Electronic device

Abstract

The electronic device includes: a display module including a folding area foldable about a folding axis extending in a first direction, and first and second non-folding areas spaced apart from each other in a second direction crossing the first direction, the first and second non-folding areas being foldable about a folding axis extending in the first direction; the folding area is located between the first non-folding area and the second non-folding area; a window disposed on the display module; a protective layer disposed on the window; the supporting plate is arranged below the display module; and a housing in which the display module and the support plate are accommodated. The support plate includes: a bottom portion facing the lower portion of the housing; and side wall portions, each of which is bent from the bottom portion to face a side portion of the housing. Each of the side wall portions is disposed between a side surface of the display module and a side portion of the housing.

Description

[0001] Cross - reference to related applications

[0002] This application claims priority and all benefits arising therefrom to Korean Patent Application No. 10 - 2024 - 0003398, filed on January 9, 2024, the content of which is incorporated herein by reference in its entirety. Technical field

[0003] The present disclosure herein relates to an electronic device. Background art

[0004] Various electronic devices such as televisions, mobile phones, tablet computers, and game consoles have been developed. Recently, flexible electronic devices each including a flexible display panel capable of sliding or folding have been developed. Different from rigid display devices, flexible electronic devices can be folded, curled, or bent. Regardless of the size of the existing screen, a flexible electronic device with the ability to transform into various shapes can be portable to improve user convenience.

[0005] Among flexible electronic devices, it is desirable for an electronic device capable of folding to maintain the reliability and stability of the components constituting the electronic device during folding. And in consideration of this, a peripheral area where no image is displayed is designed. The peripheral area of the electronic device may reduce the display quality, and thus, a method for reducing the peripheral area is desired. Summary of the invention

[0006] The present disclosure provides an electronic device that reduces the dead zone to improve visibility.

[0007] The present disclosure also provides an electronic device with improved impact resistance.

[0008] Embodiments of the present invention provide an electronic device including: a display module including a folding area and a first non - folding area and a second non - folding area, wherein the folding area can be folded around a folding axis extending in a first direction, the first non - folding area and the second non - folding area are spaced apart from each other in a second direction intersecting the first direction, and the folding area is between the first non - folding area and the second non - folding area; a window disposed on the display module; a protective layer disposed on the window; a support plate disposed below the display module; and a housing that houses the display module and the support plate. The support plate includes: a bottom portion facing the lower portion of the housing; and side wall portions, each of the side wall portions being bent from the bottom portion to face the side portion of the housing. Each of the side wall portions is disposed between the side surface of the display module and the side portion of the housing.

[0009] In an embodiment, the support plate may include: a matrix including a filler; and a reinforced fiber composite material disposed inside the matrix and including at least one of a glass fiber reinforced plastic and a carbon fiber reinforced plastic.

[0010] In an embodiment, the side wall portion may be bent from the bottom portion with a predetermined curvature.

[0011] In an embodiment, the angle between each of the side wall portions and the bottom portion may be a right angle.

[0012] In an embodiment, the electronic device may further include a lower plate disposed below the support plate, and the lower plate may have a plate shape extending in a first direction and a second direction.

[0013] In an embodiment, the lower plate may include at least one of stainless steel and aluminum.

[0014] In an embodiment, the lower plate may include: a first plate overlapping with a first non-folded area; and a second plate spaced apart from the first plate and overlapping with a second non-folded area, and a folded area is between the first plate and the second plate.

[0015] In an embodiment, the sum of the thickness of the bottom portion of the support plate and the thickness of the lower plate may be about 50 micrometers (μm) to about 250 μm.

[0016] In an embodiment, the electronic device may further include a buffer layer disposed between each of the side wall portions and a side surface of the display module, and the buffer layer may be in contact with the side wall portions.

[0017] In an embodiment, each of the side wall portions may define a plurality of holes adjacent to a boundary with the bottom portion and extending in a direction the same as the extending direction of the boundary.

[0018] In an embodiment, the electronic device may further include: a cover tape disposed on an outer portion of the side wall portion adjacent to the housing and covering the holes.

[0019] In an embodiment, the electronic device may further include: a buffer layer disposed between each of the side wall portions and a side portion of the housing, and the buffer layer may be in contact with the side wall portions.

[0020] In an embodiment, the electronic device may further include: a buffer layer in contact with a top surface of each of the side wall portions and an inner surface of each of the side wall portions.

[0021] In an embodiment, the electronic device may further include: a printed layer disposed along an edge of the protective layer and having a predetermined color.

[0022] In an embodiment, a top surface of each of the side wall portions may be in contact with the printed layer.

[0023] In an embodiment, the housing may further include a protruding portion protruding from the top surface of the side portion. The protruding portion may include: a first surface facing the top surface of the side portion; a second surface connecting the first surface to the outer surface of the side portion; and a third surface connecting the first surface to the top surface of the side portion. The angle between the second surface and the first surface may be an obtuse angle, and the angle between the third surface and the first surface may be a right angle.

[0024] In an embodiment, the first surface may be parallel to the top surface of the side portion.

[0025] In an embodiment, the first surface and the protective layer may not overlap each other in a plan view.

[0026] In an embodiment, the first surface may have a predetermined curvature.

[0027] In an embodiment, the protective layer may be disposed on a portion of the top surface of the side portion that is exposed from the protruding portion.

[0028] In an embodiment, the display module may include a first region, a bending region, and a second region arranged in a second direction, wherein the first region includes a first non-folded region, a folded region, and a second non-folded region. The bending region may be bent about a bending axis extending in a first direction such that the second region overlaps the first region in a plan view, and in the first direction, the width of the first region may be greater than the width of each of the bending region and the second region.

[0029] In an embodiment, in a state where the bending region is bent, the side wall portions may be spaced apart from each other, and the bending region is between the side wall portions.

[0030] In an embodiment, the electronic device may further include: a support portion disposed on a lower portion of the housing adjacent to the bending region.

[0031] In an embodiment, the side wall portions may not be provided in a region overlapping the folded region.

[0032] In an embodiment of the present invention, an electronic device includes: a display module including a folding region, a first non-folding region, and a second non-folding region, wherein the folding region can be folded around a folding axis extending in a first direction, the first non-folding region and the second non-folding region are spaced apart from each other in a second direction intersecting the first direction, and the folding region is between the first non-folding region and the second non-folding region; a window disposed on the display module; a protective layer disposed on the window; a lower film disposed below the display module; a support plate disposed below the lower film and defining a groove in at least a part of the recessed support plate; a coupling portion extending along an edge of the support plate and including a protruding portion coupled to the groove; and a housing that houses the display module and the support plate. The coupling portion is disposed between a side surface of the display module and the housing.

[0033] In an embodiment, each of the groove and the protruding portion may be provided in plurality, and the plurality of grooves may be arranged to be spaced apart from each other along the edge of the support plate. The coupling portion may include a main body extending along the edge of the support plate and a protruding portion protruding from the main body, and the protruding portions may be respectively inserted into the grooves.

[0034] In an embodiment, the groove may extend along the edge of the support plate, and the coupling portion may include a resin. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] The accompanying drawings are included to provide a further understanding of the present invention, and are incorporated in and constitute a part of this specification. The drawings illustrate embodiments of the present invention and, together with the description, serve to explain the principles of the present invention. In the drawings:

[0036] Figure 1A is a perspective view showing an electronic device according to an embodiment;

[0037] Figure 1B is a perspective view showing an electronic device according to an embodiment;

[0038] Figure 1C is a plan view showing an electronic device according to an embodiment;

[0039] Figure 1D is a perspective view showing an electronic device according to an embodiment;

[0040] Figure 2A is a perspective view showing an electronic device according to an embodiment;

[0041] Figure 2B is a perspective view showing an electronic device according to an embodiment;

[0042] Figure 2C is a perspective view showing an electronic device according to an embodiment;

[0043] Figure 3 is an exploded perspective view showing an electronic device according to an embodiment;

[0044] Figure 4 is showing a cross-sectional view of a portion corresponding to line I-I' in Figure 3 ;

[0045] Figure 5 is a plan view of a display panel according to an embodiment;

[0046] Figure 6A is a developed view of a support plate according to an embodiment;

[0047] Figure 6B is a perspective view of a support plate according to an embodiment;

[0048] Figure 7A is a cross-sectional view of a part of an electronic device according to an embodiment;

[0049] Figure 7B is a cross-sectional view of another part of an electronic device according to an embodiment;

[0050] Figure 8A is a developed view of a support plate according to an embodiment;

[0051] Figure 8B is a perspective view of a support plate according to an embodiment;

[0052] Figure 9A is a developed view of a support plate according to an embodiment;

[0053] Figure 9B is a perspective view of a support plate according to an embodiment;

[0054] Figure 10A is a cross-sectional view of a part of an electronic device according to an embodiment;

[0055] Figure 10B is a cross-sectional view of another part of an electronic device according to an embodiment;

[0056] Figure 10C is a developed view of a plate according to an embodiment;

[0057] Figure 11A is a cross-sectional view of a part of an electronic device according to an embodiment;

[0058] Figure 11B is a developed view of a support plate according to an embodiment;

[0059] Figure 12A is a cross-sectional view of a part of an electronic device according to an embodiment;

[0060] Figure 12B is a perspective view of a support plate and a coupling portion according to an embodiment;

[0061] Figure 12C is a cross-sectional view of a state in which a support plate and a coupling portion according to an embodiment are coupled to each other;

[0062] Figure 13A is a cross-sectional view of a part of an electronic device according to an embodiment;

[0063] Figure 13B is a perspective view of a support plate according to an embodiment;

[0064] Figure 14A is a cross-sectional view of a state in which a support plate and a coupling portion according to an embodiment are coupled to each other;

[0065] Figure 14B is a perspective view of a support plate according to an embodiment;

[0066] Figure 15 is a cross-sectional view of a part of an electronic device according to an embodiment;

[0067] Figure 16 is a cross-sectional view of a part of an electronic device according to an embodiment; and

[0068] Figure 17 is a cross-sectional view of a part of an electronic device according to an embodiment. Detailed Embodiments

[0069] In this specification, it will be understood that when an element (or region, layer, part, etc.) is referred to as being "on" another element, "connected to" or "coupled to" another element, it may be directly disposed on the other element, directly connected to or directly coupled to the other element, or a third element may be disposed between the elements.

[0070] Similar reference numerals or symbols always refer to the same element. In addition, in the drawings, for the effective description of the technical content, the thickness, ratio, and dimensions of the elements are exaggerated. The term "and / or" includes one or more combinations that can be defined by the relevant elements.

[0071] It will be understood that although the terms "first", "second", etc. may be used herein to describe various elements, these elements should not be limited by these terms. These terms are only used to distinguish one element from another. For example, without departing from the teachings of the present invention, the first element may be referred to as the second element, and similarly, the second element may be referred to as the first element. As used herein, the singular form is intended to also include the plural form, unless the context clearly indicates otherwise.

[0072] In addition, terms such as "below", "beneath", "above", and "upper" are used to explain the relationships of components shown in the drawings. These terms are relative concepts and are explained based on the directions shown in the drawings.

[0073] It will also be understood that terms such as "comprising" or "having", when used herein, specify the presence of stated features, numbers, steps, operations, components, parts, or combinations thereof, but do not preclude the presence or addition of one or more other features, numbers, steps, operations, components, parts, or combinations thereof.

[0074] Unless otherwise defined, all terms (including technical and scientific terms) used herein have the same meaning as commonly understood by one of ordinary skill in the art to which this invention pertains. It will also be understood that terms, such as those defined in commonly used dictionaries, should be interpreted as having a meaning consistent with their meaning in the context of the relevant art and will not be interpreted in an idealized or overly formal sense unless expressly so defined herein.

[0075] "At least one" should not be construed as limiting "one" or "a". "Or" means "and / or". As used herein, the term "and / or" includes any combination and all combinations of one or more of the associated listed items. "At least one of A, B, and C" includes "A", "B", "C", "A and B", "A and C", "B and C", and / or "A, B, and C". Hereinafter, embodiments of the present invention will be described with reference to the drawings.

[0076] Figure 1A is a perspective view showing an electronic device according to an embodiment. Figure 1B is a perspective view showing an electronic device according to an embodiment. Figure 1C is a plan view showing an electronic device according to an embodiment. Figure 1D is a perspective view showing an electronic device according to an embodiment.

[0077] Figure 1A is a perspective view of an unfolded state of an electronic device ED according to an embodiment. The electronic device ED according to an embodiment may be a device activated in response to an electrical signal. For example, the electronic device ED may be a mobile phone, a tablet computer, a vehicle navigation unit, a game console, or a wearable device, but the embodiment is not limited thereto. Figures 1A to 2C Shows foldable electronic devices ED and ED-a as an example. The foldable electronic devices ED and ED-a according to an embodiment may be mobile phones.

[0078] The electronic device ED may include a first display surface FS defined by a first direction axis DR1 and a second direction axis DR2 intersecting the first direction axis DR1. The electronic device ED may provide an image IM to a user through the first display surface FS. The electronic device ED may display the image IM in the direction of a third direction axis DR3 on the first display surface FS parallel to each of the first direction axis DR1 and the second direction axis DR2.

[0079] In the present disclosure, the first direction axis DR1 and the second direction axis DR2 may intersect perpendicularly to each other, and the third direction axis DR3 may be a normal direction axis of a plane defined by the first direction axis DR1 and the second direction axis DR2. The thickness direction of the electronic device ED may be a direction parallel to the third direction axis DR3. The front surface (or top surface) and the rear surface (or bottom surface) may face each other with respect to the third direction axis DR3, and the normal direction of each of the front surface (or top surface) and the rear surface (or bottom surface) may be parallel to the third direction axis DR3. The front surface (or top surface) means a surface close to the first display surface FS, and the rear surface (or bottom surface) means a surface spaced apart from the first display surface FS. In addition, the rear surface (or bottom surface) means a surface close to a second display surface RS to be described later. The term "above" (or "upper") means a direction close to the first display surface FS, and the term "below" (or "lower") means a direction away from the first display surface FS.

[0080] The cross-section of each of the components means a surface parallel to the thickness direction, and its plane means a surface perpendicular to the thickness direction. The plane means a surface defined by the first direction axis DR1 and the second direction axis DR2. As used herein, a "plan view" is a view in the thickness direction (i.e., the third direction DR3) of the display module DM (see Figure 3 ).

[0081] The directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 used herein are relative concepts and may be changed to other directions. In addition, the directions indicated by the first direction axis DR1, the second direction axis DR2, and the third direction axis DR3 may be referred to as the first to third directions and may be represented by the same reference numerals or symbols.

[0082] The electronic device ED may detect an external input applied from the outside. The external input may include various types of inputs provided from the outside of the electronic device ED. For example, the external input may include not only a touch of a part of the body (such as a user's hand), but also an external input (such as hovering) applied by approaching the electronic device ED or being adjacent to the electronic device ED at a predetermined distance. In addition, the external input may include various types such as force, pressure, temperature, and light.

[0083] The electronic device ED may include a first display surface FS and a second display surface RS. The first display surface FS may include a first active area F-AA, a first peripheral area F-NAA, and an electronic module area EMA. The second display surface RS may be defined as a surface opposite to at least a part of the first display surface FS. That is, the second display surface RS may be defined as a part of the rear surface of the electronic device ED.

[0084] The first active area F-AA may be an area that is activated in response to an electrical signal. The first active area F-AA may be an area on which an image IM is displayed and capable of detecting various types of external inputs.

[0085] The first peripheral area F-NAA may be an area on which no image IM is displayed. The first peripheral area F-NAA may be adjacent to the first active area F-AA. The first peripheral area F-NAA may have a predetermined color. The first peripheral area F-NAA may surround the first active area F-AA. Thus, the shape of the first active area F-AA may be generally defined by the first peripheral area F-NAA. However, this is an example, and the first peripheral area F-NAA may be set to be adjacent to only one side of the first active area F-AA, or may be omitted.

[0086] Various electronic modules may be provided in the electronic module area EMA. For example, the electronic module may include at least one of a camera, a speaker, a light detection sensor, and a thermal detection sensor. The electronic module area EMA may detect an external object received through the display surfaces FS and RS, or provide a sound signal such as voice to the outside through the display surfaces FS and RS. Each of the electronic modules may include a plurality of components and is not limited to any one embodiment.

[0087] The electronic module area EMA may be surrounded by the first peripheral area F-NAA. However, this is an example, and the electronic module area EMA is not limited to any one embodiment. For example, the electronic module area EMA may be surrounded by the first active area F-AA and the first peripheral area F-NAA, and the electronic module area EMA may be provided within the first active area F-AA.

[0088] According to an embodiment, an electronic device ED may be divided into at least one folding region FA and a plurality of non-folding regions NFA1 and NFA2 respectively extending from the folding region FA. For example, a first non-folding region NFA1, a folding region FA, and a second non-folding region NFA2 may be defined in a second direction DR2. The electronic device ED may be divided into a first non-folding region NFA1 and a second non-folding region NFA2 spaced apart from each other in the second direction DR2, and the folding region FA is between the first non-folding region NFA1 and the second non-folding region NFA2. For example, the first non-folding region NFA1 may be disposed on one side of the folding region FA in the second direction DR2, and the second non-folding region NFA2 may be disposed on the other side of the folding region FA in the second direction DR2.

[0089] Figure 1A An embodiment of the electronic device ED including one folding region FA is shown. However, the embodiment is not limited thereto, and in another embodiment, a plurality of folding regions may be defined in the electronic device ED. For example, an electronic device according to an embodiment may include two or more folding regions and three or more non-folding regions, with each of the folding regions disposed between the three or more non-folding regions.

[0090] Figure 1B is a perspective view showing a folding operation of an electronic device ED according to an embodiment. Figure 1C is a plan view of a folded state of an electronic device ED according to an embodiment. Figure 1D is a perspective view showing a folding operation of an electronic device ED according to an embodiment.

[0091] Reference Figure 1B , according to an embodiment, the electronic device ED may be folded about a first folding axis FX1 extending in a first direction DR1. In a state where the electronic device ED is folded, the folding region FA may have a predetermined curvature and a predetermined radius of curvature. The electronic device ED may be folded about the first folding axis FX1 to change to an inner-folded state such that the first non-folding region NFA1 and the second non-folding region NFA2 face each other, and the first display surface FS is not exposed to the outside.

[0092] Reference Figure 1C , in a state where the electronic device ED according to an embodiment is inner-folded, a second display surface RS may be visible to a user. Here, the second display surface RS may include a second active area R-AA for displaying an image. The second active area R-AA may be an area activated in response to an electrical signal. The second active area R-AA may be an area on which an image is displayed and capable of detecting various types of external inputs.

[0093] In addition, the second display surface RS may include a second peripheral region R-NAA. The second peripheral region R-NAA may be adjacent to the second active region R-AA. The second peripheral region R-NAA may have a predetermined color. The second peripheral region R-NAA may surround the second active region R-AA. Although not shown, the second display surface RS of the electronic device ED may also include an electronic module region in which an electronic module including various components is disposed, and is not limited to any one embodiment.

[0094] According to an embodiment, in a state where the electronic device ED is folded, the distance between the first non-folded region NFA1 and the second non-folded region NFA2 may be less than the radius of a circle defined by the curvature radius of the folded region FA. Here, the folded region FA may be folded in a dumbbell shape, and the distance between the first non-folded region NFA1 and the second non-folded region NFA2 may be reduced. Accordingly, an electronic device ED that becomes thinner in the folded state may be provided.

[0095] Reference Figure 1D , the electronic device ED according to an embodiment may be foldable about a second folding axis FX2 extending in a first direction DR1. The electronic device ED may be folded about the second folding axis FX2 to change to an outer-folded state such that the first display surface FS is exposed to the outside. In an embodiment, the electronic device ED may be configured to repeat an operation from an unfolded operation to an inner-folded operation or an outer-folded operation, or vice versa. However, embodiments of the present invention are not limited thereto.

[0096] Reference Figures 1A to 1D Describing folding about one folding axis (FX1 or FX2) as an example, the number of folding axes and the number of corresponding non-folded regions are not limited thereto. For another example, folding may be performed about a plurality of folding axes such that a part of the first display surface FS and a part of the second display surface RS face each other. In addition, the first folding axis FX1 and the second folding axis FX2, each of which is parallel to the long side of the electronic device ED, are shown, but embodiments are not limited thereto. For another example, the first folding axis FX1 and the second folding axis FX2 may be parallel to the short side of the electronic device ED.

[0097] In the electronic device ED, the first non-folded region NFA1 and the second non-folded region NFA2 may each be defined as a part of the display surfaces FS and RS that are parallel to the plane defined by the first direction axis DR1 and the second direction axis DR2 in the folded state as shown in Figure 1C . The folded region FA may be defined as the region between the first non-folded region NFA1 and the second non-folded region NFA2. The folded region FA may include a curved portion that is curved to have a predetermined curvature in the folded state.

[0098] Figure 2A is a perspective view showing an electronic device according to an embodiment. Figure 2B is a perspective view showing an electronic device according to an embodiment. Figure 2C is a perspective view showing an electronic device according to an embodiment.

[0099] Figures 2A to 2C is a perspective view showing an electronic device ED-a according to another embodiment of the present invention. Figure 2A is a perspective view showing an unfolded state of the electronic device ED-a. Figure 2B and Figure 2C is a perspective view showing a folding operation of the electronic device ED-a. Figure 2B is a perspective view showing Figure 2A the inner folding operation of the electronic device ED-a shown in Figure 2C is a perspective view showing Figure 2A the outer folding operation of the electronic device ED-a shown in

[0100] Referring to Figure 2A , the electronic device ED-a may be foldable about a third folding axis FX3 extending in a first direction DR1. The extending direction of the third folding axis FX3 may be parallel to the extending direction of the short side of the electronic device ED-a.

[0101] The electronic device ED-a may be divided into a folding region FA-a, a first non-folding region NFA1-a adjacent to one side of the folding region FA-a, and a second non-folding region NFA2-a adjacent to the other side of the folding region FA-a. The first non-folding region NFA1-a and the second non-folding region NFA2-a may be spaced apart from each other, and the folding region FA-a is between the first non-folding region NFA1-a and the second non-folding region NFA2-a.

[0102] The folding region FA-a may be a region foldable about the third folding axis FX3. In a folded state of the electronic device ED-a, the folding region FA-a may have a predetermined curvature and a predetermined radius of curvature. The electronic device ED-a may be folded inwardly such that the first non-folding region NFA1-a and the second non-folding region NFA2-a face each other, and the display surface FS-a is not exposed to the outside.

[0103] Referring to Figure 2A , in an embodiment, the display surface FS-a may be visible to a user in an unfolded state (i.e., a non-folded state) of the electronic device ED-a. As shown in reference Figures 1A to 1DAs described, the display surface FS-a of the electronic device ED-a may include an active area F-AAa and a peripheral area F-NAAa. The active area F-AAa may be an area on which an image IM is displayed and capable of detecting various types of external inputs.

[0104] Reference Figure 2B , according to an embodiment, the rear surface RS-a of the electronic device ED-a may be visible to the user in the folded state. For example, the rear surface RS-a may be used as a second display surface for displaying an image. In addition, an electronic module area in which an electronic module including various components is provided may also be provided in the rear surface RS-a. According to an embodiment, the rear surface RS-a of the electronic device ED-a may also include an active area on which an image is displayed.

[0105] Reference Figure 2C , the electronic device ED-a may be folded about a third folding axis FX3 to change to an outward folding state such that an area of the rear surface RS-a overlapping with the first non-folding area NFA1-a and another area of the rear surface RS-a overlapping with the second non-folding area NFA2-a face each other.

[0106] Figure 3 is an exploded perspective view showing an electronic device according to an embodiment. Figure 4 is showing corresponding to Figure 3 a cross-sectional view of a portion corresponding to line I-I' in Figure 5 is a plan view of a display panel according to an embodiment. Features to be described below with respect to the electronic device ED may be applied to the electronic device ED-a described with reference to Figures 2A to 2C described.

[0107] Reference Figure 3 , the electronic device ED may include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a support plate SP, a support portion DE, and a housing HAU.

[0108] The housing HAU may be coupled to the protective layer PF to define the appearance of the electronic device ED. The housing HAU may include a material having relatively high rigidity. For example, the housing HAU may include a plurality of frames and / or a plurality of support plates, each of the plurality of frames and / or the plurality of support plates being made of glass, plastic, or metal. The housing HAU may provide a predetermined accommodation space. The display module DM may be accommodated in the accommodation space to be protected from external impacts.

[0109] The display module DM may be activated in response to an electrical signal. The display module DM may be activated to display an image IM (see Figure 1A ) on a first active area F-AA of the electronic device ED (see Figure 1A) In the display module DM, a display area DM-AA and a non-display area DM-NAA can be defined. The display area DM-AA can be an area that is activated in response to an electrical signal. The non-display area DM-NAA can be an area set adjacent to at least one side of the display area DM-AA. Circuits, lines, etc. for driving the display area DM-AA can be provided in the non-display area DM-NAA.

[0110] The optical layer RPL can be provided between the display module DM and the window WL. The optical layer RPL can be an anti-reflection layer that reduces the reflectance of external light incident from outside the display module DM. The optical layer RPL can be formed on the display module DM through a continuous process. The optical layer RPL can include a polarizer, or can include a color filter layer. For example, the optical layer RPL can include at least one of a retarder, a polarizer, a polarizing film, and a polarizing filter. Optionally, the optical layer RPL can include a plurality of color filters arranged in a predetermined layout and a black matrix adjacent to the color filters.

[0111] The image IM generated in the display module DM (see Figure 1A ) can be transmitted through the window WL to be provided to the user. The window WL can include an optically transparent insulating material. The window WL can include a polymer substrate or a glass substrate.

[0112] The window WL can be made of polyimide, polyacrylate, polymethyl methacrylate, polycarbonate, polyethylene naphthalate, polyvinylidene chloride, polyvinylidene fluoride, polystyrene, ethylene vinyl alcohol copolymer, or a combination thereof.

[0113] However, this is an example, and the materials included in the window WL are not limited to the above materials. For example, the window WL can be a strengthened glass substrate processed through a strengthening treatment. The window WL can include ultra-thin glass (“UTG”).

[0114] The protective layer PF can be a functional layer that protects one surface of the window WL. The protective layer PF can include a polymer film. The protective layer PF can include an anti-fingerprint coating agent, a hard coating agent, an antistatic agent, etc.

[0115] The lower film PM can protect the lower part of the display panel DP. The lower film PM can include a flexible plastic material. For example, the lower film PM can include a polyethylene terephthalate material.

[0116] The support plate SP can be provided below the display panel DP. A part of the support plate SP according to an embodiment of the present invention can be bent to absorb the impact applied between the housing HAU component and the component provided on the support plate SP. In addition, the support plate SP can prevent foreign objects, etc. from being introduced into the components provided on the support plate SP. This will be described later.

[0117] According to an embodiment of the present invention, the support plate SP may include a matrix containing a filler and fiber lines disposed inside the matrix and having a woven shape. The fiber lines may be disposed inside the matrix in a fabric shape.

[0118] The fiber lines may include a reinforced fiber composite material. The reinforced fiber composite material may be at least one of carbon fiber reinforced plastic (“CFRP”) and glass fiber reinforced plastic (“GFRP”). A single strand of fiber included in one fiber line may have a diameter of about 3 micrometers (μm) to about 10 μm.

[0119] The matrix according to an embodiment may include at least one of epoxy resin, polyester, polyamide, polycarbonate, polypropylene, polybutene, and vinyl ester.

[0120] The matrix may include a filler. The filler may include at least one of silica, barium sulfate, sintered talc, barium titanate, titanium oxide, clay, alumina, mica, boehmite, zinc borate, and zinc stannate.

[0121] The electronic device ED according to an embodiment may further include a support part DE disposed on one side of the housing HAU. The support part DE may be disposed at a portion where the support plate SP does not bend. In addition, the support part DE may be disposed on a lower part of the housing HAU adjacent to the bent bending region BA of the display panel DP (see Figure 5 ), thereby preventing an impact applied to the bending region BA (see Figure 5 ).

[0122] The electronic device ED according to an embodiment may further include at least one of a buffer layer and a shielding layer. The buffer layer may prevent the support plate SP from being squeezed or plastically deformed due to external impacts and forces. The buffer layer may include an elastomer such as sponge, foam, or polyurethane resin. The buffer layer may include at least one of an acrylic polymer, a polyurethane-based polymer, a silicone-based polymer, and an imide-based polymer. The shielding layer may be an electromagnetic shielding layer or a heat dissipation layer.

[0123] The electronic device ED according to an embodiment may further include a first adhesive layer AD1 to a fifth adhesive layer AD5. The first adhesive layer AD1 may be disposed between the window WL and the protective layer PF. The second adhesive layer AD2 may be disposed between the optical layer RPL and the window WL. The third adhesive layer AD3 may be disposed between the display module DM and the optical layer RPL. The fourth adhesive layer AD4 may be disposed between the lower film PM and the display module DM. The fifth adhesive layer AD5 may be disposed between the support plate SP and the lower film PM.

[0124] Each of the first adhesive layer AD1 to the fifth adhesive layer AD5 and the adhesive layers to be described later may include a common adhesive such as a pressure-sensitive adhesive (“PSA”), an optically clear adhesive (“OCA”), or an optically clear resin (“OCR”), and is not limited to any one embodiment. In the electronic device ED according to an embodiment, at least one of the first adhesive layer AD1 to the fifth adhesive layer AD5 may be omitted.

[0125] When the electronic device ED is folded, the components of the electronic device ED slide on the adhesive layer. When folded, the components of the electronic device ED slide in a second direction DR2 perpendicular to the first direction DR1 in which the first folding axis FX1 (see Figure 1B ) extends, and in view of this phenomenon, the components constituting the electronic device ED may be arranged to have a predetermined space from the housing HAU so that the components are not affected by the impact of contact with the housing HAU.

[0126] Therefore, a component constituting the electronic device ED such as the display panel DP may be spaced apart from the housing HAU by a predetermined space in the second direction DR2. The predetermined space corresponds to a part of the first peripheral region F-NAA (see Figure 1A ).

[0127] Referring to Figure 4 , the display module DM may include a display panel DP and an input sensing layer ISP provided on the display panel DP. The display panel DP may be a component that generally generates an image. The display panel DP may be a light-emitting display panel. For example, the display panel DP may be an organic light-emitting display panel, an inorganic light-emitting display panel, a micro LED display panel, a micro OLED display panel, or a nano LED display panel.

[0128] The display panel DP may include a base layer BS, a circuit layer DP-CL, a display element layer DP-EL, and a packaging layer TFE stacked in sequence. Although not shown, a functional layer may also be provided between two adjacent layers of the base layer BS, the circuit layer DP-CL, the display element layer DP-EL, and the packaging layer TFE.

[0129] The base layer BS may be a base surface on which the circuit layer DP-CL is provided. The base layer BS may be a flexible substrate capable of being bent, folded, curled, etc. The base layer BS may be a glass substrate, a metal substrate, a polymer substrate, etc. However, the embodiment is not limited thereto, and in another embodiment, the base layer BS may be an inorganic layer, an organic layer, or a composite material layer.

[0130] The base layer BS may include a single layer or multiple layers. For example, the base layer BS may include a first synthetic resin layer, a multi-layer inorganic layer or a single-layer inorganic layer, and a second synthetic resin layer disposed on the multi-layer inorganic layer or the single-layer inorganic layer. Each of the first synthetic resin layer and the second synthetic resin layer may include a polyimide-based resin. Each of the first synthetic resin layer and the second synthetic resin layer may include at least one of an acrylic resin, a methacryloyl-based resin, a polyisoprene-based resin, a vinyl-based resin, an epoxy-based resin, a polyurethane-based resin, a cellulose-based resin, a siloxane-based resin, a polyamide-based resin, and a perylene-based resin. In the present disclosure, a "……-based" resin means a resin including a functional group of "……".

[0131] The circuit layer DP-CL may be disposed on the base layer BS. The circuit layer DP-CL may include an insulating layer, a semiconductor pattern, a conductive pattern, signal lines, etc. The display element layer DP-EL may be disposed on the circuit layer DP-CL. The display element layer DP-EL may include a light-emitting element (not shown). For example, the light-emitting element may include an organic light-emitting material, an inorganic light-emitting material, an organic-inorganic light-emitting material, quantum dots, quantum rods, micro LEDs, or nano LEDs.

[0132] The encapsulation layer TFE may be disposed on the display element layer DP-EL. The encapsulation layer TFE may be disposed on the display element layer DP-EL. The encapsulation layer TFE may protect the display element layer DP-EL from moisture, oxygen, and foreign substances such as dust particles. The encapsulation layer TFE may include at least one inorganic layer. For example, the encapsulation layer TFE may include an inorganic layer, an organic layer, and an inorganic layer stacked in sequence.

[0133] The input sensing layer ISP may be disposed on the display panel DP. The input sensing layer ISP may be directly disposed on the encapsulation layer TFE. Optionally, an adhesive member may be disposed between the input sensing layer ISP and the display panel DP.

[0134] In the present disclosure, when a component is referred to as being directly disposed on another component, this means that no third component is disposed between the one component and the other component. That is, a component being "directly disposed" on another component means that the one component is "in contact" with the other component.

[0135] The input sensing layer ISP may sense an external input to convert the external input into a predetermined input signal and provide the input signal to the display panel DP. For example, the input sensing layer ISP may be a touch sensing layer that senses touch. The input sensing layer ISP may sense direct touch of a user, indirect touch of a user, direct touch of an object, indirect touch of an object, etc.

[0136] The input sensing layer ISP can sense at least one of the position and intensity (pressure) of an externally applied touch. The input sensing layer ISP can have various structures or be made of various materials and is not limited to any one embodiment. For example, the input sensing layer ISP can sense external input by using a capacitive method. The display panel DP can receive an input signal from the input sensing layer ISP and generate an image corresponding to the input signal.

[0137] Reference Figure 5 , the display panel DP can include pixels PX, a scan driver SDV, a data driver DDV, and an emission driver EDV.

[0138] The display panel DP can include a first region AA1, a second region AA2, and a bending region BA between the first region AA1 and the second region AA2. The bending region BA can extend in a first direction DR1, and the first region AA1, the bending region BA, and the second region AA2 can be arranged in a second direction DR2. The bending region BA can be bent around a bending axis extending in the first direction DR1 such that the second region AA2 overlaps the bottom surface of the first region AA1. According to an embodiment, the width of each of the bending region BA and the second region AA2 in the first direction DR1 can be smaller than the width of the first region AA1 in the first direction DR1. Thus, the bending region BA can be easily bent toward the bottom surface of the first region AA1.

[0139] The first region AA1 can include a display region DA and a non-display region NDA around the display region DA. The non-display region NDA can surround the display region DA. The display region DA can be a region for displaying an image, and the non-display region NDA can be a region for not displaying an image. Each of the second region AA2 and the bending region BA can be a region for not displaying an image.

[0140] The first region AA1 can include a first non-fold region NFA1, a second non-fold region NFA2, and a fold region FA arranged in the second direction DR2, and the first non-fold region NFA1, the second non-fold region NFA2, and the fold region FA can be respectively Figure 1A corresponding to the first non-fold region NFA1, the second non-fold region NFA2, and the fold region FA of the electronic device ED shown in

[0141] The first region AA1 can be bent to fold around the above-mentioned fold axis. For example, the fold region FA of the first region AA1 can be folded around the above-mentioned fold axis such that the display panel DP folds.

[0142] The display panel DP may include a plurality of pixels PX, a plurality of scan lines SL1 to SLm, a plurality of data lines DL1 to DLn, a plurality of emission lines EL1 to ELm, a first control line CSL1 and a second control line CSL2, a power line PL, a plurality of connection lines CNL, and a plurality of pads PD. Here, m and n are each natural numbers greater than 1. The pixels PX may be disposed in the display area DA and connected to the scan lines SL1 to SLm, the data lines DL1 to DLn, and the emission lines EL1 to ELm.

[0143] The scan driver SDV and the emission driver EDV may be disposed in the non-display area NDA. Each of the scan driver SDV and the emission driver EDV may be disposed in a non-display area NDA adjacent to each of the opposite sides of the first area AA1 opposite to each other in the first direction DR1. The data driver DDV may be disposed in the second area AA2. The data driver DDV may be manufactured in the form of an integrated circuit chip to be mounted in the second area AA2.

[0144] The scan lines SL1 to SLm may extend in the first direction DR1 to be connected to the scan driver SDV. The data lines DL1 to DLn may extend in the second direction DR2 and be connected to the data driver DDV via the bending area BA. The data driver DDV may be connected to the pixels PX through the data lines DL1 to DLn. The emission lines EL1 to ELm may extend in the first direction DR1 to be connected to the emission driver EDV.

[0145] The power line PL may extend in the second direction DR2 to be disposed in the non-display area NDA. The power line PL may be disposed between the display area DA and the emission driver EDV. The power line PL may extend to the second area AA2 via the bending area BA. The power line PL may extend toward Figure 5 the lower end of the second area AA2 in. The power line PL may receive a driving voltage.

[0146] The connection lines CNL may extend in the first direction DR1 and be arranged in the second direction DR2. The connection lines CNL may be connected to the power line PL and the pixels PX. The driving voltage may be applied to the pixels PX through the power line PL and the connection lines CNL connected to each other.

[0147] The first control line CSL1 may be connected to the scan driver SDV and extend toward the lower end of the second area AA2 via Figure 5 the bending area BA in. The second control line CSL2 may be connected to the emission driver EDV and extend toward the lower end of the second area AA2 via Figure 5 the bending area BA in. The data driver DDV may be disposed between the first control line CSL1 and the second control line CSL2.

[0148] The pad PD can be set to be adjacent to the lower end of the second region AA2 in Figure 5 . The data driver DDV, the power line PL, the first control line CSL1, and the second control line CSL2 can be connected to the pad PD.

[0149] The data lines DL1 to DLn can be respectively connected to the corresponding pads PD through the data driver DDV. For example, the data lines DL1 to DLn can be connected to the data driver DDV, and the data driver DDV can be connected to the pads PD corresponding to the data lines DL1 to DLn respectively.

[0150] Although not shown, the printed circuit board can be connected to the pad PD, and the timing controller and the voltage generator can be provided on the printed circuit board. The timing controller can be fabricated as an integrated circuit chip to be mounted on the printed circuit board. The timing controller and the voltage generator can be connected to the pad PD through the printed circuit board.

[0151] The timing controller can control the operations of each of the scan driver SDV, the data driver DDV, and the emission driver EDV. The timing controller can generate a scan control signal, a data control signal, and an emission control signal in response to control signals received from the outside. The voltage generator can generate a driving voltage.

[0152] The scan control signal can be provided to the scan driver SDV through the first control line CSL1. The emission control signal can be provided to the emission driver EDV through the second control line CSL2. The data control signal can be provided to the data driver DDV. The timing controller can receive an image signal from the outside, convert the data format of the image signal to match the interface specification of the data driver DDV, and provide the signal to the data driver DDV.

[0153] The scan driver SDV can generate a plurality of scan signals in response to the scan control signal. The scan signals can be applied to the pixels PX through the scan lines SL1 to SLm. The scan signals can be sequentially applied to the pixels PX.

[0154] The data driver DDV can generate a plurality of data voltages corresponding to the image signal in response to the data control signal. The data voltages can be applied to the pixels PX through the data lines DL1 to DLn. The emission driver EDV can generate a plurality of emission signals in response to the emission control signal. The emission signals can be applied to the pixels PX through the emission lines EL1 to ELm.

[0155] The pixel PX can receive a data voltage in response to a scan signal. The pixel PX can display an image by emitting light having a luminance corresponding to the data voltage in response to an emission signal. The emission time of the pixel PX can be controlled by the emission signal. Each of the pixels PX can include a transistor, a capacitor, and a light-emitting element connected thereto. Each of the transistors can include a semiconductor pattern. The semiconductor pattern can include polysilicon, amorphous silicon, or metal oxide. The semiconductor pattern can be doped with an n-type dopant or a p-type dopant. The semiconductor pattern can include a heavily doped region and a lightly doped region. The heavily doped region can have higher conductivity than the lightly doped region and generally serves as the source electrode and the drain electrode of the transistor. The lightly doped region can generally correspond to the active (or channel) region of the transistor.

[0156] Figure 6A is an exploded view of a support plate according to an embodiment. Figure 6B is a perspective view of a support plate according to an embodiment. Reference will be made to Figure 6A and Figure 6B The support plate SP described is an embodiment of the support plate SP described with reference to Figure 3 Figure 6A shows the support plate SP in a state before being coupled to the housing HAU (see Figure 3 ), and Figure 6B shows the support plate SP in a state of being coupled to the housing HAU (see Figure 3 ).

[0157] Reference Figure 6A and Figure 6B , the support plate SP according to an embodiment can include a bottom portion S-B facing the lower portion of the housing HAU (see Figure 3 ) and side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C each of which bends from the bottom portion S-B. The side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C according to the present embodiment can face the side portions of the housing HAU (see Figure 3 ). The bottom portion S-B and the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C are generally one component but are described separately for ease of explanation.

[0158] The bottom portion S-B can have a plate shape defined by a first direction DR1 and a second direction DR2. In the present embodiment, each of the corner portions S-M of the bottom portion S-B can have a predetermined curvature and have a rounded shape.

[0159] ​The (1-1) side wall portion S1-U can overlap with the first non-folded area NFA1 of the bottom portion S-B in a plan view and is provided at Figure 6A the upper left end of the bottom portion S-B in. The (1-1) side wall portion S1-U can extend along the long side of the bottom portion S-B in the second direction DR2.

[0160] The (1-2) side wall portion S1-B can overlap with the first non-folded area NFA1 of the bottom portion S-B in a plan view and is provided at Figure 6A the lower left end of the bottom portion S-B in. The (1-2) side wall portion S1-B can extend along the long side of the bottom portion S-B in the second direction DR2. The (1-2) side wall portion S1-B can be spaced apart from the (1-1) side wall portion S1-U in the first direction DR1, and the bottom portion S-B is therebetween.

[0161] The (2-1) side wall portion S2-U can overlap with the second non-folded area NFA2 of the bottom portion S-B in a plan view and is provided at Figure 6A the upper right end of the bottom portion S-B in. The (2-1) side wall portion S2-U can extend along the long side of the bottom portion S-B in the second direction DR2. The (2-1) side wall portion S2-U can be spaced apart from the (1-1) side wall portion S1-U in the second direction DR2, and the folding area FA is therebetween.

[0162] The (2-2) side wall portion S2-B can overlap with the second non-folded area NFA2 of the bottom portion S-B in a plan view and is provided at Figure 6A the lower right end of the bottom portion S-B in. The (2-2) side wall portion S2-B can extend along the long side of the bottom portion S-B in the second direction DR2. The (2-2) side wall portion S2-B can be spaced apart from the (2-1) side wall portion S2-U in the first direction DR1, and the bottom portion S-B is therebetween. The (2-2) side wall portion S2-B can be spaced apart from the (1-2) side wall portion S1-B in the second direction DR2, and the folding area FA is therebetween.

[0163] The third side wall portion S-L can overlap with the first non-folded area NFA1 of the bottom portion S-B and is provided on the left side of the bottom portion S-B in a plan view. The third side wall portion S-L can extend along the short side of the bottom portion S-B in the first direction DR1. According to an embodiment, the width of the third side wall portion S-L in the first direction DR1 can be greater than the width of each of the side wall portions S1-U, S1-B, S2-U, and S2-B in the second direction DR2.

[0164] The fourth side wall portions S-R1 and S-R2 may overlap with the second non-folded region NFA2 of the bottom portion S-B and be disposed on the right side of the bottom portion S-B in a plan view. The fourth side wall portions S-R1 and S-R2 may include a (4-1) side wall portion S-R1 and a (4-2) side wall portion S-R2 that are spaced apart from each other in the first direction DR1. Refer to Figure 5 The bending region BA of the display panel DP described may be disposed between the (4-1) side wall portion S-R1 and the (4-2) side wall portion S-R2.

[0165] According to an embodiment of the present invention, even if the fourth side wall portions S-R1 and S-R2 of the support plate SP are bent from the bottom portion S-B, since the (4-1) side wall portion S-R1 and the (4-2) side wall portion S-R2 are included and spaced apart from each other, the bending region BA (refer to Figure 5 ) of the display panel DP (refer to Figure 5 ) can be easily bent to be accommodated in the housing HAU (refer to Figure 3 ).

[0166] The support plate SP according to the present embodiment may include a fifth side wall portion S-C. The fifth side wall portion S-C may be respectively disposed on the corners S-M of the bottom portion S-B. Since the support plate SP includes the fifth side wall portion S-C, the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C can be bent with a predetermined curvature to be accommodated in the housing HAU (refer to Figure 3 ).

[0167] When the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C are bent from the bottom portion S-B with a predetermined curvature, the stress in the region where the support plate SP is bent can be reduced.

[0168] Figure 7A is a cross-sectional view of a part (e.g., the first non-folded region NFA1) of an electronic device according to an embodiment. Figure 7B is a cross-sectional view of another part (e.g., the second non-folded region NFA2, the bending region BA, and the second region AA2) of an electronic device according to an embodiment. Figure 7A and Figure 7B are cross-sectional views taken by a plane defined by the second direction DR2 and the third direction DR3. Components that are the same / similar as those described with reference to Figures 1A to 6B are denoted by the same / similar reference numerals or symbols, and redundant content will be omitted.

[0169] Together with Figure 6A Refer to Figure 7A and Figure 7B, the electronic device ED according to the embodiment may include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a support plate SP, a support portion DE, and a housing HAU.

[0170] The electronic device ED may further include a printed layer BM. The printed layer BM may be disposed on the bottom surface of the protective layer PF that contacts the first adhesive layer AD1. Optionally, the printed layer BM may be disposed on the top surface or the bottom surface of the window WL. Optionally, the printed layer BM may be disposed along the edge of the protective layer PF and have a predetermined color. The printed layer BM may correspond to the first peripheral area F-NAA (see Figure 1A ). For example, a black pigment or a black dye may be provided to form the printed layer BM.

[0171] The third side wall portion S-L may be bent in a direction from the bottom portion S-B toward the first side portion H-S1 of the housing HAU. Accordingly, the third side wall portion S-L may be disposed between the first side portion H-S1 of the housing HAU and the side surface P-E of the display module DM. The same description as that described with respect to the third side wall portion S-L may be applied to the side wall portions S1-U, S1-B, S2-U, S2-B, and S-C. The portions of the housing HAU facing the side wall portions S1-U, S1-B, S2-U, S2-B, and S-L may be defined as the first side portion H-S1, and the portions of the housing HAU facing the other side wall portions S-R1 and S-R2 may be defined as the second side portion H-S2.

[0172] The electronic device ED may further include a buffer layer CS. In the present embodiment, the buffer layer CS may be disposed between each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, and S-C and the side surface P-E of the display module DM. The buffer layer CS may be in contact with the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, and S-C.

[0173] The buffer layer CS may include an elastomer such as sponge, foam, or polyurethane resin. The buffer layer CS may include at least one of an acrylic polymer, a polyurethane-based polymer, a silicon-based polymer, and an imide-based polymer.

[0174] As shown in Figure 7B , in the bent state, the display panel DP (see Figure 5) The bent region BA can be accommodated in the housing HAU. In the display module DM according to an embodiment of the present invention, step portions D-E can be provided at each of the starting point of the curvature start and the ending point of the curvature end so as to easily perform the bending of the bent region BA. Accordingly, the thickness of the bent region BA of the display module DM can be smaller than the thickness of the display module DM adjacent to the bent region BA. Accordingly, the neutral plane of the bent region BA can be maintained, and the stress applied to the conductive pattern provided in the bent region BA can be minimized.

[0175] The bent region BA can be provided in the internal space where the (4-1) sidewall portion S-R1 and the (4-2) sidewall portion S-R2 are spaced apart from each other in the first direction DR1. Accordingly, even when the sidewall portions S1-U, S1-B, S2-U, S2-B, S-L, S-C, S-R1, and S-R2 of the support plate SP are bent, the interference between the bent region BA and the support plate SP can be minimized.

[0176] The electronic device ED according to an embodiment may further include a panel protective layer CP. The panel protective layer CP can be provided at the lower portion of the support plate SP adjacent to the bent region BA. The panel protective layer CP can maintain the curvature of the bent region BA constant and can compensate for the height difference with the portion provided at the lower portion of the support plate SP of the display module DM due to the bent region BA. The panel protective layer CP can protect the lower portion of the display module DM. The panel protective layer CP can include a flexible plastic material. For example, the panel protective layer CP can include polyethylene terephthalate (“PET”).

[0177] The panel protective layer CP can be coupled to the support plate SP through a sixth adhesive layer AD6 and to the portion of the display module DM provided at the lower portion of the support plate SP through a seventh adhesive layer AD7.

[0178] The electronic device ED according to an embodiment may further include a bending protective layer BAP covering the bent region BA. The bending protective layer BAP according to an embodiment can continuously extend from the portion adjacent to the bent region BA in the first region AA1 to the portion adjacent to the bent region BA in the second region AA2 through the bent region BA. The bending protective layer BAP can be spaced apart from the data driver DDV. The bending protective layer BAP can include an acrylic resin or a polyurethane-based resin.

[0179] The electronic device ED according to an embodiment may further include an insulating tape ITP covering the data driver DDV. The insulating tape ITP can cover a part of the bending protective layer BAP. The insulating tape ITP is not limited to any one as long as it includes an insulating material.

[0180] The support portion DE can be disposed between the bending region BA and the second side portion H-S2 of the housing HAU. In the present embodiment, the support portion DE can include a first portion extending in the third direction DR3 and a second portion protruding from the first portion and extending in the second direction DR2. The first portion and the second portion can be perpendicular to each other. The bending region BA can be disposed between the first portion and the second portion, thereby protecting the bending region BA.

[0181] The housing HAU according to the present embodiment can include a lower portion H-B, side portions H-S1 and H-S2 each extending from the lower portion H-B in the third direction DR3, and protruding portions H-P protruding from each of the side portions H-S1 and H-S2.

[0182] The protruding portion H-P according to the embodiment can include a first surface H-1 facing the top surface of each of the side portions H-S1 and H-S2, a second surface H-2 connecting the first surface H-1 to the outer surface of each of the side portions H-S1 and H-S2, and a third surface H-3 connecting the first surface H-1 to the top surface of each of the side portions H-S1 and H-S2.

[0183] In the present embodiment, the first surface H-1 can extend in the second direction DR2 to be parallel to the top surface of each of the side portions H-S1 and H-S2. According to the embodiment, the angle between the first surface H-1 and the second surface H-2 can be an obtuse angle, and the angle between the first surface H-1 and the third surface H-3 can be a right angle.

[0184] In the present embodiment, a part of the protective layer PF can be disposed on the part of the top surface of each of the side portions H-S1 and H-S2 that is exposed from the protruding portion H-P. Thus, when the electronic device ED is folded, the protective layer PF can be prevented from sliding to the outside of the housing HAU. A part of the printed layer BM can be disposed on each of the side portions H-S1 and H-S2. The top surface of each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C can be in contact with the printed layer BM.

[0185] According to an embodiment of the present invention, since the support plate SP includes the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C, the support portion DE can be not disposed in a region other than the region adjacent to the bending region BA. That is, the support plate SP can replace the existing function of the support portion DE by using the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C.

[0186] Accordingly, the space for providing a separate support part can be reduced to reduce the distance from the outer surface of the housing HAU to the display area DA of the display panel DP (see Figure 5 ). Accordingly, the first peripheral area F-NAA of the electronic device ED (see Figure 5 ) can be effectively reduced. According to an embodiment of the present invention, the distance from the outer surface of the housing HAU to the display area DA of the display panel DP (see Figure 1A ) can be less than about 4.2 millimeters (mm). Figure 5 ) can be less than about 4.2 millimeters (mm). Figure 5 ) can be less than about 4.2 millimeters (mm).

[0187] Figure 8A is an exploded view of a support plate according to an embodiment. Figure 8B is a perspective view of a support plate according to an embodiment. Figure 9A is an exploded view of a support plate according to an embodiment. Figure 9B is a perspective view of a support plate according to an embodiment. The support plates SP-a and SP-b to be described with reference to Figures 8A to 9B are other embodiments of the support plate SP described with reference to Figure 6A and Figure 6B .

[0188] Figure 8A and Figure 9A show the support plates SP-a and SP-b in a state before being coupled to the housing HAU (see Figure 3 ), respectively, and Figure 8B and Figure 9B show the support plates SP-a and SP-b in a state of being coupled to the housing HAU (see Figure 3 ), respectively.

[0189] Referring to Figure 8A and Figure 8B , the support plate SP-a according to an embodiment may include a bottom portion S-B facing the lower portion of the housing HAU (see Figure 3 ) and side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, and S-R2 each bent from the bottom portion S-B. Each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, and S-R2 according to the present embodiment may face the side portion of the housing HAU (see Figure 3 ). The bottom portion S-B and the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, and S-R2 are substantially one component, but are described separately for convenience of explanation.

[0190] The bottom part S-B can have a plate shape defined by a first direction DR1 and a second direction DR2. In the present embodiment, each of the corner portions S-M of the bottom part S-B can be a right angle.

[0191] The (1-1) side wall portion S1-U can overlap with the first non-fold region NFA1 of the bottom part S-B in a plan view and is provided at Figure 8A the upper left end of the bottom part S-B therein. The (1-1) side wall portion S1-U can extend along the long side of the bottom part S-B in the second direction DR2.

[0192] The (1-2) side wall portion S1-B can overlap with the first non-fold region NFA1 of the bottom part S-B in a plan view and is provided at Figure 8A the lower left end of the bottom part S-B therein. The (1-2) side wall portion S1-B can extend along the long side of the bottom part S-B in the second direction DR2. The (1-2) side wall portion S1-B can be spaced apart from the (1-1) side wall portion S1-U in the first direction DR1, and the bottom part S-B is therebetween.

[0193] The (2-1) side wall portion S2-U can overlap with the second non-fold region NFA2 of the bottom part S-B in a plan view and is provided at Figure 8A the upper right end of the bottom part S-B therein. The (2-1) side wall portion S2-U can extend along the long side of the bottom part S-B in the second direction DR2. The (2-1) side wall portion S2-U can be spaced apart from the (1-1) side wall portion S1-U in the second direction DR2, and the folding region FA is therebetween.

[0194] The (2-2) side wall portion S2-B can overlap with the second non-fold region NFA2 of the bottom part S-B in a plan view and is provided at Figure 8A the lower right end of the bottom part S-B therein. The (2-2) side wall portion S2-B can extend along the long side of the bottom part S-B in the second direction DR2. The (2-2) side wall portion S2-B can be spaced apart from the (2-1) side wall portion S2-U in the first direction DR1, and the bottom part S-B is therebetween. The (2-2) side wall portion S2-B can be spaced apart from the (1-2) side wall portion S1-B in the second direction DR2, and the folding region FA is therebetween.

[0195] The third side wall portion S-L may overlap with the first non-folded region NFA1 of the bottom portion S-B and be disposed on the left side of the bottom portion S-B in the plan view. The third side wall portion S-L may extend along the short side of the bottom portion S-B in the first direction DR1. According to an embodiment, the width of the third side wall portion S-L in the first direction DR1 may be greater than the width of each of the side wall portions S1-U, S1-B, S2-U, and S2-B in the second direction DR2.

[0196] The fourth side wall portions S-R1 and S-R2 may overlap with the second non-folded region NFA2 of the bottom portion S-B and be disposed on the right side of the bottom portion S-B in the plan view. The fourth side wall portions S-R1 and S-R2 may include a (4-1) side wall portion S-R1 and a (4-2) side wall portion S-R2 that are spaced apart from each other in the first direction DR1. Refer to Figure 5 The bending region BA of the display panel DP described may be provided between the (4-1) side wall portion S-R1 and the (4-2) side wall portion S-R2.

[0197] According to an embodiment of the present invention, even if the fourth side wall portions S-R1 and S-R2 of the support plate SP are bent from the bottom portion S-B, since the (4-1) side wall portion S-R1 and the (4-2) side wall portion S-R2 are spaced apart from each other, the bending region BA (see Figure 5 ) of the display panel DP (see Figure 5 ) can be easily bent to be accommodated in the housing HAU (see Figure 3 ).

[0198] Since each of the corners S-M of the bottom portion S-B has a vertical shape as shown in Figure 8B , the corresponding side surfaces of adjacent side wall portions among the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, and S-R2 can contact each other when accommodated in the housing HAU (see Figure 3 ).

[0199] According to this embodiment, the angle between each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, and S-R2 and the bottom portion S-B may be vertical. Therefore, the distance from the housing HAU (see Figure 3 ) to each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, and S-R2 can be reduced.

[0200] The support plate SP-b to be referred to in Figure 9A and Figure 9B will mainly be from the reference Figure 8A and Figure 8Bwill be described by the differences of the described support plate SP-a.

[0201] Reference Figure 9A and Figure 9B , according to an embodiment, the support plate SP-b may include a bottom portion S-B facing the lower portion of the housing HAU (see Figure 3 ), and side wall portions S1-U, S1-B, S2-U, S2-B, and S-L each bent from the bottom portion S-B therein. Each of the side wall portions S1-U, S1-B, S2-U, S2-B, and S-L according to the present embodiment may face the side portion of the housing HAU (see Figure 3 ). The bottom portion S-B and the side wall portions S1-U, S1-B, S2-U, S2-B, and S-L are generally one component, but are described separately for ease of explanation.

[0202] Different from the support plate SP-a described with reference to Figure 8A and Figure 8B , the support plate SP-b according to the present embodiment may not include the fourth side wall portions S-R1 and S-R2. Therefore, even when the width of the bending region BA (see Figure 5 ) of the display panel DP (see Figure 5 ) increases in the first direction DR1, the bending region BA (see Figure 5 ) of the display panel DP (see Figure 5 ) can also be easily bent to the lower portion of the support plate SP-b.

[0203] Figure 10A is a cross-sectional view of a part of an electronic device according to an embodiment. Figure 10B is a cross-sectional view of another part of an electronic device according to an embodiment. Figure 10C is a developed view of a plate according to an embodiment. The differences from the electronic device ED described with reference to Figure 7A and Figure 7B will be mainly described.

[0204] Reference Figure 10A and Figure 10B , according to an embodiment, the electronic device ED-1 may include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a plate SP-1, a support portion DE, and a housing HAU. The electronic device ED-1 may further include a buffer layer CS, a panel protective layer CP, and a printed layer BM.

[0205] The electronic device ED-1 may include adhesive layers AD1 to AD8 each disposed between components. Each of the adhesive layers AD1 to AD8 may include a common adhesive such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR), and is not limited to any one embodiment.

[0206] The board SP-1 according to the present embodiment may include a support board SP1 and a lower board SP2 disposed below the support board SP1.

[0207] As Figure 10C shown, the support board SP1 may correspond to the support board SP described in the reference Figure 6A description. Thus, the support board SP1 may include a matrix containing a filler and fiber lines disposed inside the matrix and having a woven shape. The fiber lines may be disposed inside the matrix in a fabric shape.

[0208] The support board SP1 may include a bottom portion S-B facing the lower part of the housing HAU and side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C each of which bends from the bottom portion S-B.

[0209] The lower board SP2 may be coupled to the support board SP1 through a sixth adhesive layer AD6 and to the panel protection layer CP through a seventh adhesive layer AD7. In the present embodiment, the lower board SP2 may include a material different from that of the support board SP1. The lower board SP2 may include a material having a higher stiffness than the material of the support board SP1. For example, the lower board SP2 may include at least one of stainless steel and aluminum. However, the embodiments of the present invention are not limited thereto. For another example, the lower board SP2 may be joined to the support board SP1 by heat fusion, and here, the sixth adhesive layer AD6 may be omitted.

[0210] In the present embodiment, the sum of the thickness of the support board SP1 (e.g., the bottom portion S-B) and the thickness of the lower board SP2 may be about 50 μm to about 250 μm.

[0211] Reference Figure 10C , the lower board SP2 may include a first board SP2-1 overlapping with the first non-folding area NFA1 and a second board SP2-2 overlapping with the second non-folding area NFA2. The first board SP2-1 and the second board SP2-2 may be spaced apart from each other, and the folding area FA is therebetween. The lower board SP2 may have a board shape extending in a first direction DR1 and a second direction DR2.

[0212] In the board SP-1 according to the present embodiment, a lower board SP2 having relatively high rigidity may be disposed below the support board SP1 to supplement the rigidity of the board SP-1. In addition, since the first board SP2-1 and the second board SP2-2 are spaced apart from each other and the folding area FA is therebetween, the folding operation of the electronic device ED-1 can be performed more easily.

[0213] Figure 11A is a cross-sectional view of a part of an electronic device according to an embodiment. Figure 11B is a developed view of a support board according to an embodiment. The differences from the electronic device ED described with reference to Figure 7A and Figure 7B will be mainly described.

[0214] Reference Figure 11A and Figure 11B , the electronic device ED-2 according to an embodiment may include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a support board SP-2, and a housing HAU. The electronic device ED-2 may further include a buffer layer CS and a printed layer BM.

[0215] The electronic device ED-2 may include adhesive layers AD1 to AD5 each disposed between components. Each of the adhesive layers AD1 to AD5 may include a common adhesive such as a pressure-sensitive adhesive (PSA), an optically clear adhesive (OCA), or an optically clear resin (OCR), and is not limited to any one embodiment.

[0216] According to the present embodiment, a plurality of holes S-H may be defined through each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C of the support board SP-2. The holes S-H defined in each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C may be disposed adjacent to the boundary of the bottom portion S-B. The holes S-H may extend in a direction the same as the extending direction of the boundary of the bottom portion S-B. Since each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C includes the holes S-H, the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C can be easily bent when housed in the housing HAU.

[0217] According to an embodiment, the electronic device ED-2 may further include a cover tape TP. The cover tape TP may be disposed on the outside adjacent to the housing HAU of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C to cover the holes S-H. The cover tape TP may prevent foreign substances and the like from being introduced into the holes S-H.

[0218] According to the present embodiment, a buffer layer CS may be disposed between each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C and the side portion H-S1 of the housing HAU. Since each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C includes a hole S-H, the shape of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C may change when the electronic device ED-2 is folded. Here, the buffer layer CS may absorb the impact between each of the side wall portions S1-U, S1-B, S2-U, S2-B, S-L, S-R1, S-R2, and S-C and the housing HAU.

[0219] Figure 12A is a cross-sectional view of a part of an electronic device according to an embodiment. Figure 12B is a perspective view of a support plate and a coupling portion according to an embodiment. Figure 12C is a cross-sectional view of a state where the support plate and the coupling portion according to an embodiment are coupled to each other. The main description will be made with reference to Figure 7A and Figure 7B describe the differences from the electronic device ED.

[0220] Reference Figure 12A and Figure 12B , according to an embodiment, the electronic device ED-3 may include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a support plate SP-3, and a housing HAU. The electronic device ED-3 may further include a buffer layer (not shown) and a printed layer BM.

[0221] Compared with the previous embodiment, according to the present embodiment, the electronic device ED-3 may further include a coupling portion SC coupled to the support plate SP-3.

[0222] Reference Figure 12B , in the present embodiment, the support plate SP-3 may have a rectangular shape extending in a first direction DR1 and a second direction DR2. A plurality of holes S-H1 may be defined in the support plate SP-3 along the edge of the support plate SP-3 and passing through the support plate SP-3. The coupling portion SC may be inserted into and coupled to the holes S-H1.

[0223] The coupling part SC can extend along the edge of the support plate SP-3. The coupling part SC can include a main coupling part SC-1 and a sub-coupling part SC-2. The sub-coupling part SC-2 can be disposed in the second non-foldable area NFA2 and be arranged to be spaced apart from each other in the first direction DR1. The bending area BA (see Figure 5 ) of the display panel DP can be disposed between the sub-coupling parts SC-2.

[0224] The main coupling part SC-1 can include a main body S-B and a protruding part S-P. The main body S-B can extend along the edge of the support plate SP-3. The protruding part S-P can protrude from the main body S-B in a direction opposite to the third direction DR3. The protruding part S-P can be coupled to its corresponding hole S-H1 to stably fix the main body S-B to the support plate SP-3.

[0225] Refer to Figure 12C , the sub-coupling part SC-2 can include a main body S-B, a protruding part S-P, and an additional support part S-S. Each of the sub-coupling parts SC-2 can have a smaller width than the main coupling part SC-1 in the first direction DR1, and thus the coupling force between the sub-coupling part SC-2 and the support plate SP-3 can be weak. Therefore, an additional support part S-S that contacts the side surface S-E of the support plate SP-3 can also be included. The additional support part S-S can protrude from the main body S-B in a direction opposite to the third direction DR3. The coupling part SC can be formed by an insert injection process.

[0226] Figure 13A is a cross-sectional view of a part of an electronic device according to an embodiment. Figure 13B is a perspective view of a support plate according to an embodiment. Figure 14A is a cross-sectional view of a state in which a support plate and a coupling part are coupled to each other according to an embodiment. Figure 14B is a perspective view of a support plate according to an embodiment. The differences from the electronic device ED described with reference to Figure 7A and Figure 7B will be mainly described.

[0227] Refer to Figure 13A and Figure 13B , an electronic device ED-4 according to an embodiment can include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a support plate SP-4, and a housing HAU. The electronic device ED-4 can also include a buffer layer CS and a printed layer BM.

[0228] An electronic device ED-4 according to the present embodiment can also include a coupling part RC coupled to the support plate SP-4.

[0229] Refer to Figure 13B, in the present embodiment, the support plate SP-4 may have a rectangular shape extending in a first direction DR1 and a second direction DR2. A groove S-G extending along the edge of the support plate SP-4 and corresponding to a part removed in a direction from the top surface to the bottom surface of the support plate SP-4 may be defined in the support plate SP-4. A protruding portion S-P of the coupling portion RC may be inserted and coupled to the groove S-G. The protruding portion S-P of the coupling portion RC may have the same shape as the groove S-G.

[0230] The coupling portion RC according to the present embodiment may include a resin. Thus, the resin may be applied along the shape of the groove S-G, and then the process of curing the resin may be repeated to form the coupling portion RC. The coupling portion RC may protrude in a third direction DR3 to have a convex shape.

[0231] Figure 13A The groove S-G recessed into a part of the support plate SP-4 is shown, but the embodiments of the present invention are not limited thereto. For another example, the groove S-G may pass through the entire support plate SP-4 and is not limited to any one embodiment.

[0232] Reference Figure 14A and Figure 14B , grooves S-G1 and S-G2 may be defined in the support plate SP-5, each of the grooves S-G1 and S-G2 extending along the edge of the support plate SP-5 according to the embodiment and corresponding to a part removed in a direction from the top surface to the bottom surface of the support plate SP-5. Protruding portions S-P1 and S-P2 of the coupling portion RC may be inserted and coupled to the grooves S-G1 and S-G2, respectively. The protruding portions S-P1 and S-P2 of the coupling portion RC may respectively have the same shape as the grooves S-G1 and S-G2. Figure 14A Only one side of the support plate SP-5 is shown.

[0233] As Figure 14B shown, the grooves S-G1 and S-G2 may include a first groove S-G1 and a second groove S-G2, wherein the first groove S-G1 is defined to be relatively adjacent to the center of the support plate SP-5, and the second groove S-G2 is arranged to protrude more outward from the center of the support plate SP-5 than the first groove S-G1 and surround the first groove S-G1.

[0234] The resin may be applied along the shape of each of the first groove S-G1 and the second groove S-G2, and then the process of curing the resin may be repeated to form the coupling portion RC. The coupling portion RC may protrude in a third direction DR3 to have a bimodal shape.

[0235] Figure 15It is a cross-sectional view of a part of an electronic device according to an embodiment. Figure 16 It is a cross-sectional view of a part of an electronic device according to an embodiment. Figure 17 It is a cross-sectional view of a part of an electronic device according to an embodiment. Components identical / similar to those described with reference Figure 7A are denoted by the same / similar reference numerals or symbols, and redundant descriptions will be omitted. Differences from the electronic device ED described with reference Figure 7A and Figure 7B will be mainly described.

[0236] Reference Figure 15 , an electronic device ED-A according to an embodiment may include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a plate SP, a support part (not shown), and a housing HAU-A. The electronic device ED-A may further include a buffer layer CS and a printed layer BM.

[0237] The housing HAU-A according to the present embodiment may include a lower part H-B, a side part H-S extending from the lower part H-B in a third direction DR3, and a protruding part H-P protruding from the side part H-S.

[0238] The protruding part H-P according to an embodiment may include a first surface H-1 facing the top surface of the side part H-S, a second surface H-2 connecting the first surface H-1 to the outer surface of the side part H-S, and a third surface H-3 connecting the first surface H-1 to the top surface of the side part H-S.

[0239] In an embodiment, the first surface H-1 may have a predetermined curvature. Thus, when a user observes the electronic device ED-A in the third direction DR3, the aesthetic characteristics of the electronic device ED-A can be improved.

[0240] Reference Figure 16 , an electronic device ED-B according to an embodiment may include a protective layer PF, a window WL, a display module DM, an optical layer RPL, a lower film PM, a plate SP, a support part (not shown), and a housing HAU-B. The electronic device ED-B may further include a buffer layer CS and a printed layer BM.

[0241] The housing HAU-B according to the present embodiment may include a lower part H-B, a side part H-S extending from the lower part H-B in a third direction DR3, and a protruding part H-P protruding from the side part H-S.

[0242] The protruding portion H-P may include a first surface H-1 facing the top surface of the side portion H-S, a second surface H-2 connecting the first surface H-1 to the outer surface of the side portion H-S, and a third surface H-3 connecting the first surface H-1 to the inner surface of the side portion H-S.

[0243] In the present embodiment, the first surface H-1 may extend in the second direction DR2 to be parallel to the top surface of the side portion H-S. According to an embodiment, the angle between the first surface H-1 and the second surface H-2 may be an obtuse angle, and the angle between the first surface H-1 and the third surface H-3 may be a right angle.

[0244] In the present embodiment, the protective layer PF may expose the first surface H-1 of the protruding portion H-P. That is, when observed in the third direction DR3, the protective layer PF may be spaced apart from the first surface H-1 of the protruding portion H-P.

[0245] Reference Figure 17 , according to an embodiment, the buffer layer CS-C may contact the top surface and the inner surface of the third sidewall portion S-L. Figure 17 The third sidewall portion S-L is shown as an example. The buffer layer CS-C may contact the top surface and the inner surface of each of the sidewall portions S1-U, S1-B, S2-U, S2-B, S-R1, S-R2, and S-C described with reference to Figure 6A the sidewall portions S1-U, S1-B, S2-U, S2-B, S-R1, S-R2, and S-C.

[0246] According to the present embodiment, when the electronic device ED-C is folded, collision between the third sidewall portion S-L and the protective layer PF can be prevented.

[0247] According to an embodiment of the present invention, the sidewall portion of the support plate provided at the lower portion of the display module may be bent to support the display module. Accordingly, the space in which a separate support member is provided can be omitted. Accordingly, the dead zone can be reduced to improve the aesthetic characteristics of the electronic device.

[0248] Although embodiments of the present invention have been described, it should be understood that the present invention should not be limited to these embodiments, but various changes and modifications can be made by those of ordinary skill in the art within the spirit and scope of the present invention as claimed in the claims.

[0249] Therefore, the technical scope of the present invention is not limited to the content described in the detailed description of the specification, but should be determined by the claims.

Claims

1. An electronic device, comprising: A display module, comprising: A folding area capable of folding around a folding axis extending in a first direction; and A first non-folding area and a second non-folding area spaced apart from each other in a second direction intersecting the first direction, and the folding area is between the first non-folding area and the second non-folding area; A window disposed on the display module; A protective layer disposed on the window; A support plate disposed below the display module; and A housing that houses the display module and the support plate, wherein the support plate comprises: A bottom portion facing the lower portion of the housing; and Side wall portions, each of the side wall portions bending from the bottom portion to face the side portion of the housing, wherein each of the side wall portions is disposed between the side surface of the display module and the side portion of the housing.

2. The electronic device according to claim 1, wherein, The support plate comprises: A matrix comprising fillers; and A reinforced fiber composite disposed inside the matrix and comprising at least one of a glass fiber reinforced plastic and a carbon fiber reinforced plastic.

3. The electronic device according to claim 1, wherein, The side wall portion bends from the bottom portion with a predetermined curvature.

4. The electronic device according to claim 1, wherein, The angle between each of the side wall portions and the bottom portion is a right angle.

5. The electronic device according to claim 1, further comprising a lower plate disposed below the support plate, Among them, The lower plate has a plate shape extending in the first direction and the second direction.

6. The electronic device according to claim 5, wherein, The lower plate comprises at least one of stainless steel and aluminum.

7. The electronic device according to claim 5, wherein, The lower plate comprises: A first plate overlapping with the first non-folding area; and A second plate spaced apart from the first plate and overlapping with the second non-folding area, and the folding area is between the first plate and the second plate.

8. The electronic device according to claim 5, wherein The sum of the thickness of the bottom portion of the support plate and the thickness of the lower plate is 50 μm to 250 μm.

9. The electronic device according to claim 1, further comprising: A buffer layer disposed between each of the side wall portions and the side surface of the display module, wherein the buffer layer contacts the side wall portion.

10. The electronic device according to claim 1, wherein, Each of the side wall portions defines a plurality of holes adjacent to the boundary with the bottom portion and extending in a direction the same as the extending direction of the boundary.

11. The electronic device according to claim 10, further comprising: A covering tape disposed on the outer side of the side wall portion adjacent to the housing and configured to cover the holes.

12. The electronic device according to claim 10, further comprising: A buffer layer disposed between each of the side wall portions and the side portion of the housing, wherein the buffer layer contacts the side wall portion.

13. The electronic device according to claim 1, further comprising: A buffer layer contacting the top surface and the inner surface of each of the side wall portions.

14. The electronic device according to claim 1, further comprising: A printing layer disposed along the edge of the protective layer and having a predetermined color.

15. The electronic device according to claim 14, wherein, The top surface of each of the side wall portions contacts the printing layer.

16. The electronic device according to claim 1, wherein, The housing further comprises a protruding portion protruding from the top surface of the side portion, wherein the protruding portion comprises: The first surface, facing the top surface of the side portion; The second surface, configured to connect the first surface to the outer surface of the side portion; and The third surface, configured to connect the first surface to the top surface of the side portion, wherein, the angle between the second surface and the first surface is an obtuse angle, and the angle between the third surface and the first surface is a right angle.

17. The electronic device according to claim 16, wherein, The first surface is parallel to the top surface of the side portion.

18. The electronic device according to claim 17, wherein, The first surface and the protective layer do not overlap each other in a plan view.

19. The electronic device according to claim 16, wherein The first surface has a predetermined curvature.

20. The electronic device according to claim 16, wherein The protective layer is provided on the portion of the top surface of the side portion that is exposed from the protruding portion.

21. The electronic device according to claim 1, wherein, The display module includes a first region, a bending region, and a second region arranged in the second direction, wherein the first region includes the first non-folding region, the folding region, and the second non-folding region, wherein, the bending region is bent around a bending axis extending in the first direction such that the second region overlaps the first region in a plan view, wherein, in the first direction, the width of the first region is greater than the width of each of the bending region and the second region.

22. The electronic device according to claim 21, wherein, In a state where the bending region is bent, the side wall portions are spaced apart from each other, and the bending region is between the side wall portions.

23. The electronic device according to claim 21, further comprising: A support portion, provided on the lower portion of the housing adjacent to the bending region.

24. The electronic device according to claim 1, wherein, The side wall portions are not provided in a region overlapping the folding region.

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