Precise part grinding device

Abstract

The invention relates to the technical field of grinding and polishing equipment, and discloses a precision part grinding device which comprises a polishing head sleeve assembly, the inner side of the polishing head sleeve assembly is movably connected with a polishing head assembly, the polishing head sleeve assembly comprises an upper pipe shell, and the bottom of the upper pipe shell is rotationally connected with a lower pipe shell; the middle of the side face of the lower pipe shell is rotationally sleeved with an annular plate, the bottom of the annular plate is fixedly connected with four centrifugal assemblies, the polishing head assembly comprises a first motor, the first motor is composed of a machine body and a machine shaft, the side face of the middle of the machine shaft is fixedly sleeved with a gear, and the gear is meshed with the inner side of the lower pipe shell. The first motor drives the gear and the lower pipe shell to rotate, the lower pipe shell generates centrifugal force to separate the four centrifugal assemblies outwards, after the lower pipe shell stops rotating, the annular plate continues to rotate under the action of inertia, and the four centrifugal assemblies gradually lose the centrifugal force and rotate to gather and clean chippings.

Description

Technical Field

[0001] The present invention relates to the technical field of grinding and polishing equipment, and more particularly to a precision part grinding device. Background Art

[0002] A wafer is the core carrier for manufacturing semiconductor chips, one of the important precision parts in modern industries, and has a crucial position in the semiconductor industry. The wafer is also the basic material for chip manufacturing, and all chip manufacturing processes are carried out on the surface or inside of the wafer. Its quality and performance directly affect the yield, performance, and reliability of the chips. The surface flatness of the wafer is one of the measurement criteria for the quality of the wafer; a CMP polishing machine, that is, a chemical mechanical polishing machine, is a key device for achieving global planarization of the wafer surface in semiconductor manufacturing. However, during the polishing process of the CMP polishing machine, some particulate contaminants such as silicon chips and metal chips will be generated. If these particles cannot be removed in a timely and effective manner, these particles will adhere to the wafer surface, resulting in performance defects such as chip short circuits and leakage, reducing the yield of the chips. For this reason, we propose a precision part grinding device to solve the above problems. Summary of the Invention

[0003] In order to overcome the above-mentioned defects of the prior art, the present invention provides a precision part grinding device to solve the problems existing in the above-mentioned background art.

[0004] To achieve the above object, the present invention provides the following technical solution: A precision part grinding device includes a polishing head sleeve assembly. An inner side of the polishing head sleeve assembly is movably connected with a polishing head assembly. The polishing head sleeve assembly includes an upper housing. A bottom of the upper housing is rotatably connected with a lower housing. A middle part of a side surface of the lower housing is rotatably sleeved with an annular plate. The lower housing drives the annular plate unidirectionally. A bottom of the annular plate is fixedly connected with four centrifugal components;

[0005] The polishing head assembly includes a first motor. The first motor is composed of a body and a shaft. A side surface of a middle part of the shaft is fixedly sleeved with a gear. The gear meshes with an inner side of the lower housing;

[0006] The first motor drives the gear and the lower housing to rotate. The lower housing generates centrifugal force to separate the four centrifugal components outwards. After the lower housing stops rotating, the annular plate continues to rotate due to inertia and the four centrifugal components gradually lose centrifugal force and rotate and gather to clean debris.

[0007] Further, the lower housing and the annular plate are connected by a ratchet mechanism.

[0008] Further, a gear is fixedly connected to the inner side of the top end of the lower shell for meshing rotation. An inner circular tube is fixedly connected to the inner side of the bottom end of the lower shell. An annular space is formed between the lower shell and the inner circular tube. Six circular holes are provided at the bottom of the lower shell, and six square holes are provided inside the inner circular tube.

[0009] Further, the centrifugal component includes a slide rail element. A first spring is fixedly connected to the inner side of one end of the slide rail element. The other end of the first spring is fixedly connected to a slider. The first spring is located inside the cavity of the slide rail element. The slider moves inside the cavity of the slide rail element. A connecting component is fixedly connected to the bottom of the slider. One end of the connecting component is fixedly connected to a chip collecting fan shell. A rectangular opening is provided at the top of the chip collecting fan shell. A brush is provided in the rectangular opening and is fixedly connected to the chip collecting fan shell. The top of the slide rail element is fixedly connected to the bottom of the annular plate.

[0010] Further, a fan blade is fixedly sleeved on the side of the middle part of the machine shaft. The gear and the fan blade do not contact each other. A wafer suction head is fixedly connected to the bottom end of the first motor;

[0011] A connecting rod is fixedly connected to the middle of the top of the first motor. A first circular tube is movably sleeved on the side of the top of the connecting rod. An air pump is fixedly communicated with the top of the first circular tube. A fixing plate is fixedly sleeved on the side of the first circular tube.

[0012] Further, suction holes are provided at the bottom of the wafer suction head.

[0013] Further, a machine tool component is fixedly connected to the side of the top of the polishing head component. A workbench component is fixedly connected to the top of the machine tool component.

[0014] Further, the machine tool component includes an installation table. Two connecting plates are fixedly connected to the top of the installation table. The top of the two connecting plates is fixedly connected to a fixing plate.

[0015] Further, the workbench component includes a rotating cylinder shell. A second circular tube is fixedly connected to the inner side of the bottom of the rotating cylinder shell. A movable rod is movably sleeved on the inner side of the top of the second circular tube. A second spring is fixedly connected to the bottom of the movable rod. A second motor is fixedly connected to the top of the movable rod. A polishing disc is fixedly connected to the top of the second motor. A polishing pad is fixedly connected to the top of the polishing disc.

[0016] Further, the bottom of the rotating cylinder shell is fixedly connected to the middle of the top of the installation table. A water pump is fixedly connected to one side of the top of the installation table. A connecting pipe orifice is fixedly communicated with one side of the water pump. A connecting water pipe is fixedly communicated with the top of the water pump. One end of the connecting water pipe is fixedly communicated with an infusion pipe. The infusion pipe is located above the polishing pad.

[0017] Technical effects and advantages of the present invention:

[0018] 1. A gear is connected to the rotating shaft of the motor in the polishing head. By utilizing the meshing effect between the gear and the lower casing, the motor drives the lower casing to rotate. When the lower casing rotates, centrifugal force is generated, causing the chip collection fan casing to move towards the outer peripheral edge, thereby opening up the space for the polishing head to move downward for polishing. When the wafer polishing is completed, the motor stops running, while the annular plate still rotates under the action of inertia and the rotational speed gradually decreases. As a result, the centrifugal force of the chip collection fan casing gradually decreases, and the chip collection fan casing rotates and gathers under the action of the spring. When the brush of the chip collection fan casing touches the wafer, it cleans the particulate contaminants such as silicon chips and metal chips on the wafer surface and collects these particles into the chip collection fan casing, preventing these particles from adhering to the wafer surface and causing chip short circuits and leakage, and improving the chip yield.

[0019] 2. When the polishing head is polishing, the motor generates a lot of heat when overcoming the gravity of the polishing head and the huge resistance from the polishing pad during polishing. These heats are transmitted to the lower casing along with the downward airflow generated by the rotation of the fan blades, and are transmitted to the polishing liquid on the surface of the polishing pad through the round holes of the lower casing, increasing the reaction temperature between the polishing liquid and the wafer, promoting the oxidation reaction rate of the wafer and thus improving the polishing efficiency. When the polishing is completed, the wafer follows the polishing head back into the interior of the lower casing, causing the square hole on the inner side of the bottom of the lower casing to open, discharging the remaining heat, and drying the wafer surface.

[0020] 3. When the centrifugal force received by the centrifugal component gradually decreases, the chip collection fan casing gradually rotates and gathers. The airflow generated by the fan blades is discharged from the round holes at the bottom of the lower casing, blowing the debris particles brushed off by the brushes on the chip collection fan casing, causing the particles to gather inward. When the polishing head returns to the interior of the lower casing and the square hole on the inner side of the bottom of the lower casing opens, the airflow also discharges from the square hole. Under the combined action of the airflow discharged from the round hole and the square hole, the debris particles are blown into the chip collection fan casing. Description of the Drawings

[0021] Figure 1 is the overall structural schematic diagram of the present invention;

[0022] Figure 2 is the structural schematic diagram of the polishing head sleeve assembly of the present invention;

[0023] Figure 3 is the cross-sectional structural schematic diagram of the casing assembly of the present invention;

[0024] Figure 4 is the single cross-sectional structural schematic diagram of the centrifugal component of the present invention;

[0025] Figure 5 is the structural schematic diagram of the polishing head assembly of the present invention;

[0026] Figure 6Schematic diagram of the adsorption wafer position structure of the present invention;

[0027] Figure 7 Schematic diagram of the machine tool component structure of the present invention;

[0028] Figure 8 Schematic diagram of the workbench component structure of the present invention;

[0029] Figure 9 Partial sectional structure schematic diagram of the workbench component of the present invention;

[0030] Figure 10 Schematic diagram of the sectional structure of the chip collection fan housing of the present invention.

[0031] Reference numerals are: 1, polishing head sleeve assembly; 101, upper housing; 102, lower housing; 103, annular plate; 104, centrifugal assembly; 1041, slide rail element; 1042, first spring; 1043, slider; 1044, connection assembly; 1045, chip collection fan housing; 2, polishing head assembly; 201, first motor; 202, gear; 203, fan blade; 204, wafer adsorption head; 205, connecting rod; 206, first round tube; 207, air pump; 3, machine tool component; 301, installation table; 302, connecting plate; 303, fixing plate; 4, workbench component; 401, rotating cylinder housing; 402, second round tube; 403, movable rod; 404, second spring; 405, second motor; 406, polishing disc; 407, polishing pad; 408, infusion tube; 409, connecting water pipe; 410, water pump; 411, connecting pipe orifice. Detailed implementation manners

[0032] Next, the technical solutions in the present invention will be clearly and completely described in conjunction with the accompanying drawings in the present invention. Additionally, the forms of each structure described in the following implementation manners are merely examples. A precision part grinding device related to the present invention is not limited to the structures described in the following implementation manners. All other implementation manners obtained by those of ordinary skill in the art without creative efforts belong to the scope of protection of the present invention.

[0033] Refer to Figure 1 , the present invention provides a precision part grinding device, including a polishing head sleeve assembly 1. The inner side of the polishing head sleeve assembly 1 is movably connected to a polishing head assembly 2. The side of the top of the polishing head assembly 2 is fixedly connected to a machine tool component 3. The top of the machine tool component 3 is fixedly connected to a workbench component 4.

[0034] In this embodiment, it should be specifically supplemented that the polishing head sleeve assembly 1 utilizes the motor drive assembly to rotate and generate centrifugal force to realize the movement of the brush, so that the brush cleans the surface of the wafer when it contacts the wafer, avoiding short circuits and leakage of the chip caused by these particles, thereby improving the yield of the chip. The function of the polishing head assembly 2 is to increase the reaction temperature between the polishing liquid and the wafer, promote the oxidation reaction rate of the wafer, and thus improve the polishing efficiency, and to dry the surface of the wafer to avoid water stains on the surface of the wafer, which affects the quality, and to dissipate heat from the motor. The specific structures and working principles of the above components will be described in detail later.

[0035] Referring to Figure 2 , the polishing head sleeve assembly 1 includes an upper shell 101, the bottom of the upper shell 101 is rotatably connected to a lower shell 102, the middle of the side of the lower shell 102 is rotatably sleeved with an annular plate 103, and the bottom of the annular plate 103 is fixedly connected with four centrifugal components 104.

[0036] In this embodiment, it should be specifically supplemented that the lower shell 102 and the annular plate 103 are connected by a ratchet mechanism, so that the lower shell 102 drives the annular plate 103 unidirectionally. When the lower shell 102 stops rotating, the annular plate 103 still rotates due to inertia and the rotation speed gradually decreases until it stops. The ratchet mechanism is a prior art and will not be described in detail. The four centrifugal components 104 are fixedly connected to the front, rear, left, and right ends of the bottom of the annular plate 103 and are evenly distributed.

[0037] Referring to Figure 3 , the inner side of the top end of the lower shell 102 is fixedly connected with teeth for meshing rotation, the inner side of the bottom end of the lower shell 102 is fixedly connected with an inner circular tube, an annular space is formed between the lower shell 102 and the inner circular tube, six circular holes are provided at the bottom of the lower shell 102, and six square holes are provided inside the inner circular tube.

[0038] In this embodiment, it should be specifically supplemented that the circular holes are used to transmit heat during wafer polishing to increase the reaction rate, and the square holes are used to dry the wafer after polishing.

[0039] Referring to Figure 4, the centrifugal component 104 includes a slide rail element 1041. Inside one end of the slide rail element 1041, a first spring 1042 is fixedly connected. The other end of the first spring 1042 is fixedly connected to a slider 1043. The first spring 1042 is located inside the cavity of the slide rail element 1041. The slider 1043 moves inside the cavity of the slide rail element 1041. At the bottom of the slider 1043, a connection component 1044 is fixedly connected. One end of the connection component 1044 is fixedly connected to a chip collection fan housing 1045. At the top of the chip collection fan housing 1045, there is a rectangular opening. A brush is provided in the rectangular opening and is fixedly connected to the chip collection fan housing 1045. The brush divides the rectangular opening into two equal parts with the same opening size on both sides of the brush. The top of the slide rail element 1041 is fixedly connected to the bottom of the annular plate 103.

[0040] In this embodiment, it should be specifically supplemented that four chip collection fan housings 1045 are located at the lower pipe opening of the lower pipe housing 102. By using the meshing transmission between the teeth of the lower pipe housing 102 and the gear 202, the motor drives the lower pipe housing 102 to rotate. The centrifugal force generated during the rotation of the lower pipe housing 102 causes the chip collection fan housings 1045 to move outwards, thus opening the bottom pipe opening of the lower pipe housing 102. When the wafer polishing is completed, the motor stops running. However, the annular plate 103 still rotates under the action of the ratchet mechanism and inertia, and the rotational speed gradually decreases. As a result, the centrifugal force of the chip collection fan housings 1045 gradually decreases. While the chip collection fan housings 1045 gather under the action of the first spring 1042, they also rotate. This enables the brush of the chip collection fan housing 1045 to clean the particulate contaminants such as silicon chips and metal chips on the surface of the wafer when it comes into contact with the wafer and collect the debris particles into the chip collection fan housing 1045, preventing these particles from adhering to the surface of the wafer, which may cause chip short circuits and leakage, and improving the chip yield.

[0041] Refer to Figure 10 , both ends at the bottom of the brush are rotatably connected to rotating shafts. On the sides of the two rotating shafts, fan blades are fixedly connected.

[0042] In this embodiment, it should be specifically supplemented that the structure of the brush is that the upper half is the fine hair part, and the lower half is the brush handle for fixing the fine hair. The rotating shaft is rotatably connected to the bottom of the brush handle. On both sides of the rectangular opening at the top of the chip collecting fan housing 1045, one-way pipes are fixedly installed. The pipe orifice of the one-way pipe facing the inside of the chip collecting fan housing 1045 is provided with a filter screen. The one-way pipe is used to discharge the air flow inside the chip collecting fan housing 1045 and the debris will not leak out. The structure of the one-way pipe is a conventional structure, which will not be described in detail and is not shown in the drawings. After the debris particles enter the chip collecting fan housing 1045, the air flow flows in the chip collecting fan housing 1045, and the air flow will blow the fan blade to block the rectangular opening to prevent the impurity particles from being carried out. The air flow in the chip collecting fan housing 1045 is discharged from the one-way pipe, and the fan blade falls and resets without the push of wind force. In addition, it should be supplemented that in practice, the air flow surging towards the rectangular opening at the top of the chip collecting fan housing 1045 is larger than the air flow entering the inside of the chip collecting fan housing 1045. During the rotation of the chip collecting fan housing 1045, the debris inside the chip collecting fan housing 1045 will not be discharged from the rectangular opening. The situation of debris being discharged from the rectangular opening only occurs when the chip collecting fan housing 1045 stops rotating, and there is still residual air flow in the chip collecting fan housing 1045. The residual air flow has the risk of carrying out the debris. Therefore, the present invention is provided with a fan blade to prevent the debris from being discharged.

[0043] Referring to Figure 5 , the polishing head assembly 2 includes a first motor 201, the first motor 201 is composed of a machine body and a machine shaft. A gear 202 is fixedly sleeved on the side surface of the middle part of the machine shaft. A fan blade 203 is rotatably sleeved on the side surface of the middle part of the machine shaft. The fan blade 203 is connected to the motor shaft through a ratchet mechanism. The gear 202 and the fan blade 203 do not contact each other. The bottom end of the first motor 201 is fixedly connected with a wafer suction head 204. The middle of the top of the first motor 201 is fixedly connected with a connecting rod 205. The side surface of the top of the connecting rod 205 is movably sleeved with a first circular tube 206. The top of the first circular tube 206 is fixedly communicated with an air pump 207. The side surface of the first circular tube 206 is fixedly sleeved with a fixing plate 303.

[0044] In this embodiment, it should be specifically supplemented that the gear 202 meshes with the teeth of the lower tube housing 102, thereby realizing the synchronous rotation of the gear 202 and the lower tube housing 102. The ratchet mechanism enables the motor shaft to drive the fan blade 203 unidirectionally. The ratchet mechanism is a prior art and will not be described in detail here. The air pump 207 pressurizes and decompresses the first circular tube 206 to achieve the expansion and contraction of the connecting rod 205, and further achieves the purpose of the expansion and contraction of the wafer suction head 204. When the polishing head performs polishing, the motor shaft drives the fan blade 203 to rotate, generating a downward air flow. The heat generated by the operation of the motor is transmitted to the lower tube housing 102 along with the air flow. The bottom of the lower tube housing 102 fits the polishing platform during wafer polishing, and the heat is transmitted to the polishing liquid through the round holes at the bottom of the lower tube housing 102, increasing the reaction temperature between the polishing liquid and the wafer, promoting the oxidation reaction rate of the wafer, and thus improving the polishing efficiency. When the polishing is completed, the wafer follows the wafer suction head 204 and returns to the inside of the lower tube housing 102, causing the square holes on the inner side of the bottom of the lower tube housing 102 to open, discharging the remaining heat, drying the surface of the wafer, and preventing water stains from appearing on the surface of the wafer, which may affect the quality. In addition, the air flow generated by the fan blade 203 has a heat dissipation effect on the first motor 201.

[0045] When the centrifugal force received by the centrifugal component 104 gradually decreases, the chip collection fan housing 1045 gradually rotates and gathers. The air flow generated by the fan blade 203 is discharged from the round holes at the bottom of the lower tube housing 102, blowing the debris particles brushed by the bristles on the chip collection fan housing 1045, causing the particles to gather inward. After the polishing head returns to the inside of the lower tube housing 102 and the square holes on the inner side of the bottom of the lower tube housing 102 are opened, the air flow also discharges from the square holes. Under the combined action of the air flow discharged from the round holes and the square holes, the debris particles are blown into the chip collection fan housing 1045.

[0046] Refer to Figure 6 , an adsorption hole is provided at the bottom of the wafer suction head 204.

[0047] In this embodiment, it should be specifically supplemented that the adsorption hole is used for vacuum adsorption. The wafer suction head 204 uses vacuum adsorption to adsorb the wafer. The vacuum adsorption structure is a prior art and will not be elaborated here.

[0048] Refer to Figure 7 , the machine tool component 3 includes a mounting table 301, and two connecting plates 302 are fixedly connected to the top of the mounting table 301, and a fixing plate 303 is fixedly connected to the top of the two connecting plates 302.

[0049] Refer to Figure 8 and Figure 9, the workbench assembly 4 includes a rotary cylinder housing 401. A second circular pipe 402 is fixedly connected to the inner side of the bottom of the rotary cylinder housing 401. A movable rod 403 is movably sleeved in the inner side of the top of the second circular pipe 402. A second spring 404 is fixedly connected to the bottom of the movable rod 403. A second motor 405 is fixedly connected to the top of the movable rod 403. A polishing disc 406 is fixedly connected to the top of the second motor 405. A polishing pad 407 is fixedly connected to the top of the polishing disc 406. The bottom of the rotary cylinder housing 401 is fixedly connected to the middle of the top of the mounting table 301. A water pump 410 is fixedly connected to one side of the top of the mounting table 301. A connecting pipe orifice 411 is fixedly communicated with one side of the water pump 410. A connecting water pipe 409 is fixedly communicated with the top of the water pump 410. One end of the connecting water pipe 409 is fixedly communicated with an infusion pipe 408. The infusion pipe 408 is located above the polishing pad 407.

[0050] In this embodiment, it should be specifically supplemented that during the wafer polishing process, the first motor 201 starts first. After the centrifugal force causes the centrifugal assembly 104 to unfold, the water pump 410 starts to deliver the polishing liquid. Then, the second motor 405 starts to rotate the polishing disc 406. Finally, the air pump 207 operates for polishing.

[0051] Working principle of the present invention: During the wafer polishing process, the first motor 201 starts first. The gear 202 meshes with the inner side of the lower casing 102, causing the lower casing 102 to rotate with the gear 202. The centrifugal force generated when the lower casing 102 rotates causes the chip collection fan casing 1045 to move outward, thereby opening the bottom nozzle of the lower casing 102. The fan blades 203 rotate to generate a downward airflow. The heat generated by the operation of the motor is transmitted to the lower casing 102 along with the airflow. The lower casing 102 adheres to the polishing pad 407 during wafer polishing, and the heat is transmitted to the polishing liquid through the round holes at the bottom of the lower casing 102, increasing the reaction temperature between the polishing liquid and the wafer, promoting the oxidation reaction rate of the wafer and thus improving the polishing efficiency. When the wafer polishing is completed, the motor stops running, while the annular plate 103 and the fan blades 203 still rotate under the action of the ratchet mechanism and inertia, and the rotation speed gradually decreases. As a result, the centrifugal force of the chip collection fan casing 1045 gradually decreases. The chip collection fan casing 1045 rotates while gathering under the action of the first spring 1042, so that the brush in the chip collection fan casing 1045 brushes off particulate contaminants such as silicon chips and metal chips on the wafer surface when contacting the wafer, preventing these particles from adhering to the wafer surface and causing chip short circuits and leakage, thereby improving the yield of the chip. The airflow generated by the fan blades 203 is discharged from the round holes at the bottom of the lower casing 102, blowing the debris particles brushed off by the brush on the chip collection fan casing 1045 to gather inward. When the polishing head returns to the inside of the lower casing 102 and the square hole on the inner side of the bottom of the lower casing 102 is opened, the airflow also discharges from the square hole. Under the combined action of the airflow discharged from the round hole and the square hole, the debris particles are blown into the chip collection fan casing 1045, and at the same time the remaining heat is discharged, drying the wafer surface to prevent water stains from appearing on the wafer surface. At the same time, the airflow generated by the fan blades 203 has a heat dissipation effect on the first motor 201.

[0052] Finally, several points should be noted: First, in the description of the present application, it should be noted that unless otherwise specified and limited, the terms "installation", "connection", and "connection" should be understood in a broad sense. It can be a mechanical connection or an electrical connection, or it can be the communication inside two components. It can be directly connected. "Up", "down", "left", "right", etc. are only used to represent relative position relationships. When the absolute position of the object being described changes, the relative position relationship may change;

[0053] Second: In the drawings of the disclosed embodiments of the present invention, only the structures related to the disclosed embodiments are involved. Other structures can refer to the usual designs. Without conflict, the same embodiment and different embodiments of the present invention can be combined with each other;

[0054] Finally: The above description is only a preferred embodiment of the present invention and is not used to limit the present invention. Any modifications, equivalent replacements, improvements, etc. made within the spirit and principle of the present invention shall be included in the protection scope of the present invention.

Claims

1. A precision part grinding device, comprising a polishing head sleeve assembly (1), wherein a polishing head assembly (2) is movably connected to the inside of the polishing head sleeve assembly (1), characterized in that, The polishing head sleeve assembly (1) includes an upper shell (101). The bottom of the upper shell (101) is rotatably connected to a lower shell (102). The middle of the side of the lower shell (102) is rotatably sleeved with an annular plate (103). The lower shell (102) drives the annular plate (103) unidirectionally. Four centrifugal components (104) are fixedly connected to the bottom of the annular plate (103). The polishing head assembly (2) includes a first motor (201). The first motor (201) consists of a body and a shaft. A gear (202) is fixedly sleeved on the side of the middle of the shaft. The gear (202) meshes with the inner side of the lower shell (102). The first motor (201) drives the gear (202) and the lower shell (102) to rotate. The lower shell (102) generates centrifugal force to separate the four centrifugal components (104) outwards. After the lower shell (102) stops rotating, the annular plate (103) continues to rotate due to inertia and the four centrifugal components (104) gradually lose centrifugal force and rotate together to gather cleaning debris.

2. The precision part grinding device according to claim 1, wherein: A ratchet mechanism is connected between the lower shell (102) and the annular plate (103).

3. A precision part grinding device according to claim 1, characterized in that: Teeth for meshing rotation are fixedly connected to the inner side of the top of the lower shell (102). An inner circular tube is fixedly connected to the inner side of the bottom end of the lower shell (102). An annular space is formed between the lower shell (102) and the inner circular tube. Six round holes are provided at the bottom of the lower shell (102). Six square holes are provided inside the inner circular tube.

4. A precision part grinding device according to claim 1, characterized in that: The centrifugal component (104) includes a slide rail element (1041). A first spring (1042) is fixedly connected to the inner side of one end of the slide rail element (1041). The other end of the first spring (1042) is fixedly connected to a slider (1043). The first spring (1042) is located inside the cavity of the slide rail element (1041). The slider (1043) moves inside the cavity of the slide rail element (1041). A connecting component (1044) is fixedly connected to the bottom of the slider (1043). One end of the connecting component (1044) is fixedly connected to a chip collecting fan shell (1045). A rectangular opening is provided at the top of the chip collecting fan shell (1045). A brush is provided in the rectangular opening and is fixedly connected to the chip collecting fan shell (1045). The top of the slide rail element (1041) is fixedly connected to the bottom of the annular plate (103).

5. A precision part grinding device according to claim 1, characterized in that: A fan blade (203) is fixedly sleeved on the side of the middle of the shaft. The gear (202) and the fan blade (203) do not contact each other. A wafer suction head (204) is fixedly connected to the bottom end of the first motor (201). A connecting rod (205) is fixedly connected to the middle of the top of the first motor (201). The side of the top of the connecting rod (205) is rotatably sleeved with a first circular tube (206). An air pump (207) is fixedly connected to the top of the first circular tube (206). A fixing plate (303) is fixedly sleeved on the side of the first circular tube (206).

6. The precision part grinding device according to claim 5, characterized in that: Suction holes are provided at the bottom of the wafer suction head (204).

7. A precision part grinding device according to claim 1, characterized in that: The side of the top of the polishing head assembly (2) is fixedly connected to a machine tool assembly (3), and the top of the machine tool assembly (3) is fixedly connected to a workbench assembly (4).

8. A precision part grinding device according to claim 7, characterized in that: The machine tool assembly (3) includes a mounting table (301), and two connecting plates (302) are fixedly connected to the top of the mounting table (301), and a fixing plate (303) is fixedly connected to the top of the two connecting plates (302).

9. A precision part grinding device according to claim 7, characterized in that: The workbench assembly (4) includes a rotating cylinder housing (401), a second circular tube (402) is fixedly connected to the inner side of the bottom of the rotating cylinder housing (401), a movable rod (403) is movably sleeved in the inner side of the top of the second circular tube (402), a second spring (404) is fixedly connected to the bottom of the movable rod (403), a second motor (405) is fixedly connected to the top of the movable rod (403), a polishing disc (406) is fixedly connected to the top of the second motor (405), and a polishing pad (407) is fixedly connected to the top of the polishing disc (406).

10. A precision part grinding device according to claim 9, characterized in that: The bottom of the rotating cylinder housing (401) is fixedly connected to the middle of the top of the mounting table (301), a water pump (410) is fixedly connected to one side of the top of the mounting table (301), a connecting pipe orifice (411) is fixedly communicated with one side of the water pump (410), a connecting water pipe (409) is fixedly communicated with the top of the water pump (410), one end of the connecting water pipe (409) is fixedly communicated with an infusion pipe (408), and the infusion pipe (408) is located above the polishing pad (407).

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