Crystal support clamping device, wire cutting machine and crystal support clamping method

Abstract

The present application provides a crystal tray clamping device, a wire cutting machine, and a crystal tray clamping method, which belong to the field of crystal rod processing technology and solve the problem that the existing crystal tray clamping method causes the cut crystal rod to be prone to hidden cracks. The present application includes a base, a first clamping component, and a second clamping component, wherein the base is provided with a fixed clamping surface and a floating clamping surface, the fixed clamping surface is used to abut against the first part of the upper surface of the crystal tray, and the floating clamping surface can float up and down to abut against the second part of the upper surface of the crystal tray. The first clamping component can lift the two ends of the crystal tray, and the second clamping component can lift the middle area of ​​the crystal tray. The present application uses a floating adjustment member to move downward to abut against the second part of the upper surface of the crystal tray, so that the crystal tray will not be clamped and bent. When the base drives the crystal tray and the crystal rod to press down the cutting line, both the fixed clamping surface and the floating clamping surface can effectively support the cutting reaction force, and the probability of hidden cracks in the crystal rod cutting can be effectively reduced.

Description

Technical Field

[0001] The present application belongs to the technical field of crystal rod processing, and specifically relates to a crystal tray clamping device, a wire cutting machine, and a crystal tray clamping method. Background Art

[0002] Before processing the crystal rod, the wire saw needs to glue the crystal rod to the bottom of the crystal holder with glue. The spring cylinder in the clamping base of the wire saw uses spring force to fix the crystal holder to the bottom of the clamping base through the T-slot structure. It is generally loosened by a pneumatic cylinder or oil cylinder.

[0003] The existing clamping surface is the fixed surface at the bottom of the base, and the crystal tray is clamped and fixed along its length by approximately three spring cylinders. When the crystal tray is bonded to the ingot, the center area of ​​the crystal tray is concave or convex relative to the end areas, preventing the crystal tray from fully aligning with the clamping surface of the clamping base. This causes elastic deformation of the crystal tray and the clamping base under the action of the spring cylinders, generating internal stress within the bonded ingot. When the diamond wire cuts into the ingot downward, this internal stress is released, resulting in hidden cracks in the wafer.

[0004] Based on the above content, the technical problem to be solved by this application is: how to reduce the probability of hidden cracks in crystal ingot cutting. Summary of the Invention

[0005] The purpose of this application is to address the above-mentioned problems existing in the prior art and propose a crystal tray clamping device, a wire cutting machine and a crystal tray clamping method, which solves the problem that the crystal tray clamping method of the prior art causes easy hidden cracks in the cut crystal rods, and reduces the probability of hidden cracks in the cut crystal rods.

[0006] The purpose of the present application can be achieved through the following technical solutions: a crystal tray clamping device, including a base, the bottom of the base is provided with at least two fixed clamping surfaces arranged along the length direction, the fixed clamping surface is used to abut against the first part of the upper surface of the crystal tray, a floating adjustment member, the floating adjustment member is arranged between at least two of the fixed clamping surfaces and is movably connected to the base, the floating adjustment member has a floating clamping surface, the floating clamping surface has a vertical degree of freedom of movement for abutting against the second part of the upper surface of the crystal tray, and the second part of the upper surface of the crystal tray is defined as being located between the first parts of at least two of the upper surfaces of the crystal tray; a first clamping assembly, the first clamping assembly includes: a first clamping member, the first clamping member is at least two and is respectively arranged on the fixed clamping surfaces In the vertical direction, the first clamping member and the fixed clamping surface are used to jointly clamp the first part of the upper surface of the crystal holder; a first driving mechanism, the first driving mechanism has a first output end, the first output end acts on the first clamping member to drive the first clamping member closer to or away from the fixed clamping surface; and a second clamping assembly, the second clamping assembly includes: a second clamping member, the second clamping member is arranged in the vertical direction of the floating clamping surface, the second clamping member and the floating clamping surface are used to jointly clamp the second part of the upper surface of the crystal holder; a second driving mechanism, the second driving mechanism has a second output end, the second output end passes through the floating adjustment member and acts on the second clamping member to drive the second clamping member closer to or away from the floating clamping surface.

[0007] It is understood that the fixed clamping surfaces are fixed to the base bottom, preferably located at or near both ends of the base bottom. Exemplarily, there may be three fixed clamping surfaces, one of which is located in the middle of the base bottom, with a floating adjustment member positioned between each of the three fixed clamping surfaces. Exemplarily, there may be two fixed clamping surfaces, with two floating adjustment members equally spaced along the length of the base. Exemplarily, there may be three fixed clamping surfaces, with a floating adjustment member positioned between two of the fixed clamping surfaces. Furthermore, there may be four, five, or six fixed clamping surfaces, with at least one floating adjustment member positioned between two of the fixed clamping surfaces. The fixed clamping surfaces are engaged with a first portion of the wafer top surface, and a floating adjustment member is positioned between at least two of the fixed clamping surfaces. The floating adjustment member floats up and down to cause the floating clamping surfaces to abut a second portion of the wafer top surface. The first portion of the wafer top surface is typically located at either end of the wafer top surface, while the second portion is typically located in the middle of the wafer top surface. Because the first portion of the upper surface of the crystal tray is lifted upward by at least two first clamping members and then abuts against the fixed clamping surface, while the second portion of the upper surface of the crystal tray protrudes downward relative to the first portion and has a certain curvature, the second clamping member cannot be directly lifted upward to abut against the base, otherwise it will easily cause internal stress within the crystal ingot at the bottom of the crystal tray. Therefore, the floating adjustment member is used to move downward to abut against the second portion of the upper surface of the crystal tray, so that the crystal tray does not produce clamping bending. When the base drives the crystal tray and crystal ingot downward to press the cutting line, both the fixed clamping surface and the floating clamping surface can support the cutting reaction force, effectively reducing the probability of hidden cracks in the crystal ingot. Exemplarily, the first and second drive mechanisms are preferably configured as spring cylinders, but can also be other conventional drive mechanisms with output in the vertical direction.

[0008] In the above-mentioned crystal holder clamping device, a receiving groove is provided at the bottom of the base, and the receiving groove accommodates the floating adjustment member, and the floating adjustment member includes: a first plate body, the first plate body is arranged between the second clamping member and the base, the first plate body and the base are movably connected in the vertical direction, a first opening is provided on the first plate body, the first opening is for the second output end to pass through, a side of the first plate body facing away from the base is the floating clamping surface, and a side of the first plate body close to the base is a first inclined surface; a second plate body, the second plate body is arranged between the first plate body and the base and is located in the receiving groove, a second opening is provided on the second plate body, the second opening is coaxially arranged with the first opening for the second output end to pass through, and the second plate body has the freedom of movement along the first inclined surface to adjust the first plate body to move in the vertical direction relative to the base.

[0009] Exemplarily, the first and second plates are configured as wedge-shaped blocks, with a receiving groove formed in the bottom of the base to provide space for the second plate to move. The inner walls of the receiving groove are configured to at least partially abut against the first and second plates, thereby ensuring that the second plate can only move along the second inclined surface and cannot move in other directions. Holes are formed in the first and second plates to allow the second output end of the second drive mechanism to pass through, enabling the second clamping member to perform vertical clamping activities.

[0010] In the above-mentioned crystal support clamping device, a connecting column is provided between the first plate and the base, and the connecting column passes through the second plate to form a third opening. The cross-sectional length of the third opening is greater than the outer diameter of the connecting column, and the length direction of the cross-sectional length of the third opening is substantially parallel to the length direction of the second plate. The connecting column has a first end and a second end, the first end is fixedly connected to the first plate, and an elastic member is provided between the second end and the base, and the elastic member acts on the second end to make the first plate always have an upward movement tendency. Exemplarily, there are multiple connecting columns, preferably four, and they are arranged circumferentially on the first plate. The base is provided with mounting slots corresponding to the number of connecting posts. The second ends and elastic members are positioned within the mounting slots. The connecting posts extend through the mounting slots and the first plate to be fixedly connected to the second plate. The second ends of the connecting posts are bolt-shaped and extend through the mounting slots to form through-holes. The outer diameter of the second ends is larger than the diameter of the through-holes. The elastic members are positioned within the mounting slots and between the second ends and the through-holes, thereby providing an upward elastic force to the second ends, ensuring that the connecting posts always pull the first plate upward against the second plate. When the second plate is subjected to sufficient force to overcome the elastic force of the elastic members, it can move, achieving height adjustment of the floating clamping surface. During this movement, the first plate is always in close contact with the second plate due to the elastic force exerted by the elastic members on the connecting posts, ensuring accurate height adjustment of the floating clamping surface and ensuring resettable performance. It is important to note that the width of the cross-section of the third opening is slightly larger than the outer diameter of the connecting post. By aligning the length of the cross-section of the third opening to be substantially parallel to the length of the second plate, this provides a guide for the movement of the second plate, further improving movement accuracy.

[0011] In the above-mentioned crystal support clamping device, the second plate has a second inclined surface, which is in contact with the first inclined surface, and the slope of the second inclined surface is equal to the slope of the first inclined surface. The surface of the second plate close to the base is a second plane, and the second plane and the floating clamping surface are respectively parallel to the fixed clamping surface. It can be understood that by setting the slope of the second inclined surface to be equal to the slope of the first inclined surface, when the two are superimposed, the floating clamping surface of the first plate and the second plane of the second plate are respectively parallel to the fixed clamping surface, so that the floating clamping surface can increase the contact area with the second part of the crystal support, thereby providing stable support. Preferably, the slopes of the first and second inclined surfaces are both less than or equal to 0.2, which can improve the movement accuracy of the second plate, thereby improving the vertical height adjustment accuracy of the floating clamping surface.

[0012] In the aforementioned wafer support clamping device, a third drive mechanism is provided on the base, which acts on the second plate to drive the second plate to move along the first inclined surface. It is understood that by driving the second plate along the first inclined surface via the third drive mechanism, the floating clamping surface can be controlled to float relative to the wafer support in the height direction, thereby causing the floating clamping surface to abut against the second portion of the upper surface of the wafer support. In some embodiments, the third drive mechanism can also be communicatively connected to the second drive mechanism, so that when the third drive mechanism drives the floating clamping surface into position, it can send a signal to the second drive mechanism. In response, the second drive mechanism can drive the second clamping member to lift the wafer support, and the second clamping member cooperates with the floating clamping surface to clamp the wafer support.

[0013] In the above-mentioned crystal support clamping device, a first distance sensor is provided on the side of the base close to the floating adjustment member, and the first distance sensor faces the outer peripheral side of the floating clamping surface to obtain the distance to the second part of the upper surface of the crystal support, and the first distance sensor is communicatively connected to the third driving mechanism. Exemplarily, the first distance sensor is preferably an eddy current sensor, which can obtain the height position of the second part of the upper surface of the crystal support. Since the first part of the upper surface of the crystal support has been offset against the fixed clamping surface, and the fixed clamping surface is a fixed height, the height difference between the second part and the first part of the upper surface of the crystal support can be calculated. The eddy current sensor can send a signal to the third driving mechanism, and the third driving mechanism drives the floating adjustment member to move to an appropriate height to offset the second part of the upper surface of the crystal support. At the same time, it can also detect in real time whether the actual distance of the second part of the upper surface of the crystal support reaches the set distance, thereby sending a signal to the third driving mechanism, and the third driving mechanism can stop driving to avoid aggravating the bending of the crystal support and causing hidden cracks in the crystal rod. It should be noted that the upper surface of the crystal tray has a certain curvature. Therefore, the eddy current sensor is closer to the second part of the upper surface of the crystal tray in the horizontal direction, that is, the detection value is more accurate. Therefore, while ensuring that the detection field of view is not blocked by the floating clamping part, it is preferred to set the first distance sensor on the periphery of the floating clamping surface.

[0014] In the aforementioned wafer support clamping device, the second plate is provided with a connecting portion, which is threadedly connected to a screw, and the third drive mechanism acts on the screw to drive the screw to rotate. It is understood that because the second plate is disposed within the accommodating groove and is restricted to movement only along the first inclined surface, the third drive mechanism drives the screw to rotate, which in turn drives the second plate to move along the first inclined surface. This drive method is preferred to ensure the movement accuracy of the second plate, and to achieve an automatic locking function after the screw stops rotating, preventing the floating clamping surface from floating and ensuring stable support of the second portion of the wafer support upper surface.

[0015] In the aforementioned wafer support clamping device, the third drive mechanism is connected to a torque sensor to provide feedback and regulate the rotation of the screw. It is understood that when the torque sensor of the third drive mechanism detects an increase in torque, it can be determined that the floating clamping surface is in contact with the wafer support. Further downward movement of the floating clamping surface requires greater driving force, so the drive screw can be immediately stopped to ensure that the floating clamping surface and wafer support are in perfect contact, thereby preventing hidden cracks in the crystal ingot.

[0016] In the aforementioned wafer support clamping device, a second distance sensor is provided on the screw. The second distance sensor faces the second plate to detect the distance between the screw and the second plate. The second distance sensor is in communication with the third drive mechanism. It is understood that by providing the second distance sensor on the screw, the movement distance of the screw can be further determined, and the actual vertical height change of the second plate and the floating clamping surface can be calculated. This can be matched with the pre-adjusted height of the floating clamping surface calculated after detecting the wafer support position, thus completing closed-loop regulation.

[0017] In the aforementioned wafer support clamping device, the second plate is provided with a magnetic member, and the third drive mechanism includes an electromagnet. The electromagnet acts on the magnetic member to drive the second plate to move along the first inclined surface. It is understood that, as another solution, the magnetic properties of the electromagnet and the magnetic member can be utilized to drive one of the two components to undergo magnetic attraction or repulsion. By controlling the current flowing through the electromagnet to adjust the magnetic force, the amount of movement of the second plate can be varied, thereby similarly achieving height adjustment of the floating clamping surface.

[0018] The present application also aims to provide a wire sawing machine comprising the wafer holder clamping device described above. It is understood that by applying the wafer holder clamping device of the present application to the wire sawing machine, the wafer holder clamping state can be significantly improved, preventing further deformation of the wafer holder that could lead to hidden cracks in the crystal ingot, thereby improving the quality of the sliced ​​crystal ingot.

[0019] The present application also aims to provide a method for clamping a wafer support, comprising the following steps:

[0020] Controlling at least two first clamping members to lift the crystal tray upward, so as to keep a first portion of the upper surface of the crystal tray in contact with the fixed clamping surface of the base;

[0021] Obtaining a height position of a second portion of the upper surface of the wafer support;

[0022] Based on the height position of the second portion of the upper surface of the pedestal, the floating clamping surface is controlled to abut the second portion of the upper surface of the pedestal downward, and the second clamping member is controlled to abut the pedestal upward.

[0023] Compared with the prior art, this application has the following beneficial effects:

[0024] The present application utilizes a floating adjustment member to move downward, thereby abutting against the second part of the upper surface of the supporting crystal tray. The crystal tray will not produce clamping bending, and when the base drives the crystal tray and the crystal rod to press down the cutting line, both the fixed clamping surface and the floating clamping surface can effectively support the cutting reaction force, and the probability of hidden cracks in the crystal rod cutting can be effectively reduced. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] Figure 1This is a schematic structural diagram of the crystal tray clamping device of the present application after being assembled with a crystal tray with a crystal ingot;

[0026] Figure 2 It is a schematic structural diagram of the crystal tray clamping device and the crystal tray separation of the present application;

[0027] Figure 3 This is a schematic diagram of the structure of the crystal tray clamping device of the present application assembled with the crystal tray;

[0028] Figure 4 yes Figure 3 Schematic diagram of the cross-sectional structure in the state Figure 1 ;

[0029] Figure 5 yes Figure 4 Schematic diagram of the enlarged structure of area A in the middle;

[0030] Figure 6 yes Figure 4 Schematic diagram of the enlarged structure of the middle B area;

[0031] Figure 7 This is a structural diagram showing the bottom view of the base after hiding some of the structures in this application;

[0032] Figure 8 yes Figure 3 Schematic diagram of the cross-sectional structure in the state Figure 2 ;

[0033] Figure 9 This is a structural diagram of the floating adjustment member and the second clamping assembly of the present application;

[0034] Figure 10 This is a schematic diagram of the structure of the first plate and the second plate separated from each other in the present application;

[0035] Figure 11 This is a simplified structural diagram of the present application using an electromagnet to drive the floating adjustment member;

[0036] Figure 12 This is a simplified structural diagram of the working state conversion of the wafer holder clamping device of the present application;

[0037] Figure 13 1 is a schematic flow chart of the wafer support clamping method of the present application;

[0038] In the figure, 100, base; a, fixed clamping surface; 700, floating adjustment member; 710, first plate; 711, first opening; 712, first inclined surface; 720, second plate; 721, second opening; 722, third opening; 723, second inclined surface; 724, connecting portion; 725, magnetic member; 726, second plane; b, floating clamping surface; 110, accommodating groove; 120, connecting column; 121, first end; 122, second end; 130, elastic member; 140, mounting groove ;200, first clamping assembly;210, first clamping member;220, first driving mechanism;221, first output end;300, second clamping assembly;310, second clamping member;320, second driving mechanism;321, second output end;400, third driving mechanism;410, screw;420, torque sensor;430, electromagnet;500, first distance sensor;600, second distance sensor;J, crystal holder;J1, first part;J2, second part;S, crystal rod. DETAILED DESCRIPTION

[0039] To make the above-mentioned objects, features, and advantages of the present application more clearly understood, specific embodiments of the present application are described in detail below with reference to the accompanying drawings. The following description sets forth many specific details to facilitate a full understanding of the present application. However, the present application can be implemented in many other ways than those described herein, and those skilled in the art can make similar improvements without violating the scope of the present application. Therefore, the present application is not limited to the specific embodiments disclosed below.

[0040] In the description of the present application, it should be understood that the terms "center", "longitudinal", "lateral", "length", "width", "thickness", "up", "down", "front", "back", "left", "right", "vertical", "horizontal", "top", "bottom", "inside", "outside", "clockwise", "counterclockwise", "axial", "radial", "circumferential" and the like indicate orientations or positional relationships based on the orientations or positional relationships shown in the accompanying drawings, and are only for the convenience of describing the present application and simplifying the description, and do not indicate or imply that the device or element referred to must have a specific orientation, be constructed and operated in a specific orientation, and therefore should not be understood as a limitation on the present application.

[0041] Furthermore, the terms "first" and "second" are used for descriptive purposes only and should not be construed as indicating or implying relative importance or implicitly specifying the number of the technical features being referred to. Thus, a feature defined as "first" or "second" may explicitly or implicitly include at least one of such features. Throughout the description of this application, "plurality" means at least two, for example, two, three, etc., unless otherwise specifically defined.

[0042] In this application, unless otherwise specified or limited, the terms "installed," "connected," "connect," "fixed," etc. should be understood in a broad sense. For example, they can refer to fixed connection, detachable connection, or integration; mechanical connection or electrical connection; direct connection or indirect connection through an intermediate medium; internal communication between two elements or interaction between two elements, unless otherwise specified. Those skilled in the art will understand the specific meanings of the above terms in this application based on specific circumstances.

[0043] In this application, unless otherwise expressly specified or limited, when a first feature is "above" or "below" a second feature, it may mean that the first and second features are in direct contact, or the first and second features are in indirect contact through an intermediate medium. Furthermore, when a first feature is "above," "above," or "above" a second feature, it may mean that the first feature is directly above or diagonally above the second feature, or simply means that the first feature is at a higher level than the second feature. When a first feature is "below," "below," or "below" a second feature, it may mean that the first feature is directly below or diagonally below the second feature, or simply means that the first feature is at a lower level than the second feature.

[0044] It should be noted that when an element is referred to as being "fixed to" or "disposed on" another element, it may be directly on the other element or there may be an intermediate element. When an element is considered to be "connected to" another element, it may be directly connected to the other element or there may be an intermediate element. The terms "vertical," "horizontal," "upper," "lower," "left," "right," and similar expressions used herein are for illustrative purposes only and do not represent the only embodiments.

[0045] Please refer to the attached drawings in the manual Figures 1 to 6 The crystal holder clamping device of the present application includes a base 100, a first clamping assembly 200 and a second clamping assembly 300. The bottom of the base 100 is provided with at least two fixed clamping surfaces a arranged along the length direction. Figure 2 and Figure 7 The fixed clamping surface a is used to abut against the first portion J1 of the upper surface of the wafer tray J. A floating adjustment member 700 is provided between at least two fixed clamping surfaces a. The floating adjustment member 700 is movably connected to the base 100. The floating adjustment member 700 has a floating clamping surface b. The floating clamping surface b has vertical freedom of movement for abutting against the second portion J2 of the upper surface of the wafer tray J. The first portion J1 of the upper surface of the wafer tray J is set to 2 or more locations, and the second portion J2 of the upper surface of the wafer tray J is defined as being located between multiple first portions J1. Figure 4 and Figure 5As shown, the first clamping assembly 200 includes a first clamping member 210 and a first driving mechanism 220. There are at least two first clamping members 210, which are respectively arranged in the vertical direction of the fixed clamping surface a. The first clamping member 210 and the fixed clamping surface a are used to jointly clamp the first portion J1 of the upper surface of the crystal holder J. The first driving mechanism 220 has a first output end 221, which acts on the first clamping member 210 to drive the first clamping member 210 to move closer to or away from the fixed clamping surface a. Figure 4 and Figure 6 As shown, the second clamping assembly 300 includes a second clamping member 310 and a second driving mechanism 320. The second clamping member 310 is arranged in the vertical direction of the floating clamping surface b. The second clamping member 310 and the floating clamping surface b are used to jointly clamp the second part J2 of the upper surface of the crystal holder J. The second driving mechanism 320 has a second output end 321. The second output end 321 passes through the floating adjustment member 700 and acts on the second clamping member 310 to drive the second clamping member 310 to move closer to or away from the floating clamping surface b.

[0046] It can be understood that the fixed clamping surface a is fixed to the bottom of the base 100, and is preferably arranged at the two ends of the bottom of the base 100 or near the two ends of the bottom of the base 100. Exemplarily, there can also be three fixed clamping surfaces a, one of which is arranged in the middle area of ​​the bottom of the base 100, and a floating adjustment member 700 is set between each of the three fixed clamping surfaces a; exemplary, there can also be two fixed clamping surfaces a, and two floating adjustment members 700 are distributed between the two fixed clamping surfaces a at equal intervals in the length direction of the base 100; exemplary, there can also be three fixed clamping surfaces a, and a floating adjustment member 700 is set between two fixed clamping surfaces a. In addition, the number of fixed clamping surfaces a can also be four, five, six, etc., and relatively, at least one floating adjustment member 700 needs to be located between two of the fixed clamping surfaces a. The fixed clamping surface a is fitted with the first part J1 of the upper surface of the crystal support J, and a floating adjustment member 700 is set between at least two fixed clamping surfaces a. The floating adjustment member 700 is used to float up and down so that the floating clamping surface b abuts the second part J2 of the upper surface of the crystal support J, wherein the first part J1 of the upper surface of the crystal support J is generally set to be located at both ends of the upper surface of the crystal support J, and the second part J2 of the upper surface of the crystal support J is generally set to be located in the middle area of ​​the upper surface of the crystal support J. Because the first portion J1 of the upper surface of the pedestal J is lifted upward by at least two first clamping members 210 and abuts against the fixed clamping surface a, while the second portion J2 of the upper surface of the pedestal J protrudes downward relative to the first portion J1 and has a certain curvature, the second clamping member 310 cannot be directly lifted upward to abut against the base 100, otherwise it will easily cause internal stress within the crystal ingot S at the bottom of the pedestal J. Therefore, the floating adjustment member 700 moves downward to abut against the second portion J2 of the upper surface of the pedestal J, preventing the pedestal J from being clamped and bending. When the base 100 drives the pedestal J and the crystal ingot S downward to the cutting line, both the fixed clamping surface a and the floating clamping surface b can support the cutting reaction force, effectively reducing the probability of hidden cracks in the cut crystal ingot S. For example, the first drive mechanism 220 and the second drive mechanism 320 are preferably configured as spring cylinders, but can also be other conventional drive mechanisms with output forces in the vertical direction.

[0047] See also Figure 8 In some embodiments, a receiving groove 110 is provided at the bottom of the base 100, and the receiving groove 110 receives the floating adjustment member 700. The floating adjustment member 700 includes a first plate 710 and a second plate 720. The first plate 710 is disposed between the second clamping member 310 and the base 100. The first plate 710 is movably connected to the base 100 in the vertical direction. Figure 6 and Figure 9As shown, a first opening 711 is provided on the first plate 710, and the first opening 711 is for the second output end 321 to pass through. The side of the first plate 710 facing away from the base 100 is a floating clamping surface b, and the side of the first plate 710 close to the base 100 is a first inclined surface 712. The second plate 720 is arranged between the first plate 710 and the base 100 and is located in the accommodating groove 110. A second opening 721 is provided on the second plate 720, and the second opening 721 is coaxially arranged with the first opening 711 for the second output end 321 to pass through. The second plate 720 has the freedom of movement along the first inclined surface 712 to adjust the vertical movement of the first plate 710 relative to the base 100.

[0048] For example, Figures 8 to 10 As shown, the first plate 710 and the second plate 720 are configured as wedge-shaped blocks. By opening a receiving groove 110 at the bottom of the base 100, a space for the second plate 720 to move is provided. The inner wall of the receiving groove 110 is configured to at least partially abut against the first plate 710 and the second plate 720, thereby ensuring that the second plate 720 can only move along the second inclined surface 723 and cannot move in other directions. By opening holes in the first plate 710 and the second plate 720, the second output end 321 of the second drive mechanism 320 can pass through, which can cooperate with the second clamping member 310 to perform clamping activities in the vertical direction.

[0049] See also Figure 8 and Figure 9 In some embodiments, a connecting portion 724 is provided on the second plate 720, and the connecting portion 724 is threadedly connected to a screw 410. The third driving mechanism 400 acts on the screw 410 to drive the screw 410 to rotate. It is understandable that because the second plate 720 is disposed within the accommodating groove 110 and is restricted to movement only along the first inclined surface 712, the third driving mechanism 400 drives the screw 410 to rotate, and the rotation of the screw 410 can drive the second plate 720 to move along the first inclined surface 712. This driving method is preferred to ensure the movement accuracy of the second plate 720. After the screw 410 stops rotating, it can realize an automatic locking function to prevent the floating clamping surface b from floating, thereby ensuring the stable support of the second portion of the upper surface of the wafer support J.

[0050] Continue to refer to Figure 8 and Figure 9In some embodiments, a second distance sensor 600 is provided on the screw 410. The second distance sensor 600 faces the second plate 720 to detect the distance between the screw 410 and the second plate 720. The second distance sensor 600 is in communication with the third drive mechanism 400. It will be appreciated that by providing the second distance sensor 600 on the screw 410, the movement distance of the screw can be further determined, and the actual vertical height change of the second plate 720 and the floating clamping surface b can be calculated. This can then be matched with the pre-adjusted height of the floating clamping surface b calculated after detecting the position of the wafer support J, completing closed-loop regulation.

[0051] Reference Figure 3 、 Figure 9 as well as Figure 10 In some embodiments, the base 100 is provided with a third drive mechanism 400. The third drive mechanism 400 acts on the second plate 720 to drive the second plate 720 to move along the first inclined surface 712. It will be appreciated that by driving the second plate 720 along the first inclined surface 712 by the third drive mechanism 400, the floating clamping surface b can be controlled to float relative to the wafer support J in the height direction, thereby causing the floating clamping surface b to abut against the second portion of the upper surface of the wafer support J. In some embodiments, the third drive mechanism 400 can also be communicatively connected to the second drive mechanism 320. When the third drive mechanism 400 drives the floating clamping surface b into position, it sends a signal to the second drive mechanism 320. In response, the second drive mechanism 320 drives the second clamping member 310 to lift the wafer support J. The second clamping member 310 cooperates with the floating clamping surface b to clamp the wafer support J. In some embodiments, the third drive mechanism 400 is connected to a torque sensor 420 to provide feedback on the rotation of the adjustment screw 410. It can be understood that when the torque sensor 420 of the third driving mechanism 400 detects an increase in torque, it can be determined that the floating clamping surface b is in contact with the crystal support J. If the floating clamping surface b wants to continue to move downward, a greater driving force is required. Therefore, the driving screw 410 can be stopped immediately to ensure that the floating clamping surface b and the crystal support J are in this state of perfect fit, thereby avoiding hidden cracks and damage to the crystal rod S.

[0052] See also Figures 9 to 11In some embodiments, a connecting post 120 is provided between the first plate 710 and the base 100. The connecting post 120 extends through the second plate 720 to form a third opening 722. The cross-sectional length of the third opening 722 is greater than the outer diameter of the connecting post 120, and the cross-sectional length of the third opening 722 is substantially parallel to the length of the second plate 720. The connecting post 120 has a first end 121 and a second end 122. The first end 121 is fixedly connected to the first plate 710, and an elastic member 130 is provided between the second end 122 and the base 100. The elastic member 130 acts on the second end 122 to maintain an upward movement of the first plate 710. Exemplarily, there are multiple connecting posts 120, preferably four, arranged circumferentially on the first plate 710. The base 100 is provided with mounting grooves 140 corresponding to the number of connecting columns 120. The second end 122 and the elastic member 130 are located in the mounting groove 140. The connecting column 120 passes through the mounting groove 140 and the first plate 710 and is fixedly connected to the second plate 720. The second end 122 of the connecting column 120 is bolt-shaped. The connecting column 120 passes through the mounting groove 140 to form a through hole (not shown). The outer diameter of the second end 122 is larger than the diameter of the through hole. The elastic member 130 is arranged in the mounting groove 140 and is located between the second end 122 and the through hole. This consistently applies an upward elastic force to the second end 122, ensuring that the connecting post 120 consistently drives the first plate 710 upwardly against the second plate 720. When the second plate 720 is subjected to sufficient force to overcome the elastic force of the elastic member 130, it can move, achieving height adjustment of the floating clamping surface b. Furthermore, during this movement, the first plate 710 consistently maintains close contact with the second plate 720 through the elastic force exerted by the elastic member 130 on the connecting post 120, ensuring the precise adjustment of the floating clamping surface b and ensuring resettable performance. It is important to note that the width of the cross-section of the third opening 722 is slightly larger than the outer diameter of the connecting post 120. By arranging the length of the cross-section of the third opening 722 to be substantially parallel to the length of the second plate 720, this provides guidance for the movement of the second plate 720, further improving movement accuracy.

[0053] Reference Figure 10In some embodiments, the second plate 720 has a second inclined surface 723 that abuts the first inclined surface 712, and the slope of the second inclined surface 723 is equal to the slope of the first inclined surface 712. A surface of the second plate 720 that is closest to the base 100 is a second flat surface 726. The second flat surface 726 and the floating clamping surface b are parallel to the fixed clamping surface a. It is understood that by setting the slopes of the second inclined surface 723 and the first inclined surface 712 to be equal, when the two are superimposed, the floating clamping surface b of the first plate 710 and the second flat surface 726 of the second plate 720 are parallel to the fixed clamping surface a. This allows the floating clamping surface b to increase the contact area with the second portion J2 of the wafer holder J, thereby providing stable support. Preferably, the slopes of the first inclined surface 712 and the second inclined surface 723 are both less than or equal to 0.2, thereby improving the movement accuracy of the second plate 720 and further improving the height adjustment accuracy of the floating clamping surface b in the vertical direction.

[0054] Reference Figure 2 、 Figure 7 as well as Figure 12 In some embodiments, a first distance sensor 500 is provided on a side of the base 100 close to the floating adjustment member 700. The first distance sensor 500 faces the outer peripheral side of the floating clamping surface b to obtain the distance from the second part J2 of the upper surface of the crystal holder J, and the first distance sensor 500 is communicatively connected to the third driving mechanism 400. Exemplarily, the first distance sensor 500 is preferably an eddy current sensor, which can obtain the height position of the second part J2 of the upper surface of the crystal support J. Since the first part J1 of the upper surface of the crystal support J has been offset against the fixed clamping surface a, and the fixed clamping surface a is a fixed height, the height difference between the second part and the first part J1 of the upper surface of the crystal support J can be calculated. The eddy current sensor can send a signal to the third driving mechanism 400, and the third driving mechanism 400 drives the floating adjustment member 700 to move to an appropriate height to offset the second part of the upper surface of the crystal support J. At the same time, it can also detect in real time whether the actual distance of the second part of the upper surface of the crystal support J reaches the set distance, thereby sending a signal to the third driving mechanism 400, and the third driving mechanism 400 can stop driving to avoid the crystal support J from bending aggravated and causing the crystal rod S to crack. It should be noted that the upper surface of the crystal support J has a certain curvature. Therefore, the eddy current sensor is closer to the second part of the upper surface of the crystal support J in the horizontal direction, that is, the detection value is more accurate. Therefore, while ensuring that the detection field of view is not blocked by the floating clamping part, it is preferred to set the first distance sensor 500 on the periphery of the floating clamping surface b.

[0055] Reference Figure 11In some embodiments, the second plate 720 is provided with a magnetic member 725, and the third driving mechanism 400 includes an electromagnet 430. The electromagnet 430 acts on the magnetic member 725 to drive the second plate 720 to move along the first inclined surface 712. It is understood that, as another solution, the magnetic properties of the electromagnet 430 and the magnetic member 725 can be utilized to drive one of them to perform magnetic attraction or magnetic repulsion. By controlling the current of the electromagnet 430 to adjust the magnetic force, the movement of the second plate 720 can be changed, and the height of the floating clamping surface b can also be adjusted.

[0056] The working principle of the crystal holder clamping device of this application is as follows:

[0057] First, you can refer to Figure 1 , glue the crystal rod S to the bottom surface of the crystal support J, and then refer to Figure 2 As shown, the upper half of the crystal holder J is embedded between the base 100 and the first clamping member 210 and the second clamping member 310. When both ends of the crystal holder J are located below both ends of the base 100, refer to Figure 12 The simple working process of each component is as follows: the first driving mechanism 220 drives the first clamping member 210 to lift the crystal tray J upward until the first part J1 of the upper surface of the crystal tray J is against the fixed clamping surface a of the base 100, and then the height position of the second part J2 of the upper surface of the crystal tray J is detected by the first distance sensor 500, thereby sending a signal to the third driving mechanism 400, and the third driving mechanism 400 drives the screw 410 to rotate, and the rotation of the screw 410 drives the second plate 720 to move along the first plate 710. When the first plate 710 moves, it overcomes the elastic force of the elastic member 130 and presses the second plate 720 downward, so that the floating clamping surface b of the second plate 720 moves downward until it is against the second part J2 of the upper surface of the crystal tray J. Finally, the second driving mechanism 320 drives the second clamping member 310 upward to abut the bottom of the crystal tray J.

[0058] Beneficial effects:

[0059] The crystal support J clamping device of the present application can move in the vertical direction by providing a floating adjustment member 700, so that it can abut against the second part J2 of the upper surface of the crystal support J, and the crystal support J will not be clamped and bent. When the base 100 drives the crystal support J and the crystal rod S to press down the cutting line, the fixed clamping surface a and the floating clamping surface b can both support the cutting reaction force, and the probability of hidden cracks in the cutting of the crystal rod S can be effectively reduced. By providing a accommodating groove 110 at the bottom of the base 100, a space for the second plate 720 to move is provided, and the inner wall of the accommodating groove 110 is configured to at least partially abut against the first plate 710 and the second plate 720, so as to ensure that the second plate 720 can only move along the second inclined surface 723 and cannot jump in other directions. By providing an elastic member 130, a constant pressure is always provided to the second end 122. An upward elastic force ensures that the connecting column 120 always drives the first plate 710 upward and tightly against the second plate 720. When the second plate 720 is subjected to sufficient force to overcome the elastic force of the elastic member 130, it can move to achieve height adjustment of the floating clamping surface b. In addition, during the movement, the first plate 710 always closely adheres to the second plate 720 through the elastic force of the elastic member 130 on the connecting column 120, ensuring the height adjustment accuracy of the floating clamping surface b and having a resettable performance. By setting detection elements such as the first distance sensor 500, the second distance sensor 600, and the torque sensor 420, it can be ensured that the second part J2 of the upper surface of the crystal holder J is exactly in contact with the floating clamping surface b, and the floating clamping member will not be excessively pressed down to aggravate the bending of the crystal holder J, thereby reducing the probability of hidden cracks inside the crystal rod S.

[0060] The wire cutting machine (not shown) of the present application includes the crystal support clamping device of the present application. It can be understood that by applying the crystal support clamping device of the present application to the wire cutting machine, the clamping state of the crystal support can be significantly improved, the crystal support can be prevented from continuing to deform and causing hidden cracks in the crystal rod, and the slicing quality of the crystal rod can be improved. The wire cutting machine of the present application mainly refers to a device for wire cutting crystal rods or crystals into wafers. Wire cutting can be achieved by moving wire materials such as diamond wire back and forth in conjunction with the downward pressure of the crystal support crystal rod. The wire cutting machine is a mature equipment solution, so it will not be described in detail.

[0061] See also Figure 13 The crystal support clamping method of the present application comprises the following steps:

[0062] S100 , controlling at least two first clamping members 210 to lift the crystal holder J upward, so as to keep the first portion J1 of the upper surface of the crystal holder J in contact with the fixed clamping surface a of the base 100 ;

[0063] S200, obtaining the height position of the second portion J2 on the upper surface of the wafer holder J;

[0064] S300 , based on the height position of the second portion J2 on the upper surface of the wafer tray J, control the floating clamping surface b to abut the second portion J2 on the upper surface of the wafer tray J downward, and control the second clamping member 310 to abut the wafer tray J upward.

[0065] It is understood that obtaining the height position of the second portion J2 of the upper surface of the wafer support J can be achieved by the first distance sensor 500. It should be noted that the order of controlling the floating clamping surface b to downwardly abut the second portion J2 of the upper surface of the wafer support J and controlling the second clamping member 310 to upwardly abut the wafer support J can be interchanged, but it is necessary to ensure that the floating clamping surface b or the second clamping member 310 does not move excessively. Preferably, the movement of the floating clamping surface b is initiated first to abut the second portion J2 of the upper surface of the wafer support J.

[0066] The specific embodiments described herein are merely illustrative of the spirit of the present application. Persons skilled in the art may make various modifications, additions, or substitutions to the described specific embodiments without departing from the spirit of the present application or exceeding the scope defined by the appended claims.

Claims

1. A method for clamping a wafer tray, applicable to a wafer tray clamping device, characterized in that: The crystal support clamping device includes: A base (100), wherein the bottom of the base (100) is provided with at least two fixed clamping surfaces (a) arranged along the length direction, and the fixed clamping surfaces (a) are used to abut against the first part of the upper surface of the crystal support, a floating adjustment member (700), the floating adjustment member (700) being disposed between at least two of the fixed clamping surfaces (a) and being movably connected to the base (100), the floating adjustment member (700) having a floating clamping surface (b), the floating clamping surface (b) having vertical freedom of movement for contacting with a second portion of the upper surface of the wafer support, and defining the second portion of the upper surface of the wafer support to be located between the first portions of the at least two upper surfaces of the wafer support; A first clamping assembly (200), the first clamping assembly (200) comprising: a first clamping member (210), wherein the first clamping members (210) are at least two and are respectively arranged in the vertical direction of the fixed clamping surface (a), and the first clamping member (210) and the fixed clamping surface (a) are used to jointly clamp the crystal holder; a first driving mechanism (220), the first driving mechanism (220) having a first output end (221), the first output end (221) acting on the first clamping member (210) to drive the first clamping member (210) toward or away from the fixed clamping surface (a); and A second clamping assembly (300), the second clamping assembly (300) comprising: A second clamping member (310), the second clamping member (310) is arranged in a vertical direction of the floating clamping surface (b), and the second clamping member (310) and the floating clamping surface (b) are used to jointly clamp the crystal holder; a second driving mechanism (320), the second driving mechanism (320) having a second output end (321), the second output end (321) passing through the floating adjustment member (700) and acting on the second clamping member (310) to drive the second clamping member (310) to move closer to or away from the floating clamping surface (b); The crystal tray clamping method includes: Controlling at least two first clamping members (210) to lift the crystal tray upwards, so as to keep a first portion of the upper surface of the crystal tray in contact with the fixed clamping surface (a) of the base (100); Obtaining a height position of a second portion of the upper surface of the wafer support; Based on the height position of the second portion of the upper surface of the crystal tray, the floating clamping surface (b) is controlled to abut the second portion of the upper surface of the crystal tray downward, and the second clamping member (310) is controlled to abut the crystal tray upward.

2. The method for clamping a crystal tray according to claim 1, wherein: The base (100) has a bottom with a receiving groove (110), and the receiving groove (110) receives the floating adjustment member (700). The floating adjustment member (700) includes: a first plate (710), the first plate (710) being disposed between the second clamping member (310) and the base (100), the first plate (710) being movably connected to the base (100) in a vertical direction, a first opening (711) being provided on the first plate (710), the first opening (711) being for the second output end (321) to pass through, a surface of the first plate (710) facing away from the base (100) being the floating clamping surface (b), and a surface of the first plate (710) close to the base (100) being a first inclined surface (712); A second plate (720) is provided between the first plate (710) and the base (100) and is located in the receiving groove (110). A second opening (721) is provided on the second plate (720). The second opening (721) is coaxially arranged with the first opening (711) for allowing the second output end (321) to pass through. The second plate (720) has the freedom of movement along the first inclined surface (712) to adjust the vertical movement of the first plate (710) relative to the base (100).

3. The method for clamping a crystal tray according to claim 2, wherein: A connecting column (120) is provided between the first plate body (710) and the base (100), and the connecting column (120) passes through the second plate body (720) to form a third opening (722), the cross-sectional length of the third opening (722) is greater than the outer diameter of the connecting column (120), and the length direction of the cross-sectional length of the third opening (722) is substantially parallel to the length direction of the second plate body (720), and the connecting column (120) has a first end (121) and a second end (122), the first end (121) is fixedly connected to the first plate body (710), and an elastic member (130) is provided between the second end (122) and the base (100), and the elastic member (130) acts on the second end (122) so that the first plate body (710) always has a tendency to move upward.

4. The method for clamping a crystal tray according to claim 2, wherein: The second plate body (720) has a second inclined surface (723), the second inclined surface (723) is in contact with the first inclined surface (712), and the slope of the second inclined surface (723) is equal to the slope of the first inclined surface (712). The surface of the second plate body (720) close to the base (100) is a second plane (726), and the second plane (726) and the floating clamping surface (b) are respectively parallel to the fixed clamping surface (a).

5. The method for clamping a crystal tray according to claim 2, wherein: A third driving mechanism (400) is provided on the base (100), and the third driving mechanism (400) acts on the second plate (720) to drive the second plate (720) to move along the first inclined surface (712).

6. The method for clamping a crystal tray according to claim 5, wherein: A first distance sensor (500) is provided on the side of the base (100) close to the floating adjustment member (700), and the first distance sensor (500) faces the outer peripheral side of the floating clamping surface (b) to obtain the distance from the second part of the upper surface of the crystal support, and the first distance sensor (500) is communicatively connected to the third driving mechanism (400).

7. The method for clamping a crystal tray according to claim 5, wherein: The second plate (720) is provided with a connecting portion (724), the connecting portion (724) is threadedly connected to a screw rod (410), and the third driving mechanism (400) acts on the screw rod (410) to drive the screw rod (410) to rotate.

8. The method for clamping a wafer tray according to claim 7, wherein: The third driving mechanism (400) is connected to a torque sensor (420) for feedback regulation of the rotation of the screw (410).

9. The method for clamping a wafer tray according to claim 7, wherein: A second distance sensor (600) is provided on the screw rod (410), the second distance sensor (600) faces the second plate body (720) to obtain the distance between the second plate body (720), and the second distance sensor (600) is communicatively connected to the third driving mechanism (400).

10. The method for clamping a crystal tray according to claim 5, wherein: A magnetic part (725) is provided on the second plate (720), and the third driving mechanism (400) includes an electromagnet (430). The electromagnet (430) acts on the magnetic part (725) to drive the second plate (720) to move along the first inclined surface (712).

11. A wire cutting machine, characterized in that: Used to implement the crystal tray clamping method as described in any one of claims 1-10.

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