Preparation method of keyboard backlight module

Abstract

The invention relates to the field of keyboard preparation methods, in particular to a preparation method of a keyboard backlight module. The preparation method comprises the following steps: S1, etching a circuit pattern on a flexible substrate to form a conductive circuit and a bonding pad according to a manufacturing mode of the circuit board; s2, printing and forming a reflecting layer on the end face, provided with the bonding pad, of the circuit board; s3, baking the reflecting layer at high temperature to dry and cure the reflecting layer; s4, the circuit board is placed uprightly, the bonding pad is made to face upwards, and the P-type semiconductor electrode and the N-type semiconductor electrode of the light-emitting chip are placed at the corresponding positions of the bonding pad to be welded; and S5, printing an adhesive layer, completely coating the light-emitting chip, and covering a corresponding area below the key cap. Through the combination of the reflecting layer, the packaging layer and the shading layer, the emitted light can be better spread towards the keycap, a light guide sheet and a shading sheet are omitted, the light and thin design of the backlight module can be realized, the weight of the keyboard is reduced, the product structure is simplified, the efficiency is improved, and the cost is saved.

Description

Technical Field

[0001] The present invention relates to the field of keyboard manufacturing methods, especially the manufacturing method of a keyboard backlight module. Background Art

[0002] With the development of electronic products, users' requirements for the appearance and functionality of keyboards are increasing day by day. As an important function to enhance the keyboard usage experience, the keyboard backlight module can facilitate users to identify key characters in a dim environment. At the same time, it is required that the keyboard backlight module has colorful light transformation to enhance the visual effect of the keyboard.

[0003] The existing keyboard backlight modules adopt the design of light guide plates and light shielding plates, which increases the thickness and weight of the products. In addition, installation errors are prone to occur during the assembly process of light guide plates and light shielding plates, resulting in uneven light emission. At the same time, the existing keyboard backlight module solutions will increase the product cost. Summary of the Invention

[0004] To solve the deficiencies of the prior art described in the background art, the present invention provides a manufacturing method of a keyboard backlight module. Through the combination of a reflective layer, a packaging layer, and a light shielding layer, the present invention enables the light emitted by the light-emitting chip to better propagate towards the keycap direction. This method eliminates the light guide plate and the light shielding plate, and can achieve a thin and light design of the backlight module, reduce the weight of the keyboard, simplify the product structure, improve efficiency and save costs.

[0005] The technical solution adopted by the present invention to solve its technical problems is:

[0006] A manufacturing method of a keyboard backlight module, comprising the following steps:

[0007] S1. First, fabricate a circuit board. The fabrication method of the circuit board is to etch a circuit pattern on a flexible substrate to form conductive lines and pads;

[0008] S2. Print and form a reflective layer on the end face of the circuit board where the pads are provided;

[0009] S3. Bake the reflective layer at a high temperature to dry and cure the reflective layer;

[0010] S4. Place the circuit board face up so that the pads are facing up, and place the electrode surface of the light-emitting chip facing downwards towards the circuit board below. Place the P-type semiconductor electrode and N-type semiconductor electrode of the light-emitting chip at the corresponding positions of the pads and weld them;

[0011] S5. Print an adhesive layer to completely cover the light-emitting chip and cover the corresponding area below the keycap;

[0012] S6. Cure the adhesive layer to form a packaging layer with a certain thickness and strength;

[0013] S7. Print a light-shielding layer to fill the gap between adjacent encapsulation layers;

[0014] S8. Bake the light-shielding layer at a high temperature to dry and solidify it, thus completing the preparation of the backlight module.

[0015] S9. Inspect the backlight module.

[0016] Specifically, in step S1, the circuit pattern is etched on the flexible substrate by the FPC process.

[0017] Specifically, the reflective layer is a white ink layer.

[0018] Specifically, in step S4, the welding method is to coat die bonding solder on the pad and melt the die bonding solder through reflow soldering to achieve the welding of the light-emitting chip and the pad.

[0019] Specifically, the glue layer is resin glue or silica gel.

[0020] Specifically, in step S6, the curing method of the glue layer is to bake and cure it at a high temperature or cure it with ultraviolet light.

[0021] Specifically, the light-shielding layer is light-shielding ink.

[0022] Specifically, the inspection content includes electrical inspection and light efficiency inspection.

[0023] The beneficial effects of the present invention are as follows: The present invention provides a method for preparing a keyboard backlight module. Through the combination of the reflective layer, the encapsulation layer, and the light-shielding layer, the light emitted by the light-emitting chip can be better transmitted towards the keycap direction. This method eliminates the need for a light guide plate and a light-shielding sheet, enabling a thin and light design of the backlight module, reducing the weight of the keyboard, simplifying the product structure, improving efficiency, and saving costs. Description of the Drawings

[0024] The following further illustrates the present invention in conjunction with the drawings and embodiments.

[0025] Figure 1 is a schematic structural diagram of the keyboard backlight module of the present invention;

[0026] Figure 2 is a cross-sectional view of the keyboard backlight module of the present invention;

[0027] In the figure, 2 is a circuit board, 3 is a reflective layer, 4 is a light-emitting chip, 5 is an encapsulation layer, 6 is a light-shielding layer, 7 is a keycap, 21 is a pad, 41 is a P-type semiconductor electrode, and 42 is an N-type semiconductor electrode. Detailed Embodiments

[0028] Combined with the attached Figure 1 and the attached Figure 2As shown in the figure, a method for preparing a keyboard backlight module includes the following steps:

[0029] S1. First, fabricate a circuit board 2. By using the FPC process, etch circuit patterns on a flexible substrate to form conductive circuits and pads 21.

[0030] S2. Print white ink on the front side of the circuit board 2 where the pads 21 are located to form a reflective layer 3.

[0031] S3. Bake the reflective layer 3 at a high temperature to dry and cure the reflective layer 3.

[0032] S4. Place the circuit board 2 face up so that the pads 21 are upward. Apply die bonding solder on the pads 21, and then place the electrode surface of the light-emitting chip 4 facing the circuit board 2 below. Place the P-type semiconductor electrode 41 and N-type semiconductor electrode 42 of the light-emitting chip 4 at the corresponding positions on the pads 21, and melt the die bonding solder through reflow soldering to achieve the welding of the light-emitting chip 4 and the pads 21.

[0033] S5. Print an adhesive layer to completely encapsulate the light-emitting chip 4 and cover the corresponding area below the keycap 7.

[0034] S6. Cure the adhesive layer by baking at a high temperature or ultraviolet curing method to form a packaging layer 5 with a certain thickness and strength.

[0035] S7. Print a light-shielding layer 6 to fill the gaps between adjacent packaging layers 5.

[0036] S8. Bake the light-shielding layer 6 at a high temperature to dry and cure the light-shielding layer 6, completing the preparation of the backlight module.

[0037] S9. Conduct electrical detection and light efficiency detection on the backlight module.

[0038] The adhesive layer is a resin adhesive or a silicone adhesive.

[0039] The light-shielding layer 6 is a light-shielding ink.

[0040] Continuously apply a forward voltage to energize. The electrons of the N-type semiconductor of the light-emitting chip 4 flow to the P-type semiconductor and meet and recombine with the holes of the P-type semiconductor. During the recombination process, the electrons transition from a higher energy state to a lower energy state, and the excess energy is released in the form of photons, thereby realizing the light emission of the light-emitting chip 4. The combination of the packaging layer 5 and the reflective layer 3 can transmit and reflect light. The light-shielding layer 6 ink fills the gaps between the packaging layers 5, thereby preventing light from emitting and avoiding the generation of halos or stray light in the areas of the keyboard where light emission is not required, thus realizing uniform light emission in the keycap 7 area.

[0041] Based on the above-mentioned ideal embodiments of the present invention as inspiration, through the above description, relevant staff can completely make various changes and modifications without departing from the technical idea of this invention. The technical scope of this invention is not limited to the content in the specification, and its technical scope must be determined according to the scope of the claims.

Claims

1. A preparation method of a keyboard backlight module, characterized in that, It includes the following steps: S1. First, fabricate the circuit board (2). The circuit board is fabricated by etching the circuit pattern on a flexible substrate to form conductive circuits and pads (21). S2. Print and form a reflective layer (3) on the end face of the circuit board (2) where the pads (21) are provided. S3. Bake the reflective layer (3) at a high temperature to dry and cure the reflective layer (3). S4. Place the circuit board (2) face up so that the pads (21) face upward, and orient the electrode surface of the light-emitting chip (4) downward toward the circuit board (2). Place the P-type semiconductor electrode (41) and N-type semiconductor electrode (42) of the light-emitting chip (4) at the corresponding positions on the pads (21) and weld them. S5. Print an adhesive layer to completely cover the light-emitting chip (4) and cover the corresponding area under the keycap (7). S6. Cure the adhesive layer to form a packaging layer (5) with a certain thickness and strength. S7. Print a light-shielding layer (6) to fill the gaps between adjacent packaging layers (5). S8. Bake the light-shielding layer (6) at a high temperature to dry and cure the light-shielding layer (6), completing the preparation of the backlight module. S9. Detect the backlight module.

2. The preparation method of the keyboard backlight module according to claim 1, wherein In step S1, the circuit pattern is etched on the flexible substrate by the FPC process.

3. The preparation method of the keyboard backlight module according to claim 1, wherein, The reflective layer (3) is a white ink layer.

4. The manufacturing method of the keyboard backlight module according to claim 1, characterized in that In step S4, the welding method is to apply die bonding solder on the pads (21) and melt the die bonding solder through reflow soldering to achieve the welding of the light-emitting chip (4) and the pads (21).

5. The preparation method of the keyboard backlight module according to claim 1, wherein, The adhesive layer is a resin adhesive or a silicone adhesive.

6. The manufacturing method of the keyboard backlight module according to claim 1, wherein In step S6, the adhesive layer is cured by baking at a high temperature or ultraviolet curing.

7. The preparation method of the keyboard backlight module according to claim 1, wherein, The light-shielding layer (6) is a light-shielding ink.

8. The manufacturing method of the keyboard backlight module according to claim 1, characterized in that, The detection content includes electrical detection and light efficiency detection.

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