Packaging welding structure of semiconductor device

Abstract

The invention relates to the technical field of semiconductor device packaging and welding, in particular to a semiconductor device packaging and welding structure which comprises a welding platform, a supporting frame and a supporting column are fixed to the top of the welding platform, a pressing ring is arranged above the supporting column, a limiting frame is fixed to the top of the pressing ring, and welding grooves are formed in the limiting frame and the pressing ring. A pressing and holding mechanism is arranged in the welding groove, a lifting ring is arranged on the outer side of the pressing ring, the pressing ring is connected with the lifting ring through a rotating mechanism, the lifting ring is connected with the supporting frame through a lifting mechanism, the rotating mechanism is used for driving the pressing ring to rotate, and therefore the position of the pressing and holding mechanism is adjusted; the punching and blowing mechanism is used for blowing air to the semiconductor device; when the semiconductor device is packaged and welded, a punching and blowing effect can be achieved on the semiconductor device and the substrate, the influence of dust on welding of the semiconductor device can be effectively avoided, and the welding effect is guaranteed.

Description

Technical Field

[0001] The present invention relates to the technical field of semiconductor device packaging welding, and specifically to a packaging welding structure for semiconductor devices. Background Art

[0002] Semiconductor packaging welding refers to the process of connecting a semiconductor chip to a package body (such as a substrate, lead frame, etc.) through certain technological means to achieve electrical interconnection and physical protection. This link is crucial for ensuring the performance, reliability, and subsequent applications of semiconductor devices.

[0003] In the prior art, when packaging and welding semiconductor devices, most often the pins on the semiconductor device are first aligned with the solder joints on the surface of the substrate, and then the semiconductor device is welded to the surface of the substrate through welding equipment. However, this welding method is prone to causing the semiconductor device to shift during the welding process, reducing the welding accuracy. At the same time, the substrate and the semiconductor device cannot be self-cleaned, and the dust on the surface of the substrate has a certain impact on welding, reducing the subsequent use effect of the semiconductor device. Summary of the Invention

[0004] The purpose of the present invention is to provide a packaging welding structure for semiconductor devices to solve the problems raised in the above background art.

[0005] To achieve the above purpose, the present invention provides the following technical solutions: A packaging welding structure for semiconductor devices, including a welding platform. A support frame and support columns are fixed on the top of the welding platform. A pressing ring is arranged above the support columns. A limiting frame is fixed on the top of the pressing ring. A welding groove is provided inside the limiting frame and the pressing ring. A pressing mechanism is arranged inside the welding groove and is used for pressing the semiconductor device. An elevating ring is arranged outside the pressing ring. The pressing ring is connected to the elevating ring through a rotating mechanism. The elevating ring is connected to the support frame through a lifting mechanism. The rotating mechanism is used to drive the pressing ring to rotate, thereby adjusting the position of the pressing mechanism. The lifting mechanism is used to drive the elevating ring to move up and down. A blowing mechanism is arranged on the limiting frame and is used for blowing air on the semiconductor device.

[0006] Preferably: The pressing mechanism includes pressing plates arranged on the inner side of the welding groove. Moving blocks are fixed at the ends of the pressing plates. A first threaded rod is threadedly connected to one of the moving blocks. The first threaded rod is rotatably connected to the inner wall of the limiting frame. A limiting rod passes through the inside of the other moving block. The limiting rod is fixed to the inner wall of the limiting frame. A first motor is fixed outside the limiting frame. The output end of the first motor is fixed to one end of the first threaded rod.

[0007] Preferably: the lifting mechanism includes a second threaded rod threadedly connected to the lifting ring, a second motor is installed on the top of the support frame, the output end of the second motor is fixedly connected to one end of the second threaded rod, a guide rod is fixed between the top of the support frame and the welding platform, the guide rod passes through the lifting ring and is slidably connected to the lifting ring.

[0008] Preferably: the rotating mechanism includes a third motor installed on the top of the pressure ring, the output end of the third motor passes through the pressure ring and is fixedly connected to a gear, a gear ring is fixed to the outside of the pressure ring, the gear ring is meshed with the gear, and a supporting groove matched with the pressure ring is provided on the inner wall of the lifting ring, and the side wall of the pressure ring is located inside the supporting groove and is slidably connected to the supporting groove.

[0009] Preferably: the blowing mechanism includes an air cylinder passing through a pressure ring, the air cylinder is fixedly connected to the pressure ring, wherein a piston is slidably connected inside the air cylinder, a push rod is fixed on the top of the piston, the push rod passes through the top of the air cylinder and is slidably connected to the top of the air cylinder, an air pipe is connected above the piston and on the side wall of the air cylinder, a plurality of air holes are provided on the inner wall of the limit frame, the air holes are connected to the air pipe, a push rod is fixed to the bottom of the piston, a fixed cylinder is fixed to the bottom of the air cylinder, the push rod passes through the bottom of the air cylinder and the fixed cylinder, a baffle is fixed to the lower end of the push rod, the baffle is connected to the bottom of the fixed cylinder through a first elastic component, wherein a fixing assembly is provided inside the fixed cylinder, and the fixing assembly is used to fix the push rod.

[0010] Preferably: the fixing assembly includes a groove arranged on the inner wall of the air pressure cylinder, a block is slidably connected inside the groove, one end of the block is connected to the inner wall of the groove through a second elastic component, and the other end of the block is in contact with the side wall of the push rod, wherein the side wall of the push rod is provided with a slot adapted to the block, and the block is traction-connected with a traction component, which is used to pull the block so that the block no longer fixes the push rod.

[0011] Preferably: the traction component includes a push block arranged above the fixed cylinder, the end of the push block extends to the outside of the fixed cylinder, a slide rod is fixed to the bottom of the push block, the lower end of the slide rod extends into the interior of the fixed cylinder and is slidably connected to the fixed cylinder, wherein a traction rope is fixed to the lower end of the slide rod, the other end of the traction rope extends into the groove and is fixedly connected to the clamping block, an extrusion block for extruding the push block is fixed to the top of the welding platform, the extrusion block is arranged in a ring shape, and a clearance groove is provided on the inner side of the extrusion block and the surface of the welding platform.

[0012] Compared with the prior art, the present invention has the following beneficial effects: the present invention can effectively improve the stability of the semiconductor device during welding by pressing the semiconductor device on the surface of the substrate through the pressing plate, and can also adjust the position and direction of the pressing plate so that the pressing plate can press the semiconductor devices at different positions, thereby increasing the scope of application and facilitating the welding of the semiconductor device by the staff; In the present invention, the pressing ring drives the pressing plate and the air pressure cylinder to move downward. When the pressing ring moves downward to a certain position, the extrusion ring at the top of the welding platform extrudes the push block, and the push block drives the sliding rod to move upward relative to the fixed cylinder. The sliding rod then pulls the clamping block through the traction rope. When the pressing plate just completes the pressing of the semiconductor device, the traction rope just pulls the clamping block into the groove. Losing the limit of the clamping block, the piston quickly extrudes the gas above the air pressure cylinder, and the gas inside the air pressure cylinder quickly enters the trachea, so that the gas can be discharged from the air hole at a relatively fast speed, playing a blowing role on the semiconductor device and the substrate, effectively avoiding the influence of dust on the welding of the semiconductor device, and ensuring the welding effect. BRIEF DESCRIPTION OF THE DRAWINGS

[0013] Figure 1 It is a schematic diagram of the overall structure in an embodiment of the present invention.

[0014] Figure 2 It is a schematic diagram of the connection structure of the lifting ring in an embodiment of the present invention.

[0015] Figure 3 It is a schematic diagram of the connection structure between the pressing ring and the lifting ring in an embodiment of the present invention Figure 1 .

[0016] Figure 4 It is a schematic diagram of the connection structure between the pressing ring and the lifting ring in an embodiment of the present invention Figure 2 .

[0017] Figure 5 It is a schematic diagram of the connection structure of the pressing plate in an embodiment of the present invention.

[0018] Figure 6 It is a schematic diagram of the external structure of the air pressure cylinder in an embodiment of the present invention.

[0019] Figure 7 It is a cross-sectional view of the internal structures of the air pressure cylinder and the fixed cylinder in an embodiment of the present invention.

[0020] Figure 8 is Figure 7 the enlarged view at A in

[0021] In the figure: 1 - support frame; 2 - welding platform; 3 - pressing mechanism; 31 - first threaded rod; 32 - first motor; 33 - moving block; 34 - pressing plate; 35 - limiting rod; 4 - lifting mechanism; 41 - guiding rod; 42 - second threaded rod; 43 - second motor; 5 - rotating mechanism; 51 - gear; 52 - toothed ring; 53 - third motor; 54 - support groove; 6 - blowing mechanism; 61 - air holes; 62 - air pressure cylinder; 63 - resisting rod; 64 - fixed cylinder; 65 - air pipe; 66 - push rod; 67 - first elastic member; 68 - baffle; 69 - pushing block; 610 - piston; 611 - sliding rod; 612 - towing rope; 613 - second elastic member; 614 - clamping block; 615 - clamping groove; 616 - extrusion block; 617 - relief groove; 7 - pressing ring; 8 - limiting frame; 9 - lifting ring; 10 - welding groove; 11 - support column. Detailed implementation manner

[0022] In order to make the objectives, technical solutions and advantages of the present invention more clear and understandable, the present invention will be further described in detail below with reference to the accompanying drawings and embodiments. It should be understood that the specific embodiments described herein are only used to explain the present invention and are not used to limit the present invention.

[0023] The following describes in detail the specific implementation of the present invention with reference to specific embodiments.

[0024] In one embodiment, please refer to Figure 1 , Figure 2 , Figure 3 and Figure 4 , a semiconductor device packaging and welding structure, including a welding platform 2, a support frame 1 and a support column 11 are fixed on the top of the welding platform 2, a pressing ring 7 is arranged above the support column 11, a limiting frame 8 is fixed on the top of the pressing ring 7, a welding groove 10 is arranged inside the limiting frame 8 and the pressing ring 7, a pressing mechanism 3 is arranged inside the welding groove 10, the pressing mechanism 3 is used for pressing a semiconductor device, a lifting ring 9 is arranged outside the pressing ring 7, the pressing ring 7 is connected to the lifting ring 9 through a rotating mechanism 5, the lifting ring 9 is connected to the support frame 1 through a lifting mechanism 4, the rotating mechanism 5 is used for driving the pressing ring 7 to rotate, so as to adjust the position of the pressing mechanism 3, and the lifting mechanism 4 is used for driving the lifting ring 9 to move up and down. An air blowing mechanism 6 is arranged on the limiting frame 8, and the air blowing mechanism 6 is used for blowing air on the semiconductor device.

[0025] In this embodiment, when the device welds a semiconductor device, first place the substrate on the top of the support column 11, place the semiconductor device (such as a chip) on the surface of the substrate, and align the pins on the semiconductor device with the solder joints. After placing, drive the pressing ring 7 to rotate through the rotating mechanism 5, so as to adjust the position of the pressing mechanism 3 inside the welding groove 10. After the position of the pressing mechanism 3 is adjusted, drive the lifting ring 9 to move downward through the lifting mechanism 4. The lifting ring 9 drives the pressing ring 7 to move downward, and presses the semiconductor device on the substrate surface through the pressing mechanism 3 inside the welding groove 10, which can effectively avoid the phenomenon of shaking during the welding process of the semiconductor device and ensure the welding effect of the semiconductor device. After the semiconductor device is pressed, the staff can weld the semiconductor device on the substrate surface inside the welding groove 10 through a welding tool. And after the pressing mechanism 3 presses the semiconductor device on the substrate surface, the blowing mechanism 6 inside the limiting frame 8 blows air on the surface of the semiconductor device, playing a blowing role on the semiconductor device and the substrate, which can effectively avoid the influence of dust on the welding of the semiconductor device and ensure the welding effect.

[0026] Please refer to Figure 5 , the pressing mechanism 3 includes a pressing plate 34 arranged inside the welding groove 10. Moving blocks 33 are fixed at both ends of the pressing plate 34. A first threaded rod 31 is threadedly connected to one of the moving blocks 33. The first threaded rod 31 is rotatably connected to the inner wall of the limiting frame 8. A limiting rod 35 passes through the other moving block 33, and the limiting rod 35 is fixedly connected to the inner wall of the limiting frame 8. A first motor 32 is fixed outside the limiting frame 8, and the output end of the first motor 32 is fixedly connected to one end of the first threaded rod 31; When welding a semiconductor device, drive the first threaded rod 31 to rotate through the first motor 32, and drive the pressing plate 34 to move horizontally through the threaded connection between the first threaded rod 31 and the moving block 33, so that the pressing plate 34 can press chips at different positions, effectively improving the applicable range of the device. The limiting rod 35 can play a limiting role on the pressing plate 34 through the moving block 33, effectively improving the stability of the pressing plate 34 during movement.

[0027] Please refer to Figure 1 and Figure 2 , the lifting mechanism 4 includes a second threaded rod 42 threadedly connected to the lifting ring 9. A second motor 43 is installed on the top of the support frame 1, and the output end of the second motor 43 is fixedly connected to one end of the second threaded rod 42. A guide rod 41 is fixed between the top of the support frame 1 and the welding platform 2. The guide rod 41 passes through the lifting ring 9 and is slidably connected to the lifting ring 9; When welding a semiconductor device, the second motor 43 drives the second threaded rod 42 to rotate. Through the threaded connection between the second threaded rod 42 and the lifting ring 9, the lifting ring 9 moves downward. The lifting ring 9 drives the pressing mechanism 3 to move downward through the pressing ring 7, so that the pressing mechanism 3 can press the semiconductor device tightly on the surface of the substrate, avoiding the phenomenon of shaking during the welding process of the semiconductor device, and ensuring the welding effect of the semiconductor device. Among them, the guide rod 41 can play a limiting role on the lifting ring 9, effectively improving the stability of the lifting ring 9 during its up and down movement.

[0028] Please refer to Figure 3 and Figure 4 , the rotating mechanism 5 includes a third motor 53 installed on the top of the pressing ring 7. The output end of the third motor 53 penetrates through the pressing ring 7 and is fixedly connected with a gear 51. A toothed ring 52 is fixed outside the pressing ring 7, and the toothed ring 52 meshes with the gear 51. Among them, a support groove 54 adapted to the pressing ring 7 is provided on the inner wall of the lifting ring 9, and the side wall of the pressing ring 7 is located inside the support groove 54 and is slidably connected with the support groove 54; When welding a semiconductor device, the third motor 53 drives the gear 51 to rotate. Through the meshing of the gear 51 and the toothed ring 52, the pressing ring 7 is driven to rotate. When the pressing ring 7 rotates, it can play a role in adjusting the orientation of the pressing plate 34, thus avoiding the pressing plate 34 passing above the pins, and further avoiding the interference of the pressing plate 34 on the welding of the semiconductor device, facilitating the welding of the semiconductor device by the staff.

[0029] Please refer to Figure 5 , Figure 6 and Figure 7 , the blowing mechanism 6 includes a pneumatic cylinder 62 penetrating through the pressing ring 7, and the pneumatic cylinder 62 is fixedly connected with the pressing ring 7. Among them, a piston 610 is slidably connected inside the pneumatic cylinder 62. A resisting rod 63 is fixed on the top of the piston 610. The resisting rod 63 penetrates through the top of the pneumatic cylinder 62 and is slidably connected with the top of the pneumatic cylinder 62. Above the piston 610, an air pipe 65 is connected to the side wall of the pneumatic cylinder 62. A plurality of air holes 61 are provided on the inner wall of the limiting frame 8, and the air holes 61 communicate with the air pipe 65. A push rod 66 is fixed at the bottom of the piston 610, and a fixed cylinder 64 is fixed at the bottom of the pneumatic cylinder 62. The push rod 66 penetrates through the bottom of the pneumatic cylinder 62 and the fixed cylinder 64. The lower end of the push rod 66 is fixed with a baffle 68, and the baffle 68 is connected to the bottom of the fixed cylinder 64 through a first elastic member 67. Among them, a fixing component is provided inside the fixed cylinder 64, and the fixing component is used to fix the push rod 66; While the pressing ring 7 moves upward, it also drives the air pressure cylinder 62 upward. When the pressing ring 7 rises to a certain position, the top of the support frame 1 squeezes the abutting rod 63, and the abutting rod 63 drives the piston 610 to move inside the air pressure cylinder 62. The piston 610 drives the push rod 66 to move downward relative to the air pressure cylinder 62, so that the first elastic member 67 is in a stretched state. The first elastic member 67 can be a spring. When the pressing ring 7 rises to the highest position, the fixing assembly just completes the fixation of the push rod 66. When the pressing ring 7 moves downward, even if the support frame 1 does not squeeze the abutting rod 63, under the action of the fixing assembly, the push rod 66 cannot be reset. When the pressing mechanism 3 just completes the pressing of the semiconductor device, the fixing assembly automatically releases the fixation of the push rod 66. The push rod 66 quickly resets under the action of the baffle 68 and the first elastic member 67, and then drives the piston 610 to quickly move upward inside the air pressure cylinder 62. The piston 610 squeezes the gas above it, and the gas inside the air pressure cylinder 62 enters the trachea 65 and finally discharges from the air holes 61 on the inner wall of the limit frame 8, thereby playing a blowing role on the semiconductor device and the substrate, which can effectively avoid the influence of dust on the welding of the semiconductor device, ensure the welding effect, and after the semiconductor device is pressed, the blowing mechanism 6 will blow air to the semiconductor device and the substrate, which can effectively avoid the offset phenomenon of the semiconductor device caused by the air flow and ensure the welding accuracy.

[0030] Please refer to Figure 7 and Figure 8 The fixing assembly includes a groove provided on the inner wall of the air pressure cylinder 62. A clamping block 614 is slidably connected inside the groove. One end of the clamping block 614 is connected to the inner wall of the groove through a second elastic member 613, and the other end of the clamping block 614 is in contact with the side wall of the push rod 66. A clamping groove 615 adapted to the clamping block 614 is provided on the side wall of the push rod 66. The clamping block 614 is traction-connected with a traction member, and the traction member is used to traction the clamping block 614 so that the clamping block 614 no longer fixes the push rod 66; While the pressing ring 7 moves upward, it also drives the air pressure cylinder 62 upward. When the pressing ring 7 rises to a certain position, the top of the support frame 1 squeezes the abutting rod 63, and the abutting rod 63 drives the piston 610 to move inside the air pressure cylinder 62. When the pressing ring 7 rises to the highest position, the clamping block 614 and the clamping groove 615 are just aligned, and the clamping block 614 automatically enters the clamping groove 615 under the action of the second elastic member 613, thereby playing a fixing role on the push rod 66. When the pressing ring 7 moves downward, even if the support frame 1 does not squeeze the abutting rod 63, the push rod 66 cannot be reset, ensuring the stable performance of the piston 610. The second elastic member 613 can be a spring.

[0031] Please refer to Figure 2 and Figure 8, the traction member includes a push block 69 disposed above the fixed cylinder 64. The end of the push block 69 extends to the outside of the fixed cylinder 64. A sliding rod 611 is fixed to the bottom of the push block 69. The lower end of the sliding rod 611 extends into the fixed cylinder 64 and is slidably connected to the fixed cylinder 64. A traction rope 612 is fixed to the lower end of the sliding rod 611. The other end of the traction rope 612 extends into the groove and is fixedly connected to the clamping block 614. An extrusion block 616 for extruding the push block 69 is fixed to the top of the welding platform 2. The extrusion block 616 is annularly arranged. A relief groove 617 is provided on the inner side of the extrusion block 616 and the surface of the welding platform 2; When the pressure ring 7 moves downward to a certain position, the extrusion block 616 on the top of the welding platform 2 extrudes the push block 69, causing the push block 69 to drive the sliding rod 611 to move upward relative to the fixed cylinder 64. The sliding rod 611 then pulls the clamping block 614 through the traction rope 612. When the pressing mechanism 3 completes the pressing of the semiconductor device, the traction rope 612 exactly pulls the clamping block 614 into the groove. Losing the limit of the clamping block 614, the piston 610 quickly resets under the action of the first elastic member 67. The piston 610 quickly extrudes the gas above the air pressure cylinder 62. The gas inside the air pressure cylinder 62 quickly enters the trachea 65, and then enables the gas to be discharged from the air hole 61 at a relatively fast speed, ensuring the blowing effect on the semiconductor device and the substrate. Through the setting of the relief groove 617, the pressure ring 7 can smoothly drive the air pressure cylinder 62 to move downward, avoiding the interference of the welding platform 2 on the downward movement of the air pressure cylinder 62.

[0032] Working principle: When the device welds semiconductor devices, first place the substrate on the top of the support column 11, place the semiconductor device (such as a chip) on the surface of the substrate, and align the pins on the semiconductor device with the solder joints. After placement, drive the lifting ring 9 to move downward through the threaded connection between the second threaded rod 42 and the lifting ring 9. The lifting ring 9 drives the pressing plate 34 and the air pressure cylinder 62 to move downward through the pressing ring 7. When the pressing ring 7 moves downward to a certain position, the extrusion block 616 on the top of the welding platform 2 extrudes the push block 69, causing the push block 69 to drive the sliding rod 611 to move upward relative to the fixed cylinder 64. The sliding rod 611 then pulls the clamping block 614 through the traction rope 612. When the pressing plate 34 completes the pressing of the semiconductor device, the traction rope 612 just pulls the clamping block 614 into the groove. Losing the limit of the clamping block 614, the piston 610 quickly squeezes the gas above the air pressure cylinder 62, and the gas inside the air pressure cylinder 62 quickly enters the trachea 65, enabling the gas to be discharged from the air hole 61 at a relatively fast speed, playing a blowing role on the semiconductor device and the substrate, effectively avoiding the influence of dust on the welding of the semiconductor device, ensuring the welding effect. And the present invention can also drive the pressing plate 34 to move horizontally through the threaded connection between the first threaded rod 31 and the moving block 33, so that the pressing plate 34 can press chips at different positions, effectively improving the applicable range of the device. It can also drive the pressing ring 7 to rotate through the meshing of the gear 51 and the toothed ring 52. When the pressing ring 7 rotates, it can play a role in adjusting the orientation of the pressing plate 34, thus avoiding the pressing plate 34 passing above the pins and avoiding the interference of the pressing plate 34 on the welding of the semiconductor device, facilitating the welding of the semiconductor device by the staff.

[0033] The above are only the preferred embodiments of the present invention and are not intended to limit the present invention. Any modifications, equivalent replacements, and improvements made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A packaging and soldering structure of a semiconductor device, including a soldering platform; characterized in that, A support frame and support columns are fixed to the top of the welding platform. Above the support columns, there is a pressure ring. A limit frame is fixed to the top of the pressure ring. Inside the limit frame and the pressure ring, there is a welding groove. Inside the welding groove, there is a pressing mechanism for pressing a semiconductor device. An elevating ring is arranged outside the pressure ring. The pressure ring is connected to the elevating ring through a rotating mechanism. The elevating ring is connected to the support frame through a lifting mechanism. The rotating mechanism is used to drive the pressure ring to rotate, so as to adjust the position of the pressing mechanism. The lifting mechanism is used to drive the elevating ring to move up and down. An air blowing mechanism is arranged on the limit frame for blowing air on the semiconductor device.

2. The encapsulation and soldering structure of a semiconductor device according to claim 1, characterized in that The pressing mechanism includes pressing plates arranged on the inner side of the welding groove. Moving blocks are fixed to the ends of the pressing plates. A first threaded rod is threadedly connected to one of the moving blocks. The first threaded rod is rotatably connected to the inner wall of the limit frame. A limit rod passes through the inside of the other moving block. The limit rod is fixed to the inner wall of the limit frame. A first motor is fixed to the outside of the limit frame. The output end of the first motor is fixed to one end of the first threaded rod.

3. The encapsulation welding structure of a semiconductor device according to claim 1, characterized in that, The lifting mechanism includes a second threaded rod threadedly connected to the elevating ring. A second motor is installed on the top of the support frame. The output end of the second motor is fixed to one end of the second threaded rod. A guide rod is fixed between the top of the support frame and the welding platform. The guide rod passes through the elevating ring and is slidably connected to the elevating ring.

4. A packaging and soldering structure of a semiconductor device according to claim 1, characterized in that, The rotating mechanism includes a third motor installed on the top of the pressure ring. The output end of the third motor passes through the pressure ring and is fixedly connected to a gear. A toothed ring is fixed to the outside of the pressure ring. The toothed ring meshes with the gear. There is a support groove on the inner wall of the elevating ring that is adapted to the pressure ring. The side wall of the pressure ring is located inside the support groove and is slidably connected to the support groove.

5. The encapsulation welding structure of a semiconductor device according to claim 1, wherein, The air blowing mechanism includes a pneumatic cylinder passing through the pressure ring. The pneumatic cylinder is fixedly connected to the pressure ring. A piston is slidably connected inside the pneumatic cylinder. A resisting rod is fixed to the top of the piston. The resisting rod passes through the top of the pneumatic cylinder and is slidably connected to the top of the pneumatic cylinder. Above the piston, an air pipe is connected to the side wall of the pneumatic cylinder. A plurality of air holes are arranged on the inner wall of the limit frame. The air holes communicate with the air pipe. A push rod is fixed to the bottom of the piston. A fixed cylinder is fixed to the bottom of the pneumatic cylinder. The push rod passes through the bottom of the pneumatic cylinder and the fixed cylinder. A baffle is fixed to the lower end of the push rod. The baffle is connected to the bottom of the fixed cylinder through a first elastic member. A fixing component is arranged inside the fixed cylinder for fixing the push rod.

6. The encapsulation welding structure of a semiconductor device according to claim 5, characterized in that, The fixing component includes a groove arranged on the inner wall of the pneumatic cylinder. A clamping block is slidably connected inside the groove. One end of the clamping block is connected to the inner wall of the groove through a second elastic member. The other end of the clamping block abuts against the side wall of the push rod. A clamping groove adapted to the clamping block is arranged on the side wall of the push rod. The clamping block is connected to a traction component for pulling the clamping block so that the clamping block no longer fixes the push rod.

7. The encapsulation and soldering structure of a semiconductor device according to claim 6, characterized in that, The traction component includes a push block arranged above the fixed cylinder, the end of the push block extends to the outside of the fixed cylinder, a slide rod is fixed to the bottom of the push block, the lower end of the slide rod extends into the interior of the fixed cylinder and is slidably connected to the fixed cylinder, wherein a traction rope is fixed to the lower end of the slide rod, the other end of the traction rope extends into the groove and is fixedly connected to the clamping block, and an extrusion block for extruding the push block is fixed to the top of the welding platform, the extrusion block is arranged in a ring shape, and a clearance groove is provided on the inner side of the extrusion block and the surface of the welding platform.

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