Test load board and test system
By dividing the load board into a mother and daughter boards with larger holes and conventional production for daughter boards, the complexity and cost of load board manufacturing are reduced, improving the efficiency and cost-effectiveness of semiconductor testing.
Patent Information
- Application Number
- CN202510290932.2
- Authority / Receiving Office
- CN · China
- Patent Type
- Applications(China)
- Current Assignee / Owner
- Filing Date
- 2025-03-12
- Publication Date
- 2025-07-15
AI Technical Summary
The design and production of existing load plates are difficult, and the cost of making plates is high. Especially under the BGA packaging of small pitches and multi-solder balls, the processing difficulty and cost remain high.
The test load plate is split into a test daughter board and a test mother board. The test daughter board adopts a conventional process to design and produce. The test mother board adopts large aperture vias to reduce the aperture ratio. The test mother board can be shared by multiple test projects.
It reduces the difficulty of design and production of load boards, reduces the cost of board making, and improves the flexibility and versatility of the test system.
Smart Images
Figure CN120314746A_ABST
Abstract
Description
Technical Field
[0001] This application relates to the field of semiconductor testing technology, and particularly to a test load board and a test system. Background Art
[0002] The load board plays a crucial role in the field of semiconductor testing.
[0003] Due to the characteristics of the load board, such as large thickness, high aspect ratio of holes, and low production yield, its production process is different from that of a conventional printed circuit board (PCB). The interconnection between layers generally can only be achieved by mechanical drilling.
[0004] With the continuous development of semiconductor technology, the pitch of chips is getting smaller and the number of solder balls in the ball grid array (BGA) is increasing, which brings great difficulties to the design and production of the load board, and the board manufacturing cost remains high. Summary of the Invention
[0005] This application provides a test load board and a test system, which can effectively reduce the design and production difficulties of the load board and at the same time reduce the board manufacturing cost of the load board.
[0006] In a first aspect, this application provides a test load board, which includes: a test motherboard and at least one test daughter board;
[0007] The test motherboard can be connected to an automatic test equipment (ATE);
[0008] At least one test socket is arranged on the test daughter board, and the test socket is used to connect a device under test to the test daughter board;
[0009] A first component is arranged on the test motherboard, and the first component is used to guide the test resources of the test motherboard to the test daughter board, and the above test resources are used to test the device under test.
[0010] In some embodiments, the diameter of the via holes on the test motherboard is larger than the diameter of the via holes on the test daughter board.
[0011] In some embodiments, the thickness of the test daughter board is less than the thickness of the test motherboard.
[0012] In some embodiments, the first component is any one of the following: a probe tower, a connection plug or a connection cable.
[0013] In some embodiments, the above-mentioned test load board further includes a first fixing component, which is used to fix the test mother board on the ATE.
[0014] In some embodiments, the above-mentioned test load board further includes a second fixing component, which is used to fix the position of the test daughter board relative to the test mother board.
[0015] In some embodiments, the above-mentioned test load board further includes a test socket support component, which is used to support the test socket.
[0016] In some embodiments, there are voids in the above-mentioned test mother board, which are used for routing and / or installing the test socket support component.
[0017] In some embodiments, the above-mentioned test daughter board is made by using the High Density Interconnector (HDI) process.
[0018] In a second aspect, the present application provides a test device, including a test load board, and the test load board is the test load board provided in the first aspect.
[0019] The test load board and the test system provided by the present application, by splitting the test load board into a test daughter board and a test mother board, the test daughter board can be designed and produced by using conventional processes, and the test mother board can use vias with larger apertures to reduce the aperture ratio, thereby reducing the process difficulty and production difficulty, and the test mother board can be shared by multiple test items, which helps to reduce the board manufacturing cost of the test load board. BRIEF DESCRIPTION OF THE DRAWINGS
[0020] The drawings here are incorporated into the specification and form a part of this specification, showing the embodiments consistent with the present application, and are used together with the specification to explain the principles of the present application.
[0021] Figure 1 It is a schematic diagram of the via structure of a load board provided in an embodiment of the present application;
[0022] Figure 2 It is a schematic diagram of the structure of a test load board provided in an embodiment of the present application Figure 1 ;
[0023] Figure 3 It is a schematic diagram of the structure of a test load board provided in an embodiment of the present application Figure 2 ;
[0024] Figure 4 It is a schematic diagram of the structure of a test load board provided in an embodiment of the present application Figure 3 .
[0025] Through the above-mentioned drawings, specific embodiments of the present application have been shown, and will be described in more detail hereinafter. These drawings and the written description are not intended to limit the scope of the concept of the present application in any way, but to illustrate the concept of the present application to those skilled in the art by referring to specific embodiments.
[0026] Reference numeral
[0027] 201: Test motherboard;
[0028] 202: Test daughter board;
[0029] 203: Test holder;
[0030] 204: First component;
[0031] 205: First fixing component;
[0032] 206: Second fixing component;
[0033] 207: Test holder support component. Detailed implementation manners
[0034] The implementation manners described in the following exemplary embodiments do not represent all implementation manners consistent with the present application. On the contrary, they are merely examples of devices consistent with some aspects of the present application as detailed in the appended claims.
[0035] For the convenience of clearly describing the technical solutions of the embodiments of the present application, in the embodiments of the present application, words such as "exemplary" or "for example" are used to represent examples, illustrations or explanations. Any embodiment or design solution described as "exemplary" or "for example" in the present application should not be construed as being more preferred or having more advantages than other embodiments or design solutions. Rather, the use of words such as "exemplary" or "for example" is intended to present relevant concepts in a specific manner.
[0036] In the embodiments of the present application, terms such as "first" and "second" are used to distinguish the same items or similar items with basically the same functions and effects. For example, the first fixing component and the second fixing component are only used to distinguish different fixing components, and do not limit their sequence. Those skilled in the art can understand that terms such as "first" and "second" do not limit the quantity and execution order, and terms such as "first" and "second" do not necessarily mean different.
[0037] In the embodiments of the present application, "at least one" means one or more, and "a plurality" means two or more. "And / or" describes the association relationship of associated objects and indicates that three relationships may exist. For example, A and / or B may represent: A exists alone, A and B exist simultaneously, and B exists alone, where A and B may be singular or plural. The character " / " generally represents an "or" relationship between the associated objects before and after. "At least one (item)" or its similar expression refers to any combination of these items, including any combination of single items or plural items. For example, at least one (item) of a, b, or c may represent: a, b, c, a - b, a - c, b - c, or a - b - c.
[0038] To facilitate a clear description of the technical solutions of the embodiments of the present application, the following briefly introduces some of the terms and technologies involved in the embodiments of the present application:
[0039] 1. Printed Circuit Board (PCB)
[0040] The PCB is composed of an insulating base plate, connecting wires, and pads for assembling and soldering electronic components, and has the dual functions of conductive circuits and an insulating base plate. It can replace complex wiring to achieve electrical connections between various components in the circuit, not only simplifying the assembly and soldering work of electronic products, reducing the wiring workload in the traditional method, but also reducing the volume of the whole machine, helping to reduce product costs, and improving the quality and reliability of electronic devices.
[0041] 2. ATE (Automatic Test Equipment)
[0042] ATE is a device used for automatically testing semiconductor chips. It usually includes parts such as test hardware, test software, and test interfaces, and can automatically execute test sequences, collect test data, analyze test results, and generate test reports.
[0043] 3. Load Board (or Load Board)
[0044] The load board is a tool used to ensure that the chip undergoes precise testing before packaging. It is a specially designed interface board with multiple precision interfaces and pins, which are used to connect the contact points (such as pads or bumps) of the chip to test equipment (such as ATE). In addition to providing mechanical support and ensuring electrical connections, the load board also integrates necessary circuits and components, such as resistors, capacitors, etc., to adjust and distribute test signals and power supplies, thereby simulating the circuit conditions of the chip in the actual working environment. The load board can be composed of multiple layers of PCB to meet complex signal transmission and testing requirements.
[0045] 4. Device under test (DUT)
[0046] The DUT refers to the device whose performance is measured, analyzed, or verified during ATE testing. It is the core object of ATE testing, and through ATE testing, its functions, performance, stability, etc. can be comprehensively evaluated.
[0047] 5. PTH (Plating Through Hole)
[0048] PTH is a commonly used technology in the PCB manufacturing process for forming plated-through holes on the PCB. These through holes can connect different layers of the PCB to achieve electrical connections between electronic components.
[0049] 6. Aspect ratio
[0050] The aspect ratio refers to the ratio of the thickness of the PCB to the diameter of the via hole. It is an important parameter in the PCB design and manufacturing process, and has important impacts on both the electrical and mechanical properties of the PCB. In PCB design, an appropriate aspect ratio needs to be selected according to actual requirements to ensure the reliability and stability of the PCB.
[0051] Due to the characteristics of large size and thickness, high aspect ratio, and low production yield of the load board, the production process of the load board is different from that of conventional PCBs. The interconnection between layers generally can only be achieved by mechanical drilling. However, mechanical drilling faces many challenges in the production of load boards, such as difficult control of drilling accuracy and difficulty in debris cleaning during the drilling process.
[0052] Exemplarily, refer to Figure 1 , Figure 1 which is a schematic diagram of the through-hole structure of a load board provided in an embodiment of the present application.
[0053] As Figure 1 shown, in the area where the device under test is located, due to the large number of Balls (i.e., solder balls on the BGA package), in order to perform effective fan-out (or Fanout, that is, expanding the signal from one area of the chip package to a larger area or other parts of the circuit board) connections, through holes are usually directly drilled on the BGA pad to connect to the inner layer.
[0054] In addition, in the area where the device under test is located, due to the small Pitch (the distance between pads), generally 0.4 mm, and the need to thread wires between PTHs, the diameter of PTHs is usually relatively small (generally 0.1 - 0.125 mm), the aperture ratio is relatively large (generally 30:1 to 40:1), and the minimum distance between PTHs and wires is also very small (generally 0.08 mm). These factors will increase the processing difficulty and cost proportion of PTHs in the area where the device under test is located.
[0055] Compared with the area where the device under test is located, there are no strict size limitations and Pitch requirements in the area where the device under test is not located. Therefore, the diameter of PTHs can be designed to be more than 0.25 mm, and the minimum distance between PTHs and wires can also be set to be more than 0.25 mm. This can effectively reduce the processing difficulty and cost, making the processing in the area where the device under test is not located relatively easy to achieve.
[0056] With the continuous development of semiconductor technology, the pitch of chips is getting smaller and the number of solder balls in BGAs is increasing, which poses challenges to the fan-out design of load boards. Further, the existing manufacturing process of load boards is relatively complex, resulting in a relatively long manufacturing cycle and relatively difficult production of load boards. In addition, since each load board is customized according to specific test requirements, they are usually dedicated to specific boards only, which further increases the board manufacturing cost.
[0057] In the face of the above technical problems, the embodiments of the present application provide a test load board. By splitting the test load board into a test daughter board and a test mother board, the test daughter board can be designed and produced using conventional processes, and the test mother board can use vias with larger apertures to reduce the aperture ratio, thereby reducing the process difficulty and production difficulty. Moreover, the test mother board can be shared by multiple test projects, which helps to reduce the board manufacturing cost of the test load board.
[0058] The technical solutions provided by the present application are described in detail below through specific embodiments. It should be noted that the following several embodiments can exist independently or be combined with each other. For the same or similar content, it will not be repeated in different embodiments.
[0059] Refer to Figure 2 , Figure 2 which is a schematic structure of a test load board provided in the embodiments of the present application Figure 1 ; In some embodiments, the above test load board includes: a test mother board 201 and at least one test daughter board 202.
[0060] In some embodiments, the test mother board 201 can be connected to the ATE to introduce the signals and resources required for testing.
[0061] Optionally, the test motherboard 201 can be connected to the ATE through a specific interface or socket. This connection ensures that the ATE can stably and reliably transmit test signals and resources to the test motherboard.
[0062] In some embodiments, once the test motherboard 201 is connected to the ATE, the ATE can send test signals to the device under test through the test motherboard. These test signals can include power signals, clock signals, data signals, etc., and are used to simulate various situations of the device under test in the actual working environment.
[0063] In some embodiments, in addition to test signals, the ATE can also introduce other necessary resources to the device under test through the test motherboard, such as test software, test programs, etc.
[0064] At least one test socket 203 is provided on the test daughter board 202, and the test socket 203 is used to connect the device to be tested to the test daughter board 202.
[0065] In some embodiments, the test daughter board 202 is connected to the test motherboard and can jointly construct a complete test platform.
[0066] In some embodiments, the test daughter board 202 can also include various test circuits, interfaces, and connectors for communicating and transferring data with the test motherboard 201 and the device to be tested.
[0067] In some embodiments, the test socket 203 can also be referred to as a chip test socket, or a test socket, or a Socket, which is a test socket for connecting a device to be tested (such as a chip) to a printed circuit board.
[0068] Optionally, the test socket 203 can include parts such as a socket body, contact pieces, and a fixing structure, which can ensure a stable connection between the device to be tested and the test daughter board 202, and provide good electrical and mechanical properties. In ATE testing, the test socket 203 can conveniently replace the device to be tested, improving the test efficiency.
[0069] In some embodiments, the test socket 203 is used in cooperation with the test daughter board 202. The test socket 203 serves as a temporary fixing device that can safely hold the device to be tested, while the test daughter board 202 is responsible for establishing an electrical connection. This combination enables the device to be tested to be tested multiple times without damage, which helps to detect and screen out defective products and ensures the quality of the final product.
[0070] A first component ( Figure 2 not shown in the figure) is provided on the test motherboard 201, and the first component is used to guide the test resources of the test motherboard 201 to the test daughter board 202; the test resources are used to test the above-mentioned device to be tested.
[0071] In some embodiments, the test motherboard 201 can receive test signals output by the ATE, such as analog signals, digital signals, clock signals, etc., and use the above-mentioned first components to transmit these test signals to the test daughterboard 202. The test daughterboard 202 then uses the test socket 203 to further direct these test signals to the corresponding interfaces of the device under test.
[0072] In addition to signal transmission, the test motherboard 201 can also reasonably allocate test resources provided by the ATE (such as power supply, ground, reset signal, etc.) to the test daughterboard 202 and the device under test.
[0073] In some embodiments, the test motherboard 201 can be equipped with standardized connection interfaces for reliable and stable connection with the ATE and the test daughterboard. These interfaces may include slots, sockets, connectors, etc., and the specific form depends on the design requirements of the ATE and the test system.
[0074] In some embodiments, to meet different test requirements, the capacity of the test system can be adjusted by increasing or decreasing the number of test daughterboards; or, the test motherboard can be upgraded or the components on it can be replaced to support new test protocols or standards.
[0075] In some embodiments, the test motherboard 201 can be paired with different types of test daughterboards to flexibly adapt to different test tasks. For example, when different types of chips need to be tested, only the corresponding test daughterboard 202 needs to be replaced, without the need for large-scale adjustment or modification of the entire test load board.
[0076] It can be understood that the test motherboard 201 can be used in combination with different types of test daughterboards to quickly adapt to different test requirements and improve the flexibility of testing. Since the test daughterboard can be designed according to the specific device under test, the test motherboard can be paired with multiple types of test daughterboards, thus improving the versatility of the entire test system. And since the test motherboard can be reused, it also helps to reduce the test cost.
[0077] In some embodiments, the diameter of the vias on the above-mentioned test motherboard is larger than the diameter of the vias on the test daughterboard.
[0078] In some embodiments, the thickness of the above-mentioned test daughterboard is less than the thickness of the test motherboard.
[0079] It can be understood that since the area of the above-mentioned test daughterboard is relatively small and the thickness is low, the HDI process can be used for design and production to ensure good connection and signal transmission quality with the DUT.
[0080] Among them, the HDI board is a circuit board with a relatively high line distribution density using micro blind via technology. It can achieve higher line density and finer wiring, thus significantly improving the performance and stability of the circuit board. The main features of the HDI process include:
[0081] High line density: The HDI board can provide finer line widths and pitches, smaller via sizes, and higher connection pad densities.
[0082] Short signal transmission distance: Due to the high line density, the HDI board can shorten the signal transmission distance, thereby enhancing the signal quality and transmission speed of the circuit board.
[0083] Superior electrical performance: By reducing resistance and capacitance, the HDI board can significantly improve the electrical performance and stability of the circuit board.
[0084] Flexible connection design: The HDI board provides more connection pads, enhancing the connection flexibility and design freedom of the circuit board.
[0085] In some embodiments, the diameter of the vias on the test daughter board can be designed to be relatively small (such as 0.1 - 0.125 mm) to adapt to the dense balls and pitches on the DUT.
[0086] In some embodiments, the test mother board can use vias with larger diameters (the through - hole diameter can be designed to be more than 0.25 mm) to reduce the aperture ratio and lower the process difficulty.
[0087] In some embodiments, the test mother board can be designed and produced using conventional PCB processes.
[0088] For the test load board provided in this application, by splitting the test load board into a test daughter board and a test mother board, the test daughter board can be designed and produced using conventional processes, and the test mother board can use vias with larger diameters to reduce the aperture ratio, thereby reducing the process difficulty and production difficulty. Moreover, the test mother board can be shared by multiple test projects, which helps to reduce the board manufacturing cost of the test load board.
[0089] In some embodiments, the above - mentioned first component can be a probe tower (or called Pogo Tower).
[0090] In some embodiments, the above - mentioned probe tower can be a support frame composed of spring pins. It is a mechanically precisely arranged spring contact with controllable impedance connections at the top and bottom.
[0091] In some embodiments, the above - mentioned probe tower can play a role in connecting the test mother board and the test daughter board, ensuring the stable transmission of test signals between the test mother board and the test daughter board.
[0092] In some embodiments, the above-mentioned first component may also be a connection plug (or called a connecter).
[0093] Among them, the above-mentioned connection plug may include two parts: a plug and a socket. Through the plugging and unplugging connection of these two parts, the connection and disconnection between the test motherboard and the test daughter board can be realized. In addition, the connection plug can also transmit various electrical signals, including analog signals, digital signals, high-frequency signals, etc., which can ensure the stable transmission of test signals between the test motherboard and the test daughter board.
[0094] In some embodiments, through its unique structure and design, the above-mentioned connection plug can firmly connect the test motherboard and the test daughter board together, and can prevent the connection from loosening or disconnecting due to vibration or impact.
[0095] In some embodiments, the above-mentioned first component may also be a connection cable (or called a Cable).
[0096] Among them, the above-mentioned connection cable can realize the connection and disconnection between the test motherboard and the test daughter board through the connectors (such as plugs and sockets) at both ends.
[0097] In some embodiments, the above-mentioned connection cable can also transmit various electrical signals, including analog signals, digital signals, etc., to ensure the stable transmission of test signals between the test motherboard and the test daughter board.
[0098] Since the above-mentioned connection cable has a certain flexibility, it can adapt to different installation and layout requirements. In addition, some specially designed cables can also have characteristics such as waterproof, dustproof, and high-temperature resistance to meet the needs of specific test scenarios.
[0099] Exemplarily, refer to Figure 3 , Figure 3 which is a schematic structure of a test load board provided in an embodiment of the present application Figure 2 ; in some embodiments, the above-mentioned test load board includes: a test motherboard 201 and at least one test daughter board 202.
[0100] In some embodiments, the test motherboard 201 can be connected to the ATE to introduce the signals and resources required for testing. At least one test socket 203 is provided on the test daughter board 202, and the test socket 203 is used to connect the device to be tested to the test daughter board 202.
[0101] A first component 204 is provided on the test motherboard 201, and the first component is used to guide the test resources of the test motherboard 201 to the test daughter board 202; the test resources are used to test the above-mentioned device to be tested.
[0102] In some embodiments, the above-mentioned test resources may refer to various resources and tools provided on the test motherboard 201 for testing the device under test. Optionally, the above-mentioned test resources include, but are not limited to, the following aspects:
[0103] I. Power supply resources
[0104] For example, a DC power supply can provide a stable DC voltage and current for the device under test; an AC power supply is used to simulate the AC power supply environment in actual applications for power supply adaptability testing; power supply regulation and monitoring are used to dynamically regulate the voltage and current through a programmable power supply while monitoring the power output status.
[0105] II. Signal resources
[0106] For example, analog signals are used to generate and measure analog voltage and current signals for simulating sensor inputs, audio signals, etc.; digital signals are used to test digital circuits, processor interfaces, etc.; clock signals can provide a stable clock source for the device under test for timing testing.
[0107] III. Interface resources
[0108] For example, it includes general interfaces, special interfaces, high-frequency interfaces, etc.
[0109] IV. Control resources
[0110] For example, a microcontroller or a processor is used to control the test sequence, data acquisition, and test result processing; a field-programmable gate array can provide programmable logic for implementing complex test logics.
[0111] In some embodiments, the above-mentioned test load board further includes a first fixing component, which is used to fix the test motherboard to the ATE.
[0112] In some embodiments, the above-mentioned test load board further includes a second fixing component, which is used to fix the position of the test daughter board relative to the test motherboard.
[0113] In some embodiments, the above-mentioned test load board further includes a test socket support component, which is used to support the above-mentioned test socket, thereby increasing the load-bearing capacity of the above-mentioned test socket.
[0114] In some embodiments, there are cavities in the above-mentioned test motherboard, and the cavities can be used for routing wires and / or installing the above-mentioned test socket support component.
[0115] Exemplarily, referring to Figure 4 , Figure 4 is the structural schematic diagram of a test load board provided in an embodiment of the present application Figure 3; In some embodiments, the above-mentioned test load board includes: a test motherboard 201 and at least one test daughter board 202.
[0116] In some embodiments, the test motherboard 201 can be connected to the ATE to introduce the signals and resources required for testing. At least one test socket 203 is provided on the test daughter board 202, and the test socket 203 is used to connect the device under test to the test daughter board 202.
[0117] A first component 204 is provided on the test motherboard 201, and the first component is used to guide the test resources of the test motherboard 201 to the test daughter board 202; the test resources are used to test the above-mentioned device under test.
[0118] In some embodiments, the above-mentioned test load board further includes a first fixing component 205, and the first fixing component 205 is used to fix the test motherboard 201 to the ATE.
[0119] Optionally, the above-mentioned first fixing component 205 can be a stiffener.
[0120] In some embodiments, the above-mentioned test load board further includes a second fixing component 206, and the second fixing component 206 is used to fix the position of the test daughter board 202 relative to the test motherboard 201.
[0121] Optionally, the above-mentioned second fixing component 206 can be a metal frame, which provides stable support for the test daughter board 202 to ensure that they can be correctly positioned and fixed according to the design requirements.
[0122] In some embodiments, the above-mentioned test load board further includes a test socket support component 207, and the test socket support component 207 is used to support the above-mentioned test socket 203, thereby increasing the force-bearing capacity of the above-mentioned test socket 203.
[0123] In some embodiments, there are cavities in the above-mentioned test motherboard 201, and the cavities are used for routing and / or installing the above-mentioned test socket support component 207.
[0124] In the embodiments of the present application, by splitting the above-mentioned test load board into a test daughter board and a test motherboard, the test daughter board has a small area and a low thickness, and can be designed and produced by conventional processes, thereby reducing the difficulty of the board manufacturing process. The test motherboard can adopt a board manufacturing process more suitable for large apertures and multi-layer structures, which also helps to reduce the process difficulty.
[0125] Furthermore, the split test daughter board and test motherboard can be designed and produced separately, thereby realizing parallel processing, which helps to shorten the overall board manufacturing cycle.
[0126] Furthermore, since the test daughter board can adopt simpler processes and materials, the production cost can be reduced. In addition, since the test mother board can be shared by multiple projects, the cost can be shared, reducing the board manufacturing cost of each project.
[0127] In some embodiments, the above embodiment of the present application further provides a test system, which includes the test load board described in the above embodiment, which will not be described in detail here.
[0128] The embodiments of the present disclosure are not exhaustive, but are merely illustrative of some embodiments, and are not intended to be a specific limitation on the scope of protection of the present disclosure. In the absence of contradiction, a certain embodiment may be implemented as an independent embodiment. In addition, the optional implementations in a certain embodiment may be arbitrarily combined; in addition, the embodiments may be arbitrarily combined, for example, some or all of the components of different embodiments may be arbitrarily combined, and a certain embodiment may be arbitrarily combined with the optional implementations of other embodiments. In each embodiment of the present disclosure, unless otherwise specified and logically conflicting, the terms and / or descriptions between the embodiments are consistent and may be referenced to each other, and the technical features in different embodiments may be combined to form a new embodiment according to their inherent logical relationships.
[0129] In some embodiments, terms such as "greater than", "greater than or equal to", "not less than", "more than", "more than or equal to", "not less than", "higher than", "higher than or equal to", "not lower than", and "above" can be replaced with each other, and terms such as "less than", "less than or equal to", "not greater than", "less than", "less than or equal to", "no more than", "lower than", "lower than or equal to", "not higher than", and "below" can be replaced with each other.
[0130] Those skilled in the art can appreciate that in the several embodiments provided in this application, the units described as separate components may or may not be physically separated, may be located in one place, or may be distributed on multiple units. Some or all of the units may be selected according to actual needs to achieve the purpose of the present embodiment.
[0131] Finally, it should be noted that the above embodiments are only used to illustrate the technical solutions of the present application, rather than to limit it. Although the present application has been described in detail with reference to the aforementioned embodiments, those skilled in the art should understand that they can still modify the technical solutions described in the aforementioned embodiments, or replace some or all of the technical features therein with equivalents. However, these modifications or replacements do not cause the essence of the corresponding technical solutions to deviate from the scope of the technical solutions of the embodiments of the present application.
Claims
1. A test load board, characterized in that, The test load board includes: a test mother board and at least one test daughter board; The test mother board can be connected to an automatic test equipment (ATE); At least one test socket is arranged on the test daughter board, and the test socket is used to connect a device under test to the test daughter board; A first component is arranged on the test mother board, and the first component is used to guide the test resources of the test mother board to the test daughter board, and the test resources are used to test the device under test.
2. The test load board according to claim 1, wherein The diameter of the via holes on the test mother board is larger than the diameter of the via holes on the test daughter board.
3. The test load board according to claim 1 or 2, characterized in that The thickness of the test daughter board is less than the thickness of the test mother board.
4. The test load board according to claim 1, characterized in that, The first component is any one of the following: a probe tower, a connection plug or a connection cable.
5. The test load board according to claim 1, wherein The test load board further includes a first fixing component, and the first fixing component is used to fix the test mother board on the ATE.
6. The test load board according to claim 1 or 5, characterized in that, The test load board further includes a second fixing component, and the second fixing component is used to fix the position of the test daughter board relative to the test mother board.
7. The test load board according to claim 1, wherein, The test load board further includes a test socket support component, and the test socket support component is used to support the test socket.
8. The test load board according to claim 7, wherein, There are voids in the test mother board, and the voids are used for wiring and / or installing the test socket support component.
9. The test load board according to claim 1, characterized in that, The test daughter board is made by using a high density interconnect (HDI) process.
10. A test system, characterized in that, It includes a test load board, and the test load board is the test load board according to any one of claims 1-9.