Method for preparing nano copper oxide on copper surface

Abstract

The invention relates to the technical field of material surface treatment, in particular to a method for preparing nano copper oxide on a copper surface, which comprises the following steps: S1, solution preparation: dissolving sodium hydroxide in purified water at 100 DEG C by using a container to prepare a sodium hydroxide solution with the mass fraction of 9-15%; s2, copper part treatment: completely immersing the copper part in a sodium hydroxide solution, then heating until the solution is boiled, keeping the boiling state for 5-10 minutes, sealing a container filled with the copper part and the sodium hydroxide solution, and cooling for 1-3 days; and S3, heating and fumigating are conducted, specifically, the copper parts are taken out of the sodium hydroxide solution, sequentially placed on an isolation frame to be hung and then placed in a steam box to be heated and fumigated, and the fumigating time is 30-60 minutes.

Description

Technical Field

[0001] The present invention relates to the technical field of material surface treatment, and specifically to a method for preparing nano-copper oxide on the surface of copper. Background Art

[0002] Due to its unique physical and chemical properties, such as small size effect, surface effect, etc., nano-copper oxide exhibits excellent performance in many fields such as catalysis, sensors, and batteries. Preparing nano-copper oxide on the surface of pure copper materials can endow the pure copper materials with new characteristics and broaden their application scope. However, the existing methods for preparing nano-copper oxide on the surface of copper have problems such as complex processes, high costs, demanding equipment requirements, and unstable quality of the prepared nano-copper oxide. Therefore, it is of great practical significance to develop a simple, efficient, low-cost method that can stably prepare high-quality nano-copper oxide. Summary of the Invention

[0003] The purpose of the present invention is to provide a method for preparing nano-copper oxide on the surface of copper.

[0004] A method for preparing nano-copper oxide on the surface of copper includes the following steps: S1. Solution preparation: Dissolve sodium hydroxide in pure water at 100 °C using a container to prepare a sodium hydroxide solution with a mass fraction of 9% - 15%. S2. Copper part treatment: Completely immerse the copper part in the sodium hydroxide solution, then heat it to the boiling point of the solution and keep it boiling for 5 - 10 minutes. Seal the container containing the copper part and the sodium hydroxide solution and perform a cooling treatment for 1 - 3 days. S3. Heating and fumigation: Take out the copper part from the sodium hydroxide solution, hang it on an isolation rack in sequence, and then put it into a steaming box for heating and fumigation. The fumigation time is 30 - 60 minutes.

[0005] Further, in the step S1, the container is a ceramic container or a stainless steel container.

[0006] Further, in the step S2, the copper part includes but is not limited to copper plates, copper meshes, and copper wires.

[0007] In summary, the present invention has the following beneficial effects: The preparation method of the present invention is simple and convenient, does not require complex equipment and cumbersome operation processes, and is easy for industrial production. The raw materials are widely sourced and inexpensive, and the cost of the preparation equipment used is low. There is no need for expensive special equipment, which greatly reduces the production cost. By precisely controlling the reaction conditions of each step, the present invention can stably form uniform and high-quality nano-copper oxide on the surface of the copper part, meeting the requirements for the quality of nano-copper oxide in different application scenarios. Detailed Embodiments

[0008] To make the objectives, technical solutions and advantages of the embodiments of the present invention clearer, the technical solutions in the embodiments of the present invention will be clearly and completely described below in conjunction with the embodiments of the present invention. Apparently, the described embodiments are some, but not all, of the embodiments of the present invention. All other embodiments obtained by those of ordinary skill in the art based on the embodiments of the present invention without creative efforts shall fall within the protection scope of the present invention.

[0009] A method for preparing nano-copper oxide on the surface of copper, comprising the following steps: S1. Solution preparation: Dissolve sodium hydroxide in pure water at 100 °C using a container to prepare a sodium hydroxide solution with a mass fraction of 9% - 15%.

[0010] In this embodiment, preferably, the container is a ceramic container or a stainless-steel container. The containers made of ceramic and stainless-steel materials have stable chemical properties and will not react chemically with sodium hydroxide during the solution preparation process, ensuring the purity and stable properties of the sodium hydroxide solution and facilitating the subsequent reaction. Using pure water at 100 °C can accelerate the dissolution of sodium hydroxide and improve the preparation efficiency.

[0011] S2. Copper part treatment: Completely immerse copper parts such as copper plates, copper meshes, and copper wires in the sodium hydroxide solution, then heat to the boiling point of the solution and maintain the boiling state for 5 - 10 minutes. Seal the container containing the copper parts and the sodium hydroxide solution and perform a cooling treatment for 1 - 3 days.

[0012] In this embodiment, preferably, the copper parts are made of pure copper. During the copper part treatment process, a preliminary reaction occurs between the sodium hydroxide solution and the surface of the copper parts, laying the foundation for the subsequent formation of nano-copper oxide. Controlling the heating and boiling time within 5 - 10 minutes can not only ensure the full progress of the reaction but also prevent damage to the matrix of the copper parts due to excessive reaction. Sealed cooling can make the temperature of the reaction system drop slowly and evenly, enabling the preliminary reaction products to be more evenly distributed on the surface of the copper parts and creating conditions for the subsequent formation of a uniform nano-copper oxide layer.

[0013] S3. Heating and fumigation: Take out the copper parts from the sodium hydroxide solution, hang them on the isolation rack in sequence, and then place them in a steaming box for heating and fumigation for 30 - 60 minutes.

[0014] In this embodiment, in the high-temperature environment of the steaming box, on the one hand, the hydrogen released by the reaction of sodium hydroxide and copper helps to further reduce and adjust the chemical environment on the surface of the copper parts; on the other hand, the high-temperature heat gradually opens the atomic structure on the surface layer of the copper, enhancing the activity of copper atoms, causing the oxides to start moving on the surface and gradually aggregate, thereby gradually forming black nano-copper oxide on the surface of the copper parts. Strictly controlling the fumigation time can ensure the full formation and stable quality of the nano-copper oxide layer on the surface of the copper parts. Example 1

[0015] A method for preparing nano - copper oxide on the surface of copper, comprising the following steps: S1. Solution preparation: Dissolve 100 grams of sodium hydroxide in 900 grams of pure water at 100 °C using a ceramic container to prepare a sodium hydroxide solution with a mass fraction of 10%; S2. Copper part treatment: Immerse the copper mesh completely in the sodium hydroxide solution, then heat it to the boiling point of the solution and keep it boiling for 5 minutes. Seal the ceramic container containing the copper mesh and the sodium hydroxide solution and conduct a cooling treatment for 2 days; S3. Heating and fumigation: Take out the copper mesh from the sodium hydroxide solution, hang it on the isolation rack in sequence, and then put it into a steaming box for heating and fumigation for 45 minutes.

[0016] After detection, uniform black nano - copper oxide has been successfully formed on the surface of the copper mesh. The nano - copper oxide particles are of uniform size, and the average particle size is between 50 - 80 nanometers. Example 2

[0017] A method for preparing nano - copper oxide on the surface of copper, comprising the following steps: S1. Solution preparation: Dissolve 150 grams of sodium hydroxide in 850 grams of pure water at 100 °C using a stainless - steel container to prepare a sodium hydroxide solution with a mass fraction of 15%; S2. Copper part treatment: Immerse the copper plate completely in the sodium hydroxide solution, then heat it to the boiling point of the solution and keep it boiling for 10 minutes. Seal the stainless - steel container containing the copper plate and the sodium hydroxide solution and conduct a cooling treatment for 1 day; S3. Heating and fumigation: Take out the copper plate from the sodium hydroxide solution, hang it on the isolation rack in sequence, and then put it into a steaming box for heating and fumigation for 60 minutes.

[0018] After detection, the thickness of the nano - copper oxide layer formed on the surface of the copper plate is uniform, with good performance, and shows high activity in the catalytic reaction test. Example 3

[0019] A method for preparing nano - copper oxide on the surface of copper, comprising the following steps: S1. Solution preparation: Dissolve 90 grams of sodium hydroxide in 910 grams of pure water at 100 °C using a ceramic container to prepare a sodium hydroxide solution with a mass fraction of 9%; S2. Copper part treatment: Immerse the copper wire completely in the sodium hydroxide solution, then heat it to the boiling point of the solution and keep it boiling for 7 minutes. Seal the ceramic container containing the copper wire and the sodium hydroxide solution and conduct a cooling treatment for 3 days; S3. Heating and fumigation: Take out the copper wire from the sodium hydroxide solution, hang it on the isolation rack in sequence, and then put it into the steamer for heating and fumigation for 30 minutes.

[0020] After inspection, the nano-copper oxide formed on the surface of the copper wire has strong adhesion and shows good performance in the simulation test of electronic device applications.

[0021] It is only used to illustrate the technical solution of the present invention, rather than limiting it; although the present invention has been described in detail with reference to the foregoing embodiments, for those of ordinary skill in the art, it is still possible to modify the technical solutions described in the foregoing embodiments, or perform equivalent replacements on some of the technical features; and these modifications or replacements do not make the essence of the corresponding technical solutions deviate from the spirit and scope of the technical solutions required to be protected by the present invention.

Claims

1. A method for preparing nano-cupric oxide on the surface of copper, characterized in that, It includes the following steps: S1. Solution preparation: Dissolve sodium hydroxide in pure water at 100 °C using a container to prepare a sodium hydroxide solution with a mass fraction of 9% - 15%. S2. Copper part treatment: Completely immerse the copper part in the sodium hydroxide solution, then heat it until the solution boils and maintain the boiling state for 5 - 10 minutes. Seal the container containing the copper part and the sodium hydroxide solution and conduct a cooling treatment for 1 - 3 days. S3. Heating and fumigation: Take out the copper part from the sodium hydroxide solution, hang it on the isolation rack in sequence, and then put it into the steamer for heating and fumigation. The fumigation time is 30 - 60 minutes.

2. The method for preparing nano-copper oxide on the copper surface according to claim 1, characterized in that, In the step S1, the container is a ceramic container or a stainless steel container.

3. A method for preparing nano-cupric oxide on the copper surface according to claim 1, characterized in that, In the step S2, the copper part includes but is not limited to copper plates, copper meshes, and copper wires.