Electronic equipment shell and electronic equipment

Abstract

The embodiment of the invention provides an electronic equipment shell and electronic equipment, and relates to the technical field of electronic equipment. The electronic equipment shell comprises a front frame, a middle frame, a rear shell and a heat dissipation part. The front frame and the rear shell are respectively connected with the middle frame. The heat dissipation component has an evaporation end and a condensation end, and the evaporation end is close to the electronic component relative to the condensation end. The heat dissipation component is configured to accommodate a working medium. Wherein the middle frame covers the heat dissipation component; and / or, the rear shell covers the heat dissipation part. In the embodiment of the invention, the middle frame wraps the heat dissipation component, and / or the rear shell wraps the heat dissipation component, so that the electronic equipment shell can play a role in temperature equalization and heat dissipation, the performance of the electronic equipment is improved, the heat dissipation component does not need to additionally occupy the accommodating space enclosed by the electronic equipment shell, and miniaturization of the electronic equipment is facilitated.

Description

Technical Field

[0001] Embodiments of the present application relate to the technical field of electronic devices, and in particular, to an outer shell of an electronic device and an electronic device. Background Art

[0002] Electronic devices include electronic components. When the electronic components are working, they will emit a large amount of heat, which increases the temperature around the electronic components, affects the temperature uniformity of the electronic device, and reduces the performance of the electronic device. Summary of the Invention

[0003] Embodiments of the present application provide an outer shell of an electronic device and an electronic device, which are used to improve the temperature uniformity of the electronic device, thereby improving the performance of the electronic device.

[0004] On the one hand, embodiments of the present application provide an outer shell of an electronic device. The outer shell of the electronic device includes a front frame, a middle frame, a rear shell, and a heat dissipation component. The front frame and the rear shell are respectively connected to the middle frame. The heat dissipation component has an evaporation end and a condensation end, and the evaporation end is closer to the electronic components than the condensation end. The heat dissipation component is configured to accommodate a working medium. Wherein, the middle frame covers the heat dissipation component; and / or, the rear shell covers the heat dissipation component.

[0005] In embodiments of the present application, the working medium in the heat dissipation component can flow between the evaporation end and the condensation end. It can be understood that setting the evaporation end of the heat dissipation component closer to the electronic components than the condensation end enables the working medium to exchange heat with the electronic components at the evaporation end and then flow to the condensation end to condense and release heat, so that the outer shell of the electronic device can play a role in uniform temperature heat dissipation, improve the temperature uniformity of the electronic device, and improve the performance of the electronic device. And setting the middle frame and / or the rear shell to cover the heat dissipation component enables the heat dissipation component not to additionally occupy the accommodation space enclosed by the outer shell of the electronic device, which is beneficial to the miniaturization of the electronic device.

[0006] In some possible implementation manners, the heat dissipation component is a pulsating heat pipe. With such a setting, the working medium in the heat dissipation component can flow under the action of thermal drive, that is, the outer shell of the electronic device can achieve uniform temperature heat dissipation through phase change, without consuming external mechanical work or electric work, simplifies the structure of the outer shell of the electronic device, is beneficial to the miniaturization of the electronic device, and can reduce the cost of the electronic device.

[0007] In some possible implementation manners, the heat dissipation component includes a pipeline body and a plurality of heat exchange grooves, and the plurality of heat exchange grooves are formed in the inner wall of the pipeline body. The distance between any one of the heat exchange grooves and the evaporation end is less than the distance between the heat exchange groove and the condensation end. With such a setting, a part of the liquid working medium can flow into the heat exchange groove, so that bubbles can be formed in the liquid working medium located in the pipeline body. The distance between any one of the heat exchange grooves and the evaporation end is less than the distance between the heat exchange groove and the condensation end, so that a plurality of bubbles can be formed in the liquid working medium near the evaporation end, making it easier to form a state in which a bubble column and a liquid column are arranged at intervals near the evaporation end, and improving the heat exchange efficiency of the heat dissipation component.

[0008] In some possible implementation manners, the pipeline body includes a plurality of branch pipes and a plurality of connecting pipes. The plurality of branch pipes extend along a second direction and are arranged at intervals along a first direction, and the first direction intersects with the second direction. The plurality of connecting pipes include a first connecting pipe and a second connecting pipe. The first connecting pipe is located on one side of the plurality of branch pipes along the second direction, and the second connecting pipe is located on the side of the plurality of branch pipes away from the first connecting pipe along the second direction. Any one of the connecting pipes communicates with at least two branch pipes. The plurality of branch pipes are arranged to extend along the first direction and be spaced along the second direction, and the connecting pipes communicate with at least two branch pipes, so that the pipeline body can extend to different positions of the electronic device housing (the middle frame and / or the rear shell) along the first direction and the second direction, that is, the working medium can exchange heat with different positions of the electronic device housing (the middle frame and / or the rear shell), improving the uniform temperature heat dissipation effect of the electronic device housing.

[0009] In some possible implementation manners, the heat exchange grooves are formed in the inner wall of the branch pipes. With such a setting, the convenience of processing the heat exchange grooves can be improved, that is, the convenience of processing the heat dissipation component is improved.

[0010] In some possible implementation manners, the number of both the first connecting pipes and the second connecting pipes is a plurality. Any one of the plurality of first connecting pipes is an evaporation end, and any one of the plurality of second connecting pipes is a condensation end. With such a setting, the number of both the evaporation end and the condensation end can be a plurality, improving the heat exchange efficiency of the heat dissipation component.

[0011] In some possible implementation manners, the plurality of condensation ends are arranged at intervals. With such a setting, the mutual influence of the working medium in adjacent two condensation ends during heat release can be reduced, improving the uniform temperature heat dissipation effect of the electronic device housing, and thus improving the performance of the electronic device.

[0012] In some possible implementation manners, the plurality of branch pipes include a plurality of first branch pipes and a plurality of second branch pipes, and the plurality of first branch pipes and the plurality of second branch pipes are alternately arranged in a first direction. The width of the first branch pipe in the first direction is a first width, and the width of the second branch pipe in the first direction is a second width, and the first width is greater than the second width. With such an arrangement, the diameters of the first branch pipe and the second branch pipe in the first direction can be different, so that the pressures of two adjacent branch pipes (the first branch pipe and the second branch pipe) in the first direction can be different, and the pressure imbalance between two adjacent branch pipes can restrict the flow direction of the working medium in the pipeline body, reduce the time for the heat dissipation component to work in an oscillating state, and improve the heat exchange efficiency of the heat dissipation component.

[0013] In some possible implementation manners, the ratio of the first width to the second width is in the range of 1.5 to 3.0. With such an arrangement, it is possible to avoid the ratio of the first width to the second width being too large (for example, greater than 3.0), which may cause the width of the first branch pipe in the first direction to be too large and the pressure in the first branch pipe to be too small; and it is possible to avoid the width of the second branch pipe in the first direction being too small and the pressure in the second branch pipe being too large, so that the working medium can flow through the first branch pipe to the condensation end and through the second branch pipe to the evaporation end. In addition, it is also possible to avoid the ratio of the first width to the second width being too small (for example, less than 1.5), which may cause the pressure difference between the first branch pipe and the second branch pipe to be too small, so that the pipeline body can restrict the flow direction of the working medium.

[0014] In some possible implementation manners, the depth of the first branch pipe in a third direction is a first depth, and the depth of the second branch pipe in the third direction is a second depth, and the third direction intersects with the plane where the first direction and the second direction are located. The sum of the first width and the second width is W0, and the sum of the first depth and the second depth is H0. W0 / H0 is in the range of 1.5 to 3.0. With such an arrangement, it is possible to restrict the pressure in the branch pipe from two aspects of the width and the depth of the branch pipe, so that the pressures of two adjacent branch pipes (the first branch pipe and the second branch pipe) in the first direction can be different, and the pressure imbalance between two adjacent branch pipes can restrict the flow direction of the working medium in the pipeline body, reduce the time for the heat dissipation component to work in an oscillating state, and improve the heat exchange efficiency of the heat dissipation component.

[0015] In some possible implementation manners, when the rear case covers the heat dissipation component, the rear case includes a first sub - part and a second sub - part. A body groove is formed on the surface of the first sub - part, and a plurality of heat exchange grooves are formed on the surface of the second sub - part. The second sub - part is stacked with the second sub - part to enclose the heat dissipation component with the body groove and the plurality of heat exchange grooves. With such an arrangement, the rear case can cover the heat dissipation component and improve the processing convenience of the rear case.

[0016] In some possible implementation manners, in the first sub - part and the second sub - part, the sub - part far from the middle frame is made of a transparent material. With such a setting, the flow condition of the working fluid in the heat dissipation component can be visually observed through the transparent sub - part (the first sub - part or the second sub - part), so as to obtain the working state of the heat dissipation component (such as the oscillation state of the bubble column and the liquid column). On the one hand, when a failure (such as liquid leakage) occurs in the heat dissipation component, timely maintenance, replacement and other treatments can be carried out, improving the high reliability of the use of the electronic device housing. On the other hand, the visualization of the flow condition of the working fluid in the heat dissipation component can improve the user experience.

[0017] In some possible implementation manners, when the rear shell covers the heat dissipation component, the rear shell includes a third heat - dissipating sub - part, and the third sub - part covers the heat dissipation component. With such a setting, the structure of the rear shell can be simplified, which is beneficial to the miniaturization of the electronic device.

[0018] In some possible implementation manners, the rear shell further includes a fourth sub - part and a fifth sub - part. The fourth sub - part and the fifth sub - part are located on both sides of the third sub - part, and the fourth sub - part and the fifth sub - part are respectively arranged in a stacked manner with the third sub - part. With such a setting, the fourth sub - part and the fifth sub - part can play a role in protecting the third sub - part and the heat dissipation component, improving the reliability of the use of the rear shell.

[0019] In some possible implementation manners, the length of the heat - exchange groove along the extension direction of the pipeline body is in the range of 0.1 mm to 3 mm. With such a setting, it can be avoided that the length of the heat - exchange groove along the extension direction of the pipeline body is too large (such as greater than 3 mm) or too small (such as less than 0.1 mm), making it easier to form a state where the bubble column and the liquid column are arranged at intervals near the evaporation end, and improving the heat - exchange efficiency of the heat dissipation component.

[0020] In some possible implementation manners, the heat dissipation component further includes a check valve, and the check valve is communicated with the pipeline body. With such a setting, the flow direction of the working fluid in the pipeline body can be restricted, so that the working fluid in the pipeline body can circulate in the same direction between multiple evaporation ends and multiple condensation ends, improving the heat - exchange efficiency of the heat dissipation component.

[0021] In some possible implementation manners, the liquid filling rate of the working fluid in the heat dissipation component is in the range of 30% to 70%. With such a setting, it can be avoided that the liquid filling rate of the working fluid in the heat dissipation component is too large (such as greater than 70%), resulting in too small a space for accommodating the bubble column in the heat dissipation component, which affects the flow of the liquid working fluid pushed by the bubble column; and it can also be avoided that the liquid filling rate of the working fluid in the heat dissipation component is too small (such as less than 30%), which affects heat transfer.

[0022] In some possible implementations, the middle frame includes a frame and a middle plate. The front frame is connected to one side edge of the frame, and the rear shell is connected to the side edge of the frame away from the front frame to enclose an accommodation space. The middle plate is located inside the accommodation space and connected to the middle frame. When the heat dissipation component is covered by the middle frame, the frame covers the heat dissipation component; and / or, the middle plate covers the heat dissipation component. With such an arrangement, the flexibility of setting the heat dissipation component can be improved to meet different usage requirements. Moreover, it enables the heat dissipation component not to additionally occupy the accommodation space enclosed by the housing of the electronic device, which is beneficial to the miniaturization of the electronic device.

[0023] On the other hand, embodiments of the present application provide an electronic device. The electronic device includes electronic components and the electronic device housing as described above. The electronic components are located inside the accommodation space enclosed by the electronic device housing.

[0024] The electronic device provided by the embodiments of the present application includes the electronic device housing as described above, and thus has all the above beneficial effects, which will not be elaborated here. Description of the Drawings

[0025] Figure 1 It is a schematic structural diagram of an electronic device provided by some embodiments of the present application;

[0026] Figure 2 It is a schematic structural diagram of an electronic device provided by some other embodiments of the present application;

[0027] Figure 3 It is a schematic structural diagram of a rear shell provided by some embodiments of the present application;

[0028] Figure 4 It is a schematic diagram of the temperature regions of a rear shell provided by some embodiments of the present application;

[0029] Figure 5 It is a schematic structural diagram of an electronic device provided by some other embodiments of the present application;

[0030] Figure 6 It is a schematic structural diagram of an electronic device provided by some other embodiments of the present application;

[0031] Figure 7 It is a schematic diagram of the temperature regions of a heat dissipation component provided by some embodiments of the present application;

[0032] Figure 8 It is a schematic diagram of the positional relationship between electronic components and a heat dissipation component provided by some embodiments of the present application;

[0033] Figure 9 It is a schematic diagram of the positional relationship between electronic components and a heat dissipation component provided by some other embodiments of the present application;

[0034] Figure 10Schematic structural diagram of a heat dissipation component provided by some embodiments of the present application;

[0035] Figure 11 Schematic cross-sectional diagram of a heat dissipation component provided by some embodiments of the present application;

[0036] Figure 12 Schematic partial structural diagram of a heat dissipation component provided by some embodiments of the present application;

[0037] Figure 13 Schematic structural diagram of a Tesla valve provided by some embodiments of the present application;

[0038] Figure 14 Schematic structural diagram of a Tesla valve provided by some other embodiments of the present application;

[0039] Figure 15 Provided by some embodiments of the present application Figure 12 Local enlarged schematic diagram of the G region in;

[0040] Figure 16 Provided by some other embodiments of the present application Figure 12 Local enlarged schematic diagram of the G region in;

[0041] Figure 17 Provided by some other embodiments of the present application Figure 12 Local enlarged schematic diagram of the G region in;

[0042] Figure 18 Provided by some other embodiments of the present application Figure 12 Local enlarged schematic diagram of the G region in;

[0043] Figure 19 Schematic cross-sectional diagram of a heat dissipation component provided by some other embodiments of the present application;

[0044] Figure 20 Schematic cross-sectional diagram of a heat dissipation component provided by some other embodiments of the present application. Detailed implementation manners

[0045] Next, the technical solutions in some embodiments of the present application will be clearly and completely described in conjunction with the accompanying drawings. Obviously, the described embodiments are only a part of the embodiments of the present application, rather than all the embodiments. Based on the embodiments provided by the present application, all other embodiments obtained by those of ordinary skill in the art belong to the scope of protection of the present application.

[0046] Unless the context otherwise requires, throughout the specification and claims, the term "comprising" and its other forms, such as the third-person singular form "comprises" and the present participle form "comprising", are construed as open, inclusive meanings, i.e., "including, but not limited to". In the description of the specification, the terms "one embodiment", "some embodiments", "exemplary embodiments", "examples", "specific examples", or "some examples", etc. are intended to indicate that the specific features, structures, materials, or characteristics related to the embodiment or example are included in at least one embodiment or example of the present application. The schematic representations of the above terms do not necessarily refer to the same embodiment or example. In addition, the described specific features, structures, materials, or characteristics may be included in any one or more embodiments or examples in any appropriate manner.

[0047] Hereinafter, the terms "first" and "second" are used only for descriptive purposes and should not be construed as indicating or implying relative importance or implicitly specifying the quantity of the indicated technical features. Thus, the features defined with "first" and "second" may explicitly or implicitly include one or more of such features. In the description of the embodiments of the present application, unless otherwise stated, the meaning of "a plurality" is two or more.

[0048] Figure 1 The structural schematic diagram of the electronic device provided for some embodiments of the present application. Figure 2 The structural schematic diagram of the electronic device provided for some other embodiments of the present application. Figure 3 The structural schematic diagram of the rear shell provided for some embodiments of the present application. In the attached drawings of the specification of the present application, taking Figure 2 as an example, only a part of the components included in the electronic device 200 is shown, and the display panel 202 is not shown. It can be understood that the components included in the electronic device 200 are not limited to Figure 1 and Figure 2 the components shown therein.

[0049] As Figure 1 and Figure 2 shown, the embodiments of the present application provide an electronic device 200. The electronic device 200 may be a mobile phone, a tablet computer, a personal computer, a smart bracelet, etc. It can be understood that the embodiments of the present application do not further limit the types of the electronic device 200.

[0050] In some examples, as Figure 2 shown, the electronic device 200 includes an electronic device housing 100 and electronic components 201, and the electronic components 201 are located in the accommodation space surrounded by the electronic device housing 100. Exemplarily, the electronic device housing 100 includes a front frame 101, a middle frame 102, and a rear shell 103. The front frame 101 and the rear shell 103 are respectively connected to the middle frame 102 to surround the accommodation space.

[0051] In some examples, such as Figure 2 shown, the middle frame 102 includes a frame 102a and a middle plate 102b. The frame 102a can be an annular structure, and the middle plate 102b can be a flat plate-like structure. The front frame 101 is connected to one side edge of the frame 102a, and the rear shell 103 is connected to the side edge of the frame 102a away from the front frame 101 to enclose an accommodation space.

[0052] Exemplarily, the front frame 101 and the rear shell 103 can be respectively connected to the frame 102a by snap connection. Alternatively, the front frame 101 and the rear shell 103 can also be respectively connected to the frame 102a by bonding. It can be understood that the connection manners of the front frame 101 and the rear shell 103 to the frame 102a can be the same or different.

[0053] The middle plate 102b is located within the accommodation space and is connected to the middle frame 102a. Exemplarily, the frame 102a surrounds the middle plate 102b and is connected to the middle plate 102b. It can be understood that the middle plate 102b is the skeleton of the electronic device 200 and plays a supporting role. The middle plate 102b and the frame 102a can be connected by welding, bonding or the like, or the middle plate 102b and the frame 102a can also be integrally formed to improve the connection reliability between the two.

[0054] It can be understood that the material of the electronic device housing 100 can be non-metallic, such as plastic, glass, etc.; or the material of the electronic device housing 100 can also be metal or alloy, such as at least one of gold, silver, copper, iron, and aluminum. The materials of the front frame 101, the middle frame 102 (including the frame 102a and the middle plate 102b) and the rear shell 103 can be the same or different. In some examples, the middle frame 102 can be made of metal material, and the rear shell 103 can be made of glass material.

[0055] Exemplarily, such as Figure 2 shown, the front frame 101 is provided with a first through hole 101a. As Figure 1 shown, the electronic device 200 further includes a display panel 202. The display panel 202 is located within the accommodation space between the middle plate 102b and the front frame 101, and the display panel 202 is embedded in the first through hole 101a and connected to the front frame 101.

[0056] Understandably, the display panel 202 is used to display image information. The display panel 202 can be used to display static images, such as pictures or photos; or, the display panel 202 can also be used to display dynamic images, such as videos or game screens. The display panel 202 can be an OLED (English full name: organic light-emitting diode, Chinese name: organic light-emitting diode) display panel; or, the display panel 202 can also be other types of display panels. Setting the display panel 202 to be embedded in the first through hole 101a and connected to the front frame 101 can prevent the front frame 101 from blocking the image information displayed by the display panel 202.

[0057] Exemplarily, the electronic device 200 may further include a main board (not shown in the figure), and the main board is located in the accommodation space between the middle board 102b and the rear case 103. Exemplarily, the main board can be connected to the middle board 102b. The main board can be a PCB (English full name: printed circuit board, Chinese name: printed circuit board), and the electronic component 201 is electrically connected to the main board.

[0058] The electronic component 201 can be a chip, such as a central processing unit (English full name: central processing unit, English abbreviation: CPU), a graphics processing unit (English full name: graphics processing unit, English abbreviation: GPU), or a storage chip, etc.; or, the electronic component 201 can also be a capacitor or a resistor, etc. The number of the electronic components 201 can be multiple, and the types of the multiple electronic components 201 can be the same or different. The embodiments of the present application do not further limit the type of the electronic component 201. Setting the electronic component 201 in the accommodation space surrounded by the electronic device housing 100 enables the electronic device housing 100 to play a protective role for the electronic device 201.

[0059] Exemplarily, as Figure 3 shown, the rear case 103 is provided with a second through hole 103a and a third through hole 103b, and the second through hole 103a and the third through hole 103b can be arranged at intervals along the second direction Y; or, the second through hole 103a and the third through hole 103b can also be arranged at intervals along the first direction X. The first direction X and the second direction Y intersect, and in some examples, the first direction X and the second direction Y are perpendicular or approximately perpendicular.

[0060] In some examples, the rear housing 103 is rectangular, the first direction X is parallel to the short side of the rectangle, and the second direction Y is parallel to the long side of the rectangle. In other examples, the first direction X is parallel to the long side of the rectangle, and the second direction Y is parallel to the short side of the rectangle. In still other examples, the first direction X has an angle with respect to both the long side and the short side of the rectangle, and the second direction Y has an angle with respect to both the long side and the short side of the rectangle. It can be understood that the plane where the first direction X and the second direction Y are located is parallel to the display surface of the display panel 202.

[0061] The electronic device 200 may include a camera and a flash. The camera and the flash are located in the accommodation space between the middle plate 102b and the rear housing 103, and the camera is embedded in the second through hole 103a and connected to the rear housing 103, and the flash is embedded in the third through hole 103b and connected to the rear housing 103.

[0062] It can be understood that the camera can implement an image acquisition function, and the flash can provide supplementary lighting when the camera acquires image information. With such a setting, the electronic device 200 can also acquire image information in poor light, improving the performance of the electronic device 200.

[0063] For example, the number of cameras can be multiple. At this time, the rear housing 103 may be provided with one second through hole 103a, and multiple cameras are embedded in the same second through hole 103a and connected to the rear housing 103. Alternatively, the rear housing 103 may also be provided with multiple second through holes 103a, and at least one camera is embedded in one second through hole 103a and connected to the rear housing 103.

[0064] For example, the number of flashes can be multiple. At this time, the rear housing 103 may be provided with one third through hole 103b, and multiple flashes are embedded in the same third through hole 103b and connected to the rear housing 103. Alternatively, the rear housing 103 may also be provided with multiple third through holes 103b, and at least one flash is embedded in one third through hole 103b and connected to the rear housing 103.

[0065] It can be understood that the embodiments of the present application do not further limit the number, shape of the second through hole 103a and the third through hole 103b, and the setting positions of the second through hole 103a and the third through hole 103b, etc.

[0066] For example, as Figure 3 shown, the rear housing 103 has a first edge L1 and a second edge L2 that are oppositely arranged along the second direction Y. The second through hole 103a and the third through hole 103b may be close to the first edge L1 along the second direction Y. In some examples, the first edge L1 is the upper edge of the rear housing 103, and the second edge L2 is the lower edge of the rear housing 103. That is, when the electronic device 200 is in use, the first edge L1 is generally farther from the ground than the second edge L2.

[0067] Figure 4 Schematic diagram of the temperature regions of the rear case provided for some embodiments of the present application.

[0068] Taking the electronic component 201 as the CPU as an example, the CUP is located between the middle plate 102b and the rear case 103. By way of example, the CPU can be attached to the surface of the rear case 103 close to the middle plate 102b; alternatively, the CPU can also be spaced from the surface of the rear case 103 close to the middle plate 102b. In some other examples, the CPU can also be disposed at other positions. The embodiments of the present application do not further limit the setting position of the electronic component 201.

[0069] When the CPU is working, it will emit a large amount of heat, resulting in an increase in the temperature around the electronic component 201, causing the electronic device 200 to have uneven temperature, which affects the performance of the electronic device 200.

[0070] In some examples, as Figure 4 shown, in the second direction Y, the distance between the CPU and the first edge L1 is less than the distance between the CPU and the second edge L2. Along the direction from the first edge L1 to the second edge L2, the temperature of the rear case 103 will gradually decrease. By way of example, the rear case 103 can be divided into 8 temperature regions along the direction from the first edge L1 to the second edge L2, namely the A1 temperature region to the A8 temperature region.

[0071] The temperatures at different positions within each temperature region are approximately the same, that is, the temperature difference between different positions within each temperature region is small, for example, it can be less than or equal to 1.3 °C (unit: degree Celsius). The temperatures in different temperature regions are different, that is, the temperature difference between different temperature regions is large, for example, it can be greater than 1.3 °C. It can be understood that the embodiments of the present application do not further limit the value of the temperature difference between different positions within each temperature region and the value of the temperature difference between different temperature regions.

[0072] As Figure 4 shown, the A1 temperature region is adjacent to the first edge L1 of the rear case 103 along the second direction Y. The heat dissipated by the CPU will quickly spread to the A1 temperature region, making the temperature in the A1 temperature region relatively high. By way of example, the temperature of the A1 temperature region can be 48.6896 °C. The A2 temperature region is located on the side of the A1 temperature region away from the first edge L1 along the second direction Y, and the temperature is lower than that of the A1 temperature region. By way of example, the temperature of the A2 temperature region can be 44.4965 °C.

[0073] The A3 temperature region is located on the side of the A2 temperature region away from the first edge L1 along the second direction Y, and the temperature is lower than that of the A2 temperature region. For example, the temperature of the A3 temperature region can be 42.5807 °C. In some examples, the A3 temperature region may include a first sub-temperature region and a second sub-temperature region. The first sub-temperature region is closer to the first edge L1 than the second sub-temperature region, and the temperature of the first sub-temperature region is higher than that of the second sub-temperature region.

[0074] The A4 temperature region is located on the side of the A3 temperature region away from the first edge L1 along the second direction Y, and the temperature is lower than that of the A3 temperature region. For example, the temperature of the A4 temperature region can be 41.7903 °C. The A5 temperature region is located on the side of the A4 temperature region away from the first edge L1 along the second direction Y, and the temperature is lower than that of the A4 temperature region. For example, the temperature of the A5 temperature region can be 41.5827 °C. The A6 temperature region is located on the side of the A5 temperature region away from the first edge L1 along the second direction Y, and the temperature is lower than that of the A5 temperature region. For example, the temperature of the A6 temperature region can be 40.3580 °C.

[0075] The A7 temperature region is located on the side of the A6 temperature region away from the first edge L1 along the second direction Y, and the temperature is lower than that of the A6 temperature region. For example, the temperature of the A7 temperature region can be 39.7220 °C. In some examples, the A7 temperature region may include a third sub-temperature region A7a and a fourth sub-temperature region A7b arranged at intervals, and the temperatures of the third sub-temperature region A7a and the fourth sub-temperature region A7b may be the same or different.

[0076] The A8 temperature region is adjacent to the second edge L2 of the rear case 103 along the second direction Y, so that the distance between the A8 temperature region and the electronic component 201 is relatively far and the temperature is relatively low. For example, the temperature of the A8 temperature region can be 39.0932 °C.

[0077] It can be understood that Figure 4 the different temperature regions in are only illustrative, and the temperature regions of the rear case 103 will be different according to the setting position of the CPU. The embodiments of the present application do not further limit the shape, number, arrangement method of the temperature regions of the rear case 103, and the temperature in different temperature regions, etc.

[0078] It can be seen that the heat dissipated by the electronic component 201 will cause the temperature of the electronic device 200 to be uneven. In some implementation manners, the electronic device 200 includes a pulsating heat pipe (English full name: pulsating heat pipe, English abbreviation: PHP) and a vapor chamber (English full name: vapor chamber, English abbreviation: VC), and the pulsating heat pipe and the vapor chamber are arranged in the accommodation space.

[0079] The vacuum heat pipe has a heat dissipation cavity. The evaporation end of the pulsating heat pipe extends into the heat dissipation cavity and is fixedly connected to the side wall of the vacuum heat pipe. The condensation end of the pulsating heat pipe is located outside the heat dissipation cavity of the vacuum heat pipe. The vacuum heat pipe absorbs the heat of the electronic component 201 and transfers it to the evaporation end of the pulsating heat pipe. The working fluid flows in the pulsating heat pipe to transfer the heat to the condensation end of the pulsating heat pipe, and dissipates the heat to the air through the condensation end of the pulsating heat pipe, playing a role in temperature equalization and heat dissipation. For example, fins can be respectively arranged at the evaporation end and the condensation end of the pulsating heat pipe to improve the heat transfer efficiency.

[0080] Taking the electronic device 200 as a mobile phone as an example, with the miniaturization of the hardware SIP (full English name: system in package, Chinese name: system-level packaging), the space for arranging the pulsating heat pipe and the vacuum heat pipe in the mobile phone is limited, resulting in the deteriorating temperature equalization and heat dissipation ability of the mobile phone, which affects the performance of the mobile phone.

[0081] Figure 5 Schematic diagram of the structure of an electronic device provided by some other embodiments of the present application. Figure 6 Schematic diagram of the structure of an electronic device provided by some other embodiments of the present application. Figure 7 Schematic diagram of the temperature region of a heat dissipation component provided by some embodiments of the present application. Figure 8 Schematic diagram of the positional relationship between an electronic component and a heat dissipation component provided by some embodiments of the present application. Figure 9 Schematic diagram of the positional relationship between an electronic component and a heat dissipation component provided by some other embodiments of the present application.

[0082] Based on this, as Figure 5 and Figure 6 shown, an embodiment of the present application provides an electronic device housing 100, which includes a front frame 101, a middle frame 102, and a rear case 103. The front frame 101 and the rear case 103 are respectively connected to the middle frame 102.

[0083] It can be understood that the middle frame 102 includes a frame 102a and a middle plate 102b. The front frame 101 and the rear case 103 can be respectively connected to the frame 102a to enclose an accommodation space. The middle plate 102b is located in the accommodation space and is connected to the frame 102a. The above embodiments of the present application have illustrated the front frame 101, the middle frame 102, the rear case 103, etc., and will not be elaborated here.

[0084] In some examples, as Figure 5 and Figure 6 shown, the electronic device housing 100 further includes a heat dissipation component 110. The heat dissipation component 110 has an evaporation end 110a and a condensation end 110b. The evaporation end 110a is closer to the electronic component 201 than the condensation end 110b. The heat dissipation component 110 is configured to accommodate the working fluid.

[0085] Understandably, the working fluid in the heat dissipation component 110 can flow between the evaporation end 110a and the condensation end 110b, enabling the heat dissipation component 110 to play a heat dissipation role. By way of example, the heat dissipation component 110 can be a VC or a PHP.

[0086] Wherein, the middle frame 102 wraps the heat dissipation component 110; and / or, the rear shell 103 wraps the heat dissipation component 110.

[0087] Understandably, when the middle frame 102 wraps the heat dissipation component 110, the heat dissipation component 110 is completely embedded in the middle frame 102. By way of example, the heat dissipation component 110 can be formed in the middle frame 102 by stamping or etching, that is, the middle frame 102 and the heat dissipation component 110 are an integrally formed structure. When the rear shell 103 wraps the heat dissipation component 110, the heat dissipation component 110 is completely embedded in the rear shell 103. By way of example, the heat dissipation component 110 can be formed in the rear shell 103 by stamping or etching, that is, the rear shell 103 and the heat dissipation component 110 are an integrally formed structure.

[0088] When the middle frame 102 and the rear shell 103 wrap the heat dissipation component 110, the number of the heat dissipation components 110 can be at least two, the middle frame 102 wraps one of the heat dissipation components 110, and the rear shell 103 wraps the other heat dissipation component 110. Or, the number of the heat dissipation components 110 is one, the middle frame 102 can wrap a part of the heat dissipation component 110, and the rear shell 103 can wrap another part of the heat dissipation component 110. Understandably, in the accompanying drawings of the specification of the present application, taking Figure 5 as an example, in order to clearly show the positional relationship between the heat dissipation component 110 and the rear shell 103, the heat dissipation component 110 is shown on the rear shell 103, which does not mean that the heat dissipation component 110 is located on the surface of the rear shell 103.

[0089] Taking the heat dissipation component 110 as a PHP as an example, the evaporation end 110a and the condensation end 110b can be the ends of the heat dissipation component 110, or the evaporation end 110a and the condensation end 110b can also be a part of the pipe section of the heat dissipation component 110. When the heat dissipation component 110 is in a working state, the working fluid can flow between the evaporation end 110a and the condensation end 110b of the heat dissipation component 110. In some examples, the working fluid can be acetone, R141b (Chinese: dichloro-fluoroethane) or water, etc. The evaporation end 110a is closer to the electronic component 201 than the condensation end 110b, enabling the working fluid to absorb the heat dissipated by the electronic component 201 at the evaporation end 110a, then flow to the condensation end 110b, and release the heat at the condensation end 110b, playing a role of temperature equalization and heat dissipation, and improving the temperature uniformity of the electronic device 200.

[0090] In some examples, the heat dissipation component 110 has a plurality of evaporation ends 110a and a plurality of condensation ends 110b. The number of the evaporation ends 110a and the condensation ends 110b may be the same or different. Any one of the evaporation ends 110a is closer to the electronic component 201 than any one of the condensation ends 110b. The working medium can flow between the plurality of evaporation ends 110a and the plurality of condensation ends 110b, improving the heat exchange efficiency of the heat dissipation component 110.

[0091] Understandably, along the direction from the evaporation end 110a to the condensation end 110b, the temperature of the working medium in the heat dissipation component 110 gradually decreases. As Figure 7 shown, taking the example that the distance between the rear case 103 covering the heat dissipation component 110, the electronic component 201 and the first edge L1 is less than the distance between the electronic component 201 and the second edge L2, along the direction from the first edge L1 to the second edge L2, the heat dissipation component 110 can be divided into 4 temperature regions, namely the M1 temperature region to the M4 temperature region.

[0092] The temperature of the working medium at different positions within each temperature region is approximately the same, that is, the temperature difference at different positions within each temperature region is small, for example, it can be less than or equal to 0.16 °C (unit: degree Celsius). The temperature of the working medium in different temperature regions is different, that is, the temperature difference between different temperature regions is large, for example, it can be greater than 0.16 °C. Understandably, the embodiments of the present application do not further limit the value of the temperature difference at different positions within each temperature region and the value of the temperature difference between different temperature regions.

[0093] The M1 temperature region is close to the electronic component 201 along the second direction Y, so that the temperature of the working medium in the M1 temperature region is relatively high. By way of example, the electronic component 201 is disposed adjacent to the second through hole 103a along the first direction X. In this way, the temperature of the working medium in the heat dissipation component 110 adjacent to the second through hole 103a along the first direction X in the M1 temperature region is the highest, for example, it can be 42.9505 °C. In the M1 temperature region, the temperature of the working medium in the heat dissipation component 110 away from the second through hole 103a along the first direction X is relatively high, for example, it can be 42.5807 °C.

[0094] By way of example, the pipe section of the heat dissipation component 110 located in the M1 temperature region and adjacent to the first edge L1 along the second direction Y is the evaporation end 110a of the heat dissipation component 110.

[0095] The M2 temperature region is located on the side of the M1 temperature region away from the electronic component 201 along the second direction Y. The temperature of the working fluid in the M2 temperature region is lower than that of the working fluid in the M1 temperature region. For example, the temperature of the working fluid in the M2 temperature region is 42.4411 °C. The M3 temperature region is located on the side of the M2 temperature region away from the M1 temperature region along the second direction Y. The temperature of the working fluid in the M3 temperature region is lower than that of the working fluid in the M2 temperature region. For example, the temperature of the working fluid in the M3 temperature region is 42.0288 °C.

[0096] The M4 temperature region is located on the side of the M3 temperature region away from the M2 temperature region along the second direction Y. The temperature of the working fluid in the M4 temperature region is lower than that of the working fluid in the M3 temperature region. For example, the temperature of the working fluid in the M4 temperature region is 41.7903 °C. In the M4 temperature region, the temperature of the working fluid in the heat dissipation component 110 adjacent to the second edge L2 along the second direction Y is the lowest. For example, it can be 41.5827 °C.

[0097] For example, the pipe section of the heat dissipation component 110 located in the M4 temperature region and adjacent to the second edge L2 along the second direction Y is the condensation end 110b of the heat dissipation component 110.

[0098] It can be understood that Figure 7 the different temperature regions in are only schematic. According to the different setting positions of the electronic component 201 (such as the CPU), the temperature regions of the heat dissipation component 110 will also be different. The embodiments of the present application do not further limit the shape, quantity, arrangement mode of the temperature regions of the heat dissipation component 110, and the temperature in different temperature regions, etc.

[0099] In some examples, as Figure 8 and Figure 9 shown, the setting position of the evaporation end 110a corresponds to the setting position of the electronic component 201, so that the evaporation end 110a can be closer to the electronic component 201 relative to the condensation end 110b, reducing the distance between the evaporation end 110a and the electronic component 201, improving the heat transfer efficiency between the electronic component 201 and the evaporation end 110a, thereby improving the uniform temperature heat dissipation effect of the electronic device housing 100 and improving the performance of the electronic device 200.

[0100] When the number of evaporation ends 110a is multiple, as Figure 8 shown, the setting positions of a part (one, two or more) of the multiple evaporation ends 110a can correspond to the setting position of the electronic component 201; or, as Figure 9 shown, the setting positions of the multiple evaporation ends 110a can also all correspond to the setting position of the electronic component 201.

[0101] In some examples, the plurality of condensation ends 110b are arranged at intervals.

[0102] With such an arrangement, the mutual influence of the working fluids in two adjacent condensation ends 110b during heat release can be reduced, the uniform heat dissipation effect of the electronic device housing 100 can be improved, and thus the performance of the electronic device 200 can be improved.

[0103] In the embodiments of the present application, the working fluid in the heat dissipation component 110 can flow between the evaporation end 110a and the condensation end 110b. It can be understood that the evaporation end 110a of the heat dissipation component 110 is arranged closer to the electronic component 201 than the condensation end 110b, so that after the working fluid exchanges heat with the electronic component 201 at the evaporation end 110a, it can flow to the condensation end 110b for condensation and heat release, so that the electronic device housing 100 can play a role in uniform heat dissipation, improving the temperature uniformity of the electronic device 200 and the performance of the electronic device 200. Moreover, the middle frame 102 and / or the rear shell 103 cover the heat dissipation component 110, so that the heat dissipation component 110 does not need to additionally occupy the accommodation space enclosed by the electronic device housing 100, which is beneficial to the miniaturization of the electronic device 200.

[0104] In some examples, when the middle frame 102 covers the heat dissipation component 110, the frame 102a covers the heat dissipation component 110; and / or, the middle plate 102b covers the heat dissipation component 110.

[0105] It can be understood that when the middle frame 102 covers the heat dissipation component 110, arranging the frame 102a and / or the middle plate 102b to cover the heat dissipation component 110 can improve the setting flexibility of the heat dissipation component 110 and meet different usage requirements. Moreover, the heat dissipation component 110 does not need to additionally occupy the accommodation space enclosed by the electronic device housing 100, which is beneficial to the miniaturization of the electronic device 200.

[0106] For example, when the middle frame 102 covers the heat dissipation component 110, the frame 102a covers a part of the heat dissipation component 110, and the middle plate 102b covers another part of the heat dissipation component 110. Figure 10 It is a schematic structural diagram of the heat dissipation component provided by some embodiments of the present application.

[0107] Taking the material of the rear shell 103 as glass as an example, since the thermal conductivity of glass is low, a two-phase technology needs to be adopted to achieve uniform heat dissipation, that is, the gaseous working fluid and the liquid working fluid flow in the heat dissipation component 110 at the same time.

[0108] In some examples, the heat dissipation component 110 is a pulsating heat pipe.

[0109] It can be understood that before filling the pulsating heat pipe with the working fluid, the pulsating heat pipe needs to be evacuated. Since the diameter of the pulsating heat pipe is small, after filling the liquid working fluid into the pulsating heat pipe, bubbles will be randomly distributed in the liquid working fluid. For example,Figure 10 As shown, the liquid column Q2 formed by the liquid working medium can be arranged at intervals with the bubble column Q1 and is randomly distributed.

[0110] At the evaporation end 110a of the heat dissipation component 110, the liquid working medium absorbs heat and vaporizes, causing the bubbles to rapidly expand and the pressure at the evaporation end 110a to increase. The bubbles can push the liquid working medium to flow towards the condensation end 110b of the heat dissipation component 110. The working medium releases heat and liquefies at the condensation end 110b, the bubbles shrink and burst, and the pressure at the condensation end 110b decreases. Moreover, the working medium after releasing heat at the condensation end 110b can flow back to the evaporation end 110a under the push of the bubbles, realizing the circulation of the working medium between the evaporation end 110a and the condensation end 110b.

[0111] In this way, the working medium in the heat dissipation component 110 can flow under the action of heat drive, that is, the housing 100 of the electronic device can achieve uniform temperature heat dissipation through phase change, without consuming external mechanical work or electric work, simplifying the structure of the housing 100 of the electronic device, facilitating the miniaturization of the electronic device 200, and being able to reduce the cost of the electronic device 200.

[0112] Next, taking the pulsating heat pipe as the heat dissipation component 110 as an example, the structure of the heat dissipation component 110 will be further illustrated by examples.

[0113] In some examples, such as Figure 8 and Figure 9 As shown, the heat dissipation component 110 includes a pipeline body 121. Taking the case where the rear shell 103 covers the heat dissipation component 110 as an example, the pipeline body 121 can be formed inside the rear shell 103, that is, the inner wall of the pipeline body 121 is the rear shell 103.

[0114] Such as Figure 8 and Figure 9 As shown, the pipeline body 121 includes a plurality of branch pipes 1211 and a plurality of connecting pipes 1212. The plurality of branch pipes 1211 extend along the second direction Y and are arranged at intervals along the first direction X. The plurality of connecting pipes 1212 include a first connecting pipe 1212a and a second connecting pipe 1212b. The first connecting pipe 1212a is located on one side of the plurality of branch pipes 1211 along the second direction Y, and the second connecting pipe 1212b is located on the side of the plurality of branch pipes 1211 away from the first connecting pipe 1212a along the second direction Y. Any one of the connecting pipes 1212 (including the first connecting pipe 1212a and the second connecting pipe 1212b) communicates with at least two branch pipes 1211.

[0115] In some examples, the extending direction of the branch pipes 1211 is parallel to the long side of the rear shell 103, and the plurality of branch pipes 1211 are arranged along the short side of the rear shell 103 (see Figure 7)。In some other examples, the extending direction of the branch pipes 1211 is parallel to the short side of the rear housing 103, and multiple branch pipes 1211 are arranged along the long side of the rear housing 103. In still some other examples, the extending direction of the branch pipes 1211 intersects with both the long side and the short side of the rear housing 103, and the arrangement direction of multiple branch pipes 1211 intersects with both the long side and the short side of the rear housing 103.

[0116] For example, the lengths of multiple branch pipes 1211 extending along the second direction Y may be the same or different. Among multiple branch pipes 1211, the distances between any two adjacent branch pipes 1211 along the first direction X may be the same or different. The numbers of both the first connecting pipes 1212a and the second connecting pipes 1212b are multiple, and the numbers of the first connecting pipes 1212a and the second connecting pipes 1212b may be the same or different.

[0117] For example, as Figure 8 and Figure 9 shown, the electronic component 201 may be arranged close to multiple first connecting pipes 1212a. At this time, any one of the multiple first connecting pipes 1212a is an evaporation end 110a, and any one of the multiple second connecting pipes 1212b is a condensation end 110b.

[0118] With such an arrangement, the heat dissipation component 110 can have multiple evaporation ends 110a and multiple condensation ends 110b, improving the heat exchange efficiency of the heat dissipation component 110. It can be understood that the embodiments of the present application do not further limit the numbers of the evaporation end 110a and the condensation end 110b.

[0119] As Figure 8 and Figure 9 shown, the first connecting pipe 1212a connects two adjacent branch pipes 1211 arranged along the first direction X. The second connecting pipe 1212b includes a first second connecting pipe 1212b1 and a second second connecting pipe 1212b2. The number of the first second connecting pipes 1212b1 is multiple. As Figure 8 shown, the first second connecting pipe 1212b1 connects two adjacent branch pipes 1211 arranged along the first direction X; or, as Figure 9 shown, the first second connecting pipe 1212b1 connects multiple branch pipes 1211 arranged along the first direction X. One end of the second second connecting pipe 1212b2 is connected to the branch pipe 1211 located on one side edge along the first direction X, and the other end is connected to the branch pipe 1211 located on the other side edge along the first direction X. In this way, the heat dissipation component 110 can be a closed loop connected end to end, and the working medium can circulate in the heat dissipation component 110.

[0120] Understandably, a plurality of branch pipes 1211 are provided to extend along the second direction Y and are spaced along the first direction X. Any one of the connecting pipes 1212 communicates with at least two branch pipes 1211, so that the pipeline body 121 can extend along the first direction X and the second direction Y to different positions of the electronic device housing 100 (the middle frame 102 and / or the rear shell 103), that is, enabling the working medium to exchange heat with different positions of the electronic device housing 100 (the middle frame 102 and / or the rear shell 103), thereby improving the uniform temperature heat dissipation effect of the electronic device housing 100.

[0121] Taking the pipeline body 121 including 8 branch pipes 1211 as an example, as Figure 10 shown, the 8 branch pipes 1211 are respectively the first branch pipe A1 to the eighth branch pipe A8, and the first branch pipe A1 to the eighth branch pipe A8 are arranged at intervals in sequence along the first direction X. The pipeline body 121 further includes 4 first connecting pipes 1212a and 4 second connecting pipes 1212b, which are respectively the first first connecting pipe B1 to the fourth first connecting pipe B4, and the first second connecting pipe C1 to the fourth second connecting pipe C4. The 4 first connecting pipes 1212a are the evaporation ends 110a, and the 4 second connecting pipes 1212b are the condensation ends 110b.

[0122] As Figure 10 shown, the first first connecting pipe B1 communicates with the first branch pipe A1 and the second branch pipe A2, the second first connecting pipe B2 communicates with the third branch pipe A3 and the fourth branch pipe A4, the third first connecting pipe B3 communicates with the fifth branch pipe A5 and the sixth branch pipe A6, and the fourth first connecting pipe B4 communicates with the seventh branch pipe A7 and the eighth branch pipe A8.

[0123] The first second connecting pipe C1 communicates with the second branch pipe A2 and the third branch pipe A3, the second second connecting pipe C2 communicates with the fourth branch pipe A4 and the fifth branch pipe A5, the third second connecting pipe C3 communicates with the sixth branch pipe A6 and the seventh branch pipe A7, and the fourth second connecting pipe C4 communicates with the first branch pipe A1 and the eighth branch pipe A8.

[0124] When the power of the electronic component 201 is small and the temperature of the working medium in the evaporation end 110a is low, the heat dissipation component 110 operates in an oscillating state. At this time, the bubble columns Q1 in the plurality of branch pipes 1211 (the first branch pipe A1 to the eighth branch pipe A8) all flow along the Figure 10 direction shown by the first arrow g1 in Figure 10 , and the bubble columns Q1 push the liquid working medium to flow along the

[0125] The working fluid in the second branch pipe A2 and the working fluid in the third branch pipe A3 will collide at the first second connecting pipe C1. The working fluid in the fourth branch pipe A4 and the working fluid in the fifth branch pipe A5 will collide at the second second connecting pipe C2. The working fluid in the sixth branch pipe A6 and the working fluid in the seventh branch pipe A7 will collide at the third second connecting pipe C3. The working fluid in the first branch pipe A1 and the working fluid in the eighth branch pipe A8 will collide at the fourth second connecting pipe C4.

[0126] As the power of the electronic component 201 increases, the temperature of the working fluid in the evaporation end 110a will gradually rise. When the temperature of the working fluid in the evaporation end 110a rises to a certain value, the heat dissipation component 110 operates in a stable state. At this time, the bubble column Q1 in the first branch pipe A1 flows along Figure 10 the direction shown by the first arrow g1 in Figure 10 and the bubble column Q1 pushes the liquid working fluid to flow along

[0127] the direction shown by the first arrow g1 in Figure 10 and flows through the fourth second connecting pipe C4 into the eighth branch pipe A8. Figure 10 The bubble column Q1 in the eighth branch pipe A8 flows along Figure 10 the direction shown by the second arrow g2 in Figure 10 and the bubble column Q1 pushes the liquid working fluid to flow along

[0128] the direction shown by the second arrow g2 in

[0129] and flows through the fourth first connecting pipe B1 into the seventh branch pipe A7. The bubble column Q1 in the seventh branch pipe A7 flows along

[0130] the direction shown by the first arrow g1 in Figure 10 and the bubble column Q1 pushes the liquid working fluid to flow along Figure 10 the direction shown by the first arrow g1 in Figure 10 and flows through the third second connecting pipe C3 into the sixth branch pipe A6, and so on until the working fluid flows back to the first branch pipe A1.

[0128] That is to say, when the heat dissipation component 110 operates in a stable state, the working fluid in the heat dissipation component 110 can flow in the same direction, so that the working fluid can flow between multiple evaporation ends 110a and multiple condensation ends 110b to achieve heat transfer and play a role in temperature equalization and heat dissipation.

[0129] In some examples, the liquid filling rate of the working fluid in the heat dissipation component is in the range of 30% to 70%.

[0130] Understandably, the filling rate of the working fluid in the heat dissipation component 110, that is, the ratio of the volume of the working fluid in the heat dissipation component 110 to the volume of the heat dissipation component 110. Setting the filling rate of the working fluid in the heat dissipation component within the range of 30% to 70% can prevent the filling rate of the working fluid in the heat dissipation component 110 from being too large (for example, greater than 70%), resulting in too small a space in the heat dissipation component 110 that can accommodate the bubble column Q1, affecting the flow of the liquid working fluid driven by the bubble column Q1; and can also prevent the filling rate of the working fluid in the heat dissipation component 110 from being too small (for example, less than 30%), affecting heat transfer.

[0131] Exemplarily, the value range of the filling rate of the working fluid in the heat dissipation component 110 can be 40% - 60%, 45% - 55% or 48% - 52%, etc. In some examples, the value of the filling rate of the working fluid in the heat dissipation component 110 can be 35%, 42%, 45%, 50%, 52%, 55% or 58%, etc. The embodiments of the present application do not further limit the value of the filling rate of the working fluid in the heat dissipation component 110.

[0132] Figure 11 It is a cross-sectional schematic diagram of the heat dissipation component provided by some embodiments of the present application.

[0133] In some examples, the plurality of branch pipes 1211 include a plurality of first branch pipes 1211a and a plurality of second branch pipes 1211b, and the plurality of first branch pipes 1211a and the plurality of second branch pipes 1211b are alternately arranged along the first direction X.

[0134] The number of the first branch pipes 1211a and the number of the second branch pipes 1211b can be the same or different. The plurality of first branch pipes 1211a and the plurality of second branch pipes 1211b are alternately arranged along the first direction X, that is, in the first direction X, there is a second branch pipe 1211b between any two adjacent first branch pipes 1211a, and there is a first branch pipe 1211a between any two adjacent second branch pipes 1211b. Understandably, the connecting pipes 1212 (the first connecting pipe 1212a and the second connecting pipe 1212b) can connect the first branch pipe 1211a and the second branch pipe 1211b.

[0135] In some examples, as Figure 11 shown, the width of the first branch pipe 1211a along the first direction X is the first width W1, the width of the second branch pipe 1211b along the first direction X is the second width W2, and the first width W1 is greater than the second width W2.

[0136] The width of the branch pipe 1211 (including the first branch pipe 1211a and the second branch pipe 1211b) along the first direction X is the width of the caliber of the branch pipe 1211 along the first direction X. By way of example, the shape of the branch pipe 1211 can be cylindrical. At this time, the shape of the branch pipe 1211 in the longitudinal section (the section along the thickness direction of the electronic device 200) is circular, and the width of the branch pipe 1211 along the first direction X is the diameter of the circle. Alternatively, the shape of the branch pipe 1211 can be a cuboid. At this time, the shape of the branch pipe 1211 in the longitudinal section is rectangular (or square), and the width of the branch pipe 1211 along the first direction X is the side length of the rectangle along the first direction X. It can be understood that the shapes of multiple branch pipes 1211 can be the same or different.

[0137] Set the first width W1 of the first branch pipe 1211a along the first direction X to be greater than the second width W2 of the second branch pipe 1211b along the first direction X, so that the pressure in the first branch pipe 1211a can be less than the pressure in the second branch pipe 1211b.

[0138] It can be understood that one end of the first branch pipe 1211a and the second branch pipe 1211b is connected through the first connecting pipe 1212a (evaporation end 110a), and the other end is connected through the second connecting pipe 1212b (condensation end 110b). The working medium absorbs heat and vaporizes at the evaporation end 110a, and the pressure at the evaporation end 110a increases. Since the pressure in the first branch pipe 1211a is small and the pressure in the second branch pipe 1211b is large, most of the working medium in the evaporation end 110a can flow into the first branch pipe 1211a and flow to the condensation end 110b through the first branch pipe 1211a. The working medium in the condensation end 110b can flow into the second branch pipe 1211b under the pushing action of the bubbles and flow back to the evaporation end 110a through the second branch pipe 1211b to achieve heat transfer.

[0139] That is to say, set the first width W1 to be greater than the second width W2, so that the pressures of two adjacent branch pipes 1211 (the first branch pipe 1211a and the second branch pipe 1211b) along the first direction X can be different. The pressure imbalance between two adjacent branch pipes 1211 can restrict the flow direction of the working medium in the pipeline body 121, reduce the time for the heat dissipation component 110 to work in the oscillation state, and improve the heat exchange efficiency of the heat dissipation component 110.

[0140] In some examples, the ratio of the first width W1 to the second width W2 is in the range of 1.5 to 3.0, that is The value range of is 1.5 to 3.0.

[0141] With such a setting, it is possible to avoid the ratio of the first width W1 to the second width W2 being too large (for example, greater than 3.0), which may cause the width of the first branch pipe 1211a along the first direction X to be too large and the pressure in the first branch pipe 1211a to be too small; and it is possible to avoid the width of the second branch pipe 1211b along the first direction X being too small, resulting in too large a pressure in the second branch pipe 1211b, so that the working medium can flow through the first branch pipe 1211a to the condensation end 110b and flow through the second branch pipe 1211b to the evaporation end 110a.

[0142] In addition, it is also possible to avoid the ratio of the first width W1 to the second width W2 being too small (for example, less than 1.5), which may cause the pressure difference between the first branch pipe 1211a and the second branch pipe 1211b to be too small, so that the pipeline body 121 can restrict the flow direction of the working medium.

[0143] Exemplarily, the ratio of the first width W1 to the second width W2 can be 1.8, 2.2, 2.5, 2.8, etc. The embodiments of the present application do not further limit the value of the ratio of the first width W1 to the second width W2.

[0144] In some examples, as Figure 11 shown, the depth of the first branch pipe 1211a along the third direction Z is the first depth d1, and the depth of the second branch pipe 1211b along the third direction Z is the second depth d2. The third direction Z intersects the plane where the first direction X and the second direction Y are located. Exemplarily, the third direction Z can be the thickness direction of the electronic device 200, and the third direction Z is perpendicular to the plane where the first direction X and the second direction Y are located.

[0145] It can be understood that the depth of the branch pipe 1211 (the first branch pipe 1211a or the second branch pipe 1211b) along the third direction Z can be the average value of the depths of the branch pipe 1211 at different positions along the first direction X, or the maximum or minimum value of the depth of the branch pipe 1211.

[0146] In some examples, the sum of the first width W1 and the second width W2 is W0, and the sum of the first depth d1 and the second depth d2 is H0. The value of W0 / H0 is in the range of 1.5 to 3.0, that is, the value range of is 1.5 to 3.0.

[0147] It can be understood that when the first width W1 is equal to the second width W2, the first depth d1 is not equal to the second depth d2. Exemplarily, the first depth d1 can be greater than the second depth d2, in which case the pressure in the first branch pipe 1211a is less than the pressure in the second branch pipe 1211b. Or, the first depth d1 can also be less than the second depth d2, in which case the pressure in the first branch pipe 1211a is greater than the pressure in the second branch pipe 1211b.

[0148] When the first width W1 and the second width W2 are not equal, for example, when the first width W1 is greater than the second width W2, the first depth d1 and the second depth d2 may be equal or may not be equal.

[0149] Set the value range of the ratio of the sum W0 of the first width W1 and the second width W2 to the sum H0 of the first depth d1 and the second depth d2 to be 1.5 to 3.0, which can limit the pressure in the branch pipe 1211 from both the width and the depth of the branch pipe 1211, so that the pressures of two adjacent branch pipes 1211 (the first branch pipe 1211a and the second branch pipe 1211b) along the first direction X can be different. The pressure imbalance between two adjacent branch pipes 1211 can restrict the flow direction of the working medium in the pipeline body 121, reduce the time for the heat dissipation component 110 to work in the oscillating state, and improve the heat exchange efficiency of the heat dissipation component 110.

[0150] Exemplarily, the value of W0 / H0 can be 1.8, 2.2, 2.5, 2.8, etc. The embodiments of the present application do not further limit the value of W0 / H0.

[0151] Figure 12 It is a partial structural schematic diagram of the heat dissipation component provided by some embodiments of the present application. Figure 13 It is a structural schematic diagram of the Tesla valve provided by some embodiments of the present application. Figure 14 It is a structural schematic diagram of the Tesla valve provided by some other embodiments of the present application. It can be understood that Figure 13 and Figure 14 The difference is that the different flow directions of the fluid are shown by arrows in different directions.

[0152] In some examples, as Figure 12 shown, the heat dissipation component 110 further includes a check valve 123, and the check valve 123 is communicated with the pipeline body 121.

[0153] It can be understood that the check valve 123 can conduct unidirectionally, and the conduction direction of the check valve 123 is the same as the flow direction of the working medium in the heat dissipation component 110 in the stable state.

[0154] Exemplarily, the number of check valves 123 can be multiple, and the multiple check valves 123 are arranged at intervals on the pipeline body 121. It can be understood that the multiple check valves 123 can be arranged at intervals on the branch pipes 1211 (including the first branch pipe 1211a and the second branch pipe 1211b), and / or the multiple check valves 123 can also be arranged at intervals on the connecting pipes 1212 (including the first connecting pipe 1212a and the second branch pipe 1211b). The embodiments of the present application do not further limit the number and the installation position of the check valve 123, etc.

[0155] A one-way valve 123 is connected to the management body 121, which can control the flow direction of the working fluid in the pipeline body 121, enabling the working fluid in the pipeline body 121 to circulate in the same direction between multiple evaporation ends 110a and multiple condensation ends 110b, thereby improving the heat exchange efficiency of the heat dissipation component 110.

[0156] In some examples, the one-way valve 123 is a Tesla valve 123a (English: Tesla).

[0157] Understandably, the Tesla valve 123a has a one-way conduction characteristic. As Figure 13 shown by the arrow direction in the figure, most of the working fluid can flow from the inlet E1 of the Tesla valve 123a to the outlet E2 of the Tesla valve 123a. On the contrary, as Figure 14 shown, only a small amount of the working fluid can flow from the outlet E2 of the Tesla valve 123a to the inlet E1 of the Tesla valve 123a. Exemplarily, this part of the working fluid flowing from the outlet E2 of the Tesla valve 123a to the inlet E1 of the Tesla valve 123a can be referred to as the leakage amount of the Tesla valve 123a.

[0158] In some examples, as Figure 13 and Figure 14 shown, the included angle α between the first pipe section 123a1 of the Tesla valve 123a and the second pipe section 123a2 of the Tesla valve 123a is greater than 0° and less than or equal to 30°, so as to reduce the leakage amount of the Tesla valve 123a. Exemplarily, the value of the included angle α between the first pipe section 123a1 of the Tesla valve 123a and the second pipe section 123a2 of the Tesla valve 123a can be 5°, 10°, 15°, 20° or 25°, etc. The embodiments of the present application do not further limit the value of the included angle α between the first pipe section 123a1 and the second pipe section 123a2.

[0159] Understandably, setting the one-way valve 123 as the Tesla valve 123a can simplify the structure of the heat dissipation component 110, facilitate the miniaturization of the electronic device 200, and can reduce the cost of the electronic device 200.

[0160] Figure 15 For some embodiments of the present application Figure 12 a partial enlarged schematic diagram of the G area in the figure. Figure 16 For some other embodiments of the present application Figure 12 a partial enlarged schematic diagram of the G area in the figure. Figure 17 For some other embodiments of the present application Figure 12 a partial enlarged schematic diagram of the G area in the figure. Figure 18 For some other embodiments of the present application Figure 12 a partial enlarged schematic diagram of the G area in the figure.

[0161] In some examples, such as Figure 15 shown, the heat dissipation component 110 includes a plurality of heat exchange grooves 122, and the plurality of heat exchange grooves 122 are formed on the inner wall of the pipeline body 121. The distance between any one of the heat exchange grooves 122 and the evaporation end 110a is less than the distance between the heat exchange groove 122 and the condensation end 110b.

[0162] It can be understood that when the rear shell 103 is the inner wall of the pipeline body 121, the plurality of heat exchange grooves 122 are formed on the rear shell 103. The plurality of heat exchange grooves 122 can be arranged in an array on the inner wall of the pipeline body 121. For example, the plurality of heat exchange grooves 122 can be formed on the inner wall of the pipeline body 121 by etching. The depths of the plurality of heat exchange grooves 122 along the third direction Z can be the same or approximately the same to improve the processing convenience of the heat dissipation component 110.

[0163] In some examples, such as Figure 12 shown, the heat exchange groove 122 can be located on the inner wall of the branch pipe 1211. In some other examples, the heat exchange groove 122 can also be located on the inner wall of the connecting pipe 1212.

[0164] It can be understood that when the heat exchange groove 122 can be located on the inner wall of the branch pipe 1211, the processing convenience of the heat exchange groove 122 during processing can be improved, that is, the processing convenience of the heat dissipation component 110 is improved.

[0165] It can be understood that a plurality of heat exchange grooves 122 are formed on the inner wall of the pipeline body 121, so that a part of the liquid working medium can flow into the heat exchange grooves 122, thereby forming bubbles in the liquid working medium located in the pipeline body 121. The distance between any one of the heat exchange grooves 122 and the evaporation end 110a is less than the distance between the heat exchange groove 122 and the condensation end 110b, so that a plurality of bubbles can be formed in the liquid working medium near the evaporation end 110a, making it easier to form a state in which a bubble column and a liquid column are arranged at intervals near the evaporation end 110a, and improving the heat exchange efficiency of the heat dissipation component 110.

[0166] In some examples, the length of the heat exchange groove 122 along the extension direction of the pipeline body 121 is in the range of 0.1 mm (unit: millimeter) to 3 mm.

[0167] It can be understood that the branch pipe 1211 extends along the second direction Y. When the heat exchange groove 122 is formed on the pipe wall of the branch pipe 1211, the length of the heat exchange groove 122 along the extension direction of the pipeline body 121 is the length of the heat exchange groove 122 along the second direction Y.

[0168] Taking the heat exchange groove 122 formed on the pipe wall of the branch pipe 1211 as an example, in some examples, such as Figure 15As shown, the length H1 of the heat exchange groove 122 along the second direction Y can be 0.5 mm; in some other examples, such as Figure 16 As shown, the length H1 of the heat exchange groove 122 along the second direction Y can be 0.1 mm; in still some other examples, such as Figure 17 As shown, the length H1 of the heat exchange groove 122 along the second direction Y can be 0.3 mm; in still some other examples, such as Figure 18 As shown, the length H1 of the heat exchange groove 122 along the second direction Y can be 0.8 mm.

[0169] It can be understood that the length H1 of the heat exchange groove 122 along the extending direction of the pipeline body 121 can also be 1.0 mm, 1.2 mm, 1.5 mm, 1.8 mm, 2.0 mm, 1.2 mm, 2.5 mm or 2.8 mm, etc. The embodiments of the present application do not further limit the value of the length of the heat exchange groove 122 along the extending direction of the pipeline body 121.

[0170] Setting the value range of the length of the heat exchange groove 122 extending along the pipeline body 121 to be 0.1 mm to 3 mm can prevent the length of the heat exchange groove 122 along the extending direction of the pipeline body 121 from being too large (for example, greater than 3 mm) or too small (for example, less than 0.1 mm), making it easier for the working medium near the evaporation end 110a to form a state where the bubble column Q1 and the liquid column Q2 are arranged at intervals, and improving the heat exchange efficiency of the heat dissipation component 110.

[0171] For example, as Figure 15 As shown, the width K1 of the heat exchange groove 122 along the first direction X can be 0.045 mm. Or, the width of the heat exchange groove 122 along the first direction X can also be 0.04 mm, 0.05 mm or 0.055 m, etc. The value range of the distance between two adjacent heat exchange grooves 122 (the distance K2 between two adjacent heat exchange grooves 122 along the first direction X or the distance H2 between two adjacent heat exchange grooves 122 along the second direction Y) can be 0.01 to 0.3 mm. For example, the value of the distance between two adjacent heat exchange grooves 122 can be 0.05 mm, 0.08 mm, 0.12 mm, 0.15 mm, 0.18 mm, 0.023 mm or 0.25 mm, etc.

[0172] It can be understood that the size of the heat exchange groove 122 and the interval between two adjacent heat exchange grooves 122 can also be other values, and the embodiments of the present application do not further limit this.

[0173] In some examples, such as Figure 11As shown, when the rear case 103 wraps the heat dissipation component 110, the rear case 103 includes a first sub - part 2031 and a second sub - part 2032. A body groove 111a is formed on the surface of the first sub - part 2031, and a plurality of heat exchange grooves 122 are formed on the surface of the second sub - part 2032. The first sub - part 2031 and the second sub - part 2032 are stacked to enclose the heat dissipation component 110 with the body groove 111a and the plurality of heat exchange grooves 122.

[0174] It can be understood that the setting position of the body groove 111a corresponds to the setting position of the heat exchange grooves 122, so that when the first sub - part 2031 and the second sub - part 2032 are stacked, the body groove 111a and the plurality of heat exchange grooves 122 can enclose the heat dissipation component 110.

[0175] Exemplarily, when both the first sub - part 2031 and the second sub - part 2032 are made of metal, the first sub - part 2031 and the second sub - part 2032 can be connected by welding, such as vacuum brazing. When both the first sub - part 2031 and the second sub - part 2032 are made of glass, the first sub - part 2031 and the second sub - part 2032 can be connected by bonding.

[0176] Setting the first sub - part 2031 and the second sub - part 2032 to be connected to enclose the heat dissipation component 110 enables the rear case 103 to wrap the heat dissipation component 110, improving the processing convenience of the rear case 103.

[0177] Exemplarily, when preparing the rear case 103, the ultra - thin VC production process and equipment can be borrowed to improve production convenience. In some examples, the first sub - part 2031 and the second sub - part 2032 can be formed by stamping or etching, and the first sub - part 2031 and the second sub - part 2032 are cleaned. Then the first sub - part 2031 and the second sub - part 2032 are connected (welded or bonded) so that the rear case 103 can wrap the heat dissipation component 110. After injecting the working fluid into the heat dissipation component 110, the rear case 103 is encapsulated, and then post - treatment processes such as polishing, grinding, and cleaning are carried out to form the rear case 103 capable of uniform - temperature heat dissipation.

[0178] Adopting the above - mentioned preparation process, compared with processing ultra - thin VC, there is no need for processes such as powder filling, adding support columns, high - temperature sintering, reduction, and degassing, simplifying the preparation process of the rear case 103 and reducing the cost of the rear case 103.

[0179] In some examples, among the first sub - part 2031 and the second sub - part 2032, the sub - part away from the middle frame 102 is made of a transparent material.

[0180] Understandably, in the first sub - part 2031 and the second sub - part 2032, one is farther from the middle frame 102 than the other. When the first sub - part 2031 is farther from the middle frame 102 than the second sub - part 2032, the first sub - part 2031 is made of a transparent material; when the second sub - part 2032 is farther from the middle frame 102 than the first sub - part 2031, the second sub - part 2032 is made of a transparent material.

[0181] By setting the sub - part that is farther from the middle frame 102 in the first sub - part 2031 and the second sub - part 2032 as a transparent material, the flow condition of the working fluid inside the heat dissipation component 110 can be visually observed through the transparent sub - part (the first sub - part 2031 or the second sub - part 2032), so as to obtain the working state of the heat dissipation component 110 (such as the oscillation state of the bubble column Q1 and the liquid column Q2). On the one hand, when a failure (such as liquid leakage) occurs in the heat dissipation component 110, timely maintenance, replacement and other treatments can be carried out, improving the high reliability of the use of the electronic device housing 100. On the other hand, the visualization of the flow condition of the working fluid inside the heat dissipation component 110 can improve the user experience.

[0182] Taking the second sub - part 2032 being farther from the middle frame 102 than the first sub - part 2031 as an example, for example, the material of the second sub - part 2032 can be plastic, glass, etc.

[0183] In some other examples, both the first sub - part 2031 and the second sub - part 2032 can also be made of transparent materials.

[0184] Figure 19 This is a cross - sectional schematic diagram of the heat dissipation component provided by some other embodiments of the present application.

[0185] In some other examples, as Figure 19 shown, when the rear shell 103 wraps the heat dissipation component 110, the rear shell 103 includes a third sub - part 2033, and the third sub - part 2033 wraps the heat dissipation component 110.

[0186] With such a setting, the structure of the rear shell 103 can be simplified, which is beneficial to the miniaturization of the electronic device 200.

[0187] For example, the third sub - part 2033 can be made of a transparent material, so that the flow condition of the working fluid inside the heat dissipation component 110 can be visually observed through the third sub - part 2033, so as to obtain the working state of the heat dissipation component 110 (such as the oscillation state of the bubble column Q1 and the liquid column Q2). On the one hand, when a failure (such as liquid leakage) occurs in the heat dissipation component 110, timely maintenance, replacement and other treatments can be carried out, improving the high reliability of the use of the electronic device housing 100. On the other hand, the visualization of the flow condition of the working fluid inside the heat dissipation component 110 can improve the user experience.

[0188] In some examples, as Figure 20As shown, the rear housing 103 further includes a fourth sub - part 2034 and a fifth sub - part 2035. The fourth sub - part 2034 and the fifth sub - part 2035 are located on both sides of the third sub - part 2033, and the fourth sub - part 2034 and the fifth sub - part 2035 are respectively stacked with the third sub - part 2033.

[0189] It can be understood that the third sub - part 2033 can be located between the fourth sub - part 2034 and the fifth sub - part 2035. The third sub - part 2033 covers the heat - dissipation component 110, so that the fourth sub - part 2034 and the fifth sub - part 2035 can play a role in protecting the third sub - part 2033 and the heat - dissipation component 110, improving the reliability of use of the rear housing 103.

[0190] Exemplarily, the third sub - part 2033 can be made of a transparent material. And, among the fourth sub - part 2034 and the fifth sub - part 2035, the sub - part far from the middle frame 102 can be made of a transparent material. In this way, the flow condition of the working medium in the heat - dissipation component 110 can be directly observed through the transparent sub - part, so as to obtain the working state of the heat - dissipation component 110 (such as the oscillation state of the bubble column Q1 and the liquid column Q2). On the one hand, when the heat - dissipation component 110 fails (such as liquid leakage), timely maintenance, replacement and other treatments can be carried out, improving the high reliability of use of the electronic device housing 100. On the other hand, the visualization of the flow condition of the working medium in the heat - dissipation component 110 can improve the user experience.

[0191] In some examples, when the frame 102a covers the heat - dissipation component 110, the frame 102a can be made of a transparent material, so that the flow condition of the working medium in the heat - dissipation component 110 can be directly observed. On the one hand, when the heat - dissipation component 110 fails (such as liquid leakage), timely maintenance, replacement and other treatments can be carried out, improving the high reliability of use of the electronic device housing 100. On the other hand, the visualization of the flow condition of the working medium in the heat - dissipation component 110 can improve the user experience.

[0192] In summary, the embodiments of the present application have at least the following beneficial effects:

[0193] In the embodiments of the present application, the working medium in the heat - dissipation component 110 can flow between the evaporation end 110a and the condensation end 110b. It can be understood that the evaporation end 110a of the heat - dissipation component 110 is set to be closer to the electronic component 201 than the condensation end 110b, so that after the working medium exchanges heat with the electronic component 201 at the evaporation end 110a, it can flow to the condensation end 110b to condense and release heat. Thus, the electronic device housing 100 can play a role in uniform temperature heat dissipation, improving the temperature uniformity of the electronic device 200 and the performance of the electronic device 200. And the middle frame 102 and / or the rear housing 103 cover the heat - dissipation component 110, so that the heat - dissipation component 110 does not need to additionally occupy the accommodation space enclosed by the electronic device housing 100, which is beneficial to the miniaturization of the electronic device 200.

[0194] As described above, it is only the specific implementation manner of the present application, but the protection scope of the present application is not limited thereto. Any person skilled in the art within the technical scope disclosed by the present application, thinking of changes or substitutions, shall be covered by the protection scope of the present application. Therefore, the protection scope of the present application shall be subject to the protection scope of the claims described.

Claims

1. An electronic device housing, characterized in that, Comprising: A front frame, a middle frame, and a rear case, wherein the front frame and the rear case are respectively connected to the middle frame; A heat dissipation component, which has an evaporation end and a condensation end, and the evaporation end is closer to the electronic component relative to the condensation end; the heat dissipation component is configured to accommodate a working fluid; Wherein, the middle frame covers the heat dissipation component; and / or, the rear case covers the heat dissipation component.

2. The electronic device housing according to claim 1, characterized in that, The heat dissipation component is a pulsating heat pipe.

3. The electronic device housing according to claim 2, wherein The heat dissipation component includes a pipeline body and a plurality of heat exchange grooves, and the plurality of heat exchange grooves are opened on the inner wall of the pipeline body; the distance between any one of the heat exchange grooves and the evaporation end is less than the distance between the heat exchange groove and the condensation end.

4. The electronic device housing according to claim 3, wherein The pipeline body includes: A plurality of branch pipes, which extend along a second direction and are arranged at intervals along a first direction; the first direction intersects with the second direction; A plurality of connecting pipes, the plurality of connecting pipes include a first connecting pipe and a second connecting pipe, the first connecting pipe is located on one side of the plurality of branch pipes along the second direction, and the second connecting pipe is located on the side of the plurality of branch pipes away from the first connecting pipe along the second direction; any one of the connecting pipes communicates with at least two of the branch pipes.

5. The electronic device housing according to claim 4, characterized in that, The heat exchange grooves are opened on the inner wall of the branch pipes.

6. The electronic device housing according to claim 4 or 5, characterized in that, The plurality of branch pipes include a plurality of first branch pipes and a plurality of second branch pipes, and the plurality of first branch pipes and the plurality of second branch pipes are alternately arranged along the first direction; the width of the first branch pipe along the first direction is a first width, the width of the second branch pipe along the first direction is a second width, and the first width is greater than the second width.

7. The electronic device housing according to claim 6, wherein The ratio of the first width to the second width is in the range of 1.5 to 3.

0.

8. The electronic device housing according to claim 6 or 7, characterized in that, The depth of the first branch pipe along a third direction is a first depth, the depth of the second branch pipe along the third direction is a second depth, and the third direction intersects with the plane where the first direction and the second direction are located; the sum of the first width and the second width is W0, and the sum of the first depth and the second depth is H0; W0 / H0 is in the range of 1.5 to 3.

0.

9. The electronic device housing according to any one of claims 3 to 8, characterized in that When the rear case covers the heat dissipation component, the rear case includes a first sub - part and a second sub - part, and a body groove is opened on the surface of the first sub - part, and a plurality of heat exchange grooves are opened on the surface of the second sub - part; the second sub - part and the second sub - part are stacked to make the body groove and the plurality of heat exchange grooves enclose the heat dissipation component.

10. The electronic device housing according to claim 9, characterized in that, Among the first sub - part and the second sub - part, the sub - part away from the middle frame is made of a transparent material.

11. The electronic device housing according to any one of claims 3 to 8, characterized in that, When the rear case covers the heat dissipation component, the rear case includes a third sub - part, and the third sub - part covers the heat dissipation component.

12. The electronic device housing according to claim 11, wherein The rear case further includes a fourth sub - part and a fifth sub - part, the fourth sub - part and the fifth sub - part are located on both sides of the third sub - part, and the fourth sub - part and the fifth sub - part are respectively stacked with the third sub - part.

13. The electronic device housing according to any one of claims 3 to 12, characterized in that, The length of the heat exchange groove along the extending direction of the pipeline body is in the range of 0.1 mm to 3 mm.

14. The electronic device housing according to any one of claims 3 to 13, characterized in that, The heat dissipation component further includes a one - way valve, and the one - way valve communicates with the pipeline body.

15. The electronic device housing according to any one of claims 1 to 14, characterized in that, The filling rate of the working fluid in the heat dissipation component is in the range of 30% to 70%.

16. The electronic device housing according to any one of claims 1 to 15, characterized in that, The middle frame includes a frame and a middle plate. The front frame is connected to one side edge of the frame, and the rear shell is connected to the side edge of the frame away from the front frame to enclose an accommodation space. The middle plate is located in the accommodation space and is connected to the middle frame. When the middle frame covers the heat dissipation component, the frame covers the heat dissipation component; and / or, the middle plate covers the heat dissipation component.

17. An electronic device, characterized in that, Comprising: Electronic components; The electronic device housing according to any one of claims 1 to 16, wherein the electronic components are located in the accommodation space enclosed by the electronic device housing.

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