Dual-power intelligent temperature adjusting system based on semiconductor thermoelectric refrigeration technology

Abstract

The invention relates to the technical field of semiconductors, in particular to a dual-power intelligent temperature adjusting system based on a semiconductor thermoelectric refrigeration technology, and aims to solve the problems that the semiconductor thermoelectric technology is not applied to potted plants in the market, human resources are occupied, the watering amount is not easy to control, and the operation is inconvenient. The dual-power intelligent temperature adjusting system based on the semiconductor thermoelectric refrigeration technology comprises a base, a soil groove is formed in the base, a collecting box is arranged on the base, a plurality of air holes are formed in the outer surface of the collecting groove, a U-shaped scraping frame capable of conducting circular motion is installed in the collecting groove, and a plurality of scraping pieces are installed on the U-shaped scraping frame. A shovel piece is further installed at the bottom of the U-shaped scraping frame, when the U-shaped scraping frame moves circumferentially, the inner wall of the collecting groove can be scraped, meanwhile, the scraping piece can move up and down, and the shovel piece can move left and right to clean the U-shaped scraping frame; an electric control valve is arranged at the bottom of the collecting tank; the problems that an existing temperature adjusting system occupies manpower resources, and the watering amount is not easy to control can be solved.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor technology, and more particularly to a dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology. Background Art

[0002] With the continuous development of technology, the demand for precise temperature control is increasing in many fields, such as heat dissipation of electronic devices, temperature control of medical devices, food preservation, plant potted plants, etc. Semiconductor thermoelectric refrigeration technology is based on the Peltier effect and has the advantages of small size, light weight, no mechanical transmission components, fast response speed, and switchable refrigeration and heating, and has been widely used in the field of temperature regulation; there is no application of semiconductor thermoelectric technology to plant potted plants in the market. For some special ornamental plants, they need to grow at room temperature and also need regular irrigation, weeding and cleaning, etc. At present, the operations of irrigation and weeding are all manually processed, which not only occupies human resources, but also the manual watering method is prone to over-watering or under-watering.

[0003] Therefore, it is of great practical significance to develop a temperature control system based on semiconductor thermoelectric refrigeration technology with high reliability and high intelligence. Summary of the Invention

[0004] Aiming at the fact that semiconductor thermoelectric technology has not been applied to plant potted plants in the market, and during the operations of plant irrigation and weeding, it occupies human resources and the amount of watering is not easy to control, the present invention provides a dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology to solve the problems of occupying human resources and difficult control of the amount of watering existing in the existing temperature control system, and effectively solves the problems mentioned in the above background art.

[0005] The technical solution adopted by the present invention to solve the above problems is as follows: A dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology, including a base, a soil groove is provided in the base, a collection box is provided on the base, a top cover is provided on the collection box, a thermoelectric semiconductor chip is installed on the top cover, a collection groove is provided in the collection box, a plurality of ventilation holes are provided on the outer surface of the collection groove, a U-shaped scraping frame capable of circular motion is installed in the collection groove, a plurality of scraping blades are installed on the U-shaped scraping frame, and a shovel blade is further installed at the bottom of the U-shaped scraping frame. When the U-shaped scraping frame moves in a circle, it can scrape the inner wall of the collection groove, and at the same time, the scraping blades can move up and down, and the shovel blade can move left and right to clean the U-shaped scraping frame; an electric control valve is provided at the bottom of the collection groove.

[0006] A first card slot matching with the collection box is provided on the base, so that the collection box can be detachably installed on the base, and a second card slot matching with the top cover is provided on the collection box, so that the top cover can be detachably installed on the collection box.

[0007] A heat dissipation plate is provided on the upper end face of the thermoelectric semiconductor chip, and a water collecting panel is provided on the lower end face of the thermoelectric semiconductor chip.

[0008] A motor is fixedly connected to the inner wall of the collection tank, a small spur gear is fixedly connected to the output end of the motor, a toothed ring is meshed on the outer surface of the small spur gear, and the U-shaped scraping frame is fixedly connected to one side of the lower end surface of the toothed ring.

[0009] A vertically movable rod is installed on the U-shaped scraping frame, shovel blades are fixedly connected to both end faces of the vertical rod, an I-shaped seat is slidably connected to the inner wall of the U-shaped scraping frame, a scraping blade is fixedly connected to the I-shaped seat, a first sliding pin is slidably connected to one side of the I-shaped seat, a guide frame is fixedly connected to the inner wall of the U-shaped scraping frame, an inclined slot matching with the first sliding pin is formed on the guide frame, and a vertical slot matching with the first sliding pin is formed on the vertical rod.

[0010] A second sliding pin is fixedly connected to the lower end surface of the vertical rod, and a polygonal track groove matching with the second sliding pin is provided on the inner wall of the bottom end of the collection tank.

[0011] A sewage outlet is further provided at the bottom of the collection tank, an installation box is arranged in the sewage outlet, convex seats matching with the U-shaped scraping frame are respectively installed on both sides of the installation box, blocking doors are respectively installed on both sides of the bottom of the installation box, and when the two convex seats move outward, the blocking doors can be moved outward to open the sewage outlet.

[0012] The convex seats are respectively slidably connected to the inner walls of the front and rear ends of the installation box, installation slots are respectively formed on the inner walls of the left and right ends of the installation box, the blocking doors are respectively slidably connected to the corresponding installation slots, first springs matching with the blocking doors are respectively arranged on both sides of the bottom of the installation slots, guide plates are fixedly connected to both end faces of the blocking doors, two third sliding pins are fixedly connected to the lower end surfaces of the convex seats, and inclined key grooves matching with the third sliding pins are respectively formed on the guide plates.

[0013] The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology includes; A dual-power switching module, which is connected to two independent power supplies and is used for automatically detecting the power supply state and switching to the backup battery power supply when the mains power supply fails; A semiconductor thermoelectric refrigeration module, which is composed of a plurality of semiconductor thermoelectric refrigeration chips and realizes refrigeration or heating according to the magnitude and direction of the current; a temperature detection module, which uses a high-precision temperature sensor to collect temperature data and transmits it to the intelligent control module; An intelligent control module, which receives the temperature data, compares it with the preset target temperature, adjusts the working current of the semiconductor thermoelectric refrigeration module through PWM technology, and simultaneously monitors the state of the dual-power switching module and has a communication function.

[0014] The dual - power switching module uses a power - switching chip with over - voltage, under - voltage, and over - current protection functions, and realizes automatic switching by detecting the voltage and current of the mains power supply; the cooling chips in the semiconductor thermoelectric refrigeration module are connected in series or parallel according to the required refrigeration and heating power; the temperature sensor in the temperature detection module is connected to the analog input pin of the intelligent control module through a shielded wire.

[0015] The present invention has the following advantages compared with the prior art: During use, when the thermoelectric semiconductor chip works, a thermal - cold difference can be formed on both end faces of the thermoelectric semiconductor chip, making the upper end face of the thermoelectric semiconductor chip a hot surface, which can dissipate heat to the surrounding of the plant, provide a certain room temperature for the plant, and is beneficial to the survival and growth of the plant, etc. When the lower cold surface of the thermoelectric semiconductor chip cools, the moisture in the air can come into contact with the water - collecting panel. Due to the relatively low temperature of the water - collecting panel, the moisture in the air can condense on the water - collecting panel. When the water droplets gather to a larger size, they can fall into the collection tank under the action of gravity, thereby collecting the moisture in the air and dehumidifying the moisture during the collection process; through the rotatable rotary valve, when the rotary valve rotates and opens, the water in the collection tank can be released into the soil pot to irrigate the plant; through the set storage battery and photovoltaic power generation panel, when the photovoltaic power generation panel works, it can convert solar energy into electrical energy and store it in the storage battery, and the storage battery can supply power to electrical components such as the thermoelectric semiconductor. Brief Description of the Drawings

[0016] Figure 1 Isometric view of the dual - power intelligent temperature - regulating system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0017] Figure 2 Installation schematic diagram of the collection box of the dual - power intelligent temperature - regulating system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0018] Figure 3 Base cross - sectional view of the dual - power intelligent temperature - regulating system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0019] Figure 4 Installation schematic diagram of the electric control valve of the dual - power intelligent temperature - regulating system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0020] Figure 5 Structural schematic diagram of the collection box of the dual - power intelligent temperature - regulating system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0021] Figure 6 Structural schematic diagram of the top cover of the dual - power intelligent temperature - regulating system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0022] Figure 7Cross-sectional view of the collection box of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0023] Figure 8 Schematic diagram of the installation of the gear ring of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0024] Figure 9 Schematic diagram of the installation of the I-shaped seat of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0025] Figure 10 Cross-sectional view of the installation box of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0026] Figure 11 Schematic diagram of the installation of the blocking door of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology of the present invention.

[0027] Reference numerals in the figure: 1 - base, 2 - collection box, 3 - soil trough, 4 - electric control valve, 5 - ventilation hole, 6 - top cover, 7 - thermoelectric semiconductor chip, 8 - water collection panel, 9 - heat dissipation plate, 10 - motor, 11 - small spur gear, 12 - gear ring, 13 - U-shaped scraping frame, 14 - I-shaped seat, 15 - scraping blade, 16 - first sliding pin, 17 - guiding frame, 18 - inclined groove, 19 - vertical rod, 20 - vertical groove, 21 - shoveling blade, 22 - second sliding pin, 23 - polygonal track groove, 24 - installation box, 25 - convex seat, 26 - third sliding pin, 27 - guiding plate, 28 - inclined keyway, 29 - blocking door, 30 - anti-detachment pad, 31 - first spring, 32 - water level detector. Detailed implementation manners

[0028] The following are specific embodiments of the present invention, and the technical solutions of the present invention are further described in conjunction with the accompanying drawings, but the present invention is not limited to these embodiments.

[0029] First embodiment: As Figures 1-11 shown, the present invention provides a dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology, including a base 1, a soil trough 3 is provided in the base 1, a collection box 2 is provided on the base 1, a top cover 6 is provided on the collection box 2, a thermoelectric semiconductor chip 7 is installed on the top cover 6, a collection groove is provided in the collection box 2, a plurality of ventilation holes 5 are provided on the outer surface of the collection groove, a U-shaped scraping frame 13 capable of circular motion is installed in the collection groove, a plurality of scraping blades 15 are installed on the U-shaped scraping frame 13, and a shoveling blade 21 is further installed at the bottom of the U-shaped scraping frame 13. When the U-shaped scraping frame 13 moves circularly, the inner wall of the collection groove can be scraped, and at the same time, the scraping blade 15 can move up and down, and the shoveling blade 21 can move left and right to clean the U-shaped scraping frame 13; an electric control valve 4 is provided at the bottom of the collection groove.

[0030] As Figures 1-11 shown, the base 1 is used to support the entire potted plant. Through the provided soil trough 3, the soil trough 3 is filled with soil, and the ornamental plant is planted in the soil. The thermoelectric semiconductor chip 7 is embedded in the top cover 6. The upper end of the thermoelectric semiconductor is the hot surface and the lower end is the cold surface. When the thermoelectric semiconductor chip 7 works, it can heat the upper end of the top cover 6, thereby heating the surrounding environment of the plant and making the plant in a suitable living environment. When the thermoelectric semiconductor chip 7 works, it can also cool the lower end of the top cover 6. The moisture in the air can contact the water collection panel 8. Since the temperature of the water collection panel 8 is relatively low, the moisture in the air can condense on the water collection panel 8. When the water droplets gather to a larger size, they can fall into the collection trough under the action of gravity, thereby collecting the moisture in the air and dehumidifying the air during the collection process. Through the provided ventilation holes 5, the flow of gas can be accelerated, so as to better collect the moisture in the air, dehumidify, etc. Through the installed electric control valve 4, the water in the collection trough can be released and the plant can be irrigated regularly, which can replace manual irrigation, saving time and effort, and the electric control valve 4 can be set. A through hole is opened in the middle of the collection box 2, and the through hole is used to accommodate the plant stem and can keep the soil ventilated. Since a large amount of dust will adhere to the inner wall of the collection trough after long-term use, through the provided U-shaped scraping frame 13, when the U-shaped scraping frame 13 moves circumferentially, it can scrape the inner wall of the collection trough and centrally clean the dust adhering to the inner wall of the collection trough. When the U-shaped scraping frame 13 moves circumferentially, it can also move the scraping blade 15 up and down and the shoveling blade 21 left and right to scrape the dust adhering to the U-shaped scraping frame 13, so as to clean the dust inside the collection trough more cleanly, and can be fully automated to clean, reducing the labor intensity of users. In the traditional plant potted plant maintenance method, in terms of humidity control, ventilation and other means are often used to reduce humidity, and ventilation is greatly affected by the outdoor environment and has poor effects in closed spaces or extreme weather. As for irrigation, the manual watering method relies on manpower and is prone to overwatering or underwatering, which not only occupies manpower but also has an adverse impact on plant growth. By controlling the thermoelectric semiconductor chip 7 through the dual-power intelligent temperature control system and using it in the plant potted plant technology, it can not only automatically irrigate and reduce the occupation of human resources, but also control humidity, automatically heat, etc., providing a good living environment for the plant and being able to rely on the backup power supply to work when power is off, providing double protection for the plant.

[0031] A first card slot matching the collection box 2 is opened on the base 1, so that the collection box 2 can be detachably installed on the base 1. A second card slot matching the top cover 6 is opened on the collection box 2, so that the top cover 6 can be detachably installed on the collection box 2.

[0032] As Figures 4-5As shown, the collection box 2 and the first card slot are in interference fit, enabling the collection box 2 to be disassembled for easy regular soil replacement; the top cover 6 and the second card slot are in interference fit, enabling the top cover 6 to be disassembled for easy regular inspection of the interior of the collection box 2.

[0033] A heat dissipation plate 9 is provided on the upper end surface of the thermoelectric semiconductor chip 7, and a water collection panel 8 is provided on the lower end surface of the thermoelectric semiconductor chip 7.

[0034] As Figure 6 shown, the upper end surface of the thermoelectric semiconductor chip 7 is the heat dissipation surface, and the lower end surface is the refrigerating surface. One or more thermoelectric semiconductor chips 7 can be provided. Through the provided heat dissipation plate 9, heating in the surrounding environment can be more uniform, and the heat dissipation efficiency of the thermoelectric semiconductor chip 7 can be accelerated. Through the provided water collection panel 8, the refrigerating surface of the thermoelectric semiconductor chip 7 can be sealed to prevent water from infiltrating into the thermoelectric semiconductor chip 7, and it can absorb heat from the surrounding to cool down, so that the moisture in the air condenses on the water collection panel 8.

[0035] A motor 10 is fixedly connected to the inner wall of the collection groove. The output end of the motor 10 is fixedly connected to a small spur gear 11. A gear ring 12 is meshed on the outer surface of the small spur gear 11. The U-shaped scraping frame 13 is fixedly connected to one side of the lower surface of the gear ring 12.

[0036] As Figures 7-8 shown, the motor 10 can provide a driving force for the small spur gear 11. The gear ring 12 is rotatably connected in the collection groove. When the gear ring 12 rotates, it can drive the U-shaped scraping frame 13 to move in a circle, so that the U-shaped scraping frame 13 moves in a circle. The motor 10 is a prior art and will not be elaborated.

[0037] A vertically movable vertical rod 19 is installed on the U-shaped scraping frame 13. Shoveling blades 21 are fixedly connected to both side end faces of the vertical rod 19. An I-shaped seat 14 is slidably connected to the inner wall of the U-shaped scraping frame 13. A scraping blade 15 is fixedly connected to the I-shaped seat 14. A first sliding pin 16 is slidably connected to one side of the I-shaped seat 14. A guide frame 17 is fixedly connected to the inner wall of the U-shaped scraping frame 13. An inclined slot 18 matching with the first sliding pin 16 is formed on the guide frame 17. A vertical slot 20 matching with the first sliding pin 16 is formed on the vertical rod 19.

[0038] As Figure 9 shown, the I-shaped seat 14 can slide up and down on the inner wall of the U-shaped scraping frame 13, and the vertical rod 19 can slide left and right on the U-shaped scraping frame 13. The shoveling blades 21 and the scraping blade 15 are installed as Figure 9As shown, one or more scraping blades 21 and cleaning blades 15 can be provided. Small sliders are provided on the inner wall of the I-shaped seat 14, and the small sliders can slide left and right on the inner wall of the I-shaped seat 14. The first sliding pin 16 is fixedly connected to the small slider, that is, it is equivalent to the first sliding pin 16 being able to slide left and right on the inner wall of the I-shaped seat 14, and when the first sliding pin 16 moves up and down, it can drive the I-shaped seat 14 to move up and down; through the arranged first sliding pin 16, guide frame 17, inclined groove 18, vertical rod 19 and vertical groove 20, when the vertical rod 19 moves to the right, under the engagement of the vertical groove 20 and the first sliding pin 16, it can drive the first sliding pin 16 to move to the right on the I-shaped seat 14. When the first sliding pin 16 moves to the right, under the engagement with the inclined groove 18, the first sliding pin 16 can move downward and to the right at the same time. When the first sliding pin 16 moves downward, it can drive the I-shaped seat 14 and the cleaning blade 15 to move downward. Similarly, when the vertical rod 19 and the scraping blade 21 move to the left, it can drive the first sliding pin 16, the I-shaped seat 14, the cleaning blade 15, etc. to move upward synchronously, that is, when the vertical rod 19 reciprocates left and right, it can drive the scraping blade 21 to reciprocate left and right and the cleaning blade 15 to reciprocate up and down to clean the outer surface of the U-shaped scraping frame 13.

[0039] A second sliding pin 22 is fixedly connected to the lower end surface of the vertical rod 19, and a polygonal track groove 23 that cooperates with the second sliding pin 22 is provided on the inner wall of the bottom end of the collection tank.

[0040] As Figure 7 and Figure 9 shown, when the U-shaped scraping frame 13 moves circularly, it can drive the vertical rod 19, the second sliding pin 22, etc. to move circularly synchronously. Through the cooperation of the polygonal track groove and the second sliding pin 22, when the U-shaped scraping frame 13, the vertical rod 19, and the second sliding pin 22 move circularly, the second sliding pin 22 can reciprocate left and right under the engagement with the polygonal track groove 23, that is, the second sliding pin 22 and the vertical rod 19 reciprocate left and right, thereby driving the cleaning blade 15 and the scraping blade 21 to move.

[0041] A sewage discharge port is further provided at the bottom of the collection tank. An installation box 24 is provided in the sewage discharge port. Convex seats 25 that cooperate with the U-shaped scraping frame 13 are respectively installed on both sides of the installation box 24. Plug doors 29 are respectively installed on both sides of the bottom of the installation box 24. When the two convex seats 25 move outward, the plug doors 29 can be driven to move outward to open the sewage discharge port.

[0042] As Figures 10-11As shown, through the provided sewage outlet, when cleaning the dust inside the collection tank, the sewage outlet can be opened, and the dust falls into the lower end, that is, the soil tank 3 or the outside under the action of gravity; the installation box 24 is used to install the boss 25, the blocking door 29 and other components, and the two blocking doors 29 are in the innermost end state under normal conditions, that is, the sewage outlet is in a closed state, and rubber pads are respectively provided on the inner end surfaces of the two blocking doors 29 to enhance the sealing performance; when the U-shaped scraper 13 moves in a circle to remove dust from the collection tank, the U-shaped scraper 13 moves to a designated position to meet the corresponding two bosses 25, and the two bosses 25 can be moved outwards under the drive of the U-shaped scraper 13, and the two bosses 25 can be driven when the bosses 25 move outwards The blocking door 29 moves outward and opens, thereby discharging the dust scraped from the U-shaped scraper 13 to the outside; when the U-shaped scraper 13 loses contact with the convex seat 25, the corresponding blocking door 29 and the convex seat 25 can move inward to the initial position under the elastic force of the first spring 31, that is, the first spring 31 drives the blocking door 29, the convex seat 25, etc. to move inward to close the sewage outlet. The two convex seats 25 are set to different sizes. Since the inner and outer ends of the U-shaped scraper 13 have a radius difference, the speed of the circular movement is also different. The two convex seats 25 of different sizes cooperate with the inner and outer ends of the U-shaped scraper 13 respectively, so that the two convex seats 25 can move outward synchronously, thereby driving the two sides of the blocking door 29 to open synchronously.

[0043] The bosses 25 are respectively slidably connected to the inner walls at the front and rear ends of the installation box 24, and the inner walls at the left and right ends of the installation box 24 are respectively provided with installation grooves. The blocking door 29 is respectively slidably connected to the corresponding installation grooves. First springs 31 matching with the blocking door 29 are respectively provided on both sides of the bottom of the installation groove. Guide plates 27 are respectively fixedly connected to the end surfaces on both sides of the blocking door 29. Two third sliding pins 26 are fixedly connected to the lower end surface of the bosses 25, and oblique key grooves 28 matching with the third sliding pins 26 are respectively provided on the guide plates 27.

[0044] like Figures 10-11 As shown, the front, rear, left, and right directions of the mounting box 24 are Figure 10 For example, the convex seat 25 is arranged on the inner wall at the left and right ends of the installation box 24, and the convex seat 25 can be slidably connected to the inner wall of the installation box 24 in the front and rear directions, and the blocking door 29 is respectively slidably connected to the inner wall of the installation groove in the left and right directions. The outer end faces of the two blocking doors 29 are respectively fixed with anti-slip pads 30, and the anti-slip pads 30 are slidably connected to the inner wall of the installation groove. The function of the anti-slip pads 30 is to prevent the blocking door 29 from being separated from the installation groove; one end of the first spring 31 is fixed to the anti-slip pad 30, and the other end is fixed to the inner wall at the bottom end of the installation groove. The first spring 31 always has an inward driving force on the anti-slip pad 30 and the blocking door 29, so that the blocking door 29 is in the innermost end state under normal conditions; the installation and shape of the guide plate 27, the third sliding pin 26, and the oblique key groove 28 are as shown in Figure 11As shown, when the U-shaped scraping frame 13 moves circumferentially to meet the two convex seats 25 and causes the convex seats 25 to move outward, it can drive the third sliding pin 26 to move outward. When the third sliding pin 26 moves outward, through meshing with the inclined key groove 28, it can drive the guide plate 27 and the door stopper 29 to move outward synchronously. When the door stopper 29 moves outward, it can open the sewage outlet and compress the first spring 31. When the U-shaped scraping frame 13 moves out of contact with the convex seat 25, the door stopper 29 will move inward and reset under the elastic force of the first spring 31, and the convex seat 25 will move inward and reset to the initial position; a water level detector 32 is also provided on the collection tank. The water level detector 32 is used to detect the water level line in the collection tank. When the water level line reaches the specified height, it can trigger the water level detector 32 to trigger an alarm and power-off process, so that the thermoelectric semiconductor chip 7 stops working to prevent water overflow. The water level detector 32 is a prior art and will not be elaborated.

[0045] Second Embodiment: Most temperature control systems are powered by a single power supply. When the power supply fails or the power supply is unstable, it will cause the temperature control system to fail to work properly, affecting the normal operation of the equipment; on the other hand, the existing temperature control systems have a low degree of intelligence and often cannot automatically and accurately adjust the temperature according to the ambient temperature and load changes, resulting in low temperature adjustment accuracy and low energy utilization efficiency.

[0046] The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology includes; A dual-power switching module, connected to two independent power supplies, for automatically detecting the power supply status and switching to the backup battery power supply when the mains power supply fails; A semiconductor thermoelectric refrigeration module, composed of multiple semiconductor thermoelectric cooling chips, for realizing refrigeration or heating according to the magnitude and direction of the current; a temperature detection module, using a high-precision temperature sensor to collect temperature data and transmit it to the intelligent control module; An intelligent control module, receiving the temperature data and comparing it with the preset target temperature, adjusting the working current of the semiconductor thermoelectric refrigeration module through PWM technology, and simultaneously monitoring the status of the dual-power switching module and having a communication function.

[0047] Implementation of the dual-power switching module: Select a power switching chip with overvoltage, undervoltage, and overcurrent protection functions, such as the RT9711, a 14-pin power management chip. It has various practical functions such as overvoltage protection, undervoltage protection, and overcurrent protection, which can fully meet the system's requirements for stable power switching and protection. The RT9711 power management chip is a prior art and will not be elaborated; Connect the mains power supply and the backup battery power supply to the corresponding pins of the switching chip respectively. By writing a program, use the detection circuit inside the chip to monitor the voltage and current of the mains power supply in real time. When the mains is detected to be abnormal, trigger the switching logic and connect the backup battery power supply to the system power supply circuit; Assembly of the semiconductor thermoelectric cooling module: According to the required cooling and heating power, select an appropriate number of semiconductor thermoelectric cooling chips, and connect the cooling chips in series or parallel to meet the requirements of the system for current and voltage. When connecting the cooling chips, pay attention to the correct connection of the positive and negative poles to ensure that the current can pass through the cooling chips in the expected direction; Installation of the temperature detection module: Install a high-precision temperature sensor at the key positions that require precise temperature control, such as the surface of the object to be cooled or heated, and the cold and hot ends of the semiconductor thermoelectric cooling module. The output pins of the sensor are connected to the analog input pins of the intelligent control module through shielded wires to reduce the influence of external interference on the temperature data acquisition. The temperature sensor can be a PT100 platinum resistance temperature sensor or a MEMS temperature sensor. The sensor is an existing technology and will not be elaborated here; Programming of the intelligent control module: Based on the STM32F407 series microprocessor, conduct the hardware design of the intelligent control module, build the minimum system, and use C language or other suitable programming languages to write the control program to achieve temperature data acquisition, processing, comparison, PWM signal generation and regulation, dual power supply status monitoring and switching control, and communication functions, etc. Set a reasonable temperature control algorithm in the program, such as the PID control algorithm, to improve the accuracy and stability of temperature control.

[0048] The dual power supply switching module adopts a power supply switching chip with overvoltage, undervoltage, and overcurrent protection functions, and realizes automatic switching by detecting the voltage and current of the mains power supply; the cooling chips in the semiconductor thermoelectric cooling module are connected in series or parallel according to the required cooling and heating power; the temperature sensor in the temperature detection module is connected to the analog input pins of the intelligent control module through shielded wires.

[0049] Working principle: After the system is started, the dual power supply switching module first detects the status of the mains power supply. If the mains power is normal, the mains power supply powers the system and charges the backup battery power supply at the same time; the temperature detection module continuously collects temperature data and sends it to the intelligent control module. The intelligent control module compares the current temperature with the preset target temperature. When the current temperature is higher than the target temperature, the intelligent control module increases the cooling current of the semiconductor thermoelectric cooling module through PWM control. The cold end of the cooling chip absorbs heat to lower the ambient temperature, and the heat generated at the hot end is dissipated in time by the heat dissipation module; when the current temperature is lower than the target temperature, the intelligent control module changes the current direction to make the semiconductor thermoelectric cooling module switch to the heating mode to heat the environment. During the whole process, the intelligent control module adjusts the working parameters of the semiconductor thermoelectric cooling module in real time according to the temperature change to achieve precise temperature control. Once the mains power supply fails, the dual power supply switching module quickly switches to the backup battery power supply to ensure the uninterrupted operation of the system until the mains power is restored or the backup battery runs out of power. When the backup battery power is low, the intelligent control module can send an alarm to the user through the communication module; The design of the dual - power switching module ensures that the system can continue to operate even when the mains power fails or is unstable, greatly improving the reliability of the temperature control system. Through the collaborative work of a high - precision temperature sensor and an intelligent control module, combined with advanced control algorithms, it can achieve precise temperature regulation. The system can automatically adjust the working state of the semiconductor thermoelectric cooling module according to the ambient temperature and load changes, realizing intelligent temperature control. At the same time, it has the function of communicating with external devices, facilitating users' remote monitoring and operation, improving the user experience and the convenience of equipment management. The intelligent control module dynamically adjusts the working power of the semiconductor thermoelectric cooling module according to the actual temperature requirements, avoiding unnecessary energy consumption. The intelligent speed regulation design of the heat dissipation module further improves the energy utilization efficiency and reduces the operating cost of the system.

[0050] When in use, when the thermoelectric semiconductor chip 7 works, it can heat the upper end of the top cover 6, thereby heating the surrounding environment of the plant and making the plant in a suitable living environment. When the thermoelectric semiconductor chip 7 works, it can also cool the lower end of the top cover 6. The moisture in the air can come into contact with the water - collecting panel 8. Since the temperature of the water - collecting panel 8 is relatively low, the moisture in the air can condense on the water - collecting panel 8. When the water droplets gather to a large size, they can fall into the collection tank under the action of gravity, thereby collecting the moisture in the air and dehumidifying the air during the collection process. Through the installed electric control valve 4, the water in the collection tank can be released and the plants can be irrigated regularly, which can replace manual irrigation, saving time and effort. Through the set U - shaped scraping frame 13, when the U - shaped scraping frame 13 moves circularly, it can scrape the inner wall of the collection tank and centrally clean the dust adhering to the inside of the collection tank. When the U - shaped scraping frame 13 moves circularly, it can also make the scraping blade 15 move up and down and the shoveling blade 21 move left and right to scrape the dust adhering to the U - shaped scraping frame 13, so that the dust inside the collection tank is cleared more cleanly, and the whole process can be automated to reduce the labor intensity of users. In the traditional plant potted plant maintenance method, in terms of humidity control, ventilation and other means are often used to reduce humidity, but ventilation is greatly affected by the outdoor environment and has poor effects in closed spaces or extreme weather. As for irrigation, the manual watering method depends on manpower and is prone to over - watering or under - watering, which not only occupies manpower but also has an adverse impact on plant growth. By controlling the thermoelectric semiconductor chip 7 through the dual - power intelligent temperature control system and applying it to the plant potted plant technology, it can not only automatically irrigate and reduce the occupation of human resources, but also control humidity, automatically heat, etc., providing a good living environment for plants. When power is off, it can rely on the backup power supply to work, providing double protection for plants.

Claims

1. A dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology, including a base (1), characterized in that: The base (1) is provided with a soil trough (3) inside, and a collection box (2) is arranged on the base (1). A top cover (6) is arranged on the collection box (2), and a thermoelectric semiconductor chip (7) is installed on the top cover (6). A collection trough is arranged inside the collection box (2), and a plurality of air holes (5) are arranged on the outer surface of the collection trough. A U-shaped scraping frame (13) capable of circular motion is installed in the collection trough. A plurality of scraping blades (15) are installed on the U-shaped scraping frame (13), and a shoveling blade (21) is further installed at the bottom of the U-shaped scraping frame (13). When the U-shaped scraping frame (13) moves in a circle, the inner wall of the collection trough can be scraped, and at the same time, the scraping blades (15) can move up and down, and the shoveling blade (21) can move left and right to clean the U-shaped scraping frame (13). An electric control valve (4) is arranged at the bottom of the collection trough.

2. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 1, characterized in that: The base (1) is provided with a first clamping groove matching with the collection box (2), so that the collection box (2) can be detachably installed on the base (1). The collection box (2) is provided with a second clamping groove matching with the top cover (6), so that the top cover (6) can be detachably installed on the collection box (2).

3. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 1, wherein: A heat dissipation plate (9) is arranged on the upper end surface of the thermoelectric semiconductor chip (7), and a water collection panel (8) is arranged on the lower end surface of the thermoelectric semiconductor chip (7).

4. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 1, characterized in that: A motor (10) is fixedly connected to the inner wall of the collection trough, a small spur gear (11) is fixedly connected to the output end of the motor (10), and a toothed ring (12) is meshed on the outer surface of the small spur gear (11). The U-shaped scraping frame (13) is fixedly connected to one side of the lower surface of the toothed ring (12).

5. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 1, characterized in that: A movable vertical rod (19) is installed on the U-shaped scraping frame (13), the shoveling blade (21) is fixedly connected to the end faces on both sides of the vertical rod (19), an I-shaped seat (14) is slidably connected to the inner wall of the U-shaped scraping frame (13), the scraping blade (15) is fixedly connected to the I-shaped seat (14), a first sliding pin (16) is slidably connected to one side of the I-shaped seat (14), a guide frame (17) is fixedly connected to the inner wall of the U-shaped scraping frame (13), an inclined groove (18) matching with the first sliding pin (16) is arranged on the guide frame (17), and a vertical groove (20) matching with the first sliding pin (16) is arranged on the vertical rod (19).

6. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 5, wherein: A second sliding pin (22) is fixedly connected to the lower surface of the vertical rod (19), and a polygonal track groove (23) matching with the second sliding pin (22) is arranged on the inner wall of the bottom end of the collection trough.

7. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 1, characterized in that: A sewage outlet is further arranged at the bottom of the collection trough, an installation box (24) is arranged inside the sewage outlet, convex seats (25) matching with the U-shaped scraping frame (13) are respectively arranged on both sides of the installation box (24), and blocking doors (29) are respectively arranged on both sides of the bottom of the installation box (24). When the two convex seats (25) move outwards, the blocking doors (29) can move outwards to open the sewage outlet.

8. The dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 7, characterized in that: The convex seats (25) are respectively slidably connected to the inner walls of the front and rear ends of the installation box (24). Installation grooves are respectively formed in the inner walls of the left and right ends of the installation box (24). The blocking doors (29) are respectively slidably connected to the corresponding installation grooves. First springs (31) which are matched with the blocking doors (29) are respectively arranged on both sides of the bottom of the installation grooves. Guide plates (27) are fixedly connected to the end faces on both sides of the blocking doors (29). Two third sliding pins (26) are fixedly connected to the lower surface of each convex seat (25). Oblique key grooves (28) which are matched with the third sliding pins (26) are respectively formed in the guide plates (27).

9. The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 1, characterized in that: Including; A dual - power switching module, which is connected to two independent power supplies and is used for automatically detecting the power supply state and switching to the backup battery power supply in case of a mains power failure; A semiconductor thermoelectric refrigeration module, which is composed of a plurality of semiconductor thermoelectric refrigeration chips and realizes refrigeration or heating according to the magnitude and direction of the current; A temperature detection module, which uses a high - precision temperature sensor to collect temperature data and transmit it to the intelligent control module; An intelligent control module, which receives the temperature data, compares it with the preset target temperature, adjusts the working current of the semiconductor thermoelectric refrigeration module through PWM technology, and simultaneously monitors the state of the dual - power switching module and has a communication function.

10. The module of the dual-power intelligent temperature control system based on semiconductor thermoelectric refrigeration technology according to claim 9, wherein: The dual - power switching module adopts a power - switching chip with over - voltage, under - voltage, and over - current protection functions and realizes automatic switching by detecting the mains power voltage and current; The refrigeration chips in the semiconductor thermoelectric refrigeration module are connected in series or in parallel according to the required refrigeration and heating power; The temperature sensor in the temperature detection module is connected to the analog input pin of the intelligent control module through a shielded wire.

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