Efficient heat dissipation power supply case

Abstract

The invention relates to an efficient heat dissipation power supply case which comprises a heat conduction inner case body, a heat conduction outer shell and a power module, the heat conduction inner case body is arranged on the heat conduction outer shell, a first heat conduction boss is arranged on the heat conduction case body, the power module is arranged on the first heat conduction boss, and a heat dissipation assembly is arranged on the heat conduction case body. A wind source generated by the heat dissipation assembly flows through the power module and is discharged from the heat conduction case, the power module is arranged on the heat conduction boss of the case body, heat of the power module is concentrated at the position in contact with the case body, the heat is dissipated through the case body, meanwhile, auxiliary heat dissipation is conducted through the heat dissipation assembly, and the heat dissipation efficiency is extremely good.

Description

Technical Field

[0001] The present invention relates to the technical field of electronic devices, and more particularly to an efficient heat dissipation power supply chassis. Background Art

[0002] As a type of electronic chassis, the core function of an efficient heat dissipation power supply chassis is to accurately regulate the voltage and current of the input / output power supply. Affected by its internal high power density and power conversion loss, such devices will generate significant heat accumulation during operation, resulting in a sharp increase in internal temperature rise. Therefore, strict requirements are imposed on the efficiency and reliability of the heat dissipation system.

[0003] The current mainstream heat dissipation solutions include two technical paths: air cooling and water cooling.

[0004] Air cooling: Relies on forced convection to reduce temperature. However, when the internal heat flux density of the efficient heat dissipation power supply chassis is too high, the low heat capacity characteristic of the air medium is likely to cause the heat dissipation efficiency to saturate, making it difficult to meet the temperature control requirements under high heat conditions.

[0005] Water cooling: Although it improves the heat conduction ability through a liquid-phase working medium, it is necessary to precisely arrange cooling pipelines inside the chassis. Especially in high heat-sensitive areas, redundant pipeline topologies need to be superimposed. This not only exponentially increases the internal structure complexity of the device (increasing the assembly difficulty and maintenance cost), but also poses a potential safety hazard of coolant leakage causing electrical short circuits due to the risk of material fatigue and seal failure during long-term operation.

[0006] Therefore, there is an urgent need to design an efficient heat dissipation power supply chassis to solve the technical problems of low heat dissipation efficiency, complex structure, and difficult maintenance of existing efficient heat dissipation power supply chassis. Summary of the Invention

[0007] In view of this, the present invention provides an efficient heat dissipation power supply chassis, which realizes simple and reliable structure, high heat dissipation efficiency, and universality in water surface and underwater by optimizing the internal heat dissipation method and component integration.

[0008] The efficient heat dissipation power supply chassis provided by the present invention adopts the following technical solutions:

[0009] An efficient heat dissipation power supply chassis includes a heat-conducting inner chassis, a heat-conducting outer shell, and a power module. The heat-conducting inner chassis is disposed inside the heat-conducting outer shell. A first heat-conducting boss is provided on the heat-conducting chassis, and the power module is disposed on the first heat-conducting boss. A heat dissipation component is provided on the heat-conducting chassis, and the air source generated by the heat dissipation component flows through the power module and is discharged from the heat-conducting chassis.

[0010] Optionally, a heat-conducting pad in contact with the heat-conducting outer shell is provided at the arc of the heat-conducting inner chassis, and the heat-conducting pad is used to transfer the heat of the heat-conducting inner chassis to the heat-conducting outer shell.

[0011] Optionally, it further includes a filtering switch module, which is arranged on the second heat-conducting boss, and is used for filtering, rectifying, and on-off control of input and output.

[0012] Optionally, the heat-conducting chassis includes a chassis cover and a chassis housing, and the chassis cover is installed on the chassis housing to form a closed housing.

[0013] Optionally, the heat dissipation component includes an air inlet, a fan, and an air outlet. The fan is arranged in the chassis housing. The air source generated by the fan flows through the power module and the filtering switch module through the air inlet and then is discharged from the air outlet. The air inlet is opened on the chassis cover, and the air outlet is opened on the chassis housing.

[0014] Optionally, an electromagnetic shielding ventilation plate is arranged at the air inlet of the chassis cover.

[0015] Optionally, a wire routing bracket is arranged on the heat-conducting chassis.

[0016] Optionally, a cable plug cover assembly is arranged on the heat-conducting chassis. The cable plug cover assembly includes a cable plug cover and a cable plug. The cable plug cover is arranged at the front end of the chassis housing, and the cable plug serves as the input and output interface of the high-efficiency heat dissipation power chassis.

[0017] Optionally, conductive rubber strips are arranged on the chassis cover and the cable socket cover assembly.

[0018] Optionally, the filtering switch module is arranged in the middle of the chassis housing, and the power module is arranged on both sides of the filtering switch module.

[0019] In summary, the present invention includes at least one of the following beneficial technical effects: By arranging the power module on the first heat-conducting boss of the chassis body, the heat of the power module is concentrated at the contact position with the chassis body, and the heat is dissipated through the chassis body. At the same time, the heat dissipation component is used for auxiliary heat dissipation, and the heat dissipation efficiency is excellent. Description of the Drawings

[0020] Figure 1 is the overall structural schematic diagram of the embodiment of the present invention;

[0021] Figure 2 is the internal structural schematic diagram of the embodiment of the present invention;

[0022] Figure 3 is the longitudinal sectional structural schematic diagram of the embodiment of the present invention;

[0023] Figure 4 is the structural schematic diagram of the cable plug cover assembly of the embodiment of the present invention;

[0024] Figure 5It is a schematic structural diagram of the chassis cover and the electromagnetic shielding ventilation plate according to an embodiment of the present invention.

[0025] Explanation of reference numerals: 1, chassis cover; 2, chassis housing; 3, power module; 4, first heat conduction boss; 5, air inlet; 6, fan; 7, handle; 8, electromagnetic shielding ventilation plate; 9, wiring bracket; 10, cable plug cover plate; 11, cable plug; 12, filter switch module; 13, second heat conduction boss. Detailed implementation manners

[0026] The following further elaborates on the present invention in conjunction with the attached Figures 1-5 drawings.

[0027] An embodiment of the present invention discloses a high-efficiency heat dissipation power supply chassis.

[0028] Referring to Figures 1-5 , a high-efficiency heat dissipation power supply chassis includes a heat conduction chassis, a heat conduction outer shell (not shown in the figure), and a power module 3. The heat conduction inner chassis is arranged in the heat conduction outer shell. A first heat conduction boss 4 is arranged on the chassis housing 2, and the power module 3 is arranged on the first heat conduction boss 4. A heat dissipation component for generating a wind source is arranged on the heat conduction chassis. The wind source generated by the heat dissipation component flows through the power module 3 and is discharged from the chassis housing 2. By arranging the power module 3 on the heat conduction boss of the chassis body, the heat of the power module 3 is concentrated at the position in contact with the chassis body, and the heat is dissipated through the chassis body. At the same time, auxiliary heat dissipation is carried out through the heat dissipation component. With the cooperation of the heat conduction chassis and the heat dissipation component, the heat dissipation efficiency is effectively improved, the internal structure is simplified, assembly and maintenance are facilitated, and safety is improved. It has the advantages of high heat dissipation efficiency, simple structure, easy maintenance, and safety and reliability.

[0029] In this embodiment, when the power supply chassis is used underwater, a heat conduction outer shell is added outside the heat conduction chassis, and a heat conduction pad is added at the arc of the power supply chassis to eliminate the contact thermal resistance caused by the special-shaped structure and ensure that the heat is evenly transferred from the internal components to the heat conduction outer shell. The heat is transferred to the heat conduction outer shell, and the heat conduction outer shell is made of a heat conduction material, such as aluminum alloy, for heat exchange and dissipation with the external water, with higher efficiency; internal fan heat dissipation plays a role in balancing the heat inside the whole machine to ensure that the internal temperature is the same everywhere.

[0030] In this embodiment, a first heat conduction boss 4 is arranged on the chassis housing 2, and the power module 3 is directly installed on the first heat conduction boss 4, increasing the contact area between the power module 3 and the chassis housing 2, which is beneficial to the rapid conduction of heat. Specifically, the chassis housing 2 is made of a heat conduction material, such as aluminum alloy, steel, etc. The first heat conduction boss 4 is integrally formed with the chassis housing 2, and the installation part of the power module 3 is thickened to form the first heat conduction boss 4. The power module 3, as the core heat generation unit, is directly installed on the first heat conduction boss 4, ensuring good heat conduction between the power module 3 and the chassis housing 2.

[0031] The heat-conducting chassis includes a chassis cover 1 and a chassis housing 2. The chassis cover 1 is installed on the chassis housing 2 to form a closed housing, providing installation points and protection for the components of the entire device. The chassis cover 1 and the chassis housing 2 together form a closed space, which helps to control the flow direction of the internal air flow and improve the heat dissipation efficiency. The closed housing can prevent external heat from entering and also centrally manage the heat generated inside. The chassis housing 2 is used to install heat dissipation components, a power module 3, and other heat-generating elements, enabling the heat to be effectively transferred from the heat source to the heat dissipation components and then discharged outside the chassis, thereby improving the overall heat dissipation efficiency.

[0032] The seal between the chassis cover 1 and the chassis housing 2 can be achieved by a rubber sealing strip, ensuring the airtightness of the closed housing. This not only helps to control the internal air flow but also prevents external dust and moisture from entering, improving the reliability and service life of the high-efficiency heat dissipation power supply chassis.

[0033] For easy disassembly, the chassis cover 1 is detachably arranged on the chassis housing 2, and the disassembly method can adopt existing disassembly and fixing methods such as snap connection and bolt connection, which will not be elaborated here one by one.

[0034] To further improve the heat dissipation efficiency, a heat dissipation component is provided on the chassis cover 1. The heat dissipation component is used to generate a wind source. The heat dissipation component is arranged on the chassis cover 1 to generate a wind source and form forced convection heat dissipation. The wind source flows through the power module 3 and then is discharged from the chassis housing 2, effectively taking away the heat. This not only simplifies the structure but also avoids the potential risks of the water cooling system, solves the problem of low heat dissipation efficiency of the high-efficiency heat dissipation power supply chassis, and at the same time maintains the characteristics of simple structure and easy maintenance. It is more effective than the traditional air cooling system and avoids the complexity of the water cooling system.

[0035] During operation, the power module 3 generates heat, and the heat is first transferred to the chassis housing 2 through the heat-conducting boss. At the same time, the wind source generated by the heat dissipation component enters from the chassis cover 1, flows through the power module 3, takes away part of the heat, and finally is discharged from the chassis housing 2, improving the heat dissipation efficiency. The design of the heat-conducting boss 4 enhances heat conduction, while the directional air flow generated by the heat dissipation component accelerates the heat discharge.

[0036] The heat dissipation component includes an air inlet 5, a fan 6, and an air outlet. The fan 6 is arranged at the air outlet of the chassis housing 2. The wind source generated by the fan 6 flows through the power module 3 and the filter switch module 12 through the air inlet 5 and then is discharged from the air outlet. The fan 6 uses a high-speed fan, and the fan is fixed on the chassis cover 1 through a shock-proof gasket to reduce vibration and noise during operation. A circular air outlet is arranged on one side of the chassis housing 2, and the total area is not less than 1.2 times the area of the air inlet 5 to ensure smooth air flow discharge. All joints are sealed with conductive sealing strips to improve the electromagnetic shielding effect.

[0037] Specifically, the air inlet 5 is opened at the front end of the chassis cover 1, and the air outlet is opened at the rear end of the chassis housing 2, forming an effective air circulation path. The air source generated by the fan 6 enters from the air inlet 5 of the chassis cover 1, flows through the power module 3, takes away the heat and then is discharged from the air outlet of the chassis housing 2, improving the heat dissipation efficiency. The forced convection channel running through the entire chassis enables the cold air to fully contact the heating elements, enhancing the heat exchange efficiency, effectively controlling the air flow direction, and reducing eddy currents and dead corners. The closed structure of the heat-conducting chassis not only protects the internal components but also enhances the overall heat dissipation performance by using heat-conducting materials. The design of the heat-conducting boss 1 increases the contact area with the power module 3, improves the heat conduction efficiency, and combines with the forced air-cooling system to ensure both the heat conduction effect and the convective heat dissipation, thus comprehensively improving the heat dissipation efficiency.

[0038] In addition, the present invention not only utilizes mechanical forced convection but also cleverly combines the principle of natural convection. The characteristics of hot air rising and cold air sinking are fully utilized to form a natural heat circulation system, significantly improving the heat dissipation efficiency, reducing the load on the fan 6, and extending the service life of the system.

[0039] Furthermore, the air inlet 5 is close to the upper part of the power module 3 to ensure that the cold air directly contacts the heat source. The air outlet can be set at the diagonal position away from the power module 3 to create an oblique air flow path, maximizing the heat removal effect and forming a "top-down" air flow path. This design is conducive to the discharge of dust and impurities, reducing the possibility of their accumulation inside the chassis. Therefore, even after long-term operation, the inside of the chassis can still remain relatively clean and maintain a good heat dissipation effect.

[0040] An electromagnetic shielding ventilation plate 8 is provided at the air inlet 5 of the chassis cover 1. The electromagnetic shielding ventilation plate 8 can be integrally formed with the chassis cover 1 or installed as an independent component. The integrally formed method can reduce the assembly process and improve the production efficiency, not only solving the electromagnetic interference problem but also forming a coordinated cooperation with the entire heat dissipation system. The electromagnetic shielding ventilation plate 8 is located at the air inlet 5 and is the first barrier for air to enter the chassis. It not only filters electromagnetic interference but also can block some dust particles, extending the service life of the internal components. At the same time, due to the presence of the ventilation plate, the air flow entering the chassis will be more uniform, which is beneficial to improving the overall heat dissipation effect.

[0041] The electromagnetic shielding ventilation panel 8 can be honeycomb-shaped or grid-shaped. In a specific embodiment, the electromagnetic shielding ventilation panel 8 is made of an aluminum alloy plate with a thickness of 1 mm and processed into a honeycomb structure through a stamping process. The honeycomb structure can effectively shield electromagnetic waves with a frequency up to 1 GHz while ensuring that the increase in air flow resistance does not exceed 5%. The ventilation panel is fixed at the air inlet 5 of the chassis cover 1 through a snap-fit structure, which is convenient for disassembly and cleaning. To further improve the shielding effect, a conductive rubber sealing strip is also provided on the contact surface between the ventilation panel and the chassis cover 1.

[0042] The design of the electromagnetic shielding ventilation panel 8 of the present application has obvious advantages. Traditional high-efficiency heat dissipation power supply chassis often only focus on heat dissipation and ignore the electromagnetic compatibility problem. Even when considering electromagnetic shielding, the method of coating the entire interior of the chassis with a conductive coating is mostly adopted, which makes the method costly and difficult to optimize for the key part of the air inlet 5. However, the present invention directly protects the main entrance of electromagnetic interference, which is both efficient and economical. At the same time, since the electromagnetic shielding function is integrated into the ventilation structure, it does not increase the volume and weight of the chassis, maintains the compactness of the product, significantly improves the electromagnetic compatibility performance of the high-efficiency heat dissipation power supply chassis, and ensures the heat dissipation efficiency. This not only improves the working stability of the power module 3 but also reduces the electromagnetic interference to surrounding electronic devices, providing a guarantee for the reliable operation of the entire system.

[0043] A wiring bracket 9 is provided on the heat-conducting chassis. The wiring bracket 9 provides a structure for fixing and guiding cables and wire harnesses, making the wiring inside the chassis more neat and orderly, and can effectively solve the problem of complex wiring inside the high-efficiency heat dissipation power supply chassis.

[0044] Specifically, the wiring bracket 9 can be implemented in a variety of possible ways. For example, the wiring bracket 9 can be a metal or plastic strip structure fixed on the inner wall of the heat-conducting chassis, with multiple slots or hooks for fixing cables; or, a grid-shaped wiring rack can be set inside the heat-conducting chassis, which can flexibly fix the cables at different positions. An adjustable wiring bracket 9 can also be adopted, allowing the position and angle of the bracket to be adjusted according to actual needs. By reasonably arranging the wiring bracket 9, it can be ensured that the cables and wire harnesses do not interfere with the heat dissipation path of the power module 3, thereby optimizing the heat dissipation effect of the entire system. At the same time, the setting of the wiring bracket 9 also facilitates the electrical connection between the power module 3 and other components, improves the overall assembly efficiency, and the wiring bracket 9 helps to optimize the air flow distribution inside the chassis. In the absence of the wiring bracket 9, the messy cables may hinder the air flow, resulting in the generation of local hot spots. By using the wiring bracket 9, the cables can be concentrated and fixed, creating a more unobstructed path for the air flow, thereby improving the overall heat dissipation efficiency.

[0045] The routing bracket 9 of the present invention is provided, which not only solves these problems, but also indirectly improves the overall performance and reliability of the high-efficiency heat dissipation power supply chassis by optimizing the internal space utilization and air flow distribution.

[0046] A cable plug cover plate 10 assembly is provided on the heat-conducting chassis. The cable plug cover plate 10 assembly includes a cable plug cover plate 10 and a cable plug 11. The cable plug cover plate 10 is provided at the front end of the chassis housing 2. The cable plug 11 serves as the input and output interface of the high-efficiency heat dissipation power supply chassis. In this embodiment, the cable plug cover plate 10 assembly is installed at the front end of the chassis housing 2. The cable plug cover plate 10 can be made of a metal material, such as aluminum alloy or stainless steel, to provide good mechanical strength and electromagnetic shielding performance. The cable plug cover plate 10 can be fixed to the front end of the chassis housing 2 by means of screws or buckles, etc., which is convenient for installation and disassembly. By providing the cable plug cover plate 10 assembly on the heat-conducting chassis, the present invention effectively solves the problems of cable connection and electromagnetic shielding of the high-efficiency heat dissipation power supply chassis. The setting of the cable plug cover plate 10 provides protection and fixation for the cable plug 11, and at the same time enhances the overall structural strength of the chassis. The cable plug 11, as a standardized input and output interface, simplifies the connection process between the high-efficiency heat dissipation power supply chassis and external devices, and improves the convenience of installation and use.

[0047] Conductive rubber strips are provided on the chassis cover 1 and the cable socket cover plate assembly. The conductive rubber strips can be composed of a conductive material (such as metal particles) and an elastic material (such as silicone rubber), and have good conductivity and elasticity. When the chassis cover 1 and the cable socket cover plate assembly are assembled with the chassis housing 2, the conductive rubber strips will be compressed to form a tight electrical contact. As a preferred embodiment, the conductive rubber strips are made of silicone rubber material filled with silver particles, which has excellent conductivity and durability. The conductive rubber strips can be designed as continuous long strips and arranged along the edges of the chassis cover 1 and the cable socket cover plate assembly. On the chassis cover 1, the conductive rubber strips can form a complete rectangular ring to ensure 360-degree electromagnetic shielding. For the cable socket cover plate assembly, the conductive rubber strips can be arranged around each socket opening to form multiple independent sealing rings.

[0048] The high-efficiency heat dissipation power supply chassis further includes a filter switch module 12, which is disposed on the second heat conduction boss 13. The filter switch module 12 is used for filtering, rectifying, and on-off control of the input and output. The main functions of the filter switch module 12 are to filter, rectify, and control the on-off of the input and output. Through filtering and rectifying, the clutter and noise in the power supply can be eliminated, providing a more stable and clean power output. The on-off control function can achieve precise management of the power supply and improve the energy utilization efficiency. Setting the filter switch module 12 on the second heat conduction boss 13 can increase the heat dissipation area and improve the heat conduction efficiency, which can not only ensure the normal operating temperature of the filter switch module 12 but also utilize the heat generated by it and quickly transfer it to the outside of the chassis through the second heat conduction boss 13, thereby improving the overall heat dissipation efficiency. By optimizing the internal layout and thermal management, the problem of low heat dissipation efficiency of the high-efficiency heat dissipation power supply chassis is effectively solved. At the same time, the introduction of the filter switch module 12 also improves the power quality and enhances the functionality and reliability of the high-efficiency heat dissipation power supply chassis. Compared with the complex water-cooling system, the structure of the present invention is simpler, the maintenance is more convenient, and the leakage risk that may be brought by the water-cooling system is avoided.

[0049] The filter switch module 12 is disposed in the middle of the chassis housing 2, and the power module 3 is disposed on both sides of the filter switch module 12. In the traditional high-efficiency heat dissipation power supply chassis, the positions of the filter switch module 12 and the power module 3 are installed very dispersedly, and it is impossible to dissipate heat from the filter switch module 12 and the power module 3 simultaneously through a ventilation duct. This not only increases the complexity of the internal wiring but also is not conducive to the centralized management of heat. In this application, the power module 3 is disposed on both sides of the filter switch module 12 and dissipates heat through the heat conduction boss, greatly simplifying the internal structure and improving the heat dissipation efficiency. The filter switch module 12 and the power module 3 can be cooled simultaneously through a ventilation duct. Moreover, compared with the water-cooling heat dissipation solution, the present invention not only avoids the risk of liquid leakage but also greatly reduces the maintenance cost and difficulty, and has higher reliability and a longer service life.

[0050] To facilitate the handling of the high-efficiency heat dissipation power supply chassis, a handle 7 is provided on the heat conduction chassis.

[0051] The present invention solves the problems of low heat dissipation efficiency of the existing high-efficiency heat dissipation power supply chassis, inability to effectively cope with high-heat working conditions, complex internal structure, increased assembly difficulty, difficult maintenance, and potential safety hazards during long-term operation. These problems seriously restrict the performance and reliability of the high-efficiency heat dissipation power supply chassis and affect its actual application effect.

[0052] The present invention improves the heat dissipation efficiency by combining structural optimization and forced convection. The design of the first heat conduction boss 4 increases the contact area between the power module 3, the filter switch module 12 and the chassis housing 2, which is conducive to the rapid conduction of heat. The directional air flow generated by the heat dissipation component accelerates the heat discharge, more effectively solving the problem of low heat dissipation efficiency compared with the traditional air-cooled system, and at the same time avoiding the complexity and potential risks of the water-cooled system.

[0053] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present invention and not to limit them. Although the present invention has been described in detail with reference to the preferred embodiments, those of ordinary skill in the art should understand that the technical solutions of the present invention can be modified or equivalently replaced without departing from the spirit and scope of the technical solutions of the present invention, and they should all be covered within the scope of the claims of the present invention.

Claims

1. An efficient heat dissipation power supply chassis, characterized in that: It includes a heat-conducting inner chassis, a heat-conducting outer shell and a power module. The heat-conducting inner chassis is disposed in the heat-conducting outer shell. There is a first heat-conducting boss on the heat-conducting chassis, and the power module is disposed on the first heat-conducting boss. A heat dissipation component is provided on the heat-conducting chassis, and the air source generated by the heat dissipation component flows through the power module and is discharged from the heat-conducting chassis.

2. The high-efficiency heat dissipation power supply chassis according to claim 1, wherein: A heat-conducting pad in contact with the heat-conducting outer shell is provided at the arc of the heat-conducting inner chassis, and the heat-conducting pad is used to transfer the heat of the heat-conducting inner chassis to the heat-conducting outer shell.

3. The efficient heat dissipation power supply chassis according to claim 1, wherein: It further includes a filter switch module. The filter switch module is disposed on the second heat-conducting boss and is used for filtering, rectifying, and on-off control of input and output.

4. The high-efficiency heat dissipation power supply chassis according to claim 1, wherein: The heat-conducting chassis includes a chassis cover plate and a chassis housing, and the chassis cover plate is installed on the chassis housing to form a closed housing.

5. The high-efficiency heat dissipation power supply chassis according to claim 4, wherein: The heat dissipation component includes an air inlet, a fan, and an air outlet. The fan is disposed in the chassis housing. The air source generated by the fan flows through the power module and the filter switch module through the air inlet and is then discharged from the air outlet. The air inlet is opened on the chassis cover plate, and the air outlet is opened on the chassis housing.

6. The high-efficiency heat dissipation power supply chassis according to claim 5, wherein: An electromagnetic shielding ventilation plate is provided at the air inlet of the chassis cover plate.

7. The high-efficiency heat dissipation power supply chassis according to claim 1, characterized in that: A wiring bracket is provided on the heat-conducting chassis.

8. The high-efficiency heat dissipation power supply chassis according to claim 3, characterized in that: A cable plug cover plate assembly is provided on the heat-conducting chassis. The cable plug cover plate assembly includes a cable plug cover plate and a cable plug. The cable plug cover plate is disposed at the front end of the chassis housing, and the cable plug serves as the input and output interface of the high-efficiency heat dissipation power chassis.

9. The high-efficiency heat dissipation power supply chassis according to claim 8, characterized in that: Conductive rubber strips are provided on the chassis cover plate and the cable socket cover plate assembly.

10. The high-efficiency heat dissipation power supply chassis according to claim 5, wherein: The filter switch module is disposed in the middle of the chassis housing, and the power modules are disposed on both sides of the filter switch module.

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