Manufacturing method of keyboard backlight module

Abstract

The invention relates to the field of keyboard manufacturing methods, in particular to a manufacturing method of a keyboard backlight module. The manufacturing method comprises the following steps: S1, manufacturing a circuit board, and forming a conductive circuit and a bonding pad on the circuit board; s2, the circuit board is placed uprightly, a bonding pad is made to face upwards, then the electrode face of the light-emitting chip is made to face downwards, and a P-type semiconductor electrode and an N-type semiconductor electrode of the light-emitting chip are made to be placed at the corresponding positions of the bonding pad; s3, the light-emitting chip and the bonding pad are welded together through a reflow soldering procedure, and electric connection between the light-emitting chip and the bonding pad is achieved; s4, fully coating the light-emitting chip in the glue layer through a gluing and packaging process; and S5, through baking or ultraviolet curing, enabling the adhesive layer to form a packaging layer with a certain thickness and strength. The production process is simplified, and the cost is saved. The prepared backlight module is light and thin in structure, high in light emitting efficiency and uniform in light emitting, and partition dynamic dimming can be achieved.

Description

Technical Field

[0001] The present invention relates to the field of keyboard manufacturing methods, and in particular to a manufacturing method of a keyboard backlight module. Background Art

[0002] With the continuous development of electronic products, users' requirements for the appearance and functionality of keyboards are increasing day by day. As an important function to enhance the keyboard usage experience, keyboard backlighting can facilitate users to identify key characters in a dimly lit environment and enhance the visual effect of the keyboard.

[0003] For traditional keyboard backlight modules, LED devices are used as light sources, and one or several LEDs are soldered on the FPC under each keycap. About 100 - 120 LEDs need to be soldered on the entire FPC. In this way, the light-emitting chips need to be soldered on the metal brackets in advance, and then the LEDs are made through processes such as baking, wire bonding, baking, encapsulation, baking, stripping, testing, and packaging. This increases the LED packaging process, raises the production cost, and due to the large volume of the LEDs, it limits the thin and light design of the keyboard backlight module and the uniformity of light emission.

[0004] For another solution of traditional keyboard backlight modules, in addition to the process of making LEDs in advance, several LED lights are soldered on the light strip, and the light enters from the side. The light is diffused to the corresponding areas of the keyboard keycaps through the light guide plate. The light diffusion is insufficient at positions far from the light strip, especially dark areas are easily formed at the edges of the module, and there is over-brightness at positions close to the light strip, making it difficult to adjust the light effect to achieve uniform light output on the keyboard; at the same time, the emitted light color is single and zoned dynamic dimming cannot be achieved.

[0005] In summary, traditional keyboard backlight modules require processes such as die bonding, baking, wire bonding, baking, encapsulation, baking, stripping, testing, and packaging for LED encapsulation in advance. The product structure is complex, which affects the efficiency and raises the production cost. Summary of the Invention

[0006] To solve the deficiencies of the prior art described in the background art, the present invention provides a manufacturing method of a keyboard backlight module. The present invention simplifies the production process and saves costs. Moreover, the backlight module prepared by the present invention has a thin and light structure, high luminous efficiency, uniform light emission, and can achieve zoned dynamic dimming.

[0007] The technical solution adopted by the present invention to solve its technical problems is:

[0008] A manufacturing method of a keyboard backlight module includes the following steps:

[0009] S1. Fabricate a circuit board, and form conductive lines and pads on the circuit board;

[0010] S2. Place the circuit board face up so that the pads are facing up, then place the light-emitting chip with its electrode side facing down, and position the P-type semiconductor electrode and N-type semiconductor electrode of the light-emitting chip at the corresponding positions on the pads.

[0011] S3. Through the reflow soldering process, solder the light-emitting chip to the pads to achieve electrical connection between the light-emitting chip and the pads.

[0012] S4. Through the glue coating and encapsulation process, completely encapsulate the light-emitting chip within the glue layer.

[0013] S5. Through baking or ultraviolet curing, make the glue layer form an encapsulation layer with a certain thickness and strength.

[0014] S6. Lay the light guide plate on the substrate so that the light-emitting chip and the encapsulation layer are placed in the corresponding lamp grooves.

[0015] S7. Lay the light-shielding sheet on the light guide plate and connect the light-shielding sheet to the four peripheral edges of the circuit board.

[0016] S8. Inspect the installed keyboard backlight module.

[0017] Specifically, in step S1, the circuit board etches the circuit pattern on the flexible substrate through the FPC process to form conductive lines and pads.

[0018] Specifically, the pads are coated with die bonding solder, and when soldering, the die bonding solder is melted to achieve the soldering of the light-emitting chip to the pads.

[0019] Specifically, the glue layer is resin glue or silicone glue.

[0020] Specifically, the light-shielding sheet is bonded to the four peripheral edges of the circuit board through double-sided tape.

[0021] Specifically, in step S8, a test device and a jig are used to conduct electrical detection and light efficiency detection on the backlight module.

[0022] The beneficial effects of the present invention are as follows: The present invention provides a manufacturing method for a keyboard backlight module. The present invention simplifies the production process and saves costs. Moreover, the backlight module prepared by the present invention has a thin and light structure, high luminous efficiency, uniform light emission, and can achieve zoned dynamic dimming. BRIEF DESCRIPTION OF THE DRAWINGS

[0023] The present invention will be further described below with reference to the drawings and embodiments.

[0024] Figure 1 is a schematic structural diagram of the keyboard backlight module of the present invention;

[0025] Figure 2 is a cross-sectional view of the keyboard backlight module of the present invention;

[0026] In the figure: 1. Circuit board, 2. Light-emitting chip, 3. Encapsulation layer, 4. Light guide plate, 5. Light-shielding sheet, 11. Pad.

[0027] 21. P-type semiconductor electrode, 22. N-type semiconductor electrode, 41. Lamp slot. Detailed implementation mode

[0028] Combined with the attached Figure 1 and the attached Figure 2 As shown, a manufacturing method of a keyboard backlight module includes the following steps:

[0029] S1. Fabricate the circuit board 1, and form conductive lines and pads 11 on the circuit board 1;

[0030] S2. Place the circuit board 1 face up so that the pads 11 face upward, and then place the electrode surface of the light-emitting chip 2 downward, and place the P-type semiconductor electrode 21 and the N-type semiconductor electrode 22 of the light-emitting chip 2 at the corresponding positions of the pads 11;

[0031] S3. Through the reflow soldering process, solder the light-emitting chip 2 to the pads 11 to achieve electrical connection between the light-emitting chip 2 and the pads 11;

[0032] S4. Through the glue coating and encapsulation process, completely encapsulate the light-emitting chip 2 in the glue layer;

[0033] S5. Through baking or ultraviolet curing, make the glue layer form an encapsulation layer 3 with a certain thickness and strength;

[0034] S6. Lay the light guide plate 4 on the substrate 1 so that the light-emitting chip 2 and the encapsulation layer 3 are placed in the corresponding lamp slots 41, and the light can be efficiently coupled into the light guide plate 4.

[0035] S7. Lay the light-shielding sheet 5 on the light guide plate 4, and connect the light-shielding sheet 5 to the four peripheral edges of the circuit board 1;

[0036] S8. Detect the installed keyboard backlight module.

[0037] Continuously apply a positive voltage to energize. The electrons of the N-type semiconductor electrode 22 of the light-emitting chip 2 flow to the P-type semiconductor electrode 21 and meet and recombine with the holes of the P-type semiconductor electrode 21. During the recombination process, the electrons transition from a higher energy state to a lower energy state, and the excess energy is released in the form of photons, thereby realizing the light emission of the light-emitting chip 2. The patterns and dots on the light guide plate 4 guide and diffuse the light to achieve uniform light output. The light-shielding sheet 5 prevents halos or stray light from being generated in the areas of the keyboard where light is not required, thereby realizing the light emission of the backlight module.

[0038] In step S1, the circuit board 1 etches a circuit pattern on a flexible substrate through an FPC process to form conductive circuits and pads 11.

[0039] The die bonding solder is coated on the pads 11, and the die bonding solder is melted during welding to achieve the welding of the light-emitting chip 2 and the pads 11.

[0040] The glue layer is resin glue or silica gel. Resin glue or silica gel has good flexibility and weather resistance.

[0041] The light-shielding sheet 5 and the four peripheral edges of the circuit board 1 are bonded and connected together by double-sided tape.

[0042] In step S8, a test device and a jig are used to perform electrical detection and light efficiency detection on the backlight module. Inspired by the ideal embodiments of the present invention described above, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of the present invention. The technical scope of the present invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A manufacturing method of a keyboard backlight module, characterized in that, Including the following steps: S1. Fabricate a circuit board (1), and form conductive circuits and pads (11) on the circuit board (1); S2. Place the circuit board (1) face up so that the pads (11) face upward, then place the electrode surface of the light-emitting chip (2) face down, and place the P-type semiconductor electrode (21) and N-type semiconductor electrode (22) of the light-emitting chip (2) at the corresponding positions on the pads (11); S3. Through the reflow soldering process, solder the light-emitting chip (2) to the pads (11) to achieve electrical connection between the light-emitting chip (2) and the pads (11); S4. Through the glue coating and encapsulation process, completely encapsulate the light-emitting chip (2) in the glue layer; S5. Through baking or ultraviolet curing, make the glue layer form an encapsulation layer (3) with a certain thickness and strength; S6. Lay the light guide plate (4) on the substrate (1) so that the light-emitting chip (2) and the encapsulation layer (3) are placed in the corresponding lamp grooves (41); S7. Lay the light-shielding sheet (5) on the light guide plate (4), and connect the light-shielding sheet (5) to the four peripheral edges of the circuit board (1); S8. Inspect the installed keyboard backlight module.

2. The manufacturing method of the keyboard backlight module according to claim 1, characterized in that, In step S1, the circuit board (1) etches the circuit pattern on the flexible substrate through the FPC process to form conductive circuits and pads (11).

3. The manufacturing method of the keyboard backlight module according to claim 1, characterized in that, The pads (11) are coated with die bonding solder, and the die bonding solder is melted during welding to achieve the welding of the light-emitting chip (2) and the pads (11).

4. The manufacturing method of the keyboard backlight module according to claim 1, characterized in that, The glue layer is resin glue or silicone glue.

5. The manufacturing method of the keyboard backlight module according to claim 1, characterized in that The light-shielding sheet (5) is bonded to the four peripheral edges of the circuit board (1) through double-sided tape.

6. The manufacturing method of the keyboard backlight module according to claim 1, wherein, In step S8, use test equipment and fixtures to perform electrical detection and light efficiency detection on the backlight module.

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