Power supply unit for aerosol-generating device and aerosol-generating device

Abstract

An inhalation device (100) comprises: a power supply unit (111C) for supplying power to a heating unit (121C); a boost DC / DC converter (82) and / or a heating switch (85); a charging IC (81); and a main board (50) on which the charging IC (81), the power supply connection portion (51), and the boost DC / DC converter (82) and / or the heating switch (85) are mounted. At least one of the boost DC / DC converter (82) and / or the heating switch (85) is provided closer to the power supply connection portion (51) than the charging IC (81). A power supply voltage measurement pin (Ps) of the charging IC (81) is connected by a voltage measurement wiring (521) to a position closer to the power supply connection portion (51) than the power supply connection pin (Ps) in a power supply wiring (520) joining the power supply connection portion (51) and the power supply connection pin (Pb).

Description

Technical Field

[0001] The present disclosure relates to a power supply unit for an aerosol generating device and to an aerosol generating device. Background Art

[0002] An aerosol generating device typically heats an aerosol source by the following operations: adjusting the power supplied from a power source to a predetermined power for heating by means of a power conversion device, and then supplying the adjusted power to a heater. In addition, the aerosol generating device is configured to be able to be repeatedly recharged when the SOC of the power source decreases.

[0003] For example, PTL 1 describes an aerosol generating device in which the power of a power source is boosted by a DC / DC converter and supplied to a heater to heat an aerosol-forming article, and the DC / DC converter includes a feedback pin for adjusting an output voltage.

[0004] Citation List

[0005] Patent Document

[0006] [PTL 1] JP 2020-518236 A Summary of the Invention

[0007] Technical Problem

[0008] In such an aerosol generating device, both a heating element for providing heating to the aerosol source and a charging IC for controlling charging are preferably provided close to the power source. In the heating element, the power conversion device and the heating switch carry a particularly large current for heating, and thus the resulting power loss is preferably eliminated. At the same time, when measuring the power source voltage for controlling charging, the charging IC also preferably measures at a location close to the power source. That is, when the measurement point is far from the power source, the wiring resistance increases proportionally and the accuracy of charging control decreases.

[0009] The present disclosure provides a power supply unit for an aerosol generating device that can maintain the accuracy of charging control while improving heating efficiency, and also provides an aerosol generating device.

[0010] Solution to the Problem

[0011] The present disclosure relates to:

[0012] A power supply unit for an aerosol generating device, the power supply unit including: a power source for supplying power to a heating unit for heating an aerosol source;

[0013] A power conversion device for converting power from the power source and supplying heating power to the heating unit, and / or a heating switch for controlling the power supply to the heating unit;

[0014] A charging IC for receiving power from an external power source and performing control to supply charging power to the power source; and

[0015] A board for mounting the charging IC, a power connection portion for supplying power from the power source, and the power conversion device and / or the heating switch, wherein,

[0016] The charging IC includes:

[0017] A power supply voltage measurement pin for measuring the voltage of the power source; and

[0018] A power supply connection pin to which the voltage of the power source is input,

[0019] At least one of the power conversion device and / or the heating switch is arranged closer to the power connection portion than the charging IC, and

[0020] The power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring to a position in the power wiring that joins the power connection portion and the power supply connection pin and is closer to the power connection portion than the power supply connection pin.

[0021] This disclosure also relates to:

[0022] A power supply unit for an aerosol generating device, the power supply unit including: a power source for supplying power to a heating unit for heating an aerosol source;

[0023] A power conversion device for converting power from the power source and supplying heating power to the heating unit, and / or a heating switch for controlling the power supply to the heating unit;

[0024] A charging IC for receiving power from an external power source and performing control to supply charging power to the power source; and

[0025] A board for mounting the charging IC, a power connection portion for supplying power from the power source, and the power conversion device and / or the heating switch, where

[0026] The charging IC includes:

[0027] A power supply voltage measurement pin for measuring the voltage of the power source; and

[0028] A power connection pin to which the voltage of the power supply is input.

[0029] The wiring distance between at least one of the power conversion device and / or the heating switch and the power connection portion is shorter than the wiring distance between the charging IC and the power connection portion, and

[0030] The power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring to a position closer to the power connection portion than the power connection pin in the power wiring that joins the power connection portion and the power connection pin.

[0031] This disclosure also relates to:

[0032] An aerosol generating device, the aerosol generating device comprising: a heating unit for heating an aerosol source;

[0033] A power supply for supplying power to the heating unit;

[0034] A power conversion device for converting the power from the power supply and supplying heating power to the heating unit, and / or a heating switch for controlling the power supply to the heating unit;

[0035] A charging IC for receiving power from an external power supply and performing control to supply charging power to the power supply; and

[0036] A board for mounting the charging IC, a power connection portion for supplying power from the power supply, and the power conversion device and / or the heating switch, wherein,

[0037] The charging IC includes:

[0038] A power supply voltage measurement pin for measuring the voltage of the power supply; and

[0039] A power connection pin to which the voltage of the power supply is input.

[0040] At least one of the power conversion device and the heating switch is arranged closer to the power connection portion than the charging IC, and

[0041] The power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring to a position closer to the power connection portion than the power connection pin in the power wiring that joins the power connection portion and the power connection pin.

[0042] Advantageous effects of the present invention

[0043] This disclosure enables maintaining the accuracy of charging control while improving the heating efficiency. Description of the Drawings

[0044] Figure 1 is a schematic diagram schematically showing a first configuration example of an inhalation device (inhalation device 100A).

[0045] Figure 2 is a schematic diagram schematically showing a second configuration example of an inhalation device (inhalation device 100B).

[0046] Figure 3 is an overall perspective view of an inhalation device 100 which constitutes an embodiment of an inhalation device according to the present disclosure.

[0047] Figure 4 is a perspective view of the internal unit 10 as seen from the right front side.

[0048] Figure 5 is a perspective view of the internal unit 10 as seen from the left front side.

[0049] Figure 6 is an exploded perspective view of the internal unit 10.

[0050] Figure 7 is a cross-sectional perspective view of the heater assembly 30.

[0051] Figure 8 is a block diagram showing the electrical connection of the main elements of the internal unit 10 in a simple manner.

[0052] Figure 9 Shows the components mounted on the front surface 501 of the main board 50.

[0053] Figure 10 Shows the components mounted on the rear surface 502 of the main board 50.

[0054] Figure 11 Shows Figure 10 the power flow during heating in.

[0055] Figure 12 Shows Figure 10 the power flow during charging in.

[0056] Figure 13 Shows the main conductive tracks of the first conductive layer L1 to the tenth conductive layer L10 provided on the main board 50. Detailed Description of the Invention

[0057] Hereinafter, an inhalation device, a control method, and a program according to embodiments of the present disclosure will be described with reference to the drawings. First, two configuration examples (a first configuration example and a second configuration example) to which the configuration of the inhalation device according to the present disclosure can be applied will be described. It should be noted that hereinafter, the same or similar reference numerals may be assigned to the same or similar elements, and the description of the same or similar elements may be appropriately omitted or simplified.

[0058] <<1. Configuration example of the inhalation device>>

[0059] An inhalation device is a device for generating a substance to be inhaled by a user. Hereinafter, the substance generated by the inhalation device will be described as an aerosol. Alternatively, the substance generated by the inhalation device may be a gas.

[0060] (1) First configuration example

[0061] Figure 1 is a schematic diagram schematically showing a first configuration example of the inhalation device. As Figure 1 shown, the inhalation device 100A according to this configuration example includes a power supply unit 110, a cartridge 120, and a flavor cartridge 130. The power supply unit 110 includes a power unit 111A, a sensor unit 112A, a notification unit 113A, a memory unit 114A, a communication unit 115A, and a control unit 116A. The cartridge 120 includes a heating unit 121A, a liquid guiding portion 122, and a liquid storage portion 123. The flavor cartridge 130 includes a flavor source 131 and a mouthpiece 124. An air flow path 180 is formed in the cartridge 120 and the flavor cartridge 130.

[0062] The power unit 111A stores electric power. The power unit 111A then supplies electric power to each component of the inhalation device 100A according to the control executed by the control unit 116A. The power unit 111A may be configured, for example, by a rechargeable battery (such as a lithium-ion secondary battery).

[0063] The sensor unit 112A acquires various types of information related to the inhalation device 100A. As an example, the sensor unit 112A is configured by a pressure sensor (such as a condenser microphone, a flow rate sensor, or a temperature sensor, etc.), and acquires a value associated with the user's inhalation. As another example, the sensor unit 112A is configured by an input device (such as a button or a switch) for receiving information input from the user.

[0064] The notification unit 113A notifies the user of information. The information notified to the user by the notification unit 113A includes, for example, the state of charge (SOC) indicating the state of charge of the power supply unit 111A, the preheating time during inhalation, and the inhalation possible period, etc. For example, the notification unit 113A may be configured by a light-emitting device that emits light, a display device that displays an image, a sound output device that outputs sound, or a vibrating device that can vibrate, etc.

[0065] The memory unit 114A stores various types of information for operating the inhalation device 100A. The memory unit 114A may be configured by, for example, a non-volatile storage medium (such as a flash memory).

[0066] The communication unit 115A is a communication interface capable of performing communication according to any wired or wireless communication standard. Examples of communication standards that can be used include standards employing Wi-Fi (registered trademark), Bluetooth (registered trademark), Bluetooth Low Energy (BLE) (registered trademark), Near Field Communication (NFC), or Low Power Wide Area (LPWA), and so on.

[0067] The control unit 116A serves as an arithmetic processing device and a control device, and controls the overall operation within the inhalation device 100A according to various programs. For example, the control unit 116A is implemented by a central processing unit (CPU) or an electronic circuit such as a microprocessor, etc.

[0068] The liquid storage part 123 stores the aerosol source. The aerosol source is atomized to generate an aerosol. For example, the aerosol source is a polyol (such as glycerol or propylene glycol) or a liquid (such as water). The aerosol source may include tobacco-derived or non-tobacco-derived flavor components. If the inhalation device 100A is a medical inhaler (such as a nebulizer), the aerosol source may include a drug.

[0069] The liquid guiding part 122 guides the aerosol source from the liquid storage part 123 and holds the aerosol source, which is the liquid stored in the liquid storage part 123. The liquid guiding part 122 is, for example, a wick formed by twisting a fibrous material (such as fiberglass) or a porous material (such as porous ceramics). In such a case, the aerosol source stored in the liquid storage part 123 is guided by the capillary action of the wick.

[0070] The heating unit 121A heats the aerosol source to atomize the aerosol source, thereby generating an aerosol. In Figure 1In the example shown, the heating unit 121A is configured as a coil wound around the liquid guiding portion 122. When the heating unit 121A generates heat, the aerosol source held in the liquid guiding portion 122 is then heated and atomized, thereby generating an aerosol. The heating unit 121A generates heat when supplied with power from the power supply unit 111A. As an example, power may be supplied to the heating unit 121A when the sensor unit 112A has detected that the user has started inhaling and / or has input a predetermined information. Then, when the sensor unit 112A has detected that the user has completed inhaling and / or has input a predetermined information, the supply of power to the heating unit 121A may be stopped. Note that the inhalation action of the user on the inhalation device 100A can be detected, for example, based on a pressure (internal pressure) exceeding a predetermined threshold in the inhalation device 100A detected by an inhalation sensor.

[0071] The flavor source 131 is a component for imparting flavor components to the aerosol. The flavor source 131 may include tobacco-derived or non-tobacco-derived flavor components.

[0072] The air flow path 180 is a flow path for air to be inhaled by the user. The air flow path 180 has a tubular structure having an air inlet hole 181 and an air outlet hole 182. The air inlet hole is an entrance for air to enter the air flow path 180, and the air outlet hole is an exit for air to leave the air flow path 180, thus forming both ends. Along the air flow path 180, the liquid guiding portion 122 is provided upstream (closer to the air inlet hole 181), and the flavor source 131 is provided downstream (closer to the air outlet hole 182). The air flowing in through the air inlet hole 181 during the user's inhalation is mixed with the aerosol generated by the heating unit 121A and is conveyed through the flavor source 131 to the air outlet hole 182, as shown by the arrow 190. When the mixed fluid of the aerosol and air passes through the flavor source 131, the flavor components contained in the flavor source 131 are added to the aerosol.

[0073] The mouthpiece 124 is a member held in the user's mouth during inhalation. The air outlet hole 182 is provided in the mouthpiece 124. The user holds the mouthpiece 124 in their mouth so that the mixed fluid of the aerosol and air can be sucked into the oral cavity.

[0074] The configuration example of the inhalation device 100A has been described above. Of course, the inhalation device 100A is not limited to the configuration described above, and various configurations can be adopted, such as those shown as examples below.

[0075] As an example, the inhalation device 100A does not need to include a flavored cartridge 130. In such a case, the cartridge 120 is provided with a mouthpiece 124.

[0076] As another example, the inhalation device 100A may include various types of aerosol sources. Various types of aerosols generated from various types of aerosol sources may be mixed within the air flow path 180 to cause a chemical reaction, thereby generating many other types of aerosols.

[0077] Furthermore, the means for atomizing the aerosol source is not limited to the heating provided by the heating unit 121A. For example, the means for atomizing the aerosol source may be vibration atomization or induction heating.

[0078] (2) Second configuration example

[0079] Figure 2 is a schematic diagram schematically showing a second configuration example of the inhalation device. As Figure 2 shown, the inhalation device 100B according to this configuration example includes a power supply unit 111B, a sensor unit 112B, a notification unit 113B, a memory unit 114B, a communication unit 115B, a control unit 116B, a heating unit 121B, a housing portion 140, and a heat insulation portion 144. The power supply unit 110 that houses the power supply unit 111A, and the heating unit 121A are separate elements in the inhalation device 100A of the first configuration example, but the power supply unit 111B and the heating unit 121B form a single unit in the inhalation device 100B of the second configuration example. That is to say, the inhalation device 100B of the second configuration example may also be said to have a power supply unit with a built-in heating unit.

[0080] The power supply unit 111B, the sensor unit 112B, the notification unit 113B, the memory unit 114B, the communication unit 115B, and the control unit 116B are each substantially the same as the corresponding components included in the inhalation device 100A of the first configuration example.

[0081] The housing portion 140 has an internal space 141 and holds the rod-shaped substrate 150 while housing a part of the rod-shaped substrate 150 in the internal space 141. The housing portion 140 has an opening 142, thereby allowing the internal space 141 to communicate with the outside, and the housing portion houses the rod-shaped substrate 150 that has been inserted into the internal space 141 from the opening 142. For example, the housing portion 140 is a cylindrical body that includes the opening 142 and a bottom portion 143 serving as a bottom surface, and defines a columnar internal space 141. An air flow path for supplying air to the internal space 141 is connected to the housing portion 140. For example, an air inlet hole is provided in the side surface of the inhalation device 100, and the air inlet hole is an entrance for air to enter the air flow path. For example, an air outlet hole is provided in the bottom portion 143, and the air outlet hole serves as an outlet for air from the air flow path to the internal space 141.

[0082] The rod-shaped substrate 150 includes a substrate portion 151 and a mouthpiece portion 152. The substrate portion 151 contains an aerosol source. The aerosol source includes tobacco-derived or non-tobacco-derived flavor components. If the inhalation device 100B is a medical inhaler (such as a nebulizer), the aerosol source may include a drug. The aerosol source may be, for example, a liquid (such as water and polyols (such as glycerol and propylene glycol)) including tobacco-derived or non-tobacco-derived flavor components, or alternatively may be a solid including tobacco-derived or non-tobacco-derived flavor components. With the rod-shaped substrate 150 held in the accommodation portion 140, at least a part of the substrate portion 151 is accommodated in the internal space 141, and at least a part of the mouthpiece portion 152 protrudes from the opening 142. Then, when the user holds the mouthpiece portion 152 protruding from the opening 142 in their mouth and inhales, air flows into the internal space 141 via an air flow path not shown in the drawings and reaches the user's mouth together with the aerosol generated from the substrate portion 151.

[0083] In Figure 2 the example shown, the heating unit 121B has a film-like form and is arranged to cover the outer circumference of the accommodation portion 140. Then, when the heating unit 121B generates heat, the substrate portion 151 of the rod-shaped substrate 150 is heated from the outer circumference, thereby generating an aerosol.

[0084] The heat insulation portion 144 prevents heat from being transferred from the heating unit 121B to other components. For example, the heat insulation portion 144 is configured of a vacuum heat insulation material or an aerogel heat insulation material or the like.

[0085] The configuration example of the inhalation device 100B has been described above. Of course, the inhalation device 100B is not limited to the configuration described above and may adopt various configurations, such as those shown as examples below.

[0086] As an example, the heating unit 121B may have a blade-like form and may be arranged to protrude from the bottom portion 143 of the accommodation portion 140 into the internal space 141. In this case, the blade-like heating unit 121B is inserted into the substrate portion 151 of the rod-shaped substrate 150 and heats the substrate portion from the inside of the substrate portion 151 of the rod-shaped substrate 150. As another example, the heating unit 121B may be arranged to cover the bottom portion 143 of the accommodation portion 140. In addition, the heating unit 121B may be configured by a combination of two or more of a first heating unit covering the outer circumference of the accommodation portion 140, a blade-like second heating unit, and a third heating unit covering the bottom portion 143 of the accommodation portion 140.

[0087] As another example, the accommodating part 140 may include an opening / closing mechanism (such as a hinge) for opening / closing a part of an outer shell that forms the inner space 141. By opening / closing the outer shell, the accommodating part 140 can then receive and hold the rod-shaped substrate 150 that has been inserted into the inner space 141. In this case, the heating unit 121B may be provided on the holding part of the accommodating part 140 and may heat the rod-shaped substrate while pressing it.

[0088] Furthermore, the means for atomizing the aerosol source is not limited to the heating provided by the heating unit 121B. For example, the means for atomizing the aerosol source may be induction heating. In this case, the inhalation device 100B includes at least an electromagnetic induction source (such as a coil) for generating a magnetic field instead of the heating unit 121B. A receptor that generates heat by induction heating may be provided in the inhalation device 100B or may be included in the rod-shaped substrate 150.

[0089] The inhalation device 100B may further include the heating unit 121A, the liquid guiding part 122, the liquid storage part 123, and the air flow path 180 according to the first configuration example, and the air flow path 180 may supply air to the inner space 141. In this case, the mixed fluid of the aerosol and air generated by the heating unit 121A flows into the inner space 141 and further mixes with the aerosol generated by the heating unit 121B and reaches the user's mouth.

[0090] <<2. Configuration Examples of the Inhalation Device According to the Present Disclosure>>

[0091] Next, an embodiment of an inhalation device (hereinafter referred to as the inhalation device 100) in which the configuration of the inhalation device applying the present disclosure is described with respect to the inhalation device 100B of the second configuration example described above. Note that, although specific descriptions are omitted, some configurations of the inhalation device 100 described below may also be applied to the inhalation device 100A of the first configuration example.

[0092] Figure 3 is an overall perspective view of the inhalation device 100. Hereinafter, in the inhalation device 100, the insertion and removal direction of the rod-shaped substrate 150 with respect to the inhalation device 100 is defined as the vertical direction, the sliding movement direction of the shutter 23 described below is defined as the front-rear direction, and the direction perpendicular to the vertical direction and the front-rear direction is defined as the left-right direction. In addition, as shown in the respective figures, Fr is the front, Rr is the rear, L is the left side, R is the right side, U is upward, and D is downward.

[0093] The inhalation device 100 is preferably sized to fit in the hand, for example having a rod shape. For example, the user holds the inhalation device 100 in one hand, with the fingertips in contact with the surface of the inhalation device 100. Note that the shape of the inhalation device 100 is not limited to a rod shape, but can be any shape (e.g., a rounded substantially cubic shape or an oval shape).

[0094] The inhalation device 100 includes an internal unit 10 (see Figures 4 to 6 ), and a housing 20 that forms the exterior of the inhalation device 100. The housing 20 has a lower housing 21 and an upper housing 22. A portion of the internal unit 10 is received in the lower housing 21, and the entire internal unit 10 is received in the housing 20 by covering the lower housing 21 with the upper housing 22 from above.

[0095] On the top surface of the inhalation device 100 are provided: an opening 27 (see Figures 4 to 6 ), which is for inserting and removing the rod-shaped substrate 150; and a shutter 23 that can slide in the front-rear direction. The opening 27 is arranged on the rear side of the top surface of the inhalation device 100. The shutter 23 selectively assumes an open state (front side position) and a closed state (rear side position). The open state allows the insertion and removal of the rod-shaped substrate 150 by opening the opening 27, and the closed state closes the opening 27 by positioning the shutter 23 above the opening 27. When inserting the rod-shaped substrate 150 into the opening 27, the user sets the shutter 23 to the open state.

[0096] A shutter detection sensor 11 (see Figure 4 ) is provided near the shutter 23. The shutter detection sensor 11 detects whether the shutter 23 is in the open state. The shutter detection sensor 11 is an example of the sensor unit 112B of the inhalation device 100B that is Figure 2 .

[0097] In addition, a USB (Universal Serial Bus) port 26 (see Figure 4 ) is provided on the upper surface of the inhalation device 100. The USB port is arranged adjacent to the opening 27. In the open state described above, the shutter 23 blocks the USB port 26. On the other hand, in the closed state described above, the shutter 23 does not block the USB port 26, and the USB port 26 is open. The USB port 26 is configured to be electrically connected to an external power source (not shown in the drawings) that can supply power to charge the power supply unit 111C (see Figure 4 ). The USB port 26 is, for example, a socket into which a mating plug can be inserted. As an example, in this embodiment, the USB port 26 is a USB Type-C socket.

[0098] The operation unit 24 and the light-emitting unit 25 are provided on the front surface of the inhalation device 100. The operation unit 24 is arranged below the light-emitting unit 25. More specifically, the operation unit 24 and the light-emitting unit 25 are components of the internal unit 10 housed in the housing 20, and a part of the operation unit 24 and the light-emitting unit 25 is configured to be exposed from an opening formed in the front surface of the housing 20. The light-emitting unit 25 is Figure 2 an example of the notification unit 113B of the inhalation device 100B shown in

[0099] The operation unit 24 is a button-type switch that can be operated by the user and is an input device for receiving information input from the user. The operation unit 24 is connected to the main board 50, which will be described later (see Figures 4 to 6 ). When the user presses the operation unit 24, for example, the microcontroller unit (MCU) 1 (see Figures 4 to 6 ) or the heating unit 121C (see Figure 7 ) is activated. Note that the MCU 1 serves as the control unit 116B in the inhalation device 100B. In addition to the function of the control unit 116B in the inhalation device 100B, the MCU 1 may also incorporate the function of the communication unit 115B. Furthermore, the MCU 1 may be constituted by a single IC or two or more ICs. For example, the control of the discharge of the heating unit 121C and the control of the charging of the power supply unit 111C may be performed by a single IC or by separate ICs.

[0100] For example, the light-emitting unit 25 is configured by a light-emitting device such as a light-emitting diode (LED). More specifically, the light-emitting unit 25 includes: a plurality of LEDs 251 (see Figure 6 ) provided on the main board 50; and a transparent cover member 250 that covers the plurality of LEDs 251 and transmits the light of the plurality of LEDs 251. A part of the transparent cover member 250 is exposed through an opening formed in the front surface of the housing 20. In this embodiment, for example, it is assumed that the plurality of LEDs 251 are configured to be capable of emitting light in a plurality of colors, including blue, yellow, and red. Note that any number of light-emitting elements can be set, for example, there may be one light-emitting element in the light-emitting unit 25.

[0101] The light-emitting unit 25 emits light in a predetermined light-emitting pattern by a command from the MCU 1 to notify the user of predetermined information. Here, the light-emitting pattern may be, for example, the light-emitting color, but this is not restrictive, and the light-emitting pattern may be, for example, the intensity of irradiation (in other words, luminance) or the irradiation pattern (for example, flashing at a predetermined time interval), etc. In addition, the predetermined information is, for example, operation information indicating whether the inhalation device 100 is powered on.

[0102] Next, reference will be made to Figures 4 to 6Describe the internal unit 10 of the inhalation device 100 according to this embodiment. Figure 4 is a perspective view of the internal unit 10 as seen from the right front side; Figure 5 is a perspective view of the internal unit 10 as seen from the left front side; Figure 6 is an exploded perspective view of the internal unit 10; Figure 7 is a cross-sectional perspective view of the heater assembly 30; and Figure 8 is a block diagram showing the electrical connection of the main elements of the internal unit 10 in a simplified manner. Note that the internal unit 10 constitutes the inhalation device 100 from which the outer casing 20 and the shutter 23 have been removed.

[0103] The internal unit 10 includes a chassis 40, a main board 50, a vibration device 60, a heater assembly 30, a power supply unit 111C, a power board 71, a peripheral flexible printed circuit (FPC) 72, a sensor FPC 73, and various sensors. The power board 71, the peripheral FPC 72, and the sensor FPC 73 are flexible circuit boards. A flexible circuit board is flexible and includes conductive wiring and / or signal wiring, and allows the mounting of electronic components (elements) such as resistors and chips. The thickness of a flexible circuit board is typically set to 100 µm to 600 µm. The power board 71 may be a flexible circuit board, a rigid board as described below, or a combination of a flexible board and a rigid board, but an example of a flexible circuit board is described herein.

[0104] (Chassis)

[0105] As Figure 6 shown in the exploded perspective view, the chassis 40 includes: a power holding portion 41 for holding the power supply unit 111C; a board holding portion 42 for holding the main board 50; and a heater holding portion 43 for holding the heater assembly 30. The power holding portion 41 is positioned at the lower part of the chassis 40, and the board holding portion 42 and the heater holding portion 43 are positioned on the upper part of the chassis 40.

[0106] The power holding portion 41 has a cylindrical shape with a part of the side cut off, in other words, has a substantially semi-cylindrical shape. The power holding portion 41 has a bottom wall portion 401, a side wall portion 402 having an arc shape and standing vertically from the bottom wall portion 401, and an upper wall portion 403 provided at the upper end of the side wall portion 402. The power supply unit 111C is arranged in the space surrounded by the bottom wall portion 401, the side wall portion 402, and the upper wall portion 403.

[0107] The board holding portion 42 is provided on the vertical wall portion 404 that extends upward from the upper wall portion 403 of the power supply holding portion 41. The board holding portion 42 is provided on one side (here, the front side) in the front-rear direction of the vertical wall portion 404, and holds the main board 50.

[0108] The heater holding portion 43 is provided on the side opposite to the board holding portion 42 in the front-rear direction of the vertical wall portion 404 (here, the rear side). The heater holding portion 43 has a space surrounded by the vertical wall portion 404, a pair of left and right wall portions 405 that extend in the front-rear direction from the vertical wall portion 404, and the top surface of the upper wall portion 403 of the power supply holding portion 41, and the heater assembly 30 is arranged in this space.

[0109] (Main board)

[0110] The main board 50 is a rigid board with a plurality of electronic components (elements) mounted on both sides. The rigid board is not flexible, and the thickness is usually set to 300 µm to 1600 µm. Components such as the MCU 1, the LED 251, the charging IC (integrated circuit) 81, the boost DC / DC converter 82, the protection IC 83, the heating switches 85, 86, and the operational amplifier 87 are mounted on the main board 50. The main board 50 is held in the board holding portion 42 of the chassis 40 such that the component mounting surface is oriented in the front-rear direction.

[0111] Figure 9 Components mounted on the front surface 501 of the main board 50 are shown.

[0112] As Figure 9 shown, the power connection portion 51 is provided in the lower region on the front surface 501 of the main board 50, and is electrically connected to the power supply unit 111C at the right end. The positive electrode side connection portion 51a of the power connection portion 51 is provided below the negative electrode side connection portion 51b. The power connection portion 51 is electrically connected to the power supply unit 111C via the power board 71. The power supply unit 111C is a cylindrical lithium-ion secondary battery and is Figure 2 an example of the power supply unit 111B of the suction device 100B.

[0113] As Figure 6As shown, the power supply unit 111C is provided with a positive electrode tab 111a and a negative electrode tab 111b. The power supply unit 111C is arranged in the power supply holding portion 41 of the chassis 40 such that the positive electrode tab 111a and the negative electrode tab 111b are arranged at the front. The power supply board 71 is arranged in front of the power supply unit 111C and the main board 50 and extends in the vertical direction. The power supply board 71 is connected to the positive electrode tab 111a and the negative electrode tab 111b of the power supply unit 111C and is also connected to the power supply connection portion 51 of the main board 50. Electric power from the power supply unit 111C is transmitted to the main board 50 through the conductive tracks formed on the power supply board 71 and is supplied to each electronic component, such as a boost DC / DC converter 82 and a protection IC 83, for example. The power supply board 71 is also provided with a power supply temperature sensor 16. The power supply temperature sensor 16 is a temperature sensor for detecting the temperature of the power supply unit 111C. The power supply temperature sensor 16 is, for example, a thermistor. The power supply temperature sensor 16 is Figure 2 an example of the sensor unit 112B of the suction device 100B.

[0114] Return Figure 9 , the MCU 1 is installed in the lower area on the front surface 501 of the main board 50, to the left of the power supply connection portion 51, and the protection IC 83 is installed above the MCU 1, near the power supply connection portion 51. Also refer to Figure 8 , the protection IC 83 is designed to protect the power supply unit 111C by stopping the charging or discharging of the power supply unit 111C in the case of overcharging or over-discharging when the power supply unit 111C is charging or discharging.

[0115] Figure 10 The components installed on the rear surface 502 of the main board 50 are shown.

[0116] As Figure 10 shown, the USB port 26 is provided in the upper area on the rear surface 502 of the main board 50. The USB port 26 is electrically connected to the charging IC 81 through the wiring formed on the main board 50.

[0117] The charging IC 81 is mounted rightward in the central region of the rear surface 502 of the main board 50. The heater connection parts 57a, 57b are provided at the center of the lower region, and the low-potential side heating switch 86 (Nch FET in the drawing) is mounted on the right side of the heater connection parts 57a, 57b in the lower region. Further, on the rear surface 502 of the main board 50, between the charging IC 81 and the heater connection parts 57a, 57b, a high-potential side heating switch 85 (Pch FET in the drawing), a boost DC / DC converter 82, and an operational amplifier 87 are mounted in order from the left. The charging IC 81 performs charging control to supply the power input from the USB port 26 to the power supply unit 111C (charge this power supply unit). The boost DC / DC converter 82 boosts the voltage of the power supplied from the power supply unit 111C to generate power to be supplied to the heating unit 121C via the heating switches 85, 86 (see Figure 7 ). For example, the heating switches 85, 86 are FETs (field effect transistors). In this way, by providing the power connection part 51 on the front surface 501 while mounting heating elements such as the boost DC / DC converter 82 and the heating switches 85, 86 on the rear surface 502, the heating elements and the power connection part 51 can be arranged closer together. Since the protection IC 83 is prone to errors at high temperatures, the degradation of the control accuracy can be suppressed by mounting the protection IC 83 on the surface opposite to the heating element which is the heat generating element.

[0118] The board connection part 121a extending from below the heater assembly 30 is connected to the heater connection parts 57a, 57b to supply power to the heating unit 121C of the heater assembly 30. As a result, the power from the power supply unit 111C is supplied to the heating unit 121C of the heater assembly 30 via the main board 50.

[0119] As Figure 8 shown, the operational amplifier 87 is connected to the heater connection parts 57a, 57b. The operational amplifier 87 amplifies and outputs the difference between the voltage input to the inverting input terminal and the voltage input to the non-inverting input terminal in order to measure the resistance value of the heating unit 121C, but this will not be described in detail here. The MCU 1 acquires the temperature of the heating unit 121C based on the voltage input from the operational amplifier 87. By arranging the operational amplifier 87 on the same surface as the heating element, the signal-to-noise ratio for measuring the heater resistance value, that is, the SNR, can be increased. In addition, the operational amplifier 87 can adopt a zero-drift amplifier in order to reduce the drift error caused by heat generation.

[0120] (Vibration device)

[0121] For example, the vibration device 60 is configured by a vibration element (such as a vibration motor). As Figure 6 shown, the vibration device 60 is disposed in the power holding portion 41 of the chassis 40, between the top surface of the power supply unit 111C and the upper wall portion 403. The lead 61 of the vibration device 60 is connected to the peripheral FPC 72. The vibration device 60 vibrates in a predetermined vibration mode by a command from the MCU 1 to notify the user of predetermined information. For example, when the heating of the rod-shaped substrate 150 starts or ends, the vibration device 60 vibrates in a predetermined vibration mode to notify the user of the start or end of heating. The vibration device 60 is Figure 2 an example of the notification unit 113B of the suction device 100B.

[0122] (Heater assembly)

[0123] As Figure 7 shown, the heater assembly 30 includes a heating unit 121C, a housing portion 140C, and a heat insulating portion 144C. The heating unit 121C is, for example, a film heater and is wound around the outer circumference of the housing portion 140C. In addition, the heating unit 121C and the board connection portion 121a may be configured by a single heater FPC.

[0124] The heater assembly 30 is further provided with a rod guide 31. The rod guide 31 is provided on the upper portion of the heater assembly 30 and guides the insertion / removal of the rod-shaped substrate 150 into / from the housing portion 140C. The rod guide 31 is a cylindrical member having an opening 27 and forms a part of the housing portion 140C.

[0125] In addition, the heater assembly 30 is provided with a heater temperature sensor 15 that can detect the temperature of the heating unit 121C. More specifically, the heater temperature sensor 15 is provided in contact with or close to the heating unit 121C between the heating unit 121C and the heat insulating portion 144C. The heater temperature sensor 15 is, for example, a thermistor.

[0126] (Sensor FPC)

[0127] As Figure 6 shown, the sensor FPC 73 is disposed in the heater holding portion 43, between the vertical wall portion 404 and the heater assembly 30. The sensor FPC 73 is equipped with a rod detection sensor 12, a suction sensor 13, and a housing temperature sensor 14. The rod detection sensor 12, the suction sensor 13, and the housing temperature sensor 14 are Figure 2 examples of the sensor unit 112B of the suction device 100B.

[0128] The rod detection sensor 12 is a sensor capable of detecting the rod-shaped substrate 150 accommodated in the accommodation portion 140C. In this embodiment, the rod detection sensor 12 is an optical sensor capable of detecting the rod-shaped substrate 150 based on the amount of reflected light from the light irradiated onto the accommodation portion 140C. Here, the light amount is a concept including luminous flux, illuminance, luminous emittance, brightness, luminance, and the like. For example, the optical sensor is an infrared (IR) sensor.

[0129] The inhalation sensor 13 is a sensor that detects the user's suction action (inhalation action). The inhalation sensor 13 includes, for example, a condenser microphone, a pressure sensor, a thermistor, and the like. The inhalation sensor 13 is provided near the rod guide 31 in the sensor FPC 73.

[0130] The housing temperature sensor 14 is a sensor that detects the temperature of the housing 20. The housing temperature sensor 14 is, for example, a thermistor. The housing temperature sensor 14 is arranged adjacent to the inner surface of the housing 20 in the sensor FPC 73.

[0131] The sensor FPC 73 is also provided with a heater temperature sensor connection portion 731 that is connected to the heater temperature sensor 15 of the heater assembly 30. The heater temperature sensor connection portion 731 is provided on the lower portion of the sensor FPC 73. More specifically, the lead 15a is connected to the heater temperature sensor 15, and the heater temperature sensor connection portion 731 is connected to the lead 15a extending from below the heater assembly 30.

[0132] The rod detection sensor 12, the inhalation sensor 13, the housing temperature sensor 14, and the heater temperature sensor connection portion 731 are connected to the board connection portion 730 via conductive tracks formed on the sensor FPC 73. The board connection portion 730 is connected to the sensor FPC connection portion 55 provided in the central region of the front surface 501 of the main board 50. As a result, the detection results of the sensors are output to the MCU 1 and other components mounted on the main board 50.

[0133] In the inhalation device 100 configured in this way, when the shutter detection sensor 11 detects the open state of the shutter 23 and the rod detection sensor 12 detects the rod-shaped substrate 150, the MCU 1 starts heating through the heating unit 121C. When the user holds the mouthpiece portion 152 of the rod-shaped substrate 150 in their mouth and inhales, aerosol is supplied from the aerosol source of the rod-shaped substrate 150 heated by the heating unit 121C to the user's mouth. The inhalation sensor 13 detects the number of inhalations, and the MCU 1 stops heating after a predetermined number of inhalations or after a predetermined time has elapsed. During the heating of the inhalation device 100, the housing temperature sensor 14, the heater temperature sensor 15, and the power supply temperature sensor 16 measure the temperature, and if it is determined that there is abnormal heating, the MCU 1 stops or suppresses the heating by the heating unit 121C. In addition, the user can check, for example, the SOC of the power supply unit 111C by operating the operation unit 24. The light-emitting unit 25 (LED 251) and the vibration device 60 notify the user of various information, such as the SOC of the power supply unit 111C, error display, etc. If the SOC of the power supply unit 111C decreases, the user can connect an external power supply to the USB port 26 to charge the power supply unit 111C.

[0134] (Details of the main board)

[0135] Details of the main board 50 will be described below with reference to Figure 8 and Figures 11 to 13 to describe the details of the main board 50. Figure 11 Shows Figure 10 the power flow during heating in Figure 12 and shows Figure 10 the power flow during charging in Figure 11 and Figure 12 In Figure 9 and Figure 11 and Figure 12 the main board 50 is observed from the back surface 502 side, and the power connection portion 51 (positive electrode side connection portion 51a) provided on the front surface 501 is indicated by a dotted line. It should be noted that Figure 11 and Figure 12 show the power connection portion 51, where the front surface 501 faces forward, so the position of the power connection portion 51 appears in the opposite way in

[0136] The positional relationship of the components mounted on the main board 50 is as described above. However, when these components are viewed relative to the power connection portion 51, for example, a boost DC / DC converter 82 and heating elements such as heating switches 85 and 86 are arranged closer to the power connection portion 51 than the charging IC 81 which is a charging component. In terms of the wiring distance, these components are arranged such that the distance of the wiring joining the power connection portion 51 and, for example, the boost DC / DC converter 82 and the heating elements such as the heating switches 85 and 86 is shorter than the distance of the wiring joining the power connection portion 51 and the charging IC 81 which is a charging component.

[0137] Figure 11 The white arrow 58 in [description] shows the power flow during discharging, wherein the power from the power supply unit 111C (which is input from the positive electrode side connection portion 51a of the power connection portion 51 to the power connection pin Pb) is supplied to the heater connection portion 57a in a counterclockwise flow direction through the heating unit connection pin Po of the boost DC / DC converter 82 and the high-potential side heating switch 85.

[0138] Figure 12 The white arrow 59 in [description] shows the power flow during charging, wherein the power supplied from the USB port 26 to the charging IC 81 flows downward from the power connection pin Pb of the charging IC 81 and flows through the positive electrode side connection portion 51a of the power connection portion 51.

[0139] Figure 13 shows the main conduction tracks of the first conductive layer L1 to the tenth conductive layer L10 provided on the main board 50. In Figure 13 the first conductive layer L1 is a conductive track exposed on the rear surface 502, and the tenth conductive layer L10 is a conductive track exposed on the front surface 501. Components such as the charging IC 81, the boost DC / DC converter 82, and the heating switch 85 mounted on the rear surface 502 are connected to the first conductive layer L1. A part of the tenth conductive layer L10 (the lower end portions of the conductive tracks 810 and 820 to be described later) constitutes the positive electrode side connection portion 51a and the negative electrode side connection portion 51b.

[0140] The conductive trace 810 of the tenth conductive layer L10 forming the positive electrode side connection portion 51a is connected to the conductive traces 809 to 805 of the ninth conductive layer L9 to the fifth conductive layer L5 formed at the same position. The conductive trace 805 of the fifth conductive layer L5 extends in the on-board direction and is connected to the conductive trace 804 of the fourth conductive layer L4. The conductive trace 804 of the fourth conductive layer L4 is approximately half the vertical length of the conductive trace 805. The lower part of the conductive trace of this fourth conductive layer is connected to the conductive trace 803a of the third conductive layer L3, and the upper part of the conductive trace of this fourth conductive layer is connected to the conductive trace 803b of the third conductive layer L3. It should be noted that the connection between the conductive traces of different conductive layers is made through vias not depicted.

[0141] The conductive trace 803a of the third conductive layer L3 is connected to the power connection pin Pb of the boost DC / DC converter 82 through the conductive trace 802a of the second conductive layer L2 and the conductive trace 801a of the first conductive layer L1 formed at the same position (see Figure 11 ). That is, the conductive traces 801a to 803a and 804 to 810 are Figure 11 part of the white arrow 58 in

[0142] which constitutes the power supply wiring 510 during discharge. Figure 11 The conductive trace 803b of the third conductive layer L3 is connected to the power connection pin Pb of the charging IC 81 through the conductive trace 802b of the second conductive layer L2 and the conductive trace 801b of the first conductive layer L1 formed at the same position (see Figure 12 ). That is, the conductive traces 801b to 803b and 804 to 810 are

[0143] part of the white arrow 59 in

[0144] which constitutes the power supply wiring 520 during charging.

[0145] Therefore, the power supply wiring 520 that joins the positive electrode side connection portion 51a and the power connection pin Pb of the charging IC 81, and the power supply wiring 510 that joins the positive electrode side connection portion 51a and the power connection pin Pb of the boost DC / DC converter 82 share the conductive traces (804 to 810) in multiple conductive layers (L4 to L10). Therefore, when heating and charging are not performed simultaneously, a part of the conductive traces is shared by the power supply wiring and the charging wiring, enabling the size of the main board 50 to be reduced.

[0144] It should be noted that the conductive trace 820 of the tenth conductive layer L10 serving as the negative electrode side connection portion 51b extends upward and is connected to the ground wiring formed over a wide range from the tenth conductive layer L10 to the first conductive layer L1. The ground wiring will not be described further.

[0145] By their nature, heating and charging involve large currents passing through the wiring, so both the power supply wiring 510 during heating and the power supply wiring 520 during charging are preferably shortened. For this reason, both the heating elements (such as the boost DC / DC converter 82 and the heating switches 85, 86) and the charging IC 81 that constitutes the charging element are preferably arranged close to the power connection portion 51. However, in order to reduce the size of the main board 50, it is inevitable that any of these heating elements and the charging IC must be set separately from the power connection portion 51.

[0146] Since it is necessary to eliminate power losses during heating, it is preferable to arrange the heating elements close to the power connection portion 51 preferentially. At the same time, when measuring the power supply voltage for controlling charging, the charging IC 81 also preferably measures at a position close to the power connection portion 51. That is, when the measurement point is far from the power supply, the wiring resistance increases proportionally and the accuracy of charging control decreases.

[0147] Therefore, according to the present disclosure, by providing a power supply voltage measurement pin Ps for the charging IC 81 as a charging element and obtaining the power supply voltage measurement result from a position close to the power connection portion 51 through the voltage measurement wiring 521, rather than using the power supply voltage obtained from the power connection pin Pb of the charging IC 81, and arranging heating elements such as the boost DC / DC converter 82 and the heating switches 85, 86 closer to the power connection portion 51 than the charging IC 81 to improve the accuracy of measuring the power supply voltage.

[0148] More specifically, the charging IC 81 is provided with a power supply voltage measurement pin Ps, as Figure 11 shown. As Figure 13 shown, the power supply voltage measurement pin Ps is connected to the signal track 521b of the seventh conductive layer L7 through the via 521a that penetrates from the first conductive layer L1 to the sixth conductive layer L6. The signal track 521b extends downward from the via 521a, connects to the conductive track 807, and is connected to the positive electrode side connection portion 51a (conductive track 810) through the conductive track 808 of the eighth conductive layer L8 and the conductive track 809 of the ninth conductive layer L9 formed at the same position. That is, the power supply voltage measurement pin Ps of the charging IC 81 is connected to the conductive tracks 807 to 810 through the via 521a and the signal track 521b that constitute the voltage measurement wiring 521.

[0149] Also refer to Figure 8, the power supply voltage measurement pin Ps of the charging IC 81 is thus connected via a voltage measurement wiring 521 to a position in the power supply wiring 520 that joins the positive electrode side connection portion 51a and the power supply connection pin Pb and that is closer to the power supply connection portion 51 than the power supply connection pin Pb. Thus, the charging IC 81 can utilize the power supply voltage at a position in the power supply wiring 520 close to the positive electrode side connection portion 51a, rather than the power supply voltage input to the power supply connection pin Pb of the charging IC 81. By this means, it is possible to improve the heating efficiency by arranging heating elements such as, for example, a boost DC / DC converter 82 and / or heating switches 85, 86 closer to the power supply connection portion 51 than the charging IC 81, while still maintaining the accuracy of the charging control by this arrangement. Further, since the voltage measurement wiring 521 is a wiring for measurement, a large current does not flow through this voltage measurement wiring (as in the case of the power supply wiring 510), and thus fine wiring is sufficient for the voltage measurement wiring 521, and this voltage measurement wiring can be mounted without increasing the size.

[0150] It should be noted that, in the embodiment described above, the signal trace 521b is formed on the seventh conductive layer L7, which is a layer between the front surface 501 and the rear surface 502, but this is not restrictive, and the signal trace 521b can equally be provided on a layer closer to the positive electrode side connection portion 51a (for example, the ninth conductive layer L9). In this case, the via 521a penetrates from the first conductive layer L1 to the eighth conductive layer L8. Further, the signal trace 521b is formed on the ninth conductive layer L9 and connected to a conductive trace 809 of the ninth conductive layer L9. That is, the power supply voltage measurement pin Ps is connected via the via 521a that penetrates from the first conductive layer L1 to the eighth conductive layer L8 to the signal trace 521b of the ninth conductive layer L9. The signal trace 521b extends downward from the via 521a, is connected to the conductive trace 809, and is connected to the positive electrode side connection portion 51a (conductive trace 810) of the tenth conductive layer L10 formed at the same position. That is, the power supply voltage measurement pin Ps of the charging IC 81 is connected to the conductive traces 809 and 810 via the via 521a and the signal trace 521b that constitute the voltage measurement wiring 521.

[0151] In addition, the signal trace 521b can be provided on the tenth conductive layer L10. By forming the signal trace 521b on a layer between the front surface 501 and the rear surface 502, even when there is not enough space on the component mounting surface of the main board 50, the voltage measurement wiring 521 can be formed by utilizing the interfaces in the multilayer structure. At the same time, by providing the signal trace 521b on the tenth conductive layer L10, the power supply voltage can be obtained at a position closer to the positive electrode side connection portion 51a. In addition, the signal trace 521b can be provided on both the layer between the front surface 501 and the rear surface 502 and the layer (tenth conductive layer L10) on which the positive electrode side connection portion 51a is provided. The signal traces 521b provided on these layers can be connected by vias, and the signal trace 521b can be connected to the positive electrode side connection portion 51a on the front surface 501 (tenth conductive layer L10), on which the positive electrode side connection portion 51a is provided.

[0152] In addition, the boost DC / DC converter 82 is provided with a feedback pin Pf for measuring the output voltage from the heating unit connection pin Po to the heating switch 85, as Figure 8 and Figure 10 shown in. More specifically, the feedback pin Pf of the boost DC / DC converter 82 is connected to the signal trace 515b on the second conductive layer L2 through the via 515a penetrating the first conductive layer L1, as Figure 13 shown in. The signal trace 515b extends obliquely downward from the via 515a toward the heating switch 85 and is connected to the heating switch 85 through the via 515c penetrating the first conductive layer L1. Here, among the multiple vias in the wiring extending from the heating unit connection pin Po to the heating switch 85, the via 515c is the via closer to the heating switch 85 than other components. In addition, Figure 8 the capacitors C1 to C3 shown in are examples of "other components". The capacitors C1 to C3 are each connected in parallel to the heating unit connection pin Po and the ground terminal of the boost DC / DC converter 82. The capacitors C1 to C3 are each electrically connected to the heating unit connection pin Po on the first conductive layer L1 and are also connected to the vias 515d, 515e, 515f penetrating the first conductive layer L1. The vias 515d, 515e, 515f are grounded.

[0153] In view of the fact that for the purpose of feedback control, it is desirable to detect the power supply voltage at a position as close as possible to the heater connection portion 57a, the boost DC / DC converter 82 measures the output voltage through a via hole that is closer to the heating switch 85 than other components among a plurality of via holes in the wiring between the heating unit connection pin Po and the heating switch 85, and thus can control the heating voltage with greater accuracy. From this perspective, the feedback pin Pf preferably obtains the output voltage through the via hole closest to the heating switch 85 among the plurality of via holes. This enables the heating voltage to be controlled with even higher accuracy.

[0154] Although the different embodiments of the present disclosure have been described above with reference to the accompanying drawings, it goes without saying that the present disclosure is not limited to such examples. Obviously, those skilled in the art will be able to conceive of several variant examples or modified examples within the scope disclosed in the claims, and any such variant examples or modified examples are naturally understood to fall within the technical scope of the present disclosure. In addition, the components in the embodiments described above can be combined in any way without departing from the essential points of the present invention.

[0155] This specification elaborates at least the following features. Note that the corresponding components, etc. in the embodiments described above are shown in parentheses, but are not limited thereto.

[0156] (1) A power supply unit (power supply unit 110) for an aerosol generating device (inhalation devices 100B, 100), the power supply unit comprising: a power source (power source units 111A to 111C) for supplying power to a heating unit (heating units 121A to 121C) for heating an aerosol source (rod-shaped matrix 150);

[0157] a power conversion device (boost DC / DC converter 82) for converting the power from the power source and supplying heating power to the heating unit, and / or a heating switch (heating switch 85) for controlling the power supply to the heating unit;

[0158] a charging IC (charging IC 81) for receiving power from an external power source and performing control to supply charging power to the power source; and

[0159] a board (main board 50) for mounting the charging IC, a power connection portion (power connection portion 51) for supplying power from the power source, and the power conversion device and / or the heating switch, wherein,

[0160] the charging IC includes:

[0161] a power supply voltage measurement pin (power supply voltage measurement pin Ps) for measuring the voltage of the power source; and

[0162] A power connection pin (power connection pin Pb) to which the voltage of the power supply is input.

[0163] At least one of the power conversion device and / or the heating switch is arranged closer to the power connection portion than the charging IC, and

[0164] A power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring (voltage measurement wiring 521) to a position in a power wiring (power wiring 520) that joins the power connection portion and the power connection pin and is closer to the power connection portion than the power connection pin.

[0165] According to (1), heating elements such as the power conversion device and the heating switch are arranged close to the power connection portion, so that the power wiring through which a large current flows can be shortened, which thus enables reduction of power loss and improvement of heating efficiency. At the same time, although due to space constraints, the charging IC is arranged farther away than these heating elements, the power supply voltage measurement pin of the charging IC is connected through the voltage measurement wiring to a position in the power wiring that joins the power connection portion and the power connection pin and is closer to the power connection portion than the power connection pin. Therefore, the charging IC can utilize the power supply voltage at a position in the power wiring through which a large current flows and close to the power connection portion, rather than the power supply voltage input to the power connection pin. This enables maintenance of the accuracy of charging control while also improving heating efficiency. In addition, since the voltage measurement wiring is for measurement, the voltage measurement wiring does not require a large current to flow (as in the case of the power wiring), and thus fine wiring is sufficient for the voltage measurement wiring, and the voltage measurement wiring can be installed without increasing the size.

[0166] (2) A power supply unit (power supply unit 110) for an aerosol generating device (inhalation devices 100B, 100), the power supply unit including: a power supply (power supply units 111A to 111C) for supplying power to a heating unit (heating units 121A to 121C) for heating an aerosol source (rod-shaped substrate 150);

[0167] A power conversion device (boost DC / DC converter 82) for converting the power from the power supply and supplying heating power to the heating unit, and / or a heating switch (heating switch 85) for controlling the power supply to the heating unit;

[0168] A charging IC (charging IC 81) for receiving power from an external power supply and performing control to supply charging power to the power supply; and

[0169] a board (main board 50) for mounting the charging IC, a power connection portion (power connection portion 51) for supplying power from the power source, and the power conversion device and / or the heating switch, wherein,

[0170] the charging IC includes:

[0171] a power supply voltage measurement pin (power supply voltage measurement pin Ps) for measuring the voltage of the power supply; and

[0172] a power connection pin (power connection pin Pb) to which the voltage of the power supply is input,

[0173] the wiring distance between at least one of the power conversion device and / or the heating switch and the power connection portion is shorter than the wiring distance between the charging IC and the power connection portion, and

[0174] the power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring (voltage measurement wiring 521) to a position closer to the power connection portion than the power connection pin in a power wiring (power wiring 520) that joins the power connection portion and the power connection pin.

[0175] According to (2), the wiring distance between heating elements such as the power conversion device and the heating switch and the power connection portion is shorter than the wiring distance between the charging IC and the power connection portion. Therefore, the power wiring through which a large current flows can be shortened. This enables reduction of power loss and improvement of heating efficiency. At the same time, although the wiring distance between the charging IC and the power connection portion is longer due to space constraints, the power supply voltage measurement pin of the charging IC is connected through the voltage measurement wiring to a position closer to the power connection portion than the power connection pin in the power wiring that joins the power connection portion and the power connection pin. Therefore, the charging IC can utilize the power supply voltage at a position closer to the power connection portion in the power wiring through which a large current flows, rather than the power supply voltage input to the power connection pin. This enables maintenance of the accuracy of charging control while also improving heating efficiency. In addition, since the voltage measurement wiring is for measurement, the voltage measurement wiring does not require a large current to flow (as in the case of the power wiring), and thus fine wiring is sufficient for the voltage measurement wiring, and the voltage measurement wiring can be installed without increasing the size.

[0176] (3) The power supply unit for an aerosol generating device as disclosed in (1) or (2), wherein,

[0177] the board includes:

[0178] The first surface (rear surface 502), which is used for mounting the power conversion device and / or the heating switch; and

[0179] The second surface (front surface 501), which is on the side opposite to the first surface and is used for mounting the power connection part.

[0180] According to (3), by arranging heating elements such as the power conversion device and the heating switch and the power connection part on different surfaces of the board, these heating elements and the power connection part can be arranged closer together.

[0181] (4) A power supply unit for an aerosol generating device as disclosed in (3), wherein,

[0182] The voltage measurement wiring includes: vias (via 521a), which enable communication between the first surface and the second surface; and wiring (signal trace 521b), which is formed on at least one of the first surface and the second surface.

[0183] According to (4), the voltage measurement wiring can be formed in a simple manner.

[0184] (5) A power supply unit for an aerosol generating device as disclosed in (4), wherein,

[0185] The voltage measurement wiring is connected to the power connection part on the second surface.

[0186] According to (5), the power supply voltage can be utilized at a position close to the power connection part.

[0187] (6) A power supply unit for an aerosol generating device as disclosed in (3), wherein,

[0188] The board has a multi-layer structure, and

[0189] The voltage measurement wiring includes wiring formed on a layer between the first surface and the second surface.

[0190] According to (6), even if there is not enough space on the front surface of the board, the voltage measurement wiring can be formed by utilizing the interface in the multi-layer structure.

[0191] (7) A power supply unit for an aerosol generating device as disclosed in any one of (1) to (6), wherein,

[0192] The power conversion device includes:

[0193] A heating unit connection pin (heating unit connection pin Po) for supplying power to the heating unit via the heating switch; and

[0194] A feedback pin (feedback pin Pf) for measuring the output voltage from the heating unit connection pin to the heating switch,

[0195] A plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch,

[0196] An element is electrically connected to any one of the plurality of vias, and

[0197] The feedback pin obtains the output voltage through a via among the plurality of vias that is closer to the heating switch than the via to which the element is electrically connected.

[0198] According to (7), in view of the fact that for the purpose of feedback control, it is desirable to detect the power supply voltage at a position as close as possible to the heating unit, the power conversion device measures the output voltage through a via among the plurality of vias in the wiring between the heating unit connection pin and the heating switch that is closer to the heating switch than other elements, and thus can control heating with greater accuracy.

[0199] (8) The power supply unit for an aerosol generating device as disclosed in (7), wherein,

[0200] The element is a capacitor (capacitors C1 to C3).

[0201] According to (8), the flow of surge current to the power conversion device can be suppressed.

[0202] (9) The power supply unit for an aerosol generating device as disclosed in (8), wherein,

[0203] The capacitor is connected to the heating unit connection pin and grounded.

[0204] According to (9), the flow of surge current to the power conversion device can be suppressed.

[0205] (10) The power supply unit for an aerosol generating device as disclosed in any one of (1) to (9), wherein,

[0206] The power conversion device includes:

[0207] A heating unit connection pin (heating unit connection pin Po) for supplying power to the heating unit via the heating switch; and

[0208] A feedback pin (feedback pin Pf) for measuring the output voltage from the heating unit connection pin to the heating switch.

[0209] A plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch.

[0210] The feedback pin obtains the output voltage through the via closest to the heating switch among the plurality of vias.

[0211] According to (10), in view of the fact that for the purpose of feedback control, it is desirable to detect the power supply voltage as close as possible to the heating unit, the power conversion device measures the output voltage through the via closest to the heating switch among the plurality of vias in the wiring between the heating unit connection pin and the heating switch, and can thus control heating with greater accuracy.

[0212] (11) A power supply unit for an aerosol generating device as disclosed in any one of (1) to (10), wherein

[0213] The power conversion device includes:

[0214] A power supply connection pin (power supply connection pin Pb) to which the voltage of the power supply is input.

[0215] The board has a multi-layer structure, and

[0216] The power supply wiring (power supply wiring 520) that joins the power supply connection part and the power supply connection pin of the charging IC, and the power supply wiring (power supply wiring 510) that joins the power supply connection part and the power supply connection pin of the power conversion device share the wiring in a plurality of layers.

[0217] According to (11), when heating and charging are not performed simultaneously, a part of the wiring is shared by the power supply wiring and the charging wiring, thereby enabling the size of the board to be reduced.

[0218] (12) A power supply unit for an aerosol generating device as disclosed in any one of (3) to (6).

[0219] Includes an operational amplifier (operational amplifier 87) for measuring the resistance of the heating unit.

[0220] Wherein, the operational amplifier is mounted on the first surface.

[0221] According to (12), the amplifier gives priority to the signal-to-noise ratio (i.e., SNR) for measuring the heater resistance value rather than the drift error caused by heat generation, and thus increases the SNR by arranging the amplifier on the same surface as the heating element.

[0222] (13) A power supply unit for an aerosol generating device as disclosed in any one of (3) to (6) and (12),

[0223] including a protection IC (protection IC 83) for protecting the power supply,

[0224] wherein the protection IC is disposed on the second surface.

[0225] According to (13), since the protection IC is prone to errors at high temperatures, deterioration of control accuracy can be suppressed by mounting the protection IC on a surface opposite to the heating element which is a heat generating element.

[0226] (14) An aerosol generating device (inhalation devices 100A, 100B, 100), the aerosol generating device comprising: a heating unit (heating units 121A to 121C) for heating an aerosol source (rod-shaped substrate 150);

[0227] a power supply (power supply units 111A to 111C) for supplying power to the heating unit;

[0228] a power conversion device (boost DC / DC converter 82) for converting power from the power supply and supplying heating power to the heating unit, and / or a heating switch (heating switch 85) for controlling the power supply to the heating unit;

[0229] a charging IC (charging IC 81) for receiving power from an external power supply and performing control to supply charging power to the power supply; and

[0230] a board (main board 50) for mounting the charging IC, a power connection portion (power connection portion 51) for supplying power from the power supply, and the power conversion device and / or the heating switch, wherein,

[0231] the charging IC includes:

[0232] a power supply voltage measurement pin (power supply voltage measurement pin Ps) for measuring the voltage of the power supply; and

[0233] a power supply connection pin (power supply connection pin Pb) to which the voltage of the power supply is input,

[0234] at least one of the power conversion device and the heating switch is disposed closer to the power connection portion than the charging IC, and

[0235] The power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring (voltage measurement wiring 521) to a position in the power supply wiring (power supply wiring 520) that joins the power supply connection portion and the power supply connection pin, which is closer to the power supply connection portion than the power supply connection pin.

[0236] According to (14), heating elements such as the power conversion device and the heating switch are arranged close to the power supply connection portion, so that the power supply wiring through which a large current flows can be shortened. This thus enables reduction of power loss and improvement of heating efficiency. At the same time, although due to space constraints, the charging IC is arranged farther away than these heating elements, the power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring to a position in the power supply wiring that joins the power supply connection portion and the power supply connection pin, which is closer to the power supply connection portion than the power supply connection pin. Therefore, the charging IC can utilize the power supply voltage at a position in the power supply wiring through which a large current flows and close to the power supply connection portion, rather than the power supply voltage input to the power supply connection pin. This enables maintenance of the accuracy of charging control while also improving heating efficiency. In addition, since the voltage measurement wiring is for measurement, the voltage measurement wiring does not require a large current to flow (as in the case of the power supply wiring), and thus fine wiring is sufficient for the voltage measurement wiring, and the voltage measurement wiring can be installed without increasing the size.

[0237] List of Reference Numerals

[0238] 50 Motherboard (board)

[0239] 51 Power supply connection portion

[0240] 81 Charging IC

[0241] 82 Boost DC / DC converter (power conversion device)

[0242] 83 Protection IC

[0243] 85 Heating switch

[0244] 87 Operational amplifier (amplifier)

[0245] 100A Inhalation device (aerosol generating device)

[0246] 100 Inhalation device (aerosol generating device, power supply unit)

[0247] 100B Inhalation device (aerosol generating device, power supply unit)

[0248] 110 Power supply unit

[0249] 111A Power supply unit (power supply)

[0250] 111B Power supply unit (power supply)

[0251] 111C Power supply unit (power supply)

[0252] 121A Heating unit

[0253] 121B Heating unit

[0254] 121C Heating unit

[0255] 150 Rod-shaped substrate (aerosol source)

[0256] 501 Front surface (second surface)

[0257] 502 Rear surface (first surface)

[0258] 510 Power supply wiring (power supply wiring that joins the power connection part and the power connection pins of the power conversion device)

[0259] 520 Power supply wiring (power supply wiring that joins the power connection part and the power connection pins of the charging IC)

[0260] 521 Voltage measurement wiring

[0261] 521a Via hole

[0262] 521b Signal trace (wiring)

[0263] C1 to C3 Capacitors

[0264] Pf Feedback pin

[0265] Ps Power supply voltage measurement pin

[0266] Pb Power supply connection pin

[0267] Po Heating unit connection pin

Claims

1. A power supply unit for an aerosol generating device, the power supply unit comprising: A power supply for supplying power to a heating unit for heating an aerosol source; A power conversion device for converting power from the power supply and supplying heating power to the heating unit, and / or a heating switch for controlling the power supply to the heating unit; A charging IC for receiving power from an external power supply and performing control to supply charging power to the power supply; And A board for mounting the charging IC, a power connection portion for supplying power from the power supply, and the power conversion device and / or the heating switch, wherein The charging IC includes: A power supply voltage measurement pin for measuring the voltage of the power supply; and A power supply connection pin to which the voltage of the power supply is input, At least one of the power conversion device and / or the heating switch is arranged closer to the power connection portion than the charging IC, and The power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring to a position in the power wiring joining the power connection portion and the power supply connection pin that is closer to the power connection portion than the power supply connection pin.

2. A power supply unit for an aerosol generating device, the power supply unit comprising: A power supply for supplying power to a heating unit for heating an aerosol source; A power conversion device for converting power from the power supply and supplying heating power to the heating unit, and / or a heating switch for controlling the power supply to the heating unit; A charging IC for receiving power from an external power supply and performing control to supply charging power to the power supply; And A board for mounting the charging IC, a power connection portion for supplying power from the power supply, and the power conversion device and / or the heating switch, wherein The charging IC includes: A power supply voltage measurement pin for measuring the voltage of the power supply; and A power supply connection pin to which the voltage of the power supply is input, The wiring distance between at least one of the power conversion device and / or the heating switch and the power connection portion is shorter than the wiring distance between the charging IC and the power connection portion, and The power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring to a position in the power wiring joining the power connection portion and the power supply connection pin that is closer to the power connection portion than the power supply connection pin.

3. The power supply unit for an aerosol generating device according to claim 1 or 2, wherein The board includes: A first surface for mounting the power conversion device and / or the heating switch; and A second surface on the side opposite to the first surface for mounting the power connection portion.

4. The power supply unit for an aerosol generating device according to claim 3, wherein The voltage measurement wiring includes: a via for enabling communication between the first surface and the second surface; and a wiring formed on at least one of the first surface and the second surface.

5. The power supply unit for an aerosol generating device according to claim 4, wherein The voltage measurement wiring is connected to the power supply connection portion on the second surface.

6. The power supply unit for an aerosol generating device according to claim 3, wherein the board has a multilayer structure, and the voltage measurement wiring includes wiring formed on a layer between the first surface and the second surface.

7. The power supply unit for an aerosol generating device according to any one of claims 1 to 6, wherein the power conversion device includes: a heating unit connection pin for supplying power to the heating unit via the heating switch; and a feedback pin for measuring the output voltage from the heating unit connection pin to the heating switch, a plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch, an element is electrically connected to any one of the plurality of vias, and the feedback pin obtains the output voltage through a via closer to the heating switch than the via to which the element is electrically connected among the plurality of vias.

8. The power supply unit for an aerosol generating device according to claim 7, wherein the element is a capacitor.

9. The power supply unit for an aerosol generating device according to claim 8, wherein the capacitor is connected to the heating unit connection pin and grounded.

10. The power supply unit for an aerosol generating device according to any one of claims 1 to 9, wherein the power conversion device includes: a heating unit connection pin for supplying power to the heating unit via the heating switch; and a feedback pin for measuring the output voltage from the heating unit connection pin to the heating switch, a plurality of vias are provided in the wiring between the heating unit connection pin and the heating switch, the feedback pin obtains the output voltage through the via closest to the heating switch among the plurality of vias.

11. The power supply unit for an aerosol generating device according to any one of claims 1 to 10, wherein the power conversion device includes: a power supply connection pin to which the voltage of the power supply is input, the board has a multilayer structure, and the power wiring joining the power supply connection portion and the power supply connection pin of the charging IC, and the power wiring joining the power supply connection portion and the power supply connection pin of the power conversion device share the wiring in a plurality of layers.

12. The power supply unit for an aerosol generating device according to any one of claims 3 to 6, including an operational amplifier for measuring the resistance of the heating unit, Among them, the operational amplifier is mounted on the first surface.

13. The power supply unit for an aerosol generating device according to any one of claims 3 to 6 and 12, including a protection IC for protecting the power supply, Among them, the protection IC is provided on the second surface.

14. An aerosol generating device, the aerosol generating device comprising: a heating unit for heating an aerosol source; a power supply for supplying power to the heating unit; a power conversion device for converting the power from the power supply and supplying heating power to the heating unit, and / or a heating switch for controlling the power supply to the heating unit; A charging IC that receives power from an external power source and performs control to supply charging power to the power source; and A board for mounting the charging IC, a power connection portion for supplying power from the power source, and the power conversion device and / or the heating switch, wherein the charging IC includes: A power supply voltage measurement pin for measuring the voltage of the power supply; and A power supply connection pin to which the voltage of the power supply is input, at least one of the power conversion device and the heating switch is arranged closer to the power connection portion than the charging IC, and the power supply voltage measurement pin of the charging IC is connected through a voltage measurement wiring to a position closer to the power connection portion than the power supply connection pin in a power supply wiring that joins the power connection portion and the power supply connection pin.

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