Method and system for testing life of multi-module VCM and electronic equipment

Abstract

The invention discloses a multi-module VCM service life test method and system and electronic equipment, and the method comprises the steps: sequentially connecting a VCM service life test head board, a wire harness, a multi-module interface large board, a switching FPC, and a switching board; the VCM life test head plate is used for connecting a camera test box and receiving power supply and IIC control instructions of the camera test box; the adapter plate is used for connecting a camera module with a VCM; at least one camera module with a VCM is buckled to the module connector corresponding to the adapter plate; setting a power supply voltage; configuring test conditions of the automatic focusing life; and performing VCM reciprocating focusing motion on the camera module, and accumulating the number of motion times until the total number meets the test condition. Through the optimized test board structure and the test method, the drive integrated circuits of a plurality of camera modules can be connected at the same time, and the multi-module interface large board can be independently placed in the incubator, so that the requirements of incubator test and multi-module test are met.

Description

Technical Field

[0001] The present application relates to the technical field of VCM life testing, and in particular to a method, system and electronic equipment for multi-module VCM life testing. Background Art

[0002] When testing the reliability of the module of an autofocus camera, it is often necessary to perform a VCM (voice coil motor) life test to verify the reliability of the VCM's repeated focusing motion. For example, the camera module needs to repeat 300,000 reciprocating focusing (bottom-top-bottom), and after a certain number of times, the performance of the camera module is tested to confirm whether the product performance meets the standards.

[0003] The traditional test solution is to connect a single test box to a module for AF (Auto Focus) life test (while retaining the ability to acquire images). It uses FPC (flexible circuit board) connection, which is limited in length and cannot meet the requirements of placing in an incubator and multi-module testing. Summary of the invention

[0004] In order to at least solve the above-mentioned technical problems, the purpose of the present application is to provide a method, system and electronic equipment for multi-module VCM life testing, which well meet the needs of temperature chamber testing and multi-module testing.

[0005] In order to achieve the above object, the present application provides a method for multi-module VCM life test, including:

[0006] Connect the VCM life test head board, wiring harness, multi-module interface board, adapter FPC, and adapter board in sequence; the VCM life test head board is used to connect the camera test box and receive the power supply and IIC control instructions of the camera test box; the adapter board is used to connect the camera module with VCM;

[0007] Snapping at least one camera module with a VCM onto a module connector corresponding to the adapter board;

[0008] Set the supply voltage;

[0009] Configure the test conditions for auto focus life;

[0010] The camera module is subjected to VCM reciprocating focusing motion, and the number of motions is accumulated until the total number meets the test condition.

[0011] Furthermore, the camera test box is used to capture images, detect current and perform OS testing.

[0012] Furthermore, the multi-module interface board includes multiple module interfaces for simultaneously connecting multiple camera modules to be tested, thereby performing VCM life testing.

[0013] Furthermore, the wiring harness is used as an extension line to connect the multi-module interface board and the VCM life test head board.

[0014] Furthermore, it also includes: placing the multi-module interface board and the adapter FPC, the adapter board and the camera module connected thereto in a temperature control box; the temperature control box is used to adjust the test temperature.

[0015] Furthermore, the VCM life test head board and the camera test box, and the adapter board and the camera module are connected by means of connectors or pins.

[0016] Furthermore, the step of performing VCM reciprocating focusing motion on the camera module and accumulating the number of motions until the total number meets the test condition further includes:

[0017] The IIC command controls the driving integrated circuit to execute the reciprocating focus movement command;

[0018] Record the number of reciprocating focus times during the current VCM lifespan, and stop automatically when the specified number is reached.

[0019] Furthermore, the test conditions include: exercise interval, exercise interval time, and total number of cycles.

[0020] On the other hand, the present application also provides a multi-module VCM life test system, which adopts the multi-module VCM life test method as described above, and the multi-module VCM life test system includes:

[0021] VCM life test head board, used to connect to the camera test box and receive power supply / IIC control instructions from the camera test box;

[0022] A multi-module interface board, wherein the multi-module interface board is expanded with multiple module interfaces, and the module interfaces are used to connect the camera module to be tested;

[0023] The wiring harness, as an extension line, is used to connect the multi-module interface board and the VCM life test head board.

[0024] On the other hand, the present application also provides an electronic device, including a processor and a memory, wherein the memory stores a computer program, and when the computer program is read and executed by the processor, the method for multi-module VCM life test as described above is executed.

[0025] The method for multi-module VCM life test in the embodiments of the present application includes: sequentially connecting the VCM life test header board, the wire harness, the multi-module interface large board, the transfer FPC, and the transfer board; buckling at least one camera module with a VCM onto the module connector corresponding to the transfer board; starting the test software and setting the power supply voltage; configuring the test conditions for the autofocus life; starting the test; converting the corresponding code value instruction into an instruction for driving an integrated circuit inside the test software; performing the reciprocating focusing movement of the VCM and accumulating the number of movements until the total number meets the requirements of the test conditions. By optimizing the test board structure, the driving integrated circuits of multiple camera modules can be connected simultaneously, and the IIC controls the up and down movement of the module VCM, and is transmitted through the wire harness, meeting the requirements of the incubator test and the multi-module test. Description of the Drawings

[0026] The drawings are used to provide a further understanding of the present application, and constitute a part of the specification. Together with the embodiments of the present application, they are used to explain the present application and do not constitute a limitation to the present application. In the drawings:

[0027] Figure 1 is a schematic flowchart of the method for multi-module VCM life test in the embodiments of the present application;

[0028] Figure 2 is a schematic diagram of the interface for configuring the test conditions of the autofocus life in the embodiments of the present application;

[0029] Figure 3 is a schematic diagram of converting the corresponding code value instruction into an instruction for the Driver IC inside the software in the embodiments of the present application;

[0030] Figure 4 is a schematic block diagram of an electronic device in the embodiments of the present application. Detailed Embodiments

[0031] The embodiments of the present application will be described in more detail with reference to the drawings. Although some embodiments of the present application are shown in the drawings, it should be understood that the present application can be implemented in various forms and should not be construed as limited to the embodiments described herein. On the contrary, these embodiments are provided to more thoroughly and completely understand the present application. It should be understood that the drawings and embodiments of the present application are only for exemplary purposes and are not used to limit the protection scope of the present application.

[0032] It should be understood that the steps recorded in the method embodiments of the present application can be executed in different orders and / or executed in parallel. In addition, the method embodiments may include additional steps and / or omit the steps shown. The scope of the present application is not limited in this regard.

[0033] The term "including" and its variations used herein are open inclusions, i.e., "including but not limited to". The term "based on" means "based at least in part on". The term "one embodiment" means "at least one embodiment"; the term "another embodiment" means "at least one additional embodiment"; the term "some embodiments" means "at least some embodiments". The relevant definitions of other terms will be given in the following description.

[0034] It should be noted that the modifications of "one" and "plurality" mentioned in this application are illustrative rather than restrictive, and those skilled in the art should understand that unless otherwise clearly indicated in the context, it should be understood as "one or more". "Plurality" should be understood as two or more.

[0035] Hereinafter, embodiments of the present application will be described in detail with reference to the accompanying drawings.

[0036] The embodiment of the present application provides a method for multi-module VCM life test, including: connecting a VCM life test head board, a wiring harness, a multi-module interface board, a transfer FPC, and an adapter board in sequence; the VCM life test head board is used to connect a camera test box and receive power supply and IIC control instructions from the camera test box; the adapter board is used to connect a camera module with a VCM; at least one camera module with a VCM is snapped onto a module connector corresponding to the adapter board; the power supply voltage is set; the test conditions for autofocus life are configured; the camera module is subjected to VCM reciprocating focus movement, and the number of movements is accumulated until the total number meets the test conditions.

[0037] Example 1

[0038] Figure 1 This is a flow chart of the method for multi-module VCM life test of the embodiment of the present application. Figure 1 , the method for multi-module VCM life test in an embodiment of the present application is described in detail.

[0039] In the embodiment of the present application, considering that the VCM is driven to reciprocate, as long as the power is supplied by AFVDD (Auto Focus VDD, auto focus voltage), the IIC (integrated circuit bus) provides instructions to the DriverIC (driver integrated circuit) of the camera module, and the function of acquiring images can be simplified. Therefore, the present application simplifies the circuit design of the traditional test board (only the required circuits are retained), and adopts a split structure, which is connected by a long harness, so that the multi-module interface large board can be placed in a temperature box (high and low temperature environment for testing).

[0040] First, in step 101, the VCM life test head board, the wiring harness, the multi-module interface board, the adapter FPC, and the adapter board are connected in sequence.

[0041] In some exemplary embodiments, multiple components such as the VCM life test header board, wire harness, multi-module interface large board, adapter FPC, adapter board, etc. are connected in sequence.

[0042] The VCM life test header board is used to connect to the camera test box to obtain the power supply / IIC control instruction of the camera test box.

[0043] The camera test box is a device specifically used for testing camera modules. It can test multiple camera modules simultaneously and has functions such as image acquisition, current detection, and OS testing.

[0044] The multi-module interface large board is expanded to multiple module interfaces to facilitate the VCM life test of multiple camera modules simultaneously.

[0045] The wire harness, as an extension cable, realizes the separate connection between the multi-module interface large board and the VCM life test header board. For some test requirements where the VCM life test needs to be carried out in a high-temperature or low-temperature environment, through the transmission of this wire harness, it is possible to place the multi-module interface large board in the temperature chamber, while the camera test box and the VCM life test header board are outside the temperature chamber.

[0046] In some exemplary embodiments, the multi-module interface large board and the adapter FPC, adapter board, and camera module to be tested connected thereto are also placed in a temperature control box, which is used to adjust the test temperature.

[0047] The adapter board is mainly used to connect different types or specifications of electronic devices or interfaces to achieve signal conversion and communication between devices. It connects different electronic components through conductive paths (such as copper wires or copper foils) on the circuit board to achieve signal transmission. The design principles of the adapter board include multiple aspects such as electrical connection, signal conversion, compatibility, signal integrity, electromagnetic compatibility, thermal management, reliability, and durability to ensure its stable operation under various environmental conditions.

[0048] In some exemplary embodiments, the adapter board is designed in cooperation with the module connector and corresponds to the camera module for connecting to the camera module. When different models of camera modules need to be subjected to the VCM life test, only the adapter board needs to be replaced. The adapter FPC is the FPC (Flexible Printed Circuit Board, abbreviated as FPC) that connects the adapter board.

[0049] In some exemplary embodiments, the connection between the VCM life test header board and the camera test box, and the connection between the adapter board and the camera module are made by means of connectors or pins.

[0050] Step 102, snap multiple camera modules with VCM onto the module connectors of the corresponding adapter boards.

[0051] In some exemplary embodiments, a module connector is a connector for inter-module connection, mainly used for connecting electrical or electronic components between different modules in an electronic device, such as power supply, signal, data, etc. Through modular design, the module connector connects different modules together to achieve the coordinated operation of the entire system.

[0052] Step 103: Set the power supply voltage.

[0053] In some exemplary embodiments, the power supply voltage is set by starting the test software. The test software should have the following functions:

[0054] (1) Set the power supply voltage;

[0055] (2) Have IIC control: Control the DriverIC (Driver Integrated Circuit) to execute the instruction of reciprocating focusing movement; IIC (full name Inter-Integrated Circuit) is a multi-directional control integrated circuit bus.

[0056] (3) Counting function: Record the number of reciprocating focusing times of the current VCM life, and automatically stop after reaching the specified number.

[0057] In some exemplary embodiments, AFVDD (Auto Focus Voltage) is set to 2.8V.

[0058] Step 104: Configure the test conditions for the AF (Auto Focus) life.

[0059] In some exemplary embodiments, the test conditions for the auto focus life include conditions such as the movement range (0~1000~0~1000……), movement interval time, total number of cycles, etc. As Figure 2 shown, it is the test condition configuration interface for the auto focus life.

[0060] Step 105: Start the test.

[0061] Step 106: Convert the corresponding code value instruction into the instruction of the Driver IC. The code value refers to the numerical value used to represent specific data or status in programming. As Figure 3 and the following table:

[0062]

[0063] DAC is an analog-to-digital converter.

[0064] Step 107: Perform the VCM reciprocating focusing movement and accumulate the movement times until the total number meets the requirements of the test conditions.

[0065] Embodiment 2

[0066] This embodiment provides a multi-module VCM life test system, which is used to implement the steps of the method embodiment of the multi-module VCM life test as described above, and perform VCM life tests on camera modules. The system includes:

[0067] A VCM life test header board, which is used to connect to a camera test box and receive power supply / IIC control instructions from the camera test box;

[0068] A multi-module interface large board, which is expanded with multiple module interfaces, and the module interfaces are used to connect camera modules to be tested;

[0069] A wire harness, used as an extension cable, which is used to connect the multi-module interface large board and the VCM life test header board.

[0070] The multi-module VCM life test system provided in this embodiment utilizes the multiple module interfaces expanded on the multi-module interface large board to realize the simultaneous connection of multiple camera modules to be tested, meeting the multi-module test requirements; the wire harness, as an extension cable, realizes the separate connection of the multi-module interface large board and the VCM life test header board. For the situation where the VCM life test is required to be carried out in a high-temperature or low-temperature environment, through the transmission of this wire harness, the multi-module interface large board can be placed in an incubator, while the camera test box and the VCM life test header board are outside the incubator, thus well meeting the requirements of incubator tests and multi-module tests.

[0071] Embodiment 3

[0072] Figure 4 is a schematic block diagram of an electronic device according to an embodiment of the present application, as Figure 4 shown. At the hardware level, the electronic device includes a processor, and optionally also includes a bus, a network interface, and a memory. Among them, the memory may include internal memory, such as high-speed random access memory (Random-Access Memory, RAM), and may also include non-volatile memory (Non-Volatile Memory), such as at least one disk memory, etc. Of course, the electronic device may also include other hardware required for other services.

[0073] The processor, network interface, and memory can be interconnected through a bus, which can be an ISA (Industry Standard Architecture) bus, a PCI (Peripheral Component Interconnect) bus, an EISA (Extended Industry Standard Architecture) bus, etc. The bus can be divided into an address bus, a data bus, a control bus, etc. For the sake of convenience of representation, Figure 4 only a bidirectional arrow is used in

[0074] The memory is used to store a computer program. When the computer program is read and executed by the processor, the steps in the method embodiment of the multi-module VCM life test described above are executed. Specifically, the computer program can include program code, and the program code includes computer operation instructions.

[0075] The processor reads the corresponding computer program from the non-volatile memory into the memory and then runs it, forming a shared resource access control device at the logical level.

[0076] Although the disclosed embodiments of the present invention are as above, the content is only an embodiment adopted for the convenience of understanding the present invention and is not used to limit the present invention. Any person skilled in the art within the scope of the present invention can make any modifications and changes in the form and details of the implementation without departing from the spirit and scope disclosed by the present invention. However, the scope of patent protection of the present invention shall still be subject to the scope defined by the appended claims.

Claims

1. A method for testing the lifespan of a multi-module VCM, characterized in that, Including: Connecting in sequence a VCM life test header board, a wire harness, a multi-module interface large board, a transfer FPC, and a transfer board; the VCM life test header board is used to connect a camera test box and receive the power supply and IIC control instructions of the camera test box; the transfer board is used to connect a camera module with a VCM. Clamping at least one camera module with a VCM onto a module connector corresponding to the transfer board. Setting the supply voltage. Configuring the test conditions for the autofocus life. Performing a VCM reciprocating focusing movement on the camera module and accumulating the movement times until the total number meets the test conditions.

2. The method for multi-module VCM life test according to claim 1, characterized in that, The camera test box is used to collect images, detect current, and perform OS tests.

3. The method for multi-module VCM life test according to claim 1, characterized in that The multi-module interface large board includes a plurality of module interfaces and is used to connect a plurality of camera modules to be tested simultaneously, and then perform VCM life tests.

4. The method for testing the lifespan of a multi-module VCM according to claim 1, wherein The wire harness is used as an extension cable to connect the multi-module interface large board and the VCM life test header board.

5. The method for multi-module VCM life test according to claim 1, characterized in that Also including: Placing the multi-module interface large board and the transfer FPC, the transfer board, and the camera module connected thereto in a temperature control box. The temperature control box is used to adjust the test temperature.

6. The method for multi-module VCM life test according to claim 1, characterized in that The connection between the VCM life test header board and the camera test box, and the connection between the transfer board and the camera module are made by means of connectors or pins.

7. The method for multi-module VCM life test according to claim 1, characterized in that The step of performing a VCM reciprocating focusing movement on the camera module and accumulating the movement times until the total number meets the test conditions further includes: Controlling the driving integrated circuit to execute the reciprocating focusing movement instruction through an IIC instruction. Recording the reciprocating focusing times of the current VCM life and automatically stopping after reaching the specified number.

8. The method for multi-module VCM life test according to claim 1, wherein The test conditions include: movement range, movement interval time, and total number of cycles.

9. A multi-module VCM life test system, adopting the method for multi-module VCM life test according to any one of claims 1-8, characterized in that, The multi-module VCM life test system includes: A VCM life test header board, which is used to connect a camera test box and receive the power supply / IIC control instructions of the camera test box. A multi-module interface large board, and the multi-module interface large board is expanded with a plurality of module interfaces, and the module interfaces are used to connect camera modules to be tested. A wire harness, as an extension cable, is used to connect the multi-module interface large board and the VCM life test header board.

10. An electronic device, characterized in that, Including a processor and a memory, wherein the memory stores a computer program, and when the computer program is read and executed by the processor, it executes the method for multi-module VCM life test according to any one of claims 1-8.

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