Heating module and aerosol generating device
A buffer layer within the encapsulation structure of the heating module mitigates thermal expansion mismatches, enhancing stability and extending the lifespan of vaporizer components by absorbing pressure stresses and reducing shear forces.
Patent Information
- Application Number
- CN202510406360.X
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-04-01
- Publication Date
- 2025-07-15
AI Technical Summary
Due to the mismatch of thermal expansion coefficients of each functional layer, the existing heating modules have the risk of delamination and cracking, which affects the stability and life of the product.
A buffer layer is provided in the laminated structure of the packaged assembly, and the compressive stress is buffered through the buffer layer to avoid direct contact between the heat-generating layer and the thermally conductive layer. High-thermal conductive metals and super-slip materials are used to reduce the interface shear force and improve structural stability.
It extends the service life of the heating module, improves the stability and reliability of the product, avoids the problems of lifting or delamination of the heating layer, and enhances the heating performance and heat dispersion uniformity.
Smart Images
Figure CN120304588A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the technical field of atomization, and in particular provides a heating module and an aerosol generating device. Background Art
[0002] An aerosol generating device mainly consists of an atomizer and a power supply component. The aerosol generating device releases atomized gas by heating rather than burning materials. The atomizer is used to accommodate an aerosol generating matrix, and the atomizer includes a heating module. After the heating module is powered on, it realizes the heating function.
[0003] The current heating module includes a heating part and a substrate part. The heating part uses a heating sheet, a heating wire, a heating mesh, etc., and the heating part is usually fired on the substrate part in a coating manner. However, due to the difference in the thermal expansion coefficients of the substrate part and the heating part, it is difficult to achieve interfacial bonding. Shearing force and compressive stress are often generated between the substrate part and the heating part during repeated heating and cooling processes, and there is a risk that the heating part warps or even delaminates and cracks relative to the substrate part. Summary of the Invention
[0004] The purpose of the embodiments of this application is to provide a heating module and an aerosol generating device, aiming to solve the problem of delamination and cracking existing in the existing heating module due to the mismatch of the thermal expansion coefficients of each functional layer.
[0005] To achieve the above purpose, the technical solution adopted in this application is:
[0006] In a first aspect, the embodiments of this application provide a heating module, including a packaging component, a heating component, and a buffer layer. The packaging component includes at least a first heat-conducting layer and a second heat-conducting layer. The first heat-conducting layer and the second heat-conducting layer are stacked, and a receiving cavity is formed between the first heat-conducting layer and the second heat-conducting layer. The heating component includes a heating layer disposed in the receiving cavity. The buffer layer is disposed between the first heat-conducting layer and the heating layer and between the second heat-conducting layer and the heating layer; or disposed in the heating layer.
[0007] The beneficial effect of the heating module of this application is that by setting a buffer layer in the stacked structure of the packaging component, it is avoided that the heating layer directly contacts the structural layers in the stacking direction. The buffer layer can also buffer the compressive stress, enabling a certain degree of compressive stress contact to be maintained between the stacked structures, and it can be used stably for a long time. Therefore, the problem that the heating layer is prone to warping or even delaminating due to the mismatch of the thermal expansion coefficients between the heating layer and the heat-conducting layer is avoided; the service life of the atomization component is extended, and the product stability is improved.
[0008] In some embodiments, the first heat-conducting layer and the second heat-conducting layer are connected by hot pressing.
[0009] By adopting the above technical solution, the first heat-conducting layer and the second heat-conducting layer are hot-pressed and connected to encapsulate the heating layer, thereby forming an effective protection for the heating layer.
[0010] In some embodiments, the material of the first heat-conducting layer is metal; and / or,
[0011] the material of the second heat-conducting layer is metal.
[0012] By adopting the above technical solution, the first heat-conducting layer and the second heat-conducting layer are preferably high heat-conducting metals, including but not limited to aluminum, magnesium, copper, or their alloys, etc.; the heat transfer effect is good.
[0013] In some embodiments, the material of the buffer layer is a super-slippery material.
[0014] By adopting the above technical solution, the super-slippery material is a material with an extremely low coefficient of friction, and its frictional force is close to zero, which can effectively reduce the interfacial shear force after the encapsulation component is encapsulated, avoid the problem that the heating layer is prone to warping and falling off due to the mismatch of the thermal expansion coefficients between the heating layer and the heat-conducting layer, improve the service life and reliability, and improve the product stability.
[0015] In some embodiments, the material of the buffer layer includes graphite.
[0016] By adopting the above technical solution, the surface friction coefficient of graphite is extremely low (i.e., it exhibits a super-slippery effect); and graphite has good compression resilience along the thickness direction, which can greatly relieve / absorb the compressive stress with the metal during the heating process.
[0017] In some embodiments, one layer of the heating layer is provided in the accommodating cavity, and the buffer layers are provided on both opposite sides of the heating layer.
[0018] In some embodiments, at least two layers of the heating layers are stacked in the accommodating cavity, and the buffer layer is provided between two adjacent heating layers.
[0019] By adopting the above technical solution, through the combined heating of multiple heating layers, the heating effect is better, and the heating performance of the heating module is improved; and by providing a buffer layer between two heating layers, the compressive stress between the stacked structures can be greatly relieved and absorbed, so that a certain compressive stress contact can be maintained between the stacked structures.
[0020] In some embodiments, an intermediate layer is provided between the first heat-conducting layer and / or the second heat-conducting layer and the adjacent heating layer.
[0021] By adopting the above technical solution, an intermediate layer is further provided between the heating layer and the heat-conducting layer to avoid direct contact between the heating layer and the heat-conducting layer.
[0022] In some embodiments, a plurality of spaced slots are provided on the first heat-conducting layer and / or the second heat-conducting layer to form a plurality of the accommodating cavities between the stacked first heat-conducting layer and the second heat-conducting layer, and a heating layer is provided in each of the accommodating cavities.
[0023] By adopting the above technical solution, a plurality of accommodating cavities are formed in the heating module, and a heating layer is arranged in each accommodating cavity. The heating layers in each accommodating cavity generate heat together, so that the heating efficiency is better and the heat is more evenly dispersed.
[0024] In some embodiments, an insulating medium is provided on the outer surface of the heating layer.
[0025] By adopting the above technical solution, the insulating medium is an insulating sheet or an insulating coating. The insulating medium insulates the heating element from the external metal. After the heating element is connected to the external power supply, it generates heat concentratedly and transfers the heat to the external metal, which is beneficial to rapid temperature rise.
[0026] In some embodiments, the second heating layers are stacked on both sides of the first heating layer; the heating assembly further includes a first electrode and a second electrode provided on the heating layer, and a lead-out structure for leading the first electrode and / or the second electrode to the outside is provided on the second heat-conducting layer.
[0027] By adopting the above technical solution, the lead-out structure can be an opening or a slit provided on the second heat-conducting layer, and the electrical connecting member extends out to the outside through the lead-out structure and is connected to an external power supply.
[0028] In some embodiments, the first heat-conducting layer and the second heat-conducting layer are metal layers; the first electrode is electrically connected to the first heat-conducting layer, and the lead-out structure is used to lead out the second electrode.
[0029] By adopting the above technical solution, the first electrode is interconnected with the first heat-conducting layer, and the second electrode is led out to the outside; that is, one of the electrodes of the external power supply is electrically connected to any one of the first heat-conducting layer and the second heat-conducting layer, that is, electrically connected to the first electrode, and the electrical connection is more convenient.
[0030] In a second aspect, an aerosol generating device according to an embodiment of the present application further includes a power supply assembly and the heating module as described above; the power supply assembly is used to supply power to the heating module. BRIEF DESCRIPTION OF THE DRAWINGS
[0031] In order to more clearly illustrate the technical solutions in the embodiments of the present application, the following will briefly introduce the drawings required for the description of the embodiments or the prior art. Obviously, the following drawings are only some embodiments of the present application. For those of ordinary skill in the art, without creative efforts, other drawings can be obtained based on these drawings.
[0032] Figure 1 Schematic cross-sectional view of the first heat-conducting layer, the second heat-conducting layer and the heating component of the heating module provided by an embodiment of the present application without encapsulation; wherein, a heating layer is provided in the accommodation cavity;
[0033] Figure 2 Schematic cross-sectional view of the first heat-conducting layer, the second heat-conducting layer and the heating component of the heating module provided by an embodiment of the present application after encapsulation; wherein, a heating layer is provided in the accommodation cavity;
[0034] Figure 3 Schematic cross-sectional view of the first heat-conducting layer, the second heat-conducting layer and the heating component of the heating module provided by another embodiment of the present application without encapsulation; wherein, two heating layers are provided in the accommodation cavity;
[0035] Figure 4 Schematic cross-sectional view of the first heat-conducting layer, the second heat-conducting layer and the heating component of the heating module provided by another embodiment of the present application after encapsulation; wherein, two heating layers are provided in the accommodation cavity;
[0036] Figure 5 Schematic structural view of the first heat-conducting layer provided by an embodiment of the present application; wherein, a slot is provided in the first heat-conducting layer;
[0037] Figure 6 Schematic cross-sectional view of the first heat-conducting layer, the second heat-conducting layer and the heating component of the heating module provided by another embodiment of the present application without encapsulation; wherein, two accommodation cavities are formed in the heating module;
[0038] Figure 7 Schematic structural view of the first heat-conducting layer provided by another embodiment of the present application; wherein, two slots are provided in the first heat-conducting layer;
[0039] Figure 8 Schematic cross-sectional view of the first heat-conducting layer, the second heat-conducting layer and the heating component of the heating module provided by another embodiment of the present application without encapsulation, wherein slots are provided on both the first heat-conducting layer and the second heat-conducting layer.
[0040] Among them, each reference numeral in the figure:
[0041] 1000, atomization component;
[0042] 1, encapsulation component; 110, intermediate heat-conducting layer; 120, outer heat-conducting layer;
[0043] 2, heating component; 210, heating layer;
[0044] 3, buffer layer; 4, slot; 5, accommodation cavity; 6, intermediate layer. Detailed implementation manners
[0045] The embodiments of the technical solution of the present application will be described in detail below with reference to the accompanying drawings. The following embodiments are only used to illustrate the technical solution of the present application more clearly, so they are only examples and cannot be used to limit the protection scope of the present application.
[0046] Unless otherwise defined, all technical and scientific terms used herein have the same meaning as commonly understood by those of ordinary skill in the technical field to which this application belongs; the terms used herein are only for the purpose of describing specific embodiments and are not intended to limit this application; the terms "including" and "having" and any variations thereof in the specification and claims of this application and the above drawings are intended to cover non-exclusive inclusion.
[0047] In the description of the embodiments of this application, technical terms such as "first" and "second" are only used to distinguish different objects and cannot be understood as indicating or implying relative importance or implicitly indicating the quantity, specific order, or primary-secondary relationship of the indicated technical features. In the description of the embodiments of this application, the meaning of "a plurality of" is more than two, unless otherwise specifically defined.
[0048] Referring to "embodiments" herein means that the specific features, structures, or characteristics described in connection with the embodiments can be included in at least one embodiment of this application. The phrase appears in various places in the specification does not necessarily refer to the same embodiment, nor is it an independent or alternative embodiment mutually exclusive with other embodiments. Those skilled in the art will explicitly and implicitly understand that the embodiments described herein can be combined with other embodiments.
[0049] In the description of the embodiments of this application, the term "and / or" is only a description of the association relationship of associated objects, indicating that there can be three relationships. For example, A and / or B can mean: A exists alone, A and B exist simultaneously, and B exists alone. In addition, the character " / " in this article generally indicates that the associated objects before and after are in an "or" relationship.
[0050] In the description of the embodiments of this application, the term "a plurality of" refers to more than two (including two). Similarly, "multiple groups" refers to more than two groups (including two groups), and "multiple pieces" refers to more than two pieces (including two pieces).
[0051] In the description of the embodiments of this application, the orientation or positional relationship indicated by technical terms such as "center", "longitudinal", "transverse", "length", "width", "thickness", "upper", "lower", "front", "rear", "vertical", "horizontal", "top", "bottom", "inner", "outer", etc. is based on the orientation or positional relationship shown in the drawings. It is only for the convenience of describing the embodiments of this application and simplifying the description, rather than indicating or implying that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore cannot be understood as a limitation on the embodiments of this application.
[0052] In the description of the embodiments of the present application, unless otherwise clearly specified and limited, technical terms such as "installation", "connection", "connection", "fixation", etc. should be understood in a broad sense. For example, it can be a fixed connection, a detachable connection, or integrated; it can also be a mechanical connection or an electrical connection; it can be directly connected, or indirectly connected through an intermediate medium, and can be the communication inside two components or the interaction relationship between two components. For those of ordinary skill in the art, the specific meanings of the above terms in the embodiments of the present application can be understood according to specific circumstances.
[0053] The existing current heating module includes a heating part and a base part. The heating part uses a heating sheet, a heating wire, or a heating mesh, etc., and the heating part is usually fired on the base part in a coating manner. However, due to the difference in the thermal expansion coefficients of the base part and the heating part, it is difficult to achieve interfacial bonding; often, shear force and compressive stress are generated between the base part and the heating part during repeated heating and cooling processes, and there is a risk that the heating part warps or even delaminates and cracks relative to the base part.
[0054] Based on this, in order to solve the above problems, the present application designs a heating module. By providing a buffer layer in the stacked structure of the encapsulation component, direct contact between the heating layer and the heat conduction layer is avoided; the buffer layer can buffer the compressive stress, enabling a certain degree of compressive stress contact to be maintained between the stacked structures, and allowing for long-term stable use; thus, the problem of the heating layer being prone to warping or even delaminating due to the mismatch in the thermal expansion coefficients between the heating layer and the heat conduction layer is avoided; the service life of the atomization component is extended, and the product stability is improved.
[0055] The embodiments of the present application provide an aerosol generating device, including a power supply component and an atomizer; the atomizer includes an atomization housing and a heating module 1000 disposed inside the atomization housing.
[0056] Specifically, an aerosol matrix of liquid is stored inside the atomization housing, and the aerosol matrix is in liquid conduction communication with the heating module 1000; the power supply component is used to supply power to the heating module 1000. After the heating module 1000 is powered on, it heats and atomizes the aerosol matrix to generate an aerosol for the user to inhale.
[0057] It can be understood that the aerosol generating device of the present application can be an aerosol generating device with a replaceable atomizer, that is, the atomizer and the power supply component are detachably connected. Or, the aerosol generating device of the present application can also be a disposable aerosol generating device, that is, the atomizer and the battery module are not detachably connected. No specific limitation is made here, as long as the power module can supply power to the heating module 1000.
[0058] Reference Figures 1 to 5, in some embodiments, the heating module 1000 includes a packaging component 1, a heating component 2, and a buffer layer 3; the packaging component 1 includes at least a first heat conduction layer 110 and a second heat conduction layer 120, the first heat conduction layer 110 and the second heat conduction layer 120 are stacked, and a receiving cavity 5 is formed between the first heat conduction layer 110 and the second heat conduction layer 120; the heating component 2 includes a heating layer 210 disposed in the receiving cavity 5; the buffer layer 3 is disposed between the first heat conduction layer 110 and the heating layer 210 and between the second heat conduction layer 120 and the heating layer 210, or is disposed in the heating layer 210.
[0059] Specifically, the first heat conduction layer 110 is combined with the second heat conduction layer 120 in the thickness direction; the second heat conduction layer 120 matches the size of the first heat conduction layer 110. After packaging, the structural integrity is good, and a receiving cavity 5 is formed inside the packaging component 1. The receiving cavity 5 is used to accommodate the heating component 2 and the buffer layer 3. The packaging component 1 can effectively protect the heating component 2 and can provide better structural strength, improving the structural stability.
[0060] In one embodiment, the formation method of the receiving cavity 5 can be: refer to Figure 1 , second heat conduction layers 120 are stacked on both sides of the first heat conduction layer 110 in the thickness direction. A slot 4 is provided on the first heat conduction layer 110, and the slot 4 is a hollow slot penetrating the first heat conduction layer 110, that is, the first heat conduction layer 110 has a frame structure with a hollow structure. The first heat conduction layer 110 and the second heat conduction layers 120 on both sides enclose the receiving cavity 5 through the slot 4. And, on the basis of this embodiment, if the height of the receiving cavity 5 is not enough to accommodate the heating component 2 and the buffer layer 3, grooves can be further provided on the second heat conduction layer 120 to increase the height of the receiving cavity 5.
[0061] In another embodiment, the formation method of the receiving cavity 5 can be: refer to Figure 8 , the packaging component 1 includes a first heat conduction layer 110 and a second heat conduction layer 120 that are stacked. A slot 4 is provided on at least one of the first heat conduction layer 110 and the second heat conduction layer 120, and the slot 4 is a groove; specifically, the slot 4 can be provided only on the first heat conduction layer 110, or only on the second heat conduction layer 120, or on both the first heat conduction layer 110 and the second heat conduction layer 120; after the first heat conduction layer 110 and the second heat conduction layer 120 are stacked, the receiving cavity 5 is enclosed through the slot 4.
[0062] The heating layer 210 is used for generating heat when powered on, that is, the power module of the aerosol generating device is used to supply power to the heating layer 210. Exemplarily, the heating layer 210 can be, but is not limited to, an MCH (Metal-Ceramics Heater ceramic heating component) heating sheet prepared by using the HTCC (High Temperature Co-Fired Ceramics) process, a stainless steel thick film heating sheet (i.e., an insulating thick film layer, a thick film heating layer, a thick film electrode layer, and a thick film protective layer are printed and sintered on a stainless steel material in sequence), a ceramic thick film heating sheet (i.e., a thick film heating layer, a thick film electrode layer, and a thick film protective layer are printed and sintered on a ceramic material in sequence, which is different from the HTCC process), a heating mesh sheet or a heating wire with surface insulation (insulated by a coating or an insulating sheet, and the insulating sheet can be a ceramic sheet, a mica sheet, a glass sheet, etc.); as long as the heating layer 210 can be powered on and heated.
[0063] Specifically, the first heat conducting layer 110 and the second heat conducting layer 120 are coated outside the heating layer 210, and both the first heat conducting layer 110 and the second heat conducting layer 120 are made of heat conducting materials; preferably, the first heat conducting layer 110 and the second heat conducting layer 120 are made of a metal material with high thermal conductivity. Then, the heat generated by the heating layer 210 can be better transferred to the first heat conducting layer 110 and the second heat conducting layer 120, so that the first heat conducting layer 110 and the second heat conducting layer 120 can be quickly heated up, and heat can be transferred between the first heat conducting layer 110 and the second heat conducting layer 120, and the surface heat conduction uniformity of the encapsulation component 1 is better. The heating module 1000 is arranged in the atomizer, and the aerosol matrix will contact the encapsulation component 1 outside the heating module 1000, that is, the atomized aerosol matrix is heated by the first heat conducting layer 110 and the second heat conducting layer 120.
[0064] It can be understood that the encapsulation component 1 forms an isolation effect between the heating layer 210 and the aerosol matrix through the first heat conducting layer 110 and the second heat conducting layer 120, avoiding the problem that the heating layer 210 directly contacts the aerosol matrix and causes circuit corrosion and fracture, and the heating layer 210 and the aerosol matrix do not directly contact, avoiding the problem that harmful substances are decomposed from the aerosol matrix due to local overheating of the heating layer 210; during the working process of the atomizer, the heating layer 210 and the aerosol matrix do not contact each other, which is beneficial to protecting the heating layer 210 from corrosion and improving the service life of the heating layer 210.
[0065] The number of the heating layers 210 in the accommodating cavity 5 can be one or more. Exemplarily, referring to Figure 1 , the number of the heating layers 210 is one, and buffer layers 3 are arranged on both opposite sides of the heating layer 210 in the thickness direction. Or, referring to Figure 3 , a plurality of heating layers 210 can be stacked in the thickness direction in the accommodating cavity 5, and buffer layers 3 are arranged between adjacent two heating layers 210.
[0066] Specifically, the material of the buffer layer 3 is a super-slippery material. The buffer layer 3 can be a sheet layer made of a super-slippery material, or the buffer layer 3 can also be a coating formed by coating a super-slippery material on the surface of the heating layer 210 or the second heat conduction layer 120. A super-slippery material is a material with an extremely low coefficient of friction, and its frictional force is close to zero, that is, the buffer layer 3 has super-slippery characteristics. The frictional force when the buffer layer 3 contacts the surface of the second heat conduction layer 120 is close to zero, and the frictional force when the buffer layer 3 contacts the surface of the heating layer 210 is close to zero.
[0067] In the heating module 1000 of the present application, by arranging the buffer layer 3 in the laminated structure of the encapsulation component 1, it is avoided that the heating layer 210 directly contacts the structural layer in the lamination direction; and the buffer layer 3 has super-slippery characteristics and an extremely low coefficient of friction; the frictional force when the buffer layer 3 contacts the surface of the heat conduction layer and the frictional force when the buffer layer 3 contacts the surface of the heating layer 210 are extremely low, which can effectively reduce the interfacial shear force between the laminated structures after the heating module 1000 is encapsulated; and the buffer layer 3 can also buffer the compressive stress, so that a certain degree of compressive stress contact can be maintained between the laminated structures, and it can be used stably for a long time; therefore, the problem that the heating layer 210 is easily warped or even delaminated due to the mismatch of the thermal expansion coefficients between the heating layer 210 and the heat conduction layer is avoided; the service life of the heating module 1000 is extended, and the product stability is improved.
[0068] Reference Figures 1 to 4 , in some embodiments, the first heat conduction layer 110 and the second heat conduction layer 120 are connected by hot pressing.
[0069] Specifically, both the first heat conduction layer 110 and the second heat conduction layer 120 are in a flat plate shape, and the first heat conduction layer 110 and the second heat conduction layer 120 are connected by a hot pressing process to form an integral body to encapsulate the internal heating layer 210.
[0070] In some embodiments, the material of the first heat conduction layer 110 is metal; the material of the second heat conduction layer 120 is metal.
[0071] Exemplarily, the first heat conduction layer 110 and the second heat conduction layer 120 are preferably high thermal conductivity metals, including but not limited to aluminum, magnesium, copper, or their alloys, etc.; the metal material has high structural strength, which is beneficial to improving the structural stability; and by using a metal material with excellent thermal conductivity, the heat of the heating layer 210 can be quickly transferred to the first heat conduction layer 110 and the second heat conduction layer 120 to effectively atomize the aerosol matrix.
[0072] Specifically, the first heat conduction layer 110 and the second heat conduction layer 120 are formed of the same metal material. During the hot pressing process, the hot pressing temperature is lower than the melting point temperature of the metal used, which is 0.5 - 0.9 times the melting point of the metal (unit: °C); the hot pressing pressure is 0 - 10 Mpa, and heat preservation and pressure holding are carried out for about 2 min - 30 min or longer; after hot pressing, annealing treatment is carried out to make the hot pressing stability of the first heat conduction layer 110 and the second heat conduction layer 120 good. By heating and applying pressure, the oxides on the surfaces of the first heat conduction layer 110 and the second heat conduction layer 120 are removed, so that the first heat conduction layer 110 and the second heat conduction layer 120 are firmly welded together with good integrity, thereby enhancing the firmness and reliability of the structure; during the hot pressing connection process, the oxides on the metal surface are removed, which can effectively prevent oxidation and corrosion and extend the service life of the heating module 1000.
[0073] In some embodiments, the material of the buffer layer 3 is a super slippery material.
[0074] Specifically, the material of the buffer layer 3 includes but is not limited to graphite, graphene, or diamond-like carbon, etc.; the surface friction coefficient of the buffer layer 3 is extremely low, that is, it shows a super slippery effect, effectively reducing the interfacial shear force between the laminated structures after the heating module 1000 is encapsulated.
[0075] Preferably, the buffer layer 3 is made of APG pyrolytic graphite (Aromatic Pitch Graphite) with high conductivity. Moreover, graphite has good compression resilience in the thickness direction. The buffer layer 3 is arranged between the heating layer 210 and the metal layer, which can greatly relieve and absorb the compressive stress with the metal during the heating process, avoiding the risk of delamination and cracking of the structural layer due to the mismatch of the thermal expansion coefficients between the heating layer 210 and the metal layer. Exemplarily, the buffer layer 3 can be a graphite sheet layer arranged between the heating layer 210 and the second heat conduction layer 120; or, the buffer layer 3 can also be a graphite coating, and the buffer layer 3 is coated on the surface of the heating layer 210 or the surface of the second heat conduction layer 120.
[0076] Reference Figure 1 and Figure 2 In some embodiments, a heating layer 210 is provided in the accommodation cavity 5, and buffer layers 3 are provided on both opposite sides of the heating layer 210.
[0077] Specifically, in a single accommodation cavity 5, a heating layer 210 is provided, and buffer layers 3 are provided on both opposite sides of the heating layer 210, and then referring to Figure 1 and Figure 8, the surface of the heating layer 210 is not in contact with the surface of the structural layer in the stacking direction. The buffer layer 3 is in direct contact with the surface of the heat conduction layer. There is an extremely low coefficient of friction between the buffer layer 3 and the heat conduction layer, and between the buffer layer 3 and the heating layer 210, which can effectively reduce the shear force between the two interfaces stacked in the stacked structure, making the shear stress between the heating layer 210 and the metal layer almost negligible. During the heating process, the stacked structure is stable, improving the stability of the packaging structure.
[0078] Reference Figure 3 and Figure 4 , in some embodiments, at least two stacked heating layers 210 are provided in the accommodating cavity 5, and the buffer layer 3 is provided between two adjacent heating layers 210.
[0079] Specifically, in a single accommodating cavity 5, at least two stacked heating layers 210 are provided, that is, the multiple heating layers 210 generate heat together, and the heating effect is better, improving the heating performance of the heating module 1000.
[0080] It can be understood that in the thickness direction, the buffer layer 3 is provided between two adjacent heating layers 210. During the heating process, the buffer layer 3 can greatly relieve and absorb the compressive stress between the stacked structures, enabling a certain compressive stress contact to be maintained between the stacked structures. This compressive stress will not cause the interface of the stacked structure to deform or become unstable, improving the stability of the packaging structure.
[0081] Reference Figure 3 and Figure 4 , in some embodiments, an intermediate layer 6 is provided between the first heat conduction layer 110 and / or the second heat conduction layer 120 and the adjacent heating layer 210.
[0082] Specifically, the intermediate layer 6 is provided between the heating layer 210 and the adjacent heat conduction layer. By means of the intermediate layer 6, direct contact between the heating layer 210 and the metal layer is avoided, reducing the risk of the mismatch of the thermal expansion coefficients between the heating layer 210 and the metal layer causing damage to the stacked structure. The stacked structure is stable, improving the stability of the packaging structure.
[0083] In some embodiments, reference Figure 1 , on both sides of the first heat conduction layer 110, the second heat conduction layer 120 is stacked, and then the intermediate layer 6 is provided between the second heat conduction layer 120 and the adjacent heating layer 210.
[0084] In other embodiments, when the packaging component includes a stacked first heat conduction layer 110 and a second heat conduction layer 120, and at least two stacked heating layers 210 are provided in the accommodating cavity 5; furthermore, an intermediate layer 6 is provided between the first heat conduction layer 110 and the adjacent heating layer 210, and an intermediate layer 6 is provided between the second heat conduction layer 120 and the adjacent heating layer 210.
[0085] In some embodiments, the material of the intermediate layer 6 is a super-slippery material, including but not limited to graphite flakes, graphite aerogel layers, ceramic fiber papers, or glass fiber papers, and aerogel layers; it has resilience and a low coefficient of friction, and can also reduce the interfacial shear force.
[0086] Reference Figure 3 , in some embodiments, two stacked heating layers 210 are provided in a single accommodating cavity 5, a buffer layer 3 is provided between two adjacent heating layers 210, and a buffer layer 3 is provided between a single heating layer 210 and the second heat conducting layer 120. In this embodiment, preferably, the intermediate layer 6 is a coating (such as a graphite coating, a graphene coating, or a diamond coating), and the intermediate layer 6 is pre-coated on the surface of the heating layer 210 or the surface of the second heat conducting layer 120, which is beneficial to the assembly of the encapsulation structure and can reduce the thickness of the stacked structure.
[0087] Specifically, two stacked heating layers 210 in the accommodating cavity 5 are connected by short flexible electrical connection wires, and the electrical connection wires are buried in the intermediate layer 6 to connect the two stacked heating layers 210 in series.
[0088] Reference Figure 6 and Figure 7 , in some embodiments, a plurality of spaced-apart slots 4 are provided on the first heat conducting layer 110 and / or the second heat conducting layer 120 to form a plurality of accommodating cavities 5 between the stacked first heat conducting layer 110 and the second heat conducting layer 120, and a heating layer 210 is provided in each accommodating cavity 5.
[0089] In some embodiments, reference Figure 7 , on both sides of the first heat conducting layer 110 in the thickness direction, second heat conducting layers 120 are provided. A plurality of slots 4 arranged in the horizontal direction are provided on the first heat conducting layer 110. The slots 4 penetrate through the first heat conducting layer 110, and the number of the slots 4 can be 2 or more than 2. Then, a plurality of accommodating cavities 5 are formed in the final encapsulation structure, and a heating layer 210 is provided in each accommodating cavity 5. By the common heating of the heating layers 210 in each accommodating cavity 5, the heating efficiency is better and the heat is more evenly dispersed.
[0090] In still other embodiments, the encapsulation assembly 1 includes a first heat conducting layer 110 and a second heat conducting layer 120 stacked on each other. A plurality of slots 4 arranged in the horizontal direction are provided on at least one of the first heat conducting layer 110 and the second heat conducting layer 120, and the slots 4 are grooves; specifically, the slots 4 arranged in the horizontal direction can be provided only on the first heat conducting layer 110, or only on the second heat conducting layer 120, or on both the first heat conducting layer 110 and the second heat conducting layer 120; after the first heat conducting layer 110 and the second heat conducting layer 120 are stacked, the accommodating cavity 5 is formed by surrounding with the slots 4.
[0091] refer to Figure 7 In some embodiments, two side-by-side slots 4 are provided on the first heat-conducting layer 110. During assembly, a heating layer 210 is provided in each slot 4, and a buffer layer 3 is provided on both sides of each heating layer 210 in the thickness direction. Finally, the two second heat-conducting layers 120 are connected to the first heat-conducting layer 110 by hot pressing.
[0092] In some embodiments, an insulating medium is disposed on the outer surface of the heating layer 210 .
[0093] In this embodiment, the heating layer 210 includes a heating mesh or a heating wire, and current flows through the heating mesh or the heating wire to generate heat; the insulating medium is an insulating sheet or an insulating coating, and the insulating medium insulates the heating layer 210 from the second heat-conducting layer 120, so that no electricity is passed between the two, and only heat is transferred, thereby improving product safety. After the heating layer 210 is electrically connected to the power supply component of the aerosol generating device, it generates concentrated heat and transfers the heat to the surrounding metal layer.
[0094] In some embodiments, a second thermal conductive layer 120 is stacked on both sides of the first thermal conductive layer 110; the heating component 2 also includes a first electrode and a second electrode arranged on the heating layer 210, and the second thermal conductive layer 120 is provided with a lead-out structure for leading the first electrode and / or the second electrode to the outside.
[0095] Exemplarily, the second heat-conducting layer 120 is stacked on both sides of the first heat-conducting layer 110, and the accommodating cavity 5 is formed between the two second heat-conducting layers 120; the first electrode and the second electrode are surface-insulated leads, and lead-out structures are provided at corresponding positions on the outer second heat-conducting layer 120. The lead-out structures are openings or slits. The first electrode and the second electrode can extend from the inside of the accommodating cavity 5 to the outside of the second heat-conducting layer 120 through the lead-out structures, respectively, thereby facilitating the electrical connection between the heating layer 210 and the power supply component of the aerosol generating device.
[0096] In some embodiments, the first heat-conducting layer 110 and the second heat-conducting layer 120 are both metal layers; the first electrode is electrically connected to the first heat-conducting layer 110 or the second heat-conducting layer 120 , and the lead-out structure is used to lead out the second electrode.
[0097] Understandably, the first heat-conducting layer 110 and the second heat-conducting layer 120 are metal layers and have good electrical conductivity themselves. The second heat-conducting layers 120 are stacked on both sides of the first heat-conducting layer 110. Then, by directly connecting the first electrode on the heating layer 210 to the first heat-conducting layer 110 or the second heat-conducting layer 120, that is, the first electrode forms an electrical connection with the external metal packaging structure. Then, one of the electrodes of the power supply assembly can be electrically connected to the external metal of the heating module 1000 and can be electrically connected to the first electrode, making the electrical connection more convenient. Therefore, only an extraction structure for extracting the second electrode needs to be provided so that the second electrode can be connected to the other electrode of the power supply assembly, realizing the power supply of the power supply assembly of the aerosol generating device to the heating layer 210, which is beneficial to simplifying the structural design.
[0098] The above are only the preferred embodiments of the present application and are not intended to limit the present application. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present application shall be included within the protection scope of the present application.
Claims
1. A heating module, characterized in that, Comprising: An encapsulation component, at least including a first heat-conducting layer and a second heat-conducting layer, the first heat-conducting layer and the second heat-conducting layer are stacked, and a receiving cavity is formed between the first heat-conducting layer and the second heat-conducting layer; A heating component, including a heating layer disposed in the receiving cavity; A buffer layer, the buffer layer is disposed between the first heat-conducting layer and the heating layer and between the second heat-conducting layer and the heating layer, or is disposed in the heating layer.
2. The heating module according to claim 1, wherein The first heat-conducting layer and the second heat-conducting layer are connected by hot pressing.
3. The heating module according to claim 2, characterized in that, The material of the first heat-conducting layer is metal; and / or, the material of the second heat-conducting layer is metal.
4. The heating module according to claim 1, wherein The material of the buffer layer is a super-slippery material.
5. The heating module according to claim 1 or 4, characterized in that, The material of the buffer layer includes graphite.
6. The heating module according to claim 1, wherein One layer of the heating layer is disposed in the receiving cavity, and the buffer layer is disposed on both opposite sides of the heating layer.
7. The heating module according to claim 1, wherein At least two layers of the heating layers are stacked in the receiving cavity, and the buffer layer is disposed between two adjacent heating layers.
8. The heating module according to claim 7, wherein, An intermediate layer is disposed between the first heat-conducting layer and / or the second heat-conducting layer and the adjacent heating layer.
9. The heating module according to claim 6 or 7, characterized in that, A plurality of spaced slots are provided on the first heat-conducting layer and / or the second heat-conducting layer to form a plurality of the receiving cavities between the stacked first heat-conducting layer and the second heat-conducting layer, and the heating layer is disposed in each of the receiving cavities.
10. The heating module according to claim 1, wherein, An insulating medium is provided on the outer surface of the heating layer.
11. The heating module according to claim 1, wherein The second heat-conducting layer is stacked on both sides of the first heat-conducting layer; the heating component further includes a first electrode and a second electrode disposed on the heating layer, and a lead-out structure for leading the first electrode and / or the second electrode to the outside is provided on the second heat-conducting layer.
12. The heating module according to claim 11, characterized in that, The first heat-conducting layer and the second heat-conducting layer are both metal layers; the first electrode is electrically connected to the first heat-conducting layer, and the lead-out structure is used to lead out the second electrode.
13. An aerosol generating device, characterized in that, Comprising a power supply component and the heating module as claimed in claims 1-12; the power supply component is used to supply power to the heating module.