Cleaning equipment with intelligent drying function for spraying disc production

Abstract

The invention discloses cleaning equipment with an intelligent drying function for spraying disc production, and relates to the technical field of semiconductor spraying disc cleaning, the cleaning equipment comprises a cleaning equipment body and a controller, the cleaning equipment body comprises a box body, a cleaning cavity and multiple sets of ultrasonic generators are arranged in the box body, and a partition plate is installed in the middle of the cleaning cavity; a water supply assembly and a driving motor are installed at the bottom of the partition plate, a clamping assembly is installed above the partition plate and connected with the driving motor, a flushing assembly is installed above the cleaning cavity and connected with the water supply assembly, an end cover is installed on the box body, and a drying assembly is arranged at the bottom of the end cover. According to the semiconductor spraying disc cleaning device, the spraying disc can be cleaned in multiple modes, then the semiconductor spraying disc is cleaned more effectively, meanwhile, after cleaning is conducted every time, liquid can be recycled, resource waste is reduced, and finally the device can dry the wet spraying disc so that the spraying disc can be subjected to subsequent procedures conveniently.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor showerhead cleaning, and specifically to a cleaning device for showerhead production with an intelligent drying function. Background Art

[0002] The showerhead is widely used in PVD, CVD, PECVD, etching and other process flows in the manufacturing process of semiconductor integrated circuits, and is a key component in various gas distribution processes.

[0003] It is mainly used to evenly distribute gas into the reaction chamber to ensure that semiconductor materials can uniformly contact the gas during the reaction process, improving production efficiency and product quality. The product has characteristics such as high precision, high cleanliness, and multiple-composite surface treatments (such as sandblasting / anodizing / nickel brushing / electropolishing, etc. integrated). The gas distribution plate is located inside the reaction chamber and provides a uniformly deposited gas film layer for the wafer reaction environment, and is the core component of wafer production; However, after the existing showerheads are produced, there will be certain debris in the spray holes, so it is necessary to clean them to prevent the holes of the showerhead from being blocked, and single flushing cannot effectively remove the impurities on the showerhead. Summary of the Invention

[0004] The purpose of the present invention is to provide a cleaning device for showerhead production with an intelligent drying function to solve the problems raised in the prior art.

[0005] To achieve the above purpose, the present invention provides the following technical solution: A cleaning device for showerhead production with an intelligent drying function, including a cleaning device main body and a controller. The cleaning device main body includes a box body. Inside the box body, there are multiple groups of ultrasonic generators in a cleaning chamber. A partition plate is installed in the middle of the cleaning chamber. A water supply component and a driving motor are installed at the bottom of the partition plate. A clamping component is installed above the partition plate. The clamping component is connected to the driving motor. A flushing component is installed above the cleaning chamber. The flushing component is connected to the water supply component. An end cover is installed on the box body. A drying component is arranged at the bottom of the end cover.

[0006] Further, the water supply component includes a recycling box and multiple groups of water tanks. Above each water tank, a water supply pump is installed respectively. Above the partition plate, there are multiple groups of water inlets and multiple groups of water outlets. The output end of the water supply pump is connected to the water inlet. The water outlet is connected to the recycling box. The output end of the recycling box is connected to multiple groups of water tanks respectively. A discharge port is arranged at the bottom of the recycling box. Acid solution, alkali solution, ultrapure water and pure water are respectively arranged in multiple groups of water tanks.

[0007] Further, the clamping assembly includes a support disk, which is connected to the drive motor. A plurality of limit blocks and a plurality of limit grooves are installed on the support disk. The plurality of limit blocks are respectively equidistantly installed on the inner and outer sides of the support disk. The plurality of limit grooves are equidistantly installed on the inner side of the support disk. The limit blocks on the outer side of the support disk are fixedly connected thereto. The limit blocks inside the support disk are connected to the limit grooves. A limit rod is installed inside the limit groove, and a spring is arranged outside the limit rod. The spring can support the inner limit blocks. A spray disk is installed between two oppositely-opening limit blocks.

[0008] Further, a vibration cavity is arranged inside the support disk, and a plurality of rubber balls are installed inside the vibration cavity. The rubber balls can impact each other or impact the support disk.

[0009] Further, when the support disk rotates: the inner limit blocks on the support disk will squeeze the spray disk to limit the position of the spray disk; The rubber balls can impact each other on the support disk to generate vibration.

[0010] Further, the flushing assembly includes an L-shaped support plate, which is fixedly installed above the partition plate. The output end of the L-shaped support plate is matched with the support disk. The L-shaped support plate is connected to a water tank provided with ultrapure water. A spray head is installed at the output end of the L-shaped support plate, and the spray head is matched with the spray disk on the support disk.

[0011] Further, the drying assembly includes a plurality of support frames. A plurality of drying sheets and a plurality of flat circular copper tubes are installed between the support frames. The plurality of drying sheets are installed at the innermost part of the support frames. A plurality of heating wires are equidistantly installed at the outermost part of the support frames. A plurality of flat circular copper tubes are installed between the heating wires and the drying sheets. The output ends of the drying sheets face the flat circular copper tubes. Each group of drying sheets is matched with two flat circular copper tubes. The output end of the drying sheet is in the shape of a sharp blade. The diameter of one end of the flat circular copper tube close to the drying sheet is larger than that of the other end. The drying sheets and the flat circular copper tubes are respectively connected to the controller. The drying sheets are equidistantly provided with serrated grooves. The cooperation between the drying sheets and the flat circular copper tubes can generate ionic wind.

[0012] Further, a plurality of ultrasonic generators are equidistantly installed inside the box body. The ultrasonic generators are matched with a water tank provided with acid solution, alkali solution and pure water. The ultrasonic generators can clean the semiconductor spray disk through a liquid medium.

[0013] Further, a recovery motor is installed above the recovery box. A transmission rod is installed inside the recovery box. A plurality of stirring rods and scraping plates are installed on the transmission rod. The output end of the recovery motor is connected to the transmission rod. The stirring rods and the scraping plates are equidistantly installed on the transmission rod. The scraping plates are in contact with the inner wall of the recovery box.

[0014] Further, a controller is installed inside the box body. The controller is connected to the main body of the cleaning device. A control panel is arranged outside the box body, and the control panel is connected to the controller.

[0015] Compared with the prior art, the beneficial effects of the present invention are as follows: 1. When the device is in use, it can clean the spray tray in multiple ways, thereby more effectively cleaning the semiconductor spray tray. At the same time, after each cleaning, the device will recycle the liquid, thus reducing waste of resources. Finally, the device can dry the wet spray tray to facilitate subsequent processes of the spray tray. 2. When the clamping component of the device is in use, it can clamp and fix the semiconductor spray tray to prevent the spray tray from being damaged during the cleaning process. When the support tray rotates driven by the driving motor, the support tray rotates clockwise, and the limiting block inside the support tray will squeeze the semiconductor spray tray under the action of centrifugal force, thereby strengthening the clamping of the semiconductor spray tray. 3. When the support tray rotates, the rubber balls inside it will collide in the vibration cavity. Specifically, in use, because the support tray rotates clockwise driven by the driving motor, and because the vibration cavity inside the support tray is not circular, the rubber balls in the vibration cavity will not always move along the inner wall of the vibration cavity, but will collide in the vibration cavity. After the rubber balls collide with each other, the support tray can be shaken more violently. When the support tray shakes, the semiconductor spray tray on the support tray will also shake, thereby cooperating with the ultrasonic generator to better clean the semiconductor spray tray. 4. When the drying component of the device is in use, it can dry the semiconductor spray tray. Specifically, in use, the drying component can generate ion wind. The ion wind is mainly generated by the movement of current from the strong pole to the weak pole. The output end of the drying sheet cooperates with the flat circular copper tube, and the drying sheet discharges electricity towards the flat circular copper tube. Because the output end of the drying sheet is provided with equidistant serrated grooves, the power generation area can be increased, thereby increasing the wind force of the ion wind. The outermost part of the support frame is provided with heating wires, which can generate heat. When the ion wind passes through the heating wires, hot air flow can be generated to dry the semiconductor spray tray. Description of the Drawings

[0016] Figure 1 It is a schematic structural diagram of the whole of the present invention; Figure 2 It is an expanded schematic structural diagram of the whole of the present invention; Figure 3 It is a schematic structural diagram of the box body of the present invention; Figure 4 It is a schematic cross-sectional structure diagram of the recycling box of the present invention; Figure 5 It is a schematic cross-sectional structure diagram inside the box body of the present invention; Figure 6 It is a schematic structural diagram of the clamping assembly of the present invention; Figure 7 For the present invention Figure 2 The enlarged schematic diagram at "A" in it; Figure 8 For the present invention Figure 6 The enlarged schematic diagram at "B" in it; Figure 9 For the present invention Figure 4 The enlarged schematic diagram at "C" in it.

[0017] In the figure: 1. Cleaning equipment main body; 11. Box body; 111. Partition board; 12. Cleaning chamber; 13. Ultrasonic generator; 14. Driving motor; 15. End cover; 2. Water supply assembly; 21. Recycling box; 211. Discharge port; 212. Recycling motor; 213. Stirring rod; 214. Scraper; 22. Water tank; 221. Water supply pump; 3. Clamping assembly; 31. Support disk; 311. Vibration chamber; 312. Rubber ball; 32. Limit block; 33. Limit groove; 34. Limit rod; 35. Spring; 4. Flushing assembly; 41. L-shaped support plate; 42. Sprayer; 5. Drying assembly; 51. Support frame; 52. Drying sheet; 53. Oval copper tube; 54. Heating wire; 6. Controller; Specific embodiments

[0018] Next, the technical solutions in the embodiments of the present invention will be clearly and completely described in conjunction with the accompanying drawings in the embodiments of the present invention. Obviously, the described embodiments are only a part of the embodiments of the present invention, rather than all the embodiments. Based on the embodiments of the present invention, all other embodiments obtained by those of ordinary skill in the art without creative efforts shall fall within the protection scope of the present invention.

[0019] Embodiment: As Figures 1-9 shown, the present invention provides a cleaning device for the production of spray trays with intelligent drying function, including a cleaning equipment main body 1 and a controller 6. The cleaning equipment main body 1 includes a box body 11. Inside the box body 11, there are multiple groups of ultrasonic generators 13 arranged in a cleaning chamber 12. In the middle of the cleaning chamber 12, a partition board 111 is installed. At the bottom of the partition board 111, a water supply assembly 2 and a driving motor 14 are installed. Above the partition board 111, a clamping assembly 3 is installed. The clamping assembly 3 is connected to the driving motor 14. Above the cleaning chamber 12, a flushing assembly 4 is installed. The flushing assembly 4 is connected to the water supply assembly 2. An end cover 15 is installed on the box body 11. At the bottom of the end cover 15, a drying assembly 5 is provided; When the device is in use, first, the semiconductor spray tray needs to be placed on the clamping component 3, and the spray tray is fixed by the clamping component 3 to prevent the spray tray from being damaged during the cleaning process. Then, the end cover 15 of the device can be closed to perform subsequent cleaning. Specifically, when in use, first, the water supply component 2 injects liquid into the cleaning chamber 12, and the ultrasonic generator 13 is combined to assist in cleaning the semiconductor spray tray. First, the water supply component 2 injects pure water into the cleaning chamber 12, and the ultrasonic generator 13 is combined to perform a preliminary cleaning of the semiconductor spray tray. Then, all the pure water will discharge the impurities together, and the pure water is recycled through the recycling tank 21 in the water supply component 2. At this time, in order to prevent impurities from existing in the recycled pure water, the recycling tank 21 can be cleaned through the components inside it. After the preliminary cleaning of the semiconductor spray tray, it will be cleaned again with acid or alkali to remove the organic residues in the semiconductor spray tray. Then, the acid or alkali will also be recycled to reduce waste of resources. Finally, the water supply component 2 will also cooperate with the flushing component 4 to perform a final cleaning of the semiconductor spray tray. The flushing component 4 sprays ultrapure water on the semiconductor spray tray, and then the semiconductor spray tray is finally cleaned with ultrapure water. Then, the ultrapure water will be recycled separately. During the recycling process, not only impurities but also air need to be filtered to prevent the ultrapure water from being contaminated and reduce consumption. Finally, the device will perform a drying process on the semiconductor spray tray to evaporate the remaining water on the semiconductor spray tray. Thus, when the device is in use, it can effectively clean the semiconductor spray tray, reduce the impurities remaining in its production, and enable the cleaned semiconductor spray tray to be directly put into the next process.

[0020] As Figures 4-5 shown, in this embodiment, specifically, the water supply component 2 includes a recycling tank 21 and multiple groups of water tanks 22. A water supply pump 221 is installed above each group of water tanks 22. Multiple water inlets and multiple drain outlets are arranged above the partition plate 111. The output end of the water supply pump 221 is connected to the water inlet, and the drain outlet is connected to the recycling. The output end of the recycling tank 21 is respectively connected to multiple groups of water tanks 22. A discharge port 211 is arranged at the bottom of the recycling tank 21. Acid solution, alkali solution, ultrapure water, and pure water are respectively arranged in multiple groups of water tanks 22; When the water supply component 2 of the device is in use, it can inject different liquids into the cleaning chamber 12. Specifically, when in use, the water supply pumps 221 on each group of water tanks 22 will successively inject pure water, acid-containing liquid, and alkali-containing liquid into the cleaning chamber 12, and cooperate with the ultrasonic generator 13 to clean the semiconductor spray tray. After each water tank 22 injects liquid into the cleaning chamber 12, the recycling tank 21 will respectively recycle the pure water, acid-containing liquid, and alkali-containing liquid, thereby reducing resource consumption.

[0021] As Figure 6 and Figure 8As shown, in this embodiment, specifically, the clamping assembly 3 includes a support disk 31. The support disk 31 is connected to the driving motor 14. A plurality of limit blocks 32 and a plurality of limit grooves 33 are installed on the support disk 31. The plurality of limit blocks 32 are respectively equidistantly installed on the inner and outer sides of the support disk 31. The plurality of limit grooves 33 are equidistantly installed on the inner side of the support disk 31. The limit blocks 32 on the outer side of the support disk 31 are fixedly connected thereto. The limit blocks 32 inside the support disk 31 are connected to the limit grooves 33. A limit rod 34 is installed inside the limit groove 33. A spring 35 is arranged outside the limit rod 34. The spring 35 can support the inner limit block 32. A spray disk is installed between two limit blocks 32 with opposite openings. When the clamping assembly 3 of the device is in use, it can clamp and fix the semiconductor spray disk to prevent the spray disk from being damaged during the cleaning process. Specifically, during use, first, the staff needs to place the semiconductor spray disk between two limit blocks 32. First, pull the limit block 32 inside the support disk 31, then place the semiconductor spray disk between the two limit blocks 32, and then release the inner limit block 32. The limit block 32 will be pushed by the spring 35 to clamp and fix the semiconductor spray disk. When the support disk 31 rotates driven by the driving motor 14, the support disk 31 rotates clockwise, and the limit block 32 inside the support disk 31 will squeeze the semiconductor spray disk under the action of centrifugal force, thereby strengthening the clamping of the semiconductor spray disk.

[0022] As Figure 5 As shown, in this embodiment, specifically, a vibration cavity 311 is arranged inside the support disk 31. A plurality of rubber balls 312 are installed inside the vibration cavity 311. The rubber balls 312 can collide with each other or collide with the support disk 31. When the support disk 31 of the device rotates, the rubber balls 312 inside it will collide inside the vibration cavity 311. Specifically, during use, because the support disk 31 is driven by the driving motor 14 to rotate clockwise, and because the vibration cavity 311 inside the support disk 31 is not circular, the rubber balls 312 inside the vibration cavity 311 will not always move along the inner wall of the vibration cavity 311, but will collide inside the vibration cavity 311. After the rubber balls 312 collide with each other, the support disk 31 can be shaken more severely. When the support disk 31 shakes, the semiconductor spray disk on the support disk 31 will also shake, and then, in cooperation with the ultrasonic generator 13, the semiconductor spray disk can be better cleaned.

[0023] As Figures 2-5 As shown, in this embodiment, specifically, when the support disk 31 rotates: the inner limit block 32 on the support disk 31 will squeeze the spray disk to limit the position of the spray disk; The rubber balls 312 can collide with each other on the support disk 31 to generate vibration; When the support disk 31 rotates driven by the driving motor 14, the support disk 31 rotates clockwise. The limiting block 32 inside the support disk 31 will squeeze the semiconductor spraying disk under the action of centrifugal force, thereby strengthening the clamping of the semiconductor spraying disk. The vibration cavity 311 inside the support disk 31 is not circular, so the rubber balls 312 inside the vibration cavity 311 will not always move along the inner wall of the vibration cavity 311, but will collide inside the vibration cavity 311, thereby enhancing the cleaning effect.

[0024] As Figures 2-5 shown, in this embodiment, specifically, the flushing component 4 includes an L-shaped support plate 41. The L-shaped support plate 41 is fixedly installed above the partition plate 111. The output end of the L-shaped support plate 41 cooperates with the support disk 31. The L-shaped support plate 41 is connected to the water tank 22 provided with ultrapure water. The output end of the L-shaped support plate 41 is installed with a spray head 42, and the spray head 42 cooperates with the spraying disk on the support disk 31; When the flushing component 4 of the device is in use, the flushing component 4 can flush the semiconductor spraying disk, thereby cleaning the impurities on the semiconductor spraying disk. Specifically, when in use, the water tank 22 provided with ultrapure water can supply ultrapure water to the L-shaped support plate 41. Finally, the ultrapure water can be discharged through the spray head 42 at the output end of the L-shaped support plate 41. The spray head 42 is located above the semiconductor spraying disk, so it can accurately clean the semiconductor spraying disk. After the cleaning is completed, the ultrapure water will be collected separately, and the collected ultrapure water also needs to be filtered multiple times to prevent the ultrapure water from being polluted.

[0025] As Figures 1-2 shown in FIGS. 6 and 7, in this embodiment, specifically, the drying component 5 includes multiple groups of support frames 51. Multiple groups of drying sheets 52 and multiple groups of flat-round copper tubes 53 are installed between the support frames 51. Multiple groups of drying sheets 52 are installed inside the outermost part of the support frames 51. Multiple groups of heating wires 54 are equidistantly installed on the outermost part of the support frames 51. Multiple groups of flat-round copper tubes 53 are installed between the heating wires 54 and the drying sheets 52. The output ends of the drying sheets 52 face the flat-round copper tubes 53. Each group of drying sheets 52 cooperates with two groups of flat-round copper tubes 53. The output ends of the drying sheets 52 are in the shape of sharp blades. The diameter of one end of the flat-round copper tube 53 close to the drying sheet 52 is larger than the other end. The drying sheets 52 and the flat-round copper tubes 53 are respectively connected to the controller 6. The drying sheets 52 are equidistantly provided with serrated grooves. The cooperation between the drying sheets 52 and the flat-round copper tubes 53 can generate ionic wind; When the drying component 5 of the device is in use, it can dry the semiconductor spray tray. Specifically, when in use, the drying component 5 can generate ion wind. The ion wind is mainly caused by the movement of current from the strong pole to the weak pole. The output end of the drying sheet 52 cooperates with the oval copper tube 53. Then, the drying sheet 52 discharges electricity towards the oval copper tube 53. Since the output end of the drying sheet 52 is provided with equidistant serrated grooves, the power generation area can be increased, and thus the wind force of the ion wind can be increased. The outermost part of the support frame 51 is provided with a heating wire 54, which can generate heat. When the ion wind passes through the heating wire 54, hot air flow can be generated to dry the semiconductor spray tray.

[0026] As Figures 2-3 shown, in this embodiment, specifically, multiple ultrasonic generators 13 are equidistantly installed inside the box body 11. The ultrasonic generators 13 cooperate with the water tank 22 containing acid solution, alkali solution and pure water. The ultrasonic generators 13 can clean the semiconductor spray tray through the liquid medium. When the ultrasonic generator 13 of this device is in use, it can indirectly clean the semiconductor spray tray through pure water, acid-containing liquid and alkali-containing liquid, and then clean the particles existing on the semiconductor spray tray.

[0027] As Figure 4 and Figure 9 shown, in this embodiment, specifically, a recycling motor 212 is installed above the recycling box 21. A transmission rod is installed inside the recycling box 21. Multiple stirring rods 213 and scraping plates 214 are installed on the transmission rod. The output end of the recycling motor 212 is connected to the transmission rod. The stirring rods 213 and the scraping plates 214 are equidistantly installed on the transmission rod, and the scraping plates 214 are in contact with the inner wall of the recycling box 21. When the recycling box 21 of this device is in use, the recycling motor 212 on the recycling box 21 will drive the stirring rods 213 and the scraping plates 214 to rotate. The stirring rods 213 can rotate to stir the liquid in the recycling box 21, and the scraping plates 214 can scrape the residual liquid on the inner wall of the recycling box 21. When the device discharges impurities, a certain amount of liquid needs to be left in the recycling box 21, so that the impurities in the liquid can be discharged from the recycling box 21 together when draining the liquid.

[0028] As Figure 1 shown, in this embodiment, specifically, a controller 6 is installed inside the box body 11. The controller 6 is connected to the cleaning equipment main body 1. A control panel is arranged outside the box body 11, and the control panel is connected to the controller 6. When this device is in use, the cleaning equipment main body 1 can be controlled through the controller 6. Since the control panel arranged on the box body 11 is connected to the controller 6, the staff can indirectly control the cleaning equipment main body 1 through the control panel.

[0029] Working principle: When this device is in use, first, the semiconductor spray plate needs to be placed on the clamping component 3, and the spray plate is fixed by the clamping component 3 to prevent damage to the spray plate during the cleaning process. Then, the end cover 15 of the device can be closed to proceed with subsequent cleaning. Specifically, during use, first, the water supply component 2 injects liquid into the cleaning chamber 12, and the ultrasonic generator 13 is combined to assist in cleaning the semiconductor spray plate. First, the water supply component 2 injects pure water into the cleaning chamber 12, and the ultrasonic generator 13 is combined to conduct a preliminary cleaning of the semiconductor spray plate. Then, all the pure water will discharge the impurities together, and the pure water is recycled through the recycling tank 21 in the water supply component 2. At this time, in order to prevent impurities from existing in the recycled pure water, the recycling tank 21 can be cleaned through the components inside it. After the preliminary cleaning of the semiconductor spray plate, it will be cleaned a second time with acid or alkali to remove the organic residues in the semiconductor spray plate. Then, the acid or alkali will also be recycled to reduce waste of resources. Finally, the water supply component 2 will also cooperate with the flushing component 4 to conduct a final cleaning of the semiconductor spray plate. The flushing component 4 sprays ultrapure water onto the semiconductor spray plate, and then the semiconductor spray plate is finally cleaned with ultrapure water. Then, the ultrapure water will be recycled separately. During the recycling process, not only impurities but also air need to be filtered to prevent the ultrapure water from being contaminated and reduce consumption. Finally, the device will dry the semiconductor spray plate to evaporate the remaining moisture on the semiconductor spray plate. Thus, when this device is in use, it can effectively clean the semiconductor spray plate, reduce the impurities remaining in its production, and enable the cleaned semiconductor spray plate to be directly put into the next process.

[0030] For those skilled in the art, it is obvious that the present invention is not limited to the details of the above exemplary embodiments, and the present invention can be implemented in other specific forms without departing from the spirit or basic characteristics of the present invention. Therefore, from any point of view, the embodiments should be regarded as exemplary and non-limiting. The scope of the present invention is defined by the appended claims rather than the above description. Therefore, all changes falling within the meaning and scope of the equivalent elements of the claims are intended to be encompassed within the present invention. Any reference signs in the claims should not be regarded as limiting the claims involved.

Claims

1. A cleaning device for the production of spray trays with intelligent drying function, comprising a cleaning device main body (1) and a controller (6), characterized in that: The main body (1) of the cleaning device includes a box body (11). Inside the box body (11), there are a cleaning chamber (12) and multiple ultrasonic generators (13). In the middle of the cleaning chamber (12), a partition plate (111) is installed. At the bottom of the partition plate (111), a water supply component (2) and a driving motor (14) are installed. Above the partition plate (111), a clamping component (3) is installed. The clamping component (3) is connected to the driving motor (14). Above the cleaning chamber (12), a flushing component (4) is installed. The flushing component (4) is connected to the water supply component (2). An end cover (15) is installed on the box body (11). At the bottom of the end cover (15), a drying component (5) is provided.

2. The cleaning equipment for the production of the spray tray with an intelligent drying function according to claim 1, characterized in that: The water supply component (2) includes a recycling box (21) and multiple water tanks (22). Above each water tank (22), a water supply pump (221) is installed respectively. Above the partition plate (111), there are multiple water inlets and multiple water outlets. The output end of the water supply pump (221) is connected to the water inlet, and the water outlet is connected to the recycling box. The output end of the recycling box (21) is connected to multiple water tanks (22) respectively. A discharge port (211) is provided at the bottom of the recycling box (21). Acid solution, alkaline solution, ultrapure water and pure water are respectively arranged in multiple water tanks (22).

3. The cleaning equipment for the production of the spray tray with an intelligent drying function according to claim 2, characterized in that: The clamping component (3) includes a support disk (31). The support disk (31) is connected to the driving motor (14). Multiple limit blocks (32) and multiple limit grooves (33) are installed on the support disk (31). Multiple limit blocks (32) are respectively installed equidistantly on the inner side and the outer side of the support disk (31). Multiple limit grooves (33) are installed equidistantly on the inner side of the support disk (31). The limit blocks (32) on the outer side of the support disk (31) are fixedly connected thereto. The limit blocks (32) inside the support disk (31) are connected to the limit grooves (33). A limit rod (34) is installed inside the limit groove (33). A spring (35) is arranged outside the limit rod (34). The spring (35) can support the inner limit block (32). A spray disk is installed between two opposite limit blocks (32) with openings facing each other.

4. The cleaning equipment for the production of a spray tray with an intelligent drying function according to claim 3, characterized in that: A vibration chamber (311) is arranged inside the support disk (31). Multiple rubber balls (312) are installed inside the vibration chamber (311). The rubber balls (312) can impact each other or impact the support disk (31).

5. The cleaning equipment for the production of the spray tray with an intelligent drying function according to claim 4, wherein: When the support disk (31) rotates: the inner limit block (32) on the support disk (31) will squeeze the spray disk to limit the position of the spray disk; The rubber balls (312) can impact each other in the support disk (31) to generate vibration.

6. The cleaning equipment for the production of the spray tray with intelligent drying function according to claim 5, characterized in that: The rinsing assembly (4) includes an L-shaped support plate (41). The L-shaped support plate (41) is fixedly installed above the partition plate (111). The output end of the L-shaped support plate (41) is matched with the support disk (31). The L-shaped support plate (41) is connected to a water tank (22) containing ultrapure water. A spray head (42) is installed at the output end of the L-shaped support plate (41). The spray head (42) is matched with the spray disk on the support disk (31).

7. The cleaning equipment for the production of the spray tray with intelligent drying function according to claim 6, characterized in that: The drying assembly (5) includes multiple groups of support frames (51). Multiple groups of drying sheets (52) and multiple groups of flat-round copper tubes (53) are installed between the support frames (51). Multiple groups of the drying sheets (52) are installed in the innermost part of the support frames (51). Multiple groups of heating wires (54) are equidistantly installed on the outermost part of the support frames (51). Multiple groups of flat-round copper tubes (53) are installed between the heating wires (54) and the drying sheets (52). The output end of the drying sheet (52) faces the flat-round copper tube (53). Each group of the drying sheets (52) is matched with two groups of flat-round copper tubes (53). The output end of the drying sheet (52) is in the shape of a sharp blade. The diameter of one end of the flat-round copper tube (53) close to the drying sheet (52) is larger than that of the other end. The drying sheets (52) and the flat-round copper tubes (53) are respectively connected to the controller (6). The drying sheets (52) are equidistantly provided with serrated grooves. The cooperation between the drying sheets (52) and the flat-round copper tubes (53) can generate ionic wind.

8. The cleaning equipment for the production of the spray tray with an intelligent drying function according to claim 7, characterized in that: Multiple groups of ultrasonic generators (13) are equidistantly installed inside the box body (11). The ultrasonic generators (13) are matched with a water tank (22) containing acid solution, alkali solution and pure water. The ultrasonic generators (13) can clean the semiconductor spray disk through a liquid medium.

9. The cleaning equipment for the production of a spray tray with an intelligent drying function according to claim 8, characterized in that: A recovery motor (212) is installed above the recovery box (21). A transmission rod is installed inside the recovery box (21). Multiple groups of stirring rods (213) and scraping plates (214) are installed on the transmission rod. The output end of the recovery motor (212) is connected to the transmission rod. The stirring rods (213) and the scraping plates (214) are equidistantly installed on the transmission rod. The scraping plates (214) are in contact with the inner wall of the recovery box (21).

10. The cleaning equipment for the production of the spray tray with an intelligent drying function according to claim 9, characterized in that: The controller (6) is installed inside the box body (11). The controller (6) is connected to the cleaning equipment main body (1). A control panel is arranged outside the box body (11). The control panel is connected to the controller (6).

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