Modularized ceramic matrix composite heat insulation tile and design method thereof

Abstract

The invention provides a modular ceramic-based composite material heat insulation tile and a design method thereof, the heat insulation tile comprises a ceramic-based outer shell, the ceramic-based outer shell is filled with a plurality of permeable topological structure particles, the plurality of permeable topological structure particles form a lattice structure particle layer, and the lattice structure particle layer and the ceramic-based outer shell are integrally formed; and light low-thermal-conductivity materials are filled between gaps of the adjacent permeable topological structure particles and in cavities in the permeable topological structure particles, and the light low-thermal-conductivity materials and the light low-thermal-conductivity materials jointly form a filling layer. According to the method, the temperature difference between the upper surface and the lower surface of a modular ceramic matrix composite heat insulation tile model is calculated through finite element simulation and serves as the basis for optimizing the thickness of a filling layer. The method is suitable for an ultra-high-temperature thermal protection structure, the heat insulation performance is remarkably improved, and the aim of light weight of the thermal protection structure is achieved; meanwhile, a finite element method is adopted for structural parameterization design, the time period of the thermal protection structure from design to application is shortened, and therefore rapid optimization of the ultra-high-temperature thermal protection structure is achieved.

Description

Technical Field

[0001] The present invention belongs to the technical field of computer materials science, relates to ceramic matrix composite thermal insulation materials, and particularly relates to a modular ceramic matrix composite thermal insulation tile and a design method thereof. Background Art

[0002] During hypersonic flight, the aircraft will experience extreme aerodynamic heating, frictional heating, and shock heating effects. When the surface of the aircraft comes into direct contact with the high-speed airflow, the surface temperature of the aircraft will rapidly increase during flight, and the local temperature can reach up to 1800K. Conventional heat-resistant alloys cannot withstand such high temperatures. Therefore, when designing and applying a thermal protection system, especially for hypersonic aircraft, thermal insulation tiles are often used to cope with extreme aerodynamic heating.

[0003] Traditional thermal insulation tiles are usually large in size. Especially when a large amount of thermal protection materials are required to cover the surface of the aircraft, the size of the tiles may need to reach several meters or even larger. The large size of the thermal insulation tiles makes it more difficult to control the processing accuracy and quality. During the manufacturing process, deformation or surface defects may occur, affecting the thermal performance and structural strength of the materials. Large-sized tiles require special transportation and handling equipment, and highly precise docking is required during installation on the aircraft to ensure the thermal protection effect, resulting in difficulties in transportation and assembly. Different aircraft components (such as the nose, wings, tail fins, etc.) have different shapes, and different types of thermal insulation tiles are required to meet the thermal protection requirements of different parts. At the same time, there are often large curvatures on the surfaces of these parts. In order to make the thermal insulation tiles fit tightly with the aircraft surface, each tile usually needs to be custom processed, resulting in a long production cycle and high processing costs. The thermal insulation tiles of hypersonic aircraft usually require high-precision installation, and the combination between different materials and different types of tiles needs to be very careful. The installation process is complex, requiring high skills from installation workers and consuming a huge amount of time. During the later maintenance work of the aircraft, the thermal insulation tiles will inevitably experience problems such as wear, aging, or damage, and regular inspections and replacements are required. However, due to their complex shapes and diverse materials, the maintenance and replacement are very difficult. Summary of the Invention

[0004] Aiming at the defects and deficiencies existing in the prior art, the purpose of the present invention is to provide a modular ceramic matrix composite thermal insulation tile and a design method thereof, so as to solve the technical problems such as large weight, large size, large curvature, use of multiple materials, complex processing, high cost, difficult installation and maintenance, etc. existing in the thermal insulation tiles applied to hypersonic aircraft in the prior art.

[0005] To solve the above technical problems, the present invention adopts the following technical solutions to achieve:

[0006] A modular ceramic matrix composite heat insulation tile, comprising a ceramic matrix outer shell, and the ceramic matrix outer shell is a hollow regular hexagonal prism structure shell.

[0007] A plurality of closely arranged hollow topological configuration particles are arranged in the ceramic matrix outer shell and form a lattice structure particle layer, and the material of the hollow topological configuration particles is the same as that of the ceramic matrix outer shell; a lightweight low thermal conductivity material is filled between the gaps of adjacent hollow topological configuration particles and in the cavities inside the hollow topological configuration particles, and the filled lightweight low thermal conductivity materials together form a filling layer.

[0008] A lightweight low thermal conductivity material is filled between the gaps of adjacent hollow topological configuration particles and in the cavities inside the hollow topological configuration particles, and the filled lightweight low thermal conductivity materials together form a filling layer.

[0009] The lightweight low thermal conductivity material is selected from one of alumina fiber and thermal insulation aerogel or a mixture of two in any proportion.

[0010] The present invention also has the following technical features:

[0011] Specifically, the hollow topological configuration particle is composed of six hollow topological configuration particle first unit blocks and twelve hollow topological configuration particle second unit blocks.

[0012] Specifically, the main body of the hollow topological configuration particle first unit block is a block with a regular octagonal prism structure, and a first hole is axially opened in the middle of the main body of the hollow topological configuration particle first unit block, and the first hole is a hole with a rectangular structure.

[0013] Specifically, the hollow topological configuration particle second unit block is a block with a cuboid structure.

[0014] Specifically, four sides of the hollow topological configuration particle first unit block are connected to the hollow topological configuration particle second unit block, and the four sides are not adjacent to each other in pairs, and each side is respectively connected to a hollow topological configuration particle second unit block; the space surrounded by three hollow topological configuration particle first unit blocks and three hollow topological configuration particle second unit blocks is a second hole, and the second hole is a hole with a regular hexagonal structure.

[0015] Specifically, the side length of the ceramic matrix outer shell is 100 mm, and the wall thickness of the ceramic matrix outer shell is 2 mm.

[0016] Specifically, the particle size of the hollow topological configuration particle is 8 mm to 26 mm, the thickness of the structure of the hollow topological configuration particle filling layer is 8 mm to 26 mm, and the thickness of the filling layer is equal to that of the particle size filling layer of the hollow topological configuration particle.

[0017] Specifically and preferably, the porosity of the dot matrix structure particle layer is 78.4%.

[0018] Most preferably and optionally, when the overall thickness of the modular ceramic matrix composite heat insulation tile is 20 mm, the particle size of the open topological configuration particles is 16 mm, the thickness of the filling layer is 16 mm, and the lightweight low thermal conductivity material is alumina fiber, the cooling requirement of 500 °C can be met.

[0019] Most preferably and optionally, when the overall thickness of the modular ceramic matrix composite heat insulation tile is 22 mm, the particle size of the open topological configuration particles is 18 mm, the thickness of the filling layer is 18 mm, and the lightweight low thermal conductivity material is thermal insulation aerogel, the cooling requirement of 500 °C can be met.

[0020] Specifically, the modular ceramic matrix composite heat insulation tile is applicable to ultra-high temperature environments of 1500 °C or higher.

[0021] The present invention also protects a design method for the modular ceramic matrix composite heat insulation tile as described above. This method uses finite element simulation to calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model, and uses this as the basis for optimizing the structural parameters of the modular ceramic matrix composite heat insulation tile. This method specifically includes the following steps:

[0022] Step 1, determine the structural parameters and materials:

[0023] The structural parameters include: the side length of the ceramic matrix outer shell, the wall thickness of the ceramic matrix outer shell, the particle size of the open topological configuration particles, the thickness of the filling layer, and the porosity of the dot matrix structure particle layer.

[0024] Step 2, establish a geometric model:

[0025] In the modeling software, construct the geometric model of the ceramic matrix outer shell and the geometric model of a single open topological configuration particle. Arrange several open topological configuration particles closely to form a dot matrix structure particle layer, and fill the geometric model of the lightweight low thermal conductivity material in the gaps between adjacent open topological configuration particles and in the cavities inside the open topological configuration particles to obtain the geometric model of the filling layer; combine the geometric models of the ceramic matrix outer shell, the dot matrix structure particle layer, and the filling layer together to obtain the modular ceramic matrix composite heat insulation tile model.

[0026] Step 3, parameter optimization design:

[0027] Based on the geometric model of the modular ceramic matrix composite heat insulation tile established in Step 2, in the modeling software, in combination with the structural parameters in Step 1, set the optimization range of the input parameters; specifically, the optimization range of the input parameters is as follows: the particle size of the hollow topology configuration particles is 8 mm to 26 mm, the thickness of the filling layer is 8 mm to 26 mm, and the overall thickness of the modular ceramic matrix composite heat insulation tile is set to 12 mm to 30 mm.

[0028] Step 4, perform solid mesh division:

[0029] In the finite element software, perform tetrahedral mesh division on each component of the model; when dividing, insert a mesh encryption option in the mesh settings, select the encryption surfaces as the filling layer and the lightweight low thermal conductivity material filling layer, and perform mesh update; specifically, when performing mesh encryption, the encryption cycle value is set to 3.

[0030] Step 5, set boundary conditions:

[0031] In the finite element software, apply a temperature boundary to the upper surface of the ceramic matrix outer shell and set a thermal radiation condition on the upper surface of the ceramic matrix outer shell; specifically, the temperature boundary applied to the upper surface of the ceramic matrix outer shell is 1300 °C; set a surface-to-environment thermal radiation condition with an emissivity of 0.8 and an ambient temperature of 22 °C on the upper surface of the ceramic matrix outer shell. The lower surface and the side surfaces of the ceramic matrix outer shell are set as adiabatic boundaries.

[0032] Step 6, determine parameter variables and calculation scale:

[0033] In the finite element software, set the output parameters as: the maximum temperature on the lower surface of the ceramic matrix outer shell, the minimum temperature on the lower surface of the ceramic matrix outer shell, and the average temperature on the lower surface of the ceramic matrix outer shell; based on the size limitations of the usage scenario and according to the optimization range of the input parameters in Step 3, perform calculations every 1 mm.

[0034] Step 7, calculate the heat insulation performance:

[0035] In the finite element software, calculate and obtain the maximum temperature on the lower surface of the ceramic matrix outer shell, the minimum temperature on the lower surface of the ceramic matrix outer shell, and the average temperature on the lower surface of the ceramic matrix outer shell.

[0036] Step 8, determine the thickness of the filling layer:

[0037] Based on the calculation results in Step 7, calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model, that is, subtract the maximum temperature on the lower surface of the ceramic matrix outer shell from the temperature on the upper surface of the ceramic matrix outer shell; based on the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model, finally determine the thickness of the filling layer.

[0038] Compared with the prior art, the present invention has the following beneficial technical effects:

[0039] (Ⅰ) The modular ceramic matrix composite insulation tile designed by the present invention is applicable to ultra-high temperature (≥1500°C) thermal protection structures. The shape of the insulation tile is a regular hexagon with consistent dimensions. The modular insulation structure with unified specifications can achieve large-scale production in the same batch, greatly reducing the economic and time costs. At the same time, the modular insulation structure has unified specifications, the large-area paving process is the same, the installation difficulty and the technical requirements for workers are reduced, avoiding assembly problems caused by uneven technical levels of workers, and realizing rapid installation.

[0040] (Ⅱ) Since the layout method of the modular ceramic matrix composite insulation tile designed by the present invention is a regular hexagon honeycomb-like multi-point tightly connected and densely paved, which is connected to six adjacent pieces to form a multi-point interlocking structure, the overall structural stability under aerodynamic loads is improved; in addition, since the present invention uses a filling layer made of a light and low thermal conductivity material and a lattice structure particle layer with a high porosity (porosity greater than 75%), it can take into account low cost and light weight while improving the insulation performance to meet the development trend of current ultra-high temperature thermal protection structures.

[0041] (Ⅲ) The present invention uses the finite element method to design the modular ceramic matrix composite insulation tile, which not only reduces the cost of material development and testing, but also analyzes the influence law of different input variables on the insulation performance of the modular ceramic matrix composite insulation tile by using the parametric model method; in addition, the structural design by the finite element method can also reduce the time cycle of the material from design to application, so as to realize the rapid optimization of the modular ceramic matrix composite insulation tile. BRIEF DESCRIPTION OF THE DRAWINGS

[0042] Figure 1 It is a schematic structural diagram of the modular ceramic matrix composite insulation tile.

[0043] Figure 2 It is a schematic structural diagram of the filling layer.

[0044] Figure 3 It is a schematic structural diagram of the open-topology configuration particles.

[0045] Figure 4 It is a schematic structural diagram of the lattice structure particle layer composed of the open-topology configuration particles.

[0046] Figure 5 It is the insulation performance curve graph of Example 2 and Example 3; Figure 5 In the figure: the horizontal axis is the overall thickness of the modular ceramic matrix composite insulation tile (unit: mm), and the vertical axis is the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite insulation tile model (unit: °C).

[0047] Figure 6 Schematic diagram of the modular heat-insulating tile with a cross-shaped particle lattice structure of Comparative Example 1.

[0048] Figure 7 Schematic diagram of the structure of the cross-shaped particle of Comparative Example 1.

[0049] The meanings of the reference numerals in the figure are as follows: 1 - ceramic matrix outer shell, 2 - open topological configuration particles, 3 - filling layer, 4 - lattice structure particle layer.

[0050] 101 - upper plate of the outer shell, 102 - lower plate of the outer shell, 103 - boundary plate.

[0051] 201 - first unit block of the open topological configuration particles, 202 - second unit block of the open topological configuration particles, 203 - first hole, 204 - second hole.

[0052] The technical solutions of the present invention will be further described below in conjunction with the embodiments. Specific embodiments

[0053] In the present invention, the particle size of the open topological configuration particles 2 refers to the maximum vertical distance between two opposite first unit blocks of the open topological configuration particles.

[0054] It should be noted that the software used in the present invention is, without special instructions, conventional software known in the prior art. For example: the modeling software uses the SpaceClaim module in the commonly used Ansys Workbench known in the prior art. The finite element analysis software uses the Steady-State Thermal module in the commonly used Ansys Workbench known in the prior art.

[0055] It should be noted that the materials mentioned in the present invention are, without special instructions, conventional materials known in the prior art. For example: alumina fiber is lightweight fibrous alumina. Heat-insulating aerogel is a gel with a nanoscale porous structure, including gelatin, gum arabic, silica gel, etc.

[0056] It should be noted that the present invention is a computer simulation design. In actual production, the preparation method of the modular ceramic matrix composite heat-insulating tile can adopt conventional methods known in the prior art. For example: using 3D printing technology to manufacture the ceramic matrix outer shell 1 without a lower plate and the lattice structure particle layer 4, and then pouring molten alumina fiber or melted heat-insulating aerogel into the ceramic matrix outer shell 1, so that the alumina fiber or heat-insulating aerogel fills the voids of the lattice structure particle layer 4. After the alumina fiber or heat-insulating aerogel solidifies, then use high-temperature ceramic glue to bond the pre-3D printed lower plate, and ensure the bonding accuracy during bonding to achieve the effect of integral molding.

[0057] In accordance with the above technical solution, specific embodiments of the present invention are given below. It should be noted that the present invention is not limited to the following specific embodiments, and any equivalent transformation based on the technical solution of this application falls within the protection scope of the present invention.

[0058] Embodiment 1:

[0059] This embodiment provides a modular ceramic matrix composite heat insulation tile, as Figure 1 、 Figure 2 and Figure 4 shown, including a ceramic matrix outer shell 1, the ceramic matrix outer shell 1 is a hollow regular hexagonal prism structure shell; a plurality of closely arranged hollow topological configuration particles 2 are arranged inside the ceramic matrix outer shell 1 and form a lattice structure particle layer 4, and the material of the hollow topological configuration particles 2 is the same as that of the ceramic matrix outer shell 1; a lightweight low thermal conductivity material is filled between the gaps of adjacent hollow topological configuration particles 2 and in the cavities inside the hollow topological configuration particles 2, and the filled lightweight low thermal conductivity materials together form a filling layer 3.

[0060] As a specific solution of this embodiment, the lightweight low thermal conductivity material is selected from one of alumina fiber and thermal insulation aerogel or a mixture of two in any proportion.

[0061] As a specific solution of this embodiment, as Figure 1 shown, a plurality of hollow topological configuration particles 2 are arranged in a single layer.

[0062] As a specific solution of this embodiment, as Figure 1 shown, the ceramic matrix outer shell 1 includes an outer shell upper plate 101 and an outer shell lower plate 102 arranged parallel and opposite to each other. The outer shell upper plate 101 is the plate exposed to the external environment, and the outer shell lower plate 102 is the plate close to the aircraft; the outer shell upper plate 101 and the outer shell lower plate 102 have exactly the same shape and size, and are both flat plates with a hexagonal structure; six boundary plates 103 are arranged between the outer shell upper plate 101 and the outer shell lower plate 102, and the closed cavity formed by the outer shell upper plate 101, the outer shell lower plate 102 and the six boundary plates 103 is an interlayer filling cavity, and the filling layer 3 is arranged in the interlayer filling cavity.

[0063] As a specific solution of this embodiment, as Figure 3 shown, the hollow topological configuration particle 2 is generally a hollow truncated octahedron structure, and is composed of six hollow topological configuration particle first unit blocks 201 and twelve hollow topological configuration particle second unit blocks 202.

[0064] As a specific solution of this embodiment, as Figure 3As shown, the main body of the first unit block 201 of the hollow topological configuration particles is a block with a regular octagonal prism structure. A first hole 203 is provided along the axial direction in the middle of the main body of the first unit block 201 of the hollow topological configuration particles. The first hole 203 is a hole with a rectangular structure.

[0065] As a specific solution of this embodiment, as Figure 3 shown, the second unit block 202 of the hollow topological configuration particles is a block with a cuboid structure.

[0066] As a specific solution of this embodiment, as Figure 3 shown, four sides of the first unit block 201 of the hollow topological configuration particles are connected to the second unit block 202 of the hollow topological configuration particles. The four sides are not adjacent to each other in pairs, and each side is respectively connected to a second unit block 202 of the hollow topological configuration particles; the space enclosed by three first unit blocks 201 of the hollow topological configuration particles and three second unit blocks 202 of the hollow topological configuration particles is the second hole 204, and the second hole 204 is a hole with a regular hexagonal structure.

[0067] Embodiment 2:

[0068] This embodiment provides a design method for the modular ceramic matrix composite heat insulation tile of Embodiment 1. The method specifically includes the following steps:

[0069] Step 1, determine the structural parameters and materials:

[0070] In this embodiment, the side length of the upper shell plate 101 and the lower shell plate 102 (i.e., the side length of the ceramic matrix shell 1) is 100 mm, the particle size of the hollow topological configuration particles is 8 mm, the thickness of the filling layer 3 is 8 mm, the thickness of the upper shell plate 101, the lower shell plate 102 and the boundary layer plate 103 is 2 mm, and the overall thickness of the modular ceramic matrix composite heat insulation tile (i.e., the sum of the thickness of the upper shell plate 101, the thickness of the lower shell plate 102 and the thickness of the filling layer 3) is 12 mm; the porosity of the filling layer lattice structure is 78.4%.

[0071] In this embodiment, the material of the ceramic matrix shell 1 is a high-entropy carbide ceramic with a Zr-Ta-W-TiC-SiC-based carbon-containing reinforcement. The density of this material is 853 kg / m 3 , the thermal conductivity is 18.2 W / m·°C, the specific heat is 1420 J / kg·°C, and the surface emissivity is 0.8; the material of the filling layer 3 is alumina fiber, that is, both the hollow topological configuration particles 2 and the lightweight low-thermal-conductivity material filled in the pores thereof are alumina fiber; the density of the alumina fiber filling layer 3 is 56 kg / m 3 , the specific heat is 1000 J / kg·°C, and the thermal expansion coefficient is 3.0×10-6 / °C, and the isotropic thermal conductivity is 0.02 W / m·°C.

[0072] In this embodiment, the temperature reduction requirement is 500 °C, that is, the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model needs to be greater than or equal to 500 °C.

[0073] Step 2, establish a geometric model:

[0074] Construct the geometric model of the ceramic matrix outer shell 1 and the geometric model of a single hollow topological configuration particle 2 in the modeling software. Arrange several hollow topological configuration particles 2 closely to form a lattice structure particle layer 4. Fill the gaps between adjacent hollow topological configuration particles 2 and the cavities inside the hollow topological configuration particles 2 with the geometric model of a lightweight low thermal conductivity material to obtain the geometric model of the filling layer 3. Combine the geometric models of the ceramic matrix outer shell 1, the lattice structure particle layer 4, and the filling layer 3 to obtain the modular ceramic matrix composite heat insulation tile model.

[0075] Step 3, parameter optimization design:

[0076] Based on the geometric model of the modular ceramic matrix composite heat insulation tile established in Step 2, in the modeling software, combined with the structural parameters in Step 1, set the optimization range of the input parameters. In this embodiment, the optimization range of the input parameters is specifically: the particle size of the hollow topological configuration particle is 8 mm to 26 mm, the thickness of the filling layer 3 is 8 mm to 26 mm, and the overall thickness of the modular ceramic matrix composite heat insulation tile is set to 12 mm to 30 mm.

[0077] Step 4, perform solid mesh division:

[0078] In the finite element software, perform tetrahedral mesh division on the geometric models of the components of the model, namely the ceramic matrix outer shell 1, the hollow topological configuration particle 2, and the lightweight low thermal conductivity material filling layer 3. Since there are a large number of small planes in the hollow irregular polygon topological configuration lattice structure and the lightweight low thermal conductivity material filling layer, it is necessary to encrypt the mesh to ensure the mesh quality and result accuracy. Insert a mesh encryption option in the mesh settings, select the encrypted surface as the lattice structure of the hollow topological configuration particle 2 and the lightweight low thermal conductivity material of the filling layer 3, set the encryption cycle value to 3, and perform mesh update.

[0079] Step 5, set boundary conditions:

[0080] Apply a temperature boundary of 1300 °C to the surface of the upper layer plate 101 of the outer shell in the finite element software, and set the surface-to-environment thermal radiation conditions with an emissivity of 0.8 and an ambient temperature of 22 °C on the upper layer plate 102 of the outer shell. Set the lower surface and side surfaces of the ceramic matrix outer shell as adiabatic boundaries.

[0081] Step 6, determine the parameter variables and calculation scale:

[0082] Set the output parameters in the finite element software as: the maximum temperature on the surface of the lower layer of the outer shell, the minimum temperature on the surface of the lower layer of the outer shell, and the average temperature on the surface of the lower layer of the outer shell; based on the size limitations of the usage scenario and according to the optimization range of the input parameters in Step 3, that is, the particle size of the open-top topology particles is 8 mm to 26 mm, the thickness of the filling layer 3 is 8 mm to 26 mm, and the overall thickness of the modular ceramic matrix composite heat insulation tile is set to 12 mm to 30 mm, and calculations are carried out every 1 mm. In this embodiment, the total number of calculations is 19 cases.

[0083] Step 7, calculate the heat insulation performance:

[0084] In the finite element software, set the calculation order as follows: carry out calculations from small to large in the range of 8 mm to 26 mm to obtain the maximum temperature on the surface of the lower layer of the outer shell, the minimum temperature on the surface of the lower layer of the outer shell, and the average temperature on the surface of the lower layer of the outer shell. It should be noted that when calculating the temperature difference subsequently, only the maximum temperature on the surface of the lower layer is used. The purpose of outputting the minimum temperature and average temperature here is to judge the accuracy of the simulation through the results.

[0085] Step 8, determine the thickness of the filling layer:

[0086] Based on the calculation results in Step 7, calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model, that is, use the temperature on the surface of the upper layer of the outer shell (that is, 1300 °C set in Step 5 minus the maximum temperature on the surface of the lower layer of the outer shell), and the specific results are as Figure 5 shown. It can be seen from Figure 5 that as the thickness of the filling layer 3 increases, the heat insulation effect gradually increases. Combining the cooling requirement of 500 °C, in this embodiment, the overall thickness of the finally designed modular ceramic matrix composite heat insulation tile should be not less than 22 mm, that is, the thicknesses of the upper layer plate 101, the lower layer plate 102 of the outer shell, and the boundary layer plate 103 are 2 mm, and the thickness of the filling layer 3 should be not less than 18 mm.

[0087] Example 3:

[0088] This embodiment provides a design method for the modular ceramic matrix composite heat insulation tile of Example 1, and the method specifically includes the following steps:

[0089] Step 1, determine the structural parameters and materials:

[0090] In this embodiment, the side lengths of the upper shell plate 101 and the lower shell plate 102 are 100 mm, the particle size of the open topological configuration particles is 8 mm, the thickness of the filling layer 3 is 8 mm, the thicknesses of the upper shell plate 101, the lower shell plate 102 and the boundary layer plate 103 are 2 mm, and the overall thickness of the modular ceramic matrix composite heat insulation tile is 12 mm; the porosity of the filling layer lattice structure is 78.4%.

[0091] In this embodiment, the material of the ceramic matrix shell 1 is a high-entropy carbide ceramic with a (Zr-Ta-W-Ti)C-SiC-based carbon-containing reinforcement, and the material of the filling layer 3 is a thermal insulation aerogel (i.e., the lightweight low-thermal-conductivity material filled between the pores of the open topological configuration particles 2 is a thermal insulation aerogel); the density of the thermal insulation aerogel filling layer is 300 kg / m 3 , the specific heat is 559.0 J / kg·°C, and the isotropic thermal conductivity is 0.00016×T + 0.05 W / m·°C (T is the temperature, in °C).

[0092] In this embodiment, the cooling requirement is 500 °C, that is, the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model needs to be greater than or equal to 500 °C.

[0093] Steps two to seven are exactly the same as steps two to seven in Embodiment 2.

[0094] Step eight, determine the thickness of the filling layer:

[0095] Based on the calculation results in step seven, calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model, that is, subtract the maximum temperature on the surface of the lower shell plate from the temperature on the surface of the upper shell plate, which is 1300 °C set in step five. The specific results are as Figure 5 shown. It can be seen from Figure 5 that as the thickness of the filling layer 3 increases, the heat insulation effect gradually increases. Combining the cooling requirement of 500 °C, in this embodiment, the overall thickness of the finally designed modular ceramic matrix composite heat insulation tile should be not less than 20 mm, that is, the thicknesses of the upper shell plate 101, the lower shell plate 102 and the boundary layer plate 103 are 2 mm, and the thickness of the filling layer 3 should be not less than 16 mm.

[0096] Comparative Example 1:

[0097] This comparative example presents a modular ceramic matrix composite heat insulation tile, which is different from Embodiment 3 in that: cross-shaped particles (the structure is as Figure 7 shown) are used to replace the open topological configuration particles 2 in Embodiment 3, and the filling layer 3 is not provided; the overall thickness of the modular ceramic matrix composite heat insulation tile is 8 mm; the thickness of the cross-shaped particles is 1 mm, and the cross-shaped particle lattice structure (the structure is as Figure 6The porosity is 76.6% (as shown).

[0098] Finite element simulation was used to analyze the heat insulation performance of the modular ceramic matrix composite heat insulation tile. The calculated maximum temperature on the surface of the lower layer of the outer shell was 1023.3 °C, the minimum temperature was 990.3 °C, the average temperature was 1006 °C, and the temperature difference between the upper and lower surfaces was 276.7 °C.

[0099] Effect comparison between Example 2 and Example 3:

[0100] It can be seen from Figure 5 that under the same thickness, the heat insulation effect of the heat insulation aerogel filling layer in Example 3 is better than that of the alumina fiber filling layer in Example 2. The initial weight of the alumina fiber filling layer in Example 2 was 2.88 g, and the initial total weight of a single-piece modular heat insulation structure was 223.47 g. The initial weight of the heat insulation aerogel filling layer in Example 3 was 11.59 g, and the initial total weight of a single-piece modular heat insulation structure was 232.18 g. Under the same size, the weight of the heat insulation tile with the alumina fiber filling layer was less than that of the heat insulation tile with the heat insulation aerogel filling layer. Thus, it can be seen that when determining the applicable filling layer structure design in Step 8, the weight requirements of the thermal protection structure should also be comprehensively considered to meet the lightweight design of the thermal protection structure.

[0101] Effect comparison between Example 3 and Comparative Example 1:

[0102] Example 3 and Comparative Example 1 had the same sandwich thickness, but the difference was that the structure of the particles in the sandwich was different and there was no filling layer; when the overall thickness was 8 mm, the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model in Example 3 was 401.2 °C, while the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model in Comparative Example 1 was 276.7 °C. Thus, it can be seen that under the same thickness, the heat insulation effect of the heat insulation tile designed by the present invention with the open topological configuration particles 2 and the filling layer 3 is better.

Claims

1. A modular ceramic matrix composite heat insulation tile, comprising a ceramic matrix outer shell (1), characterized in that: The described ceramic matrix outer shell (1) is a hollow regular hexagonal prism - shaped shell; Inside the described ceramic matrix outer shell (1), there are multiple closely arranged hollow topological configuration particles (2) which form a lattice - structured particle layer (4). The material of the hollow topological configuration particles (2) is the same as that of the ceramic matrix outer shell (1); Between the gaps of adjacent hollow topological configuration particles (2) and in the cavities inside the hollow topological configuration particles (2), a lightweight low - thermal - conductivity material is filled. The filled lightweight low - thermal - conductivity materials together form a filling layer (3); The described lightweight low - thermal - conductivity material is selected from one of alumina fiber and thermal insulation aerogel or a mixture of the two in any proportion.

2. The modular ceramic matrix composite heat insulation tile according to claim 1, characterized in that, The described hollow topological configuration particle (2) is composed of six hollow topological configuration particle first unit blocks (201) and twelve hollow topological configuration particle second unit blocks (202); The main body of the described hollow topological configuration particle first unit block (201) is a block with a regular octagonal prism structure. Along the axial direction in the middle of the main body of the hollow topological configuration particle first unit block (201), there is a first hole (203), and the first hole (203) is a rectangular structure; The described hollow topological configuration particle second unit block (202) is a block with a cuboid structure; Four sides of the described hollow topological configuration particle first unit block (201) are connected to the hollow topological configuration particle second unit block (202). The four sides are not adjacent to each other pairwise, and each side is respectively connected to a hollow topological configuration particle second unit block (202). The space enclosed by three hollow topological configuration particle first unit blocks (201) and three hollow topological configuration particle second unit blocks (202) is a second hole (204), and the second hole (204) is a hole with a regular hexagonal structure.

3. The modular ceramic matrix composite heat insulation tile according to claim 1, characterized in that, The side length of the described ceramic matrix outer shell (1) is 100 mm, and the wall thickness of the ceramic matrix outer shell (1) is 2 mm.

4. The modular ceramic matrix composite thermal insulation tile according to claim 1, wherein, The particle size of the described hollow topological configuration particle (2) is 8 mm - 26 mm, and the thickness of the filling layer (3) is 8 mm - 26 mm. The particle size of the described hollow topological configuration particle (2) is equal to the thickness of the filling layer (3).

5. The modular ceramic matrix composite heat insulation tile according to claim 1, wherein The porosity of the described lattice - structured particle layer (4) is 78.4%.

6. The modular ceramic matrix composite heat insulation tile according to claim 1, characterized in that It is applicable to ultra - high temperature environments of 1500 °C or higher.

7. A design method for a modular ceramic matrix composite thermal insulation tile according to any one of claims 1 to 6, characterized in that, This method uses finite - element simulation to calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite insulation tile model, and uses it as the basis for optimizing the structural parameters of the modular ceramic matrix composite insulation tile.

8. The design method of the modular ceramic matrix composite thermal insulation tile according to claim 7, characterized in that, This method specifically includes the following steps: Step 1, determine the structural parameters and materials: The described structural parameters include: the side length of the ceramic matrix outer shell (1), the wall thickness of the ceramic matrix outer shell (1), the particle size of the hollow topological configuration particle (2), the thickness of the filling layer (3), and the porosity of the lattice - structured particle layer (4); Step 2, establish a geometric model: Build the geometric model of the ceramic matrix outer shell (1) and the geometric model of a single hollow topological configuration particle (2) in the modeling software. Arrange several hollow topological configuration particles (2) closely to form a lattice structure particle layer (4). Fill the gaps between adjacent hollow topological configuration particles (2) and the cavities inside the hollow topological configuration particles (2) with the geometric model of a lightweight and low thermal conductivity material to obtain the geometric model of the filling layer (3). Combine the geometric models of the ceramic matrix outer shell (1), the lattice structure particle layer (4), and the filling layer (3) to obtain the modular ceramic matrix composite heat insulation tile model; Step 3, parameter optimization design: Based on the geometric model of the modular ceramic matrix composite heat insulation tile established in Step 2, in the modeling software, combine the structural parameters in Step 1 and set the optimization range of the input parameters; Step 4, perform solid mesh division: In the finite element software, perform tetrahedral mesh division on each component of the model; when dividing, insert a mesh encryption option in the mesh settings, select the encryption surfaces as the hollow topological configuration particles (2) and the lightweight and low thermal conductivity material, and perform mesh update; Step 5, set boundary conditions: In the finite element software, apply a temperature boundary to the upper surface of the ceramic matrix outer shell (1) and set a thermal radiation condition on the lower surface of the ceramic matrix outer shell (1); Step 6, determine parameter variables and calculation scale: In the finite element software, set the output parameters as: the maximum temperature on the lower surface of the ceramic matrix outer shell (1), the minimum temperature on the lower surface of the ceramic matrix outer shell (1), and the average temperature on the lower surface of the ceramic matrix outer shell (1); based on the size limitations of the usage scenario and according to the optimization range of the input parameters in Step 3, perform a calculation every 1 mm; Step 7, calculate the heat insulation performance: In the finite element software, calculate and obtain the maximum temperature on the lower surface of the ceramic matrix outer shell (1), the minimum temperature on the lower surface of the ceramic matrix outer shell (1), and the average temperature on the lower surface of the ceramic matrix outer shell (1); Step 8, determine the thickness of the filling layer: Based on the calculation results in Step 7, calculate the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model, that is, subtract the maximum temperature on the lower surface of the ceramic matrix outer shell (1) from the temperature on the upper surface of the ceramic matrix outer shell (1); according to the temperature difference between the upper and lower surfaces of the modular ceramic matrix composite heat insulation tile model, finally determine the thickness of the filling layer (3).

9. The design method of the modular ceramic matrix composite thermal insulation tile according to claim 8, characterized in that, In Step 4, when performing mesh encryption, the encryption value is set to 3.

10. The design method of the modular ceramic matrix composite thermal insulation tile according to claim 8, characterized in that, In Step 5, the temperature boundary applied to the upper surface of the ceramic matrix outer shell (1) is 1300 °C; the thermal radiation condition set on the lower surface of the ceramic matrix outer shell (1) is: the emissivity is 0.8 and the radiation temperature is 22 °C.

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