Thermal management structure and display module

Abstract

The invention discloses a heat management structure and a display module, and relates to the technical field of display, and the heat management structure comprises a substrate, a gradient heat diffusion layer and a micro-channel heat exchanger which are arranged in sequence; the gradient heat diffusion layer comprises a plurality of heat diffusion sub-layers, and the heat conductivity of each heat diffusion sub-layer is gradually reduced from the side close to the substrate to the side close to the micro-channel heat exchanger; the micro-channel heat exchanger includes a fluid channel connected to a cooling system. The problem of heat accumulation in the display module is effectively solved.

Description

Technical Field

[0001] This application relates to the field of display technologies, and particularly to a thermal management structure and a display module. Background Art

[0002] With the continuous progress of display technologies, various high-performance display modules, such as LEDs (light-emitting diodes), Mini-LEDs (sub-millimeter light-emitting diodes), OLEDs (organic light-emitting diodes), etc., have been widely used in multiple fields such as televisions, monitors, and automotive displays. However, with the significant improvement in display effects, these display modules also face a series of technical challenges, and one of the most prominent problems is heat accumulation. The high chip density of some display modules results in a greater power input per unit area, thereby generating serious heat dissipation problems. This heat accumulation not only shortens the service life of the display device but may also affect its display performance.

[0003] The above content is only used to assist in understanding the technical solution of this application and does not represent an admission that the above content is prior art. Summary of the Invention

[0004] The main purpose of this application is to provide a thermal management structure and a display module, aiming to effectively improve the heat accumulation problem in the display module.

[0005] To achieve the above purpose, this application provides a thermal management structure, which includes:

[0006] A substrate, a gradient heat diffusion layer, and a microchannel heat exchanger arranged in sequence;

[0007] The gradient heat diffusion layer includes multiple heat diffusion sub-layers, and the thermal conductivity of each heat diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger;

[0008] The microchannel heat exchanger includes a fluid channel connected to a cooling system.

[0009] In one embodiment, the thermal management structure further includes: a thermal interface material layer provided on the side of the substrate away from the gradient heat diffusion layer.

[0010] In one embodiment, the thermal conductivity of the thermal interface material layer is greater than or equal to 10 W / m·K.

[0011] In one embodiment, the thermal interface material layer includes: thermal grease and / or thermal film;

[0012] And / or, the thickness of the thermal interface material layer is: 100 - 200 um.

[0013] In one embodiment, a heat dissipation layer is provided on the surface of the substrate, and the thermal conductivity of the heat dissipation layer is greater than or equal to 2000 W / m·K;

[0014] And / or, the material of the substrate includes at least one of sapphire, silicon, and silicon carbide.

[0015] In one embodiment, the heat dissipation layer includes at least one of a graphene film, a graphene coating layer, and a diamond film;

[0016] And / or, the thickness of the heat dissipation layer is 0.5 - 1.1 um.

[0017] In one embodiment, the material of the thermal diffusion sub-layer includes at least one of copper, aluminum, graphene, boron nitride, alumina, and a carbon nanotube composite material.

[0018] In one embodiment, the cooling system includes a liquid cooling circulation system.

[0019] In one embodiment, the microchannel heat exchanger includes a microchannel network composed of a plurality of the fluid channels, and the shape of the microchannel network includes at least one of parallel arrangement, spiral arrangement, and honeycomb arrangement.

[0020] In addition, to achieve the above object, an embodiment of the present application further provides a display module, which includes a light-emitting chip and the thermal management structure as described above, and the thermal management structure is disposed on a side of the light-emitting chip away from the light-emitting direction.

[0021] One or more technical solutions provided by the embodiments of the present application have at least the following technical effects: providing a thermal management structure, including a substrate, a gradient thermal diffusion layer, and a microchannel heat exchanger arranged in sequence. The thermal management structure can be disposed on one side of a light-emitting chip (for example, an LED chip, a Mini LED chip, an OLED chip, etc.) of the display module, and the substrate provides mechanical support for the chip and other components in the thermal management structure to ensure the stability of each component during operation. Furthermore, through the gradient thermal diffusion layer composed of multiple thermal diffusion sub-layers, the heat generated by the light-emitting chip is quickly absorbed and transferred, thereby effectively avoiding the occurrence of local overheating of the light-emitting chip; at the same time, the thermal conductivity of each thermal diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger, which helps to evenly disperse the heat and control the speed of heat transfer to the outside, preventing excessive temperature difference stress between the external environment and the internal components. Furthermore, through the microchannel heat exchanger connected to the cooling system, the heat is quickly taken away, effectively improving the heat accumulation situation in the display module. Description of the Drawings

[0022] Figure 1 Structural schematic diagram of the thermal management structure involved in the embodiment of the present applicationFigure 1 ;

[0023] Figure 2 This is a schematic structural view of the microchannel heat exchanger according to an embodiment of the present application;

[0024] Figure 3 This is a schematic structural view of the thermal management structure according to an embodiment of the present application Figure 2 ;

[0025] Figure 4 This is a schematic structural view of the display module according to an embodiment of the present application.

[0026] Description of the reference numerals

[0027] 110, substrate; 120, gradient heat diffusion layer; 121, heat diffusion sub-layer;

[0028] 130, microchannel heat exchanger; 140, thermal conductive interface material layer;

[0029] 200, cooling system; 300, light-emitting chip.

[0030] The realization, functional features and advantages of the purpose of the present application will be further described with reference to the embodiments and the accompanying drawings. Detailed implementation manners

[0031] To make the objectives, technical solutions and advantages of the embodiments of the present application clearer, the technical solutions in the embodiments of the present application will be clearly and completely described below. Those not specified in the embodiments are carried out according to conventional conditions or conditions recommended by the manufacturer. Those reagents or instruments not specified by the manufacturer can be obtained as conventional products available on the market.

[0032] Hereinafter, the implementation manners of the thermal management structure and the display module of the present application are specifically disclosed with appropriate reference to the accompanying drawings. However, there may be cases where unnecessary detailed descriptions are omitted. For example, there are cases where detailed descriptions of well-known matters and repeated descriptions of actually identical structures are omitted. This is to avoid the following description from becoming unnecessarily long and to facilitate the understanding of those skilled in the art. In addition, the accompanying drawings and the following description are provided for those skilled in the art to fully understand the present application and are not intended to limit the subject matter recited in the claims.

[0033] The "ranges" disclosed in this application are defined in the form of a lower limit and an upper limit. A given range is defined by selecting a lower limit and an upper limit, and the selected lower limit and upper limit define the boundaries of a particular range. The ranges defined in this way can include or exclude the end values, and can be combined arbitrarily, that is, any lower limit can be combined with any upper limit to form a range. For example, if ranges of 60 - 120 and 80 - 110 are listed for a specific parameter, ranges of 60 - 110 and 80 - 120 are also contemplated. In addition, if the minimum range values 1 and 2 are listed, and if the maximum range values 3, 4, and 5 are listed, the following ranges are all contemplated: 1 - 3, 1 - 4, 1 - 5, 2 - 3, 2 - 4, and 2 - 5. In this application, unless otherwise specified, the numerical range "a - b" represents an abbreviated representation of any real number combination between a and b, where a and b are both real numbers. For example, the numerical range "0 - 5" means that all real numbers between "0 - 5" are fully listed herein, and "0 - 5" is only an abbreviated representation of these numerical combinations. Additionally, when stating that a certain parameter is an integer ≥2, it is equivalent to disclosing that the parameter is, for example, the integers 2, 3, 4, 5, 6, 7, 8, 9, 10, 11, 12, etc.

[0034] If there is no special instruction, all embodiments and optional embodiments of this application can be combined with each other to form new technical solutions.

[0035] If there is no special instruction, all technical features and optional technical features of this application can be combined with each other to form new technical solutions.

[0036] If there is no special instruction, all steps of this application can be carried out in sequence or randomly, preferably in sequence. For example, the method includes steps (a) and (b), which means that the method can include steps (a) and (b) carried out in sequence, or can also include steps (b) and (a) carried out in sequence. For example, when it is mentioned that the method may further include step (c), it means that step (c) can be added to the method in any order. For example, the method can include steps (a), (b), and (c), or can also include steps (a), (c), and (b), or can also include steps (c), (a), and (b), etc.

[0037] If there is no special instruction, the "including" and "comprising" mentioned in this application mean open-ended or can also be closed-ended. For example, the "including" and "comprising" can mean that other components not listed can also be included or comprised, or can only include or comprise the listed components.

[0038] Unless otherwise specified, the term "or" is inclusive in this application. For example, the phrase "A or B" means "A, B, or both A and B". More specifically, any of the following conditions satisfies the condition "A or B": A is true (or exists) and B is false (or does not exist); A is false (or does not exist) and B is true (or exists); or both A and B are true (or exist).

[0039] To make the above objects, features, and advantages of this application more obvious and understandable, the technical solutions of this application will be further described below in conjunction with the accompanying drawings and embodiments. However, this application is not limited to the listed embodiments, and should also include any other well-known changes within the scope of the rights required by this application.

[0040] As used herein, the term "one embodiment" or "embodiment" refers to a specific feature, structure, or characteristic that may be included in at least one implementation of this application. The appearances of "in one embodiment" in different places in this specification do not all refer to the same embodiment, nor are they separate or selectively exclusive embodiments from other embodiments.

[0041] To better understand the technical solutions of this application, the following will be described in detail in conjunction with the drawings of the specification and specific implementation manners.

[0042] In the related art, the chip density of some display modules is relatively high, which in turn results in a greater power input per unit area and causes serious heat dissipation problems. This heat accumulation will not only shorten the service life of the display device but may also affect its display performance. Conventional thermal management structures, such as heat-conducting substrates, heat sinks, etc., have defects such as high thermal resistance, insufficient heat dissipation efficiency, and large volume.

[0043] In this embodiment, a thermal management structure is provided, including: a substrate, a gradient heat diffusion layer, and a microchannel heat exchanger arranged in sequence. The thermal management structure can be arranged on one side of the light-emitting chip (such as an LED chip, a Mini LED chip, an OLED chip, etc.) of the display module, and the substrate provides mechanical support for the chip and other components in the thermal management structure to ensure the stability of each component during operation. Furthermore, through the gradient heat diffusion layer composed of multiple heat diffusion sub-layers, the heat generated by the light-emitting chip is quickly absorbed and transferred out, thus effectively avoiding the occurrence of local overheating of the light-emitting chip; at the same time, the thermal conductivity of each heat diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger, which helps to evenly disperse the heat and control the speed of heat transfer to the outside, preventing excessive temperature difference stress from occurring between the external environment and the internal components. Furthermore, through the microchannel heat exchanger connected to the cooling system, the heat is quickly removed, effectively improving the heat accumulation situation in the display module.

[0044] Based on this, in the first aspect of the embodiments of the present application, a thermal management structure is provided. Referring to Figure 1 and 2 , the thermal management structure includes:

[0045] A substrate, a gradient thermal diffusion layer, and a microchannel heat exchanger arranged in sequence;

[0046] The gradient thermal diffusion layer includes multiple thermal diffusion sub-layers, and the thermal conductivity of each thermal diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger;

[0047] The microchannel heat exchanger includes a fluid channel connected to a cooling system.

[0048] In a feasible implementation manner, the substrate provides mechanical support for the chip and other components in the thermal management structure to ensure the stability of each component during operation. The materials of the substrate include at least one of sapphire, silicon, and silicon carbide.

[0049] Sapphire is the second hardest material after diamond, with excellent wear resistance and scratch resistance, and has a high melting point and good thermal stability, suitable for high-temperature environments.

[0050] Silicon is one of the most common semiconductor materials, with mature production processes and relatively low costs. In addition, silicon is easy to process through various microfabrication technologies, such as etching, deposition, etc., suitable for large-scale production. At the same time, silicon matches well with many materials, reducing stress problems caused by temperature changes.

[0051] Silicon carbide has a high thermal conductivity, which helps to dissipate heat quickly, especially suitable for high-power density devices, and silicon carbide can also work at extremely high temperatures, making it very suitable for applications in high-temperature environments.

[0052] Exemplarily, the materials of the substrate may also include at least one of gallium nitride, gallium arsenide, zinc oxide, ceramic materials, and glass.

[0053] Exemplarily, the thickness of the substrate is 500 - 1000 um. For example, the thickness of the substrate is 500 nm, 600 nm, 700 nm, 800 nm, 900 nm, 1000 nm, etc.

[0054] In a feasible implementation manner, in order to further improve the heat dissipation effect of the thermal management structure on the light-emitting chip, a heat dissipation layer (not shown in the drawings) may be provided on the surface of the substrate close to the light-emitting chip, so as to quickly conduct the heat of the chip to the gradient thermal diffusion layer, where the thermal conductivity of the heat dissipation layer is greater than or equal to 2000 W / m·K.

[0055] Exemplarily, techniques such as physical vapor deposition and chemical vapor deposition can be used to prepare the heat dissipation layer material on the substrate to ensure the coating uniformity and adhesion.

[0056] In a feasible implementation, the heat dissipation layer includes at least one of a graphene thin film, a graphene coating layer, and a diamond thin film.

[0057] Exemplarily, the heat dissipation layer includes at least one of a graphene thin film, a graphene composite thin film, a graphene coating layer, and a diamond thin film.

[0058] Graphene is one of the materials with the best known thermal conductivity currently. Its in-plane thermal conductivity is extremely high, and it can conduct heat quickly and effectively. Moreover, the graphene thin film is not only thin and light but also extremely strong. Therefore, it can provide strong heat dissipation support without affecting the weight of the device. By combining graphene with polymers or other materials to form composite materials, their physical and chemical properties can be adjusted according to specific needs, such as increasing mechanical strength or improving processing performance. And compared with pure graphene thin films, graphene composite materials may be more cost-effective and easier to mass-produce. Graphene coatings can be directly sprayed or brushed onto surfaces of various shapes and sizes, simplifying the manufacturing process and enabling the formation of a uniform coating on complex structures to ensure effective heat dissipation across the entire surface.

[0059] Diamond has the highest thermal conductivity in nature, far exceeding most other materials, and is particularly suitable for application scenarios that require extreme heat dissipation performance. Moreover, diamond exhibits extremely high resistance to almost all chemical substances and can work stably for a long time in harsh environments.

[0060] In a feasible implementation, the thickness of the heat dissipation layer is 0.5 - 1.1 μm. For example, the thickness of the heat dissipation layer is 0.5 μm, 0.55 μm, 0.6 μm, 0.65 μm, 0.7 μm, 0.75 μm, 0.8 μm, 0.85 μm, 0.9 μm, 0.95 μm, 1 μm, 1.1 μm, etc. If the heat dissipation layer is too thick, the overall size of the thermal management structure will increase, which is not conducive to lightweighting. At the same time, an overly thick heat dissipation layer will result in a longer heat conduction path, thereby increasing the total thermal resistance, which may reduce the heat dissipation efficiency. If the thickness of the heat dissipation layer is too thin, the total amount of heat that can be absorbed and conducted is also less, and it cannot effectively meet the heat dissipation requirements under high power density. Therefore, the embodiments of the present application determine that the thickness of the heat dissipation layer is 0.5 - 1.1 μm.

[0061] In a feasible implementation, referring to Figure 3 , the thermal management structure further includes a thermal interface material layer disposed on the side of the substrate away from the gradient heat diffusion layer.

[0062] The Thermal Interface Material Layer (TIM layer) can fill the tiny gaps and unevenness between the heat-generating components (such as light-emitting chips) close to the substrate and the substrate, reducing the presence of air, which is a poor heat-conducting medium; since the thermal conductivity of air is very low (about 0.026 W / m·K), while the thermal interface material has a relatively higher thermal conductivity. Therefore, the thermal interface material layer can significantly reduce the thermal resistance between interfaces, ensuring that heat is transferred more smoothly from the heat-generating components to the substrate and further transferred out, thereby improving the heat transfer efficiency from the heat-generating components to the thermal management structure.

[0063] In a feasible implementation, the thermal conductivity of the thermal interface material layer is greater than or equal to 10 W / m·K.

[0064] In a feasible implementation, the thermal interface material layer includes: thermal paste and / or thermal film.

[0065] Thermal paste is usually composed of a mixture of metal oxide (such as alumina, boron nitride, etc.) particles and silicone oil, which can provide a relatively high thermal conductivity and contribute to efficient heat conduction. And thermal paste has a certain fluidity, which can well fill the tiny voids and unevenness between the substrate and the radiator, thus minimizing the air gap to the greatest extent and improving the contact area and heat conduction efficiency. Due to its fluid characteristics, thermal paste is particularly suitable for electronic components with a relatively high surface roughness or complex shapes, ensuring good thermal contact in these cases. And if it is necessary to disassemble and reinstall the heat dissipation device, thermal paste is relatively easy to clean, facilitating subsequent maintenance and replacement.

[0066] Thermal film is a preformed solid material that can be directly placed in the required position, simplifying the assembly process, especially suitable for use in automated production lines. And thermal film usually has a certain elasticity and thickness, which can absorb vibrations and impacts to a certain extent, providing additional mechanical protection for the device. Once it is properly adhered, thermal film will not flow or dry out like thermal paste over time or with temperature changes, so it can provide long-term stable thermal resistance performance.

[0067] In a feasible embodiment, the thickness of the thermal interface material layer is: 100 - 200 um; for example, the thickness of the thermal interface material layer is: 100 um, 110 um, 120 um, 130 um, 140 um, 150 um, 160 um, 170 um, 180 um, 190 um, 200 um, etc. Although the thermal interface material layer itself has high thermal conductivity, an overly thick layer will increase the distance of heat transfer, resulting in an increase in the total thermal resistance; at the same time, its fluidity or adaptability will also decrease, and it cannot effectively fill these fine gaps, resulting in air residue, further increasing the thermal resistance and increasing the overall size. An overly thin thermal interface material layer may not be sufficient to fill all the microscopic unevenness and voids between the substrate and the heating element, especially for components with a relatively high surface roughness. The remaining air gaps will significantly reduce the heat conduction efficiency and form local hot spots. Therefore, in the embodiments of the present application, the thickness of the thermal interface material layer is determined to be: 100 - 200 um.

[0068] Exemplarily, the gradient thermal diffusion layer includes a first thermal diffusion sub-layer, a second thermal diffusion sub-layer, and a third thermal diffusion sub-layer arranged in sequence, wherein the thermal conductivity of the first thermal diffusion sub-layer close to the substrate is greater than that of the second thermal diffusion sub-layer, and the thermal conductivity of the second thermal diffusion sub-layer is greater than that of the third thermal diffusion sub-layer close to the microchannel heat exchanger.

[0069] Exemplarily, the gradient thermal diffusion layer can be prepared layer by layer using techniques such as sputtering technology, electroless plating process, etc.

[0070] In a feasible embodiment, the material of the thermal diffusion sub-layer includes at least one of copper, aluminum, graphene, boron nitride, aluminum oxide, and carbon nanotube composite materials.

[0071] Exemplarily, the gradient thermal diffusion layer includes graphene (i.e., the first thermal diffusion sub-layer), copper (i.e., the second thermal diffusion sub-layer), and aluminum (i.e., the third thermal diffusion sub-layer) arranged in sequence.

[0072] Exemplarily, the thickness of the gradient thermal diffusion layer is 50 - 200 um. For example, the thickness of the gradient thermal diffusion layer is 50 um, 60 um, 80 um, 100 um, 120 um, 140 um, 160 um, 180 um, 200 um, etc.

[0073] In a feasible embodiment, the cooling system includes: a liquid cooling circulation system. The liquid cooling circulation system can use a liquid (such as water, ethylene glycol solution, or a special coolant) as a medium to absorb and transfer heat. Compared with traditional air cooling, the liquid cooling system can provide higher heat dissipation efficiency, especially suitable for the cooling requirements of high power density devices.

[0074] Exemplarily, the liquid cooling circulation system uses a fluorinated liquid and / or nanofluid as a cooling medium to circulate and remove heat.

[0075] In a feasible embodiment, the microchannel heat exchanger includes a microchannel network composed of multiple fluid channels, and the shape of the microchannel network includes at least one of parallel arrangement, spiral arrangement, and honeycomb arrangement.

[0076] Exemplarily, precise channel forming can be achieved by using laser etching or dry etching technology.

[0077] Exemplarily, with reference to Figure 2 , in the parallel-arranged microchannel network, each fluid channel is parallel to each other and usually has the same width and depth. The coolant flows along these parallel channels in a straight or nearly straight path from the inlet to the outlet. Since the conditions of each channel are basically the same, the flow velocity and pressure distribution of the liquid in each channel are relatively uniform, which is conducive to achieving a consistent heat exchange effect. For application scenarios that require large-area heat dissipation, parallel arrangement can provide efficient heat conduction because it can arrange a large number of parallel channels in a limited space, increasing the total heat transfer area.

[0078] Exemplarily, spiral arrangement means that the flow channels are arranged in a spiral manner around a certain center point or axis. When the liquid flows in such channels, it will experience a process of gradually expanding outwards or contracting inwards. The spiral channels can promote the turbulent effect of the fluid, enhance the heat exchange between the liquid and the wall surface, improve the heat transfer efficiency, and can achieve a longer flow channel length in a smaller space, which is suitable for applications where space is limited but efficient heat dissipation is required; and through the spiral flow path, it helps to balance the temperature difference in different regions and reduce the formation of local hot spots.

[0079] Exemplarily, honeycomb arrangement mimics the hexagonal structure of honeycombs in nature and is composed of multiple hexagonal units, with a microchannel inside each unit. The liquid flows in these hexagonal channels. The hexagonal structure can accommodate the largest number of channels per unit area, thus maximizing the heat transfer area; the honeycomb structure not only provides a good heat conduction path but also has high mechanical strength and can withstand large external pressures; due to its regular and dense layout, the distribution of the liquid in the entire microchannel network is more uniform, reducing the existence of dead zones or inefficient regions, and the honeycomb structure can adjust the unit size and shape according to specific requirements, flexibly adapting to different application environments.

[0080] In this embodiment, by optimizing the interface material and the heat conduction path, the thermal resistance is reduced by more than 30%. During the actual application process, the temperature rise of the display module can be controlled within 60°C, the heat dissipation efficiency is increased by 40%, and by using the microchannel heat exchanger to replace the traditional heat sink design, the thickness is reduced by more than 20%, thus effectively avoiding local overheating of the display module and extending the service life of the light-emitting chip.

[0081] In this embodiment, the thermal management structure includes a substrate, a gradient thermal diffusion layer, and a microchannel heat exchanger arranged in sequence. The thermal management structure can be disposed on one side of the light-emitting chip (such as an LED chip, a Mini LED chip, an OLED chip, etc.) of the display module, providing mechanical support for the chip and other components in the thermal management structure through the substrate to ensure the stability of each component during operation. Furthermore, through the gradient thermal diffusion layer composed of multiple thermal diffusion sub-layers, the heat generated by the light-emitting chip is quickly absorbed and transferred out, thus effectively avoiding the occurrence of local overheating of the light-emitting chip; at the same time, the thermal conductivity of each thermal diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger, which helps to evenly disperse the heat and control the speed of heat transfer to the outside, preventing excessive temperature difference stress between the external environment and the internal components. Furthermore, through the microchannel heat exchanger connected to the cooling system, the heat is quickly removed, effectively improving the heat accumulation situation in the display module.

[0082] In the second aspect of the embodiments of the present application, a display module is provided. Referring to Figure 4 , the display module includes a light-emitting chip and a thermal management structure, and the thermal management structure is disposed on the side of the light-emitting chip away from the light-emitting direction.

[0083] In a feasible implementation manner, the thermal management structure includes:

[0084] a substrate, a gradient thermal diffusion layer, and a microchannel heat exchanger arranged in sequence;

[0085] The gradient thermal diffusion layer includes multiple thermal diffusion sub-layers, and the thermal conductivity of each thermal diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger;

[0086] The microchannel heat exchanger includes a fluid channel connected to the cooling system.

[0087] In a feasible implementation manner, the thermal management structure further includes a thermal interface material layer disposed on the side of the substrate away from the gradient thermal diffusion layer.

[0088] In a feasible implementation manner, the thermal conductivity of the thermal interface material layer is greater than or equal to 10 W / m·K.

[0089] In a feasible implementation manner, the thermal interface material layer includes thermal paste and / or thermal film;

[0090] and / or, the thickness of the thermal interface material layer is: 100 - 200 um.

[0091] In a feasible implementation manner, a heat dissipation layer is provided on the surface of the substrate, and the thermal conductivity of the heat dissipation layer is greater than or equal to 2000 W / m·K;

[0092] And / or, the material of the substrate includes at least one of sapphire, silicon, and silicon carbide.

[0093] In a feasible embodiment, the heat dissipation layer includes at least one of a graphene film, a graphene coating layer, and a diamond film;

[0094] And / or, the thickness of the heat dissipation layer is 0.5 to 1.1 μm.

[0095] In a feasible embodiment, the material of the thermal diffusion sub-layer includes at least one of copper, aluminum, graphene, boron nitride, aluminum oxide, and a carbon nanotube composite material.

[0096] In a feasible embodiment, the cooling system includes a liquid cooling circulation system.

[0097] In a feasible embodiment, the microchannel heat exchanger includes a microchannel network formed by a plurality of fluid channels, and the shape of the microchannel network includes at least one of parallel arrangement, spiral arrangement, and honeycomb arrangement.

[0098] In this embodiment, by providing a thermal management structure on one side of the light-emitting chip, wherein the thermal management structure includes a substrate, a gradient thermal diffusion layer, and a microchannel heat exchanger arranged in sequence. The substrate provides mechanical support for the chip and other components in the thermal management structure to ensure the stability of each component during operation. Furthermore, through the gradient thermal diffusion layer composed of multiple thermal diffusion sub-layers, the heat generated by the light-emitting chip is quickly absorbed and transferred, thereby effectively avoiding the occurrence of local overheating of the light-emitting chip; at the same time, the thermal conductivity of each thermal diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger, which helps to evenly disperse the heat and control the speed of heat transfer to the outside, preventing excessive temperature difference stress between the external environment and the internal components. Furthermore, through the microchannel heat exchanger connected to the cooling system, the heat is quickly removed, effectively improving the heat accumulation situation in the display module.

[0099] The above are only the preferred embodiments of the present application, and do not limit the patent scope of the present application. For those skilled in the art, the present application can have various changes and modifications. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included in the patent protection scope of the present application.

Claims

1. A thermal management structure, characterized in that, The thermal management structure includes: A substrate, a gradient thermal diffusion layer, and a microchannel heat exchanger arranged in sequence; The gradient thermal diffusion layer includes multiple thermal diffusion sub-layers, and the thermal conductivity of each thermal diffusion sub-layer gradually decreases from the side close to the substrate to the side close to the microchannel heat exchanger; The microchannel heat exchanger includes a fluid channel connected to a cooling system.

2. The thermal management structure according to claim 1, wherein, The thermal management structure further includes: a thermal interface material layer provided on the side of the substrate away from the gradient thermal diffusion layer.

3. The thermal management structure according to claim 2, wherein, The thermal conductivity of the thermal interface material layer is greater than or equal to 10 W / m·K.

4. The thermal management structure according to claim 2, characterized in that, The thermal interface material layer includes: thermal paste and / or thermal conductive film; And / or, the thickness of the thermal interface material layer is: 100 - 200 um.

5. The thermal management structure according to claim 1, wherein, A heat dissipation layer is provided on the surface of the substrate, and the thermal conductivity of the heat dissipation layer is greater than or equal to 2000 W / m·K; And / or, the material of the substrate includes at least one of sapphire, silicon, and silicon carbide.

6. The thermal management structure according to claim 5, wherein, The heat dissipation layer includes at least one of a graphene film, a graphene coating layer, and a diamond film; And / or, the thickness of the heat dissipation layer is: 0.5 - 1.1 um.

7. The thermal management structure according to claim 1, wherein The material of the thermal diffusion sub-layer includes at least one of copper, aluminum, graphene, boron nitride, aluminum oxide, and carbon nanotube composite material.

8. The thermal management structure according to claim 1, wherein, The cooling system includes: a liquid cooling circulation system.

9. The thermal management structure according to claim 1, characterized in that, The microchannel heat exchanger includes a microchannel network composed of multiple fluid channels, and the shape of the microchannel network includes at least one of parallel arrangement, spiral arrangement, and honeycomb arrangement.

10. A display module, characterized in that, The display module includes a light-emitting chip and the thermal management structure according to any one of claims 1 to 9, and the thermal management structure is provided on the side of the light-emitting chip away from the light-emitting direction.

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