Flat micro-LED for headlight

Abstract

The invention relates to a vehicle headlight based on micro LEDs. The micro-LEDs may produce light of the same or similar intensity as existing headlight designs or are arranged in the panel at a density that meets legal requirements. These micro LED headlights may enable cheaper, more energy efficient, smaller, and / or more customizable headlights.

Description

[0001] Background Art and Technical Field

[0002] The present disclosure generally relates to the application of micro-LED lighting to automotive applications.

[0003] Due to the required brightness of vehicle headlights, these headlights typically occupy a large volume at the front of the vehicle.

[0004] Headlights can be costly, especially on larger vehicles or vehicles with computerized headlight control.

[0005] As a byproduct of generating light, headlights produce heat. This heat is wasted energy and can be harmful to the vehicle and human operator.

[0006] Headlights can be bulky and add weight, reducing the vehicle's speed, gas efficiency, and aerodynamics. They also make their storage and transportation more costly.

[0007] Although not the most expensive replacement part for a vehicle, headlights can still be costly, depending on the headlight technology used by the vehicle. The replacement cost of some bulbs can be as high as $100 per bulb, and some traditional LED headlights may require replacement of the entire headlight assembly. Summary of the Invention

[0008] The present invention relates to a micro-LED vehicle headlight system that includes: a micro-LED panel composed of a plurality of micro-LEDs; a substrate to which the micro-LED die are bonded; a connector that integrates the electronics of the micro-LED panel with the vehicle; and wherein the micro-LED panel performs the function of a vehicle headlight. Brief Description of the Drawings

[0009] In this specification, the terms "micro-LED" and "micro-device" may be used interchangeably.

[0010] Figure 1: Illustrates the integration of transferred micro-devices and electro-optic thin film devices in a hybrid structure according to an embodiment.

[0011] Figure 2: Illustrates a flat micro-LED panel for a headlight according to an embodiment.

[0012] Figure 3 : Illustrates a flat micro-LED panel for a headlight with a lens according to an embodiment.

[0013] Figure 4: Illustrates a flat micro-LED panel for a headlight laminated to a glass window according to an embodiment.

[0014] Figure 5: Illustrates a micro-LED patch located on a formed glass panel according to an embodiment.

[0015] Figure 6 : Illustrates a flat micro-LED panel for a headlamp having a plurality of micro-LED patterns according to an embodiment.

[0016] Figure 7 : Illustrates a flat micro-LED panel for a headlamp having a plurality of micro-LED regions according to an embodiment.

[0017] Figure 8: Illustrates a flat micro-LED panel for a headlamp having a protective layer according to an embodiment. Detailed Description

[0018] Embodiments of the present disclosure will be described more fully hereinafter with reference to the accompanying drawings, in which like numerals refer to like elements throughout the several views, and in which example embodiments are shown. However, the embodiments of the claims may be embodied in many different forms and should not be construed as limited to the embodiments set forth herein. The examples set forth herein are non-limiting examples and are merely examples and other possible examples. Embodiments also relate to structures, systems, and methods for interior and exterior lighting in an automobile.

[0019] Figure 1AAn example of integrating a transfer microdevice 106 with an electro-optic thin film device 112 in a hybrid structure is shown. This is an example of an integrated micro-LED die that is later picked and placed into a die array. It should be apparent to those skilled in the art that there are many ways to produce and integrate micro-LED dies in a die array according to US20160218143A1 - Microdevice integration into system substrate. In multiple hybrid structure embodiments, a receptor substrate 102 and contact pads 104 onto which an array of microdevices 106 is transferred and into which a thin film electro-optic device is integrated. The microdevices 106 can be transferred and bonded to the bonding pads 104 of the receptor substrate 100. In one case, a dielectric layer 108 is formed over the substrate 102 to cover the exposed electrodes and conductive layers. The dielectric layer 108 can be patterned using photolithography and etching. Then, a conductive layer 110 is deposited and patterned to form the bottom electrode of the thin film electro-optic device 112. If there is no risk of unwanted coupling between the bottom electrode 110 and other conductive layers in the receptor substrate, the dielectric layer 108 can be eliminated. However, this dielectric layer can also be used as a planarization layer to provide better fabrication of the electro-optic device 112. A dam layer 114 is deposited on the substrate 102 to cover the edges of the electrodes 110 and the microdevices 106. Then, the thin film electro-optic device 112 is formed over this structure. An organic LED (OLED) device is an example of a thin film electro-optic device, and the thin film electro-optic device can be formed using different techniques including but not limited to shadow masking, photolithography, and printing patterning. Finally, a top electrode 118 of the electro-optic thin film device 112 is deposited and, if needed, patterned. In embodiments where the thickness of the microdevices 106 is significantly high, breaks or other structural problems may occur within the bottom electrode 110. In these embodiments, a planarization layer can be used with or without the dielectric layer 108 to address this issue.

[0020] In another embodiment, the microdevice 106 can have a device electrode 116. This electrode can be common among other microdevices 106 in the system substrate. In this case, a planarization layer (if present) and / or a dam structure 114 covers the electrode 116 to avoid any short circuit between the electro-optic device 112 and the device electrode 116.

[0021] Figure 1BIllustrated is a structure of sharing a device among several pixels (or sub-pixels) after post-processing to deposit a common electrode and a color conversion layer. Here, the micro-device 106 is not fully patterned, but the horizontal condition is engineered such that the contact 104 defines the area allocated to each pixel. A system substrate 102 having contact pads 104 and a donor substrate having micro-devices 106. After transferring the micro-devices 106 to the system substrate 102, post-processing such as depositing a common electrode 120, a color conversion layer 122, color filters, etc. can be performed. However, the methods described in this disclosure and other possible methods can be used.

[0022] After forming the pixel (or sub-pixel) active region, the color conversion layer as described can be added to the active region. If the active region of the pixel (or sub-pixel) is covered by a reflective layer, this can provide a higher fill factor and higher performance and avoid color leakage from adjacent pixels (or sub-pixels). In another embodiment, the micro-device 106 is grown on a buffer / sacrificial layer.

[0023] Figure 2A Shows a flat micro-LED panel for a headlight. Figure 2B Shows a structure of a micro-LED panel that can include Figure 2A The element 202 can be a micro-LED panel that can be composed of one or more patches including a plurality of micro-LEDs. A plurality of small micro-LED patches can be integrated together into a larger flat panel. The panel can include micro-LEDs having a density that produces the same light as existing headlights. The panel can use RGB micro-LEDs or blue micro-LEDs having phosphors to obtain white light. The element 204 can be a substrate to which the micro-LED patches can be bonded. The substrate can be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate can also accommodate electronic devices connected to the micro-LEDs or bonded to these electronic devices. These electronic devices can be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of a circuit. The element 206 can be a micro-LED patch composed of a plurality of micro-LEDs. The element 208 can be a connector that allows Figure 2A the electronic devices of the micro-LED panel to be connected to the vehicle's electronic system. This can allow the micro-LED panel to be powered and controlled by the vehicle and provide feedback information to the vehicle. The element 210 can accommodate Figure 2AThe structure of a micro-LED panel. This structure can conform to the shape of the headlight in existing or upcoming vehicle models, so they can be interchangeable with non-micro-LED headlights. Element 212 can be a window that allows light from the micro-LEDs to pass through. The window can include glass, plastic, crystal, transparent or translucent materials, or any combination of these materials. The window can contain lenses or patterns that can diffuse, focus, polarize, block, redirect, or otherwise interact with the light from the micro-LEDs. Element 214 can be Figure 2A a micro-LED panel. Element 216 can be a bracket or base that holds the micro-LED panel in place relative to the vehicle. The bracket or base can also ensure that the electrical connection between the micro-LED panel and the vehicle does not disconnect. The micro-LED panel can be closer to the window compared to a typical headlight bulb, thus reducing the space required for the headlight. Although the initial cost of micro-LED headlights may be higher than that of traditional headlights, cost savings can be achieved in other aspects, such as replacement cost and energy cost. Micro-LEDs are more efficient than traditional headlights and thus generate less heat and waste less energy. Due to the reduced volume required, micro-LED headlights can be lighter compared to their traditional counterparts. Due to the small size of the micro-LED panel, the replacement cost of micro-LED headlights can be lower than that of other headlights, which means that the invasiveness of the replacement can be smaller and the replacement can be simple enough to be completed without the need for vehicle maintenance expertise.

[0024] Figure 3 shows a flat micro-LED panel for a headlight with a lens. Element 302 can be a micro-LED panel that can be composed of one or more patches containing multiple micro-LEDs. Multiple small micro-LED patches can be integrated together into a larger flat panel. The panel can contain micro-LEDs with a density that produces the same light as existing headlights. The panel can use RGB micro-LEDs or blue micro-LEDs with phosphors to obtain white light. Element 304 can be a substrate to which the micro-LED patches can be bonded. The substrate can be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate can also accommodate or incorporate electronics connected to the micro-LEDs. These electronics can be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of the circuit. Element 306 can be a micro-LED patch composed of multiple micro-LEDs. Element 308 can be an element that allows Figure 3An electronic device of a micro-LED panel is connected to a connector of an electronic system of a vehicle. This allows the micro-LED panel to be powered and controlled by the vehicle and to provide feedback information to the vehicle. Element 310 can be a lens, which can allow the micro-LEDs to be focused on a fixed position on the road. The lens can be connected to or embedded in the substrate. The lens can include glass, plastic, crystal, transparent or translucent materials, or any combination of these materials. The lens can diffuse, focus, polarize, block, redirect, or otherwise interact with the light from the micro-LEDs. The micro-LED panel may not require a window or empty space between the light source and the lens, thus reducing the space required for the headlight. Although the initial cost of micro-LED headlights may be higher than that of traditional headlights, cost savings can be achieved in other aspects, such as replacement cost and energy cost. Micro-LEDs are more efficient than traditional headlights, generate less heat, and waste less energy. Due to the reduced volume required, micro-LED headlights can be lighter than their traditional counterparts. Due to the small size of the micro-LED panel, the replacement cost of micro-LED headlights can be lower than that of other headlights, which means that the replacement can be less invasive and simple enough to be completed without vehicle maintenance expertise. Due to the close distance between the lens and the light source, the micro-LED panel can be externally connected to the vehicle.

[0025] Figure 4A Shows a flat micro-LED panel for a headlight laminated to a glass window. Figure 4B Shows Figure 4A An isometric view and a laminated structure of. Element 402 can be a micro-LED panel that can be composed of one or more patches containing multiple micro-LEDs. Multiple small micro-LED patches can be integrated together into a larger flat panel. The panel can contain micro-LEDs having a density that produces the same light as existing headlights. The panel can use RGB micro-LEDs or blue micro-LEDs with phosphors to obtain white light. Element 404 can be a substrate to which the micro-LED patches can be bonded. The substrate can be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate can also accommodate or incorporate electronic devices connected to the micro-LEDs. These electronic devices can be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of the circuit. Element 406 can be a micro-LED patch composed of multiple micro-LEDs. Element 408 can be a Figure 4AThe electronic device of the micro-LED panel is connected to a connector of the electronic system of the vehicle. This allows the micro-LED panel to be powered and controlled by the vehicle and to provide feedback information to the vehicle. Element 410 can be a laminated material such as plastic or epoxy resin that coats the micro-LED panel and adheres the micro-LED panel to the window pane. The laminated material can also protect the electronics or other fragile components of the micro-LED panel. Element 412 can be the entire laminated structure, including Figure 4A the laminated micro-LED and the glass housing. Element 414 can be the glass housing to which the micro-LED panel is adhered by the laminated material. The glass housing can be shaped such that it can be attached to the vehicle at multiple locations, not just the locations where traditional headlights might be. The glass housing can be an existing glass or other glass-like material that is already part of the vehicle, such as an existing headlight housing, windshield, window, etc. Element 416 can be Figure 4A the micro-LED panel. The micro-LED panel can be laminated to the window, thus reducing the space required for the headlight. Although the initial cost of the micro-LED headlight may be higher than that of a traditional headlight, cost savings can be achieved in other aspects, such as replacement cost and energy cost. The micro-LED is more efficient than a traditional headlight, generates less heat, and wastes less energy, which means that the micro-LED panel does not require as much space for ventilation. Due to the reduced volume required, the micro-LED headlight can be lighter than its traditional counterpart. Due to the small size of the micro-LED panel, the replacement cost of the micro-LED headlight can be lower than that of other headlights, which means that the replacement can be less invasive and simple enough to be completed without vehicle maintenance expertise.

[0026] Figure 5Shows a micro-LED patch located on a formed glass panel. Element 502 can be a micro-LED panel composed of one or more patches containing multiple micro-LEDs, and the one or more patches are located on or in the formed glass. The micro-LED patch can be embedded or integrated into the formed glass. The micro-LED patch can be fixed to a flexible substrate, which is then laminated or otherwise adhered to the formed glass. Multiple small micro-LED patches can be integrated together into a larger flat panel. The panel can contain micro-LEDs having a density that produces the same light as existing headlamps. The panel can use RGB micro-LEDs or blue micro-LEDs with phosphors to obtain white light. Element 504 can be the formed glass to which the micro-LED patch can be bonded. The glass can be made of any material other than silica glass, such as silicon, sapphire, any other substrate known in the art, any material to which the micro-LED patch can be bonded, or any combination of these materials. The glass can be formed as a single piece or a combination of connected glass plates. Element 506 can be a micro-LED patch composed of multiple micro-LEDs located on the forward-facing portion of the formed glass. Element 508 can be a micro-LED patch composed of multiple micro-LEDs located on the angled portion of the formed glass. Element 510 can be a micro-LED patch composed of multiple micro-LEDs located on the second angled portion of the formed glass. Element 512 can be Figure 5 a connector that allows the electronic device of the micro-LED panel to be connected to the vehicle's electronic system. This can allow the micro-LED panel to be powered and controlled by the vehicle and provide feedback information to the vehicle. The micro-LED panel can be closer to the window compared to a typical headlamp bulb, thereby reducing the space required for the headlamp. Although the initial cost of a micro-LED headlamp may be higher than that of a traditional headlamp, it can save costs in other aspects, such as replacement cost and energy cost. Micro-LEDs are more efficient than traditional headlamps, generate less heat, and waste less energy. Due to the reduced volume required, micro-LED headlamps can be lighter than their traditional counterparts. Due to the small size of the micro-LED panel, the replacement cost of micro-LED headlamps can be lower than that of other headlamps, which means that the replacement can be less invasive and simple enough to be completed without vehicle maintenance expertise.

[0027] Figure 6Displays a flat micro-LED panel for a headlight having multiple micro-LED patterns. Element 602 can be a micro-LED panel that can be composed of one or more patches containing multiple micro-LEDs. Multiple small micro-LED patches can be integrated together into a larger flat panel. The panel can contain micro-LEDs having a density that produces the same light as existing headlights. The panel can use RGB micro-LEDs or blue micro-LEDs with phosphors to obtain white light. Different-shaped micro-LED patches can be used to create patterns. When these specific patches are activated, these patterns can be used for the aesthetic effect of the final light projected, to organize light patterns (such as high beam or low beam), or to indicate direction (left or right). Element 604 can be a substrate to which the micro-LED patches can be bonded. The substrate can be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate can also house electronics connected to the micro-LEDs or bonded to these electronics. These electronics can be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of the circuit. Element 606 can be a first type of micro-LED patch composed of multiple micro-LEDs. Element 608 can be a second type of micro-LED patch composed of multiple micro-LEDs, the second type of micro-LED patch having a different shape, structure, color, or other differentiating factor from the first type of micro-LED patch. Element 610 can be a connector that allows Figure 6 the electronic devices of the micro-LED panel to be connected to the vehicle's electronic system. This can allow the micro-LED panel to be powered and controlled by the vehicle and to provide feedback information to the vehicle. The micro-LED panel can be closer to the window compared to a typical headlight bulb, thereby reducing the space required for the headlight. Although the initial cost of the micro-LED headlight may be higher than that of a traditional headlight, cost savings can be achieved in other aspects, such as replacement cost and energy cost. In addition, the patterned micro-LED headlight can provide multiple functions and replace more than one light on the vehicle. For example, the micro-LED panel can be used as both a headlight and a turn signal. Micro-LEDs are more efficient than traditional headlights and thus produce less heat and waste less energy. Due to the reduced volume required, the micro-LED headlight can be lighter than its traditional counterpart. Due to the small size of the micro-LED panel, the replacement cost of the micro-LED headlight can be lower than that of other headlights, which means that the replacement can be less invasive and simple enough to be completed without vehicle maintenance expertise.

[0028] Figure 7Disclosed is a flat micro-LED panel for a headlight having multiple micro-LED regions. Element 702 can be a micro-LED panel that can be composed of one or more patches containing multiple micro-LEDs. Multiple small micro-LED patches can be integrated together into a larger flat panel. The panel can contain micro-LEDs having a density that produces the same light as existing headlights. The panel can use RGB micro-LEDs or blue micro-LEDs with phosphors to obtain white light. Different groups of micro-LED patches can be used to produce regions. These regions can represent high beam, low beam, turn signal, night light, driving light, various colors, densities, etc. Element 704 can be a substrate to which the micro-LED patches can be bonded. The substrate can be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate can also house electronics connected to the micro-LEDs or bonded to these electronics. These electronics can be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of a circuit. Element 706 can be a micro-LED patch composed of multiple micro-LEDs in a first region. Element 708 can be a micro-LED patch composed of multiple micro-LEDs in a second region that is different from the first region in terms of position, intensity of the micro-LED patch, color of the micro-LED patch, orientation, any other differentiating factor or any combination of factors. Element 710 can be a connector that allows Figure 7 the electronics of the micro-LED panel to be connected to the vehicle's electronic system. This can allow the micro-LED panel to be powered and controlled by the vehicle and provide feedback information to the vehicle.

[0029] Figure 8A Disclosed is a flat micro-LED panel for a headlight having a protective layer. Figure 8B Disclosed is Figure 8A a side view of. Element 802 can be a micro-LED panel that can be composed of one or more patches containing multiple micro-LEDs. Multiple small micro-LED patches can be integrated together into a larger flat panel. The panel can contain micro-LEDs having a density that produces the same light as existing headlights. The panel can use RGB micro-LEDs or blue micro-LEDs with phosphors to obtain white light. Element 804 can be a substrate to which the micro-LED patches can be bonded. The substrate can be silicon, glass, sapphire, any other substrate known in the art, any material to which the micro-LED patches can be bonded, or any combination of these materials. The substrate can also house electronics connected to the micro-LEDs or bonded to these electronics. These electronics can be contained within the substrate, tunnel through the substrate to reach the micro-LEDs, or use the substrate as part of a circuit. Element 806 can be a micro-LED patch composed of multiple micro-LEDs. Element 808 can be a connector that allows Figure 8AAn electronic device of a micro-LED panel is connected to a connector of an electronic system of a vehicle. This allows the micro-LED panel to be powered and controlled by the vehicle and to provide feedback information to the vehicle. Element 810 can be a protective layer. The protective layer can protect against environmental and / or vibration damage. The protective layer can be made of glass, epoxy resin, plastic, metal, other protective materials, or any combination of protective materials. The protective layer can be hermetically sealed. Element 812 can be the micro-LED panel of Element 802. Element 814 can be the protective layer of Element 810. Element 816 can be the micro-LED chip of Element 806. Element 818 can be the substrate of Element 804. The micro-LED panel can be closer to the window compared to a typical headlight bulb, thus reducing the space required for the headlight. Although the initial cost of a micro-LED headlight may be higher than that of a traditional headlight, cost savings can be achieved in other aspects, such as replacement cost and energy cost. Micro-LEDs are more efficient than traditional headlights, generate less heat, and waste less energy. Due to the reduced volume required, micro-LED headlights can be lighter compared to their traditional counterparts. Due to the small size of the micro-LED panel, the replacement cost of micro-LED headlights can be lower than that of other headlights, which means that the replacement can be less invasive and simple enough to be completed without the need for vehicle maintenance expertise. Compared to traditional headlights, the protective seal can reduce the rate at which micro-LED headlights need to be replaced.

[0030] Functions performed in processes and methods can be implemented in different orders. Additionally, the steps and operations outlined are provided only as examples, and some steps and operations can be optional, combined into fewer steps and operations, or expanded into additional steps and operations without departing from the essence of the disclosed embodiments.

Claims

1. A micro-LED vehicle headlight system, comprising: A micro-LED panel composed of a plurality of micro-LEDs; A substrate to which the micro-LED patches are bonded; A connector that integrates the electronics of the micro-LED panel with the vehicle; and Wherein the micro-LED panel performs the function of a vehicle headlight.

2. The system according to claim 1, wherein the micro-LED panel is composed of one or more micro-LED patches each containing a plurality of micro-LEDs.

3. The system according to claim 2, wherein a plurality of small micro-LED patches are integrated together into a larger flat panel.

4. The system according to claim 2, wherein the panel contains a certain density of micro-LEDs to enable the generation of the same light as conventional LED and non-LED headlights.

5. The system according to claim 2, wherein the panel uses RGB micro-LEDs or blue micro-LEDs with phosphors to obtain white light.

6. The system according to claim 2, wherein the substrate is one of silicon, glass, sapphire, or any material to which the micro-LED patches are bonded, or any combination of these materials.

7. The system according to claim 2, wherein the substrate further houses or is bonded to electronics connected to the micro-LEDs.

8. The system according to claim 2, wherein the first element is a connector that allows the electronics of the panel to be connected to the vehicle's electronic system, and the vehicle's electronic system further allows the micro-LED panel to be powered and controlled by the vehicle and provides feedback information to the vehicle.

9. The system according to claim 2, wherein the second element is a structure that houses the micro-LED panel and conforms to the shape of the headlight.

10. The system according to claim 9, wherein the shape can be interchanged with the non-micro-LED headlights of existing vehicles.

11. The system according to claim 2, wherein the third element is a window that allows light from the micro-LEDs and is composed of glass, plastic, crystal, transparent or translucent material, or any combination of these materials, and further, the window contains a lens or pattern that diffuses, focuses, polarizes, blocks, redirects, or otherwise interacts with the light from the micro-LEDs.

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