LED packaging structure and LED packaging structure manufacturing method

Abstract

The invention relates to the technical field of LED packaging, and discloses an LED packaging structure and a manufacturing method of the LED packaging structure. The LED packaging structure comprises a circuit substrate and a chip, wherein the chip is arranged on the circuit substrate; the reflecting glue covers the circuit substrate and surrounds the side surface of the chip; the packaging glue is covered on the reflecting glue and the top surface of the chip; the reflection cup shell is arranged on the reflection glue and is arranged on the outer side of the packaging glue in a surrounding manner; the upper portion and the lower portion of the reflection cup shell are of a structure with the thick upper portion and the thin lower portion, transition is achieved between the upper portion and the lower portion through a step face, and the step face is located below the top face of the chip. According to the LED packaging structure provided by the invention, the possibility of capillary action between the reflecting glue and the inner wall of the reflecting cup shell is avoided, so that the volume of the packaging glue and the bonding surface between the inner walls of the packaging and gluing reflecting cup shell are effectively ensured, and the reliability of the structure is improved.

Description

Technical Field

[0001] The present invention relates to the technical field of LED packaging, and particularly relates to an LED packaging structure and a manufacturing method thereof. Background Art

[0002] Transmitting and receiving devices are widely used in biological health detection of smart watches, bracelets, etc. The higher the light intensity generated by the transmitting device, the higher the effective signal of biological health detection, the better the detection accuracy, and at the same time, the lower the power consumption of the product.

[0003] In order to improve the brightness of the transmitting device, a layer of white high-reflection substance (such as glue added with titanium dioxide) is usually coated on the surface of the substrate after die bonding and before encapsulation with glue. This can improve the light extraction efficiency of the chip and increase the reflection on the surface of the substrate, thereby achieving a brightness improvement. Moreover, the thicker the high-reflection substance, the better the reflection effect. However, when setting the thickness of the high-reflection substance in the reflective cup, due to capillary action, the white high-reflection substance will climb onto the side wall of the reflective cup shell, resulting in a reduction in the bonding area between the encapsulation glue and the cup shell when encapsulating the glue in the reflective cup later, thereby reducing the bonding reliability.

[0004] Therefore, the LED packaging products in the prior art have the problem of weak structural reliability by directly increasing the high-reflection substance in the reflective cup. Summary of the Invention

[0005] Aiming at the above problems, the purpose of the present invention is to provide an LED packaging structure and a manufacturing method thereof, which can solve the problem of weak structural reliability of the LED packaging products in the prior art by directly increasing the high-reflection substance in the reflective cup.

[0006] The above technical purpose of the present invention is achieved through the following technical solutions:

[0007] An LED packaging structure provided in an embodiment of the present invention includes:

[0008] A circuit board and a chip, the chip is disposed on the circuit board;

[0009] A reflective glue, the reflective glue covers the circuit board and surrounds the side of the chip;

[0010] An encapsulation glue, the encapsulation glue covers the reflective glue and the top surface of the chip; and

[0011] A reflective cup shell, the reflective cup shell is disposed on the reflective glue and surrounds the outside of the encapsulation glue; the reflective cup shell is divided into an upper part and a lower part, the upper part and the lower part have a structure with a thicker upper part and a thinner lower part, and the upper part and the lower part are transitioned through a stepped surface, and the stepped surface is located below the top surface of the chip.

[0012] In an achievable embodiment, in the outward direction from the side surface of the chip, the thickness of the reflective adhesive on the circuit board gradually thins.

[0013] In an achievable embodiment, a bonding groove is provided on the periphery of the reflective adhesive, and the reflective cup housing is bonded to the reflective adhesive through the bonding groove.

[0014] In an achievable embodiment, the inner side of the upper part expands outward in a horn shape.

[0015] In an achievable embodiment, the thinnest part of the upper part is greater than or equal to the thickest part of the lower part.

[0016] In an achievable embodiment, the upper surface of the reflective adhesive and the top surface of the chip are smoothly transitionally fitted.

[0017] In an achievable embodiment, a transition part is provided at the mating part of the reflective adhesive and the top surface of the chip, and the upper surface of the transition part is flush with the top surface of the chip.

[0018] The embodiment of the present invention also provides a method for manufacturing an LED packaging structure, including the following steps:

[0019] Mount and fix a plurality of chips on the circuit board according to a preset arrangement;

[0020] Inject the reflective adhesive so that the reflective adhesive covers the circuit board and surrounds the side surface of the chip;

[0021] Coat encapsulation glue on the chip and the reflective adhesive and perform a hardening treatment;

[0022] Perform a first cutting and a second cutting so that stepped grooves are formed on the reflective adhesive and the encapsulation glue;

[0023] Fill the stepped grooves with reflective cup material to form a reflective cup housing and perform a hardening treatment;

[0024] Perform a third cutting along the position where the stepped grooves are located to separate single LED packaging structure products.

[0025] In an achievable embodiment, the step of performing a first cutting and a second cutting so that stepped grooves are formed on the reflective adhesive and the encapsulation glue specifically includes:

[0026] Perform a first cutting to cut the encapsulation glue to form a first groove;

[0027] Perform a second cutting to form a second groove at the bottom of the first groove, wherein the bottom of the second groove is located above the reflective glue, the width of the first groove is greater than that of the second groove to form the stepped groove, and the bottom of the first groove is located below the top surface of the chip.

[0028] In an achievable embodiment, the widths of the slots respectively opened during the first cutting, the second cutting, and the third cutting decrease in sequence.

[0029] Due to the adoption of the above technical solution, the present invention has at least the following beneficial effects:

[0030] The LED packaging structure provided by the present invention, through the method of setting the reflective cup shell on the reflective glue, enables the reflective glue to be formed first and then the reflective cup shell is set, avoiding the possibility of capillary action between the reflective glue and the inner wall of the reflective cup shell, thereby effectively ensuring the volume of the packaging glue and the bonding surface between the packaging glue and the inner wall of the reflective cup shell, and improving the reliability of the structure; and by designing the stepped surface between the upper and lower parts of the reflective cup shell to be located below the top surface of the chip, the light of the chip can be fully reflected by the reflective cup shell, reducing light transmission and improving the quality of the LED product. Description of the Drawings

[0031] Figure 1 is a schematic diagram of the LED packaging structure provided by the embodiment of the present invention;

[0032] Figure 2 is provided by the embodiment of the present invention Figure 1 magnified structural schematic diagram of the partial A therein;

[0033] Figure 3 is a schematic diagram of the LED packaging structure of the finished board provided by the embodiment of the present invention;

[0034] Figure 4 is another schematic diagram of the LED packaging structure provided by the embodiment of the present invention;

[0035] Figure 5 is still another schematic diagram of the LED packaging structure provided by the embodiment of the present invention;

[0036] Figure 6 is a flowchart of the manufacturing method of the LED packaging structure provided by the embodiment of the present invention;

[0037] Figure 7 is a schematic diagram of the structure for fixing the chip to the circuit board provided by the embodiment of the present invention;

[0038] Figure 8 is a schematic diagram of the structure for coating the reflective glue provided by the embodiment of the present invention;

[0039] Figure 9 It is a schematic structural diagram of the coating encapsulation glue provided by the embodiment of the present invention;

[0040] Figure 10 It is a schematic structural diagram of cutting the first groove provided by the embodiment of the present invention;

[0041] Figure 11 It is a schematic structural diagram of cutting the second groove provided by the embodiment of the present invention;

[0042] Figure 12 It is a schematic structural diagram of filling the reflective cup housing provided by the embodiment of the present invention.

[0043] In the drawings, 1, circuit board; 2, chip; 3, reflective glue; 31, bonding groove; 32, transition part; 33; 4, encapsulation glue; 5, reflective cup housing; 51, upper part; 52, lower part; 53, stepped surface; 6, stepped groove; 61, first groove; 62, second groove. Detailed implementation manners

[0044] The technical solutions of the present invention will be clearly and completely described below with reference to the drawings. Obviously, the described embodiments are part of the embodiments of the present invention, rather than all of them. All other embodiments obtained by those skilled in the art based on the embodiments of the present invention without creative efforts belong to the scope of protection of the present invention.

[0045] In the description of the present invention, it should be noted that, as terms such as "center", "upper", "lower", "left", "right", "vertical", "horizontal", "inner", "outer", etc. indicate the orientation or positional relationship based on the orientation or positional relationship shown in the drawings, it is only for the convenience of describing the present invention and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and thus cannot be construed as a limitation of the present invention.

[0046] In the description of the present invention, it should be noted that, unless otherwise clearly specified and defined, terms such as "installation", "connection", "connection" should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or an integral connection; it can be a mechanical connection or an electrical connection; it can be a direct connection or an indirect connection through an intermediate medium, and it can be the communication inside two elements. For those skilled in the art, the specific meanings of the above terms in this utility model can be understood according to specific situations.

[0047] Example 1

[0048] See Figure 1 and Figure 2 , Figure 1It is a schematic diagram of the LED packaging structure provided by this embodiment. Figure 2 This is this embodiment Figure 1 The enlarged structural schematic diagram of the partial area A in this embodiment. A kind of LED packaging structure provided by this embodiment includes:

[0049] A circuit board 1 and a chip 2, and the chip 2 is arranged on the circuit board 1;

[0050] A reflective glue 3, and the reflective glue 3 covers the circuit board 1 and surrounds the side of the chip 2;

[0051] A packaging glue 4, and the packaging glue 4 covers the reflective glue 3 and the top surface of the chip 2; and

[0052] A reflective cup shell 5, and the reflective cup shell 5 is arranged on the reflective glue 3 and surrounds the outside of the packaging glue 4; the reflective cup shell 5 is divided into an upper part 51 and a lower part 52, the upper part 51 and the lower part 52 have a structure with a thicker upper part and a thinner lower part, and the upper part 51 and the lower part 52 are transitioned through a stepped surface 53, and the stepped surface 53 is located below the top surface of the chip 2.

[0053] It can be understood that the circuit board 1 in this embodiment is mainly used as the basis for circuit connection and support. It can be a substrate with a conductive layer, such as a ceramic board, a PCB board, a BT board, an EMC board, an SMC board or a Sapphire board, etc. There is no strict limitation here, and those skilled in the art can choose according to actual needs. Further, the chip 2 is mainly used as an LED chip 2 for emitting light, and it can be a diode chip 2, such as a light-emitting diode, a photodiode, etc. The way it is arranged on the circuit board 1 can preferably choose the flip-chip method, but other conventional choices are not excluded, and no further description will be given here. In addition, in this embodiment, it is taken that there is a single chip 2 in a single LED packaging structure as an example, but the situation where multiple chips 2 are arranged in a single LED packaging structure is not excluded, and no further description will be given here.

[0054] Further, in this embodiment, the reflective glue 3 can be selected as a conventional white colloid, such as a white gum containing titanium dioxide. In addition, for the material of the reflective cup shell 5, it can be the same as or different from the reflective glue 3, that is, the material of the reflective cup shell 5 can be selected as a white colloid, or a black or dark resin can be selected, such as specific epoxy resin, silicone, etc. More possibilities will not be listed and exemplified here, and those skilled in the art can choose according to the actual situation. The reflective glue 3 covers the circuit board 1 and surrounds the side of the chip 2, so that the light emitted by the chip 2 cannot penetrate from the side and can only be emitted from the top surface, reducing light transmission.

[0055] Furthermore, for the encapsulant 4, it can be an organic glue, an inorganic glue, or a mixture thereof in any proportion, such as silicone, epoxy resin, fluororubber, etc. The encapsulant 4 mainly serves as a protective layer, covering the chip 2 and the reflective glue 3 to ensure optical properties such as light transmittance while enhancing the strength of the structure.

[0056] It should be noted that the overall LED packaging structure can be square or circular, that is, the outer shapes of the reflective glue 3, the encapsulant 4, and the reflective cup housing 5 can be adjusted according to actual needs. For example, when manufacturing a single LED packaging structure product, it can be arbitrarily selected according to actual needs. If mass-producing LED packaging structure products, it is preferable to design the overall structure as square for easy panel molding or cutting. Specific limitations are not described here.

[0057] It can be understood that, as Figure 1 shown in the figure, a stepped transition is designed between the upper part 51 and the lower part 52 of the reflective cup housing 5 in this embodiment, and the stepped surface 53 for transition is set lower than the top surface of the chip 2. Considering that the reflective glue 3 surrounds the side of the chip 2 and blocks side light transmission, through the design of the stepped transition, the light from the upper part 51 of the chip 2 can be reflected and directed out by the reflective cup housing 5, reducing light transmittance.

[0058] In addition, as Figure 3 shown in the figure, it is a schematic diagram of the formed-board LED packaging structure provided in this embodiment. In the case of mass-producing LED packaging structure products, grooves for filling the reflective cup housing 5 need to be opened between adjacent LED packaging structures along the reflective glue 3 and the encapsulant 4. Due to the miniaturization of LED products, if a thick tool is used for cutting, the width of the opened groove is larger and the contact surface is also larger. The circuit board 1 is harder than the reflective glue 3 and the encapsulant 4, especially at the connection junction of the reflective glue 3, the encapsulant 4, and the circuit board 1. During the advancement of the tool, it is easy to cause vibration of the circuit board 1 or form a tearing force between the circuit board 1 and the reflective glue 3 and the encapsulant 4, resulting in a decrease in the structural stability and the product qualification rate. In this embodiment, by arranging the reflective glue 3 on the side of the chip 2, the requirement for protecting the light transmittance of the lower part 52 of the reflective cup housing 5 (i.e., the part close to the circuit board 1) can be reduced, and the lower part 52 of the reflective cup housing 5 can be designed to be thinner (compared to the upper part 51). Thus, a thinner tool can be used for cutting the filling position of the reflective cup housing 5, which is equivalent to reducing the cutting surface between the tool and the reflective glue 3 and the encapsulant 4. Especially when dividing into single LED packaging structure products, it is necessary to cut through the reflective cup housing, the reflective glue, and the circuit board. At this time, the influence can be further reduced, which helps to ensure the product qualification rate.

[0059] Further, in the embodiment of the present invention, the reflective cup shell 5 is disposed on the reflective glue 3, rather than coating the reflective glue 3 after the reflective cup shell 5 is set, so as to avoid the capillary phenomenon when the reflective glue 3 is coated, reduce the bonding surface between the reflective cup shell 5 and the encapsulating glue 4, and ensure the reliability of the structure.

[0060] In this embodiment, as Figure 1 shown, in the outward direction from the side surface of the chip 2, the thickness of the reflective glue 3 on the circuit board 1 gradually becomes thinner.

[0061] It can be understood that the reflective glue 3 is disposed on the circuit board 1 and surrounds the side surface of the chip 2, so that the reflective glue 3 can ensure the reflection effect and avoid the light transmission of the side light of the chip 2. At the same time, in order to make the bonding area between the subsequent encapsulating glue 4 and the reflective cup shell 5 sufficient as much as possible and ensure the structural reliability, the thickness of the reflective glue 3 is gradually thinned, and enough space and contact surface are left at the position close to the reflective cup shell 5 for the encapsulating glue 4 and the reflective cup shell 5 to combine.

[0062] Further, there are various ways to thin the thickness of the reflective glue 3. For example, the upper surface of the cross-section of the reflective glue 3 is in an inclined straight line, arc or stepped down, etc. Specifically, those skilled in the art can adjust the setting according to actual needs.

[0063] In this embodiment, as Figure 2 shown, a bonding groove 31 is provided on the periphery of the reflective glue 3, and the reflective cup shell 5 is combined with the reflective glue 3 through the bonding groove 31, and the bonding groove 31 can enhance the bonding reliability between the reflective cup shell 5 and the encapsulating glue 4.

[0064] In this embodiment, as Figure 4 shown, it is another schematic diagram of the LED packaging structure provided by this embodiment. The inner side of the upper part 51 expands outward in a trumpet shape, so as to achieve the projection control of light, make the opening of the trumpet shape gradually expand, balance the distribution of light during the reflection process, reduce the overexposure phenomenon in the central area, and avoid the sudden drop of the edge brightness at the same time, so as to provide a softer and more uniform light spot effect.

[0065] In this embodiment, as Figure 4 shown, the thinnest part of the upper part 51 is greater than or equal to the thickest part of the lower part 52, which can make the strength distribution of the overall structure reasonable and further ensure the overall structural strength of the reflective cup shell 5.

[0066] In this embodiment, as Figure 5 shown, it is another schematic diagram of the LED packaging structure provided in this embodiment. The upper surface of the reflective glue 3 is smoothly transitionally matched with the top surface of the chip 2.

[0067] It can be understood that the reflective adhesive 3 is arranged on the side of the chip 2 mainly to prevent the side of the chip 2 from transmitting light. In order to ensure the bonding strength between the encapsulating adhesive 4 and the reflective cup shell 5, while preventing the side of the chip 2 from transmitting light and enhancing the light reflection of the circuit board 1, the reflective adhesive 3 is as thin as possible. Therefore, the junction between the reflective adhesive 3 and the top surface of the chip 2 is easily overlooked, and the transition is relatively thin, which easily causes the side area near the top surface of the chip 2 not to be effectively protected against light transmission. In this embodiment, through the smooth transition design between the upper surface of the reflective adhesive 3 and the top surface of the chip 2, the side area near the top surface of the chip 2 can be effectively blocked, reducing side light transmission.

[0068] In this embodiment, as Figure 5 shown, a transition portion 32 is provided at the mating portion of the reflective adhesive 3 and the top surface of the chip 2, and the upper surface of the transition portion 32 is flush with the top surface of the chip 2. It can be understood that the transition portion 32 can be a planar transition or an arc-shaped transition, mainly ensuring sufficient contact between the reflective adhesive 3 and the side surface near the top surface of the chip 2 and effective blocking. Details are not further elaborated here, and those skilled in the art can make simple deformation designs according to actual needs.

[0069] Due to the adoption of the above technical solutions, the present invention has the following beneficial effects:

[0070] The LED packaging structure provided by the present invention makes the reflective adhesive form first and then sets the reflective cup shell 5 by encapsulating and setting the reflective cup shell 5 on the reflective adhesive 3, avoiding the possibility of capillary action between the reflective adhesive 3 and the inner wall of the reflective cup shell 5, thereby effectively ensuring the volume of the encapsulating adhesive 4 and the bonding surface between the encapsulating adhesive 4 and the inner wall of the reflective cup shell 5, improving the reliability of the structure; and by designing the stepped surface 53 between the upper part 51 and the lower part 52 of the reflective cup shell 5 to be below the top surface of the chip 2, the light of the chip 2 can be fully reflected by the reflective cup shell 5, reducing light transmission and improving the quality of the LED product.

[0071] Embodiment 2

[0072] See Figure 6 , which is a flowchart of a method for manufacturing an LED packaging structure provided in this embodiment. A method for manufacturing an LED packaging structure provided by the present invention includes the following steps:

[0073] Step S1, installing and fixing a plurality of chips on the circuit board according to a preset arrangement manner.

[0074] It can be understood that before step S1, according to actual needs, the type of the circuit board 1 can be selected, and a substrate with a conductive layer (such as a ceramic board, a PCB board, etc.) can be selected as the basis for circuit connection and support.

[0075] In addition, asFigure 7 As shown, it is a schematic structural diagram of fixing a chip to a circuit board provided in this embodiment. In this embodiment, the preset arrangement mode of the chip 2 mainly refers to the situation of mass-producing LED packaging structure products in a board. The chips 2 corresponding to the number of LED packaging structure products included in each board product are arranged in advance, which can be arranged in rows and columns for subsequent segmentation. More details will not be further described here.

[0076] Furthermore, the chip 2 can be installed on the circuit board 1 by conventional methods such as flip-chip and face-up mounting. In this embodiment, the flip-chip method is preferably used for installation and fixation.

[0077] Step S2: Inject reflective glue so that the reflective glue covers the circuit board and surrounds the side of the chip.

[0078] It can be understood that, as Figure 8 shown, it is a schematic structural diagram of coating reflective glue provided in this embodiment. Since there are several chips 2 in a board, gaps are formed between adjacent chips 2. Reflective glue 3 (which can be a white colloid, such as a white resin containing titanium dioxide) is injected into the gaps between adjacent chips 2 to form a covering structure. This step not only protects the conductive layer of the circuit board 1 from oxidation, but also improves the light extraction efficiency through reflection. This layer of reflective glue 3 can reflect the light emitted by the chip 2 to the light extraction surface, significantly improving the brightness and light efficiency of the LED packaging structure product.

[0079] Step S3: Coat encapsulation glue on the chip and the reflective glue and perform hardening treatment.

[0080] It can be understood that, as Figure 9 shown, it is a schematic structural diagram of coating encapsulation glue provided in this embodiment. The encapsulation glue 4 coated on the surface of the chip 2 and the reflective glue 3 can be a transparent colloid (such as silica gel or epoxy resin), which is mainly used to form a protective layer. The encapsulation glue 4 covers the entire structure to ensure that the optical performance (such as light transmittance) is guaranteed and the structural strength is improved. Those skilled in the art preferably ensure that the resin covers evenly during coating to avoid the generation of bubbles. Specific implementations can be adjusted and improved according to actual needs and will not be further described here.

[0081] Furthermore, the hardening treatment can be carried out by heating or ultraviolet irradiation to completely harden the transparent resin and form a stable encapsulation structure.

[0082] Step S4: Perform the first cutting and the second cutting to form stepped grooves on the reflective glue and the encapsulation glue.

[0083] Specifically, as Figures 10 to 11As shown, they are respectively the schematic structural diagrams of cutting the first groove and the second groove provided in this embodiment. In this embodiment, the steps of performing the first cutting and the second cutting to form a stepped groove in the reflective adhesive and the encapsulating adhesive specifically include:

[0084] Perform the first cutting to cut the encapsulating adhesive 4 to form the first groove 61;

[0085] Perform the second cutting to cut and form the second groove 62 at the bottom of the first groove 61, where the bottom of the second groove 62 is located above the reflective adhesive 3, the width of the first groove 61 is greater than that of the second groove 62 to form the stepped groove 6, and the bottom of the first groove 61 is located below the top surface of the chip 2.

[0086] It should be noted that, in this embodiment, the bottom of the first groove 61 is between the top surface of the chip 2 and the upper surface of the reflective adhesive 3. The main consideration is to use a thicker tool during the first cutting to avoid cutting the substrate, causing vibration or tearing, and loosening the joint between the reflective adhesive 3 and the circuit substrate 1, thereby ensuring the reliability and qualification rate of the product structure. In addition, it can be understood that, in combination with the LED packaging structure in Embodiment 1, after the second cutting, the bottom of the corresponding first groove 61, a part of the first groove 61 corresponds to the upper part 51 of the reflective cup housing 5 after the subsequent filling of the reflective cup housing 5, and the second groove 62 corresponds to form the lower part 52 of the reflective cup housing 5 after filling the reflective cup housing 5, and the bottom of the first groove 61 corresponds to the stepped surface 53 of the reflective cup housing 5.

[0087] Furthermore, in addition to using a tool for cutting in this embodiment, the formation of the first groove 61 and the second groove 62 can also be achieved by means of laser etching. The first groove 61 and the second groove 62 can be annular or linear, and can be specifically designed according to the actual layout, which will not be further elaborated here.

[0088] Step S5, fill the stepped groove with a reflective cup material to form a reflective cup housing and perform a hardening treatment.

[0089] As Figure 12 shown, it is the schematic structural diagram of filling the reflective cup housing provided in this embodiment. Inject a reflective cup material (such as reflective white glue) into the first groove 61 and the second groove 62 to form the reflective cup housing 5 structure. The reflective cup housing 5 mainly functions to block external stray light interference, improve the signal-to-noise ratio of the device, prevent internal light leakage, and optimize the optical performance.

[0090] In addition, when forming the reflector cup housing 5, residual bubbles in the reflector cup housing 5 can be removed through vacuum degassing or centrifugal processes to ensure filling density. The excess resin that overflows is mechanically or chemically removed to keep the encapsulation structure flat. The hardening treatment mainly makes the reflector cup housing 5 closely combine with the reflective adhesive 3 and the encapsulation adhesive 4 to form a stable structure.

[0091] Step S6: Perform a third cut along the position where the stepped groove is located to separate single LED encapsulation structure products.

[0092] As Figure 12 shown, a third cut can be made along the central position of the stepped groove 6 ( Figure 11 the dashed line in the figure) so that the reflector cup housings 5 of adjacent two LED encapsulation structure products are relatively uniform. The specific cutting operation is not further described herein.

[0093] In an implementable embodiment, the widths of the grooves opened by the first cut, the second cut, and the third cut decrease in sequence.

[0094] As described in the previous embodiment, in the case of mass-producing LED encapsulation structure products, grooves for filling the reflector cup housing 5 need to be opened along the reflective adhesive 3 and the encapsulation adhesive 4 between adjacent LED encapsulations. Due to the miniaturization of LED products, if a thick tool is used for cutting, the circuit board 1 is harder than the reflective adhesive 3 and the encapsulation adhesive 4. Especially at the connection junction of the reflective adhesive 3, the encapsulation adhesive 4, and the circuit board 1, the vibration of the circuit board 1 is easily caused during the forward movement of the tool, or a tearing force is formed between the circuit board 1 and the reflective adhesive 3 and the encapsulation adhesive 4, resulting in the reduction of structural stability and the product qualification rate. Therefore, in this embodiment, by arranging the reflective adhesive 3 on the side of the chip 2, the protection requirement for the light transmittance of the lower part 52 of the reflector cup housing 5 (i.e., the part close to the substrate) is reduced. The lower part 52 of the reflector cup housing 5 can be designed to be thinner (compared with the upper part 51), so that a thinner tool can be used for cutting the filling position of the reflector cup housing 5, and the width of the groove opening is smaller, which is equivalent to the reduction of the cutting surface of the tool and the reflective adhesive 3 and the encapsulation adhesive 4, reducing the influence and helping to ensure the product qualification rate.

[0095] Furthermore, for the first cut, the second cut, and the third cut, in this embodiment, the tool cutting is taken as an example for illustration, but other cutting methods are not excluded, such as laser cutting. As long as the widths of the grooves opened by the first cut, the second cut, and the third cut decrease in sequence to avoid the vibration of the circuit board 1 or the tearing and loosening during cutting, it will not be further described herein.

[0096] In addition to the above steps, this embodiment further includes cleaning, electrical testing, and optical performance testing of the cut LED packaging structure products, rejecting defective products, and ensuring that the finished products meet the design requirements.

[0097] The manufacturing method of the LED packaging structure provided in this embodiment can realize the production and manufacturing of the LED packaging structure products introduced in the foregoing embodiments. At the same time, according to the design of the LED packaging product structure in this embodiment, by first setting the reflective glue and then combining with setting the reflective cup shell, the problem that the capillary action of the reflective glue reduces the bonding surface between the reflective cup shell and the encapsulation glue, resulting in poor structural reliability, can be avoided. And after the reflective cup shell is designed into a structure with a thicker upper part and a thinner lower part through the first cutting, the second cutting, and the third cutting, the LED packaging products designed in a panel can avoid the problem of defective products caused by relatively wider slotting during segmentation, improving the yield and quality of the products.

[0098] For the content not mentioned in the above embodiments, it can be understood and implemented with reference to the description in Embodiment 1, and will not be repeated here.

[0099] Although the present invention has been described in detail with general descriptions and specific embodiments above, based on the present invention, some modifications or improvements can be made, which are obvious to those skilled in the art. Therefore, these modifications or improvements made without departing from the spirit of the present invention all fall within the scope of protection required by the present invention.

Claims

1. An LED packaging structure, characterized in that, Comprising: A circuit board and a chip, the chip being disposed on the circuit board; A reflective adhesive, the reflective adhesive covering the circuit board and surrounding the side of the chip; A packaging adhesive, the packaging adhesive covering the reflective adhesive and the top surface of the chip; And A reflective cup housing, the reflective cup housing being disposed on the reflective adhesive and surrounding the outside of the packaging adhesive; the reflective cup housing is divided into an upper part and a lower part, the upper part and the lower part having a structure with a thicker upper part and a thinner lower part, and the upper part and the lower part are transitioned through a stepped surface, the stepped surface being located below the top surface of the chip.

2. The LED packaging structure according to claim 1, wherein In the outward direction from the side of the chip, the thickness of the reflective adhesive on the circuit board gradually becomes thinner.

3. The LED packaging structure according to claim 1, wherein, A bonding groove is provided on the periphery of the reflective adhesive, and the reflective cup housing is bonded to the reflective adhesive through the bonding groove.

4. The LED packaging structure according to claim 1, wherein The inner side of the upper part expands outward in a horn shape.

5. The LED packaging structure according to claim 4, wherein The thinnest part of the upper part is greater than or equal to the thickest part of the lower part.

6. The LED packaging structure according to claim 1, wherein The upper surface of the reflective adhesive and the top surface of the chip are smoothly transitionally fitted.

7. The LED packaging structure according to claim 6, wherein, A transition portion is provided at the mating portion of the reflective adhesive and the top surface of the chip, and the upper surface of the transition portion is flush with the top surface of the chip.

8. A method for manufacturing an LED packaging structure, characterized in that, Including the following steps: Mounting and fixing a plurality of chips on the circuit board according to a preset arrangement; Injecting a reflective adhesive so that the reflective adhesive covers the circuit board and surrounds the side of the chip; Coating a packaging adhesive on the chip and the reflective adhesive and performing a hardening treatment; Performing a first cutting and a second cutting so that stepped grooves are formed on the reflective adhesive and the packaging adhesive; Filling the stepped grooves with a reflective cup material to form a reflective cup housing and performing a hardening treatment; Performing a third cutting along the position where the stepped grooves are located to separate a single LED packaging structure product.

9. The method for manufacturing an LED packaging structure according to claim 8, wherein The step of performing the first cutting and the second cutting so that stepped grooves are formed on the reflective adhesive and the packaging adhesive specifically includes: Performing a first cutting to cut the packaging adhesive to form a first groove; Performing a second cutting to cut a second groove at the bottom of the first groove, wherein the bottom of the second groove is located above the reflective adhesive, the width of the first groove is greater than that of the second groove to form the stepped groove, and the bottom of the first groove is located below the top surface of the chip.

10. The method for manufacturing an LED packaging structure according to claim 8, wherein, The widths of the slots opened by the first cutting, the second cutting, and the third cutting are gradually decreased in sequence.

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