A hot-press welding apparatus and its welding method

Abstract

This invention discloses a hot-press welding apparatus and its welding method, specifically relating to the field of hot-press welding. The hot-press welding apparatus includes a base, a machine platform mounted on the base, a welding mechanism mounted on the machine platform, and an electrical box mounted on the machine platform. A pressure head assembly is mounted on the electrical box. The welding mechanism includes a support base, on which a support seat is mounted. A flexible plate platform is provided on one side of the support seat, and the flexible plate platform is used to mount a perforated plate. A window is opened at the connecting end of the perforated plate, within which a suspended piece is suspended. A rigid plate platform is provided on the side of the support seat away from the flexible plate platform. This invention uses protrusions to provide reverse support for multiple suspended pieces, preventing bending or breakage of the suspended pieces due to pressure concentration when the solder pads and solder are pressed down. A fixed support plate supports the window of the perforated plate, preventing deformation of the window from affecting the welding accuracy between the suspended piece and the solder pad, thus ensuring the pass rate of hot-press welding of the perforated plate.

Description

Technical Field

[0001] This invention relates to the field of hot press welding technology, and more specifically, to a hot press welding apparatus and a welding method thereof. Background Technology

[0002] Pulse thermocompression welding is mainly used to achieve high-precision, low-heat-damage welding of irregular or flexible materials, such as the connection of PCB (rigid circuit board) and FPC (flexible circuit board). High-energy pulse current can be applied at the moment of welding to rapidly raise the local temperature to the melting point of the solder (such as 200~300℃). The heating time is short (millisecond level), avoiding carbonization or delamination of PCB / FPC substrate due to continuous high temperature.

[0003] FPCs mainly include single-sided and double-sided boards. Single-sided boards have only a single layer of circuitry and are suitable for simple circuit connections. When the circuit design only requires a single layer of circuitry but double-sided connections are needed, a special type of single-sided board is required: the single-copper double-sided board, also known as a perforated board. This board has windows on the flexible board substrate, and suspended finger circuitry is set inside the windows. The suspended finger circuitry facilitates double-sided connections. This perforated board not only retains the flexural properties of a single-sided board but also has the double-sided connection function of a double-sided board.

[0004] In existing technology, when soldering the finger lines of a cutout board to the pads of a PCB, the cutout board is first fixed on a soldering table, then solder is applied to the upper surface of the finger lines, the PCB pads are aligned above the finger lines, and then the PCB pads are heated and pressed down by a hot press head, so that the solder melts and then solidifies, thus soldering and fixing the pads to the finger lines. Finally, the cutout board is flipped over and the same steps are performed on the other side of the finger lines.

[0005] However, in order to distribute bending stress and avoid the hot press head at the window, the length and width of the perforated plate need to be increased, which leads to an increase in the overhang length of the finger lines. Since there is a recess at the window, in order to make the pads fit tightly with the finger lines, the downward pressure of the hot press head needs to be increased. Therefore, during hot press welding, the overhanging finger lines at the solder joints with solder are subjected to pressure concentration, causing the solder joints of the overhanging finger lines to bend or even break, resulting in unqualified or damaged hot press welding of the perforated plate. Summary of the Invention

[0006] The present invention provides a hot-press welding device and welding method, which aims to solve the following problem: When performing hot-press welding on a perforated plate, the existing hot-press welding device causes the weld points of the suspended finger lines to bend or even break due to the large window and long finger lines of the perforated plate and the concentrated pressure of the hot press head.

[0007] To achieve the above objectives, the present invention provides the following technical solution: a hot-press welding device, comprising a base, a platform mounted on the base, a welding mechanism mounted on the platform, an electrical box mounted on the platform, a pressure head assembly mounted on the electrical box, the welding mechanism comprising a support base, a support seat mounted on the support base, a flexible board platform on one side of the support seat for mounting a perforated board, a window opening at the connecting end of the perforated board with a suspended piece suspended within the window, a rigid board platform on the side of the support seat away from the flexible board platform for mounting a PCB board, a solder pad at the connecting end of the PCB board, and the suspended piece of the perforated board being fixed to the solder pad of the PCB board by soldering; a reverse support member is mounted on the support base, and the reverse support member is located on the side of the suspended piece away from the solder pad.

[0008] In a preferred embodiment, the reverse support includes a pad, a protrusion fixedly provided on the top of the pad and abutting against the bottom surface of the suspended plate, a pressure sensor installed inside the protrusion, a fixed support plate installed on the pad and located at the bottom of the hollow plate.

[0009] In a preferred embodiment, an installation base is installed inside the electrical box, a pulse generator is installed on the installation base, a fixed platform is installed on one side of the installation base, a second linear driver is installed on the fixed platform, and the output end of the second linear driver is connected to the pressure head assembly.

[0010] In a preferred embodiment, the pressure head assembly includes a heating base, a hot pressure head is mounted on the bottom of the heating base, a rigid plate pressure block is provided on one side of the hot pressure head, and the rigid plate pressure block is detachably connected to the heating base.

[0011] In a preferred embodiment, a linear drive mechanism is mounted on the machine base, the output end of the linear drive mechanism is connected to the support base, a fixture plate is mounted on the flexible board carrier, the edge of the fixture plate is provided with positioning blocks, a positioning groove is opened on the flexible board carrier, and the positioning blocks are positioned and connected to the positioning groove by screws.

[0012] In a preferred embodiment, a side plate assembly is installed on the fixed support plate. The side plate assembly includes a first side plate and a second side plate, and the first side plate and the second side plate are located on both sides of the suspended piece, respectively.

[0013] In a preferred embodiment, the pad is provided with a movable support plate, the fixed support plate has an opening inside, and a support column is fixedly provided on both the first side plate and the second side plate. The support column passes through the opening and is fixedly connected to the movable support plate. A first linear driver is installed on the support base, and the output end of the first linear driver is connected to the movable support plate.

[0014] In a preferred embodiment, a limiting groove is provided in the middle of the protrusion, and limiting ports are provided at both ends of the movable support plate. The limiting ports are adapted to the two ends of the protrusion. The middle of the movable support plate is slidably disposed inside the limiting groove. Guide blocks are fixedly provided on both sides of the pad. A guide post passes through the inside of the guide block, and the top of the guide post is fixedly connected to the movable support plate.

[0015] In a preferred embodiment, a receiving groove is provided on the opposite side of each of the two adjacent sets of No. 1 and No. 2 side plates, and a collection chamber is provided inside each of the No. 1 and No. 2 side plates. A guide plate is installed on the side of the collection chamber corresponding to the receiving groove, and a sealing block is detachably connected to the bottom of the collection chamber.

[0016] The present invention also provides a welding method for a hot-press welding apparatus, comprising the following steps:

[0017] S1: The linear drive mechanism drives the support base to extend, the cutout plate is installed on the fixture plate, the solder is applied to the suspended plate, the PCB board is installed on the rigid board platform, and the solder pads of the PCB board are pressed on the solder.

[0018] S2: The linear drive mechanism drives the support base to retract to below the pressure head assembly. The hot pressure head of the pressure head assembly aligns with the pads of the PCB board and performs hot pressure. The suspended piece is supported from the bottom by the bump, the window of the cutout plate is supported by the fixed support plate, and the pressure data of the cutout plate is detected in real time by the pressure sensor.

[0019] S3: The first linear driver drives the movable pallet to rise, so that the top of the side panel assembly abuts against the PCB board, and the two adjacent sets of side panels No. 1 and No. 2 respectively block the sides of the corresponding suspended piece.

[0020] S4: The movable pallet is driven to descend by the first linear driver, and the first and second side plates move to the sides below the suspended plate. The hot-melt solder overflowing from both sides of the suspended plate is collected by the receiving groove and the guide plate.

[0021] The beneficial effects of this invention are as follows:

[0022] This invention uses bumps to provide reverse support for multiple suspended pieces, preventing the suspended pieces from bending or breaking due to pressure concentration when the pads and solder are pressed down. The fixed support plate supports the window of the cutout plate, preventing deformation of the window of the cutout plate from affecting the welding accuracy between the suspended pieces and the pads, and ensuring the pass rate of hot-press welding of the cutout plate.

[0023] The present invention uses a first linear actuator to drive the movable support plate and side plate assembly to rise, so that the first side plate and the second side plate block the two sides of the suspended plate, which facilitates the solder to flow along the axial direction of the suspended plate.

[0024] This invention lowers the first and second side plates, scraping the solder adhering to the sides of the first and second side plates onto the suspended plate. A small amount of solder flows to both sides without additional pressure and is collected through the receiving groove, thus avoiding the difficulty in separating the bump from the suspended plate due to solder adhering to the bump. Attached Figure Description

[0025] Figure 1 This is a schematic diagram of the overall structure of the present invention.

[0026] Figure 2 This is a schematic diagram of the machine tool structure of the present invention.

[0027] Figure 3 This is a schematic diagram of the flexible plate carrier structure of the present invention.

[0028] Figure 4 This is a schematic diagram of the pressure head assembly structure of the present invention.

[0029] Figure 5 This is a top view schematic diagram of the perforated plate installation according to the present invention.

[0030] Figure 6 This is a schematic diagram of the end structure of the support base of the present invention.

[0031] Figure 7 This is a three-dimensional structural diagram of the side panel assembly of the present invention.

[0032] Figure 8 This is a schematic diagram of the cross-sectional structure of the second side plate of the present invention.

[0033] Figure 9 This is a schematic diagram of the fixed support plate structure of the present invention.

[0034] Figure 10 This is a schematic diagram of the pad structure of the present invention.

[0035] Figure 11 This is a schematic diagram of the welding method of the present invention.

[0036] The attached figures are labeled as follows: 1. Machine base; 2. Machine platform; 3. Welding mechanism; 31. Support base; 32. Support seat; 321. Pad; 322. Pressure sensor; 323. Limiting groove; 324. Protrusion; 33. Flexible plate platform; 331. Fixture plate; 332. Positioning block; 333. Positioning groove; 34. Rigid plate platform; 35. Fixed support plate; 351. Opening; 36. Side plate assembly; 361. First side plate; 362. Second side plate; 363. Receiving groove; 364. Collection chamber; 365. Support 366. Support column; 367. Guide plate; 37. Blocking block; 38. Movable support plate; 39. Limiting port; 40. Guide block; 51. Guide column; 62. First linear actuator; 73. Electrical box; 84. Mounting base; 95. Pulse generator; 10. Second linear actuator; 11. Pressure head assembly; 12. Heating base; 13. Hot pressure head; 14. Hard plate pressure block; 15. Fixed platform; 16. Linear drive mechanism; 17. Hollow plate; 18. Suspended plate; 19. PCB board; 20. Solder pad; 20. Solder. Detailed Implementation

[0037] The present application will now be described in further detail with reference to the accompanying drawings. It should be noted that the following specific embodiments are only used to further illustrate the present application and should not be construed as limiting the scope of protection of the present application. Those skilled in the art can make some non-essential improvements and adjustments to the present application based on the above application content.

[0038] Refer to the instruction manual appendix Figures 1 to 6 A hot-press welding apparatus includes a base 1, a platform 2 mounted on the base 1, a welding mechanism 3 mounted on the platform 2, an electrical box 4 mounted on the platform 2, and a pressure head assembly 44 mounted on the electrical box 4. The welding mechanism 3 includes a support base 31, a support seat 32 mounted on the support base 31, a flexible plate carrier 33 on one side of the support seat 32, and the flexible plate carrier 33 is used to mount a perforated plate 7. The connecting end of the perforated plate 7 has a window, and a suspension piece 71 is suspended in the window. The support base 3... A rigid board stage 34 is provided on the side away from the flexible board stage 33, and the rigid board stage 34 is used to install the PCB board 8. The connecting end of the PCB board 8 is provided with a solder pad 81. The suspended piece 71 of the cutout board 7 is fixed to the solder pad 81 of the PCB board 8 by solder 9. A reverse support is installed on the support base 32, and the reverse support is located on the side of the suspended piece 71 away from the solder pad 81. When the pressure head assembly 44 presses down on the PCB board 8 and the cutout board 7, the reverse support provides reverse support to the cutout board 7.

[0039] It should be noted that the pad 81 is protruding, the solder 9 is made of tin or other hot-press solder, the width of the reverse support is slightly smaller than the width of the suspended piece 71, and the rigid board stage 34 is provided with positioning holes for positioning the PCB board 8.

[0040] Furthermore, the reverse support includes a pad 321, a protrusion 324 is fixedly provided on the top of the pad 321, and the protrusion 324 abuts against the bottom surface of the suspended plate 71. A pressure sensor 322 is installed inside the protrusion 324. A fixed support plate 35 is installed on the pad 321, and the fixed support plate 35 is located at the bottom of the hollow plate 7.

[0041] It should be noted that the pad 321 is detachably mounted on the support base 32, and the fixing plate 35 is fixed at the upper part of the center of the protrusion 324.

[0042] Furthermore, an installation base 41 is installed inside the electrical box 4, a pulse generator 42 is installed on the installation base 41, a fixed platform 5 is installed on one side of the installation base 41, a second linear driver 43 is installed on the fixed platform 5, and the output end of the second linear driver 43 is connected to the pressure head assembly 44.

[0043] It should be noted that the pulse generator 42 is electrically connected to the second linear driver 43, which is a common operation for those skilled in the art.

[0044] Furthermore, the pressure head assembly 44 includes a heating base 441, a hot pressure head 442 is mounted on the bottom end of the heating base 441, a rigid plate pressure block 443 is provided on one side of the hot pressure head 442, and the rigid plate pressure block 443 is detachably connected to the heating base 441.

[0045] It should be noted that the heating seat 441 is equipped with a heater inside, which is connected to the hot press head 442. The hot press head 442 is a heat-conducting material component, and the hard plate pressing block 443 is a rubber material component.

[0046] Furthermore, a linear drive mechanism 6 is installed on the machine base 2. The output end of the linear drive mechanism 6 is connected to the support base 31. A fixture plate 331 is installed on the flexible board platform 33. A positioning block 332 is provided on the edge of the fixture plate 331. A positioning groove 333 is opened on the flexible board platform 33. The positioning block 332 is positioned and connected to the positioning groove 333 by screws.

[0047] It should be noted that the positioning block 332 presses down on the edge of the hollow plate 7 on the fixture plate 331 for positioning.

[0048] In this embodiment, the specific implementation scenario is as follows: the linear drive mechanism 6 drives the support base 31 to move away from the electrical box 4, placing the cutout plate 7 on the fixture plate 331. The positioning block 332 presses down on the edge of the cutout plate 7 for positioning. Solder 9 is applied to the suspended piece 71. The PCB board 8 is mounted on the rigid board stage 34 and fixed through the positioning holes. At this time, the protrusion 324 extends from the bottom into the window of the cutout plate 7 and abuts against the bottom of the suspended piece 71. The fixing plate 35 is supported outside the window of the cutout plate 7. The hot press head 442 indirectly heats the solder 9 to a hot melt state, causing the solder 9 to flow between the suspended piece 71 and the pad 81. The second linear actuator 43 presses down to make the suspended piece 71 fit tightly against the pad 81. After the solder 9 cools and solidifies, the hot pressing welding is completed. The hot pressing head 442 is removed and the support base 31 is extended by the linear drive mechanism 6 to remove the cutout plate 7 and PCB board 8. The entire assembly is supported by the protrusions 324 to prevent the suspended pieces 71 from bending or breaking due to pressure concentration when the pad 81 and solder 9 are pressed down. The window of the cutout plate 7 is supported by the fixed support plate 35 to prevent the welding accuracy between the suspended piece 71 and the pad 81 from being affected by the deformation of the window of the cutout plate 7, thus ensuring the pass rate of hot pressing welding of the cutout plate 7.

[0049] Refer to the instruction manual appendix Figures 5 to 10 During the hot pressing stage, the flowing solder 9 overflows to both sides, causing the bump 324 to be covered with solder 9. After the solder 9 cools and solidifies, the bump 324 and the suspended piece 71 are difficult to separate.

[0050] To solve this problem, the following technical solution is also provided: a side plate assembly 36 is installed on the fixed support plate 35. The side plate assembly 36 includes a first side plate 361 and a second side plate 362, and the first side plate 361 and the second side plate 362 are located on both sides of the suspended piece 71, respectively.

[0051] It should be noted that the surface of the first side plate 361 and the second side plate 362 opposite to the suspended piece 71 is a smooth surface, and this side is treated with anti-sticking material.

[0052] Furthermore, the pad 321 is provided with a movable support plate 37, and the fixed support plate 35 has an opening 351 inside. Support columns 365 are fixedly provided on the first side plate 361 and the second side plate 362. The support columns 365 pass through the inside of the opening 351 and are fixedly connected to the movable support plate 37. The support base 32 is equipped with a first linear driver 39, and the output end of the first linear driver 39 is connected to the movable support plate 37.

[0053] It should be noted that when the first linear driver 39 drives the first side plate 361 and the second side plate 362 to rise via the movable support plate 37, the tops of the first side plate 361 and the second side plate 362 abut against the bottom surface of the PCB board 8. When the movable support plate 37 drives the first side plate 361 and the second side plate 362 to fall, the tops of the first side plate 361 and the second side plate 362 are lower than the top surface height of the suspended plate 71.

[0054] Furthermore, a limiting groove 323 is provided in the middle of the protrusion 324, and limiting ports 371 are provided at both ends of the movable support plate 37. The limiting ports 371 are adapted to the two ends of the protrusion 324. The middle part of the movable support plate 37 is slidably disposed inside the limiting groove 323. Guide blocks 38 are fixedly provided on both sides of the pad 321. A guide post 381 passes through the inside of the guide block 38, and the top of the guide post 381 is fixedly connected to the movable support plate 37.

[0055] It should be noted that the movable pallet 37 is H-shaped, with its middle part assembled with the limiting groove 323 to play a lateral limiting role, while the guide block 38 and guide post 381 play a guiding role when moving vertically.

[0056] Furthermore, each of the two adjacent sets of side plates 361 and 362 has a receiving groove 363 on the opposite side. Both side plates 361 and 362 have a collection chamber 364 inside. A guide plate 366 is installed on the side of the collection chamber 364 corresponding to the receiving groove 363. A sealing block 367 is detachably connected to the bottom of the collection chamber 364.

[0057] It should be noted that the cross-section of the receiving trough 363 is L-shaped, and the upper surface of the guide vane 366 is an inclined surface.

[0058] In this embodiment, the specific implementation scenario is as follows: During the hot pressing stage, the first linear actuator 39 drives the movable support plate 37 and the side plate assembly 36 to rise, causing the first side plate 361 and the second side plate 362 to block the sides of the suspended plate 71, facilitating the axial flow of the solder 9 along the suspended plate 71. Before the solder 9 solidifies, the downward pressure of the hot pressing head 442 is removed, and the first side plate 361 and the second side plate 362 are lowered. The solder 9 adhering to the sides of the first side plate 361 and the second side plate 362 is scraped onto the suspended plate 71. A small amount of solder 9 flows to both sides without additional pressure and passes through the receiving groove 36. 3. The solder 9 is collected into the collection chamber 364 through the guide plate 366. The sealing block 367 is then removed to clean out the solder 9 collected in the collection chamber 364 for reuse. The first side plate 361 and the second side plate 362 prevent the flowing solder 9 from overflowing to both sides. The solder 9 adhering to the surface of the first side plate 361 and the second side plate 362 is scraped off by moving the first side plate 361 and the second side plate 362 down and left on the suspended plate 71. The small amount of solder 9 that overflows from both sides without additional pressure is collected through the collection chamber 364 to prevent the bump 324 from being difficult to separate from the suspended plate 71 due to the solder 9 adhering to it.

[0059] Working principle:

[0060] 1. The linear drive mechanism 6 drives the support base 31 to move away from the electrical box 4, and the cutout plate 7 is placed on the fixture plate 331. The positioning block 332 presses down on the edge of the cutout plate 7 for positioning. Solder 9 is applied to the suspended piece 71. The PCB board 8 is installed on the rigid board stage 34 and fixed through the positioning holes.

[0061] 2. The protrusion 324 extends from the bottom into the window of the perforated plate 7 and abuts against the bottom of the suspended piece 71, while the fixed support plate 35 is supported outside the window of the perforated plate 7.

[0062] Third, the movable support plate 37 and the side plate assembly 36 are raised by the first linear driver 39, so that the first side plate 361 and the second side plate 362 block the two sides of the suspended plate 71.

[0063] Fourth, the solder 9 is indirectly heated by the hot press head 442 to make it hot melt, so that the solder 9 flows between the suspended piece 71 and the pad 81. The second linear driver 43 presses down to make the suspended piece 71 and the pad 81 fit tightly. After the solder 9 cools and solidifies, the hot press welding is completed.

[0064] 5. Remove the hot press head 442 and lower the first side plate 361 and the second side plate 362. The solder 9 adhering to the sides of the first side plate 361 and the second side plate 362 is scraped onto the suspended plate 71. A small amount of solder 9 flows to both sides without additional pressure and is collected through the receiving groove 363. The support base 31 is extended by the linear drive mechanism 6, and the cutout plate 7 and PCB board 8 can be removed.

[0065] Refer to the instruction manual appendix Figure 11 The present invention also provides a welding method for a hot-press welding apparatus, comprising the following steps:

[0066] S1: The linear drive mechanism 6 drives the support base 31 to extend, the cutout plate 7 is installed on the fixture plate 331, the solder 9 is applied to the suspended plate 71, the PCB board 8 is installed on the rigid board stage 34, and the solder pads 81 of the PCB board 8 are pressed on the solder 9.

[0067] S2: The linear drive mechanism 6 drives the support base 31 to retract to below the pressure head assembly 44. The hot pressure head 442 of the pressure head assembly 44 aligns with the pad 81 of the PCB board 8 and performs hot pressure. The protrusion 324 supports the suspended piece 71 from the bottom. The fixed support plate 35 supports the window of the cutout plate 7. The pressure sensor 322 detects the pressure data of the cutout plate 7 in real time.

[0068] S3: The first linear driver 39 drives the movable tray 37 to rise, so that the top of the side plate assembly 36 abuts against the PCB board 8, and the two adjacent sets of first side plate 361 and second side plate 362 respectively block the sides of the corresponding suspended piece 71.

[0069] S4: The movable pallet 37 is driven down by the first linear driver 39, and the first side plate 361 and the second side plate 362 move to the sides below the suspended plate 71, and collect the hot melt solder 9 overflowing from both sides of the suspended plate 71 through the receiving groove 363 and the guide plate 366.

[0070] The above embodiments merely illustrate several implementation methods of the present invention, and their descriptions are relatively specific and detailed, but they should not be construed as limiting the scope of the present invention. It should be noted that those skilled in the art can make various modifications and improvements without departing from the concept of the present invention, and these all fall within the protection scope of the present invention.

Claims

1. A hot-press welding apparatus, characterized in that: The machine includes a base (1), on which a machine platform (2) is installed, on which a welding mechanism (3) is installed, on which an electrical box (4) is also installed, on which a pressure head assembly (44) is installed, and the welding mechanism (3) includes a support base (31), on which a support base (32) is installed, and on one side of the support base (32) is a flexible plate carrier (33), and the flexible plate carrier (33) is used to install a perforated plate (7). The connecting end of the perforated plate (7) has a window, and a suspended piece (71) is suspended in the window. The support base (32) is provided with a rigid board platform (34) on the side away from the flexible board platform (33), and the rigid board platform (34) is used to install the PCB board (8). The connecting end of the PCB board (8) is provided with a solder pad (81). The suspended piece (71) of the hollow plate (7) and the solder pad (81) of the PCB board (8) are fixed by solder (9). A reverse support is installed on the support base (32), and the reverse support is located on the side of the suspended piece (71) away from the pad (81); The reverse support includes a pad (321), a protrusion (324) is fixedly provided on the top of the pad (321), and the protrusion (324) abuts against the bottom surface of the suspended plate (71). A pressure sensor (322) is installed inside the protrusion (324). A fixed support plate (35) is installed on the pad (321), and the fixed support plate (35) is located at the bottom of the hollow plate (7). The electrical box (4) is equipped with a mounting base (41), a pulse generator (42) is mounted on the mounting base (41), a fixed platform (5) is mounted on one side of the mounting base (41), a second linear driver (43) is mounted on the fixed platform (5), and the output end of the second linear driver (43) is connected to the pressure head assembly (44). The pressure head assembly (44) includes a heating base (441), a hot pressure head (442) is installed at the bottom of the heating base (441), a hard plate pressure block (443) is provided on one side of the hot pressure head (442), and the hard plate pressure block (443) is detachably connected to the heating base (441).

2. The hot-press welding apparatus according to claim 1, characterized in that: A linear drive mechanism (6) is installed on the machine base (2). The output end of the linear drive mechanism (6) is connected to the support base (31). A jig plate (331) is installed on the flexible board platform (33). A positioning block (332) is provided on the edge of the jig plate (331). A positioning groove (333) is provided on the flexible board platform (33). The positioning block (332) is positioned and connected to the positioning groove (333) by screws.

3. The hot-press welding apparatus according to claim 2, characterized in that: The fixed support plate (35) is equipped with a side plate assembly (36), which includes a first side plate (361) and a second side plate (362), and the first side plate (361) and the second side plate (362) are located on both sides of the suspended piece (71).

4. The hot-press welding apparatus according to claim 3, characterized in that: The pad (321) is provided with a movable tray (37), and the fixed tray (35) has an opening (351) inside. The first side plate (361) and the second side plate (362) are both fixedly provided with support columns (365). The support columns (365) pass through the inside of the opening (351) and are fixedly connected to the movable tray (37). The support base (32) is equipped with a first linear driver (39), and the output end of the first linear driver (39) is connected to the movable tray (37).

5. The hot-press welding apparatus according to claim 4, characterized in that: The protrusion (324) has a limiting groove (323) in the middle, and the movable support plate (37) has limiting ports (371) at both ends. The limiting ports (371) are adapted to the two ends of the protrusion (324). The middle part of the movable support plate (37) is slidably disposed inside the limiting groove (323). Guide blocks (38) are fixedly provided on both sides of the pad (321). A guide post (381) passes through the inside of the guide block (38), and the top of the guide post (381) is fixedly connected to the movable support plate (37).

6. The hot-press welding apparatus according to claim 5, characterized in that: Each of the two adjacent sets of side plates (361 and 362) has a receiving groove (363) on one side opposite to the receiving groove (363). Each of the two side plates (361 and 362) has a collection chamber (364) inside. A guide plate (366) is installed on the side of the collection chamber (364) corresponding to the receiving groove (363). A sealing block (367) is detachably connected to the bottom of the collection chamber (364).

7. A welding method using the hot-press welding apparatus as described in claim 6, characterized in that, Includes the following steps: S1: The support base (31) is extended by the linear drive mechanism (6), the hollow plate (7) is installed on the jig plate (331), the solder (9) is applied to the suspended plate (71), the PCB board (8) is installed on the rigid board stage (34), and the solder pads (81) of the PCB board (8) are pressed on the solder (9); S2: The linear drive mechanism (6) drives the support base (31) to retract to below the pressure head assembly (44). The hot pressure head (442) of the pressure head assembly (44) aligns with the pad (81) of the PCB board (8) and performs hot pressing. The suspended piece (71) is supported from the bottom by the protrusion (324). The window of the cutout plate (7) is supported by the fixed support plate (35). The pressure data of the cutout plate (7) is detected in real time by the pressure sensor (322). S3: The first linear driver (39) drives the movable tray (37) to rise, so that the top of the side panel assembly (36) abuts against the PCB board (8), and the two adjacent sets of No. 1 side panel (361) and No. 2 side panel (362) respectively block the sides of the corresponding suspended piece (71). S4: The movable pallet (37) is driven down by the first linear driver (39), and the first side plate (361) and the second side plate (362) move to the sides below the suspended plate (71). The hot melt solder (9) overflowing from both sides of the suspended plate (71) is collected by the receiving groove (363) and the guide plate (366).

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