Multi-modal defect detection method, system, medium and equipment for GIS (Geographic Information System) component

Abstract

The invention relates to the technical field of defect detection of GIS components, and discloses a defect multi-mode detection method, system, medium and equipment of a GIS component, and the method comprises the following steps: scanning a to-be-detected GIS component by using a terahertz laser signal, receiving a laser signal reflected by the GIS component, and determining the defect of the to-be-detected GIS component according to the received laser signal; the surface defect detection of the GIS component is realized by comparing the original terahertz laser signal with the reflected laser signal; the terahertz laser signals generate ultrasonic waves on the surface of the GIS assembly under the elastic-optical effect, ultrasonic echoes are reflected at the positions, with defects, of the slightly deep layer of the GIS assembly, and slightly deep layer defect detection of the GIS assembly is achieved by comparing the original terahertz laser signals with the ultrasonic echoes; an ultrasonic signal is used for scanning the GIS assembly, the ultrasonic signal reflected by the GIS assembly is received, and deep defect detection of the GIS assembly is achieved by comparing the original ultrasonic signal with the reflected ultrasonic signal. According to the invention, the detection efficiency, precision and sensitivity can be improved while the detection depth is ensured.

Description

Technical Field

[0001] The present invention relates to the technical field of defect detection of GIS components, and in particular to a multi-modal defect detection method, system, medium and device for GIS components. Background Art

[0002] Gas-Insulated Switchgear (GIS) is composed of components such as insulators, circuit breakers, disconnectors, earthing switches, current transformers, voltage transformers, and metal enclosures. Compared with conventional open substations, GIS has the advantages of compact structure, small floor area, high reliability, flexible configuration, convenient installation, strong safety, strong environmental adaptability, and small maintenance workload. Therefore, GIS is widely used not only in high-voltage and extra-high-voltage fields but also in ultra-high-voltage fields.

[0003] During the manufacturing, installation, use, etc. of GIS, defects in GIS components are inevitable. In order to ensure the normal operation of GIS, non-destructive detection and targeted maintenance of GIS defects are required. Existing non-destructive detection methods include ultrasonic detection, pulsed current detection, X-ray detection, infrared thermal imaging detection, ultra-high frequency detection, etc. Although these methods can achieve defect detection of GIS, they are usually used alone. A single detection method not only has low efficiency but also has problems of low detection depth, accuracy, and sensitivity when detecting GIS defects. Summary of the Invention

[0004] Therefore, the technical problem to be solved by the present invention is to overcome the deficiencies in the prior art and provide a multi-modal defect detection method, system, medium and device for GIS components, which can improve the detection efficiency, accuracy, and sensitivity while ensuring the detection depth.

[0005] To solve the above technical problems, the present invention provides a multi-modal defect detection method for GIS components, including:

[0006] Scanning the GIS component to be detected with a terahertz laser signal, receiving the laser signal reflected by the GIS component, and realizing the surface defect detection of the GIS component by comparing the original terahertz laser signal and the reflected laser signal;

[0007] The terahertz laser signal generates ultrasonic waves on the surface of the GIS component due to the photoelastic effect. The generated ultrasonic waves reflect ultrasonic echoes at the parts with defects in the slightly deeper layer of the GIS component. The slightly deeper layer defect detection of the GIS component is realized by comparing the original terahertz laser signal and the ultrasonic echoes.

[0008] Scanning the GIS component using ultrasonic signals, receiving the ultrasonic signals reflected by the GIS component, and realizing the deep defect detection of the GIS component by comparing the original ultrasonic signals and the reflected ultrasonic signals.

[0009] Furthermore, the surface defect detection of the GIS component is realized by comparing the original terahertz laser signal and the reflected laser signal, specifically as follows:

[0010] Calculating the surface defect displacement through the laser interference formula:

[0011] Δφ = 4πnd / λ,

[0012] where Δφ represents the surface defect displacement, n represents the refractive index, d represents the deformation amount, and λ represents the wavelength of the laser signal;

[0013] Obtaining the position where the surface defect is located according to the surface defect displacement.

[0014] Furthermore, the terahertz laser signal generates ultrasonic waves on the surface of the GIS component due to the elasto-optic effect, and the generated ultrasonic waves reflect ultrasonic echoes at the part with defects in the slightly deeper layer of the GIS component. The slightly deeper defect detection of the GIS component is realized by comparing the original terahertz laser signal and the ultrasonic echoes, specifically as follows:

[0015] The terahertz laser signal generates thermoacoustic signals on the surface of the GIS component due to the elasto-optic effect. The thermoacoustic signals reflect acoustic pressure signals at the part with defects in the slightly deeper layer of the GIS component. A relational expression between time and the acoustic pressure signal is constructed by combining the material properties of the GIS component to be detected;

[0016] The timing matching of the original terahertz laser signal and the acoustic pressure signal is realized through synchronous triggering. A relational expression between the acoustic pressure signal, ultrasonic displacement, and time is established through the photoacoustic coupling equation. The ultrasonic displacement is obtained by combining the received acoustic pressure signal, the relational expression between time and the acoustic pressure signal, and the position where the slightly deeper defect is located is obtained according to the ultrasonic displacement.

[0017] Furthermore, the relational expression between the acoustic pressure signal, ultrasonic displacement, and time is specifically as follows:

[0018]

[0019] where p(x, t) represents the acoustic pressure signal, where β represents the coefficient of thermal expansion, μ a represents the optical absorption coefficient, F0 represents the terahertz laser energy density, δ represents the coupling coefficient, t represents time, x represents the ultrasonic displacement, and c represents the sound velocity.

[0020] The present invention also provides a multi-modal defect detection system for GIS components, including a detector, an ultrasonic transducer, a femtosecond pulsed laser, and a detection and calculation module. The detector and the ultrasonic transducer are arranged on the GIS component to be detected;

[0021] The femtosecond pulsed laser generates terahertz laser signals, and the terahertz laser signals scan the GIS component. The detector receives the laser signals reflected by the GIS component and transmits them to the detection and calculation module;

[0022] Due to the elasto-optic effect, the terahertz laser signals generate ultrasonic waves on the surface of the GIS component. The generated ultrasonic waves reflect ultrasonic echoes at the positions with defects in the slightly deeper layer of the GIS component. The ultrasonic transducer receives the ultrasonic echoes and transmits them to the detection and calculation module;

[0023] The ultrasonic transducer generates ultrasonic signals, and the ultrasonic signals scan the GIS component. The ultrasonic transducer receives the ultrasonic signals reflected by the GIS component and transmits them to the detection and calculation module;

[0024] The detection and calculation module realizes the surface defect detection of the GIS component by comparing the original terahertz laser signals and the reflected laser signals, realizes the slightly deeper layer defect detection of the GIS component by comparing the original terahertz laser signals and the ultrasonic echoes, and realizes the deep layer defect detection of the GIS component by comparing the original ultrasonic signals and the reflected ultrasonic signals.

[0025] Furthermore, it further includes a control module, and the control module is connected to the detector, the ultrasonic transducer, and the femtosecond pulsed laser;

[0026] The control module controls the femtosecond pulsed laser to generate terahertz laser signals, controls the detector to receive the laser signals reflected by the GIS component and transmit them to the detection and calculation module, and controls the ultrasonic transducer to receive the ultrasonic echoes and transmit them to the detection and calculation module.

[0027] Furthermore, it further includes a two-dimensional scanning circuit, and the two-dimensional scanning circuit is connected to the femtosecond pulsed laser to control the terahertz laser signals generated by the femtosecond pulsed laser to scan the GIS component evenly.

[0028] Furthermore, it further includes a weak signal processing module and an excitation module,

[0029] The weak signal processing module is connected to the detector and the ultrasonic transducer. The weak signal processing module processes the reflected laser signals received by the detector and the ultrasonic echoes received by the ultrasonic transducer and then transmits them to the detection and calculation module;

[0030] The excitation module includes an ultrasonic excitation circuit and a power amplification circuit. The excitation module excites terahertz laser signals for surface defect detection, generates ultrasonic waves for slightly deeper defect detection, and excites ultrasonic signals for deep defect detection.

[0031] The present invention also provides a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, the multi-modal defect detection method of the GIS component described above is implemented.

[0032] The present invention also provides a multi-modal defect detection device for GIS components, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, the multi-modal defect detection method of the GIS component described above is implemented.

[0033] The above technical solution of the present invention has the following beneficial effects compared with the prior art:

[0034] The present invention simultaneously realizes three-modal detections of laser reflection detection, laser and ultrasonic echo detection, and ultrasonic reflection detection through the coupling of terahertz laser and ultrasound, and can simultaneously detect defects at different depths of the GIS component, achieving higher detection efficiency, accuracy, and sensitivity. BRIEF DESCRIPTION OF THE DRAWINGS

[0035] In order to make the content of the present invention easier to be clearly understood, the following further details the present invention according to specific embodiments of the present invention in conjunction with the drawings, wherein:

[0036] Figure 1 It is a flowchart of the method in the preferred embodiment of the present invention.

[0037] Figure 2 It is a schematic structural diagram of the system in the preferred embodiment of the present invention.

[0038] Explanation of the reference numerals in the specification drawings: 1, detector; 2, ultrasonic transducer; 3, GIS component. DETAILED DESCRIPTION OF THE EMBODIMENTS

[0039] The following further illustrates the present invention in conjunction with the drawings and specific embodiments, so that those skilled in the art can better understand the present invention and be able to implement it, but the embodiments cited are not intended to limit the present invention.

[0040] Referring to Figure 1 As shown, the present invention discloses a multi-modal defect detection method for GIS components, including the following steps:

[0041] S1: Uniformly scan the GIS component to be detected using terahertz laser signals.

[0042] S2: Receive the laser signal reflected by the GIS component, and detect the surface defects of the GIS component by comparing the original terahertz laser signal and the reflected laser signal.

[0043] The terahertz laser signal generates ultrasonic waves on the surface of the GIS component due to the elasto-optic effect. The generated ultrasonic waves reflect ultrasonic echoes at the defective parts in the slightly deeper layer of the GIS component. Detect the slightly deeper defects of the GIS component by comparing the original terahertz laser signal and the ultrasonic echoes.

[0044] Use ultrasonic signals to scan the GIS component, receive the ultrasonic signals reflected by the GIS component, and detect the deep defects of the GIS component by comparing the original ultrasonic signals and the reflected ultrasonic signals.

[0045] Receive the laser signal reflected by the GIS component, and detect the surface defects of the GIS component by comparing the original terahertz laser signal and the reflected laser signal. Specifically:

[0046] Calculate the surface defect displacement through the laser interference formula of the femtosecond pulsed laser:

[0047] Δφ = 4πnd / λ,

[0048] where Δφ represents the surface defect displacement, n represents the refractive index, d represents the deformation amount, and λ represents the wavelength of the laser signal. Obtain the position where the surface defect is located according to the surface defect displacement.

[0049] The terahertz laser signal generates ultrasonic waves on the surface of the GIS component due to the elasto-optic effect. The generated ultrasonic waves reflect ultrasonic echoes at the defective parts in the slightly deeper layer of the GIS component. Detect the slightly deeper defects of the GIS component by comparing the original terahertz laser signal and the ultrasonic echoes. Specifically:

[0050] First step, the terahertz laser signal generates a thermoacoustic signal (i.e., ultrasonic wave) on the surface of the GIS component due to the elasto-optic effect. The thermoacoustic signal reflects an acoustic pressure signal (i.e., ultrasonic echo) at the defective parts in the slightly deeper layer of the GIS component. Combine the material properties of the GIS component to be detected to construct a relational expression between time and the acoustic pressure signal; in this embodiment, taking the GIS component to be detected as an insulator and the insulator material as epoxy resin as an example, first establish the heat conduction equation inside the epoxy resin material, which is:

[0051]

[0052] In the formula, t represents time, ρ represents the density of the material of the GIS component, c i$c_p$ represents the specific heat of the material of the GIS component, $p(r, z, t)$ represents the acoustic pressure signal in the GIS component at time $t$, $r$ and $z$ represent the radial distance variable and the transverse distance variable respectively, and $k$ represents the thermal conductivity of the material of the GIS component.

[0053] Integrate the heat conduction equation to obtain the relationship $p(t)$ between time and the acoustic pressure signal.

[0054] In the second step, achieve the timing matching of the original terahertz laser signal and the acoustic pressure signal through synchronous triggering, and establish the relationship between the acoustic pressure signal, ultrasonic displacement, and time through the photoacoustic coupling equation. The photoacoustic coupling equation is obtained from the propagation characteristics of terahertz laser-induced ultrasound. The relationship between the acoustic pressure signal, ultrasonic displacement, and time is specifically:

[0055]

[0056] where $p(x, t)$ represents the acoustic pressure signal, $\beta$ represents the coefficient of thermal expansion, $\mu$ a represents the optical absorption coefficient, $F_0$ represents the terahertz laser energy density, $\delta$ represents the coupling coefficient, $t$ represents time, $x$ represents the ultrasonic displacement, and $c$ represents the speed of sound.

[0057] In the third step, combine the received acoustic pressure signal and the relationship between time and the acoustic pressure signal to obtain the ultrasonic displacement, and determine the location of the slightly deeper defect based on the ultrasonic displacement. Substitute the relationship $p(t)$ between time and the acoustic pressure signal into $p(x, t)$ to obtain the relationship $p(x)$ between the acoustic pressure signal and the ultrasonic displacement, and calculate the ultrasonic displacement $x$ by combining the received acoustic pressure signal (i.e., the ultrasonic echo). The ultrasonic displacement $x$ points to the location of the slightly deeper defect.

[0058] When using an ultrasonic transducer to generate an ultrasonic signal to scan the GIS component, receive the ultrasonic signal reflected by the GIS component, and detect the deep defect of the GIS component by comparing the original ultrasonic signal and the reflected ultrasonic signal, the method is the same as the method for detecting the slightly deeper defect of the GIS component by comparing the original terahertz laser signal and the ultrasonic echo. The difference is that the timing matching of the original ultrasonic signal and the acoustic pressure signal obtained by reflection is achieved through synchronous triggering, and then the relationship between the acoustic pressure signal, ultrasonic displacement, and time is established.

[0059] The depth division between the slightly deeper layer and the deep layer is determined according to the size of the actual GIS component. The surface defect detection, slightly deeper defect detection, and deep defect detection are carried out simultaneously.

[0060] The present invention also discloses a multi-modal defect detection system for a GIS component, including a detector, an ultrasonic transducer, a femtosecond pulse laser, and a detection and calculation module. The detector and the ultrasonic transducer are arranged on the GIS component to be detected.

[0061] The femtosecond pulse laser generates a terahertz laser signal that directly irradiates the GIS component to be detected. The terahertz laser signal scans the GIS component, and the detector receives the laser signal reflected by the GIS component and transmits it to the detection and calculation module.

[0062] Due to the elasto-optic effect, the terahertz laser signal generates ultrasonic waves on the surface of the GIS component. The generated ultrasonic waves reflect ultrasonic echoes at the defective parts in the slightly deeper layer of the GIS component. The ultrasonic transducer receives the ultrasonic echoes and transmits them to the detection and calculation module.

[0063] The ultrasonic transducer generates an ultrasonic signal that scans the GIS component. The ultrasonic transducer receives the ultrasonic signal reflected by the GIS component and transmits it to the detection and calculation module.

[0064] The detection and calculation module realizes the surface defect detection of the GIS component by comparing the original terahertz laser signal and the reflected laser signal, realizes the slightly deeper layer defect detection of the GIS component by comparing the original terahertz laser signal and the ultrasonic echo, and realizes the deep layer defect detection of the GIS component by comparing the original ultrasonic signal and the reflected ultrasonic signal. In this embodiment, the detection and calculation module can be a host computer, and the host computer realizes the detection calculation of defects at each depth and displays them.

[0065] In this embodiment, the multi-modal defect detection system of the GIS component further includes a control module, which is connected to the detector, the ultrasonic transducer, and the femtosecond pulse laser. The control module controls the femtosecond pulse laser to generate a terahertz laser signal, controls the detector to receive the laser signal reflected by the GIS component and transmit it to the detection and calculation module, and controls the ultrasonic transducer to receive the ultrasonic echo and transmit it to the detection and calculation module.

[0066] In this embodiment, the multi-modal defect detection system of the GIS component further includes a two-dimensional scanning circuit, which is connected to the femtosecond pulse laser. Under the control of the control module, it controls the terahertz laser signal generated by the femtosecond pulse laser to scan the GIS component evenly, realizing the two-dimensional scanning detection method.

[0067] In this embodiment, the multi-modal defect detection system of the GIS component further includes a weak signal processing module and an excitation module. The weak signal processing module is connected to the detector and the ultrasonic transducer. The weak signal processing module processes the reflected laser signal received by the detector and the ultrasonic echo received by the ultrasonic transducer and then transmits them to the detection and calculation module; the signal processing of the weak signal processing module includes operations such as amplification and noise filtering of the weak signal.

[0068] The excitation module includes an ultrasonic excitation circuit and a power amplification circuit. The excitation module excites the terahertz laser signal generated by the femtosecond pulse laser for surface defect detection, excites the ultrasonic wave generated by the acousto-optic effect of the terahertz laser signal on the surface of the GIS component for slightly deeper defect detection, and excites the ultrasonic signal generated by the ultrasonic transducer for deep defect detection.

[0069] The present invention also discloses a computer-readable storage medium, on which a computer program is stored. When the computer program is executed by a processor, it implements the method for multi-modal detection of defects in GIS components.

[0070] The present invention also discloses a device, including a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, it implements the method for multi-modal detection of defects in GIS components.

[0071] The present invention is a method for multi-modal detection of defects in GIS components. By coupling terahertz laser and ultrasound, it simultaneously realizes three-modal detections: laser reflection detection, laser and ultrasound echo detection, and ultrasound reflection detection, and can detect defects at different depths of GIS components, achieving higher detection efficiency, accuracy, and sensitivity.

[0072] The present invention can be applied to the defect detection of metal components such as insulators and metal shells in GIS components, as well as other components containing metal and non-metal parts. The present invention can not only detect crack defects, bubble defects, and metal impurity defects, but also has the feasibility of detecting other possible defects in GIS components, and has broad application prospects and potential application values.

[0073] Those skilled in the art should understand that the embodiments of the present application can be provided as a method, a system, or a computer program product. Therefore, the present application can adopt the form of a complete hardware embodiment, a complete software embodiment, or an embodiment combining software and hardware aspects. Moreover, the present application can adopt the form of a computer program product implemented on one or more computer-usable storage media (including but not limited to disk storage, CD-ROM, optical storage, etc.) containing computer-usable program code.

[0074] This application is described with reference to the flowcharts and / or block diagrams of methods, apparatuses (systems), and computer program products according to embodiments of the present application. It should be understood that each flow and / or block in the flowchart and / or block diagram, and the combination of flows and / or blocks in the flowchart and / or block diagram, can be implemented by computer program instructions. These computer program instructions can be provided to the processor of a general-purpose computer, special-purpose computer, embedded processor, or other programmable data processing device to generate a machine, such that the instructions executed by the processor of the computer or other programmable data processing device produce means for implementing the functions specified in one or more flows and / or blocks Figure 1 in one or more flows and / or blocks Figure 1 in one or more blocks.

[0075] These computer program instructions can also be stored in a computer-readable memory that can direct a computer or other programmable data processing device to work in a specific manner, such that the instructions stored in the computer-readable memory produce a manufactured article including instruction means for implementing the functions specified in one or more flows and / or blocks Figure 1 in one or more flows and / or blocks Figure 1 in one or more blocks.

[0076] These computer program instructions can also be loaded onto a computer or other programmable data processing device, such that a series of operation steps are executed on the computer or other programmable device to generate a computer-implemented process, and thus the instructions executed on the computer or other programmable device provide steps for implementing the functions specified in one or more flows and / or blocks Figure 1 in one or more flows and / or blocks Figure 1 in one or more blocks.

[0077] Obviously, the above embodiments are only examples for clear illustration and are not limitations on the implementation manners. For those of ordinary skill in the art, other different forms of changes or variations can be made based on the above description. It is not necessary and impossible to exhaustively list all implementation manners here. And the obvious changes or variations derived therefrom are still within the protection scope of the present invention.

Claims

1. A multi-modal defect detection method for GIS components, characterized in that Including: Scanning the GIS component to be detected with a terahertz laser signal, receiving the laser signal reflected by the GIS component, and realizing the surface defect detection of the GIS component by comparing the original terahertz laser signal and the reflected laser signal; The terahertz laser signal generates ultrasonic waves on the surface of the GIS component due to the elasto-optic effect. The generated ultrasonic waves are reflected by the ultrasonic echo at the position with defects in the slightly deeper layer of the GIS component. The slightly deeper layer defect detection of the GIS component is realized by comparing the original terahertz laser signal and the ultrasonic echo; Scanning the GIS component with an ultrasonic signal, receiving the ultrasonic signal reflected by the GIS component, and realizing the deep defect detection of the GIS component by comparing the original ultrasonic signal and the reflected ultrasonic signal.

2. The method for defect multi-modal detection of the GIS component according to claim 1, characterized in that: The realization of the surface defect detection of the GIS component by comparing the original terahertz laser signal and the reflected laser signal is specifically: Calculating the surface defect displacement through the laser interference formula: △φ=4πnd / λ, where Δφ represents the surface defect displacement, n represents the refractive index, d represents the deformation amount, and λ represents the wavelength of the laser signal; Obtaining the position where the surface defect is located according to the surface defect displacement.

3. The method for multi-modal detection of defects of the GIS component according to claim 1, characterized in that: The terahertz laser signal generates ultrasonic waves on the surface of the GIS component due to the elasto-optic effect. The generated ultrasonic waves are reflected by the ultrasonic echo at the position with defects in the slightly deeper layer of the GIS component. The slightly deeper layer defect detection of the GIS component is realized by comparing the original terahertz laser signal and the ultrasonic echo, specifically: The terahertz laser signal generates a thermoacoustic signal on the surface of the GIS component due to the elasto-optic effect. The thermoacoustic signal is reflected by the sound pressure signal at the position with defects in the slightly deeper layer of the GIS component. A relational expression between time and the sound pressure signal is constructed by combining the material characteristics of the GIS component to be detected; The timing matching of the original terahertz laser signal and the sound pressure signal is realized through synchronous triggering. A relational expression between the sound pressure signal, ultrasonic displacement, and time is established through the photoacoustic coupling equation. The ultrasonic displacement is obtained by combining the received sound pressure signal and the relational expression between time and the sound pressure signal. The position where the slightly deeper layer defect is located is obtained according to the ultrasonic displacement.

4. The method for multi-modal detection of defects of the GIS component according to claim 3, characterized in that: The relational expression between the sound pressure signal, ultrasonic displacement, and time is specifically: Among them, p(x, t) represents the sound pressure signal, where β represents the coefficient of thermal expansion, μ a represents the optical absorption coefficient, F0 represents the terahertz laser energy density, δ represents the coupling coefficient, t represents time, x represents the ultrasonic displacement, and c represents the sound velocity.

5. A multi-modal defect detection system for GIS components, characterized in that: Including a detector, an ultrasonic transducer, a femtosecond pulsed laser, and a detection and calculation module. The detector and the ultrasonic transducer are arranged on the GIS component to be detected; The femtosecond pulsed laser generates a terahertz laser signal. The terahertz laser signal scans the GIS component. The detector receives the laser signal reflected by the GIS component and transmits it to the detection and calculation module; The terahertz laser signal generates ultrasonic waves on the surface of the GIS component due to the elasto-optic effect. The generated ultrasonic waves are reflected by the ultrasonic echo at the position with defects in the slightly deeper layer of the GIS component. The ultrasonic transducer receives the ultrasonic echo and transmits it to the detection and calculation module; The ultrasonic transducer generates an ultrasonic signal. The ultrasonic signal scans the GIS component. The ultrasonic transducer receives the ultrasonic signal reflected by the GIS component and transmits it to the detection and calculation module; The detection and calculation module realizes the surface defect detection of the GIS component by comparing the original terahertz laser signal and the reflected laser signal, realizes the slightly deeper defect detection of the GIS component by comparing the original terahertz laser signal and the ultrasonic echo, and realizes the deep defect detection of the GIS component by comparing the original ultrasonic signal and the reflected ultrasonic signal.

6. The multi-modal defect detection system for GIS components according to claim 5, characterized in that: It further includes a control module, which is connected to the detector, ultrasonic transducer, and femtosecond pulse laser; The control module controls the femtosecond pulse laser to generate a terahertz laser signal, controls the detector to receive the laser signal reflected by the GIS component and transmits it to the detection and calculation module, and controls the ultrasonic transducer to receive the ultrasonic echo and transmits it to the detection and calculation module.

7. The defect multimodal detection system for GIS components according to claim 5, characterized in that: It further includes a two-dimensional scanning circuit, which is connected to the femtosecond pulse laser and controls the terahertz laser signal generated by the femtosecond pulse laser to uniformly scan the GIS component.

8. The defect multi-modal detection system of the GIS component according to claim 5, characterized in that: It further includes a weak signal processing module and an excitation module. The weak signal processing module is connected to the detector and the ultrasonic transducer. The weak signal processing module processes the reflected laser signal received by the detector and the ultrasonic echo received by the ultrasonic transducer and then transmits them to the detection and calculation module. The excitation module includes an ultrasonic excitation circuit and a power amplification circuit. The excitation module excites the terahertz laser signal for surface defect detection, excites the generated ultrasonic wave for slightly deeper defect detection, and excites the ultrasonic signal for deep defect detection.

9. A computer-readable storage medium having a computer program stored thereon, characterized in that: When the computer program is executed by a processor, it realizes the multi-modal defect detection method of the GIS component according to any one of claims 1-4.

10. A multi-modal detection device for defects of GIS components, characterized in that: It includes a memory, a processor, and a computer program stored on the memory and executable on the processor. When the processor executes the computer program, it realizes the multi-modal defect detection method of the GIS component according to any one of claims 1-4.

Images