is arranged on the original 3a in such a way that it at least partially overlaps with the first reference mark 8 of the original stage 4 in a state where the original 3a is mounted on the original stage 4. Therefore, the detection unit 2 can detect the first reference mark 8 and the original mark 10 in a state where both the first reference mark 8 of the original stage 4 and the original mark 10 of the original 3a are simultaneously within the field of view.

[0045] For example, as Figure 3 shown, on the original 3a of a specified size, a plurality (two) of original marks 10a to 10b are provided, separated in the X direction. In this case, the control unit 11 moves the original stage 4 and the detection unit 2 relatively so as to simultaneously bring the first reference mark 8a and the original mark 10a into the field of view of the detection unit 2, and in this state, causes the detection unit 2 to detect the first reference mark 8a and the original mark 10a. Similarly, the control unit 11 moves the original stage 4 and the detection unit 2 relatively so as to simultaneously bring the first reference mark 8b and the original mark 10b into the field of view of the detection unit 2, and in this state, causes the detection unit 2 to detect the first reference mark 8b and the original mark 10b. Thereby, the control unit 11 obtains the relative position between the first reference mark 8 detected by the detection unit 2 and the corresponding original mark 10, and can determine the positional deviation of the original 3a with respect to the original stage 4 based on the difference between the obtained relative position and the designed relative position.

[0046] Figure 4 An example is shown in which the original 3b having a size smaller than the specified size (hereinafter sometimes referred to as a small size) is mounted on the original stage 4 via the bracket 20. In addition, Figure 5 (a) shows the layout of the first reference mark 8 in the original stage 4, and (b) shows the layout of the original mark 18 in the small-sized original 3b held by the bracket 20. Here, since the configuration of the original stage 4 is as described above, the description thereof is omitted here. Figure 2 As described above, the description here is omitted.

[0047] The holder 20 may include: a first portion 21 held by the original carrier 4 (collet 4b); a second portion 22 connected to the first portion and holding (supporting) the small-sized original 3b; and a fixing member 23 for fixing the original 3b held by the second portion 22. The first portion 21 and the second portion 22 of the holder 20 may be made of an opaque member such as metal, etc., but may also be made of a light-transmissive member. In the case where the first portion 21 and the second portion 22 are made of an opaque member, the holder 20 has a light-transmissive portion 24 at the position (first portion 21) overlapping with the first fiducial mark 8 in the state of being mounted on the original carrier 4. A light-transmissive member having the same material and the same thickness as the original 3 may be provided in the light-transmissive portion 24 of the holder 20 so that the focus of the detection unit 2 is the same when detecting the first fiducial mark 8 via the original 3 and when detecting the first fiducial mark 8 via the light-transmissive portion 24. In addition, the fixing member 23 is a member that fixes the small-sized original 3b to the holder 20 (second portion 22) by pressing the small-sized original 3b against the second portion 22, and may be composed of a leaf spring, for example.

[0048] An original mark 18 (second mark) is provided on the small-sized original 3b (second original). When using the small-sized original 3b, in the state where the original 3b is mounted on the original carrier 4 via the holder 20, the first fiducial mark 8 of the original carrier 4 and the original mark 18 of the original 3b cannot be simultaneously received into the field of view of the detection unit 2 (observer). Therefore, the detection unit 2 separately receives the first fiducial mark 8 of the original carrier 4 and the original mark 18 of the original 3b into the field of view of the detection unit 2 by the relative movement between the original carrier 4 and the detection unit 2 for detection.

[0049] For example, as Figure 5As shown, a plurality (two) of original marks 18a to 18b isolated in the X direction can be provided on the small-sized original plate 3b. In this case, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively, and receives the first reference mark 8a into the field of view of the detection unit 2 through the light-transmitting portion 24 of the support 20. In this state, the detection unit 2 detects the first reference mark 8a. Then, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively, and receives the original mark 18a into the field of view of the detection unit 2. In this state, the detection unit 2 detects the original mark 18a. Similarly, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively, and receives the first reference mark 8b into the field of view of the detection unit 2 through the light-transmitting portion 24 of the support 20. In this state, the detection unit 2 detects the first reference mark 8b. Then, the control unit 11 moves the original plate stage 4 and the detection unit 2 relatively, and receives the original mark 18b into the field of view of the detection unit 2. In this state, the detection unit 2 detects the original mark 18b. Thus, the control unit 11 obtains the relative positions of the first reference mark 8 detected by the detection unit 2 and the corresponding original mark 18, and can determine the position offset of the original plate 3b relative to the original plate stage 4 based on the difference between the obtained relative position and the designed relative position.

[0050] Next, an operation example (lithography method, exposure method) of the exposure apparatus EXP in the present embodiment will be described. Figure 6 It is a flowchart showing an operation example of the exposure apparatus EXP. Figure 6 The flowchart can be executed by the control unit 11. Here, Figure 6 Steps S12 to S15 in the flowchart can also be understood as measurement processes for measuring the position offset of the original plate 3 relative to the original plate stage 4. In the measurement process, in addition to steps S12 to S15, step S11 may also be included.

[0051] In step S11, the control unit 11 determines the type of the original plate 3 conveyed onto the original plate stage 4 by an original plate conveyance unit (not shown). For example, the control unit 11 can determine the type of the original plate 3 conveyed onto the original plate stage 4 by reading an identifier (e.g., barcode) provided on the original plate 3.

[0052] In step S12, the control unit 11 obtains information indicating the relative position in design between the first reference mark 8 of the original plate stage 4 and the original plate mark of the original plate 3 in the state where the original plate 3 is held on the original plate stage 4, based on the type of the original plate 3 determined in step S11 (acquisition process). The relative position in design between the first reference mark 8 and the original plate mark is, for example, the relative position in design between the first reference mark 8 and the original plate mark when the original plate 3 is mounted on the original plate stage 4 such that the center of gravity (center) of the original plate stage 4 coincides with the center of gravity (center) of the original plate 3. Hereinafter, the information indicating the relative position in design between the first reference mark 8 and the original plate mark may sometimes be referred to as "design information".

[0053] In step S13, the control unit 11 selects one mode from a plurality of modes for detecting the first reference mark 8 of the original plate stage 4 and the original plate mark of the original plate 3, according to the design information obtained in step S12 (selection process). The plurality of modes may include a first mode and a second mode. The first mode is a mode in which the first reference mark 8 and the original plate mark are simultaneously brought into the field of view of the detection unit 2 to detect the first reference mark 8 and the original plate mark. In addition, the second mode is a mode in which the first reference mark 8 and the original plate mark are separately brought into the field of view of the detection unit 2 by the relative movement between the original plate stage 4 and the detection unit 2 to detect the first reference mark 8 and the original plate mark.

[0054] When the control unit 11 determines, based on the design information obtained in step S12, that the original plate mark of the original plate 3 mounted on the original plate stage 4 can be brought into the field of view of the detection unit 2 together (simultaneously) with the first reference mark 8, the control unit 11 selects the first mode. That is, when the original plate 3a of a specified size is mounted on the original plate stage 4, the first mode is selected. In this case, the process proceeds to step S14, and the control unit 11 causes the detection unit 2 to detect the first reference mark 8 and the original plate mark according to the first mode, and determines the position offset of the original plate 3 with respect to the original plate stage 4 based on the detection result (determination process). That is, the control unit 11 performs the measurement process in the first mode. The details of step S14 in the first mode will be described later.

[0055] On the other hand, when the control unit 11 determines, based on the design information obtained in step S12, that the original plate mark of the original plate 3 mounted on the original plate stage 4 cannot be brought into the field of view of the detection unit 2 together (simultaneously) with the first reference mark 8, the control unit 11 selects the second mode. That is, when the original plate 3b of a small size is mounted on the original plate stage 4, the second mode is selected. In this case, the process proceeds to step S15, and the control unit 11 causes the detection unit 2 to detect the first reference mark 8 and the original plate mark according to the second mode, and determines the position offset of the original plate 3 with respect to the original plate stage 4 based on the detection result (determination process). That is, the control unit 11 performs the measurement process in the second mode. The details of step S15 will be described later.

[0056] In step S16, the control unit 11 performs an exposure process of exposing the substrate 6 to transfer the pattern of the original plate 3 onto the substrate 6. In the exposure process, the alignment of the original plate 3 and the substrate 6 is controlled based on the position offset determined in step S14 or S15. For example, the control unit 11 controls the position of the original plate 3 mounted on the original plate stage 4 based on the position of the original plate stage 4 measured by the first measurement unit 13 and the position offset determined in step S14 or S15, thereby controlling the alignment of the original plate 3 and the substrate 6.

[0057] Next, the details of step S14 described above will be described. Figure 7 It is a flowchart showing the measurement process in the first mode performed in step S14. Here, an example will be described in which the original plate 3a of a specified size is used as the original plate 3 mounted on the original plate stage 4 and a plurality of (two) original plate marks 10a to 10b are provided on the original plate 3a.

[0058] In step S21, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the first reference mark 8 of the original plate stage 4 and the original plate mark 10 of the original plate 3a are simultaneously received into the field of view of the detection unit 2. Next, in step S22, in a state where the first reference mark 8 and the original plate mark 10 are simultaneously received into the field of view of the detection unit 2, the control unit 11 causes the detection unit 2 to detect (capture) the first reference mark 8 and the original plate mark 10. At this time, the control unit 11 can adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the first reference mark 8.

[0059] In step S23, the control unit 11 obtains the relative position offset between the first reference mark 8 and the original plate mark 10 based on the detection result of step S22 (i.e., the image obtained by capturing). This relative position offset refers to the offset from the designed relative position between the first reference mark 8 and the original plate mark 10. Next, in step S24, the control unit 11 determines whether the relative position offset has been obtained for all groups of the first reference mark 8 and the original plate mark 10. In the case of this embodiment, the groups of the first reference mark 8 and the original plate mark 10 may include the group of the first reference mark 8a and the original plate mark 10a and the group of the first reference mark 8b and the original plate mark 10b. When the relative position offset has been obtained for all groups, the process proceeds to step S25. On the other hand, when the relative position offset has not been obtained for all groups, the process proceeds to step S21, and steps S21 to S23 are performed for the groups for which the relative position offset has not been obtained.

[0060] For example, in the first time of steps S21 to S22, as Figure 2As shown, the original stage 4 and the inspection unit 2 are relatively driven so that the first reference mark 8a and the original mark 10a are simultaneously received into the field of view of the inspection unit 2. Then, the inspection unit 2 inspects the first reference mark 8a and the original mark 10a. Thus, in step S23, the relative position shift between the first reference mark 8a and the original mark 10a can be obtained. Similarly, in the second steps S21 - S22, the original stage 4 and the inspection unit 2 are relatively driven so that the first reference mark 8b and the original mark 10b are simultaneously received into the field of view of the inspection unit 2. Then, the inspection unit 2 inspects the first reference mark 8b and the original mark 10b. Thus, in step S23, the relative position shift between the first reference mark 8b and the original mark 10b can be obtained. Additionally, in the case where, as shown in Figure 1 the exposure apparatus EXP is provided with a plurality of inspection units 2, the steps S21 - S23 for each group can also be performed in parallel by the plurality of inspection units 2.

[0061] In step S25, the control unit 11 determines the position shift of the original 3a relative to the original stage 4 based on the relative position shift between the first reference mark 8 and the original mark 10 obtained in step S23. In the case where there are a plurality of groups of the first reference mark 8 and the original mark 10, the position shift of the original 3a relative to the original stage 4 can also be determined based on the representative value (such as the average value, the mode value, etc.) of the relative position shifts obtained for the plurality of groups respectively.

[0062] Next, the details of the above step S15 will be described. Figure 8 is a flowchart showing the measurement process in the second mode performed in step S15. Here, an example will be described in which a small - sized original 3b is used as the original 3 mounted on the original stage 4 and a plurality of (two) original marks 18a - 18b are provided on the original 3b.

[0063] In the following description, the design positions of the first reference marks 8a - 8b of the original stage 4 are represented as positions in the XY directions with the center of gravity (center) of the original stage 4 as the origin, and are set as (XL1, YL1), (XR1, YR1) respectively. In addition, the design positions of the original marks 18a - 18b of the small - sized original 3b are represented as positions in the XY directions with the center of gravity (center) of the original 3b as the origin, and are set as (XL2, YL2), (XR2, YR2) respectively. However, in design, it is assumed that the center of gravity of the original stage 4 coincides with the center of gravity of the small - sized original 3b mounted on the original stage 4 via the bracket 20.

[0064] In step S31, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the first reference mark 8 of the original plate stage 4 enters the field of view of the detection unit 2 through the light-transmitting portion 24 of the support 20. Next, in step S32, the control unit 11 causes the detection unit 2 to detect (capture) the first reference mark 8 that has entered the field of view of the detection unit 2. At this time, the control unit 11 can adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the first reference mark 8.

[0065] In step S33, the control unit 11 relatively drives (moves) the original plate stage 4 and the detection unit 2 so that the original mark 18 of the original plate 3b enters the field of view of the detection unit 2. In the present embodiment, as the relative drive amount of the original plate stage 4 and the detection unit 2, the relative distance in design between the first reference mark 8 and the original mark 18 can be used. Next, in step S34, the control unit 11 causes the detection unit 2 to detect (capture) the original mark 18 that has entered the field of view of the detection unit 2. At this time, the control unit 11 can adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the original mark 18.

[0066] In step S35, the control unit 11 obtains the relative position deviation between the first reference mark 8 and the original mark 18 based on the detection results of steps S32 and S34 (i.e., the images obtained by capturing). This relative position deviation refers to the deviation from the relative position in design between the first reference mark 8 and the original mark 18. Next, in step S36, the control unit 11 determines whether the relative position deviation has been obtained for all groups of the first reference mark 8 and the original mark 18. In the case of the present embodiment, the groups of the first reference mark 8 and the original mark 18 may include the group of the first reference mark 8a and the original mark 18a and the group of the first reference mark 8b and the original mark 18b. In the case where the relative position deviation has been obtained for all groups, step S37 is performed. On the other hand, in the case where the relative position deviation has not been obtained for all groups, the process proceeds to step S31, and steps S31 to S35 are performed for the groups for which the relative position deviation has not been obtained.

[0067] For example, in the first steps S31 to S34, as Figure 4As shown, the first reference mark 8a and the original mark 18a are detected separately by the detection unit 2. In this case, in step S32, the position offset of the first reference mark 8a in the XY directions with respect to the field center of the detection unit 2 is obtained as (dxL1, dyL1). Further, in step S33, as the relative driving amount of the original stage 4 and the detection unit 2, the relative distance (XL2 - XL1, YL2 - YL1) designed between the first reference mark 8a and the original mark 18a is used. And in step S35, the position offset of the original mark 18a in the XY directions with respect to the field center of the detection unit 2 is obtained as (dxL2, dxL2). Thus, in step S35, the relative position offset between the first reference mark 8a and the original mark 18a is obtained as (dxL2 - dxL1, dyL2 - dyL1).

[0068] Similarly, in the second time of steps S31 to S34, the first reference mark 8b and the original mark 18b are detected separately by the detection unit 2. In this case, in step S32, the position offset of the first reference mark 8b in the XY directions with respect to the field center of the detection unit 2 is obtained as (dxR1, dyR1). Further, in step S33, as the relative driving amount of the original stage 4 and the detection unit 2, the relative distance (XR2 - XR1, YR2 - YR1) designed between the first reference mark 8b and the original mark 18b is used. And in step S35, the position offset of the original mark 18a in the XY directions with respect to the field center of the detection unit 2 is obtained as (dxR2, dyR2). Thus, in step S35, the relative position offset between the first reference mark 8b and the original mark 18b is obtained as (dxR2 - dxR1, dyR2 - dyR1).

[0069] In addition, as Figure 1 shown, in the case where the exposure apparatus EXP is provided with a plurality of detection units 2, the steps S31 to S35 for each group can also be performed in parallel by the plurality of detection units 2.

[0070] In step S37, the control unit 11 determines the position offset of the original plate 3b with respect to the original stage 4 based on the relative position offset between the first reference mark 8 and the original mark 18 obtained in step S35. In the case where there are a plurality of groups of the first reference mark 8 and the original mark 18, the position offset of the original plate 3b with respect to the original stage 4 can also be determined based on the representative value (such as the average value, the mode value, etc.) of the relative position offsets obtained for the plurality of groups respectively.

[0071] Here, in the above-described measurement process, when calculating the relative position offset between the first reference mark 8 and the original marks 10 and 18, the position of the substrate stage 7 is arbitrary. From the viewpoint of productivity, the above-described measurement process is preferably carried out in parallel with other processes. For example, it can be carried out during the replacement process of the substrate 6 on the substrate stage 7.

[0072] In addition, when the focus of the detection unit 2 is adjusted by the focus adjustment mechanism, the mark image may not only change in the Z direction but also shift in the XY direction. Therefore, the displacement amount of the mark image in the XY direction when the focus of the detection unit 2 is changed at an arbitrary interval by the focus adjustment mechanism can be measured in advance, and the measurement result can be stored in the data storage unit 11a as a table or a function. Thus, the control unit 11 can accurately detect the relative position offset between the first reference mark 8 and the original marks 10 and 18 based on the displacement amount of the mark image in the XY direction corresponding to the change amount (adjustment amount) of the detection unit 2 through the focus adjustment mechanism. The measurement of the displacement amount of the mark image can be carried out Figure 6 at any time before the start of the flowchart of

[0073] Furthermore, when the detection unit 2 is driven in the XY direction, there is a possibility that the actual driving position is displaced in the XY direction with respect to the driving command value. Therefore, the displacement amount (i.e., the driving error amount) in the XY direction when the detection unit 2 is driven in the XY direction at an arbitrary interval can be measured in advance, and the measurement result can be stored in the data storage unit 11a as a table or a function. Thus, the control unit 11 can accurately drive the detection unit 2 based on the displacement amount in the XY direction corresponding to the driving position of the detection unit 2. The measurement of the displacement amount of the driving position can be carried out Figure 6 at any time before the start of the flowchart of

[0074] As described above, in the present embodiment, based on the design information indicating the relative position between the first reference mark 8 and the original mark in design, one mode is selected from a plurality of modes for detecting the first reference mark 8 and the original mark. And, based on the result of detecting the first reference mark 8 and the original mark according to the selected one mode, the position of the original plate 3 with respect to the original plate stage 4 is determined. The plurality of modes include a first mode and a second mode. The first mode is a mode in which the first reference mark 8 and the original mark are simultaneously received in the field of view of the detection unit 2 for detection, and can be selected when the original plate 3a of a specified size is mounted on the original plate stage 4. The second mode is a mode in which the first reference mark 8 and the original mark are separately received in the field of view of the detection unit 2 through the relative movement of the original plate stage 4 and the detection unit 2 for detection, and can be selected when the small-sized original plate 3b is mounted on the original plate stage 4 via the bracket 20. Thus, the position offset of the original plate 3 with respect to the original plate stage 4 can be accurately measured according to the type of the original plate 3. <Second Embodiment>

[0075] A description is given of the second embodiment of the present invention. In this embodiment, a modification of the measurement process in the second mode performed in step S15 is described. In addition, this embodiment basically follows the first embodiment, and can follow the first embodiment except for the matters mentioned below.

[0076] Figure 9 (a) shows the layout of the first fiducial marks 8 in the original substrate stage 4, (b) shows the layout of the original marks 18 in the small-sized original substrate 3b held by the bracket 20, and (c) shows the layout of the second fiducial marks 9 in the substrate stage 7.

[0077] In the following description, the design positions of the first fiducial marks 8a to 8b of the original substrate stage 4 are represented as positions in the XY directions with the center of gravity (center) of the original substrate stage 4 as the origin, and are set as (XL1, YL1) and (XR1, YR1), respectively. In addition, the design positions of the original marks 18a to 18b of the small-sized original substrate 3b are represented as positions in the XY directions with the center of gravity (center) of the original substrate 3b as the origin, and are set as (XL2, YL2) and (XR2, YR2), respectively. Furthermore, the design positions of the second fiducial marks 9a to 9b of the substrate stage 7 are represented as positions in the XY directions with the center of gravity (center) of the substrate stage 7 as the origin, and are set as (XL3, YL3) and (XR3, YR3), respectively. However, in the design, it is set that the center of gravity of the original substrate stage 4, the center of gravity of the substrate stage 7, and the center of gravity of the small-sized original substrate 3b mounted on the original substrate stage 4 via the bracket 20 coincide. Here, the second fiducial marks 9a to 9b of the substrate stage 7 are arranged at the same interval as the original marks 18a to 18b of the original substrate 3b. In the case of using a plurality of small-sized original substrates 3b with different sizes, the second fiducial marks 9 of the substrate stage 7 can also be increased according to each type of the interval of the original marks 18. In this case, the interval of the second fiducial marks 9 of the substrate stage 7 is also the same as the interval of the original marks 18.

[0078] Figure 10 is a flowchart showing the measurement process in the second mode performed in step S15. In this embodiment, an example of obtaining the relative position deviation between the first fiducial mark 8 of the original substrate stage 4 and the original mark 18 of the original substrate 3b with the second fiducial mark 9 of the substrate stage 7 as a reference is described.

[0079] In step S41, the control unit 11 relatively drives (moves) the original substrate stage 4 and the detection unit 2 so as to bring the original mark 18 of the original substrate 3b into the field of view of the detection unit 2. At this time, the control unit 11 drives the substrate stage 7 so as to bring the second fiducial mark 9 of the substrate stage 7 into the field of view of the detection unit and the projection area of the projection optical system 5.

[0080] In step S42, the control unit 11 causes the detection unit 2 to detect (image) the original mark 18 and the second reference mark 9 that have entered the field of view of the detection unit 2. The second reference mark 9 is detected by the detection unit 2 via the projection optical system 5. At this time, the control unit 11 can adjust the focus of the detection unit 2 by the focus adjustment mechanism or adjust the position of the second reference mark 9 in the Z direction by the substrate stage 7 so that the focus of the detection unit 2 is aligned with the original mark 18 and the second reference mark 9. Next, in step S43, the control unit 11 calculates the position offset of the original mark 18 relative to the second reference mark 9 based on the detection result of step S42 (i.e., the image obtained by imaging). At this time, the control unit 11 also calculates the position offset of the second reference mark 9 relative to the center of the field of view of the detection unit 2.

[0081] In step S44, the control unit 11 relatively drives (moves) the original stage 4 and the detection unit 2 so that the first reference mark 8 on the original stage 4 enters the field of view of the detection unit 2 through the light transmissive portion 24 of the support 20. In the present embodiment, as the relative drive amount of the original stage 4 and the detection unit 2, the relative distance in design between the first reference mark 8 and the original mark 18 can be used.

[0082] In step S45, the control unit 11 causes the detection unit 2 to detect (image) the first reference mark 8 that has entered the field of view of the detection unit 2. At this time, the control unit 11 can adjust the focus of the detection unit 2 by the focus adjustment mechanism so that the focus of the detection unit 2 is aligned with the first reference mark 8. Next, in step S46, the control unit 11 calculates the position offset of the first reference mark 8 relative to the center of the field of view of the detection unit 2 based on the detection result of step S45 (i.e., the image obtained by imaging). Here, steps S44 to S46 are performed to calculate the positional relationship between the original stage 4 and the substrate stage 7. Therefore, when the "position offset of the first reference mark 8 relative to the center of the field of view of the detection unit 2" is obtained in the first steps S44 to S46, the subsequent steps S44 to S46 can be omitted.

[0083] In step S47, the control unit 11 calculates the relative position offset between the first reference mark 8 and the original mark 18. The relative position offset can be calculated based on the "position offset of the original mark 18 relative to the second reference mark 9", the "position offset of the second reference mark 9 relative to the center of the field of view", and the "position offset of the first reference mark 8 relative to the center of the field of view" calculated in step S43 and step S46.

[0084] In step S48, the control unit 11 determines whether the relative position offset is obtained for all groups of the original marks 18 of the first reference mark 8 and the second reference mark 9. In the case of the present embodiment, the groups of the first reference mark 8, the second reference mark 9, and the original mark 18 may include the group of the first reference mark 8a, the second reference mark 9a, and the original mark 18a and the group of the first reference mark 8b, the second reference mark 9b, and the original mark 18b. When the relative position offset is obtained for all groups, the process proceeds to step S49. On the other hand, when the relative position offset is not obtained for all groups, the process proceeds to step S41, and steps S41 to S47 are performed for the groups for which the relative position offset has not yet been obtained.

[0085] For example, in the first execution of steps S41 to S47, the first reference mark 8a and the original mark 18a are detected separately by the detection unit 2. In this case, in step S41, as the driving amount of the substrate stage 7, “−(XL3 + XR3) / 2” is used for the X direction, and “(YL3 + YR3) / 2 − (YL1 + YR1) / 2” is used for the Y direction. And, in step S43, the position offset of the original mark 18a with respect to the second reference mark 9a is obtained as (dxL3, dyL3), and the position offset of the second reference mark 9a with respect to the center of the field of view of the detection unit 2 is obtained as (dxL4, dyL4). Further, in step S44, as the relative driving amount of the original stage 4 and the detection unit 2, the relative distance in design between the first reference mark 8a and the original mark 18a (XL1 − XL2, YL1 − YL2) is used. And, in step S46, the position offset of the first reference mark 8a with respect to the center of the field of view of the detection unit 2 is obtained as (dxL5, dyL5). Thus, in step S47, the relative position offset between the first reference mark 8a and the original mark 18a is obtained as (dxL3 + dxL4 − dxL5, dyL3 + dyL4 − dyL5).

[0086] Similarly, in the second execution of steps S41 to S47, the first reference mark 8b and the original mark 18b are detected separately by the detection unit 2. In this case, in step S43, the positional deviation of the original mark 18b with respect to the second reference mark 9b is obtained as (dxR3, dyR3), and the positional deviation of the second reference mark 9b with respect to the center of the field of view of the detection unit 2 is obtained as (dxR4, dyR4). Further, in step S44, as the relative driving amount between the original stage 4 and the detection unit 2, the relative distance in design between the first reference mark 8a and the original mark 18a (XR1 - XR2, YR1 - YR2) is used. And, in step S46, the positional deviation of the first reference mark 8b with respect to the center of the field of view of the detection unit 2 is obtained as (dxR5, dyR5). Thus, in step S47, the relative positional deviation between the first reference mark 8b and the original mark 18b is obtained as (dxR3 + dxR4 - dxR5, dyR3 + dyR4 - dyR5).

[0087] Further, in the case where Figure 1 the exposure apparatus EXP is provided with a plurality of detection units 2 as shown, steps S41 to S47 for each group may also be performed in parallel by the plurality of detection units 2.

[0088] In step S49, the control unit 11 determines the positional deviation of the original plate 3b with respect to the original stage 4 based on the relative positional deviation between the first reference mark 8 and the original mark 18 obtained in step S47. In the case where there are a plurality of sets of the first reference mark 8 and the original mark 18, the positional deviation of the original plate 3b with respect to the original stage 4 may also be determined based on a representative value (such as an average value, a mode value, etc.) of the relative positional deviations obtained for the plurality of sets respectively.

[0089] According to the present embodiment, similarly to the first embodiment, the positional deviation of the original plate 3 with respect to the original stage 4 can be measured with high accuracy according to the type of the original plate 3. Here, for the process (step S47) of obtaining the relative positional deviation between the first reference mark 8 and the original mark 18, from the viewpoint of productivity, it is preferably performed in parallel with other processes. For example, it may be performed during the replacement of the substrate 6 on the substrate stage 7. Thus, the second reference mark 9 of the substrate stage 7 may be provided on the substrate stage 7 so as to at least partially overlap the original mark 10 at the position of the substrate stage 7 during the replacement of the substrate 6. <Third Embodiment>

[0090] A description will be given of a third embodiment of the present invention. In this embodiment, a configuration example of a specific exposure apparatus EXP for determining the type of the original plate 3 in the above step S11 will be described. In addition, this embodiment basically follows the first embodiment, and can be implemented in accordance with the first embodiment except for the matters mentioned below. In addition, in this embodiment, the measurement process in the second mode of the second embodiment can be applied instead of the measurement process in the second mode of the first embodiment.

[0091] Figure 11 FIG. is a schematic diagram showing a configuration example of an exposure apparatus EXP' that constitutes this embodiment. Compared with the exposure apparatus EXP of the first embodiment, the exposure apparatus EXP' of this embodiment can further include an original plate storage unit 50, an original plate transfer robot 51, and an original plate transfer loader 56. The original plate transfer robot 51 and the original plate transfer loader 56 constitute an original plate transfer unit that transfers the original plate 3 from the original plate storage unit 50 to the original plate stage 4.

[0092] The original plate storage unit 50 is a unit for storing the original plate 3. The original plate storage unit 50 may include an original plate stacker 52, a cassette opening device 53, and original plate cassettes 54 to 55. The original plate is taken out from the original plate stacker 52 by the original plate transfer robot 51 and transferred to the original plate transfer loader 56 in a state where the cassette is opened by the cassette opening device 53. Then, the original plate transfer loader 56 transfers the original plate onto the original plate stage 4. A plurality of original plates are held in the original plate stacker 52. In Figure 11 FIG., the original plate 3 taken out from the original plate cassette 54 and mounted on the original plate stage 4 and the original plate 57 stored in the original plate cassette 55 are illustrated. On the original plate transfer robot 51, a reading unit 58 for reading an identifier (e.g., a barcode) provided on each original plate is provided. The reading unit 58 reads the identifier provided on the original plate (e.g., the side surface) during the transfer of the original plate by the original plate transfer robot 51. Thereby, the control unit 11 can determine the type (e.g., size) of the original plate transferred onto the original plate stage 4 based on the identifier read by the reading unit 58. Information related to the type of the original plate is stored, for example, in the data storage unit 11a and is used to obtain design information indicating the relative position in design between the first reference mark 8 and the original plate mark.

[0093] <Embodiment of the article manufacturing method>

[0094] The article manufacturing method according to an embodiment of the present invention is suitable for manufacturing micro-devices such as semiconductor devices or articles such as elements with fine structures. The article manufacturing method of the present embodiment includes: a transfer process of transferring the pattern of the original plate onto a substrate using the above-described lithography method (lithography apparatus); a processing process of processing the substrate that has undergone the transfer process; and a manufacturing process of manufacturing an article from the substrate that has undergone the processing process. The transfer process can also be understood as a process of exposing the substrate using the above-described exposure method (exposure apparatus). In addition, the processing process can also be understood as a process of developing the photosensitive material (photoresist) on the substrate onto which the original plate pattern has been transferred as a latent image pattern. Furthermore, the article manufacturing method includes other well-known processes (oxidation, film formation, evaporation, doping, planarization, etching, resist stripping, slicing, bonding, packaging, etc.). The article manufacturing method of the present embodiment is advantageous in at least one aspect among the performance, quality, productivity, and production cost of the article as compared with the conventional methods. <Other Embodiments>

[0095] The present invention can also be realized by the following process: providing a program for realizing one or more functions of the above-described embodiment to a system or apparatus via a network or a storage medium, and reading and executing the program by one or more processors in a computer of the system or apparatus. In addition, it can also be realized by a circuit (such as an ASIC) that realizes one or more functions. Other Embodiments

[0096] The embodiment of the present invention can also be realized by the following method: providing software (program) that executes the functions of the above-described embodiment to a system or apparatus via a network or various storage media, and reading and executing the program by a computer or a central processing unit (CPU) or a microprocessing unit (MPU) of the system or apparatus.

[0097] The invention is not limited to the above-described embodiment, and various changes and modifications can be made without departing from the concept and scope of the invention. Therefore, the claims are attached to disclose the scope of the invention. Description of Reference Numerals

[0098] 1: Illumination optical system, 2: Detection unit (observer), 3: Original plate, 4: Original plate stage, 5: Projection optical system, 6: Substrate, 7: Substrate stage, 8: First reference mark, 9: Second reference mark, 10, 18: Original plate mark, 11: Control unit, EXP: Exposure apparatus (lithography apparatus).

Claims

1. A measuring method for measuring the positional deviation of a reticle relative to a stage in a lithographic apparatus that transfers a pattern of the reticle mounted on the stage onto a substrate, characterized in that: The measuring method includes: An acquisition step of acquiring information indicating the relative position in design between a fiducial mark of the stage and a reticle mark of the reticle in a state where the reticle is mounted on the stage; A selection step of selecting one mode from a plurality of modes for detecting the fiducial mark and the reticle mark by an observer according to the information acquired in the acquisition step; and A determination step of detecting the fiducial mark and the reticle mark by the observer according to the one mode selected in the selection step, and determining the positional deviation based on the detection result, The plurality of modes include: a first mode in which the fiducial mark and the reticle mark are simultaneously brought into the field of view of the observer for detection; and a second mode in which the fiducial mark and the reticle mark are separately brought into the field of view through relative movement of the stage and the observer for detection.

2. The measuring method according to claim 1, characterized in that: In the selection step, the first mode is selected when a first reticle is mounted on the stage, and the second mode is selected when a second reticle is mounted on the stage, The first reticle has a first mark as the reticle mark, and the first mark is brought into the field of view together with the fiducial mark in a state where the first reticle is mounted on the stage, The second reticle has a second mark as the reticle mark, and the second mark is not brought into the field of view together with the fiducial mark in a state where the second reticle is mounted on the stage.

3. The measuring method according to claim 2, characterized in that: The second reticle has a smaller size than the first reticle and is mounted on the stage via a holder that holds a peripheral portion of the second reticle.

4. The measuring method according to claim 3, characterized in that: In the second mode, the fiducial mark is detected by the observer through the holder.

5. The measuring method according to claim 4, characterized in that: The holder has a light-transmitting portion at a position overlapping the fiducial mark in a state of being mounted on the stage.

6. The measuring method according to claim 3, characterized in that: The holder includes: a first portion held by a chuck of the stage; a second portion connected to the first portion and holding the reticle; and a fixing member that fixes the reticle by pressing the reticle against the second portion.

7. The measuring method according to claim 1, characterized in that: The measuring method further includes a determination step in which the type of the reticle transferred to the stage is determined by reading an identifier provided on the reticle, In the acquisition step, the information is acquired based on the type of the reticle determined in the determination step.

8. A lithography method for transferring the pattern of a reticle mounted on a stage onto a substrate, characterized in that: The above lithography method includes: A measurement process that uses the measurement method described in any one of claims 1 to 7 to measure the positional offset of the above reticle relative to the above stage; and A transfer process that transfers the pattern of the above reticle onto the above substrate, In the above transfer process, based on the above positional offset measured in the above measurement process, the alignment of the above reticle and the above substrate is controlled.

9. An article manufacturing method, characterized in that: The above article manufacturing method includes: A transfer process that uses the lithography method described in claim 8 to transfer the pattern of a reticle onto a substrate; A processing process that processes the above substrate that has undergone the above transfer process; and A manufacturing process that manufactures an article from the above substrate that has undergone the above processing process.

10. A lithography apparatus for transferring the pattern of a reticle onto a substrate, characterized in that: The above lithography apparatus includes: A stage that mounts the above reticle; An observer that detects a fiducial mark of the above stage and a reticle mark of the above reticle; and A control unit that determines the positional offset of the above reticle relative to the above stage, The above control unit selects one mode from a plurality of modes based on information indicating the designed relative position of the above fiducial mark and the above reticle mark in a state where the above reticle is mounted on the above stage, and determines the above positional offset based on the results of detecting the above fiducial mark and the above reticle mark by the observer according to the above one mode, The above plurality of modes include: a first mode that simultaneously receives the above fiducial mark and the above reticle mark into the field of view of the above observer for detection; and a second mode that separately receives the above fiducial mark and the above reticle mark into the field of view through the relative movement of the above stage and the above observer for detection.

Images