Housing, method of manufacturing the same, and electronic device

Abstract

The application provides a shell, a preparation method thereof and an electronic device. The shell comprises a fiber cloth, a graphene coating wrapped around the outer periphery of part of the fiber cloth, and a resin layer wrapped around the surface of the fiber cloth and the graphene coating. The shell has high rigidity and a high thermal conductivity, and does not affect the transmission of electromagnetic wave signals.

Description

Technical Field

[0001] This application relates to the field of electronics, specifically to a housing, its preparation method, and an electronic device. Background Technology

[0002] The back cover materials for electronic devices (such as mobile phones and tablets) mainly include plastic, metal, glass, and ceramic. Conventional plastic back covers are low-cost, lightweight, and easy to process, but they lack a premium feel, have low mechanical strength, and are prone to deformation. Metal back covers, while offering a good feel and durability, are more expensive and heavier, and can also interfere with signal transmission. Glass back covers are aesthetically pleasing, highly durable, and support wireless charging, but they are fragile, prone to fingerprints, and have poor thermal conductivity. Ceramic back covers combine the advantages of both metal and glass, but are expensive, heavy, and fragile. In summary, current electronic device back covers struggle to simultaneously achieve high thermal conductivity, high strength, and without interfering with signal transmission. Summary of the Invention

[0003] This application provides a housing with high rigidity and thermal conductivity, which does not affect the transmission of electromagnetic wave signals.

[0004] A first aspect of this application provides a housing comprising:

[0005] Fiber cloth;

[0006] A graphene coating, said graphene coating being wrapped around a portion of the outer periphery of said fiber cloth; and

[0007] A resin layer, which is wrapped around the surface of the fiber cloth and the graphene coating.

[0008] A second aspect of this application provides a method for preparing a shell, the method comprising:

[0009] Provide fiber cloth;

[0010] A graphene coating is deposited in a portion of the fiber cloth to obtain a graphene fiber cloth; and

[0011] The montmorillonite fiber cloth is immersed in a resin solution, and the resin solution is cured to form a resin layer, thus obtaining the shell.

[0012] A third aspect of this application provides an electronic device comprising:

[0013] Display screen;

[0014] The housing described in this application embodiment is disposed opposite to the display screen; and

[0015] A processor is located between the housing and the display screen, and is electrically connected to the display screen for controlling the display screen to display content.

[0016] The housing in this application embodiment includes a fiber cloth, a graphene coating, and a resin layer. The graphene coating covers a portion of the outer periphery of the fiber cloth, and the resin layer covers the surfaces of the fiber cloth and the graphene coating. Compared to a fiber-resin housing impregnated with fiber cloth, this housing not only has a higher thermal conductivity and better heat dissipation, but when applied to electronic devices, it can better dissipate heat from heat-generating components such as the motherboard and battery, extending the lifespan of the electronic device. Furthermore, compared to a fiber-resin housing, the housing in this application has higher rigidity and mechanical strength, is less prone to deformation, and can better protect the electronic device. In addition, the graphene coating is only located in a portion of the housing. Through design, when the housing is applied to an electronic device, the graphene coating avoids the antenna placement of the electronic device, thus not affecting antenna signal transmission, allowing the antenna signal to be transmitted and received normally without affecting signal strength. Attached Figure Description

[0017] To more clearly illustrate the technical solutions of the embodiments of this application, the drawings used in the embodiments will be briefly introduced below. Obviously, the drawings described below are only some embodiments of this application. For those skilled in the art, other drawings can be obtained based on these drawings without creative effort.

[0018] Figure 1 This is a schematic diagram of the structure of the housing according to an embodiment of this application.

[0019] Figure 2 The housing along one embodiment of this application Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0020] Figure 3 This is another embodiment of the housing along the edge of the present application. Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0021] Figure 4 This is a schematic flowchart of a method for preparing a shell according to an embodiment of this application.

[0022] Figure 5 This is a schematic diagram of the manufacturing process of the shell according to an embodiment of this application.

[0023] Figure 6 This is a schematic flowchart of a method for preparing a montmorillonite fiber cloth according to an embodiment of this application.

[0024] Figure 7This is a schematic diagram of the process of forming a shell from a montmorillonite fiber cloth according to an embodiment of this application.

[0025] Figure 8 This is a schematic diagram of the structure of an electronic device according to an embodiment of this application.

[0026] Figure 9 This is a partial exploded structural diagram of an electronic device according to an embodiment of this application.

[0027] Figure 10 This is a circuit block diagram of an electronic device according to an embodiment of this application.

[0028] Explanation of reference numerals in the attached figures:

[0029] 100-Housing, 10a-Graphene fiber cloth, 10-Fiber cloth, 11-First part, 12-Second part, 12'-Mask layer, 20-Graphene coating, 30-Resin layer, 40-First area, 50-Second area, 101-Light-transmitting part, 300-Electronic device, 310-Display, 320-Middle frame, 330-Processor, 350-Memory, 370-Camera module. Detailed Implementation

[0030] To enable those skilled in the art to better understand the present application, the technical solutions in the embodiments of the present application will be clearly and completely described below with reference to the accompanying drawings. Obviously, the described embodiments are only some embodiments of the present application, and not all embodiments. Based on the embodiments in the present application, all other embodiments obtained by those of ordinary skill in the art without creative effort are within the scope of protection of the present application.

[0031] The terms "first," "second," etc., in the specification, claims, and accompanying drawings of this application are used to distinguish different objects, not to describe a specific order. Furthermore, the terms "comprising" and "having," and any variations thereof, are intended to cover non-exclusive inclusion. For example, a process, method, system, product, or apparatus that includes a series of steps or units is not limited to the listed steps or units, but may optionally include steps or units not listed, or may optionally include other steps or units inherent to these processes, methods, products, or apparatuses.

[0032] The technical solutions in the embodiments of this application will now be described with reference to the accompanying drawings.

[0033] It should be noted that, for ease of explanation, the same reference numerals denote the same components in the embodiments of this application, and for the sake of brevity, detailed descriptions of the same components are omitted in different embodiments.

[0034] The back cover materials for electronic devices (such as mobile phones and tablets) mainly include plastic, metal, glass, and ceramic. Conventional plastic back covers are low-cost, lightweight, and easy to process, but they lack a premium feel, have low mechanical strength, and are prone to deformation. Metal back covers, while offering a good feel and durability, are more expensive and heavier, and can also interfere with signal transmission. Glass back covers are aesthetically pleasing, highly durable, and support wireless charging, but they are fragile, prone to fingerprints, and have poor thermal conductivity. Ceramic back covers combine the advantages of both metal and glass, but are expensive, heavy, and fragile. In summary, current electronic device back covers struggle to simultaneously achieve high thermal conductivity, high strength, and without interfering with signal transmission.

[0035] Figure 1 This is a schematic diagram of the structure of the housing 100 according to an embodiment of this application. Figure 2 The housing 100 of one embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction. Figure 3 The housing 100 of another embodiment of this application is along Figure 1 A schematic diagram of the cross-sectional structure along the AA direction.

[0036] Please see Figures 1 to 3 This application provides a housing 100, which includes a fiber cloth 10, a graphene coating 20, and a resin layer 30. The graphene coating 20 is wrapped around a portion of the outer periphery of the fiber cloth 10; the resin layer 30 is wrapped around the surface of the fiber cloth 10 and the graphene coating 20.

[0037] The housing 100 of this application can be applied to portable electronic devices such as mobile phones, tablets, laptops, desktop computers, smart bracelets, smartwatches, e-readers, and game consoles. The housing 100 in this application embodiment can be a 2D structure, a 2.5D structure, a 3D structure, etc. The housing 100 in this application can be the mid-frame, back cover (battery cover), or decorative part of an electronic device. In the following embodiments of this application, the housing 100 is described in detail using the back cover of a mobile phone as an example.

[0038] Understandably, the graphene coating 20 is disposed on a portion of the outer periphery of the fiber cloth 10. It is also understood that the graphene coating 20 is deposited on a portion of the surface of the fiber cloth 10.

[0039] It should be noted that the graphene coating 20 can be located on one surface of the fiber cloth 10 or on two opposite surfaces of the fiber cloth 10.

[0040] It should be noted that the resin layer 30 covers the entire outer periphery of the fiber cloth 10 and the graphene coating 20; in other words, the fiber cloth 10 and the graphene coating 20 are disposed inside the resin layer 30.

[0041] Understandably, the housing 100 includes a fiber resin board, which includes a fiber cloth 10, a graphene coating 20, and a resin layer 30. The graphene coating 20 is wrapped around a portion of the outer periphery of the fiber cloth 10, and the resin layer 30 is wrapped around the surface of the fiber cloth 10 and the graphene coating 20.

[0042] Optionally, the housing 100 includes one or more fiber resin boards. When the housing 100 includes multiple fiber resin boards, the multiple fiber resin boards are stacked and connected sequentially. Understandably, the multiple fiber resin boards are connected by the adhesive properties of their own resin layers 30, without the need for additional adhesives.

[0043] The term "multi-story" refers to two or more stories.

[0044] Optionally, the thickness of each fiber resin board layer ranges from 0.08 mm to 0.16 mm. Specifically, the thickness of the fiber resin board can be, but is not limited to, 0.08 mm, 0.09 mm, 0.1 mm, 0.12 mm, 0.14 mm, 0.16 mm, etc.

[0045] The housing 100 of this application embodiment includes a fiber cloth 10, a graphene coating 20, and a resin layer 30. The graphene coating 20 covers a portion of the outer periphery of the fiber cloth 10; the resin layer 30 covers the surfaces of the fiber cloth 10 and the graphene coating 20. Compared to a fiber-resin housing 100 impregnated with resin, this housing 100 has a higher thermal conductivity and better heat dissipation. When applied to electronic devices, it can better dissipate heat from heat-generating components such as the motherboard and battery, extending the lifespan of the electronic device. Furthermore, compared to a fiber-resin housing 100, the housing 100 of this application has higher rigidity and mechanical strength, is less prone to deformation, and can better protect the electronic device. In addition, the graphene coating 20 is only located in a portion of the housing 100. Through design, when the housing 100 is applied to an electronic device, the graphene coating 20 avoids the antenna placement of the electronic device, thus not affecting the transmission of antenna signals, allowing the antenna signals to be transmitted and received normally without affecting signal strength.

[0046] Optionally, the fiber fabric 10 is formed by weaving or knitting fiber threads. In other words, the fiber fabric 10 comprises multiple interwoven fiber threads, such as fiber threads woven together along the warp and weft directions.

[0047] Optionally, the diameter of the fiber filament can be, but is not limited to, 5 μm to 10 μm. Specifically, the diameter of the fiber filament can be, but is not limited to, 5 μm, 6 μm, 7 μm, 8 μm, 9 μm, 10 μm, etc. If the diameter of the fiber filament is too small, it will increase the difficulty of fiber filament preparation and reduce mechanical strength; if the diameter of the fiber filament is too large, it will also reduce the wear resistance and mechanical strength of the fiber filament. In addition, this will make the single layer of fiber cloth 10 relatively thick, which is not convenient for the stacking design of the shell 100.

[0048] In the embodiments of this application, when the numerical range a to b is involved, unless otherwise specified, the numerical value can be any value between a and b, including the endpoint value a and the endpoint value b.

[0049] Optionally, the fiber cloth 10 may be, but is not limited to, at least one of glass fiber, Kevlar fiber, aramid fiber, poly(p-phenylene benzodioxazole) fiber (PBO fiber), ultra-high molecular weight polyethylene fiber (UPE fiber), ceramic fiber, etc.

[0050] Fiberglass filaments are a high-performance inorganic non-metallic material, typically made from glass spheres or waste glass through processes such as high-temperature melting, drawing, winding, and weaving to produce various products. Fiberglass woven fabric is made from fiberglass filaments using a specific weaving process. Winding involves combining multiple drawn fiberglass filaments to form a yarn, followed by necessary finishing and inspection to ensure yarn quality and uniformity. Therefore, if the raw filaments are too thick, the wound yarn will be relatively thick, making it difficult to produce a thin single-layer prepreg and hindering layered designs.

[0051] Optionally, the resin layer 30 can be made of at least one of epoxy resin, phenolic resin, and polyester resin. When the resin layer 30 is made of epoxy resin, epoxy resin has good adhesion, chemical resistance, physical and mechanical properties, and electrical insulation properties, which can give the shell 100 better mechanical strength. Therefore, only a thinner shell 100 is needed to ensure good mechanical properties, which is beneficial to the thinning of the shell 100.

[0052] Optionally, in the fiber resin board, the mass fraction of the resin layer 30 ranges from 70% to 79.7%. Specifically, in the fiber resin board, the mass fraction of the resin layer 30 can be, but is not limited to, 70%, 71%, 72%, 73%, 74%, 75%, 76%, 77%, 78%, 79.7%, etc. If the mass fraction of the resin layer 30 is too low, the bonding force between adjacent fiber resin boards is reduced, making the shell 100 prone to delamination after a period of use; if the mass fraction of the resin layer 30 is too high, the content of the fiber cloth 10 and the graphene coating 20 is too low, reducing the mechanical strength and thermal conductivity of the fiber resin board.

[0053] Optionally, the mass fraction of the fiber cloth 10 in the fiber resin board ranges from 20% to 30%. Specifically, the mass fraction of the fiber cloth 10 in the fiber resin board can be, but is not limited to, 20%, 21%, 22%, 23%, 24%, 25%, 26%, 27%, 28%, 29%, 30%, etc. If the mass fraction of the fiber cloth 10 is too low, the mechanical strength of the fiber resin board is reduced; if the mass fraction of the fiber cloth 10 is too high, the bonding force between adjacent fiber resin boards is reduced, making the shell 100 prone to delamination after a period of use.

[0054] Optionally, the mass fraction of the graphene coating 20 in the fiber resin board ranges from 0.3% to 6%. Specifically, the mass fraction of the graphene coating 20 in the fiber resin board can be, but is not limited to, 0.3%, 0.5%, 0.8%, 1%, 2%, 3%, 4%, 5%, 6%, etc. If the mass fraction of the graphene coating 20 is too low, the improvement on the stiffness and thermal conductivity of the shell 100 is limited; if the mass fraction of the graphene coating 20 is too high, the cost of the shell 100 is greatly increased. In addition, it reduces the bonding force between the fiber cloth 10 and the resin layer 30, thereby reducing the mechanical properties of the shell 100.

[0055] Furthermore, in the fiber resin board, the mass fraction of the graphene coating 20 ranges from 0.3% to 3%. This allows the shell 100 to have higher rigidity and thermal conductivity, and also provides better adhesion between the fiber cloth 10 and the resin layer 30.

[0056] Please see again Figures 1 to 3 In some embodiments, the housing 100 includes a first region 40 and a second region 50 connected together, the second region 50 being disposed around the outer periphery of the first region 40, the graphene coating 20 covering the portion of the fiber cloth 10 located in the first region 40, and the graphene coating 20 avoiding the portion of the fiber cloth 10 located in the second region 50.

[0057] Understandably, the graphene coating 20 is only disposed in the middle region of the housing 100, and is not disposed in the outer peripheral region of the housing 100. That is, the graphene coating 20 is disposed away from the outer peripheral region of the housing 100.

[0058] When the housing 100 serves as the back cover of an electronic device, the antenna of the electronic device is typically located on the mid-frame, transmitting signals from the side of the mid-frame. In this embodiment, the graphene coating 20 covers the portion of the fiber cloth 10 located in the first region 40, while the graphene coating 20 avoids the portion of the fiber cloth 10 located in the second region 50. This better prevents the graphene layer from affecting the transmission and reception of antenna signals, while also giving the housing 100 overall high rigidity and thermal conductivity.

[0059] In other embodiments, the housing 100 includes a first region 40 and a second region 50 connected to each other. The graphene coating 20 covers the portion of the fiber cloth 10 located in the first region 40, and the graphene coating 20 avoids the portion of the fiber cloth 10 located in the second region 50. In this embodiment, the second region 50 may be located on one side of the first region 40; it may also be embedded within the first region 40, i.e., the first region 40 surrounds the outer periphery of the second region 50; furthermore, there may be multiple second regions 50, with one of the multiple second regions 50 surrounding the outer periphery of the first region 40, and the other portions of the multiple second regions 50 embedded in the first region 40.

[0060] Please see again Figure 3 In some embodiments, the line width w of the second region 50 is in the range of 4mm ≤ w ≤ 12mm.

[0061] Specifically, the line width w of the second region 50 can be, but is not limited to, 4mm, 5mm, 6mm, 7mm, 8mm, 9mm, 10mm, 11mm, 12mm, etc.

[0062] In this embodiment, if the linewidth w of the second region 50 is too narrow, the area covered by the graphene coating 20 will be too large. When the housing 100 is applied to electronic devices, it will easily affect the transmission and reception of antenna signals such as electromagnetic waves of the electronic devices. In addition, the bonding force between the graphene coating 20 and the resin is weaker than that between the fiber cloth 10 and the resin. This will also reduce the bonding force of each layer inside the fiber resin board, making the fiber resin board prone to delamination. If the linewidth w of the second region 50 is too wide, the area covered by the graphene coating 20 will be too small, which will have limited effect on improving the rigidity and thermal conductivity of the housing 100.

[0063] In some embodiments, the thickness h of the graphene coating 20 is in the range of 0.2 μm ≤ h ≤ 10 μm.

[0064] Specifically, the thickness h of the graphene coating 20 can be, but is not limited to, 0.2μm, 0.5μm, 0.8μm, 1μm, 2μm, 3μm, 4μm, 5μm, 6μm, 7μm, 8μm, 9μm, 10μm, etc.

[0065] In this embodiment, if the thickness h of the graphene coating 20 is too thin, the improvement on the rigidity and thermal conductivity of the shell 100 will be limited; if the thickness h of the graphene coating 20 is too thick, the coating time and amount of graphene used will be increased, which will greatly increase the cost of the shell 100. In addition, it will reduce the bonding force between the fiber cloth 10 and the resin layer 30, thereby reducing the mechanical properties of the shell 100.

[0066] In some embodiments, the thermal conductivity α of the housing 100 is in the range of 130 W / mK ≤ α ≤ 180 W / mK.

[0067] Specifically, the thermal conductivity α of the shell 100 can be, but is not limited to, 130 W / mK, 135 W / mK, 140 W / mK, 145 W / mK, 150 W / mK, 155 W / mK, 160 W / mK, 165 W / mK, 170 W / mK, 175 W / mK, 180 W / mK, etc.

[0068] In this embodiment, if the thermal conductivity of the housing 100 is too low, it will hinder heat dissipation; if the thermal conductivity of the housing 100 is too high, a thicker graphene coating 20 needs to be deposited, increasing the cost of the housing 100. When the thermal conductivity of the housing 100 is between 130 W / mK and 180 W / mK, the housing 100 can achieve good heat dissipation while maintaining a low manufacturing cost.

[0069] In some embodiments, the stiffness of the housing with a thickness of 0.27 mm ranges from 5500 N / m to 7000 N / m.

[0070] Specifically, the stiffness of the shell with a thickness of 0.27 mm can be, but is not limited to, 5500 N / m, 5600 N / m, 5800 N / m, 6000 N / m, 6200 N / m, 6400 N / m, 6600 N / m, 6800 N / m, 7000 N / m, etc.

[0071] In this embodiment, if the rigidity of the housing 100 is too small, the proportion of graphene coating 20 in the housing 100 will be small, which is not conducive to improving the heat dissipation effect of the housing 100; if the rigidity of the housing 100 is too large, the proportion of graphene coating 20 in the housing 100 will be large, which will not only increase the cost of the housing 100, but also reduce the bonding force between the fiber resin boards.

[0072] In some embodiments, the graphene coating 20 is deposited on a portion of the surface of the fiber cloth 10 by a deposition method.

[0073] Optionally, the deposition method includes at least one of chemical vapor deposition (CVD), physical vapor deposition (PVD), and electrochemical deposition. In this embodiment, a graphene coating 20 is deposited on a portion of the surface of the fiber cloth 10 using a deposition method. This can better enhance the bonding force between the graphene coating 20 and the fiber cloth 10, and better prevent the shell 100 from delaminating after a period of use.

[0074] Optionally, the thickness of the housing 100 ranges from 0.25mm to 1mm; specifically, the thickness of the housing 100 can be, but is not limited to, 0.25mm, 0.27mm, 0.3mm, 0.4mm, 0.5mm, 0.6mm, 0.7mm, 0.8mm, 0.9mm, 1mm, etc. When the housing 100 is too thin, its mechanical strength is reduced, failing to provide adequate support and protection, and the mechanical strength cannot adequately meet the requirements of the electronic device housing 100. When the housing 100 is too thick, it increases the weight of the electronic device, affecting its feel and resulting in a poor user experience.

[0075] The housing 100 of this application embodiment can be prepared by the methods described in the following embodiments of this application. In addition, it can also be prepared by other methods. The preparation methods of this application embodiment are merely one or more preparation methods of the housing 100 of this application and should not be construed as limiting the housing 100 provided in the embodiments of this application.

[0076] Figure 4 This is a schematic flowchart of a method for preparing a shell 100 according to an embodiment of this application. Figure 5 This is a schematic diagram of the fabrication process of the shell 100 according to an embodiment of this application.

[0077] Please see Figure 4 and Figure 5 This application also provides a method for preparing a shell 100, the method comprising:

[0078] S201, provides 10 fiber cloths;

[0079] Optionally, the fiber cloth 10 may be, but is not limited to, at least one of glass fiber, Kevlar fiber, aramid fiber, poly(p-phenylene benzodioxazole) fiber (PBO fiber), ultra-high molecular weight polyethylene fiber (UPE fiber), ceramic fiber, etc. In the embodiments of this application, the fiber cloth 10 is described using glass fiber cloth 10 and the resin layer 30 is described using epoxy resin layer 30 as examples, and should not be construed as limiting the fiber cloth 10 and resin layer 30 of the embodiments of this application.

[0080] S202, a graphene coating 20 is deposited in a portion of the fiber cloth 10 to obtain graphene fiber cloth 10a; and

[0081] Optionally, when the fiber cloth 10 is glass fiber cloth 10, the montmorillonite fiber cloth 10a is montmorillonite glass fiber cloth.

[0082] Understandably, please see again Figure 2 The graphene fiber cloth 10a includes a fiber cloth 10 and a graphene coating 20, wherein the graphene coating 20 is deposited on two opposite surfaces of the graphene fiber cloth 10a.

[0083] In one specific embodiment, the silica content in the glass fiber cloth 10 is 99.83%, and the calcined content is 0.16%. The warp tensile breaking strength of the montmorillonite glass fiber cloth 10 is 177 N / 25 mm, the weft tensile breaking strength is 150 N / 25 mm, the sheet resistivity is 10 Ω / sq, the electrothermal radiation conversion efficiency is >90%, and the normal total emission frequency is 0.88.

[0084] S203, the montmorillonite fiber cloth 10a is immersed in resin solution and the resin solution is cured to form resin layer 30, thereby obtaining the shell 100.

[0085] For a detailed description of other aspects of the fiber cloth 10, the graphene coating 20, and the resin layer 30, please refer to the description of the corresponding section of the above embodiments, which will not be repeated here.

[0086] The method for preparing the housing 100 according to this application involves first depositing a graphene coating 20 on a fiber cloth 10, then impregnating the graphene fiber cloth 10a in a resin solution and curing it. The resulting housing 100 includes a fiber cloth 10, a graphene coating 20, and a resin layer 30. The graphene coating 20 covers a portion of the outer periphery of the fiber cloth 10; the resin layer 30 covers the surfaces of the fiber cloth 10 and the graphene coating 20. Compared to a fiber resin housing 100 impregnated with resin, this housing not only has a higher thermal conductivity and better heat dissipation, but when applied to electronic devices, it can better dissipate heat from heat-generating components such as the motherboard and battery, extending the lifespan of the electronic device. Furthermore, compared to a fiber resin housing 100, the housing 100 of this application has higher rigidity and mechanical strength, is less prone to deformation, and can better protect electronic devices. Furthermore, the graphene coating 20 is only located in a portion of the housing 100. Through design, when the housing 100 is used in electronic devices, the graphene coating 20 avoids the antenna placement of the electronic device, thus not affecting antenna signal transmission and ensuring normal signal transmission and reception without affecting signal strength. Moreover, the graphene coating 20 is formed by deposition, which allows for better adhesion between the graphene coating 20 and the fiber cloth 10, preventing delamination of the housing 100 after a period of use.

[0087] Figure 6 This is a schematic flowchart of a method for preparing a montmorillonite fiber cloth 10a according to an embodiment of this application.

[0088] Please see Figure 5 and Figure 6 In some embodiments, the fiber cloth 10 includes a first portion 11 and a second portion 12 connected together, the second portion 12 being disposed around the outer periphery of the first portion 11; in S202, the deposition of a graphene coating 20 in a portion of the fiber cloth 10 to obtain a graphene fiber cloth 10a includes:

[0089] S2021, a mask layer 12' is provided on the second part 12 of the fiber cloth 10; and

[0090] Optionally, before setting the mask layer 12', the fiber cloth 10 (e.g., glass fiber cloth 10, or simply glass fiber cloth) is cut to a specific length and width as required, cleaned and dried for later use.

[0091] Optionally, photoresist is coated on both opposite surfaces of the fiber cloth 10 to form a photoresist layer, and then subjected to processes such as exposure, development, and hard baking to form a mask layer 12' on the second part 12. In other embodiments, the fiber cloth 10 is placed in a fixture that is used to cover the periphery of the front and back edges of the fiber cloth 10 (i.e., to cover the front and back of the second part 12 of the fiber cloth 10) so that the periphery of the fiber cloth 10 is not coated during graphene coating.

[0092] Understandably, the orthographic projection of the mask layer 12' onto the surface of the second part 12 falls within the area of ​​the second part 12; it is also understood that the mask layer 12' precisely covers the entire second part 12.

[0093] In other embodiments, the mask layer 12' may also be an Invar alloy mask or a quartz glass mask, etc.

[0094] Understandably, the first part 11 of the fiber cloth 10 is provided corresponding to the first region 40 of the housing 100, and the second part 12 of the fiber cloth 10 is provided corresponding to the second region 50 of the housing 100.

[0095] S2022, under an inert atmosphere and at a temperature of 850°C to 950°C, carbon-containing gas and hydrogen are introduced to deposit a graphene coating 20 on the first part 11 of the fiber cloth 10 to obtain a graphene fiber cloth 10a, wherein the flow ratio of the carbon-containing gas to the hydrogen is 3:1 to 8:1.

[0096] Optionally, the fiber cloth 10 with the mask layer 12' is placed in a chemical vapor deposition (CVD) apparatus, and a vacuum is drawn to reduce the pressure to below 0.5 Pa. The CVD apparatus is heated to 850°C to 950°C, and carbon source gas and hydrogen are sequentially introduced to deposit the graphene coating 20. After deposition, the sample is cooled, and the mask layer 12' is removed to obtain the graphene fiber cloth 10a.

[0097] In one specific embodiment, the graphene coating 20 deposition includes: (1) turning on the electrical, gas, and exhaust gas absorption devices; the main switch for CH4, H2, and Ar, the first pressure reducing valve, and the second pressure reducing valve; (2) turning on the PECVD power switch and the instrument switch, starting the vacuum detection unit switch, detecting the vacuum degree of the instrument, maintaining its vacuum degree below 0.5 Pa, testing its pressure holding effect, and after the vacuum system test, cutting a 10cm length of fiber cloth 10 and placing it on the quartz boat and placing it in the heating zone of the quartz tube, and closing the flange furnace door; (3) vacuuming: opening the baffle valve, closing the exhaust gas connection device switch, clicking the vacuum system device start button until the pressure inside the quartz tube drops below 0.5 Pa; (4) heating: clicking the heating control unit run button until the temperature rises to the target temperature; (5) isothermal annealing: opening the H2 inlet port. (6) Growth: Open the CH4 inlet switch, click the automatic inlet setting button, turn on the plasma switch, adjust the power to the target power, click the ON button of plasma, and the H2 flow will automatically shut off after 30 minutes; (7) Cooling: Open the Ar inlet switch, click the automatic inlet setting button, close the H2 and CH4 inlet switches, and the Ar flow will automatically shut off after 50 minutes; and (8) Cooling and sampling: When the furnace temperature drops to 50°C, close the vacuum detection unit, close the Ar inlet and the mixed inlet switch, open the flange and take out the sample.

[0098] Understandably, in this embodiment, a graphene coating 20 is grown on the fiber cloth 10 using chemical deposition (CVD).

[0099] Optionally, the inert atmosphere can be, but is not limited to, nitrogen, argon (Ar), etc.

[0100] Optionally, the carbon-containing gas may be, but is not limited to, at least one of methane, ethylene, acetylene, etc.

[0101] In this embodiment, carbon-containing gas reacts with hydrogen gas at high temperature under an inert atmosphere, causing the carbon-containing gas to decompose and depositing a graphene coating 20 on the fiber cloth 10. The method of this embodiment allows for precise control of the growth position and amount of the graphene coating 20. Furthermore, it results in a graphene coating 20 with higher quality, thus exhibiting higher stiffness and better thermal conductivity.

[0102] Specifically, the deposition temperature of the graphene coating 20 can be, but is not limited to, 850℃, 860℃, 870℃, 880℃, 890℃, 900℃, 910℃, 920℃, 930℃, 940℃, and 950℃. If the deposition temperature of the graphene coating 20 is too low, the graphene may not grow completely, resulting in a discontinuous film, which reduces the rigidity and thermal conductivity of the resulting shell 100. Furthermore, the slow growth rate of the graphene coating 20 prolongs the growth time, reducing the production efficiency of the shell 100 and increasing its production cost. If the deposition temperature of the graphene coating 20 is too high, the growth rate and direction of the graphene in different regions may be inconsistent, leading to the formation of grain boundaries. These grain boundaries weaken the mechanical properties of the graphene and are detrimental to improving the mechanical strength of the shell 100.

[0103] Optionally, the flow ratio of the carbon-containing gas to the hydrogen gas can be, but is not limited to, 3:1, 4:1, 5:1, 6:1, 7:1, 8:1, etc. If the flow ratio of the carbon-containing gas to the hydrogen gas is too low, there will be too little carbon gas and too much hydrogen. Too little carbon gas will reduce the growth efficiency of graphene and increase the cost of depositing the graphene coating 20. Too much hydrogen will make the reaction too vigorous, increasing the cost of preparing the graphene coating 20. If the flow ratio of the carbon-containing gas to the hydrogen gas is too high, there will be too much carbon gas and too little hydrogen. Too much carbon gas will reduce the quality of the formed graphene coating 20. Too little hydrogen will reduce the stability of the graphene.

[0104] Optionally, the flow rate of the carbon-containing gas ranges from 50 sccm to 100 sccm. Specifically, the flow rate of the carbon-containing gas can be, but is not limited to, 50 sccm, 60 sccm, 70 sccm, 80 sccm, 90 sccm, 100 sccm, etc. If the flow rate of the carbon-containing gas is too small, it will reduce the growth efficiency of graphene and increase the cost of graphene coating 20 deposition; if the flow rate of the carbon-containing gas is too large, it will reduce the quality of the formed graphene coating 20.

[0105] Optionally, the hydrogen flow rate ranges from 12 sccm to 30 sccm. Specifically, the hydrogen flow rate can be, but is not limited to, 12 sccm, 15 sccm, 18 sccm, 20 sccm, 23 sccm, 25 sccm, 28 sccm, and 30 sccm. Too little hydrogen reduces the stability of graphene; too much hydrogen makes the reaction too vigorous, increasing the cost of preparing the graphene coating 20.

[0106] Optionally, the deposition time of the graphene coating 20 ranges from 40 minutes to 100 minutes. Specifically, the deposition time of the graphene coating 20 can be, but is not limited to, 40 minutes, 50 minutes, 60 minutes, 70 minutes, 80 minutes, 90 minutes, and 100 minutes. If the deposition time of the graphene coating 20 is too short, the thickness of the resulting graphene coating 20 will be too thin, which will have limited effect on improving the rigidity and thermal conductivity of the shell 100; if the deposition time of the graphene coating 20 is too long, it will increase the cost of the shell 100.

[0107] Figure 7 This is a schematic diagram of the process of forming a shell 100 from a montmorillonite fiber cloth 10a according to an embodiment of this application.

[0108] Please see Figure 5 and Figure 7 Optionally, in S203, the step of immersing the montmorillonite fiber cloth 10a in a resin solution and curing the resin solution to form a resin layer 30 to obtain the shell 100 includes:

[0109] S2031, the montmorillonite fiber cloth 10a is immersed in resin solution;

[0110] Optionally, the resin adhesive can be, but is not limited to, an epoxy resin adhesive, such as a bisphenol A epoxy resin adhesive, i.e., a bisphenol A epoxy resin monomer adhesive.

[0111] It should be noted that when the prepared montmorillonite fiber cloth 10a is in roll form, continuous pre-impregnation can be performed on a roll-to-roll device when preparing the semi-cured board. The montmorillonite fiber cloth 10a is immersed in the epoxy resin tank and then semi-cured at low temperature.

[0112] S2032, a semi-cured montmorillonite fiber cloth 10a impregnated with resin adhesive is subjected to semi-curing to obtain a semi-cured board; and

[0113] Optionally, the montmorillonite fiber cloth 10a is removed from the resin solution and semi-cured at a temperature of 60°C to 80°C to allow the resin monomers in the resin solution to form a semi-cured resin, thereby obtaining a semi-cured board.

[0114] Specifically, the semi-curing temperature can be, but is not limited to, 60℃, 65℃, 70℃, 75℃, 80℃, etc. If the semi-curing temperature is too low, the viscosity of the resin is too high, the fluidity decreases, and it cannot penetrate into the fiber cloth 10 well, resulting in a decrease in the bonding force between the fiber cloth 10 and the resin, and a reduction in the mechanical strength of the resulting shell 100. If the semi-curing temperature is too high, the degree of resin curing is too high, which reduces the adhesion between adjacent semi-cured boards during subsequent curing of multiple layers of semi-cured boards, making the resulting shell 100 prone to delamination.

[0115] S2033, the multi-layer semi-cured board is stacked and cured to obtain the shell 100.

[0116] Optionally, according to the design, multiple layers of prepreg are stacked together and hot-pressed at a temperature of 100°C to 130°C to obtain the shell 100. Understandably, several layers of prepreg are stacked and high-pressure molded according to thickness and strength requirements to obtain a shell 100 of a specific thickness (such as fiberglass board for mobile phone back covers).

[0117] Specifically, the curing temperature can be, but is not limited to, 100℃, 105℃, 110℃, 115℃, 120℃, 125℃, 130℃, etc. If the curing temperature is too low, the resin will not cure completely, reducing the mechanical strength of the shell 100; if the curing temperature is too high, the resin will be cured to an excessive degree, reducing the resin's toughness and the impact resistance of the shell 100, making it prone to brittle fragmentation.

[0118] Understandably, the prepreg, after curing, forms a fiber resin board.

[0119] The following detailed description of the housing 100 of this application is provided through specific embodiments.

[0120] Example 1

[0121] The housing 100 of the embodiment is prepared by the following steps:

[0122] (1) Provide 10g of fiberglass cloth;

[0123] (2) A mask layer 12' with a width of 6 mm is formed on the outer periphery of the glass fiber cloth 10;

[0124] (3) Set in a chemical vapor deposition equipment, in an argon atmosphere, at a vacuum of 0.5 Pa and a temperature of 900 °C, methane and hydrogen are introduced to perform chemical vapor deposition to deposit a graphene coating 20 on the two opposing surfaces of the fiber cloth 10, wherein the flow rate of methane is 80 sccm and the flow rate of hydrogen is 20 sccm. Remove the mask layer 12' to obtain the graphene fiber cloth 10a.

[0125] (4) Immerse the montmorillonite fiber cloth 10a in epoxy resin solution, take it out and semi-cur it at 75°C to obtain a semi-cured board.

[0126] (5) The three semi-cured boards are stacked and hot-pressed at 120°C to obtain shell 100.

[0127] Measurements showed that the thickness of the shell 100 was 0.27 mm, the mass fraction of epoxy resin in the shell 100 was 73%, the mass fraction of glass fiber cloth 10 was 25%, and the mass fraction of graphene coating 20 was 2%.

[0128] Comparative Example 1

[0129] The shell 100 of this comparative example is prepared by the following steps:

[0130] (1) Provide fiberglass cloth 10 and epoxy resin solution;

[0131] (2) Immerse the glass fiber cloth 10 in epoxy resin solution, take it out and semi-cur it at 75°C to obtain a semi-cured board.

[0132] (3) The three semi-cured boards are stacked and hot-pressed at 120°C to obtain shell 100.

[0133] Measurements showed that the thickness of the shell 100 was 0.27 mm, the mass fraction of epoxy resin in the shell 100 was 75%, and the mass fraction of glass fiber cloth 10 was 25%.

[0134] Comparative Example 2

[0135] The shell 100 of this comparative example is prepared by the following steps:

[0136] (1) Provide fiberglass cloth 10, epoxy resin solution and graphene sheet;

[0137] (2) Graphene sheets are dispersed in epoxy resin solution, and glass fiber cloth 10 is immersed in epoxy resin solution mixed with graphene sheets. It is then taken out and semi-cured at 75°C to obtain a semi-cured board.

[0138] (3) The three semi-cured boards are stacked and hot-pressed at 120°C to obtain shell 100.

[0139] Measurements showed that the thickness of the shell 100 was 0.27 mm, the mass fraction of epoxy resin in the shell 100 was 73%, the mass fraction of glass fiber cloth 10 was 25%, and the mass fraction of graphene sheet was 2%.

[0140] Performance tests were conducted on the housing 100 of each embodiment and comparative example, and the test results are shown in Table 1 below.

[0141] (1) Stiffness test: The stiffness was measured using an automatic load tester.

[0142] (2) Thermal conductivity α test: ASTM D5470.

[0143] Table 1 Performance parameters of the housing 100 in each embodiment and comparative example

[0144] Example stiffness thermal conductivity α Example 1 6500N / m 140W / mK Comparative Example 1 5000N / m 0.2W / mK Comparative Example 2 5000N / m 1.244 W / (mK)

[0145] As can be seen from the test results of Example 1 and Comparative Example 1, compared with the glass fiber shell 100 without graphene (i.e., the shell 100 of Comparative Example 1), the shell 100 of Example 1 of this application, which is made by coating the surface of the glass fiber cloth 10 with graphene coating 20, then immersing it in epoxy resin, and curing and semi-curing, has higher rigidity and thermal conductivity. Therefore, when the shell 100 is used in electronic devices, it can better protect the electronic devices. Moreover, the shell 100 can be made thinner while meeting mechanical performance requirements, thus making the electronic devices lighter and thinner. Furthermore, when the shell 100 of this application is used in electronic devices, it can better dissipate heat from the motherboard and battery and other heat-generating components of the electronic devices, thereby extending the service life of the electronic devices.

[0146] The test results of Comparative Examples 1 and 2 show that, compared to the glass fiber shell 100 in Comparative Example 1 which does not contain graphene, the addition of graphene sheets to the epoxy resin in Comparative Example 2 improves the thermal conductivity of the shell 100. However, the improvement in the thermal conductivity of the shell 100 by adding graphene sheets to the epoxy resin is limited, and therefore the improvement in the heat dissipation effect of the shell 100 is also limited.

[0147] As can be seen from the test results of Example 1 and Comparative Example 2, compared with the method of directly dispersing graphene sheets of the same mass content in resin (i.e., Comparative Example 2), in Example 1 of this application, a graphene coating 20 is first deposited on the surface of the glass fiber cloth 10, then impregnated with epoxy resin, and cured to form a shell 100. This allows the shell 100 to have a higher thermal conductivity. When applied to electronic devices, it can better dissipate heat from heat-generating components such as the motherboard and battery, thereby extending the service life of the electronic devices. In addition, the shell 100 of this embodiment also has higher rigidity.

[0148] Figure 8 This is a schematic diagram of the structure of an electronic device 300 according to an embodiment of this application. Figure 9 This is a partial exploded structural diagram of an electronic device 300 according to an embodiment of this application. Figure 10 This is a circuit block diagram of an electronic device 300 according to an embodiment of this application.

[0149] Please see Figures 8 to 10 This application also provides an electronic device 300, which includes: a display screen 310, a housing 100 as described in this application embodiment, and a processor 330. The housing 100 is disposed opposite to the display screen 310. The processor 330 is located between the housing 100 and the display screen 310, and is electrically connected to the display screen 310 for controlling the display screen 310 to display.

[0150] The electronic device 300 in this application embodiment can be, but is not limited to, a mobile phone, tablet computer, laptop computer, desktop computer, smart bracelet, smartwatch, e-reader, game console, or other portable electronic device 300.

[0151] For a detailed description of the housing 100, please refer to the description of the corresponding part of the above embodiment, which will not be repeated here.

[0152] Optionally, the display screen 310 may be, but is not limited to, one or more of the following: liquid crystal display screen, light-emitting diode display screen (LED display screen), micro light-emitting diode display screen (Micro LED display screen), mini LED display screen, organic light-emitting diode display screen (OLED display screen).

[0153] Optionally, processor 330 includes one or more general-purpose processors, wherein the general-purpose processor can be any type of device capable of processing electronic instructions, including a central processing unit (CPU), microprocessor, microcontroller, main processor, controller, and ASIC, etc. Processor 330 is used to execute various types of digital storage instructions, such as software or firmware programs stored in memory, which enables the computing device to provide a wide range of services.

[0154] Optionally, the electronic device 300 of this application further includes a memory 350. The memory 350 is electrically connected to the processor 330 and is used to store the program code required for the processor 330 to run, the program code required to control the display screen 310, the display content of the display screen 310, etc.

[0155] Optionally, memory 350 may include volatile memory, such as random access memory (RAM); memory 350 may also include non-volatile memory (NVM), such as read-only memory (ROM), flash memory (FM), hard disk drive (HDD), or solid-state drive (SSD). Memory 350 may also include combinations of the above types of memory.

[0156] In some embodiments, the electronic device 300 of this application further includes a mid-frame 320 and a camera module 370. The mid-frame 320 is disposed between the display screen 310 and the housing 100, and the side of the mid-frame 320 is exposed between the housing 100 and the display screen 310. The mid-frame 320 and the housing 100 enclose an accommodating space (not shown), which is used to accommodate the processor 330, the memory 350, and the camera module 370. The camera module 370 is electrically connected to the processor 330 and is used to take pictures under the control of the processor 330.

[0157] Optionally, the housing 100 has a light-transmitting portion 101, through which the camera module 370 can take pictures. That is, in this embodiment, the camera module 370 is a rear-facing camera module 370. It is understood that in other embodiments, the light-transmitting portion 101 may be disposed on the display screen 310, that is, the camera module 370 is a front-facing camera module 370. In the schematic diagram of this embodiment, the light-transmitting portion 101 is shown as an opening. In other embodiments, the light-transmitting portion 101 may not be an opening, but may be made of a light-transmitting material, such as plastic or glass.

[0158] It is understood that the electronic device 300 described in this embodiment is merely one form of the electronic device 300 used in the housing 100, and should not be construed as a limitation on the electronic device 300 provided in this application, nor should it be construed as a limitation on the housing 100 provided in various embodiments of this application.

[0159] In this application, the terms "embodiment" and "implementation" mean that a specific feature, structure, or characteristic described in connection with an embodiment can be included in at least one embodiment of this application. The appearance of these phrases in various locations throughout the specification does not necessarily refer to the same embodiment, nor are they independent or alternative embodiments mutually exclusive with other embodiments. Those skilled in the art will understand, explicitly and implicitly, that the embodiments described in this application can be combined with other embodiments. Furthermore, it should be understood that the features, structures, or characteristics described in the various embodiments of this application can be arbitrarily combined to form another embodiment that does not depart from the spirit and scope of the technical solution of this application, provided there is no contradiction between them.

[0160] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of this application and are not intended to limit it. Although this application has been described in detail with reference to the above preferred embodiments, those skilled in the art should understand that modifications or equivalent substitutions to the technical solutions of this application should not depart from the spirit and scope of the technical solutions of this application.

Claims

1. A housing characterized by, include: Fiber cloth; A graphene coating is disposed on a portion of the surface of the fiber cloth; the thickness h of the graphene coating is in the range of 0.2 μm ≤ h ≤ 10 μm; as well as A resin layer, which is wrapped around the surface of the fiber cloth and the graphene coating.

2. The housing of claim 1, wherein The housing includes a first region and a second region connected together, the second region being disposed around the outer periphery of the first region, the graphene coating covering the portion of the fiber cloth located in the first region, and the graphene coating avoiding the portion of the fiber cloth located in the second region.

3. The housing of claim 2, wherein, The line width w of the second region is in the range of 4mm ≤ w ≤ 12mm.

4. The case according to claim 1, characterized by The thermal conductivity α of the shell is in the range of 130W / mK≤α≤180W / mK.

5. The case according to claim 1, characterized by The stiffness of the shell, which has a thickness of 0.27 mm, ranges from 5500 N / m to 7000 N / m.

6. The housing according to any one of claims 1 to 5, characterized in that The graphene coating is deposited on a portion of the surface of the fiber cloth using a deposition method.

7. A method of producing a case, characterized by, The preparation method includes: Provide fiber cloth; A graphene coating is deposited in a portion of the fiber cloth to obtain a graphene fiber cloth; and The montmorillonite fiber cloth is immersed in a resin solution, and the resin solution is cured to form a resin layer, thus obtaining the shell.

8. The method of producing a case according to claim 7, characterized by, The fiber cloth includes a first part and a second part connected together, the second part being disposed around the outer periphery of the first part; the deposition of a graphene coating in a portion of the fiber cloth to obtain the graphene fiber cloth includes: A mask layer is provided on the second part of the fiber cloth; and In an inert atmosphere and at a temperature of 850°C to 950°C, a carbon-containing gas and hydrogen are introduced to deposit a graphene coating on the first portion of a portion of the fiber cloth, wherein the flow ratio of the carbon-containing gas to the hydrogen is 3:1 to 8:

1.

9. An electronic device, comprising: include: Display screen; The housing according to any one of claims 1-6, wherein the housing is disposed opposite to the display screen; as well as A processor is located between the housing and the display screen, and is electrically connected to the display screen for controlling the display screen to display content.

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