Display driving circuit, control method, display substrate, module and device

Abstract

The invention discloses a display driving circuit, a control method, a display substrate, a module and a device, and relates to the technical field of display. The invention provides a display driving circuit. A display substrate comprises a pixel circuit, a driving signal line and a binding pin. The display driving circuit comprises a detection module used for being electrically connected with a tested module of the display substrate through a binding pin, the detection module is used for detecting electric signal data of a test loop, and the test loop comprises a loop formed by electrically connecting the detection module, the binding pin and the tested module; and the display driving module is used for being electrically connected with the pixel circuit and the driving signal line through the binding pins.

Description

Technical Field

[0001] The present disclosure relates to the field of display technologies, and in particular, to a display driving circuit, a control method for a display driving circuit, a display substrate, a display module, and a display device. Background Art

[0002] Currently, with the continuous development of display technologies, the consumer market has increasingly higher requirements for the performance of display products. Generally, display products need to perform a test on the module bonding impedance to determine whether the reliability of the display products meets the requirements. However, the usual bonding impedance test requires manual wiring test operations, and the test stability and test accuracy are poor, and the interception accuracy for poor bonding of display products will be poor. Summary of the Invention

[0003] Embodiments of the present disclosure provide a display driving circuit, a control method, a display substrate, a module, and a device, which can eliminate the intervention of manual operations, save labor costs, and can also eliminate the influence of data fluctuations caused by manual operations, and thus can improve the detection accuracy of the bonding impedance.

[0004] In a first aspect of the present disclosure, a display driving circuit is provided. The display substrate includes a pixel circuit, a driving signal line, and a bonding pin.

[0005] The display driving circuit includes:

[0006] A detection module, configured to be electrically connected to a module under test of the display substrate through the bonding pin. The detection module is configured to detect electrical signal data of a test loop, and the test loop includes a loop formed by electrically connecting the detection module, the bonding pin, and the module under test.

[0007] A display driving module, configured to be electrically connected to the pixel circuit and the driving signal line through the bonding pin.

[0008] In some embodiments, the detection module includes a detection unit, a circuit gating unit, and a charge storage unit.

[0009] The circuit gating unit is electrically connected to the detection unit, the charge storage unit, and the module under test respectively.

[0010] In some embodiments, the circuit gating unit is electrically connected to a reset terminal, and the reset terminal is configured to discharge and reset the charge storage unit through the circuit gating unit.

[0011] In some embodiments, the circuit gating unit includes at least three gating branches, at least three of the gating branches are electrically connected to a gating node, the charge storage unit is connected to the gating node, and at least three of the gating branches are respectively connected to the detection unit, the module under test, and the reset terminal.

[0012] In some embodiments, the circuit gating unit includes a first switching device, a second switching device, and a third switching device;

[0013] One end of the first switching device, one end of the second switching device, and one end of the third switching device are all electrically connected to the gating node;

[0014] The other end of the first switching device is used to be electrically connected to the module under test, the other end of the second switching device is connected to the detection unit, and the other end of the third switching device is connected to the reset terminal;

[0015] One end of the charge storage unit is electrically connected to the gating node, and the other end of the charge storage unit is grounded.

[0016] In some embodiments, the circuit gating unit includes a plurality of transistors; and / or,

[0017] The charge storage unit includes a capacitor; and / or,

[0018] The reset terminal includes a ground terminal.

[0019] In a second aspect of the embodiments of the present application, a control method for a display driving circuit is provided, which is applied to the display driving circuit as described in the first aspect. The control method includes:

[0020] Controlling the detection module to detect electrical signal data of a test loop, where the test loop includes a loop formed by electrically connecting the detection module, a bonding pin, and the module under test;

[0021] Analyzing the detected electrical signal data to determine whether the bonding impedance of the bonding pins of the display substrate is qualified.

[0022] In some embodiments, when the detection module includes a detection unit, a circuit gating unit, and a charge storage unit, and the circuit gating unit includes a first switching device, a second switching device, and a third switching device;

[0023] The controlling the detection module to detect electrical signal data of a test loop includes:

[0024] Controlling the first switching device to close, and controlling the second switching device and the third switching device to open, so that the module under test charges the charge storage unit;

[0025] Control the first switching device and the third switching device to be turned off, and control the second switching device to be turned on, so that the detection unit charges the charge storage unit;

[0026] During the process of the detection unit charging the charge storage unit, the detection unit obtains the detection current and the detection voltage;

[0027] Obtain impedance data according to the detection current and the detection voltage;

[0028] Control the first switching device and the second switching device to be turned off, and control the third switching device to be turned on, so that the charge storage unit discharges and resets.

[0029] In a third aspect of the embodiments of the present application, a display substrate is provided, including: a pixel circuit, a driving signal line, a bonding pin, and a module under test;

[0030] The pixel circuit, the driving signal line, and the module under test are all electrically connected to the bonding pin, and the bonding pin is used to be electrically connected to the display driving circuit as described in the first aspect.

[0031] In some embodiments, the module under test includes a plurality of units under test;

[0032] The unit under test includes some components or conductive structures of the pixel circuit; and / or,

[0033] The unit under test includes the pixel circuit; and / or,

[0034] The unit under test includes other components or conductive structures outside the pixel circuit.

[0035] In some embodiments, a plurality of the units under test are connected in parallel.

[0036] In some embodiments, a first end of the unit under test is used to access a first power signal, a second end of the unit under test is used to access a second power signal, and a third end of the unit under test is electrically connected to a second end of an adjacent connected unit under test;

[0037] The first power signal is greater than the second power signal.

[0038] In some embodiments, the unit under test includes a transistor.

[0039] In some embodiments, gates of all the transistors of the module under test are used to access a first power signal line, and sources are used to access a second power signal line;

[0040] Two adjacent transistors are respectively a first transistor and a second transistor, and a drain of the first transistor is electrically connected to a source of the second transistor;

[0041] A drain of the transistor closest to the detection module after being connected in parallel is electrically connected to a detection bonding pin, and the detection bonding pin is used for electrically connecting to the detection module.

[0042] In some embodiments, a display substrate includes:

[0043] A display area and a non-display area, and the non-display area surrounds the display area;

[0044] The unit under test is located in an edge area of the display area close to the non-display area.

[0045] In some embodiments, the number of units under test in the module under test is greater than or equal to 100.

[0046] A fourth aspect of the embodiments of the present application provides a display module, including:

[0047] The display driving circuit as described in the first aspect; and / or,

[0048] The display substrate as described in the third aspect.

[0049] In some embodiments, the display module includes:

[0050] A flexible circuit board is bonded to a bonding pin of the display substrate, and the display driving circuit is integrated on the flexible circuit board.

[0051] A fifth aspect of the embodiments of the present application provides a display device, including:

[0052] The display module as described in the fourth aspect.

[0053] The display driving circuit provided by the embodiments of the present application, by setting a detection module in the display driving circuit and a module under test in the display substrate, electrically connecting the detection module and the module under test through a bonding pin on the display substrate, and testing the electrical signal data of the loop formed by the detection module, the bonding pin, and the module under test, can realize the test of the bonding impedance of the bonding pin. Due to the setting of the detection module, the display driving circuit can automatically test the bonding impedance without the intervention of manual operation, saving labor costs, and can also eliminate the influence of data fluctuations caused by manual operation, thereby improving the detection accuracy of the bonding impedance. In addition, the detection module is built into the display driving circuit, which can reduce the space for setting detection points on the flexible circuit board, enhance the competitiveness of display products, and can also save special equipment for impedance testing in the display module stage, reducing production and detection costs. Description of the Drawings

[0054] Figure 1 It is a schematic structural diagram of a display module provided by an embodiment of the present application;

[0055] Figure 2 It is a schematic structural diagram of a display substrate provided by an embodiment of the present application;

[0056] Figure 3 It is a schematic block diagram of a display driving circuit provided by an embodiment of the present application;

[0057] Figure 4 It is a schematic block diagram of the connection relationship between a detection module and a display substrate provided by an embodiment of the present application;

[0058] Figure 5 It is a schematic block diagram of a detection module provided by an embodiment of the present application;

[0059] Figure 6 It is a schematic block diagram of another detection module provided by an embodiment of the present application;

[0060] Figure 7 It is a schematic block diagram of yet another detection module provided by an embodiment of the present application;

[0061] Figure 8 It is a schematic connection structure diagram between another module to be measured and a detection module provided by an embodiment of the present application;

[0062] Figure 9 It is a schematic connection structure diagram between yet another module to be measured and a detection module provided by an embodiment of the present application;

[0063] Figure 10 It is a schematic flowchart of a control method for a display driving circuit provided by an embodiment of the present application;

[0064] Figure 11 It is a schematic block diagram of a display device provided by an embodiment of the present application. Detailed Description of the Embodiments

[0065] In order to better understand the technical solutions provided by the embodiments of this specification, the technical solutions of the embodiments of this specification will be described in detail below through the drawings and specific embodiments. It should be understood that the specific features in the embodiments of this specification and the embodiments are detailed descriptions of the technical solutions of the embodiments of this specification, rather than limitations on the technical solutions of this specification. Without conflict, the technical features in the embodiments of this specification and the embodiments can be combined with each other.

[0066] In this text, relational terms such as first and second are only used to distinguish one entity or operation from another entity or operation, and do not necessarily require or imply any actual relationship or order between these entities or operations. Moreover, the term "comprising", "including" or any other variant thereof is intended to cover non-exclusive inclusion, such that a process, method, article or device comprising a series of elements includes not only those elements but also other elements not expressly listed, or elements inherent to such process, method, article or device. Without further limitation, an element defined by the phrase "comprising a..." does not exclude the presence of additional identical elements in the process, method, article or device comprising the element. The term "more than two" includes two or more than two cases.

[0067] Currently, with the continuous development of display technology, the consumer market has higher and higher requirements for the performance of display products. Usually, display products need to perform module binding impedance tests to determine whether the reliability of display products meets the requirements. However, the usual binding impedance test requires manual wiring test operations, and the test stability and test accuracy are poor, and the interception accuracy of poor binding of display products will be poor.

[0068] Exemplarily, a display product may include an LCD (liquid crystal display panel) or an OLED (organic light emitting diode) display panel, and the organic light emitting display panel may include a silicon-based OLED. A display module can be obtained after binding a flexible circuit board to the display panel; a driving chip can be integrated on the flexible circuit board, and the driving chip can also be directly bound to the display panel. After the display panel is bound to the flexible circuit board, there are large fluctuations in the binding impedance of the display panel during the 8585 ring test (temperature 85°C, humidity 85% dynamic test). Currently, the interface used for the display module of the silicon-based OLED is mainly MIPI (Mobile Industry Processor Interface), and the resistance corresponding to the driving signal input pin on the binding pin is calculated, and it is obtained that the MIPI signal input pin has the highest requirement for impedance, and the binding impedance requirement for a single pin can be less than or equal to 7Ω.

[0069] Exemplarily, Table 1 shows the schematic of MIPI line electrical parameters; Table 2 shows the MIPI High Speed Receiver Characteristics. According to the equivalent circuit of the impedance test pin, the binding impedance of the MIPI interface is controlled to be less than or equal to 14Ω, and 14Ω corresponds to the impedance from the whole machine AP (Access Point) input to the binding pin end.

[0070]

[0071] Table 1

[0072]

[0073] Table 2

[0074] In addition, in the display substrate of the glass substrate, the bonding condition can be inspected by a microscope on the back of the glass substrate. However, in the silicon-based display substrate, the light transmittance of the silicon-based substrate is poor, and the bonding condition cannot be observed through the microscope.

[0075] For the above reasons, the display module adds a bonding impedance test, that is, tests the superimposed value of the FPC (flexible printed circuit board) impedance, the FPC bonding impedance, the IC (driver chip) bonding impedance, and the bonding pin impedance of the display panel. Special equipment for impedance testing needs to be customized, and the bonding impedance of the left, middle, and right is controlled by connecting to multiple impedance test points on the FPC. Exemplarily, three groups of impedance test points can be set.

[0076] Figure 1 It is a schematic structural diagram of a display module provided by an embodiment of the present application. Exemplarily, referring to Figure 1 , the display module includes a display substrate 200, a driver chip IC, and a flexible printed circuit board FPC. The driver chip IC and the flexible printed circuit board FPC can be bonded to the display substrate through the bonding pins on the display substrate 200. The connector on the flexible printed circuit board FPC is used to connect to the control main board of the display product. The flexible printed circuit board FPC is provided with test points, and the impedance test points can be copper leakage settings, and the test can be performed by contacting the copper leakage with the test leads of a multimeter.

[0077] Exemplarily, Figure 1 shows 6 impedance test points, numbered 1 to 6 respectively. 1, 2, and 3 are located at the left, middle, and right of the flexible printed circuit board respectively, and the corresponding bonding pins are also distributed at the left, middle, and right positions. 1 and 3 can be used as the first group for testing, 1 and 5 can be used as the second group for testing, and 3 and 5 can be used as the third group for testing. 1 and 2 are the internal trace impedance test points of the FPC corresponding to the first group, 3 and 4 are the internal trace impedance test points of the FPC corresponding to the third group, and 5 and 6 are the internal trace impedance test points of the FPC corresponding to the second group. Taking the first group as an example, impedance test point 1 is the starting point of the test path, and impedance test point 3 is the end point of the test path. Starting from impedance test point 1, the test path passes through the FPC internal trace, FPC bonding, the internal circuit of the driver chip IC, the bonding pin of the driver chip IC, and the FPC internal circuit in sequence, and returns to impedance test point 3. Considering the need to eliminate the influence of the FPC internal circuit, the final bonding impedance tested by the first group is the test value of 1 and 3 minus half of the test value of 1 and 2.

[0078] It can be seen that the traditional method of testing and binding impedance requires the use of a multimeter and manual operation. It is difficult to ensure the consistency of operation factors, which affects the test accuracy and incurs a large amount of labor costs.

[0079] In some embodiments, a display driving circuit is provided. The display driving circuit can be used to drive the display of the display substrate and other driving controls related to the display. Exemplarily, the display substrate may include a pixel circuit, driving signal lines, and bonding pins. The pixel circuit is configured to perform display driving of pixels under the action of driving signals provided by the driving signal lines, and the bonding pins are used to transmit driving signals provided by a circuit board outside the display substrate and feedback signals of the display substrate. Exemplarily, the display substrate may be an array substrate for a liquid crystal display panel or a driving backplane for an OLED panel. For example, a silicon-based display substrate. In the array substrate of a liquid crystal display panel, the pixel circuit can provide an electrical signal to the pixel electrode, and the pixel electrode generates an electric field that can drive the liquid crystal to rotate. The rotation of the liquid crystal can control the light transmittance of the backlight, thereby realizing the display of the picture. In the driving backplane of an OLED panel, the pixel circuit can be electrically connected to the anode of the light-emitting device. The pixel circuit provides an electrical signal to the anode, and the cathode of the light-emitting device receives the cathode signal provided by the driving signal line. The light-emitting layer of the light-emitting device emits light under the action of the cathode and the anode for picture display.

[0080] Exemplarily, the display driving circuit may be an integrated circuit integrated on the display substrate. The display driving circuit may also be a circuit integrated on a chip, that is, a driving chip. The driving chip can be bonded and connected to the bonding pins through a bonding process, and the bonding pins are arranged in the non-display area of the display substrate. The display driving circuit can provide driving signals to the pixel circuit and the scan driving circuit in the display substrate, and the scan driving circuit can provide scan signals to the pixel circuit.

[0081] Exemplarily, the display driving circuit may be integrated on a flexible circuit board. The display driving circuit can be directly integrated on the flexible circuit board. The display driving circuit may also be integrated on the flexible circuit board in the form of a chip, and the embodiments of the present application do not make specific limitations.

[0082] Figure 2 A schematic structural diagram of a display substrate provided by an embodiment of the present application. In some examples, refer to Figure 1, the display substrate 200 includes a display area 210 and a non-display area 220, and the non-display area 220 surrounds the display area 210. A pixel circuit 211 is disposed in the display area 210, and a scan driving circuit 223 and a bonding pin 221 are disposed in the non-display area 220. The display substrate 200 is provided with driving signal lines 222. Some of the driving signal lines 222 may be located in the non-display area 220, and some of the driving signal lines 222 may cross the non-display area 220 and extend to the display area 210. Exemplarily, the driving signal lines 222 may include data signal lines, clock signal lines, frame start signal lines, power supply signal lines, and fixed voltage signal lines, etc. The data signal lines may be connected between the bonding pins and the pixel circuit. The display substrate 200 further includes a module under test 230, and the module under test 230 is electrically connected to the bonding pin 221.

[0083] In some examples, the module under test 230 may be located in the non-display area 220 as shown in Figure 2 .

[0084] In some examples, the module under test 230 may be disposed in the display area 210. Exemplarily, the circuits in the module under test 230 may share some of the pixel circuits, that is, some of the pixel circuits or some of the devices in the pixel circuits may be used as the circuits in the module under test 230.

[0085] Figure 3 This is a schematic structural block diagram of a display driving circuit provided by an embodiment of the present application. In some examples, referring to Figure 3 , the display driving circuit 100 may include: a detection module 110 and a display driving module 120. The detection module 110 is used to be electrically connected to the module under test 230 of the display substrate 200 through the bonding pin 221. The detection module 110 is used to detect the electrical signal data of the test loop. The test loop includes the loop formed by electrically connecting the detection module 110, the bonding pin 221, and the module under test 230. If the bonding pin 221 and the module under test 230 are connected in the test loop, the bonding impedance of the bonding pin 221 can be measured through the test loop. The display driving module 120 is used to be electrically connected to the pixel circuit and the driving signal lines 222 through the bonding pin 221. The display driving module 120 can provide driving signals to the driving signal lines 222, and the driving signal lines 222 transmit the driving signals to the scan driving circuit 223, the pixel circuit 211, etc., so as to realize the display driving of the picture on the display substrate.

[0086] In some examples, bonding pins are also disposed in the display driving circuit 100, and the bonding pins of the display driving circuit 100 are bonded to the bonding pins of the display substrate to realize the connection between the display driving circuit and the display substrate.

[0087] In some examples, bonding pins can be provided on a flexible circuit board. The bonding pins of the flexible circuit board are bonded and connected to the bonding pins of the display substrate. The display driving circuit can be integrated on the flexible circuit board, or the display driving circuit can be bonded to the flexible circuit board. The embodiments of the present application do not make specific limitations.

[0088] For the display driving circuit provided by the embodiments of the present application, by providing a detection module in the display driving circuit and a module to be measured in the display substrate, and electrically connecting the detection module and the module to be measured through the bonding pins on the display substrate, the bonding impedance of the bonding pins can be tested by measuring the electrical signal data of the loop formed by the detection module, the bonding pins, and the module to be measured. Due to the setting of the detection module, the display driving circuit can automatically test the bonding impedance without the intervention of manual operation, saving labor costs and eliminating the influence of data fluctuations caused by manual operation, thereby improving the detection accuracy of the bonding impedance. In addition, the detection module is built into the display driving circuit, which can reduce the space for setting detection points on the flexible circuit board, enhance the competitiveness of the display product, and also save the dedicated equipment for impedance testing in the display module stage, reducing the production and detection costs.

[0089] Exemplarily, whether the display driving circuit is integrated on the flexible circuit board or the display driving circuit and the flexible circuit board are separately bonded to the display substrate, the detection loop can pass through the detection line impedance of the flexible circuit board, the bonding impedance of the flexible circuit board, the bonding impedance of the display driving circuit, and the bonding impedance of the display substrate.

[0090] Exemplarily, when the display driving circuit is integrated on the flexible circuit board, and the bonding of the display substrate is only with the flexible circuit board, the detection path can be the integrated impedance of the display driving circuit, the line impedance of the flexible circuit board, and the bonding impedance between the flexible circuit board and the display substrate.

[0091] Figure 4 This is a schematic structural block diagram of the connection relationship between a detection module and a display substrate provided by the embodiments of the present application. In some embodiments, referring to Figure 4 , the detection module 110 includes a detection unit 111, a circuit gating unit 112, and a charge storage unit 113; the circuit gating unit 112 is electrically connected to the detection unit 111, the charge storage unit 113, and the module to be measured 230 respectively. Between the module to be measured 230 and the gating unit 112, there are corresponding bonding pins 221. The gating unit 112 can control the connection between the module to be measured 230 and the detection unit or the connection between the module to be measured 230 and the charge storage unit 113. The gating unit 112 can be used to switch different connection paths.

[0092] Figure 5Schematic structural block diagram of a detection module provided by an embodiment of the present application. In some examples, a reset terminal 114 is electrically connected to the circuit gating unit 112, and the reset terminal is used to discharge and reset the charge storage unit 113 through the circuit gating unit 112. The gating unit 112 can switch the communication path with the detection unit 111, the charge storage unit, or the reset terminal 114.

[0093] In some embodiments, the circuit gating unit includes at least three gating branches, and the at least three gating branches are all electrically connected to a gating node. The charge storage unit is connected to the gating node, and the at least three gating branches are respectively connected to the detection unit, the module under test, and the reset terminal.

[0094] Figure 6 Schematic structural block diagram of another detection module provided by an embodiment of the present application. In some examples, refer to Figure 6 , the gating unit 112 may include a first gating branch 112-1, a second gating branch 112-2, and a third gating branch 112-3. The three gating branches and the charge storage unit 113 are all connected to the gating node S. The first gating branch 112-1 is electrically connected to the module under test 230, the second gating branch 112-2 is electrically connected to the detection unit 111, and the third gating branch 112-3 is electrically connected to the reset terminal 114.

[0095] Figure 7 Schematic structural block diagram of yet another detection module provided by an embodiment of the present application. In some embodiments, refer to Figure 7 , the circuit gating unit includes a first switching device 112-4, a second switching device 112-5, and a third switching device 112-6; the first switching device 112-4 is located in the first gating branch 112-1, the second switching device 112-5 is located in the second branch 112-2, and the third switching device 112-6 is located in the third gating branch 112-3.

[0096] Exemplarily, refer to Figure 7 , the charge storage unit 113 may include a capacitor C, and the reset terminal 114 may be a ground terminal GND.

[0097] Refer to Figure 7 , one end of the first switching device 112-4, one end of the second switching device 112-5, and one end of the third switching device 112-6 are all electrically connected to the gating node S; the other end of the first switching device 112-4 is used to be electrically connected to the module under test 230, the other end of the second switching device 112-5 is electrically connected to the detection unit 111, and the other end of the third switching device 112-6 is electrically connected to the reset terminal 114; one end of the charge storage unit 113 is electrically connected to the gating node S, and the other end of the charge storage unit 113 is grounded, that is, one end of the capacitor C is connected to the gating node S, and the other end is connected to the ground terminal GND.

[0098] In some examples, the circuit gating unit includes multiple transistors. The switching device in the gating branch can be a transistor. Using a transistor as a switch allows for more precise control and a faster response speed.

[0099] In some embodiments, referring to Figures 2 to 7 , a display substrate is provided, including: a pixel circuit 211, a driving signal line 222, a bonding pin 221, and a module under test 230; the pixel circuit 211, the driving signal line 222, and the module under test 230 are all electrically connected to the bonding pin 221, and the bonding pin 221 is used to be electrically connected to the display driving circuit 100 provided in any of the above embodiments.

[0100] In some examples, in combination with Figure 7 , the module under test 230 of the display substrate 200 is electrically connected to the detection module 110 through the bonding pin 221. Specifically, the module under test 230 is electrically connected to the first switching device 112-4 through the bonding pin.

[0101] In some embodiments, the module under test includes multiple units under test, and the multiple units under test are connected in parallel with each other. Connecting the multiple units under test in parallel can be equivalent to multiple resistors connected in parallel, which can be equivalent to an amplifier circuit. The number of units under test connected in parallel can be regarded as the amplification factor, which can increase the value of the detected electrical signal data, thereby facilitating data analysis and detection.

[0102] Figure 8 This is a schematic connection structure diagram of another module under test and a detection module provided by an embodiment of the present application. In some embodiments, referring to Figure 8 , the first end 201 of the unit under test 231 is used to access the first power supply signal V1, the second end 202 of the unit under test 231 is used to access the second power supply signal V2, and the third end 203 of the unit under test 231 is electrically connected to the second end 202 of the adjacent unit under test 231; the first power supply signal V1 is greater than the second power supply signal V2.

[0103] Exemplarily, the first power supply signal V1 can be a positive voltage constant power supply signal. In a liquid crystal display panel, the second power supply signal V2 can be a common voltage signal. In an OLED display substrate, the second power supply signal V2 can also be a cathode voltage signal.

[0104] Referring to Figure 8, to achieve the automatic test of the bonding impedance of the display substrate, a module under test can be set on the display substrate. The module under test includes multiple units under test. The first end 201 of the unit under test 231 is used to access the first power signal V1, the second end 202 of the unit under test 231 is used to access the second power signal V2, and the third end 203 of the unit under test 231 is electrically connected to the second end 202 of the adjacent connected unit under test 231; the third end 203 of the last unit under test connected in parallel is directly connected to the bonding pin, so the current at the third end 203 of the last unit under test can be the detection current Itest, that is, the detection current Itest detected by the detection unit 111 is the current flowing through the third end 203 of the last unit under test.

[0105] In some embodiments, the unit under test includes some components or conductive structures of the pixel circuit. The units under test can share some components in the pixel circuit; the units under test can also share some conductive structures in the pixel circuit, such as electrodes or connection structures, etc.

[0106] In some embodiments, the unit under test includes a complete pixel circuit. Sharing the unit under test with the pixel circuit can avoid additional circuit layouts, and thus avoid occupying additional layout space.

[0107] In some embodiments, the unit under test includes other components or conductive structures outside the pixel circuit, such as an additional set circuit or device, etc.

[0108] In some embodiments, the unit under test is located in the edge area of the display area close to the non-display area. In the case where the unit under test shares part or all of the pixel circuit, the unit under test can share the pixel circuit at the edge of the display area, which can avoid signal interference caused by too long circuit connection lines and improve the detection accuracy.

[0109] In some embodiments, the unit under test includes a transistor.

[0110] In some examples, the unit under test can include one or more transistors, and the transistor includes a gate, a source, and a drain.

[0111] Figure 9 Another schematic connection structure diagram of the module under test and the detection module provided by the embodiment of the present application. In some examples, refer to Figure 9, the gates G of all the transistors of the module under test 230 are used to connect to the first power signal line V1, and the sources S are used to connect to the second power signal line V2; two adjacent transistors are the first transistor T1 and the second transistor T2 respectively, and the drain D of the first transistor T1 is electrically connected to the source S of the second transistor T2; the drains D of the transistors that are connected in parallel and are closest to the detection module 230 are electrically connected to the detection binding pins, and the detection binding pins are used to connect to the detection module. The detection binding pins are the binding pins 221 connected to the module under test 230.

[0112] In some embodiments, the number of units under test in the module under test is greater than or equal to 100. Then the electrical signal detected by the test loop is 100 times or more of the electrical signal of a single unit under test, which can achieve the effect of amplifying the electrical signal by more than 100 times.

[0113] Exemplarily, the detection accuracy of a single unit under test using a pixel circuit is of the order of 10e -9 order of magnitude, and the detection accuracy of the driving chip is of the order of 10e -7 order of magnitude, with a difference of 100 times. Then, by setting the number of units under test in the module under test to at least 100 and connecting them in parallel, the effect of amplifying by 100 times or more than 100 times can be achieved. The more the number of detection units, the greater the amplification factor and the higher the detection accuracy, which can improve the detection accuracy of the display driving circuit.

[0114] Figure 10 This is a schematic flowchart of a control method for a display driving circuit provided by an embodiment of the present application. In some embodiments, a control method for a display driving circuit is provided, which can be applied to the display driving circuit provided in any of the above embodiments. Refer to Figure 10 , the control method of the display driving circuit includes:

[0115] S301: Control the detection module to detect the electrical signal data of the test loop, where the test loop includes a loop formed by electrically connecting the detection module, the binding pins, and the module under test.

[0116] Exemplarily, in combination with Figure 4 , the detection unit 111 can detect the electrical signal data of the test loop under the control of computer program instructions. The detection loop includes the conduction path of the binding pins 221 and the module under test 230. The computer program instructions can be a control program pre-stored in the display driving loop, and can be used to control the detection operation of the detection unit 111 after being called by the processor.

[0117] S302: Analyze the detected electrical signal data to determine whether the binding impedance of the binding pins of the display substrate is qualified.

[0118] Exemplarily, under the control of computer program instructions, the detection unit 111 analyzes the electrical signal data to determine whether the bonding impedance of the bonding pins meets the requirements. The operation of analyzing the data can also be performed by other modules, not limited to the detection unit.

[0119] In some embodiments, when the detection module includes a detection unit, a circuit gating unit, and a charge storage unit, and the circuit gating unit includes a first switching device, a second switching device, and a third switching device;

[0120] Step S301 may include:

[0121] Control the first switching device to close, and control the second and third switching devices to open, so that the module under test charges the charge storage unit.

[0122] Exemplarily, referring to Figure 8 , control the first switching device 112-4 to close, that is, turn on, and control the second switching device 112-5 and the third switching device 112-6 to open. The first gating branch 112-1 is turned on, and the second and third gating branches 112-2 and 112-3 are turned off. Then, the detection current Itest generated by the circuit after multiple units under test 231 are connected in parallel under the action of the first power signal V1 and the second power signal V2 charges the capacitor C.

[0123] Control the first and third switching devices to open, and control the second switching device to close, so that the detection unit charges the charge storage unit.

[0124] Exemplarily, in combination with Figure 8 , after the voltage across the capacitor C reaches the minimum detection accuracy of the detection unit 111, control the first switching device 112-4 to open, keep the third switching device 112-6 open, and control the second switching device 112-5 to close. At this time, the first and third gating branches are turned off, and the second gating branch is turned on. The detection unit 111 can continue to charge the capacitor C.

[0125] During the process of the detection unit charging the charge storage unit, the detection unit obtains a detection current and a detection voltage.

[0126] Exemplarily, the capacitance value C of the capacitor C is 40 nF, and the current detection accuracy I of the detection unit 111 is 10 -7 A. The charge amount Q of the capacitor C within the unit time of 1 s is Q = 10 -7 A × 1 s. Also, Q = CU = 4 × 10 -8 A × U. Then, the voltage U across the capacitor is U = 2.5 V, that is, the detection voltage is U.

[0127] Obtain impedance data based on the detection current and the detection voltage;

[0128] Exemplarily, for the detection current Itest obtained by the detection unit 111 through testing the detection loop, the binding impedance R = U÷Itest can be obtained, and then the test value R of the binding impedance can be obtained.

[0129] Control the first switch device and the second switch device to disconnect, and control the third switch device to close to discharge and reset the charge storage unit.

[0130] Exemplarily, in combination with Figure 8 , control the first gating branch and the second gating branch to disconnect, control the third gating branch to conduct, then both ends of the capacitor C are grounded, and after the capacitor C discharges, it is reset for the next detection. The above detection steps can be cycled, and the detection frequency can be set through the register.

[0131] In some embodiments, a display module is provided, including: the display driving circuit provided in any of the above embodiments.

[0132] In some embodiments, a display module is provided, including: the display substrate provided in any of the above embodiments.

[0133] In some embodiments, the display module may include a flexible circuit board, the flexible circuit board is bound and connected to the binding pins of the display substrate, and the display driving circuit is integrated on the flexible circuit board.

[0134] In some examples, the display module includes two groups of binding pins. One group of binding pins can be bound and connected to the driving chip, and the other group of binding pins can be bound and connected to the flexible circuit board. Then, the driving chip and the flexible circuit board are respectively bound and connected to the display substrate.

[0135] In the module provided by the embodiment of the present application, by setting a detection module in the display driving circuit and a module to be measured in the display substrate, the detection module and the module to be measured are electrically connected through the binding pins on the display substrate. By testing the electrical signal data of the loop formed by the detection module, the binding pins and the module to be measured, the test of the binding impedance of the binding pins can be realized. Due to the setting of the detection module, the automatic test of the binding impedance by the display driving circuit can be realized, without the intervention of manual operation, saving labor costs, and the data fluctuation influence caused by manual operation can also be eliminated, thereby improving the detection accuracy of the binding impedance. In addition, the detection module is built into the display driving circuit, which can reduce the space for setting detection points on the flexible circuit board, enhance the competitiveness of the display product, and also save the special equipment for impedance testing in the display module stage, reducing the production and detection costs.

[0136] Figure 11 This is a schematic structural block diagram of a display device provided by an embodiment of the present application. In some embodiments, refer toFigure 11 , a display device is provided, including: the display module 1000 provided in any of the above embodiments.

[0137] In the device provided by the embodiments of the present application, by setting a detection module in the display driving circuit and a module to be measured in the display substrate, and electrically connecting the detection module and the module to be measured through the bonding pins on the display substrate, the electrical signal data of the loop formed by testing the detection module, the bonding pins and the module to be measured can be used to test the bonding impedance of the bonding pins. Due to the setting of the detection module, the automatic testing of the bonding impedance by the display driving circuit can be realized, without the intervention of manual operation, saving labor costs, and the data fluctuation influence caused by manual operation can also be eliminated, thereby improving the detection accuracy of the bonding impedance. In addition, the detection module is built in the display driving circuit, which can reduce the space for setting detection points on the flexible circuit board, enhance the competitiveness of the display product, and can also save the special equipment for impedance testing in the display module stage, reducing the production and detection costs.

[0138] It should be noted that the display device provided by the examples of the present disclosure may include a smart phone, a tablet computer, a notebook computer, a television, a smart wearable display device, etc. The smart wearable display device may include a smart watch, VR (augmented reality) display, AR (virtual reality) display, etc. The embodiments of the present disclosure do not make specific limitations.

[0139] The above embodiments are only used to illustrate the technical solutions of the present disclosure, rather than to limit them; although the present disclosure has been described in detail with reference to the foregoing embodiments, those of ordinary skill in the art should understand that: they can still modify the technical solutions recorded in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions of the embodiments of the present disclosure.

[0140] Although the preferred embodiments of this specification have been described, those skilled in the art can make additional changes and modifications once they know the basic creative concept. Therefore, the appended claims are intended to be construed to include the preferred embodiments and all changes and modifications falling within the scope of this specification.

[0141] Obviously, those skilled in the art can make various changes and modifications to this specification without departing from the spirit and scope of this specification. Thus, if these modifications and variations of this specification fall within the scope of the claims of this specification and their equivalent technologies, this specification is also intended to include these modifications and variations.

Claims

1. A display driving circuit, characterized in that, The display substrate includes a pixel circuit, a driving signal line, and a bonding pin; The display driving circuit includes: A detection module for electrically connecting to a module under test of the display substrate through the bonding pin. The detection module is used to detect the electrical signal data of a test loop, and the test loop includes a loop formed by electrically connecting the detection module, the bonding pin, and the module under test; A display driving module for electrically connecting to the pixel circuit and the driving signal line through the bonding pin.

2. The display driving circuit according to claim 1, wherein The detection module includes a detection unit, a circuit gating unit, and a charge storage unit; The circuit gating unit is electrically connected to the detection unit, the charge storage unit, and the module under test respectively.

3. The display driving circuit according to claim 2, wherein The circuit gating unit is electrically connected to a reset terminal, and the reset terminal is used to discharge and reset the charge storage unit through the circuit gating unit.

4. The display driving circuit according to claim 3, wherein The circuit gating unit includes at least three gating branches. At least three of the gating branches are all electrically connected to a gating node. The charge storage unit is connected to the gating node. At least three of the gating branches are respectively connected to the detection unit, the module under test, and the reset terminal.

5. The display driving circuit according to claim 3, wherein The circuit gating unit includes a first switching device, a second switching device, and a third switching device; One end of the first switching device, one end of the second switching device, and one end of the third switching device are all electrically connected to the gating node; The other end of the first switching device is used to be electrically connected to the module under test. The other end of the second switching device is connected to the detection unit. The other end of the third switching device is connected to the reset terminal; One end of the charge storage unit is electrically connected to the gating node, and the other end of the charge storage unit is grounded.

6. The display driving circuit according to claim 3, wherein The circuit gating unit includes a plurality of transistors; and / or, The charge storage unit includes a capacitor; and / or, The reset terminal includes a ground terminal.

7. A control method for a display driving circuit, characterized in that, Applying the display driving circuit according to any one of claims 1 to 6, the control method includes: Controlling the detection module to detect the electrical signal data of the test loop, wherein the test loop includes a loop formed by electrically connecting the detection module, the bonding pin, and the module under test; Analyzing the detected electrical signal data to determine whether the bonding impedance of the bonding pin of the display substrate is qualified.

8. The control method of the display driving circuit according to claim 7, wherein In the case where the detection module includes a detection unit, a circuit gating unit, and a charge storage unit, and the circuit gating unit includes a first switching device, a second switching device, and a third switching device; The controlling the detection module to detect the electrical signal data of the test loop includes: Controlling the first switching device to close, and controlling the second switching device and the third switching device to open, so that the module under test charges the charge storage unit; Control the first switching device and the third switching device to be turned off, and control the second switching device to be turned on, so that the detection unit charges the charge storage unit; During the process of the detection unit charging the charge storage unit, the detection unit obtains the detection current and the detection voltage; Obtain impedance data according to the detection current and the detection voltage; Control the first switching device and the second switching device to be turned off, and control the third switching device to be turned on, so that the charge storage unit discharges and resets.

9. A display substrate, characterized in that, Comprising: A pixel circuit, a driving signal line, a bonding pin, and a device under test module; The pixel circuit, the driving signal line, and the device under test module are all electrically connected to the bonding pin, and the bonding pin is used to be electrically connected to the display driving circuit according to any one of claims 1 to 6.

10. The display substrate according to claim 9, wherein: The device under test module includes a plurality of devices under test; The device under test includes some components or conductive structures of the pixel circuit; and / or, The device under test includes the pixel circuit; and / or, The device under test includes other components or conductive structures outside the pixel circuit.

11. The display substrate according to claim 10, wherein: A plurality of the devices under test are connected in parallel.

12. The display substrate according to claim 11, wherein: A first end of the device under test is used to access a first power signal, a second end of the device under test is used to access a second power signal, and a third end of the device under test is electrically connected to a second end of an adjacent device under test; The first power signal is greater than the second power signal.

13. The display substrate according to claim 10, wherein: The device under test includes a transistor.

14. The display substrate according to claim 13, wherein: The gates of all the transistors in the device under test module are used to access a first power signal line, and the sources are used to access a second power signal line; Two adjacent transistors are a first transistor and a second transistor respectively, and a drain of the first transistor is electrically connected to a source of the second transistor; The drain of the transistor closest to the detection module after being connected in parallel is electrically connected to a detection bonding pin, and the detection bonding pin is used to be electrically connected to the detection module.

15. The display substrate according to claim 10, wherein Comprising: A display area and a non-display area, the non-display area surrounds the display area; The device under test is located in an edge area of the display area close to the non-display area.

16. The display substrate according to claim 10, wherein: The number of the devices under test in the device under test module is greater than or equal to 100.

17. A display module, characterized in that, Comprising: The display driving circuit according to any one of claims 1 to 6; and / or, The display substrate according to any one of claims 9 to 16.

18. The display module according to claim 17, comprising: A flexible circuit board, which is bonded and connected to the bonding pin of the display substrate, and the display driving circuit is integrated on the flexible circuit board.

19. A display device, characterized in that, Comprising: The display module according to claim 17 or 18.

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