Method and System for Detecting Temperature Variation Uniformity of Wafer Heating Plate Based on Time-Series Multi-Point Sensing

Abstract

The present invention belongs to the field of semiconductor manufacturing technology and discloses a method and system for detecting the temperature uniformity of a wafer heating plate based on time-series multi-point sensing. The method comprises a PLC controller that simultaneously controls the operation of a rotating multi-point detection frame and the wafer heating plate. The temperature sensor array on the rotating multi-point detection frame scans the wafer heating plate in a heating state for one cycle and synchronously collects data at multiple points, obtaining a set of correlated data corresponding to the heating parameters of the wafer heating plate, including synchronous changes in the four elements of time-series data, temperature data, and spatial data at each point. The system then compares the dynamic change rates between the four-dimensional correlated data sets to determine whether the absolute temperature change error and the dynamic change rate between each point are simultaneously within an allowable range, obtains the test results, and indicates the position coordinates and error values of unqualified points. The system structure of the present invention is compact, the method is simple and accurate, and it can automatically and batch complete the multi-element temperature uniformity detection of wafer heating plates.

Description

Technical Field

[0001] The present invention relates to the field of semiconductor manufacturing technology, and in particular to a method and system for detecting uniformity of a wafer heating plate based on time-series multi-point sensing. Background Art

[0002] Semiconductor heating plates are devices used to heat semiconductor wafers. They are typically made of a high-thermal-conductivity material (commonly aluminum nitride ceramic) and are capable of evenly transferring heat to the wafer surface. They are widely used in various stages of the semiconductor manufacturing process, such as wafer cleaning, thin-film deposition, photolithography, and annealing. Controlling the temperature uniformity of the heating plate ensures precise and uniform heating of the wafers to meet the requirements of various process steps. Therefore, comprehensive and accurate testing of the heating performance of wafer heating plates is essential to improve the quality and yield of semiconductor devices in subsequent manufacturing processes and eliminate the uncertainty caused by poor heating plate performance.

[0003] Most existing detection technologies can only measure the surface temperature of the wafer heating plate. This is typically accomplished by placing a temperature sensor wafer (TC-wafer) composed of a silicon wafer and thermocouple elements in a high-temperature, vacuum reaction chamber. The TC-wafer's surface temperature, in place of the wafer, represents the actual wafer surface temperature during the process. This allows for indirect measurement of the wafer's surface temperature and temperature distribution within the reaction chamber during the actual process. Conventional MOCVD temperature monitoring, both domestically and internationally, uses infrared thermometers or thermocouples. However, due to limited installation space and hardware and software costs, the number of measurement points is very limited. This allows only a rough, discrete measurement of the MOCVD graphite plate surface temperature, making it difficult to obtain a precise temperature distribution. This makes it difficult to precisely and comprehensively control or specifically adjust the graphite plate surface temperature distribution, such as peaks and valleys, and their spatial locations. Furthermore, because this technology requires multiple infrared thermometers, such equipment is not only expensive but also cumbersome to calibrate. The existing temperature monitoring devices have the disadvantages of relatively rough test results and cumbersome calibration correction when measuring the temperature uniformity of MOCVD graphite carrier disks. In addition, the multiple detection holes make the processing of MOCVD reaction chambers more difficult. The existing resistance furnace heating elements are wound or coiled with high-temperature metals such as tungsten, molybdenum, and rhenium. The conventional design is annular or vortex-shaped. It is difficult to adjust the local blocks of the resistance furnace heating elements separately, and it is easy to have "high temperature-low temperature" intervals staggered in the radial direction, resulting in uneven radial temperature distribution. However, due to the narrow range of variation of this unevenness, it is difficult to detect using conventional detection equipment and static detection methods, and therefore it is difficult to identify qualified products and defective products with high precision.

[0004] For example, CN117686244A discloses a wafer heating plate performance testing device and testing method, wherein the wafer heating plate performance testing device includes a power supply unit, a multi-channel temperature acquisition unit, and a control unit; the multi-channel temperature acquisition unit includes nine fixed-position temperature acquisition probes, each of which is used to collect real-time temperatures at different positions on the heating surface of the heating plate; the control unit is used to control the heating plate to heat up or cool down to a set temperature, and calculate the heating rate and / or cooling rate and / or temperature uniformity data based on the real-time temperatures detected by each temperature acquisition probe. The above device is designed to resemble the structure of a microwave oven. During the testing process of the present invention, the positions of the multiple temperature acquisition probes and the heating plate are relatively fixed. Each temperature acquisition probe can only collect the temperature value of a fixed position on the upper surface of the heating plate. If one or more of the temperature acquisition probes have data distortion, or the sampled points on the heating plate do not cover the abnormal area, the obtained graduation uniformity value and the heating rate or cooling rate of the corresponding position will be distorted, ultimately resulting in overall distortion of the test results. Temperature acquisition probes are prone to data distortion in a variety of situations, such as improper probe installation, probe aging or damage, interference from environmental factors, interference from the surface characteristics of the measured object, and signal transmission problems. CN117686244A, with only nine temperature acquisition probes in fixed positions, clearly cannot overcome these issues.

[0005] In addition, in the semiconductor wafer heating and baking equipment and detection method disclosed in CN 221149960 U, it is not considered that the reason for the uneven temperature of the wafer heating plate is not only whether the temperature of the heating plate itself is consistent, but also has a great relationship with the heat load of the wafer surface heat dissipation. Therefore, the spatial design and heat dissipation uniformity of the detection equipment itself should also be considered. The existing technology only improves the detection of the performance of the heating plate itself, and fails to recognize that the uneven heat dissipation caused by the improvement of the detection equipment is also a factor that leads to reduced temperature consistency of the wafer heating plate.

[0006] In summary, the above existing technologies usually use a small number of temperature acquisition probes to statically collect temperature data at various locations on a stationary heating plate at a fixed spatial position. It is difficult to overcome the problems of partial sensor distortion and incomplete regional coverage. At the same time, it also does not take into account the heat dissipation uniformity of the detection equipment itself. Therefore, it is difficult to comprehensively detect the multivariate uniformity of the position-time-temperature-space changes of the heating plate under dynamic conditions, and it is also difficult to further optimize the test process and process parameters of different types of heating plates, which is not conducive to the automation and intelligent upgrade of the detection equipment. Summary of the Invention

[0007] In view of the shortcomings existing in the above-mentioned background technology, the purpose of the present invention is to provide a method and system for detecting the temperature uniformity of a wafer heating plate based on dynamic scanning time-series multi-point sensing. Through the simultaneous improvement of the detection system, detection method and detection environment elements, the operating parameter-temperature-time-space four-dimensional correlation data group of the multi-point synchronous changes on the upper surface of the entire wafer heating plate can be accurately obtained. Based on data comparison and analysis, on the one hand, a comprehensive detection of the multivariate uniformity of the point-time-temperature-space changes of the heating plate can be achieved. It is further combined with network remote control and intelligent manipulators to perform batch and rapid testing on crystal heating plates of different models, which is conducive to the automation and intelligence of detection equipment to meet industrial needs.

[0008] To achieve the above object, the present invention provides the following technical solutions:

[0009] A method for detecting temperature uniformity of a wafer heating platen based on time-series multi-point sensing, wherein a PLC controller simultaneously controls the operation of a rotating multi-point detection frame and the wafer heating platen, wherein a temperature sensor array on the rotating multi-point detection frame rotates according to a set speed, direction, and interval angle, scanning the upper surface of the wafer heating platen in a heating operation state for at least one cycle and synchronously collecting data at multiple points, thereby obtaining a synchronously changing associated data set of four elements: time-series data, temperature data, and spatial data at each point corresponding to the heating operation parameters of the wafer heating platen, i.e., a four-dimensional associated data set of heating operation parameters, time-series data, temperature data, and spatial position data of the multiple points synchronously changing.

[0010] The absolute temperature values of each point on the wafer heating plate and the dynamic change rate between each four-dimensional correlation data group are compared with the pre-set allowable error range to determine whether the absolute temperature change error and the dynamic change rate between each point are both within the allowable range. If all points are within the allowable range at the same time, it is a qualified product; otherwise, it is an unqualified product. The position coordinates and error values of the unqualified points are marked to complete the detection of the multivariate temperature change uniformity of the entire surface of the wafer heating plate.

[0011] A wafer heating plate temperature uniformity detection system based on time-sequential multi-point sensing is used to implement the wafer heating plate temperature uniformity detection method based on time-sequential multi-point sensing, comprising: a PLC controller, a synchronous detection device, and a wafer heating plate; the synchronous detection device comprises a rotary lifting bracket, a temperature sensor, an electric rotary telescopic rod, and a photoelectric encoder;

[0012] The PLC controller is electrically connected to the wafer heating plate, the electric rotating telescopic rod of the synchronous detection device, the photoelectric encoder and the temperature sensor respectively;

[0013] The rotary lifting bracket includes a rotary multi-point detection frame, which includes a plurality of sensor array arms uniformly distributed in a centrally symmetrical manner, and each sensor array arm is provided with a plurality of temperature sensors to form a uniformly spaced temperature sensor array;

[0014] The wafer heating plate is set directly below the rotating multi-point detection frame, and the radius of each sensor array arm is the same as that of the wafer heating plate;

[0015] The electric rotating telescopic rod is vertically arranged at the axis position, and the photoelectric encoder is arranged on the upper part of the electric rotating telescopic rod; the rotary lifting bracket is arranged at the lower part of the electric rotating telescopic rod, and the electric rotating telescopic rod is controlled by a PLC controller to drive the rotary lifting bracket to perform ascending, descending and circumferential rotation movements; during this process, the position of the wafer heating plate remains fixed, and the photoelectric encoder rotates with the electric rotating telescopic rod, collecting initial and rotation angle data and transmitting them to the PLC controller;

[0016] When the electric rotating telescopic rod drives the rotary lifting bracket to descend, it drives multiple temperature sensors of each sensor array arm sensor array to contact the upper surface of the wafer heating plate at the same time, and separately and independently collects the temperature data of each contact point and transmits it to the PLC controller;

[0017] When the electric rotating telescopic rod drives the rotary lifting bracket to perform an ascending and rotating action, it drives the multiple temperature sensors of each sensor array arm sensor array to first ascend and leave the upper surface of the wafer heating plate to a set height, then rotate to a set interval angle, and then descend, so that each temperature sensor contacts the upper surface of the wafer heating plate at the same time, and separately and independently collects the temperature data of each contact point and transmits it to the PLC controller;

[0018] When the PLC controller controls the operating parameters of the electric rotating telescopic rod and the wafer heating plate, and the electric rotating telescopic rod drives the rotary lifting bracket to perform ascending, descending, and circumferential rotation for one circle multiple times, a four-dimensional correlation data set of operating parameters, temperature, time series, and space covering the entire area of the upper surface of the wafer heating plate with synchronous changes at multiple points is scanned.

[0019] Compared with the prior art, the present invention has at least the following advantages and significant features:

[0020] 1. The present invention provides a method and system for detecting the temperature uniformity of a wafer heating plate based on time-series multi-point sensing. In view of the shortcomings of existing technologies and methods, which all measure the temperature of the wafer surface during the measurement process and can only indirectly evaluate the temperature uniformity of the semiconductor heating plate after heating, and cannot effectively and directly evaluate the synchronous temperature uniformity of the semiconductor heating plate at various circumferential locations, the present invention improves the detection system, detection method and detection environment elements simultaneously, and can accurately obtain the operating parameter-temperature-time-space four-dimensional correlation data group of the multi-point synchronous changes on the upper surface of the entire wafer heating plate. Based on data comparison and analysis, on the one hand, it can realize a comprehensive detection of the multivariate uniformity of the point-time-temperature-space changes of the heating plate. It can further combine network remote control and intelligent manipulators to perform batch and rapid testing on crystal heating plates of different models, which is conducive to the automation and intelligence of detection equipment and can better meet industrial needs.

[0021] 2. The present invention can further adjust the operating parameters of the wafer heating plate, dividing the process into three stages: heating, constant temperature, and constant temperature. A synchronous detection device rotates and scans the upper surface of the wafer heating plate according to a set time interval and sequence, synchronously collecting data sets corresponding to the wafer heating plate's operating parameters, including multi-point time series data, temperature data, and spatial data, to obtain synchronously changing associated data sets. This is a four-dimensional, multi-point synchronously changing operating parameter-temperature-time series-space associated data set. The synchronous detection device scans for at least one cycle to obtain the absolute temperature value of each point and the dynamic rate of change between each associated data set, determining whether the error is within the allowable range. If so, the product is qualified; otherwise, it is unqualified, thus completing the multivariate temperature uniformity test of the entire wafer heating plate. The present invention uses the dynamic derivative of the absolute temperature change and other data to comprehensively determine whether the product is qualified. This improves detection accuracy and avoids misjudgments caused by sensor distortion.

[0022] 3. The present invention provides an online detection method and system for the temperature uniformity of a semiconductor wafer heating plate based on time-series multi-point sensing. This method and system can perform an overall scan and comprehensive coverage of the temperature distribution of the heating plate. Combined with the closed internal structure of the synchronous detection device and the method in which only the upper temperature sensor array rotates and the lower wafer heating plate remains stationary, the heat dissipation conditions at various locations of the wafer heating plate are basically consistent. When considering external environmental parameters as background data, the detection data group can be obtained more accurately and the analysis results of each point can be obtained, thereby more accurately and effectively evaluating its performance.

[0023] 4. The method and system provided by the present invention can be further divided into three stages of heating, constant temperature and constant temperature for scanning, and the corresponding four-dimensional correlation data groups of heating operation parameters-timing-temperature-spatial position can be obtained respectively, and the specific point (spatial coordinate) can be accurately located. The detection value of each point only represents the point where it is located and a small area around it. The detection granularity is finer. After the data of each point is summarized, the temperature change uniformity of the entire semiconductor wafer heating plate at different stages can be accurately detected, and qualified and unqualified products can be distinguished within a larger temperature change range.

[0024] 5. The present invention can also further analyze and obtain the optimal heating plate operating parameters and synchronous detection device working parameters, etc., to obtain the optimal operating parameter set, which can be applied to the efficient detection of online and batch wafer heating plates; by continuously optimizing the heating plate operating parameters and synchronous detection device working parameters, combined with machine learning and other technologies, it can also realize the intelligent detection of wafer heating plates of different types or batches, effectively improving the test efficiency and result accuracy. BRIEF DESCRIPTION OF THE DRAWINGS

[0025] In order to more clearly illustrate the embodiments of the present invention or the technical solutions in the prior art, the following briefly introduces the drawings required for use in the embodiments or the description of the prior art. Obviously, the drawings described below are merely embodiments of the present invention. For ordinary technicians in this field, without paying any creative work, other drawings obtained based on these drawings still fall within the scope of the present invention.

[0026] Figure 1 A schematic diagram of the overall structure of a wafer heating plate temperature uniformity detection system based on time-series multi-point sensing provided by an embodiment of the present invention;

[0027] Figure 2 A schematic diagram of the overall three-dimensional structure of a synchronization detection device provided by an embodiment of the present invention;

[0028] Figure 3 A schematic diagram of the three-dimensional assembly structure of the synchronous detection device provided by an embodiment of the present invention after removing the upper cover of the transparent housing;

[0029] Figure 4 A schematic diagram of the internal three-dimensional structure of the synchronization detection device provided by an embodiment of the present invention with the transparent shell removed;

[0030] Figure 5 This is a schematic top view of the structure of a rotating multi-point detection frame in a synchronous detection device provided by an embodiment of the present invention.

[0031] In the picture:

[0032] 1. Synchronous detection device; 2. Multi-channel temperature collector; 3. PLC controller; 4. Host computer; 5. Remote server; 6. Wafer heating plate;

[0033] 10. Transparent housing; 101. Housing upper cover; 102. Housing lower barrel; 103. Housing positioning circular hole; 104. Fixing support rod hole;

[0034] 11. Base tray; 111. Round tray; 112. Centering clamping groove;

[0035] 12. Centering clamping column; 121. Centering clamping plate; 122. Centering short handle; 123. Centering wheel; 124. Centering ball;

[0036] 13. Rotating lifting bracket; 131. Rotating frame; 132. Rotating multi-point detection frame; 133. Center disk; 134. Sensor array support arm; 135. Sensor mounting hole;

[0037] 14. Temperature sensor; 15. Electric rotating telescopic rod; 16. Photoelectric encoder;

[0038] 17. Thermal insulation pad; 18. Fixed support rod. DETAILED DESCRIPTION

[0039] In order to make the technical problems, technical solutions and beneficial effects to be solved by the present invention more clearly described, the present invention will be further described in detail below with reference to the accompanying drawings.

[0040] Example 1

[0041] See attached Figure 1-Figure 5 The embodiment of the present invention provides a method for detecting the temperature uniformity of a wafer heating plate based on time-series multi-point sensing. The temperature sensor array on the rotating multi-point detection frame performs a single-circle scan on the upper surface of the wafer heating plate and obtains the detection results, specifically:

[0042] The PLC controller simultaneously controls the operation of the rotating multi-point detection frame and the wafer heating plate. The temperature sensor array on the rotating multi-point detection frame rotates according to the set speed, direction, and interval angle, scanning the upper surface of the wafer heating plate in the heating operation state for one round and synchronously collecting data at multiple points, thereby obtaining a correlated data set of synchronously changing four elements of time series data, temperature data, and spatial data at each point corresponding to the heating operation parameters of the wafer heating plate, namely, a four-dimensional correlated data set of synchronously changing heating operation parameters, time series data, temperature data, and spatial position data at multiple points;

[0043] The absolute temperature values of each point on the wafer heating plate and the dynamic change rates between each four-dimensional correlation data group obtained by detection are compared with the pre-set allowable error range to determine whether the absolute temperature change errors and dynamic change rates between each point are simultaneously within the allowable range. If all points are simultaneously within the allowable range, the product is qualified; otherwise, it is unqualified. The position coordinates and error values of the unqualified points are marked to complete the multivariate temperature uniformity detection of the entire surface of the wafer heating plate. The specific steps include the following:

[0044] S1: Setting up the wafer heating plate temperature uniformity detection system

[0045] A wafer heating plate temperature uniformity detection system is provided, including a PLC controller, a synchronous detection device, and a wafer heating plate. The synchronous detection device includes a rotating multi-point detection frame and a photoelectric encoder. The rotating multi-point detection frame includes a central disk and a plurality of sensor array arms connected to the central disk and extending outwardly in a centrally symmetrical, cross-shaped arrangement. The central disk of the rotating multi-point detection frame and each sensor array arm are provided with 7-9 independent temperature sensors. In this embodiment, a total of 109 temperature sensors are provided.

[0046] S2: Scanning and testing the temperature uniformity of the wafer heating plate

[0047] The PLC controller controls the operation of the wafer heating plate and the synchronous detection device at the same time. When the wafer heating plate is in the heating operation state, the temperature sensor array on the rotating multi-point detection frame rotates according to the set speed, direction, and interval angle to scan the upper surface of the wafer heating plate for at least one circle and collect data synchronously at multiple points. The temperature sensor array collects the temperature data of each point, the photoelectric encoder collects the starting position and rotation angle data, and the PLC controller records the time and operation parameters, and obtains the associated data group of the synchronous changes of the four elements of the timing data, temperature data, and spatial data of each point corresponding to the heating operation parameters of the wafer heating plate, that is, the heating operation parameters-timing-temperature data of multiple points synchronously changed. degree-spatial position four-dimensional correlation data group; in the process of weekly scanning, multiple sensor array arms first contact a group of points on the wafer heating disk 6 at the same time, collect the first group of data and then rotate a certain angle (such as 5-10 degrees) to reach another group of points (the second group of points), and then contact the second group of points on the wafer heating disk 6 at the same time, collect the second group of data and then rotate a certain angle to reach the third group of points and collect the third group of data, and so on. After a cumulative rotation of 360 degrees, multiple groups of point data can be collected in sequence, and after summarizing, a four-dimensional correlation data group of heating operation parameters-timing-temperature-spatial position of multiple points synchronously changing on the entire upper surface of the wafer heating disk to be detected is obtained.

[0048] In this embodiment, the sensor array support arms on the rotating multi-point detection frame have 12 arms and a total of 109 temperature sensors. The specific operation steps are:

[0049] First, install the wafer heating plate 6 (8-inch ceramic heating plate) on the inner side of the centering clamping column 12 of the base tray 11, and ensure that the wafer heating plate 6 is in close contact with the insulation pad 17 and is concentric with the base tray 11;

[0050] The PLC controller controls the electric rotating telescopic rod 15 to descend from its initial position to its lowest position (2 cm from the surface of the wafer heating plate). A temperature sensor 14 (S-type thermocouple, accuracy of ±1°C, range of 0-1100°C) is inserted into each of the sensor mounting holes 135 of the rotating multi-point detection frame 132 and its 12 sensor array arms 134. A total of 109 temperature sensors are distributed in a concentric circle array on the rotating multi-point detection frame 132, each fixed in a sensor mounting hole 135 and electrically connected to the PLC controller.

[0051] During the temperature uniformity scanning test in the heating stage, the PLC controller is used to set the heating stage (setting the target temperature at 800°C and the heating rate at 10°C / min), the temperature setting stage (maintaining the temperature at 800°C±5°C), and the constant temperature stage after the temperature setting stage (maintaining the temperature at 800°C±2°C). The rotation step angle of the electric rotating telescopic rod 15 is set to 10°.

[0052] The PLC controller controls the wafer heating plate to heat up at 5°C / min, while the electric rotating telescopic rod 15 descends at 2 mm / s, so that all temperature sensors on the rotary multi-point detection frame (including 12 sensor array arms and the center position) reach the first group of points on the upper surface of the wafer heating plate, and the temperature sensor array on the rotary multi-point detection frame synchronously collects data. After the collected temperature data is stable, the temperature data of the first group of points is transmitted to the PLC controller, and then the electric rotating telescopic rod 15 rises and rotates 10° and then descends, driving the rotary multi-point detection frame to move, so that all temperature sensors on the rotary multi-point detection frame reach the second group of points on the upper surface of the wafer heating plate, and each temperature sensor synchronously collects temperature data of the second group of points; the above process is repeated multiple times, and the rotary multi-point detection frame completes one sampling cycle (one cycle is 10 rotations, and the rotation step angle is 10°) of the wafer heating plate, covering the entire upper surface of the wafer heating plate;

[0053] The multi-channel temperature collector 2 is used to collect the temperature value of the detection potential obtained by each temperature sensor (thermocouple); the rotation angle is output by the photoelectric encoder 16; the host computer is used to receive and process data from the PLC controller, including controlling the operating parameters of the wafer heating plate, such as voltage, current and power, outputting the adjusted wafer heating plate operating parameters to the PLC controller, receiving and processing the temperature data collected by each temperature sensor, the time of data collection, etc., and the host computer obtains a four-dimensional correlation data set of heating operating parameters-timing-temperature-spatial position that changes synchronously at multiple points during the heating stage.

[0054] During the temperature uniformity scanning test in the constant temperature stage, the PLC controller controls the wafer heating plate to heat to 800℃±5℃, and continuously collects three sampling cycles of the wafer heating plate. One cycle is 10 rotations, and the rotation step angle is 10°. The host computer obtains the four-dimensional correlation data set of heating operation parameters-timing-temperature-spatial position with synchronous changes at multiple points in the constant temperature stage.

[0055] When performing the temperature change uniformity scanning test in the constant temperature stage, the constant temperature stage test is started after the constant temperature stage ends (temperature fluctuation ≤ 2°C for 10 minutes); at this time, the rotation angle is adjusted to 5° each time, and the rotation angle of each test cycle is 360°. After 5 cycles of continuous data collection, the host computer obtains the four-dimensional correlation data set of heating operation parameters, timing, temperature, and spatial position that change synchronously at multiple points in the constant temperature stage.

[0056] S3: Detection Data Analysis

[0057] The absolute temperature values of each point on the wafer heating plate and the dynamic change rate between each four-dimensional correlation data group are compared with the pre-set allowable error range (for example, the absolute temperature value is set to ±1°C, and the dynamic change rate is ±0.1) to determine whether the absolute temperature change error and the dynamic change rate between each point are both within the allowable range. If all points are within the allowable range at the same time, the product is qualified; otherwise, it is unqualified. The position coordinates and error values of the unqualified points are marked to complete the detection of the multivariate temperature change uniformity of the overall surface temperature of the wafer heating plate.

[0058] First, the four-dimensional correlation data set of heating operation parameters, timing, temperature and spatial position of multiple points synchronously changing in the constant temperature stage obtained by the host computer, including: heating plate operation parameters, each thermocouple temperature, acquisition time, and the spatial point position corresponding to each thermocouple acquisition time, is aligned based on the time series of the data timestamp, and a time-space coordinate system is constructed; then, the dT / dT change curve of each detection point on the wafer heating plate over time is calculated, and the absolute temperature of each point is identified as abnormal. It is compared with the set allowable error range to determine whether all are within the allowable range. If all are within the allowable range, the product is qualified, otherwise it is unqualified.

[0059] S4: Optimize the three-stage operation plan

[0060] Continue adjusting the heating plate's heating rate to 10°C and 20°C, and repeat steps S2-S3. Finally, three sets of data are obtained for heating plate heating rates of 5°C / min, 10°C / min, and 20°C / min, respectively. The output four-dimensional data sets (heating plate operating parameters, thermocouple temperatures, acquisition time, and the spatial locations of each thermocouple during acquisition) are simultaneously analyzed to obtain the optimal heating parameters and a solution with good temperature uniformity (the optimal parameter set).

[0061] S5: Control the heating plate and synchronous detection device to operate according to the optimal solution

[0062] The host computer transmits the optimized optimal parameter set to the PLC controller, and adjusts the heating plate power output and the rotation speed and lifting stroke of the synchronous detection device in real time to carry out subsequent batch detection of wafer heating plates.

[0063] In this embodiment, during a stage of the heating, temperature setting or constant temperature process of the wafer heating plate 6, a plurality of temperature sensors 14 arranged in an array first follow the electric rotating telescopic rod 15 to an initial position, which is located directly above the upper surface of the wafer heating plate; after the detection starts, the electric rotating telescopic rod 15 descends and drives the rotary multi-point detection frame 132 to a position where each temperature sensor 14 contacts the upper surface of the wafer heating plate at the same time. At this time, the temperature data of the corresponding detection points are collected simultaneously by each temperature sensor 14, and the operating parameters and timing signals of the wafer heating plate 6 and the electric rotating telescopic rod 15 are recorded by the PLC controller, and the photoelectric encoder 16 assists in collecting the rotation, height and other spatial positions of the electric rotating telescopic rod 15. Set signal; then the electric rotating telescopic rod 15 rises 2cm, driving the rotary multi-point detection frame 132 to rise 2cm, and then rotates 10° clockwise or counterclockwise. After rotating into place, the electric rotating telescopic rod 15 drops 2cm, driving the rotary multi-point detection frame 132 to a position where each temperature sensor 14 contacts the upper surface of the wafer heating disk at the same time, and again collects the temperature data of the corresponding detection points through each temperature sensor 14 at the same time. After the collection is completed, it rises again, and so on and so forth is repeated many times until it rotates 360°, so that the collected data group covers the upper surface of the entire wafer heating disk, and then performs data comparison and analysis to obtain the detection results of each detection point, and then summarizes the detection results of the entire wafer heating disk.

[0064] The wafer heating plate temperature uniformity detection system based on time-series multi-point sensing provided in this embodiment includes: a PLC controller 3, a synchronous detection device 1, and a wafer heating plate 6; the synchronous detection device 1 includes a rotary lifting bracket 13, a temperature sensor 14, an electric rotary telescopic rod 15, and a photoelectric encoder 16;

[0065] The PLC controller 3 is electrically connected to the wafer heating plate 6, the electric rotating telescopic rod 15 of the synchronous detection device 1, the photoelectric encoder 16 and the temperature sensor 14 respectively;

[0066] The rotary lifting bracket 13 includes a rotary multi-point detection frame 132, which includes a plurality of sensor array arms 134 that are evenly distributed and symmetrically distributed around the center. Each sensor array arm 134 is provided with a plurality of temperature sensors 14. Together with the temperature sensor provided at the center of the rotary multi-point detection frame 132, these form an evenly spaced temperature sensor array, which is arranged in a concentric circle array with different radii.

[0067] The wafer heating disk 6 is arranged directly below the rotating multi-point detection frame 132, and the radius of each sensor array support arm 134 is the same as that of the wafer heating disk 6; the wafer heating disk is specifically a ceramic heating disk used to heat semiconductor wafers, etc.; for wafer heating disks 6 of different models and specifications, they can be adapted by adjusting the centering clamping column 12; the size of the wafer heating disk in this embodiment is 8 inches.

[0068] The electric rotating telescopic rod 15 is vertically arranged at the axis position, and the photoelectric encoder 16 is arranged on the upper part of the electric rotating telescopic rod 15; the rotary lifting bracket 13 is arranged at the lower part of the electric rotating telescopic rod 15. The electric rotating telescopic rod 15 is controlled by the PLC controller 3 to drive the rotary lifting bracket 13 to perform the movements of ascending, descending, and circumferential rotation. During this process, the position of the wafer heating plate 6 remains fixed. The photoelectric encoder 16 rotates with the electric rotating telescopic rod 15, collects initial and rotation angle data, and transmits them to the PLC controller 3.

[0069] When the electric rotating telescopic rod 15 drives the rotary lifting bracket 13 to descend, it drives the multiple temperature sensors 14 of the sensor array arms 134 to contact the upper surface of the wafer heating plate 6 at the same time, and separately and independently collects the temperature data of each contact point and transmits it to the PLC controller 3;

[0070] When the electric rotating telescopic rod 15 drives the rotary lifting bracket 13 to perform an ascending and rotating action, it drives the multiple temperature sensors 14 of each sensor array support arm 134 to first ascend and leave the upper surface of the wafer heating plate 6 to a set height, then rotate to a set interval angle, and then descend, so that each temperature sensor 14 is in contact with the upper surface of the wafer heating plate 6 at the same time, and the temperature data of each contact point is collected separately and independently, and transmitted to the PLC controller 3;

[0071] When the PLC controller 3 controls the operating parameters of the electric rotating telescopic rod 15 and the wafer heating plate 6, and the electric rotating telescopic rod 15 drives the rotary lifting bracket 13 to perform rising, falling and circumferential rotation for one circle multiple times, it can scan and obtain a four-dimensional correlation data set of operating parameters-temperature-time series-space with synchronous changes at multiple points covering the entire area of the upper surface of the wafer heating plate 6.

[0072] The synchronous detection device 1 further includes a transparent housing 10, a base tray 11, a centering clamping column 12, a heat insulating pad 17, and a fixed support rod 18;

[0073] The wafer heating plate 6, base tray 11, rotary lifting bracket 13, temperature sensor 14, centering clamping column 12, thermal insulation pad 17, and fixed support rod 18 are all arranged in the transparent housing 10;

[0074] The transparent housing 10 comprises an upper housing cover 101 and a lower housing barrel 102. When the upper housing cover 101 and the lower housing barrel 102 are fastened together, a closed cylindrical hollow space is formed inside. A through hole is provided at the center of the upper housing cover 101. The lower housing barrel 102 is provided with a plurality of housing positioning holes 103 on its sidewall and a fixing support rod hole 104 on its bottom surface.

[0075] The upper section of the electric rotating telescopic rod 15 extends to the outside through the through hole of the housing cover 101 and is fixed to the transparent housing 10, with its lower end surface abutting against the upper surface of the rotating multi-point detection frame 132;

[0076] The lower section of the fixed support rod 18 is embedded in the fixed support rod hole 104 and is fixed in the transparent housing 10;

[0077] The base tray 11 includes a circular tray 111 and a plurality of long, symmetrically arranged centering clamping grooves 112 on the circular tray 111;

[0078] There are multiple centering clamping columns 12, each of which includes a centering clamping plate 121, a centering short handle 122, a centering wheel 123, and a centering ball 124; the centering clamping plate 121 is an upright rectangular long plate, which is integrally embedded in the centering clamping groove 112; the inner side of the cylindrical centering short handle 122 is arranged on the outer surface of the centering clamping plate 121, and the outer side passes through the shell positioning circular hole 103 on the side wall of the lower barrel 102 of the shell and extends outward; the cylindrical centering wheel 123 is arranged on the upper side surface of the centering clamping plate 121 near the inner side surface, and a plurality of centering balls 124 arranged in a row are arranged on the bottom surface of the centering clamping plate 121;

[0079] The thermal insulation pad 17 is a circular thin sheet, which is arranged directly above the circular tray 111. The wafer heating plate 6 is arranged directly above the thermal insulation pad 17, and the two are concentrically arranged; the thermal insulation pad 17 is used to isolate the heat exchange between the base tray and the wafer heating plate to prevent the temperature data obtained by the temperature sensor from being interfered with by the temperature fluctuation of the base tray.

[0080] The upper section of the fixed support rod 18 passes through the center of the circular tray 111 and the heat insulation pad 17 respectively, and the upper end surface of the fixed support rod 18 is against the center position of the lower surface of the wafer heating plate 6; the periphery of the wafer heating plate 6 is supported by the centering wheel 123 to ensure that the wafer heating plate 6 is concentric with the rotating multi-point detection frame 132;

[0081] The rotary lifting bracket 13 also includes a rotary frame 131, which has an overall hollow cylindrical shape, an open lower end face, and a plurality of elongated slots on the side walls. The rotary multi-point detection frame 132 is disposed in the opening on the lower end face of the rotary frame 131. Each of its sensor array arms 134 extends outward through the elongated slots and is evenly and spaced apart directly above the wafer heating plate 6. The radius of each sensor array arm 134 is the same as that of the wafer heating plate 6.

[0082] The lower section of the electric rotating telescopic rod 15 passes through the center hole of the rotating frame 131, and the lower end surface reaches the upper surface of the rotating multi-point detection frame 132; during the process of rising, falling and rotating, with the shell cover 101 as the fulcrum, the whole drives the rotating lifting bracket 13 and the photoelectric encoder 16 to rise, fall and rotate together, so that the temperature sensor arrays on each sensor array support arm 134 scan the upper surface of the wafer heating plate 6 in turn.

[0083] The rotating multi-point detection frame 132 includes a central disk 133 and a sensor array support arm 134. Each sensor array support arm 134 is provided with a plurality of sensor mounting holes 35. The temperature sensors 14 are respectively embedded in each sensor mounting hole 135 to form a uniformly spaced temperature sensor array; and each temperature sensor 14 is arranged in a concentric circle array with different diameters.

[0084] The temperature sensors 14 used in this embodiment are Class I precision S-type thermocouples, comprising 109 temperature sensors 14 arranged in an array. The operating temperature range of the temperature sensors 14 is 0°C to 1100°C, with a tolerance of ±1°C. Using a contact-type temperature sensor that directly contacts the object being measured allows for more accurate measurement of the object's actual temperature and rapid response to temperature changes.

[0085] The photoelectric encoder 16 is coaxial with the rotating multi-point detection frame 132, and both rotate synchronously with the electric rotating telescopic rod 15 as the axis; the photoelectric encoder 16 is used to collect the rotation time, rotation angle, rotation direction and rotation speed of the electric rotating telescopic rod 15, so as to obtain the spatial distribution (including spatial coordinates) of the temperature signal measurement points corresponding to each temperature sensor after measurement; the base tray and the centering clamping column are used to place and fix the wafer heating plate. The wafer heating plate remains stationary during the entire detection process to obtain a uniform heat dissipation environment.

[0086] The center of the fixed support rod hole 104 on the shell cover of the transparent shell 10 and the bottom surface of the shell, and the center of the electric rotating telescopic rod 15, the rotating frame 131, the rotating multi-point detection frame 132, the base tray 11, the wafer heating plate 6 and the insulation pad 17 are all on the same vertical axis.

[0087] Example 2

[0088] The method and system for detecting temperature uniformity of a wafer heating plate based on time-sequential multi-point sensing provided in this embodiment are substantially the same as those in embodiment 1, except that:

[0089] The wafer heating plate temperature uniformity scanning detection in step S2 also includes the steps of sequentially collecting the heating operation parameter-time series-temperature-spatial position four-dimensional correlation data set of multi-point synchronous changes in the three heating stages of heating, constant temperature and constant temperature, and the step of multi-element temperature uniformity verification detection of the point data on the wafer heating plate and the temperature sensor performance through multi-week scanning, and applying these data to optimize the detection plan to obtain the optimal operating parameter set.

[0090] S4: Optimize detection plan

[0091] Adjust the operating parameters of the wafer heating plate, scan multiple cycles, and synchronously adjust the working parameters of the rotating multi-point detection frame (including single rotation speed, angle, lifting height, etc.). Through comparative testing, analysis and calculation of the correlation between the changes in various parameters in the three heating stages of heating, fixed temperature, and constant temperature and multiple cycles of scanning, an optimal parameter set with the best detection accuracy is obtained, which consists of the wafer heating plate operating parameters, the rotating multi-point detection frame working parameters, and the number of scanning cycles. This optimal parameter set is used for subsequent wafer heating plate temperature uniformity detection.

[0092] By comparing the changes in various parameters in the three stages and analyzing the calculations, and coordinating the operating parameters of the wafer heating plate and the synchronous detection device, the optimal wafer heating plate heating parameters and temperature uniformity detection scheme can be obtained, thus achieving the effects of saving time and power, and achieving high accuracy in temperature uniformity detection.

[0093] After obtaining the optimal parameter set, the host computer transmits the optimized parameter set to the PLC controller, and adjusts the power output of the wafer heating plate and the rotation speed and lifting stroke of the synchronous detection device in real time, so as to control the wafer heating plate and the synchronous detection device to operate according to the optimal plan.

[0094] Specifically, when optimizing the operation scheme of the three temperature change stages, this embodiment can set the adjustment range of the wafer heating plate's heating rate to 5°C-20°C / min, repeat the other detection steps (S2-23), and obtain three sets of data (or more sets of data) when the wafer heating plate's heating rate is 5°C / min, 10°C / min, and 20°C / min, respectively. By comparing and analyzing the corresponding obtained multi-point synchronously changing heating operation parameter-timing-temperature-spatial position four-dimensional correlation data groups, the optimal heating parameters and the detection operation scheme with better temperature uniformity (including the heating plate operation parameter range, each thermocouple temperature range, acquisition time, the corresponding total number of acquisition points and spatial intervals, etc.) and the optimal operation parameter set can be obtained.

[0095] Through the detection operation parameter optimization process and results of this embodiment, it can be seen that, according to the four-dimensional correlation data group of heating operation parameters-timing-temperature-spatial position of multiple synchronous changes collected during a week of scanning for any stage of the three heating stages of heating, constant temperature and constant temperature of the first wafer heating plate, when all points are qualified, there is no need to perform subsequent detection steps; if after the first week of scanning, it is found that some points are preliminarily judged to be unqualified, it is necessary to further perform the second and third weeks of scanning, and detect the three stages of heating, constant temperature and constant temperature of the wafer heating plate in turn. If the same points obtained from the scanning in each week are judged to be unqualified, it can be determined that the wafer heating plate is unqualified.

[0096] The rotating multi-point detection frame 132 of the embodiment of the present invention includes 12 sensor array arms 134 that are centrally symmetrically distributed, and the angle between each two sensor array arms 134 is 30°. When the rotation angle is 10° each time, the rotating multi-point detection frame 132 can basically cover the entire upper surface of the wafer heating plate (achieving 360° scanning) by rotating at least 3-5 times, thereby greatly improving the detection efficiency.

[0097] Typically, for wafer heating plates of the same batch and model, the optimal parameter set is first obtained by analyzing the scanning inspection data of the first 1-5 wafers. When conducting subsequent temperature uniformity inspections of the wafer heating plates, the host computer transmits the optimized parameters to the PLC controller, and adjusts the power output of the heating plate and the rotation speed and lifting stroke of the synchronous detection device in real time, controlling the heating plate and the synchronous detection device to operate according to the optimal parameter set to improve detection efficiency.

[0098] Example 3

[0099] The method and system for detecting temperature uniformity of a wafer heating plate based on time-sequential multi-point sensing provided in this embodiment are substantially the same as those in Embodiments 1 and 2, except that:

[0100] The wafer heating plate temperature uniformity detection system based on time-series multi-point sensing also includes a remote server, a host computer, and a multi-channel temperature collector. The multi-channel temperature collector collects data from each temperature sensor and works in conjunction with the remote server, the host computer and the PLC controller to control the operation of the synchronous detection device and the wafer heating plate, and performs temperature uniformity detection on the wafer heating plate one by one to obtain a four-dimensional correlation data group of multi-point synchronously changing operating parameters-temperature-time series-space.

[0101] Among them, the PLC controller is connected and communicates with the remote server and the host computer through the network;

[0102] The PLC controller is used to control the operating parameters of the synchronous detection device and the wafer heating plate, and is also used to collect the operating voltage, current, and time of the wafer heating plate, and perform temperature increase, temperature setting, and constant temperature detection in stages; it is also used to control the lifting and rotation of the synchronous detection device, and receive data collected by various temperature sensors and multi-channel temperature collectors;

[0103] Remote server, used for data storage, backup and remote control of multiple signals;

[0104] The host computer is used to display and process the collected multi-point synchronously changing operating parameter-temperature-timing-space four-dimensional correlation data group (including wafer heating plate operating parameters, timing signals, temperature signals, spatial coordinate information of temperature signal collection points, etc.).

[0105] The host computer communicates with the PLC controller and the multi-channel temperature collector to display detection information such as the temperature signals corresponding to different timing signals on the wafer heating plate obtained under certain working parameters and the spatial distribution of the temperature signal collection points.

[0106] The method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing further comprises:

[0107] S5: Remote control detection

[0108] The remote server, host computer and PLC controller work together to adopt the optimal parameter set to control the synchronous detection device and the wafer heating plate to operate with the optimal parameter set, and perform online and batch temperature uniformity detection of multiple wafer heating plates; combined with automated robots and other tools, it can realize automated operations of loading, testing and unloading.

[0109] The dynamic synchronous detection adopted in the embodiment of the present invention means that each time the temperature sensor collects data, the corresponding points on the wafer heating disk are points that change dynamically according to the rotation order. Each temperature sensor uses 109 temperature sensors 14 at different points and the same time points according to the set time interval, angle interval and rotation order to synchronously collect the temperature data of the upper surface of the wafer heating disk to ensure the accuracy of the data obtained.

[0110] Example 4

[0111] The wafer heating plate temperature uniformity detection method and system based on time-sequential multi-point sensing provided in this embodiment are substantially the same as those in Embodiments 1 to 3, except that the wafer heating plate uniformity detection optimization method based on time-sequential multi-point sensing further includes the step of multivariate temperature uniformity verification detection:

[0112] When the rotating multi-point detection frame scans the upper surface of the wafer heating plate for the first week, the absolute temperature values of each point and the dynamic change rate between each related data group are compared with the pre-set allowable error range. One or two of the values of some points exceed the allowable range, and they are preliminarily judged as unqualified products and the coordinates of the preliminarily unqualified points are marked. Then, the second or third week of scanning is added, and the data of the unqualified points obtained in the second and third weeks are compared to verify the data changes of the unqualified point itself, and further compare with the data changes of other points around the point to determine whether the point is unqualified or the temperature sensor corresponding to the point is distorted or drifted, thereby completing the multivariate temperature change uniformity verification and detection of the point data and temperature sensor performance on the wafer heating plate.

[0113] Specifically, step S2 includes: when the rotating multi-point inspection frame scans the entire upper surface of the wafer heating plate for one cycle, the absolute temperature value of each point and the dynamic change rate between each related data group are compared with the pre-set allowable error range. If one or both of them exceed the allowable range and the product is initially judged as unqualified, the coordinates of the unqualified point are determined, and then a second or third cycle of scanning is performed;

[0114] Step S3 includes: continuously comparing and verifying the data of unqualified points obtained in the second and third weeks, verifying whether the data of the scans of this point in each week and the absolute temperature change error and dynamic change rate data obtained by scanning other points in the corresponding week are both within the pre-set allowed range. If the scanning data of the second and third weeks are both within the allowed range, it is a qualified product; otherwise, it is an unqualified product, thus completing the verification and detection of the multivariate temperature change uniformity of a single point on the entire surface of the wafer heating plate.

[0115] The detection methods and systems provided in the above-mentioned embodiments of the present invention can be further combined with machine learning technology (automatic data processing and predictive analysis), intelligent manipulators (automatic replacement of wafer heating plates) and other technologies to continuously test and optimize the operating process parameters of the wafer heating plates to achieve automated and intelligent operation, effectively improve detection efficiency, and reduce detection costs.

[0116] The above description is only an embodiment of the present invention and is not intended to limit the scope of protection of the present invention; the scope of protection of the present invention is defined by the claims in the appended claims, and all equivalent changes and modifications made based on the invention are within the scope of protection of the patent of the present invention.

Claims

1. A method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing, characterized in that: The PLC controller simultaneously controls the operation of the rotating multi-point detection frame and the wafer heating plate. The temperature sensor array on the rotating multi-point detection frame rotates according to the set speed, direction, and interval angle, and scans the upper surface of the wafer heating plate in the heating operation state for at least one round, and synchronously collects data at multiple points, thereby obtaining a synchronously changing associated data set of the four elements of time series data, temperature data, and spatial data of each point corresponding to the heating operation parameters of the wafer heating plate, that is, a four-dimensional associated data set of heating operation parameters, time series data, temperature data, and spatial position data of multiple points synchronously changing; The absolute temperature values of each point on the wafer heating plate and the dynamic change rate between each four-dimensional correlation data group are compared with the pre-set allowable error range to determine whether the absolute temperature change error and the dynamic change rate between each point are both within the allowable range. If all points are within the allowable range at the same time, it is a qualified product; otherwise, it is an unqualified product. The position coordinates and error values of the unqualified points are marked to complete the detection of the multivariate temperature change uniformity of the entire surface of the wafer heating plate.

2. The method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing according to claim 1, characterized in that: It also includes the following steps: The heating stage includes three stages: temperature rise, constant temperature and constant temperature; The PLC controller simultaneously controls the operation of the rotary multi-point detection frame and the wafer heating plate. The temperature sensor array on the rotary multi-point detection frame rotates according to the set speed, direction, and interval angle, and scans the upper surface of the wafer heating plate in the three heating operation states of heating, fixed temperature, and constant temperature for one round, and synchronously collects data at multiple points. The data is obtained by synchronously changing the four elements of the timing data, temperature data, and spatial data of each point corresponding to the three-stage heating operation parameters of the wafer heating plate, i.e., the four-dimensional correlation data set of heating operation parameters, timing data, temperature data, and spatial position of the multi-point synchronous changes. The absolute temperature values of each point obtained in the three heating stages and the dynamic change rate between each related data group are compared with the pre-set allowable error range to determine whether the absolute temperature change error and the dynamic change rate between each point in the three heating stages are both within the allowable range. If all points are within the allowable range at the same time, the product is qualified; otherwise, it is unqualified, and the coordinates of the unqualified points are marked to complete the multi-stage and multi-element temperature change uniformity detection of the overall surface of the wafer heating plate.

3. The method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing according to claim 1 or 2, characterized in that: It also includes the following steps: when the rotating multi-point detection frame scans the upper surface of the wafer heating disk for the first week, the absolute temperature values of each point obtained and the dynamic change rate between each related data group are compared with the pre-set allowable error range. One or two of the values of some points exceed the allowable range, and they are preliminarily judged as unqualified products and the coordinates of the preliminarily unqualified points are marked. Then, the second or third week is scanned additionally, and the data of the unqualified points obtained in the second and third weeks are compared to verify the data changes of the unqualified point itself, and further compare with the data changes of other points around the point to determine whether the point is unqualified or the temperature sensor corresponding to the point is distorted or drifted, thereby completing the multivariate temperature change uniformity verification and detection of the point data and temperature sensor performance on the wafer heating disk.

4. The method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing according to claim 3, characterized in that: It specifically includes the following steps: S1: Setting up the wafer heating plate temperature uniformity detection system A wafer heating plate temperature uniformity detection system is provided, including a PLC controller, a synchronous detection device, and a wafer heating plate. The synchronous detection device includes a rotating multi-point detection frame and a photoelectric encoder. The rotating multi-point detection frame includes a central disk and a plurality of sensor array arms connected to the central disk and extending outwardly in a centrally symmetrical, cross-shaped arrangement. The central disk of the rotating multi-point detection frame and each sensor array arm are provided with a plurality of independent temperature sensors. S2: Scanning and testing the temperature uniformity of the wafer heating plate The PLC controller simultaneously controls the operation of the wafer heating plate and the synchronous detection device. When the wafer heating plate is in the heating operation state, the temperature sensor array on the rotating multi-point detection frame rotates according to the set speed, direction, and interval angle, scanning the upper surface of the wafer heating plate for at least one circle and synchronously collecting data at multiple points. The temperature sensor array collects temperature data at each point, the photoelectric encoder collects the starting position and rotation angle data, and the PLC controller records the time and operation parameters, respectively. The four-element associated data group of synchronous changes of the time series data, temperature data, and spatial data of each point corresponding to the heating operation parameters of the wafer heating plate is obtained, that is, the four-dimensional associated data group of heating operation parameters-time series-temperature-spatial position that changes synchronously at multiple points; S3: Detection Data Analysis The absolute temperature values of each point on the wafer heating plate and the dynamic change rate between each four-dimensional correlation data group are compared with the pre-set allowable error range to determine whether the absolute temperature change error and the dynamic change rate between each point are both within the allowable range. If all points are within the allowable range at the same time, the product is qualified; otherwise, it is unqualified. The position coordinates and error values of the unqualified points are marked to complete the detection of the multivariate temperature change uniformity of the overall surface temperature of the wafer heating plate.

5. The method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing according to claim 4, characterized in that: The wafer heating plate temperature uniformity scanning test in step S2 also includes the steps of sequentially collecting a four-dimensional correlation data set of heating operation parameters, time series, temperature, and spatial position that synchronously changes at multiple points in the three heating stages of heating: heating, constant temperature, and constant temperature; and the step of multi-dimensional temperature uniformity verification and testing of the point data on the wafer heating plate and the performance of the temperature sensor through multi-cycle scanning. S4: Optimize detection plan Adjust the operating parameters of the wafer heating plate, scan multiple cycles, and synchronously adjust the working parameters of the rotating multi-point detection frame. Through comparative testing, analysis and calculation of the correlation between the changes in various parameters in the three heating stages of heating, fixed temperature and constant temperature and multiple cycles of scanning, an optimal parameter set with the best detection accuracy is obtained, which consists of the wafer heating plate operating parameters, the rotating multi-point detection frame working parameters, and the number of scanning cycles. This optimal parameter set is used for subsequent wafer heating plate temperature uniformity detection.

6. The method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing according to claim 5, characterized in that: Step S1 also includes the steps of setting up a remote server and a host computer in the wafer heating plate temperature uniformity detection system; S5: Remote control detection The remote server, host computer and PLC controller work together to use the optimal parameter set to perform online and batch temperature uniformity testing on multiple wafer heating plates.

7. The method for detecting temperature uniformity of a wafer heating plate based on time-series multi-point sensing according to claim 6, characterized in that: Step S1 also includes the step of setting a multi-channel temperature collector in the wafer heating plate temperature uniformity detection system: Step S2 also includes: a multi-channel temperature collector receives data collected by each temperature sensor, works in coordination with a remote server, a host computer and a PLC controller, controls the synchronous detection device and the wafer heating plate to operate with an optimal parameter set, performs temperature change uniformity detection on the wafer heating plate one by one, and obtains a four-dimensional correlation data set of operating parameters-temperature-time series-space with synchronous changes at multiple points.

8. A wafer heating plate temperature uniformity detection system based on time-series multi-point sensing, characterized in that: It is used to implement the wafer heating plate temperature uniformity detection method based on time-series multi-point sensing as described in any one of claims 1 to 7, and comprises: a PLC controller, a synchronous detection device, and a wafer heating plate; the synchronous detection device comprises a rotary lifting bracket, a temperature sensor, an electric rotary telescopic rod, and a photoelectric encoder; The PLC controller is electrically connected to the wafer heating plate, the electric rotating telescopic rod of the synchronous detection device, the photoelectric encoder and the temperature sensor respectively; The rotary lifting bracket includes a rotary multi-point detection frame, which includes a plurality of sensor array arms uniformly distributed in a centrally symmetrical manner, and each sensor array arm is provided with a plurality of temperature sensors to form a uniformly spaced temperature sensor array; The wafer heating plate is set directly below the rotating multi-point detection frame, and the radius of each sensor array arm is the same as that of the wafer heating plate; The electric rotating telescopic rod is vertically arranged at the axis position, and the photoelectric encoder is arranged on the upper part of the electric rotating telescopic rod; the rotary lifting bracket is arranged at the lower part of the electric rotating telescopic rod, and the electric rotating telescopic rod is controlled by a PLC controller to drive the rotary lifting bracket to perform ascending, descending and circumferential rotation movements; during this process, the position of the wafer heating plate remains fixed, and the photoelectric encoder rotates with the electric rotating telescopic rod, collecting initial and rotation angle data and transmitting them to the PLC controller; When the electric rotating telescopic rod drives the rotary lifting bracket to descend, it drives multiple temperature sensors of each sensor array arm sensor array to contact the upper surface of the wafer heating plate at the same time, and separately and independently collects the temperature data of each contact point and transmits it to the PLC controller; When the electric rotating telescopic rod drives the rotary lifting bracket to perform an ascending and rotating action, it drives the multiple temperature sensors of each sensor array arm sensor array to first ascend and leave the upper surface of the wafer heating plate to a set height, then rotate to a set interval angle, and then descend, so that each temperature sensor contacts the upper surface of the wafer heating plate at the same time, and separately and independently collects the temperature data of each contact point and transmits it to the PLC controller; When the PLC controller controls the operating parameters of the electric rotating telescopic rod and the wafer heating plate, and the electric rotating telescopic rod drives the rotary lifting bracket to perform ascending, descending, and circumferential rotation for one circle multiple times, a four-dimensional correlation data set of operating parameters, temperature, time series, and space covering the entire area of the upper surface of the wafer heating plate with synchronous changes at multiple points is scanned.

9. The wafer heating plate temperature uniformity detection system based on time-series multi-point sensing according to claim 8, characterized in that: It also includes a remote server, a host computer, and a multi-channel temperature collector. The multi-channel temperature collector receives data collected by various temperature sensors, works in conjunction with the remote server, the host computer, and the PLC controller to control the operation of the synchronous detection device and the wafer heating plate, and performs temperature change uniformity detection on the wafer heating plate one by one to obtain a four-dimensional correlation data group of operating parameters-temperature-time series-space with synchronous changes at multiple points.

10. The wafer heating plate temperature uniformity detection system based on time-series multi-point sensing according to claim 8, characterized in that: The synchronous detection device further comprises a transparent shell, a base tray, a centering clamping column, a heat insulation pad, and a fixed support rod; The wafer heating plate, base tray, rotary lifting bracket, temperature sensor, centering clamping column, thermal insulation pad, and fixed support rod are all arranged in a transparent shell; The transparent shell comprises: a shell upper cover and a transparent shell lower barrel. When the shell upper cover and the shell lower barrel are buckled together, a closed cylindrical hollow space is formed inside. A through hole is provided at the center of the shell upper cover. The side wall of the shell lower barrel is provided with a plurality of shell positioning circular holes, and a fixing support rod hole is provided on the bottom surface. The upper section of the electric rotating telescopic rod extends to the outside through the through hole of the upper cover of the housing and is fixed to the transparent housing, with its lower end surface abutting against the upper surface of the rotating multi-point detection frame; The lower section of the fixed support rod is embedded in the fixed support rod hole and fixed in the transparent shell; The base tray includes a circular tray and a plurality of long strip-shaped centering clamping grooves arranged symmetrically on the circular tray; There are multiple centering clamping columns, each of which includes a centering clamping plate, a centering short handle, a centering wheel, and a centering ball; the centering clamping plate is an upright rectangular long plate, which is integrally embedded in the centering clamping groove; the inner side of the cylindrical centering short handle is arranged on the outer side of the centering clamping plate, and the outer side passes through the shell positioning circular hole on the side wall of the lower barrel of the shell and extends outward; the cylindrical centering wheel is arranged on the upper side of the centering clamping plate near the inner side, and a plurality of centering balls arranged in a row are arranged on the bottom surface of the centering clamping plate; The thermal insulation pad is a circular thin sheet, which is arranged directly above the circular tray, and the wafer heating plate is arranged directly above the thermal insulation pad, and the two are arranged concentrically; The upper section of the fixed support rod passes through the center of the circular tray and the thermal insulation pad respectively, and the upper end surface of the fixed support rod is against the center position of the lower surface of the wafer heating plate; the periphery of the wafer heating plate is supported by the centering wheel to ensure that the wafer heating plate is concentric with the rotating multi-point detection frame; The rotary lifting bracket also includes a rotary frame, which has an overall hollow cylindrical shape, an opening at the lower end face, and a plurality of elongated receiving grooves on the side walls; the rotary multi-point detection frame is arranged in the opening at the end face of the rotary frame, and each of its sensor array arms passes through the elongated receiving groove and extends outward, and is evenly and spaced apart and arranged directly above the wafer heating plate, and the radius of each sensor array arm is the same as that of the wafer heating plate; The lower section of the electric rotating telescopic rod passes through the center hole of the rotating frame, and the lower end surface reaches the upper surface of the rotating multi-point detection frame; during the process of rising, falling and rotating, with the upper cover of the shell as the fulcrum, the whole body drives the rotating lifting bracket and the photoelectric encoder to rise, fall and rotate together, so that the temperature sensor array on each sensor array support arm scans the upper surface of the wafer heating plate in turn.

11. The wafer heating plate temperature uniformity detection system based on time-series multi-point sensing according to claim 8, characterized in that: The rotating multi-point detection frame includes a central disk and a sensor array support arm. Each sensor array support arm is provided with a plurality of sensor mounting holes. The temperature sensors are respectively embedded in each sensor mounting hole to form a uniformly spaced temperature sensor array; and each temperature sensor is arranged in a concentric circle array with different diameters.

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